CN117092738A

CN117092738A - Bonding jig and manufacturing method of array waveguide

Info

Publication number: CN117092738A
Application number: CN202311220405.1A
Authority: CN
Inventors: 洪琨志
Original assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; Yecheng Optoelectronics Wuxi Co Ltd; General Interface Solution Ltd
Current assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Priority date: 2023-09-20
Filing date: 2023-09-20
Publication date: 2023-11-21

Abstract

The application relates to a bonding jig and a manufacturing method of an array waveguide. The laminating jig is used for laminating a plurality of waveguide prefabricated members, the waveguide prefabricated members are provided with two opposite laminating surfaces along a first direction, the laminating jig comprises a bearing piece, an abutting piece, a limiting piece and an operating piece, the bearing piece is provided with a bearing surface for bearing the plurality of waveguide prefabricated members, and the plurality of waveguide prefabricated members are sequentially arranged along the first direction; the abutting piece is arranged on the bearing side of the bearing piece; the abutting piece is provided with an abutting surface arranged along a first direction; the limiting piece is arranged on the bearing piece; the limiting piece is provided with two limiting surfaces which are oppositely arranged along the second direction, and the two limiting surfaces, the abutting surface and the bearing surface jointly define a fixing space for fixing a plurality of waveguide prefabricated parts; the manipulator is configured to be movable in a first direction toward or away from the abutment surface in response to an external force to bring each adjacent abutment surface of the plurality of waveguide preforms into abutment with one another. The application is helpful for improving the cutting precision and manufacturing the high-quality array waveguide.

Description

Bonding jig and manufacturing method of array waveguide

Technical Field

The application relates to the technical field of optical waveguides, in particular to a bonding jig and a manufacturing method of an array waveguide.

Background

Currently, optical waveguides can be broadly divided into three types, namely geometric waveguides, diffractive waveguides and volume holographic waveguides. The geometrical waveguide, i.e. the array waveguide, represents an optical element having a half-mirror array, which follows the law of reflection with an angle of incidence equal to the angle of reflection, without dispersion of the incident light of the three primary colors constituting the full-color display. Therefore, compared with diffraction waveguides and volume hologram waveguides, images realized by using array waveguides have higher quality and no chromatic dispersion problem. In some special optical fields, the array waveguide has better application prospect.

In general, the manufacturing process of the array waveguide comprises five steps of coating, attaching, cutting, polishing and grinding, the manufacturing process is complex, and in the actual manufacturing process, the geometric parameters and the optical performance of the array waveguide cannot meet the standard requirements of some special optical fields.

Disclosure of Invention

Based on the above, the bonding jig and the manufacturing method of the array waveguide are provided, the manufacturing process of the array waveguide is improved, the manufacturing precision of the array waveguide is improved, and the high-quality array waveguide is realized.

According to a first aspect of the present application, there is provided a bonding jig for bonding a plurality of waveguide preforms, the waveguide preforms having two bonding surfaces disposed opposite to each other along a first direction, the bonding jig comprising:

The bearing piece is provided with a bearing surface, the bearing surface is used for bearing a plurality of waveguide prefabricated parts, and the plurality of waveguide prefabricated parts are sequentially arranged along a first direction;

the abutting piece is positioned on the bearing side of the bearing piece; the abutting piece is provided with an abutting surface arranged along a first direction;

the limiting piece is arranged on the bearing piece; the limiting piece is provided with two limiting surfaces which are oppositely arranged along the second direction, and the two limiting surfaces, the abutting surface and the bearing surface jointly define a fixing space for fixing a plurality of waveguide prefabricated parts; a kind of electronic device with high-pressure air-conditioning system

An operating member configured to be movable in a first direction toward or away from the abutment surface in response to an external force to form a clamping space with the abutment member for clamping the plurality of waveguide preforms so that each adjacent abutment surface of the plurality of waveguide preforms is abutted against each other;

wherein the first direction and the second direction are perpendicular to each other.

In one embodiment, the waveguide preform has a first end and a second end disposed opposite in a second direction;

the attaching jig further comprises a plurality of blocking pieces;

wherein each barrier is disposed between first ends of two waveguide preforms adjacent in a first direction; and/or

Each barrier is disposed between the second ends of two waveguide preforms adjacent in the first direction.

In one embodiment, the barrier has a barrier face;

the blocking surface is configured to be parallel to the bonding surface.

In one embodiment, the blocking surface and the bonding surface are each configured to be disposed at a first predetermined angle with respect to the first direction.

In one embodiment, the barrier is configured to abut a corresponding end of a waveguide preform adjacent to the barrier in the event that a plurality of waveguide preforms are conformed to one another.

In one embodiment, the limiting piece comprises a first sub-limiting piece and a second sub-limiting piece which are both arranged on the bearing piece, and the first sub-limiting piece and the second sub-limiting piece are oppositely arranged along the second direction;

the surfaces of the first sub-limiting piece and the second sub-limiting piece, which are opposite to each other, are limiting surfaces.

In one embodiment, the first sub-limiting member includes a plurality of first limiting structures disposed on the carrier and independent from each other, and the plurality of first limiting structures are disposed along a first direction;

the second sub-limiting piece comprises a plurality of second limiting structures which are arranged on the bearing piece and are independent of each other, and the second limiting structures are arranged along the first direction;

each first limit structure corresponds to one second limit structure.

In one embodiment, the first limiting structure and the second limiting structure are slidably connected to the carrier along the first direction respectively.

In one embodiment, each of the first limiting structures and each of the second limiting structures is provided with a blocking member.

In one embodiment, the first limiting structure and the blocking member connected with the first limiting structure are of an integrated structure; and/or

The second limiting structure and the blocking piece connected with the second limiting structure are of an integrated structure.

In one embodiment, the fitting jig further comprises a support; the supporting piece is connected to the bearing piece and is used for enabling the bearing surface to be arranged at a second preset angle with the horizontal direction;

the first preset angle is equal to the second preset angle.

In one embodiment, the attaching jig further includes a cover member, where the cover member is used to cover the carrier;

the cover piece is provided with a cover surface, and in the cover state, a limit space is limited between the cover surface and the bearing surface, and the limit space is used for limiting the plurality of waveguide prefabricated parts.

In one embodiment, the attaching jig further comprises an illumination piece arranged on the cover piece, and the illumination piece is used for illuminating the plurality of waveguide prefabricated parts in the limiting space.

According to a second aspect of the present application, there is provided a method for manufacturing an arrayed waveguide, the method for manufacturing an arrayed waveguide being manufactured using the bonding jig according to any one of the previous embodiments; the manufacturing method of the array waveguide comprises the following steps:

Sequentially stacking the plurality of waveguide preforms on the bearing surface along a first direction by means of the limiting piece so that at least part of the plurality of waveguide preforms are accommodated in the fixed space;

and moving the operating member along a first direction to form a clamping space so as to enable adjacent bonding surfaces in the plurality of waveguide prefabricated members to be bonded with each other, thereby obtaining the assembly.

In one embodiment, the attaching jig further includes a plurality of blocking members; the waveguide preform has a first end and a second end disposed opposite in a second direction;

sequentially stacking a plurality of waveguide preforms on a bearing surface along a first direction by means of a limiting member, comprising:

after each waveguide preform is arranged on the bearing surface, at least one barrier is arranged at the first end and/or the second end of the corresponding waveguide preform such that the barrier is located between two adjacent waveguide preforms.

In one embodiment, the limiting member comprises a plurality of first limiting structures and a plurality of second limiting structures, wherein the first limiting structures and the second limiting structures are both in sliding connection with the bearing member along a first direction, and each first limiting structure can correspond to one second limiting structure along a second direction; each first limit structure and each second limit structure are respectively provided with a blocking piece;

After each waveguide preform is disposed on the bearing surface, disposing at least one barrier to the first end and/or the second end of the corresponding waveguide preform, comprising:

after the current waveguide prefabricated member is arranged on the bearing surface, a first limiting structure and a corresponding second limiting structure are moved along a first direction to form at least part of a fixing space for fixing the current waveguide prefabricated member, a blocking piece on the current first limiting structure is located at a first end of the current waveguide prefabricated member, and a blocking piece on the current second limiting structure is located at a second end of the current waveguide prefabricated member.

In one embodiment, after the assembly is obtained, it comprises:

cutting the assembly along a preset path on a preset surface of the assembly to obtain an array waveguide;

wherein, the first direction and the second direction are parallel to the preset surface.

In one embodiment, before stacking the plurality of waveguide preforms on the carrying surface in the first direction, the method for manufacturing the array waveguide further includes:

providing a waveguide substrate;

coating a film on a target surface of the waveguide substrate to obtain a waveguide prefabricated member; the target surface is one of two bonding surfaces corresponding to the waveguide substrate.

an adhesive is disposed on at least one of the faying surfaces of the waveguide preform.

In one embodiment, the waveguide substrate includes a first substrate and a second substrate, the first substrate having a dimension in the first direction that is greater than a dimension of the second substrate in the first direction.

In one embodiment, the first substrate has a dimension in the first direction of 2 cm to 3 cm and the second substrate has a dimension in the first direction of 0.8 cm to 2 cm.

In one embodiment, the number of the first substrates is two, and the number of the second substrates is a plurality; the two first base materials are positioned at two opposite sides of the assembly along the first direction, and the plurality of second base materials are positioned between the two oppositely arranged first base materials.

In the above bonding jig and the manufacturing method of the array waveguide, the waveguide sheet is manufactured as the waveguide prefabricated member, so that the later grinding and polishing operations of the traditional manufacturing process can be omitted, the bonding jig is utilized to bond the plurality of waveguide prefabricated members, and the waveguide prefabricated members are provided with two bonding surfaces which are oppositely arranged along the first direction. The laminating tool is at least including carrier, butt spare, locating part and operating piece, and two spacing faces that provide through the locating part, the butt face that the butt piece provided and the carrier that the carrier provided are used for fixed space that a plurality of waveguide prefabs are limited jointly, make it remove along first direction through acting on the operating piece to form the centre gripping space between messenger's operating piece and the butt piece, make each adjacent two laminating faces laminating each other in a plurality of waveguide prefabs through the centre gripping effect in centre gripping space. Therefore, the waveguide prefabricated members are laminated and attached together along the first direction, the cutting thickness is reduced, the cutting precision is improved, and the high-quality array waveguide is facilitated to be realized.

Drawings

Fig. 1 (a) is a schematic side view illustrating the bonding of a waveguide substrate according to an embodiment of the related art.

Fig. 1 (b) is a schematic side view of the waveguide substrate of fig. 1 (a) after bonding. Fig. 1 (c) is a schematic side view of the arrayed waveguide obtained after the dicing of fig. 1 (b).

Fig. 1 (d) is a schematic top view of the arrayed waveguide of fig. 1 (c).

Fig. 2 is a schematic view of the structure of a waveguide preform in an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a bonding tool according to an embodiment of the application.

FIG. 4 is a schematic diagram of a process for bonding a waveguide preform by the bonding tool of FIG. 3.

Fig. 5 is a schematic diagram of another process for bonding a waveguide preform by means of the bonding tool of fig. 3.

Fig. 6 is a schematic diagram of yet another process for conforming a waveguide preform by means of the conforming jig of fig. 4.

Fig. 7 is an enlarged schematic view at a portion M in fig. 5.

Fig. 8 is a schematic side view of the conformable jig conformable waveguide preform of fig. 6.

Fig. 9 is a schematic diagram illustrating a process of attaching a waveguide preform by using an attaching jig according to another embodiment of the present application.

Fig. 10 is a schematic side view of the conformable jig conformable waveguide preform of fig. 9.

FIG. 11 is a schematic diagram of an assembly according to an embodiment of the application.

Fig. 12 is a schematic structural diagram of the arrayed waveguide obtained by cutting the assembly in fig. 11.

Fig. 13 is a flow chart of a method for fabricating an array waveguide according to an embodiment of the application.

Fig. 14 is a flowchart illustrating an embodiment of a method for fabricating the arrayed waveguide of fig. 13.

Fig. 15 is a flowchart of an embodiment of a method for fabricating the arrayed waveguide of fig. 14.

Fig. 16 is a flow chart of a method for fabricating an array waveguide according to another embodiment of the application.

Fig. 17 is a flow chart of a method for fabricating an array waveguide according to another embodiment of the application.

Reference numerals illustrate:

a waveguide substrate 10, a cut surface 10a;

an array waveguide 20;

a first dimension L1, a second dimension L2;

a first inclination angle theta 1, a second inclination angle theta 2, a third inclination angle theta 3, a fourth inclination angle theta 4, a fifth inclination angle theta 5, and a sixth inclination angle theta 6;

a first test position A1 and a second test position A2;

a bonding jig 100;

a carrier 110, a carrier surface 110a;

an abutting piece 120, an abutting surface 120a;

the limiting piece 130, the limiting surface 130a, the first sub-limiting piece 131, the first limiting structure 131a, the second sub-limiting piece 132 and the second limiting structure 132a;

an operation member 140;

A barrier 150, a barrier face 150a;

a support 160;

a covering member 170 and a covering surface 170a;

a fixed space Q1, a clamping space Q2 and a limiting space Q3;

a waveguide preform 200, a bonding surface 200a, a first end 200b, a second end 200c;

assembly 300, preset surface S1;

an array waveguide 400;

a first direction F1, a second direction F2, a third direction F3;

a first preset angle w1 and a second preset angle w2.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

In the related art, as shown in fig. 1 (a), a plurality of monolithic waveguide substrates 10 are laminated and bonded together in sequence in the vertical direction, wherein the waveguide substrate 10 has two bonding surfaces in the vertical direction, and one bonding surface is subjected to a coating operation. Next, as shown in fig. 1 (b), the bonded waveguide substrate 10 is cut obliquely from the top thereof, and an array waveguide 20 is obtained, as shown in fig. 1 (c) and 1 (d). Since the plurality of waveguide substrates 10 are laminated in the vertical direction, the overall thickness is large, and the waveguide substrates 10 are easily slightly displaced during the dicing process, so that the dicing accuracy of the machine is affected, and the geometric parameters of the array waveguide 20 are affected. After the dicing, the dicing surface 10a (i.e., the light-in surface and the light-out surface) of the array waveguide 20 needs to be ground and polished, so that the flatness of the light-in surface and the light-out surface of the array waveguide 20 is not high.

As shown in tables 1 and 2, table 1 is a table of geometry data of the arrayed waveguide 20 in fig. 1 (c). Table 2 is a table of optical characteristics data of the arrayed waveguide 20 in fig. 1 (c). As can be seen from tables 1 and 2, the geometric data and the optical characteristic data of the array waveguide 20 cannot meet the required specifications, especially in the field of augmented Reality (Augmented Reality, AR) technology and the field of Mixed Reality (MR) technology, the array waveguide 20 is a main technical means for realizing the enhanced visualization effect by the AR/MR device, so the requirements on the geometric data and the optical characteristic data of the array waveguide 20 are high.

TABLE 1

Class of	Measurement data	Specification of specification
			First dimension L1 (mm)	85.50	85.0±0.1
Second dimension L2 (mm)	1.39	1.5±0.1
			First inclination angle theta 1 (degree)	22.8	22±0.5
Second inclination angle θ2 (degree)	21.9	22±0.5
			Third inclination angle θ3 (degree)	22.2	22±0.5
Fourth inclination angle θ4 (degree)	21.5	22±0.5
			Fifth inclination angle theta 5 (degree)	21.1	22±0.5
Sixth inclination angle theta 6 (degree)	21.4	22±0.5

TABLE 2

Based on the above, the embodiment of the application provides a bonding jig and a manufacturing method of an array waveguide, improves the manufacturing process of the array waveguide, is beneficial to improving the manufacturing precision of the array waveguide and realizes high-quality array waveguide.

See fig. 2-6. Fig. 2 shows a schematic structural view of a waveguide preform in an embodiment of the present application. Fig. 3 is a schematic structural diagram of a bonding tool according to an embodiment of the application. Fig. 4 shows a schematic diagram of a process for conforming a waveguide preform by means of the conforming jig of fig. 3. Fig. 5 shows another process schematic for conforming a waveguide preform with the conforming jig of fig. 3. Fig. 6 shows a schematic view of a further process of conforming a waveguide preform by means of the conforming jig of fig. 3. In the figure, the first direction F1 and the second direction F2 are perpendicular to each other, and the first direction F1 and the third direction F3 are disposed at a first preset angle w 1.

The bonding jig 100 provided in an embodiment of the present application is used for bonding a plurality of waveguide preforms 200, the waveguide preforms 200 have two bonding surfaces 200a disposed opposite to each other along a first direction F1, and the bonding jig 100 includes a carrier 110, an abutting part 120, a limiting part 130 and an operating part 140. The carrier 110 has a carrying surface 110a, the carrying surface 110a is used for carrying a plurality of waveguide preforms 200, and the plurality of waveguide preforms 200 are sequentially arranged along a first direction F1. The abutment 120 is located on the load-bearing side of the load-bearing member 110. The abutment 120 has an abutment surface 120a disposed along the first direction F1. The limiting member 130 is disposed on the carrier 110. The stopper 130 has two stopper surfaces 130a disposed opposite to each other along the second direction F2, and the two stopper surfaces 130a, the abutment surface 120a, and the bearing surface 110a together define a fixing space Q1 for fixing the plurality of waveguide preforms 200. The operating member 140 is configured to be movable in a first direction F1 toward or away from the abutment surface 120a in response to an external force to form a clamping space Q2 with the abutment member 120 for clamping the plurality of waveguide preforms 200 such that each adjacent abutment surface 200a of the plurality of waveguide preforms 200 abuts against each other.

The waveguide preform 200 refers to a waveguide sheet fabricated using a waveguide substrate. In particular, in some embodiments, the waveguide substrate may be made of a material such as glass or plastic that has light transmittance, where the waveguide substrate made of glass may be made by a casting process, and the waveguide substrate made of plastic may be made by a hot press molding process or an injection molding process. The waveguide preform 200 has two bonding surfaces 200a, that is, the waveguide substrate has two bonding surfaces 200a, and one of the two bonding surfaces 200a of the waveguide substrate has a coating film to achieve the effect of half transmission and half reflection. Specific surfaces may be selected for coating according to actual conditions, and the embodiment of the present application is not particularly limited.

Further, the waveguide preform 200 needs to be provided with an adhesive on the bonding surface 200a of the waveguide preform 200 before or after being placed on the carrying surface 110a, and the refractive index of the adhesive needs to be the same as that of the waveguide substrate. The adhesive may be solid optical transparent adhesive (Optically Clear Adhesive, OCA) or liquid optical transparent adhesive (Liquid Optical Clear Adhesive, LOCA), and may be selected according to practical needs, which is not particularly limited in this embodiment. It should be noted that, as shown in fig. 2, the dimensions of each waveguide preform 200 along the first direction F1 may be the same or different, and may be set according to actual requirements, which is not particularly limited in this embodiment. The transmittance-reflectance of each waveguide preform 200 is the same. The bonding surface 200a of each waveguide preform 200 is disposed at a first preset angle w1 with respect to the first direction F1, where the size of the first preset angle w1 is related to the product housing and the overall design to which the arrayed waveguide 400 is applied, and the first preset angle w1 may be generally set between 20 degrees and 30 degrees, and the angle thereof cannot be too large, otherwise total reflection cannot be generated.

The carrier 110 refers to a stage or platform that provides a carrying function. The carrier 110 has a bearing surface 110a, and the bearing surface 110a is a surface for facilitating the conforming operation of the waveguide preform 200. The waveguide preform 200 may be placed flat on the bearing surface 110a. The size and shape of the carrier 110 may be set according to practical requirements, which is not particularly limited in this embodiment.

The abutment 120 is a member that can act as an abutment for the waveguide preform 200. The abutting piece 120 is located at one end, i.e. the bearing side, of the bearing piece 110 along the first direction F1, and the abutting piece 120 may be integrally formed with the bearing piece 110, or the abutting piece 120 may be integrally formed with the limiting piece 130, so long as the abutting piece 120 has an abutting surface 120a along the first direction F1. The abutting surface 120a can be parallel to the abutting surface 200a of the waveguide preform 200 placed on the bearing surface 110a, so that the abutting surface 200a of the waveguide preform 200 placed first can abut against the abutting surface 120a, which is convenient for subsequent abutting operation.

The stopper 130 is a member for stopping the plurality of waveguide preforms 200. The two limiting surfaces 130a of the limiting member 130 are parallel to the first direction F1 and perpendicular to the second direction F2, respectively. The dimensions of the two limiting surfaces 130a along the second direction F2 are the same as those of the waveguide preforms 200 along the second direction F2, so that the two limiting surfaces 130a, the abutting surface 120a and the bearing surface 110a together define a fixed space Q1, at least part of the plurality of waveguide preforms 200 can be accommodated in the fixed space Q1, the front ends of the plurality of waveguide preforms 200 along the first direction F1 are limited by the abutting surface 120a, and the two ends of the plurality of waveguide preforms 200 along the second direction F2 are limited by the two limiting surfaces 130 a. It should be noted that, the limiting member 130 may be fixed on the bearing surface 110a of the bearing member 110, or the limiting member 130 is movably connected with the bearing member 110, and may be set according to actual requirements, which is not limited in this embodiment.

The operation member 140 is a member for pressing the plurality of waveguide preforms 200. The handling member 140 has a contact surface (not shown in the drawings) that is a surface that can abut against the plurality of waveguide preforms 200. The operating member 140 can move toward the abutting surface 120a under the action of external force, so that the abutting surface 120a and the contact surface form a clamping space Q2, and the plurality of waveguide preforms 200 are clamped by the clamping space Q2, so that adjacent abutting surfaces 200a in the plurality of waveguide preforms 200 are abutted to each other through adhesive under the action of external force and the action of the clamping space Q2.

Specifically, the plurality of waveguide preforms 200 are placed on the carrying surface 110a one by one along the first direction F1, at least part of the plurality of waveguide preforms 200 is accommodated between the two limiting surfaces 130a, then the contact surface of the operating element 140 is attached to one attaching surface 200a of the waveguide preform 200 located at the end of the plurality of waveguide preforms 200, and under an external force, the plurality of waveguide preforms 200 are moved towards the abutting surface 120a by means of the operating element 140, so that adjacent attaching surfaces 200a of the plurality of waveguide preforms 200 are attached to each other.

In this embodiment, by first manufacturing the waveguide sheet as the waveguide preform 200, the polishing operation in the later stage of the conventional manufacturing process can be omitted, and then the bonding jig 100 is used to bond the plurality of waveguide preforms 200, and the waveguide preform 200 has two bonding surfaces 200a disposed opposite to each other along the first direction F1. The attaching jig 100 at least comprises a carrier 110, an abutting piece 120, a limiting piece 130 and an operating piece 140, wherein two limiting surfaces 130a provided by the limiting piece 130, an abutting surface 120a provided by the abutting piece 120 and a carrying surface 110a provided by the carrier 110 jointly define a fixing space Q1 for fixing a plurality of waveguide preforms 200, the operating piece 140 is acted to move along a first direction F1 so as to form a clamping space Q2 between the operating piece 140 and the abutting piece 120, and two adjacent attaching surfaces 200a in the plurality of waveguide preforms 200 are attached to each other under the clamping action of the clamping space Q2. In this way, the waveguide preforms 200 are laminated together in the first direction F1, the cutting thickness is reduced, the cutting accuracy is improved, and the high-quality arrayed waveguide 400 is facilitated.

With continued reference to fig. 2 and 5, and in conjunction with fig. 7, in some embodiments, the waveguide preform 200 has a first end 200b and a second end 200c disposed opposite in the second direction F2. The bonding tool 100 further includes a plurality of barriers 150. Wherein each barrier 150 is disposed between the first ends 200b of two waveguide preforms 200 adjacent in the first direction F1. And/or, each barrier 150 is provided between the second ends 200c of two waveguide preforms 200 adjacent in the first direction F1.

Note that the barrier 150 refers to a member for spacing between two adjacent waveguide preforms 200. To control the thickness of the adhesive of the plurality of waveguide preforms 200 after the adjacent bonding surfaces 200a are bonded to each other, a dam 150 may be spaced between the adjacent first ends 200b of the plurality of waveguide preforms 200, or a dam 150 may be spaced between the adjacent second ends 200c of the plurality of waveguide preforms 200, or a dam 150 may be spaced between the adjacent first ends 200b of the plurality of waveguide preforms 200, and a dam 150 may be spaced between the adjacent second ends 200c of the plurality of waveguide preforms 200. In addition, no adhesive is disposed between each adjacent first end 200b of the plurality of waveguide preforms 200, and no adhesive is disposed between each adjacent second end 200c of the plurality of waveguide preforms 200, that is, surfaces are reserved at portions of the bonding surfaces 200a of the plurality of waveguide preforms 200 adjacent to the first end 200b and the second end 200c, the reserved surfaces are not covered with adhesive, the reserved surfaces facilitate placement of the barrier member 150 between two adjacent waveguide preforms 200, and the thickness of the adhesive between each adjacent two waveguide preforms 200 is controlled by the barrier member 150.

For example, the plurality of barriers 150 may be a single member independent of each other. After each waveguide preform 200 is placed on the bearing surface 110a, the barrier member 150 is placed on the preset surface of the side of the waveguide preform 200 away from the abutting surface 200a, so that the barrier members 150 are spaced between two adjacent waveguide preforms 200, the thickness of the adhesive between each two adjacent waveguide preforms 200 is controlled by the barrier members 150, and the damage to the waveguide preforms 200 during the lamination process can be reduced.

In some embodiments, the barrier 150 is configured to be able to abut a corresponding end of a waveguide preform 200 adjacent to the barrier 150 in the event that a plurality of waveguide preforms 200 are conformed to one another. Specifically, under the action of the external force and the clamping space Q2, each adjacent first end 200b of the plurality of waveguide preforms 200 abuts against one barrier member 150, and/or each adjacent second end 200c of the plurality of waveguide preforms 200 abuts against another barrier member 150. In this way, the degree of compaction of the press-fit between the individual waveguide preforms 200 can be increased, while damage to the waveguide preforms 200 can be reduced.

With continued reference to fig. 7, in some embodiments, the barrier 150 has a barrier surface 150a. The blocking surface 150a is configured to be parallel to the bonding surface 200 a. In particular, the barrier 150 may be planar. When the barrier 150 is placed between two adjacent waveguide preforms 200, the barrier surface 150a is parallel to the bonding surface 200a, and the barrier surface 150a is disposed at a first predetermined angle w1 with respect to the first direction F1. In this way, the bonding effect between the waveguide preforms 200 is improved by the surface-to-surface contact method between the barrier surface 150a and the bonding surface 200 a.

With continued reference to fig. 3, in some embodiments, the limiting member 130 includes a first sub-limiting member 131 and a second sub-limiting member 132 disposed on the carrier 110, and the first sub-limiting member 131 and the second sub-limiting member 132 are disposed opposite to each other along the second direction F2. The surfaces of the first sub-stopper 131 and the second sub-stopper 132 facing each other are stopper surfaces 130a.

Specifically, the first sub-stopper 131 refers to a single integral member or a plurality of sub-members for providing one of the two stopper surfaces 130a, 130a. The second sub-stop 132 refers to a unitary member or sub-members for providing the other one 130a of the two stop surfaces 130a.

For example, the first sub-limiter 131 and the second sub-limiter 132 may be configured as a single integral member and disposed on the bearing surface 110a of the bearing 110, and further, the first sub-limiter 131, the second sub-limiter 132, and the bearing 110 may be of an integral structure. The first sub-stopper 131 and the second sub-stopper 132 are disposed opposite to each other along the second direction F2. The surfaces of the first sub-stopper 131 and the second sub-stopper 132 facing each other are stopper surfaces 130a. In this way, the limiting surfaces 130a of the first sub-limiting member 131 and the limiting surfaces 130a of the second sub-limiting member 132 limit the plurality of waveguide preforms 200 placed on the bearing surface 110a, that is, limit the plurality of waveguide preforms 200 in the second direction F2, so as to reduce the displacement of the waveguide preforms 200 in the second direction F2, thereby facilitating the completion of the bonding operation of the waveguide preforms 200 and improving the bonding effect.

With continued reference to fig. 3 and 5, further, the first sub-limiting member 131 includes a plurality of first limiting structures 131a disposed on the carrier 110 and independent from each other, and the plurality of first limiting structures 131a are disposed along the first direction F1. The second sub-limiting member 132 includes a plurality of second limiting structures 132a disposed on the carrier 110 and independent from each other, and the plurality of second limiting structures 132a are disposed along the first direction F1. Each first limiting structure 131a corresponds to one second limiting structure 132a.

It should be noted that, the first limiting structure 131a refers to a sub-member for providing at least a part of the surface of one of the two limiting surfaces 130 a. The second stop feature 132a refers to a sub-member for providing at least a portion of the surface of the other stop face 130a of the two stop faces 130 a.

Further, the first limiting structure 131a and the second limiting structure 132a are slidably connected to the carrier 110 along the first direction F1, respectively. It should be noted that, two sliding grooves are formed on the bearing surface 110a along the first direction F1, and the first limiting structure 131a and the second limiting structure 132a each have a sliding block, so that the first limiting structure 131a and the second limiting structure 132a are slidably connected to the bearing surface 110a of the bearing member 110 along the first direction F1. In addition, the operating member 140 may also be provided with a slider, so that the operating member 140 is slidably connected to the bearing surface 110a of the bearing member 110, so as to slide the operating member 140 along the first direction.

For example, the dimension of the chute along the first direction F1 may be the same as the dimension of the bearing surface 110a along the first direction F1, that is, the first limiting structure 131a and the second limiting structure 132a may slide out from the bearing surface 110a, so that the number of the groups of the first limiting structure 131a and the second limiting structure 132a on the bearing surface 110a may be adjusted according to the number of the waveguide preforms 200. Alternatively, the size of the sliding groove along the first direction F1 may be smaller than the size of the bearing surface 110a along the first direction F1, that is, the first limiting structure 131a and the second limiting structure 132a are always kept in a connected state with the bearing member 110, so that the sliding situation of the first limiting structure 131a and the second limiting structure 132a can be reduced.

Specifically, after each waveguide preform 200 is placed on the carrying surface 110a, a set of the first limiting structure 131a and the second limiting structure 132a are moved to be located at the first end 200b and the second end 200c of the waveguide preform 200, so as to limit the waveguide preform 200 in the second direction F2, and reduce the displacement of the waveguide preform 200 in the second direction F2.

In some embodiments, each of the first limiting structures 131a and each of the second limiting structures 132a are respectively provided with a blocking member 150. Further, the first limiting structure 131a and the blocking member 150 connected to the first limiting structure 131a are an integral structure. And/or the second limiting structure 132a and the blocking member 150 connected to the second limiting structure 132a are in an integral structure.

Specifically, one blocking member 150 is connected to each first limiting structure 131a, one blocking member 150 is connected to each second limiting structure 132a, and the blocking surface 150a of the blocking member 150 is parallel to the third direction F3, and the third direction F3 is parallel to the bonding surface 200a of the waveguide preform 200. Further, after each waveguide preform 200 is placed on the carrying surface 110a, the first limiting structure 131a and the second limiting structure 132a are moved, and the blocking surface 150a of the blocking member 150 can be attached to the attaching surface 200a. In this way, the confining operation and the blocking operation for one waveguide preform 200 can be completed at one time, thereby improving the convenience of operation and the operation efficiency.

Considering that the waveguide preform 200 may be bonded by using a liquid optically transparent adhesive, it is necessary to drop the liquid optically transparent adhesive on the corresponding bonding surface 200a of the waveguide preform 200 after the waveguide preform 200 is placed on the carrying surface 110 a. If the bonding jig 100 of the present embodiment is placed horizontally, that is, the carrying surface 110a is disposed horizontally, and the liquid optical transparent adhesive is dropped onto the bonding surface 200a of the waveguide preform 200 in an inclined state, the liquid optical transparent adhesive is easy to overflow onto the carrying surface 110a due to the flowability, so that the residual amount of the liquid optical transparent adhesive on the bonding surface 200a is insufficient, and the bonding effect of the waveguide preform 200 is affected. The solid optical transparent glue is adopted between the waveguide prefabricated members 200, so that the corresponding bonding surface 200a of the waveguide prefabricated member 200 can be covered with the solid optical transparent glue in advance, and the bonding jig 100 of the embodiment is horizontally arranged, that is, the bearing surface 110a is horizontally arranged.

In some embodiments, the conforming jig 100 further comprises a support 160. The supporting member 160 is connected to the supporting member 110, and is configured to set the supporting surface 110a at a second predetermined angle w2 with respect to the horizontal direction. The first preset angle w1 is equal to the second preset angle w 2.

The support 160 is a member for supporting the carrier 110. The supporting member 160 may be a supporting table or a supporting frame, and is specifically configured according to practical situations, which is not particularly limited in this embodiment. Specifically, after the carrier 110 is placed on the supporting member 160, the carrying surface 110a of the carrier 110 is inclined, the carrying surface 110a is set at a second preset angle w2 with respect to the horizontal direction, and the bonding surface 200a of the waveguide preform 200 and the first direction F1 are set at a first preset angle w1, so that the first preset angle w1 and the second preset angle w2 can be set to be equal. In this way, the bonding surface 200a of the waveguide preform 200 can be parallel to the horizontal plane, so as to improve the situation that the liquid optical transparent adhesive overflows to the bearing surface 110a and the amount of the liquid optical transparent adhesive on the bonding surface 200a is insufficient, thereby improving the bonding effect of the waveguide preform 200.

In some embodiments, the fitting jig 100 further includes a cover 170, where the cover 170 is used to cover the carrier 110. The covering member 170 has a covering surface 170a, and in the covering state, a limiting space Q3 is defined between the covering surface 170a and the bearing surface 110a, and the limiting space Q3 is used for limiting the plurality of waveguide preforms 200.

The lid 170 is a member that performs a function of lid-fixing the plurality of waveguide preforms 200. The covering member 170 has a covering surface 170a, and the covering surface 170a may be configured as a plane. The space Q3 refers to a space for spacing and fixing the top surfaces of the plurality of waveguide preforms 200 in a direction perpendicular to the carrying surface 110 a.

Specifically, after the plurality of waveguide preforms 200 are sequentially placed on the carrying surface 110a and fixed by the fixing space Q1, the covering member 170 is covered on the carrying member 110, so that the covering surface 170a contacts the top surfaces of the plurality of waveguide preforms 200, and a limiting space Q3 is limited between the covering surface 170a and the carrying surface 110 a. In this way, the waveguide preforms 200 are not easy to displace towards the side away from the bearing surface 110a during the pressing process, and all the waveguide preforms 200 are pressed in the limiting space Q3, so that the pressing precision of the waveguide preforms 200 can be improved.

It is contemplated that the liquid optically transparent adhesive is not easily cured after the liquid optically transparent adhesive is used between the waveguide preforms 200. In some embodiments, the attaching jig 100 further includes an illumination member (not shown) disposed on the covering member 170, where the illumination member is used for illuminating the plurality of waveguide preforms 200 in the limiting space Q3.

Specifically, the light irradiation means a member for light-curing the liquid optically clear adhesive. The illumination member may be an Ultraviolet (UV) lamp, and the layout model and layout position of the ultraviolet lamp may be specifically set according to actual requirements, which is not specifically limited in this embodiment. In this way, the curing speed of the liquid optically transparent adhesive can be increased by providing the illumination member, and the attaching operation efficiency of the waveguide preform 200 can be improved.

Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing an array waveguide 400, where the method for manufacturing an array waveguide 400 uses the bonding jig 100 according to any one of the previous embodiments. The method for manufacturing the array waveguide 400 comprises the following steps:

s11, stacking the plurality of waveguide preforms 200 on the carrying surface 110a sequentially along the first direction F1 by means of the limiting member 130, so that at least part of the plurality of waveguide preforms 200 is accommodated in the fixing space Q1.

S12, moving the operating member 140 along the first direction F1 to form a clamping space Q2, so that each adjacent bonding surface 200a of the plurality of waveguide preforms 200 is bonded to each other, thereby obtaining the assembly 300.

Specifically, the plurality of waveguide preforms 200 are placed on the bearing surface 110a one by one along the first direction F1, at least part of the plurality of waveguide preforms 200 is accommodated between the two limiting surfaces 130a of the limiting member 130, then the contact surface of the operating member 140 is attached to one attaching surface 200a of the waveguide preform 200 located at the end of the plurality of waveguide preforms 200, and under the action of the external force and the clamping space Q2, the plurality of waveguide preforms 200 are moved towards the attaching surface 120a by means of the operating member 140, so that the adjacent attaching surfaces 200a of the plurality of waveguide preforms 200 are attached to each other, thereby obtaining the assembly 300. In addition, the specific arrangement of the components of the bonding tool 100 is described in detail in the foregoing embodiments, and will not be described herein.

In some embodiments, the bonding tool 100 further comprises a plurality of barriers 150. The waveguide preform 200 has a first end 200b and a second end 200c disposed opposite in a second direction F2. In step S11, a plurality of waveguide preforms 200 are stacked on the carrying surface 110a in sequence along the first direction F1 by means of the stoppers 130, including:

s110, after each waveguide preform 200 is disposed on the bearing surface 110a, at least one barrier member 150 is disposed at the first end 200b and/or the second end 200c of the corresponding waveguide preform 200, such that the barrier member 150 is located between two adjacent waveguide preforms 200.

Specifically, to control the thickness of the adhesive applied to each adjacent bonding surface 200a of the plurality of waveguide preforms 200, a spacer 150 may be disposed between each adjacent first end 200b of the plurality of waveguide preforms 200, or a spacer 150 may be disposed between each adjacent second end 200c of the plurality of waveguide preforms 200, or a spacer 150 may be disposed between each adjacent first end 200b of the plurality of waveguide preforms 200, and a spacer 150 may be disposed between each adjacent second end 200c of the plurality of waveguide preforms 200. In this way, the barrier member 150 is spaced between each two adjacent waveguide preforms 200, the thickness of the adhesive between each two adjacent waveguide preforms 200 is controlled by the barrier member 150, and the damage to the waveguide preforms 200 can be reduced. In addition, the specific arrangement of the components of the bonding tool 100 is described in detail in the foregoing embodiments, and will not be described herein.

In some embodiments, the limiting member 130 includes a plurality of first limiting structures 131a and a plurality of second limiting structures 132a, each of which is slidably connected to the carrier 110 along the first direction F1, where each of the first limiting structures 131a can correspond to one of the second limiting structures 132a along the second direction F2; each first limiting structure 131a and each second limiting structure 132a are respectively provided with a blocking member 150. In step S110, after each waveguide preform 200 is disposed on the bearing surface 110a, at least one barrier 150 is disposed on the first end 200b and/or the second end 200c of the corresponding waveguide preform 200, including:

s1101, after the current waveguide preform 200 is disposed on the bearing surface 110a, a first limiting structure 131a and a corresponding second limiting structure 132a are moved along the first direction F1 to form at least a part of a fixing space Q1 for fixing the current waveguide preform 200, and the blocking member 150 on the current first limiting structure 131a is located at the first end 200b of the current waveguide preform 200, and the blocking member 150 on the current second limiting structure 132a is located at the second end 200c of the current waveguide preform 200.

Specifically, since one blocking member 150 is connected to each first limiting structure 131a, one blocking member 150 is connected to each second limiting structure 132 a. Further, after the current waveguide preform 200 is placed on the carrying surface 110a, a set of first limiting structures 131a and corresponding second limiting structures 132a are moved to limit the first end 200b and the second end 200c of the current waveguide preform 200, and the blocking member 150 of the first limiting structure 131a is disposed at the first end 200b of the current waveguide preform 200, and the blocking member 150 of the second limiting structure 132a is disposed at the second end 200c of the current waveguide preform 200, so that the blocking member 150 is spaced between two adjacent waveguide preforms 200. In this way, the confining operation and the blocking operation for one waveguide preform 200 can be completed at one time, thereby improving the convenience of operation and the operation efficiency. In addition, the specific arrangement of the components of the bonding tool 100 is described in detail in the foregoing embodiments, and will not be described herein.

In some embodiments, after the assembly 300 is obtained in step S12, the method for manufacturing the arrayed waveguide 400 further includes:

s13, cutting the assembly 300 along a preset path on the preset surface S1 of the assembly 300 to obtain the array waveguide 400. Wherein, the first direction F1 and the second direction F2 are parallel to the preset surface S1.

Specifically, the preset surface S1 refers to one of two surfaces of the assembly 300 that are disposed opposite to each other along the third direction F3. The preset surface S1 is parallel to the first direction F1 and the second direction F2, respectively, and the preset path refers to a cutting path when the assembly 300 is cut to obtain the single arrayed waveguide 400. The extending direction of the preset path may be parallel to the first direction F1, or the extending direction of the preset path intersects with the first direction F1, and the dimensions of the array waveguide 400 along the second direction F2 may be all related to the product housing and the overall design applied by the array waveguide 400, and may be set according to practical situations, which is not particularly limited in this embodiment.

Compared with the prior art, after the waveguide substrates 10 are stacked and bonded in the vertical direction, the top of the waveguide substrates 10 need to be beveled, so that materials on two sides of the waveguide substrates 10 are wasted, and the utilization rate of the waveguide substrates 10 is not high.

In some embodiments, before stacking the plurality of waveguide preforms 200 on the carrying surface 110a in the first direction F1 in sequence in step S11, the method for manufacturing the arrayed waveguide 400 further includes:

s101, providing a waveguide substrate.

S102, coating a film on the target surface of the waveguide substrate to obtain the waveguide preform 200. The target surface is one of two bonding surfaces 200a corresponding to the waveguide substrate.

Specifically, the waveguide substrate may be made of a material such as glass or plastic having light transmittance, wherein the waveguide substrate made of glass may be made by a casting process, and the waveguide substrate made of plastic may be made by a hot press molding process or an injection molding process. The waveguide preform 200 has two bonding surfaces 200a, that is, the waveguide substrate has two bonding surfaces 200a, and one of the two bonding surfaces 200a of the waveguide substrate has a coating film, and a specific surface may be selected for coating according to practical situations, which is not particularly limited in the embodiment of the present application.

Compared with the related art, the method provides a plurality of monolithic waveguide substrates, and the monolithic waveguide substrates are laminated and bonded together in sequence in the vertical direction, so that the subsequent cutting thickness is large, and the cut surface of the array waveguide 400 after cutting needs to be ground and polished, so that the flatness of the light incident surface and the light emergent surface of the array waveguide 400 is not high. In the embodiment of the application, the waveguide substrate can be manufactured by a casting process, a hot press forming process or an injection forming process, so that the manufacturing precision of the waveguide substrate can be improved, and the light incident surface and the light emergent surface of the subsequent array waveguide 400 are determined while the waveguide substrate is manufactured, namely, the two surfaces of the waveguide prefabricated member 200 which are oppositely arranged along the third direction F3, therefore, the subsequent array waveguide 400 is only required to be sequentially attached together along the first direction F1, the cutting thickness is smaller, the cutting precision is higher, and the cut array waveguide 400 does not need to grind and polish the light incident surface and the light emergent surface of the array waveguide 40, so that the geometric dimension data and the optical performance data of the array waveguide 400 manufactured by the embodiment are more accurate, approach to the standard requirements, and the array waveguide 400 with high quality is facilitated.

In some embodiments, before stacking the plurality of waveguide preforms 200 on the bearing surface 110a in the first direction F1, the method for fabricating the array waveguide 400 further includes:

s103, setting adhesive on at least one bonding surface 200a of the waveguide prefabricated member 200.

It should be noted that, before or after the waveguide preform 200 is placed on the carrying surface 110a, an adhesive needs to be disposed on the bonding surface 200a of the waveguide preform 200, and the adhesive may be a solid optical transparent adhesive or a liquid optical transparent adhesive, which may be selected according to practical needs, and is not limited in this embodiment. It should be noted that, depending on the type of adhesive used, the state of the carrier 110 may be set to improve the bonding effect of the waveguide preform 200. Specifically, one of the two bonding surfaces 200a of the waveguide preform 200 placed first covers the adhesive, wherein the other bonding surface 200a is used for contacting with the abutment surface 120a, one of the two bonding surfaces 200a of the waveguide preform 200 placed last covers the adhesive, wherein the other bonding surface 200a is used for contacting with the contact surface of the operation member 140, and the two bonding surfaces 200a of each waveguide preform 200 placed in the middle can both cover the adhesive, so as to improve the bonding strength between the respective waveguide preforms 200.

In some embodiments, the waveguide substrate includes a first substrate and a second substrate, the first substrate having a dimension along the first direction F1 that is greater than a dimension along the first direction F1 of the second substrate. In particular, in some embodiments, the array waveguide 400 may be applied to a wearable device, and since the wearable device has a distance from the lens frame to the human eye, the waveguide substrate (i.e. the first substrate) on two sides of the fabricated array waveguide 400 along the first direction F1 is required to have a larger size along the first direction F1, and the waveguide substrate (i.e. the second substrate) on the middle part is required to have a smaller size along the first direction F1.

Further, the first substrate has a dimension in the first direction F1 of 2 cm to 3 cm, and the second substrate has a dimension in the first direction F1 of 0.8 cm to 2 cm. Specifically, the first substrate may have a dimension along the first direction F1 of 2 cm, 2.1 cm, 2.2 cm, 2.3 cm, 2.4 cm, 2.5 cm, 2.6 cm, 2.7 cm, 2.8 cm, 2.9 cm, or 3 cm. While the second substrate may have a dimension in the first direction F1 of 0.8 cm, 0.9 cm, 1 cm, 1.1 cm, 1.2 cm, 1.3 cm, 1.4 cm, 1.5 cm, 1.6 cm, 1.7 cm, 1.8 cm, 1.9 cm or 2 cm. The setting may be performed according to actual demands, and the present embodiment is not particularly limited thereto.

In some embodiments, the number of first substrates is provided two and the number of second substrates is provided a plurality. The two first substrates are located at two opposite sides of the assembly 300 along the first direction F1, and the plurality of second substrates are located between the two first substrates disposed opposite to each other. In particular, in some embodiments, the array waveguide 400 may be applied to a wearable device, where the second substrate in the array waveguide 400 is located in front of the human eye, and the multiple laminated second substrates combined with the film coating layer thereof can enable the AR/MR image to have a pupil expansion effect, so that the smaller the size of the multiple second substrates along the first direction F1, the more the number of second substrates can be set, so as to improve the pupil expansion effect of the array waveguide 400 on the AR/MR image.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims

1. A laminating tool for laminate a plurality of waveguide prefabs, the waveguide prefab has two faying surfaces of relative setting along first direction, its characterized in that, laminating tool includes:

a carrier having a carrying surface for carrying the plurality of waveguide preforms, the plurality of waveguide preforms being arranged in sequence along the first direction;

the abutting piece is positioned on the bearing side of the bearing piece; the abutment has an abutment surface disposed along the first direction;

the limiting piece is arranged on the bearing piece; the limiting piece is provided with two limiting surfaces which are oppositely arranged along the second direction, and the two limiting surfaces, the abutting surface and the bearing surface jointly define a fixing space for fixing the plurality of waveguide prefabricated parts; a kind of electronic device with high-pressure air-conditioning system

An operating member configured to be movable in the first direction toward or away from the abutment surface in response to an external force to form a clamping space with the abutment member for clamping the plurality of waveguide preforms, so that each adjacent abutment surface of the plurality of waveguide preforms is abutted against each other;

2. The conforming jig of claim 1 wherein the waveguide preform has first and second ends disposed opposite along the second direction;

The attaching jig further comprises a plurality of blocking pieces;

wherein each of said barriers is disposed between said first ends of two of said waveguide preforms adjacent in said first direction; and/or

Each of the barriers is disposed between the second ends of two of the waveguide preforms adjacent in the first direction.

3. The bonding jig according to claim 2, wherein the blocking member has a blocking surface;

the blocking surface is configured to be parallel to the abutment surface.

4. The bonding jig of claim 3, wherein the blocking surface and the bonding surface are each configured to be disposed at a first predetermined angle from the first direction.

5. The bonding jig according to claim 2, wherein the barrier is configured to be able to abut against a corresponding end of the waveguide preform adjacent to the barrier when the plurality of waveguide preforms are bonded to each other.

6. The bonding jig according to any one of claims 2 to 5, wherein the limiting member includes a first sub-limiting member and a second sub-limiting member both provided on the carrier, the first sub-limiting member and the second sub-limiting member being disposed opposite to each other along the second direction;

7. The bonding jig according to claim 6, wherein the first sub-stopper includes a plurality of first stopper structures provided on the carrier and independent from each other, the plurality of first stopper structures being arranged along the first direction;

each first limit structure corresponds to one second limit structure.

8. The bonding jig according to claim 7, wherein the first limiting structure and the second limiting structure are slidably connected to the carrier along the first direction respectively.

9. The fitting jig according to claim 8, wherein each of the first and second limiting structures is provided with a blocking member.

10. The bonding jig according to claim 9, wherein the first limit structure and the blocking member connected to the first limit structure are an integral structure; and/or

11. The bonding tool according to any one of claims 1-5, further comprising a support; the supporting piece is connected to the bearing piece and is used for enabling the bearing surface to be arranged at a second preset angle with the horizontal direction;

the first preset angle is equal to the second preset angle.

12. The bonding tool according to any one of claims 1-5, further comprising a cover for covering the carrier;

13. The bonding jig of claim 12, further comprising an illumination member disposed on the covering member, the illumination member being configured to illuminate the plurality of waveguide preforms in the spacing space.

14. A method for manufacturing an array waveguide, characterized in that the method for manufacturing an array waveguide is manufactured by using the bonding jig according to any one of claims 1 to 13; the manufacturing method of the array waveguide comprises the following steps:

Sequentially stacking a plurality of waveguide preforms on the bearing surface along the first direction by means of the limiting piece so that at least part of the waveguide preforms are accommodated in the fixed space;

and moving the operating piece along the first direction to form the clamping space, so that adjacent bonding surfaces in the plurality of waveguide prefabricated parts are bonded with each other, and an assembly is obtained.

15. The method of claim 14, wherein the bonding jig further comprises a plurality of blocking members; the waveguide preform having a first end and a second end disposed opposite along the second direction;

the step of stacking a plurality of waveguide preforms on the bearing surface sequentially along the first direction by means of the limiting piece comprises the following steps:

after each of the waveguide preforms is arranged on the carrying surface, at least one of the barriers is arranged at the first end and/or the second end of the corresponding waveguide preform such that the barrier is located between two adjacent waveguide preforms.

16. The method of manufacturing an arrayed waveguide of claim 15, wherein the spacing member comprises a plurality of first spacing structures and a plurality of second spacing structures each slidably connected to the carrier along the first direction, each of the first spacing structures being capable of corresponding to one of the second spacing structures along the second direction; each first limit structure and each second limit structure are respectively provided with a blocking piece;

Said disposing at least one said barrier member at a first and/or second end of a corresponding said waveguide preform after each said waveguide preform is disposed at said bearing surface, comprising:

after the current waveguide preform is disposed on the bearing surface, moving a first limit structure and a corresponding second limit structure along the first direction to form at least part of the fixing space for fixing the current waveguide preform, wherein the blocking piece on the current first limit structure is positioned at the first end of the current waveguide preform, and the blocking piece on the current second limit structure is positioned at the second end of the current waveguide preform.

17. A method of fabricating an arrayed waveguide as claimed in any one of claims 14 to 16, wherein the resulting assembly, after it has been formed, comprises:

cutting the assembly along a preset path on a preset surface of the assembly to obtain the array waveguide;

wherein the first direction and the second direction are parallel to the preset surface.

18. The method of fabricating an arrayed waveguide of any one of claims 14 to 16, wherein prior to stacking a plurality of waveguide preforms sequentially on the bearing surface in the first direction, the method further comprises:

Providing a waveguide substrate;

coating a film on the target surface of the waveguide substrate to obtain the waveguide prefabricated member; the target surface is one of the two bonding surfaces corresponding to the waveguide substrate.

19. The method of fabricating an arrayed waveguide of any one of claims 14 to 16, wherein prior to stacking a plurality of waveguide preforms sequentially on the bearing surface in the first direction, the method further comprises:

and setting adhesive on at least one joint surface of the waveguide prefabricated member.

20. The method of any one of claims 14-16, wherein the waveguide substrate comprises a first substrate and a second substrate, the first substrate having a dimension along the first direction that is greater than the dimension along the first direction of the second substrate.

21. The method of claim 20, wherein the first substrate has a dimension in the first direction of 2 cm to 3 cm and the second substrate has a dimension in the first direction of 0.8 cm to 2 cm.

22. The method of manufacturing an arrayed waveguide of claim 20, wherein the number of the first substrates is two and the number of the second substrates is a plurality; the two first base materials are positioned on two opposite sides of the assembly along the first direction, and the plurality of second base materials are positioned between the two oppositely arranged first base materials.