CN117089302A - Organic silicon pouring sealant for display screen and preparation method thereof - Google Patents
Organic silicon pouring sealant for display screen and preparation method thereof Download PDFInfo
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- CN117089302A CN117089302A CN202311159945.3A CN202311159945A CN117089302A CN 117089302 A CN117089302 A CN 117089302A CN 202311159945 A CN202311159945 A CN 202311159945A CN 117089302 A CN117089302 A CN 117089302A
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- 239000000565 sealant Substances 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 17
- 229910052710 silicon Inorganic materials 0.000 title claims description 17
- 239000010703 silicon Substances 0.000 title claims description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims abstract description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000945 filler Substances 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000012745 toughening agent Substances 0.000 claims abstract description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 11
- 239000001257 hydrogen Substances 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- 229920002545 silicone oil Polymers 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims description 49
- 238000002156 mixing Methods 0.000 claims description 28
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 14
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 claims description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- -1 polydimethylsiloxane Polymers 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 8
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 7
- PGTMTTGPWLZNQO-UHFFFAOYSA-N 2-dodecyl-1,3,5,7,9,11-hexaoxa-2,4,6,8,10,12-hexasilacyclododecane Chemical compound C(CCCCCCCCCCC)[SiH]1O[SiH2]O[SiH2]O[SiH2]O[SiH2]O[SiH2]O1 PGTMTTGPWLZNQO-UHFFFAOYSA-N 0.000 claims description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 7
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 claims description 7
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 7
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 7
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 claims description 7
- 239000004952 Polyamide Substances 0.000 claims description 7
- 239000005062 Polybutadiene Substances 0.000 claims description 7
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 7
- 150000008064 anhydrides Chemical class 0.000 claims description 7
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 claims description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 7
- 229910021389 graphene Inorganic materials 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 7
- 239000000395 magnesium oxide Substances 0.000 claims description 7
- 239000010445 mica Substances 0.000 claims description 7
- 229910052618 mica group Inorganic materials 0.000 claims description 7
- 150000002825 nitriles Chemical class 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 7
- 229920002647 polyamide Polymers 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 229920000570 polyether Polymers 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000002383 tung oil Substances 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims 7
- 239000002131 composite material Substances 0.000 claims 1
- 238000007259 addition reaction Methods 0.000 abstract description 2
- 229920000620 organic polymer Polymers 0.000 abstract description 2
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- VYFYYTLLBUKUHU-UHFFFAOYSA-N dopamine Chemical compound NCCC1=CC=C(O)C(O)=C1 VYFYYTLLBUKUHU-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229960003638 dopamine Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention relates to the technical field of organic polymers, and discloses an organosilicon pouring sealant for a display screen and a preparation method thereof, wherein the organosilicon pouring sealant comprises the following components in parts by weight: 60-100 parts of modified epoxy resin, 40-60 parts of hydrogen-containing silicone oil, 20-40 parts of siloxane, 60-80 parts of filler, 3-8 parts of toughening agent, 5-15 parts of curing agent and 2-5 parts of accelerator. The modified epoxy resin is prepared by copolymerizing styrene and divinylbenzene to modify bisphenol A epoxy resin, and a certain amount of solubilizer is added to reduce the viscosity of the modified epoxy resin by selecting the proportion of the styrene, the divinylbenzene and the bisphenol A epoxy resin. The addition reaction of the organosilicon and the modified epoxy resin is carried out, and then the filler is added, so that the pouring sealant has better heat resistance and excellent mechanical property, and simultaneously has good air tightness, and can effectively prevent water vapor from penetrating. The pouring sealant has good heat and impact resistance and low viscosity, and can be applied to various scenes.
Description
Technical Field
The invention relates to the technical field of organic polymers, in particular to an organic silicon pouring sealant for a display screen and a preparation method thereof.
Background
The pouring sealant, also called electronic glue, is used for bonding, pouring and coating electronic instruments, is liquid before being cured, has certain fluidity, and has the functions of dust prevention, moisture prevention, corrosion prevention and shock absorption. The pouring sealant is made of various materials, such as epoxy resin, silicone rubber, polyurethane, UV and EVA, and the pouring sealant with corresponding functions is selected according to different application environments. The display screen is composed of a lattice and a panel and is used for displaying characters, pictures, animations and the like, and is widely applied to various fields, so that the requirements on the display screen are higher and higher, and the devices in the display screen are required to be encapsulated and protected in the face of an outdoor complex working environment. In patent CN112480863B, an organosilicon pouring sealant is reported, and dopamine modified organosilicon resin is adopted, so that the pouring sealant does not need to treat the surface of a device, and the adhesion between the pouring sealant and an electronic device can be effectively improved. The fluidity is affected to some extent while the adhesion is improved, the coverage of the components is insufficient, and the air tightness is reduced, so that the components cannot be well protected. Therefore, the pouring sealant with low viscosity, impact resistance, heat resistance and corrosion resistance is required, and the market application prospect is wide.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides the organic silicon pouring sealant for the display screen and the preparation method thereof, which have smaller viscosity and good heat resistance, impact resistance and air tightness.
(II) technical scheme
The organic silicon pouring sealant for the display screen comprises the following components in parts by weight: 60-100 parts of modified epoxy resin, 40-60 parts of hydrogen-containing silicone oil, 20-40 parts of siloxane, 60-80 parts of filler, 3-8 parts of toughening agent, 5-15 parts of curing agent and 2-5 parts of accelerator.
Preferably, the preparation method of the modified epoxy resin comprises the following steps: adding a solubilizer into 50-70 parts of bisphenol A epoxy resin, stirring for 10-20 min, adding 25-40 parts of styrene and divinylbenzene, adding 0.3-0.8 part of initiator benzoyl peroxide, and stirring for 10-30 min to obtain modified epoxy resin.
Preferably, the siloxane is one of tetramethyl tetravinyl cyclotetrasiloxane, alpha, omega-dihydroxy polydimethylsiloxane, 1, 3-tetramethyl disiloxane and dodecyl cyclohexasiloxane.
Preferably, the filler is one or more of silica micropowder, alumina, magnesia, mica powder and graphene oxide.
Preferably, the toughening agent is one of polyurethane, nitrile rubber-26, hydroxyl-terminated polybutadiene, carboxyl-terminated polybutadiene and polyether.
Preferably, the curing agent is one of polyamide, dodecenyl succinic anhydride, tung oil anhydride, aliphatic amine, phenolic amine and triethanolamine.
Preferably, the accelerator is one of 2-methylimidazole, 2-ethyl-4-methylimidazole, triethylamine, benzylamine and triethanolamine.
Preferably, the preparation method comprises the following steps:
(1) Mixing the modified epoxy resin, the hydrogen-containing silicone oil and the siloxane, dropwise adding a platinum catalyst while stirring, and stirring for 10-30 min to obtain an organic silicon resin polymer; mixing the organic silicon resin polymer and the filler, stirring for 30-60 min, vacuum defoaming, and sealing;
(2) Mixing the toughening agent, the curing agent and the accelerator, stirring for 10-30 min, vacuum defoaming and sealing;
(3) And (3) mixing the products obtained in the step (1) and the step (2) when filling and sealing, and stirring for 5-10 min to obtain the pouring sealant.
(III) beneficial technical effects
An organosilicon pouring sealant for a display screen comprises modified epoxy resin, hydrogen-containing silicone oil, siloxane, filler, toughening agent, curing agent and accelerator.
The modified epoxy resin is prepared by copolymerizing styrene and divinylbenzene to modify bisphenol A epoxy resin, and a certain amount of solubilizer is added by selecting the proportion of the styrene, the divinylbenzene and the bisphenol A epoxy resin, so that the modified product has smaller viscosity. The addition reaction of the organosilicon and the modified epoxy resin is carried out, and then the filler is added, so that the pouring sealant has better heat resistance and excellent mechanical property, and simultaneously has good air tightness, and can effectively prevent water vapor from penetrating. The pouring sealant has good heat and impact resistance and low viscosity, and can be applied to various scenes.
Detailed Description
Example 1
(1) Adding a solubilizer into 70 kg bisphenol A epoxy resin, stirring for 20 min, adding 40 kg styrene and divinylbenzene, adding 0.8 kg benzoyl peroxide serving as an initiator, and stirring for 30 min to obtain the modified epoxy resin.
(2) Mixing 60 kg modified epoxy resin, 40 kg hydrogen-containing silicone oil and 20 kg siloxane, dropwise adding a platinum catalyst while stirring, and stirring for 10 min to obtain an organosilicon resin polymer; mixing the organic silicon resin polymer and 60 kg filler, stirring for 30 min, vacuum defoaming, and sealing.
(3) Mixing 5 kg toughening agent, 10 kg curing agent and 3 kg accelerator, stirring for 15 min, vacuum defoaming, and sealing.
(4) And (3) mixing the products obtained in the step (2) and the step (3) when filling and sealing, and stirring for 5 min to obtain the pouring sealant.
The siloxane is one of tetramethyl tetravinyl cyclotetrasiloxane, alpha, omega-dihydroxy polydimethylsiloxane, 1, 3-tetramethyl disiloxane and dodecyl cyclohexasiloxane.
The filler is one or more of silica micropowder, aluminum oxide, magnesium oxide, mica powder and graphene oxide.
The toughening agent is one of polyurethane, nitrile rubber-26, hydroxyl-terminated polybutadiene, carboxyl-terminated polybutadiene and polyether.
The curing agent is one of polyamide, dodecenyl succinic anhydride, tung oil anhydride, fatty amine, phenolic amine and triethanolamine.
The promoter is one of 2-methylimidazole, 2-ethyl-4-methylimidazole, triethylamine, benzylamine and triethanolamine.
Example 2
(1) Adding a solubilizer into 50 kg bisphenol A epoxy resin, stirring for 10 min, adding 25 kg styrene and divinylbenzene, adding 0.3 kg benzoyl peroxide serving as an initiator, and stirring for 10 min to obtain the modified epoxy resin.
(2) Mixing 90 kg modified epoxy resin, 45 kg hydrogen-containing silicone oil and 30 kg siloxane, dropwise adding a platinum catalyst while stirring, and stirring for 22 min to obtain an organic silicon resin polymer; mixing the organic silicon resin polymer and 70 kg filler, stirring for 60 min, vacuum defoaming, and sealing.
(3) Mixing 8 kg toughening agent, 15 kg curing agent and 5 kg accelerator, stirring for 30 min, vacuum defoaming, and sealing.
(4) And (3) mixing the products obtained in the step (2) and the step (3) when filling and sealing, and stirring for 10 min to obtain the pouring sealant.
The siloxane is one of tetramethyl tetravinyl cyclotetrasiloxane, alpha, omega-dihydroxy polydimethylsiloxane, 1, 3-tetramethyl disiloxane and dodecyl cyclohexasiloxane.
The filler is one or more of silica micropowder, aluminum oxide, magnesium oxide, mica powder and graphene oxide.
The toughening agent is one of polyurethane, nitrile rubber-26, hydroxyl-terminated polybutadiene, carboxyl-terminated polybutadiene and polyether.
The curing agent is one of polyamide, dodecenyl succinic anhydride, tung oil anhydride, fatty amine, phenolic amine and triethanolamine.
The promoter is one of 2-methylimidazole, 2-ethyl-4-methylimidazole, triethylamine, benzylamine and triethanolamine.
Example 3
(1) Adding the solubilizer into the 55 kg bisphenol A epoxy resin, stirring for 12 min, adding 30 kg styrene and divinylbenzene, adding 0.5 kg benzoyl peroxide serving as an initiator, and stirring for 15 min to obtain the modified epoxy resin.
(2) Mixing 80 kg modified epoxy resin, 45 kg hydrogen-containing silicone oil and 30 kg siloxane, dropwise adding a platinum catalyst while stirring, and stirring for 12 min to obtain an organic silicon resin polymer; mixing the organic silicon resin polymer and 66 kg filler, stirring for 50 min, vacuum defoaming, and sealing.
(3) Mixing 3 kg toughening agent, 5 kg curing agent and 2 kg accelerator, stirring for 10 min, vacuum defoaming, and sealing.
(4) And (3) mixing the products obtained in the step (2) and the step (3) when filling and sealing, and stirring for 8 min to obtain the pouring sealant.
The siloxane is one of tetramethyl tetravinyl cyclotetrasiloxane, alpha, omega-dihydroxy polydimethylsiloxane, 1, 3-tetramethyl disiloxane and dodecyl cyclohexasiloxane.
The filler is one or more of silica micropowder, aluminum oxide, magnesium oxide, mica powder and graphene oxide.
The toughening agent is one of polyurethane, nitrile rubber-26, hydroxyl-terminated polybutadiene, carboxyl-terminated polybutadiene and polyether.
The curing agent is one of polyamide, dodecenyl succinic anhydride, tung oil anhydride, fatty amine, phenolic amine and triethanolamine.
The promoter is one of 2-methylimidazole, 2-ethyl-4-methylimidazole, triethylamine, benzylamine and triethanolamine.
Example 4
(1) Adding the solubilizer into the 60 kg bisphenol A epoxy resin, stirring for 15 min, adding 35 kg styrene and divinylbenzene, adding 0.6 kg benzoyl peroxide serving as an initiator, and stirring for 18 min to obtain the modified epoxy resin.
(2) Mixing 100 kg modified epoxy resin, 60 kg hydrogen-containing silicone oil and 40 kg siloxane, dropwise adding a platinum catalyst while stirring, and stirring for 30 min to obtain an organic silicon resin polymer; mixing the organic silicon resin polymer and 80 kg filler, stirring for 60 min, vacuum defoaming, and sealing.
(3) Mixing 6 kg toughening agent, 12 kg curing agent and 4 kg accelerator, stirring for 20 min, vacuum defoaming, and sealing.
(4) And (3) mixing the products obtained in the step (2) and the step (3) when filling and sealing, and stirring for 8 min to obtain the pouring sealant.
The siloxane is one of tetramethyl tetravinyl cyclotetrasiloxane, alpha, omega-dihydroxy polydimethylsiloxane, 1, 3-tetramethyl disiloxane and dodecyl cyclohexasiloxane.
The filler is one or more of silica micropowder, aluminum oxide, magnesium oxide, mica powder and graphene oxide.
The toughening agent is one of polyurethane, nitrile rubber-26, hydroxyl-terminated polybutadiene, carboxyl-terminated polybutadiene and polyether.
The curing agent is one of polyamide, dodecenyl succinic anhydride, tung oil anhydride, fatty amine, phenolic amine and triethanolamine.
The promoter is one of 2-methylimidazole, 2-ethyl-4-methylimidazole, triethylamine, benzylamine and triethanolamine.
Example 5
(1) Adding the solubilizer into 65 kg bisphenol A epoxy resin, stirring for 10 min, adding 35 kg styrene and divinylbenzene, adding 0.8 kg benzoyl peroxide serving as an initiator, and stirring for 30 min to obtain the modified epoxy resin.
(2) Mixing 70 kg modified epoxy resin, 55 kg hydrogen-containing silicone oil and 20 kg siloxane, dropwise adding a platinum catalyst while stirring, and stirring for 20 min to obtain an organosilicon resin polymer; mixing the organic silicon resin polymer and 80 kg filler, stirring for 60 min, vacuum defoaming, and sealing.
(3) Mixing 5 kg toughening agent, 10 kg curing agent and 3 kg accelerator, stirring for 30 min, vacuum defoaming, and sealing.
(4) And (3) mixing the products obtained in the step (2) and the step (3) when filling and sealing, and stirring for 5 min to obtain the pouring sealant.
The siloxane is one of tetramethyl tetravinyl cyclotetrasiloxane, alpha, omega-dihydroxy polydimethylsiloxane, 1, 3-tetramethyl disiloxane and dodecyl cyclohexasiloxane.
The filler is one or more of silica micropowder, aluminum oxide, magnesium oxide, mica powder and graphene oxide.
The toughening agent is one of polyurethane, nitrile rubber-26, hydroxyl-terminated polybutadiene, carboxyl-terminated polybutadiene and polyether.
The curing agent is one of polyamide, dodecenyl succinic anhydride, tung oil anhydride, fatty amine, phenolic amine and triethanolamine.
The promoter is one of 2-methylimidazole, 2-ethyl-4-methylimidazole, triethylamine, benzylamine and triethanolamine.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. An organosilicon pouring sealant for a display screen, which is characterized in that: the composite material comprises the following components in parts by weight: 60-100 parts of modified epoxy resin, 40-60 parts of hydrogen-containing silicone oil, 20-40 parts of siloxane, 60-80 parts of filler, 3-8 parts of toughening agent, 5-15 parts of curing agent and 2-5 parts of accelerator.
2. The silicone pouring sealant for a display screen according to claim 1, wherein: the preparation method of the modified epoxy resin comprises the following steps: adding a solubilizer into 50-70 parts of bisphenol A epoxy resin, stirring for 10-20 min, adding 25-40 parts of styrene and divinylbenzene, adding 0.3-0.8 part of initiator benzoyl peroxide, and stirring for 10-30 min to obtain modified epoxy resin.
3. The silicone pouring sealant for a display screen according to claim 1, wherein: the siloxane is one of tetramethyl tetravinyl cyclotetrasiloxane, alpha, omega-dihydroxy polydimethylsiloxane, 1, 3-tetramethyl disiloxane and dodecyl cyclohexasiloxane.
4. The silicone pouring sealant for a display screen according to claim 1, wherein: the filler is one or more of silica micropowder, aluminum oxide, magnesium oxide, mica powder and graphene oxide.
5. The silicone pouring sealant for a display screen according to claim 1, wherein: the toughening agent is one of polyurethane, nitrile rubber-26, hydroxyl-terminated polybutadiene, carboxyl-terminated polybutadiene and polyether.
6. The silicone pouring sealant for a display screen according to claim 1, wherein: the curing agent is one of polyamide, dodecenyl succinic anhydride, tung oil anhydride, fatty amine, phenolic amine and triethanolamine.
7. The silicone pouring sealant for a display screen according to claim 1, wherein: the promoter is one of 2-methylimidazole, 2-ethyl-4-methylimidazole, triethylamine, benzylamine and triethanolamine.
8. The silicone pouring sealant for a display screen according to claim 1, wherein: the preparation method comprises the following steps:
(1) Mixing the modified epoxy resin, the hydrogen-containing silicone oil and the siloxane, dropwise adding a platinum catalyst while stirring, and stirring for 10-30 min to obtain an organic silicon resin polymer; mixing the organic silicon resin polymer and the filler, stirring for 30-60 min, vacuum defoaming, and sealing;
(2) Mixing the toughening agent, the curing agent and the accelerator, stirring for 10-30 min, vacuum defoaming and sealing;
(3) And (3) mixing the products obtained in the step (1) and the step (2) when filling and sealing, and stirring for 5-10 min to obtain the pouring sealant.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4904761A (en) * | 1986-05-20 | 1990-02-27 | Mitsui Toatsu Chemicals, Inc. | Resin composition for sealing semiconductors |
| JPH05267094A (en) * | 1992-03-23 | 1993-10-15 | Shinei Kk | Impregnating resin composition, chip film capacitor using the same composition and manufacture thereof |
| CN103342798A (en) * | 2013-07-16 | 2013-10-09 | 华东理工大学 | Synthesis method for low-viscosity high-temperature-resistant modified epoxy resin |
| CN104231995A (en) * | 2014-08-29 | 2014-12-24 | 江苏省交通科学研究院股份有限公司 | Low-temperature rapidly cured acrylic ester modified epoxy resin joint sealant used in road and bridge |
| CN115627151A (en) * | 2022-09-30 | 2023-01-20 | 太湖金张科技股份有限公司 | Organosilicon OCA of dual curing system |
-
2023
- 2023-09-11 CN CN202311159945.3A patent/CN117089302A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4904761A (en) * | 1986-05-20 | 1990-02-27 | Mitsui Toatsu Chemicals, Inc. | Resin composition for sealing semiconductors |
| JPH05267094A (en) * | 1992-03-23 | 1993-10-15 | Shinei Kk | Impregnating resin composition, chip film capacitor using the same composition and manufacture thereof |
| CN103342798A (en) * | 2013-07-16 | 2013-10-09 | 华东理工大学 | Synthesis method for low-viscosity high-temperature-resistant modified epoxy resin |
| CN104231995A (en) * | 2014-08-29 | 2014-12-24 | 江苏省交通科学研究院股份有限公司 | Low-temperature rapidly cured acrylic ester modified epoxy resin joint sealant used in road and bridge |
| CN115627151A (en) * | 2022-09-30 | 2023-01-20 | 太湖金张科技股份有限公司 | Organosilicon OCA of dual curing system |
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