CN117089163A - Light epoxy resin composite board, preparation process and preparation device - Google Patents
Light epoxy resin composite board, preparation process and preparation device Download PDFInfo
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- CN117089163A CN117089163A CN202311104876.6A CN202311104876A CN117089163A CN 117089163 A CN117089163 A CN 117089163A CN 202311104876 A CN202311104876 A CN 202311104876A CN 117089163 A CN117089163 A CN 117089163A
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- epoxy resin
- glass fiber
- resin composite
- fiber reinforced
- parts
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 183
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 183
- 239000002131 composite material Substances 0.000 title claims abstract description 98
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 239000003365 glass fiber Substances 0.000 claims abstract description 74
- 239000000463 material Substances 0.000 claims abstract description 56
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000011324 bead Substances 0.000 claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 16
- 239000003063 flame retardant Substances 0.000 claims abstract description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 9
- 238000002347 injection Methods 0.000 claims description 49
- 239000007924 injection Substances 0.000 claims description 49
- 239000003292 glue Substances 0.000 claims description 28
- 229920006335 epoxy glue Polymers 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000011152 fibreglass Substances 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 7
- 239000004744 fabric Substances 0.000 abstract description 6
- 238000004321 preservation Methods 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 description 11
- 230000002787 reinforcement Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 239000012779 reinforcing material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 2
- 238000009755 vacuum infusion Methods 0.000 description 2
- HHDUMDVQUCBCEY-UHFFFAOYSA-N 4-[10,15,20-tris(4-carboxyphenyl)-21,23-dihydroporphyrin-5-yl]benzoic acid Chemical compound OC(=O)c1ccc(cc1)-c1c2ccc(n2)c(-c2ccc(cc2)C(O)=O)c2ccc([nH]2)c(-c2ccc(cc2)C(O)=O)c2ccc(n2)c(-c2ccc(cc2)C(O)=O)c2ccc1[nH]2 HHDUMDVQUCBCEY-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- -1 halogenated phosphate ester Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- GTRSAMFYSUBAGN-UHFFFAOYSA-N tris(2-chloropropyl) phosphate Chemical compound CC(Cl)COP(=O)(OCC(C)Cl)OCC(C)Cl GTRSAMFYSUBAGN-UHFFFAOYSA-N 0.000 description 1
- XHTMGDWCCPGGET-UHFFFAOYSA-N tris(3,3-dichloropropyl) phosphate Chemical compound ClC(Cl)CCOP(=O)(OCCC(Cl)Cl)OCCC(Cl)Cl XHTMGDWCCPGGET-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
- B29C70/52—Pultrusion, i.e. forming and compressing by continuously pulling through a die
- B29C70/521—Pultrusion, i.e. forming and compressing by continuously pulling through a die and impregnating the reinforcement before the die
- B29C70/522—Pultrusion, i.e. forming and compressing by continuously pulling through a die and impregnating the reinforcement before the die the transport direction being vertical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
- B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
- B29B15/10—Coating or impregnating independently of the moulding or shaping step
- B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
- B29B15/122—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex
- B29B15/125—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex by dipping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
- B29C70/52—Pultrusion, i.e. forming and compressing by continuously pulling through a die
- B29C70/525—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
- B29C70/545—Perforating, cutting or machining during or after moulding
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/28—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The application provides a light epoxy resin composite material plate, a preparation process and a preparation device, wherein the light epoxy resin composite material plate comprises the following components in parts by weight: 100 parts of epoxy resin, 20-100 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 80-120 parts of epoxy resin curing agent and 100-200 parts of glass fiber reinforced material; wherein the density of the hollow glass beads 10 is 0.1-0.5 g/cm 3 The glass fiber reinforced material has an areal density of 120-1200 g/m 2 The glass fiber mesh cloth or felt of the application can form a light epoxy resin composite material plate with larger thickness at one time, and the product has good heat insulation effect, flame retardance and higher mechanical strength, can be applied to the fields with high requirements on heat preservation and insulation, flame retardance and strength, and expands the application range thereof.
Description
Technical Field
The application relates to the field of thermosetting reinforced materials, in particular to a light epoxy resin composite material plate, a preparation process and a preparation device.
Background
The epoxy resin composite material plate has the advantages of excellent mechanical property, corrosion resistance, electrical insulation and the like, becomes the variety with the largest dosage in the field of composite material plates, is widely used in the fields of marine engineering, aerospace, wind power, transportation and the like, and commonly used molding processes of the epoxy resin composite material plate comprise pultrusion molding, compression molding and vacuum infusion molding, and the common thickness of products molded by the pultrusion molding and compression molding processes is smaller, generally 2-10 mm and less than 20mm; the vacuum infusion molding process has the advantages that the thickness of a molded product can reach about 100mm, but the molded product has higher requirements on glass fiber reinforced materials, the density of the molded product is about 2.0g/cm < 3 >, the mechanical property is excellent, but the heat conductivity coefficient is generally higher, and the molded product is difficult to be used in the field with higher requirements on heat insulation performance.
For some special fields, such as storage tank skids of LNG ships and LPG ships and ultra-low temperature liquid cargo transport ships, high requirements are put forward on the heat preservation and heat insulation performance of the skid materials, so that the materials with good mechanical properties and low heat conduction coefficient are required to be used as skids, the supply of high-quality wood is difficult to guarantee along with the increasing severity of environmental protection, and the development of the domestic LNG ship technology is limited by the shortage of the skid materials.
Thus, current applications of epoxy resin composite boards still face the following problems: firstly, the epoxy resin composite material plate prepared by the traditional process has smaller thickness, the product with large thickness cannot be continuously molded, bonding is generally required, and the production efficiency is low; secondly, the epoxy resin composite material plate prepared by the traditional process has higher heat conductivity coefficient and poorer heat insulation effect, and limits the application field of the epoxy resin composite material plate.
Disclosure of Invention
In view of the above, the present application aims to provide a light epoxy resin composite board, a preparation process and a preparation device, which solve one of the problems that a large-thickness epoxy resin composite board cannot be continuously molded, and the production efficiency is low; the second problem to be solved is that the heat insulation effect of the epoxy resin composite material plate is poor, and the epoxy resin composite material plate is used for the field with higher heat insulation requirement and needs larger thickness.
In order to achieve the above purpose, the technical scheme of the application is realized as follows:
the light epoxy resin composite material plate comprises the following components in parts by weight: 100 parts of epoxy resin, 20-100 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 80-120 parts of epoxy resin curing agent and 100-200 parts of glass fiber reinforced material; wherein the density of the hollow glass beads is 0.1-0.5 g/cm 3 The glass fiber reinforced material has an areal density of 120-1200 g/m 2 Is a fiberglass scrim or felt.
The application can form the light epoxy resin composite material plate with larger thickness at one time, the product has good heat insulation effect and flame retardance, and higher mechanical strength, can be applied to the fields with high requirements on heat preservation and insulation, flame retardance and strength, and expands the application range.
Further, the density of the composite material plate is 800kg/m 3 ～1800kg/m 3 The fiber content is 30-70%, the width is 200-1200 mm, and the thickness is 20-200 mm.
A process for preparing a light epoxy resin composite board, which is used for preparing the light epoxy resin composite board, comprising the following steps:
step S1: calculating the number of layers of glass fiber reinforced materials according to the density and the glass fiber content of the composite material plate;
step S2: layering the glass fiber reinforced material according to the calculation result;
step S3: impregnating the layered glass fiber reinforced material with epoxy resin;
step S4: heating and curing the glass fiber reinforced material impregnated with the epoxy resin to form a light epoxy resin composite material plate;
step S5: and cutting and segmenting the formed light epoxy resin composite material plate according to the size requirement.
The preparation process enables the composite material plate to have higher specific strength.
Further, in step S3, the flow and pressure of the epoxy resin are controlled so that the epoxy resin is uniformly impregnated on the surface of the glass fiber reinforced material.
Further, in step S3, the glass fiber reinforced material impregnated with the epoxy resin is subjected to high-frequency vibration.
The process can uniformly impregnate the epoxy resin and the glass fiber reinforced material.
The preparation device of the light epoxy resin composite board adopts the preparation process of the light epoxy resin composite board, and comprises a felt frame, a glue injection box, an epoxy glue injection machine, a guide roller, a high-frequency vibration auxiliary impregnating machine, a crawler and a sawing machine which are sequentially arranged, wherein the felt frame is used for placing glass fiber reinforced materials, the glue injection box is used for coating epoxy resin on the surface of the glass fiber reinforced materials, the epoxy glue injection machine is used for conveying the epoxy resin into the glue injection box, the guide roller is used for controlling the conveying direction of the glass fiber reinforced materials, the high-frequency vibration auxiliary impregnating machine is used for enabling the glass fiber reinforced materials to vibrate at high frequency, so that the epoxy resin and the glass fiber reinforced materials are uniformly impregnated, the crawler is used for dragging the light epoxy resin composite board to move, the crawler is provided with a die, the die is used for heating the glass fiber reinforced materials coated with the epoxy resin, so that the epoxy resin is cured, and the sawing machine is used for cutting the light epoxy resin composite board.
The preparation device of the light epoxy resin composite material plate realizes continuous curing and forming of the light epoxy resin composite material plate and improves the production efficiency.
Further, the temperature of the die is 50-100 ℃.
Further, the epoxy glue injection machine comprises an epoxy resin tank, an epoxy resin curing agent tank, a mixing head and a glue injection port, wherein the epoxy resin tank and the epoxy resin curing agent tank are communicated through a pipeline and the mixing head respectively, the mixing head, the glue injection port and the glue injection box are communicated through pipelines in sequence, the epoxy resin tank is used for storing epoxy resin A, the epoxy resin curing agent tank is used for storing epoxy resin curing agent B, the mixing head is used for mixing epoxy resin A and epoxy resin curing agent B, and the glue injection port is used for injecting mixed epoxy resin into the glue injection box.
The setting can improve the injecting efficiency and the epoxy stability of the injecting glue machine.
Further, the crawler comprises a lower crawler and an upper crawler, a template is arranged between the lower crawler and the upper crawler to form a product forming die, and the light epoxy resin composite material plate is solidified and formed in the die and is automatically separated from the die along with rotation of the crawler.
This arrangement facilitates the continuous formation of the lightweight epoxy composite board.
Further, the felt frame is provided with a felt dividing plate for dividing the glass fiber reinforced material into layers.
This arrangement facilitates delamination of the glass fiber reinforcement.
Further, the epoxy glue injection machine further comprises a flow divider, wherein the flow divider is used for equally dividing the epoxy resin output by the glue injection port, so that each part of epoxy resin is communicated with the glue injection box through a runner.
This arrangement facilitates uniform impregnation of the epoxy resin with the glass fiber reinforcement.
Compared with the prior art, the light epoxy resin composite material plate, the preparation process and the preparation device have the following advantages:
1) The prepared light epoxy resin composite board has good heat insulation effect, flame retardance and higher mechanical strength, can be applied to the fields with high requirements on heat preservation and insulation, flame retardance and strength, and expands the application range of the light epoxy resin composite board;
2) The continuous molding of the large-thickness light epoxy resin composite material plate is realized, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic structural view of a device for manufacturing a light epoxy resin composite board according to an embodiment of the present application;
fig. 2 is a schematic structural view of a light epoxy resin composite board according to an embodiment of the present application.
Reference numerals illustrate:
1. a felt rack; 2. a glue injection box; 3. an epoxy glue injection machine; 31. an epoxy resin tank; 32. an epoxy resin curing agent tank; 33. a mixing head; 34. a glue injection port; 4. a guide roller; 5. a high-frequency vibration auxiliary impregnating machine; 6. a crawler; 61. a lower crawler; 62. a crawler belt feeding machine; 7. a sawing machine; 8. an epoxy resin matrix; 9. a glass fiber reinforced material layer; 10. hollow glass beads.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
Example 1
As shown in fig. 1-2, a light epoxy resin composite board comprises the following components in parts by weight: 100 parts of epoxy resin, 20-100 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 80-120 parts of epoxy resin curing agent and 100-200 parts of glass fiber reinforced material; wherein the density of the hollow glass beads 10 is 0.1-0.5 g/cm 3 The glass fiber reinforced material has an areal density of 120-1200 g/m 2 Is a fiberglass scrim or felt.
Specifically, the light epoxy resin composite material plate provided by the application adopts the hollow glass beads 10 as a reinforcing material, and the epoxy resin is used as a matrix, so that the light epoxy resin composite material plate has good heat insulation effect, flame retardance and high mechanical strength, can be applied to the fields with high requirements on heat preservation and insulation, flame retardance and strength, and expands the application range.
As a preferred example of the present application, the composite plate has a density of 800kg/m 3 ～1800kg/m 3 The fiber content is 30-70%, the width is 200-1200 mm, and the thickness is 20-200 mm.
Preferably, the length of the composite sheet may be cut as desired.
The application also provides a preparation process of the light epoxy resin composite board, which is used for preparing the light epoxy resin composite board and comprises the following steps:
step S1: calculating the number of layers of glass fiber reinforced materials according to the density and the glass fiber content of the composite material plate;
step S2: layering the glass fiber reinforced material according to the calculation result;
step S3: impregnating the layered glass fiber reinforced material with epoxy resin;
step S4: heating and curing the glass fiber reinforced material impregnated with the epoxy resin to form a light epoxy resin composite material plate;
step S5: and cutting and segmenting the formed light epoxy resin composite material plate according to the size requirement.
In particular, the preparation process enables the composite material plate to have higher specific strength.
Preferably, in step S2, 2 to 5 layers of glass fiber reinforcement are used as one layer.
As a preferred example of the present application, in step S3, the flow rate and pressure of the epoxy resin are controlled so that the epoxy resin is uniformly impregnated on the surface of the glass fiber reinforcement.
As a preferred example of the present application, the epoxy-impregnated glass fiber reinforcement is subjected to high-frequency vibration in step S3.
In particular, the process can uniformly distribute the epoxy resin among the glass fiber reinforced materials.
The application also provides a preparation device of the light epoxy resin composite material plate, which adopts the preparation process of the light epoxy resin composite material plate, and comprises a felt frame 1, a glue injection box 2, an epoxy glue injection machine 3, a guide roller 4, a high-frequency vibration auxiliary impregnating machine 5, a crawler machine 6 and a sawing machine 7 which are sequentially arranged, wherein the felt frame 1 is used for placing glass fiber reinforced materials, the glue injection box 2 is used for coating epoxy resin on the surface of the glass fiber reinforced materials, the epoxy glue injection machine 3 is used for conveying the epoxy resin into the glue injection box 2, the guide roller 4 is used for controlling the conveying direction of the glass fiber reinforced materials, the high-frequency vibration auxiliary impregnating machine 5 is used for enabling the glass fiber reinforced materials to vibrate at high frequency so as to uniformly impregnate the epoxy resin and the glass fiber reinforced materials, the crawler machine 6 is used for dragging the light epoxy resin composite material plate, the crawler machine 6 is provided with a die, the die is used for heating the glass fiber reinforced materials coated with the epoxy resin so as to cure the epoxy resin, and the light epoxy resin composite material plate is formed, and the crawler machine 7 is used for sawing the light epoxy resin composite material plate.
Specifically, the preparation device of the light epoxy resin composite material plate realizes continuous curing and forming of the light epoxy resin composite material plate and improves the production efficiency.
As a preferred example of the present application, the epoxy resin injection machine 3 includes an epoxy resin tank 31, an epoxy resin curing agent tank 32, a mixing head 33 and an injection port 34, the epoxy resin tank 31 and the epoxy resin curing agent tank 32 are respectively communicated with the mixing head 33 through pipes, the mixing head 33, the injection port 34 and the injection box 2 are sequentially communicated through pipes, the epoxy resin tank 31 is used for storing an epoxy resin a, the epoxy resin curing agent tank 32 is used for storing an epoxy resin curing agent B, the mixing head 33 is used for mixing the epoxy resin a and the epoxy resin curing agent B, and the injection port 34 is used for injecting the mixed epoxy resin into the injection box 2.
Specifically, this kind of setting can improve the injecting glue efficiency of injecting glue machine.
As a preferred example of the present application, the crawler 6 includes a lower crawler 61 and an upper crawler 62, a form between the lower crawler 61 and the upper crawler 62 forms a product-forming mold, and the lightweight epoxy composite board is cured and formed in the mold and is automatically separated from the mold as the crawler 6 rotates.
In particular, this arrangement facilitates the continuous formation of a lightweight epoxy composite board.
As a preferred example of the present application, the mat frame 1 is provided with a mat dividing plate for dividing the glass fiber reinforced material.
In particular, this arrangement facilitates delamination of the glass fiber reinforcement.
As a preferred example of the present application, the epoxy resin injection machine 3 further includes a flow divider for equally dividing the epoxy resin outputted from the resin injection port 34 so that each epoxy resin is communicated with the resin injection box 2 through a flow channel.
In particular, this arrangement facilitates uniform impregnation of the epoxy resin with the glass fiber reinforcement.
As a preferred example of the present application, as shown in fig. 2, the lightweight epoxy resin composite board according to the present application includes an epoxy resin matrix 8 and a glass fiber reinforced material layer 9 laminated to each other, wherein the epoxy resin matrix 8 includes hollow glass beads 10.
Example 2
The composite board comprises: 100 parts of epoxy resin with the density of 0.2g/cm 3 20 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 80 parts of epoxy resin curing agent and glass fiber reinforced material: the areal density is 600g/m 2 The relative parts of the glass fiber mesh cloth 60 layers are 200 parts.
The preparation process parameters of the light epoxy resin composite material plate are as follows: the size of the die is set to be 300 multiplied by 60mm, the molding speed is 0.4m/min, the glass fiber content is 45%, and the epoxy glue injection machine 3 can automatically calculate the resin flow of the epoxy resin A and the epoxy resin curing agent B. Setting the temperature of the die to be 50-100 ℃, setting the curing time to be 40-80 min, and demolding and sawing after curing to obtain the product with the density of 1600kg/m 3 Is a lightweight epoxy resin composite board.
Preferably, the glass fiber reinforced material is set as chopped glass fiber, continuous glass fiber fabric, glass fiber mesh cloth or biaxial cloth.
Preferably, the epoxy resin is a low viscosity epoxy resin or an acrylic modified epoxy resin, and the viscosity is 400 to 2000mPas (25 ℃).
Preferably, the flame retardant comprises an organic phosphorus flame retardant, and the halogenated phosphate ester additive flame retardant can be tri (2-chloroethyl) phosphate (TCEP), tri (2-chloropropyl) phosphate TCPP, tri (dichloropropyl) phosphate TDCP, or the like; and a mixture of oxide flame retardants (alumina, antimony trioxide, etc.), in a mixing ratio of 1:0.5 to 2.
Preferably, the coupling agent is an epoxy silane coupling agent commonly used in the market, including but not limited to gamma-glycidoxypropyl trimethoxysilane (KH 560), beta- (3, 4-epoxycyclohexyl) ethyl trimethoxysilane (KH 566), gamma-glycidoxypropyl triethoxysilane (KH-561), etc.
Example 3
The composite board comprises: 100 parts of epoxy resin with the density of 0.1g/cm 3 60 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 100 parts of epoxy resin curing agent and glass fiber reinforcing material: the areal density is 600g/m 2 The relative parts of the glass fiber mesh cloth 40 layers of the (a) are 120 parts.
The preparation process parameters of the light epoxy resin composite material plate are as follows: the size of the die is set to be 300 multiplied by 60mm, the molding speed is 0.4m/min, the glass fiber content is 45%, and the epoxy glue injection machine 3 can automatically calculate the resin flow of the epoxy resin A and the epoxy resin curing agent B. Setting the temperature of the die to 60 ℃, setting the curing time to 40-80 min, and demolding and sawing after curing to obtain the product with the density of 1330kg/m 3 Is a lightweight epoxy resin composite board.
Example 4
The composite board comprises: 100 parts of epoxy resin with the density of 0.10kg/m 3 60 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 100 parts of epoxy resin curing agent and glass fiber reinforcing material: the areal density is 600g/m 2 40 layers of fiberglass mesh of (2), relative proportionsThe number is 120 parts.
The preparation process parameters of the light epoxy resin composite material plate are as follows: the size of the die is set to be 300 multiplied by 60mm, the molding speed is 0.45m/min, the glass fiber content is 45%, and the epoxy glue injection machine 3 can automatically calculate the resin flow of the epoxy resin A and the epoxy resin curing agent B. Setting the temperature of the die to be 50-100 ℃, setting the curing time to be 40-80 min, and demolding and sawing after curing to obtain the material with the density of 1180kg/m 3 Is a lightweight epoxy resin composite board.
Example 5
The composite board comprises: 100 parts of epoxy resin with the density of 0.1g/cm 3 100 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 120 parts of epoxy resin curing agent and glass fiber reinforced material: the areal density is 900g/m 2 The relative parts of the glass fiber mesh 50 layers are 100 parts.
The preparation process parameters of the light epoxy resin composite material plate are as follows: the size of the die is set to be 300 multiplied by 120mm, the molding speed is 0.4m/min, the glass fiber content is 30%, and the epoxy glue injection machine 3 can automatically calculate the resin flow of the epoxy resin A and the epoxy resin curing agent B. Setting the temperature of the die to be 50-100 ℃, setting the curing time to be 40-80 min, and demolding and sawing after curing to obtain the product with the density of 1010kg/m 3 Is a lightweight epoxy resin composite board.
The main properties of the composite plates in the above examples 2 to 5 were tested according to the corresponding international standard or national standard, and the test data are shown in table 1 below.
Table 1 shows the test data for the composite plates in examples 2 to 5 above
| Performance parameters | Unit (B) | Example 2 | Example 3 | Example 4 | Example 5 | Test standard |
| Density of | Kg/m 3 | 1600 | 1330 | 1180 | 1010 | GB/T1463 |
| Coefficient of thermal conductivity | W/(m·K) | 0.268 | 0.245 | 0.206 | 0.164 | ISO22007-4 |
| Compressive Strength | MPa | 256 | 218 | 182 | 146 | GB/T1448 |
| Flexural Strength | MPa | 308 | 247 | 206 | 139 | GB/T1449 |
| Flexural modulus of elasticity | GPa | 16.8 | 12.4 | 10.2 | 8.26 | GB/T1449 |
| Interlaminar shear Strength | MPa | 26.4 | 22.1 | 19.6 | 16.5 | GB/T1450.1 |
| Oxygen index | ％ | 38.8 | 36.2 | 36.3 | 33.5 | GB/T8924 |
In summary, the light epoxy resin composite material plate, the preparation process and the preparation device have the advantages that 1, the light epoxy resin composite material plate adopts the hollow glass beads 10 as a reinforcing material, the epoxy resin is taken as a matrix, the light epoxy resin composite material plate has good heat insulation effect and flame retardance, and high mechanical strength, can be applied to the fields with high requirements on heat insulation, flame retardance and strength, and expands the application range of the light epoxy resin composite material plate; 2. the continuous molding of the light epoxy resin composite material plate is realized, and the production efficiency is improved.
Although the present application is disclosed above, the present application is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the application, and the scope of the application should be assessed accordingly to that of the appended claims.
Claims (10)
1. The light epoxy resin composite material plate is characterized by comprising the following components in parts by weight: 100 parts of epoxy resin, 20-100 parts of hollow glass beads, 20 parts of flame retardant, 2 parts of silane coupling agent, 80-120 parts of epoxy resin curing agent and 100-200 parts of glass fiber reinforced material; wherein the density of the hollow glass beads (10) is 0.1-0.5 g/cm 3 The glass fiber reinforced material has an areal density of 120-1200 g/m 2 Is a fiberglass scrim or felt.
2. The lightweight epoxy resin composite board of claim 1, wherein the composite board has a density of 800kg/m 3 ～1800kg/m 3 The fiber content is 30-70%, the width is 200-1200 mm, and the thickness is 20-200 mm.
3. A process for preparing a light epoxy resin composite board according to any one of claims 1 to 2, comprising:
step S1: calculating the number of layers of glass fiber reinforced materials according to the density and the glass fiber content of the composite material plate;
step S2: layering the glass fiber reinforced material according to the calculation result;
step S3: impregnating the layered glass fiber reinforced material with epoxy resin;
step S4: heating and curing the glass fiber reinforced material impregnated with the epoxy resin to form a light epoxy resin composite material plate;
step S5: and cutting and segmenting the formed light epoxy resin composite material plate according to the size requirement.
4. A process for the preparation of a lightweight epoxy resin composite board as claimed in claim 3, wherein in step S3, the epoxy impregnated glass fiber reinforced material is subjected to high frequency vibration.
5. A preparation device of a light epoxy resin composite board according to any one of claims 3-4, characterized by comprising a felt frame (1), a glue injection box (2), an epoxy glue injection machine (3), a guide roller (4), a high-frequency vibration auxiliary impregnating machine (5), a crawler machine (6) and a sawing machine (7) which are sequentially arranged, wherein the felt frame (1) is used for placing glass fiber reinforced materials, the glue injection box (2) is used for coating epoxy resin on the surface of the glass fiber reinforced materials, the epoxy glue injection machine (3) is used for conveying epoxy resin into the glue injection box (2), the guide roller (4) is used for controlling the conveying direction of the glass fiber reinforced materials, the high-frequency vibration auxiliary impregnating machine (5) is used for enabling the glass fiber reinforced materials to generate high-frequency vibration, the crawler machine (6) is used for dragging the light epoxy resin composite board to move, the crawler machine (6) is provided with a die, the die is used for heating the glass fiber reinforced materials coated with the epoxy resin, the epoxy resin is cured to form the light epoxy resin composite board, and the sawing machine (7) is used for cutting the light epoxy resin composite board.
6. The apparatus for manufacturing a lightweight epoxy resin composite board as in claim 5, wherein the temperature of the mold is 50-100 ℃.
7. The device for preparing the light epoxy resin composite board according to claim 5, wherein the epoxy glue injection machine (3) comprises an epoxy resin tank (31), an epoxy resin curing agent tank (32), a mixing head (33) and a glue injection port (34), the epoxy resin tank (31) and the epoxy resin curing agent tank (32) are respectively communicated with the mixing head (33) through pipelines, the mixing head (33), the glue injection port (34) and the glue injection box (2) are sequentially communicated through pipelines, the epoxy resin tank (31) is used for storing epoxy resin A, the epoxy resin curing agent tank (32) is used for storing epoxy resin curing agent B, the mixing head (33) is used for mixing the epoxy resin A and the epoxy resin curing agent B, and the glue injection port (34) is used for injecting the mixed epoxy resin into the glue injection box (2).
8. The device for preparing the lightweight epoxy resin composite board as claimed in claim 5, wherein the crawler (6) comprises a lower crawler (61) and an upper crawler (62), a template is arranged between the lower crawler (61) and the upper crawler (62) to form a product forming die, and the lightweight epoxy resin composite board is solidified and formed in the die and is automatically separated from the die along with the rotation of the crawler (6).
9. The device for manufacturing a lightweight epoxy resin composite board as claimed in claim 5, wherein the felt frame (1) is provided with a felt dividing plate for dividing the glass fiber reinforced material.
10. The device for manufacturing the light epoxy resin composite board according to claim 5, wherein the epoxy glue injection machine (3) further comprises a flow divider, and the flow divider is used for equally dividing the epoxy resin output by the glue injection port (34) so that each epoxy resin is communicated with the glue injection box (2) through a runner.
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