CN117062484A - Display panel and preparation method thereof - Google Patents
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- CN117062484A CN117062484A CN202311128083.8A CN202311128083A CN117062484A CN 117062484 A CN117062484 A CN 117062484A CN 202311128083 A CN202311128083 A CN 202311128083A CN 117062484 A CN117062484 A CN 117062484A
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application relates to a display panel and a preparation method thereof, wherein the display panel comprises a substrate and a pixel limiting layer, a luminous functional layer and a packaging layer which are arranged on the substrate, the packaging layer covers the pixel limiting layer and the luminous functional layer, the packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are arranged in a stacked manner, the second inorganic layer is arranged on one side of the first inorganic layer far away from the substrate, the packaging layer also comprises a photocatalysis layer, the photocatalysis layer is arranged between the first inorganic layer and the second inorganic layer, the photocatalysis layer comprises photocatalysis particles, the orthographic projection of the photocatalysis particles on the substrate and the orthographic projection of the pixel opening on the substrate are not overlapped, and the photocatalysis particles and the invaded water vapor are subjected to oxidation-reduction reaction under the excitation of an external light source or a luminous device so as to decompose and consume the water vapor. The application can reduce the damage of water vapor invasion to the light-emitting device in a high-humidity environment and prolong the service life.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
The organic light emitting diode (Organic LightEmitting Diode, abbreviated as OLED) display panel has the characteristics of self-luminescence, low power consumption, quick response, light weight, flexibility, low harmful blue light and the like, and gradually becomes the main stream direction of industries such as mobile phones, displays, televisions and the like. The self-luminous device of the OLED display panel is mainly realized by a sandwich-like structure, that is, an organic light-emitting layer is sandwiched between two electrodes, and the organic light-emitting layer transfers electrons and holes between the two electrodes to the light-emitting layer to be compositely released energy and transferred to substance molecules in the organic light-emitting layer, so that the substance molecules generate energy level transition radiation to generate light.
Because the organic light-emitting layer is very sensitive to substances such as water vapor, oxygen and the like, the light-emitting device needs to be effectively packaged, and the device is prevented from being contacted with the water oxygen, so that the ageing rate of the device is reduced, and the service life of the device is prolonged. At present, common packaging technology focuses on improving the tightness of a packaging layer to isolate water vapor, but the water vapor and oxygen which enter an organic light-emitting layer cannot be treated, and especially the water vapor invasion in a high-humidity environment greatly damages a light-emitting device, so that the reliability of a display panel is affected.
Disclosure of Invention
The application aims to provide a display panel and a preparation method thereof, which can reduce the damage of water vapor invasion to a light-emitting device in a high-humidity environment and prolong the service life.
In a first aspect, an embodiment of the present application provides a display panel, including a substrate, and a pixel defining layer, a light emitting functional layer and a packaging layer disposed on the substrate, where the light emitting functional layer includes a plurality of light emitting devices distributed in an array, the pixel defining layer includes a plurality of pixel openings, at least a portion of the light emitting devices are disposed in the pixel openings, the packaging layer covers the pixel defining layer and the light emitting functional layer, the packaging layer includes a first inorganic layer, an organic layer and a second inorganic layer that are disposed in a stacked manner, the second inorganic layer is disposed on a side of the first inorganic layer away from the substrate, the packaging layer further includes a photocatalytic layer, the photocatalytic layer is disposed between the first inorganic layer and the second inorganic layer, the photocatalytic layer includes photocatalytic particles, and orthographic projections of the photocatalytic particles on the substrate and orthographic projections of the pixel openings on the substrate do not overlap each other, and the photocatalytic particles undergo a redox reaction with an intruded vapor under excitation of an external light source or the light emitting devices to decompose and consume the vapor.
In one possible embodiment, the material of the photocatalytic particles includes a semiconductor material and a metal catalyst deposited on the semiconductor material.
In one possible embodiment, the surface of the photocatalytic particles is dispersed with an adsorbent for adsorbing the decomposition products, the adsorbent comprising an oxygen adsorbent and/or a hydrogen adsorbent.
In one possible embodiment, the photocatalytic layer is located between the organic layer and the second inorganic layer, and the photocatalytic layer further includes a first transparent substrate for carrying photocatalytic particles and support pillars located between the organic layer and the first transparent substrate, and the orthographic projections of the support pillars on the substrate and the orthographic projections of the pixel openings on the substrate do not overlap each other.
In one possible embodiment, the photocatalytic layer is located between the first inorganic layer and the organic layer, and the photocatalytic layer further includes a first transparent substrate for carrying photocatalytic particles, and a second transparent substrate located on a side of the photocatalytic particles away from the first transparent substrate, and a support pillar is further disposed between the second transparent substrate and the first transparent substrate, where an orthographic projection of the support pillar on the substrate and an orthographic projection of the pixel opening on the substrate do not overlap each other.
In one possible embodiment, the heights of the support posts are greater than or equal to the heights of the photocatalytic particles.
In one possible embodiment, the display panel has a bezel area, and the encapsulation layer further includes a vent hole in the bezel area for venting decomposition products.
In one possible embodiment, the top of the vent is flush with or higher than the side of the second inorganic layer facing away from the substrate, and the bottom of the vent is higher than the side of the first transparent substrate facing away from the substrate.
In one possible embodiment, the encapsulation layer includes a waterproof membrane forming the vent and a separation membrane, the waterproof membrane being located on a side of the separation membrane remote from the substrate, the separation membrane including a plurality of oxygen molecular sieves and/or hydrogen molecular sieves.
In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, including: providing a substrate; forming a patterned pixel defining layer on a substrate, the pixel defining layer including a plurality of pixel openings; forming a patterned light emitting functional layer on the pixel defining layer, the light emitting functional layer comprising a plurality of light emitting devices distributed in an array, at least a portion of the light emitting devices being located within the pixel opening; and forming a packaging layer on the pixel limiting layer and the luminous functional layer, wherein the packaging layer comprises a first inorganic layer, an organic layer, a second inorganic layer and a photocatalysis layer, wherein the first inorganic layer, the organic layer and the second inorganic layer are arranged in a stacked mode, the photocatalysis layer is positioned on one side, far away from the substrate, of the first inorganic layer, the photocatalysis layer comprises photocatalysis particles, orthographic projections of the photocatalysis particles on the substrate and orthographic projections of the pixel openings on the substrate are not overlapped with each other, and the photocatalysis particles and the invaded water vapor are subjected to oxidation reduction reaction under the excitation of an external light source or a luminous device to decompose and consume the water vapor.
According to the display panel and the preparation method thereof, the photocatalysis layer is arranged between the first inorganic layer and the second inorganic layer of the packaging layer of the display panel, the photocatalysis layer comprises the photocatalysis particles, and the orthographic projection of the photocatalysis particles on the substrate and the orthographic projection of the pixel openings on the substrate are not overlapped, so that the photocatalysis particles and the invaded water vapor are subjected to oxidation-reduction reaction under the excitation of an external light source or a light-emitting device to decompose and consume the water vapor, the damage of the water vapor invasion to the light-emitting device under the high-humidity environment can be weakened, the signal tolerance of the product is effectively improved, and the service life is prolonged.
Drawings
Features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings. In the drawings, like parts are designated with like reference numerals. The drawings are not drawn to scale, but are merely for illustrating relative positional relationships, and the layer thicknesses of certain portions are exaggerated in order to facilitate understanding, and the layer thicknesses in the drawings do not represent the actual layer thickness relationships.
Fig. 1 is a schematic cross-sectional view of a display panel according to a first embodiment of the present application;
FIG. 2 shows a schematic top view of the display panel shown in FIG. 1;
FIG. 3 is a schematic view showing the structure of a photocatalytic layer in the display panel shown in FIG. 1;
FIG. 4 is a schematic diagram showing the operation of the photocatalytic layer in the display panel shown in FIG. 1 in a redox reaction;
fig. 5 is a schematic cross-sectional view of a display panel according to a second embodiment of the present application;
fig. 6 is a flowchart illustrating a method for manufacturing a display panel according to a third embodiment of the present application.
Reference numerals illustrate:
1. a substrate base; AA. A display area; NA, border region;
2. a pixel defining layer; 21. a pixel opening;
3. a light-emitting functional layer; 31. a light emitting device;
4. an encapsulation layer; 41. a first inorganic layer; 42. a second inorganic layer; 43. an organic layer;
44. a photocatalytic layer; 440. photocatalytic particles; 440a, semiconductor material; 440b, a metal catalyst; 440c, an adsorbent; 441. a first transparent substrate; 442. a second transparent substrate; 444. a support column;
45. an exhaust hole; 451. a waterproof membrane; 452. and a separation membrane.
Detailed Description
Features and exemplary embodiments of various aspects of the application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order not to unnecessarily obscure the present application; also, the size of the region structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The common packaging technology of the OLED display panel at present focuses on the tightness of the packaging layer to improve the capability of isolating water vapor, but cannot cope with the water vapor and oxygen which enter. For general display device type products, the reliability and reliability test is mainly to simulate the limit use conditions of the products, wherein high temperature (60 ℃) and high humidity (90%) are key indexes for checking the reliability and reliability of the devices. Therefore, the embodiments of the application provide a display panel and a manufacturing method thereof, which can reduce damage of water vapor invasion to a light emitting device in a high humidity environment and prolong the service life. The display panel provided by the embodiments is described in detail below with reference to the accompanying drawings.
First embodiment
As shown in fig. 1 to 4, the display panel provided in the first embodiment of the present application may be a flexible OLED display panel or a rigid OLED display panel. For convenience of description, the present application will be described with reference to a flexible OLED display panel.
The display panel comprises a substrate 1, a pixel limiting layer 2, a light-emitting functional layer 3 and a packaging layer 4, wherein the pixel limiting layer 2, the light-emitting functional layer 3 and the packaging layer 4 are arranged on the substrate 1, the light-emitting functional layer 3 comprises a plurality of light-emitting devices 31 distributed in an array, the pixel limiting layer 2 comprises a plurality of pixel openings 21, at least part of the light-emitting devices 31 are arranged in the pixel openings 21, the packaging layer 4 covers the pixel limiting layer 2 and the light-emitting functional layer 3, the packaging layer 4 comprises a first inorganic layer 41, an organic layer 43 and a second inorganic layer 42 which are arranged in a stacked mode, and the second inorganic layer 42 is arranged on one side, far away from the substrate 1, of the first inorganic layer 41.
The encapsulation layer 4 further includes a photo-catalytic layer 44, where the photo-catalytic layer 44 is located between the first inorganic layer 41 and the second inorganic layer 42, and the photo-catalytic layer 44 includes photo-catalytic particles 440, and the front projection of the photo-catalytic particles 440 on the substrate 1 and the front projection of the pixel openings 21 on the substrate 1 do not overlap each other, and the photo-catalytic particles 440 undergo oxidation-reduction reaction with the water vapor that is intruded under the excitation of the external light source or the light emitting device 31 to decompose and consume the water vapor.
In the embodiment of the application, a driving array layer is further arranged between the substrate 1 and the pixel defining layer 2, and the driving array layer is provided with a pixel circuit, a storage capacitor and the like. The side of the driving array layer far away from the substrate 1 is also formed with a plurality of first electrodes distributed in an array. The light emitting device 31 is an organic light emitting diode including a light emitting structure on a first electrode and a second electrode layer on the light emitting structure, either one of the first electrode and the second electrode layer being an anode of a light emitting element, the other being a cathode of the light emitting element. The anode may be formed of a transparent conductive material having a high work function, the cathode may be formed of a material having high conductivity and a low work function, and the cathode may be formed of a metal material. For convenience of explanation, the embodiment of the present application will be described by taking the first electrode as an anode and the second electrode layer as a cathode.
Optionally, the light emitting structure includes a first carrier layer, a light emitting layer, and a second carrier layer, where the first carrier layer includes a hole injection layer (Hole Injection Layer, short for HIL) and a hole transport layer (Hole Transport Layer, short for HTL) on a surface of the first electrode 11, and the second carrier layer includes an electron transport layer (Electron Transport Layer, short for ETL) and an electron injection layer (Electron Injection Layer, short for EIL) on a surface of the light emitting layer. Under the action of an electric field, holes generated by the first electrode and electrons generated by the second electrode layer of the light-emitting element move, and are respectively injected into the hole transport layer HTL and the electron transport layer ETL and migrate into the light-emitting structure. When the two meet in the light emitting structure, an energy exciton is generated, thereby exciting the light emitting molecule to finally generate visible light.
It is understood that the first carrier layer of the light emitting structure may include only the hole injection layer HIL or the hole transport layer HTL, and accordingly, the second carrier layer may include only the electron transport layer ETL or the electron injection layer EIL, which will not be described again.
Taking a flexible OLED display panel as an example, some unavoidable protruding small particles are already present on the surface of the film layer before cathode plating, and because the cathode metal layer is very thin, these protruding small particles are enough to pierce the cathode to cause pinholes in the cathode metal layer, eventually causing water and oxygen to enter the device along the pinholes, causing damage to the light emitting device 31.
The encapsulation layer 4 includes a first inorganic layer 41, an organic layer 43, and a second inorganic layer 42 that are stacked, the second inorganic layer 42 being located on a side of the first inorganic layer 41 remote from the substrate 1. The material of the first inorganic layer 41 is typically SiO2, siNx or a combination of both, and has a thickness of about 1 μm to 2 μm for covering pinholes formed in the second electrode layer, but the SiNx film itself forms new pinholes. The material of the organic layer 43 is generally acrylic/resin organic matter, the thickness is 10 μm-30 μm, the interface is flattened, the defect of the SiO2+SiNx layer can be effectively filled, the path of water oxygen entering the light-emitting device 31 is prolonged, and the bending resistance of the light-emitting device 31 can be effectively improved by the organic polymer. The second inorganic layer 42 is typically made of a SiNx thin film, and the barrier property of the light emitting device 31 is improved by increasing the channel length to reduce the effect of pinholes on the light emitting device 31. The patterned organic layer 43 has high elasticity, and is sandwiched between the first inorganic layer 41 and the second inorganic layer 42, so that the cracking of the inorganic thin film can be suppressed, the stress between inorganic substances can be released, and the flexibility of the whole packaging layer 4 can be improved, thereby realizing reliable flexible packaging.
Further, the encapsulation layer 4 further comprises a photo-catalytic layer 44 between the first inorganic layer 41 and the second inorganic layer 42. As shown in fig. 4, photocatalysis (photo-catalysis) is a complex process involving physical and chemical changes, that is, a process in which some semiconductor photocatalytic materials undergo a series of reactions under irradiation of sunlight (ultraviolet light or visible light) to finally catalyze and decompose substances. The reaction process is divided into the following three parts:
the first part is the generation of photogenerated carriers: after the semiconductor is irradiated, if the absorbed light energy is larger than the forbidden band energy, electrons (e-) on the semiconductor valence band are migrated to the conduction band position of the semiconductor, and holes (h+) with strong oxidizing property are left, so that photo-generated electron-hole pairs with strong reactivity are formed in the semiconductor;
the second part is carrier migration: the photocatalytic reaction of the semiconductor is actually carried out on the surface of the semiconductor, i.e. electron-hole pairs generated inside the semiconductor are separated under the action of an electric field or diffusion force built in the material and migrate from the inside of the particles to the surface for reaction;
the third part is that carriers participate in redox reactions: when a defect or a capturing agent exists on the surface of the semiconductor, the recombination of electron-hole pairs can be effectively inhibited, and further the oxidation/reduction reaction of photo-generated electrons/holes and target substances is promoted.
For the photocatalytic decomposition of water by a semiconductor, after photo-generated electrons and holes are diffused to the surface of a semiconductor material, the holes in a valence band oxidize water molecules adsorbed on the surface to generate H + And O 2 While the electrons of the conduction band will dissociate H + The reduction to hydrogen is released and the reaction process can be represented by the following equation:
semiconductor photocatalyst +hv- & gt h + +e -
2H 2 O+4h + →4H + +O 2
2H + +2e - →H 2
Total reaction: semiconductor photocatalyst +hv +H 2 O→H 2 +1/2O 2
Therefore, in the embodiment of the application, the photocatalytic layer 44 made of the photocatalytic material and having the photocatalytic effect is arranged in the packaging layer 4, and the external light source such as sunlight or the self-luminous light-emitting device 31 on the screen can be used as the light source for excitation, so that the invaded water vapor is subjected to oxidation-reduction reaction to decompose and consume the water vapor, and the decomposition products are hydrogen and oxygen, thereby effectively weakening the damage of the invasion of the water vapor to the light-emitting device 31 in a high-humidity environment, improving the reliability and the tolerance of the product and prolonging the service life.
In addition, since the photocatalytic layer 44 may have a certain color and may have a certain light loss, in order to avoid the influence on the normal display of the screen in the pixel opening area, the photocatalytic layer 44 is located at a gap position outside the pixel opening and is uniformly distributed, that is, the orthographic projection of the photocatalytic particles 440 on the substrate 1 and the orthographic projection of the pixel opening 21 on the substrate 1 do not overlap each other, so as to avoid the influence on the display effect.
According to the display panel provided by the embodiment of the application, the photocatalytic layer 44 is arranged between the first inorganic layer 41 and the second inorganic layer 42 of the packaging layer 4, the photocatalytic layer 44 comprises the photocatalytic particles 440, and the orthographic projection of the photocatalytic particles 440 on the substrate 1 and the orthographic projection of the pixel openings 21 on the substrate 1 are not overlapped, so that the photocatalytic particles 440 and the invaded water vapor are subjected to oxidation-reduction reaction under the excitation of an external light source or a light-emitting device to decompose and consume the water vapor, the damage of the water vapor invasion to the light-emitting device 31 under the high-humidity environment can be reduced, the reliability of the product is effectively improved, and the service life is prolonged.
In some embodiments, the material of the photocatalytic particles 440 includes a semiconductor material 440a and a metal catalyst 440b deposited on the semiconductor material 440 a. The photocatalytic particles 440 may be prepared into a semiconductor material having a specific shape by electrostatic spinning or electrochemical preparation, and may be in the form of particles or columns having a supporting function, and the shape thereof is determined according to the use.
Typical semiconductor materials are TiO 2 、ZnO、Ta 2 O 5 、CdS、SrTiO 3 Such as semi-conducting metal oxides, sulfides, and complex metal oxides. Some novel photocatalytic materials, such as perovskite type composite oxides, bismuth series photocatalysts, molecular sieve photocatalysts, tungstate photocatalysts, oxyhalide photocatalysts, graphite structure polymer photocatalysts and the like. Due to the conventional semiconductors CdS and MoS 2 The like are mostly toxic and organic semiconductor g-C 3 N 4 The method mainly has the defects of high self-generated electron and hole recombination rate and the like, so that the activity of the photocatalytic reaction is difficult to effectively improve, and a plurality of modification methods are generated, wherein the noble metal promoter is loaded on the surface of the semiconductor, and the method has the advantages of simple preparation method, small loading capacity, obvious modification effect and the like.
Optionally, the common metal catalyst is noble metal catalyst such as platinum Pt, silver Ag, gold Au, ruthenium Ru, palladium Pd and the like, and is used for improving the surface activity of the semiconductor material and increasing the catalytic efficiency. The metal catalyst is reduced to metal particles in a metal compound solution.
In some embodiments, the surface of the photocatalytic particles 440 is dispersed with an adsorbent 440c for adsorbing decomposition products, the adsorbent 440c comprising an oxygen adsorbent and/or a hydrogen adsorbent. The adsorbent 440c is a molecular sieve or a metal framework substance, and can perform physical molecular adsorption on oxygen or hydrogen for oxygen fixation or hydrogen fixation. The oxygen fixation mode is a physical mode, or chemical mode can be adopted to combine oxygen, such as the reaction of metal and O2 is adopted to oxidize, but the mode is generally difficult to occur at normal temperature and has low reaction efficiency, and is easy to reduce in H2 atmosphere, so the physical mode is most feasible under the condition of low oxygen content.
Because the reaction products of the photocatalytic decomposition of the water vapor are H2 and a small amount of O2, the oxygen adsorbent can adsorb oxygen generated in the decomposition process, and the hydrogen adsorbent can adsorb hydrogen generated in the decomposition process, so that the damage of the water vapor invasion to the light emitting device 31 in a high-humidity environment can be further weakened, the reliability and the durability of the product are effectively improved.
Further, the photocatalytic layer 44 is located between the organic layer 43 and the second inorganic layer 42, and the photocatalytic layer 44 further includes a first transparent substrate 441 for carrying the photocatalytic particles 440, and support pillars 444 located between the organic layer 43 and the first transparent substrate 441 of the first transparent substrate 441, where orthographic projections of the support pillars 444 on the substrate 1 and orthographic projections of the pixel openings 21 on the substrate 1 do not overlap each other.
As shown in fig. 1 and 2, since the organic layer 43 of the encapsulation layer 4 easily absorbs moisture, the photocatalytic layer 44 is disposed on the organic layer 43, so that the absorption of moisture by the organic layer 43 can be effectively blocked. In addition, the photocatalytic particles 440 are disposed on the first transparent substrate 441 at a gap position outside the pixel opening 31 of the pixel defining layer 3 by chemical deposition or physical transfer, and the position without the photocatalytic particles 440 does not have photocatalytic properties, and the first transparent substrate 441 may be made of transparent organic polyimide PI or an inorganic material, so that the display brightness and the display effect are not affected.
Since the photocatalytic layer 44 and the upper second inorganic layer 42 require a certain space, the photocatalytic particles 440 can serve as a support to support the second inorganic layer 42. In other examples, the supporting strength of the photocatalytic particles 440 is insufficient, other materials may be used to form the supporting pillars 444, and the orthographic projection of the supporting pillars 444 on the substrate 1 and the orthographic projection of the pixel openings 21 on the substrate 1 do not overlap each other, that is, the supporting pillars 444 and the photocatalytic particles 440 are located at the gap positions outside the pixel openings 21, and the height of the supporting pillars 444 is greater than or equal to the height of the photocatalytic particles 440, so as to prevent the photocatalytic particles 440 from being overwhelmed by the second inorganic layer 42 to destroy the photocatalytic performance, thereby affecting the water vapor decomposition effect.
In some embodiments, the display panel has a bezel area NA, and the encapsulation layer 4 further includes a vent hole 45 located at the bezel area NA, the vent hole 45 being used to vent decomposition products. The display panel is provided with a display area AA and a frame area NA positioned on at least one side of the display area AA, the exhaust holes 45 are positioned in the frame area NA, oxygen and hydrogen decomposed by oxidation-reduction reaction can be discharged out of the display panel, and compared with oxygen and hydrogen decomposed by adsorption of the adsorbent, the consumption rate of decomposition products can be improved, and the water vapor decomposition effect is further improved.
Further, the top of the vent hole 45 is flush with the side of the second inorganic layer 42 facing away from the substrate 1 or higher than the side of the second inorganic layer 42 facing away from the substrate 1, and the bottom of the vent hole 45 is higher than the side of the first transparent substrate 441 facing away from the substrate 1. By this arrangement, the discharge of oxygen and hydrogen decomposed by the oxidation-reduction reaction can be facilitated.
In some embodiments, the encapsulation layer 4 includes a waterproof membrane 451 forming the vent hole 45 and a separation membrane 452, the waterproof membrane 451 being located at a side of the separation membrane 452 remote from the substrate 1, the separation membrane 452 including a plurality of oxygen molecular sieves and/or hydrogen molecular sieves.
Optionally, the waterproof membrane 451 is made of polyurethane PUM. Alternatively, the separation membrane is a hydrogen separation membrane or an oxygen separation membrane, or a combination of a hydrogen separation membrane and an oxygen separation membrane. The waterproof membrane 451 is close to the external environment side, has excellent property of isolating liquid from passing through gas, can avoid water vapor in the external environment from entering from the exhaust hole 45, and meanwhile, the separation membrane at the lower layer adopts the molecular sieve principle, and can only pass through gas with molecular size smaller than or equal to that of oxygen or hydrogen. According to the composition of air, no gas substances except hydrogen can enter basically, and the pressure in the packaging layer 4 can promote the discharge of hydrogen or oxygen due to the gas products generated by the internal oxidation-reduction reaction, so that the characteristics that the oxygen or hydrogen in the packaging layer 4 is discharged and external water vapor and other gases cannot enter are realized.
In one example, the outer surface of the photocatalytic particles 440 is coated with an oxygen adsorbent for adsorbing oxygen generated by the oxidation-reduction reaction, and hydrogen generated by the oxidation-reduction reaction is discharged through the hydrogen separation membrane 452 provided at the gas discharge hole 45. In this way, the adsorbent 440c can separate the oxygen generated by the oxidation-reduction reaction from the hydrogen by adsorbing the oxygen and discharging the hydrogen through the exhaust hole 45, so as to avoid the hydrogen and the oxygen from being recombined into water vapor again in the discharging path, and further improve the decomposition effect of the water vapor.
It should be noted that, in the embodiment of the present application, the present application is applicable to not only the flexibly packaged OLED display panel, but also the rigid OLED display panel, and only the photocatalytic layer 44 needs to be disposed at the edge of the packaging layer 4 where water vapor is easy to enter.
Second embodiment
As shown in fig. 5, the second embodiment of the present application provides a display panel 1, which is similar to the display panel 1 provided in the first embodiment, except that the position of the photocatalytic layer 44 in the encapsulation layer 4 is different.
Specifically, the photocatalytic layer 44 is located between the first inorganic layer 41 and the organic layer 43, the photocatalytic layer 44 further includes a first transparent substrate 441 for carrying the photocatalytic particles 440, and a second transparent substrate 442 located on a side of the photocatalytic particles 440 facing away from the first transparent substrate 441, and a support pillar 444 is further disposed between the second transparent substrate 442 and the first transparent substrate 441, where an orthographic projection of the support pillar 444 on the substrate 1 and an orthographic projection of the pixel opening 21 on the substrate 1 do not overlap each other.
Since the photocatalytic layer 44 and the upper organic layer 43 and the second inorganic layer 42 require a certain space, the photocatalytic particles 440 can serve as a support to support the second inorganic layer 42. In other examples, the supporting strength of the photocatalytic particles 440 is insufficient, other materials may be used to form the supporting pillars 444, and the orthographic projection of the supporting pillars 444 on the substrate 1 and the orthographic projection of the pixel openings 21 on the substrate 1 do not overlap each other, that is, the supporting pillars 444 and the photocatalytic particles 440 are located at the gap positions outside the pixel openings 21, and the height of the supporting pillars 444 is greater than or equal to the height of the photocatalytic particles 440, so as to prevent the photocatalytic particles 440 from being overwhelmed by the organic layer 43 and the second inorganic layer 42 to destroy the photocatalytic performance, thereby affecting the water vapor decomposition effect.
Further, when the photocatalytic layer 44 is disposed between the first inorganic layer 41 and the organic layer 43, in addition to the structure of the photocatalytic layer 44, a second transparent substrate 442 is disposed above the support pillars 444 to prevent filling the space between the support pillars 444 when the organic layer 43 is prepared, and the reaction product gas is in a sealed environment and cannot flow and be discharged normally.
Compared with the first embodiment in which the photocatalytic layer 44 is located between the organic layer 43 and the second inorganic layer 42, the water vapor entry path is prolonged, the amount of photocatalytic reaction occurring is reduced, the service life of the adsorbent material for the photocatalytic product is prolonged, and the service life of the display panel is further improved.
Third embodiment
As shown in fig. 6, a third embodiment of the present application provides a method for manufacturing a display panel, which is applied to any of the display panels described above.
The preparation method comprises the following steps:
step S1: providing a substrate 1;
step S2: forming a patterned pixel defining layer 2 on the substrate 1, the pixel defining layer 2 including a plurality of pixel openings 21;
step S3: forming a patterned light emitting functional layer 3 on the pixel defining layer 2, the light emitting functional layer 3 including a plurality of light emitting devices 31 distributed in an array, at least part of the light emitting devices 31 being located within the pixel opening 21;
step S4: the encapsulation layer 4 is formed on the pixel defining layer 2 and the light emitting functional layer 3, the encapsulation layer 4 comprises a first inorganic layer 41, an organic layer 43, a second inorganic layer 42 and a photo-catalytic layer 44 positioned between the first inorganic layer 41 and the second inorganic layer 42, the second inorganic layer 42 is positioned on one side of the first inorganic layer 41 away from the substrate 1, the photo-catalytic layer 44 comprises photo-catalytic particles 440, the front projection of the photo-catalytic particles 440 on the substrate 1 and the front projection of the pixel opening 21 on the substrate 1 are not overlapped, and the photo-catalytic particles 440 are subjected to oxidation reduction reaction with the invaded water vapor under the excitation of an external light source or the light emitting device 31 to decompose and consume the water vapor.
Further, the photocatalytic layer 44 further includes a first transparent substrate 441 for carrying the photocatalytic particles 440, where the photocatalytic particles 440 are disposed on the first transparent substrate 441 by chemical deposition or physical transfer, and the photocatalytic particles 440 are made into semiconductor materials with specific shapes by using electrostatic spinning or electrochemical preparation methods, and may be granular or columnar with a supporting function, and the shape is determined according to the application.
According to the preparation method of the display panel provided by the embodiment of the application, the photocatalytic layer 44 is arranged between the first inorganic layer 41 and the second inorganic layer 42 of the packaging layer 4, the photocatalytic layer 44 comprises the photocatalytic particles 440, and the orthographic projection of the photocatalytic particles 440 on the substrate 1 and the orthographic projection of the pixel openings 21 on the substrate 1 are not overlapped, so that the photocatalytic particles 440 and the invaded water vapor are subjected to oxidation-reduction reaction under the excitation of an external light source or a light-emitting device to decompose and consume the water vapor, the damage of the water vapor invasion to the light-emitting device 31 under the high-humidity environment can be reduced, the signal tolerance of the product is effectively improved, and the service life is prolonged.
It should be readily understood that the terms "on … …", "above … …" and "above … …" in this disclosure should be interpreted in the broadest sense so that "on … …" means not only "directly on something" but also includes "on something" with intermediate features or layers therebetween, and "above … …" or "above … …" includes not only the meaning "on something" or "above" but also the meaning "above something" or "above" without intermediate features or layers therebetween (i.e., directly on something).
The term "substrate" as used herein refers to a material upon which subsequent layers of material are added. The substrate itself may be patterned. The material added atop the substrate may be patterned or may remain unpatterned. In addition, the substrate may comprise a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, and the like. Alternatively, the substrate may be made of a non-conductive material (e.g., glass, plastic, or sapphire wafer, etc.).
The term "layer" as used herein may refer to a portion of material that includes regions having a certain thickness. The layer may extend over the entire underlying or overlying structure, or may have a range that is less than the range of the underlying or overlying structure. Further, the layer may be a region of a continuous structure, either homogenous or non-homogenous, having a thickness less than the thickness of the continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layers may extend laterally, vertically and/or along a tapered surface. The drive array layer may be a layer, may include one or more layers therein, and/or may have one or more layers located thereon, and/or thereunder. The layer may comprise a plurality of layers. For example, the interconnect layer may include one or more conductors and contact layers (within which contacts, interconnect lines, and/or vias are formed) and one or more dielectric layers.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (10)
1. The display panel comprises a substrate, a pixel limiting layer, a luminous functional layer and a packaging layer, wherein the pixel limiting layer, the luminous functional layer and the packaging layer are arranged on the substrate, the luminous functional layer comprises a plurality of luminous devices distributed in an array, the pixel limiting layer comprises a plurality of pixel openings, at least part of the luminous devices are arranged in the pixel openings, the packaging layer covers the pixel limiting layer and the luminous functional layer, the packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are arranged in a stacked manner, the second inorganic layer is arranged on one side of the first inorganic layer away from the substrate,
the packaging layer also comprises a photocatalytic layer, the photocatalytic layer is positioned between the first inorganic layer and the second inorganic layer, the photocatalytic layer comprises photocatalytic particles, the orthographic projection of the photocatalytic particles on the substrate and the orthographic projection of the pixel openings on the substrate are not overlapped, and the photocatalytic particles and the invaded water vapor are subjected to oxidation-reduction reaction under the excitation of an external light source or the light-emitting device to decompose and consume the water vapor.
2. The display panel of claim 1, wherein the material of the photocatalytic particles comprises a semiconductor material and a metal catalyst deposited on the semiconductor material.
3. The display panel according to claim 2, wherein the photocatalytic particles have an adsorbent dispersed on a surface thereof for adsorbing decomposition products, the adsorbent comprising an oxygen adsorbent and/or a hydrogen adsorbent.
4. The display panel of claim 1, wherein the photocatalytic layer is located between the organic layer and the second inorganic layer, the photocatalytic layer further comprising a first transparent substrate and support posts located between the organic layer and the first transparent substrate, the first transparent substrate being configured to carry the photocatalytic particles, and an orthographic projection of the support posts onto the substrate and an orthographic projection of the pixel openings onto the substrate do not overlap each other.
5. The display panel according to claim 1, wherein the photocatalytic layer is located between the first inorganic layer and the organic layer, the photocatalytic layer further comprises a first transparent substrate for carrying the photocatalytic particles, and a second transparent substrate located at a side of the photocatalytic particles away from the first transparent substrate, and support columns are further disposed between the second transparent substrate and the first transparent substrate, and the orthographic projection of the support columns on the substrate and the orthographic projection of the pixel openings on the substrate do not overlap each other.
6. The display panel of claim 4 or 5, wherein the support posts have a height greater than or equal to the height of the photocatalytic particles.
7. The display panel of claim 4 or 5, wherein the display panel has a bezel area, and the encapsulation layer further comprises a vent hole at the bezel area for venting the decomposition product.
8. The display panel of claim 7, wherein a top of the vent is flush with or higher than a side of the second inorganic layer facing away from the substrate, and a bottom of the vent is higher than a side of the first transparent substrate facing away from the substrate.
9. The display panel according to claim 7, wherein the encapsulation layer includes a waterproof film and a separation film forming the vent hole, the waterproof film being located at a side of the separation film remote from the substrate base plate, the separation film including a plurality of oxygen molecular sieves and/or hydrogen molecular sieves.
10. A method of manufacturing the display panel according to any one of claims 1 to 9, comprising:
providing a substrate;
forming a patterned pixel defining layer on the substrate base plate, the pixel defining layer including a plurality of pixel openings;
forming a patterned light emitting functional layer on the pixel defining layer, the light emitting functional layer comprising a plurality of light emitting devices distributed in an array, at least a portion of the light emitting devices being located within the pixel opening;
and forming a packaging layer on the pixel limiting layer and the luminous functional layer, wherein the packaging layer comprises a first inorganic layer, an organic layer, a second inorganic layer and a photocatalysis layer, the first inorganic layer, the second inorganic layer and the photocatalysis layer are arranged in a stacked mode, the photocatalysis layer is positioned on one side, far away from the substrate, of the first inorganic layer, the photocatalysis layer comprises photocatalysis particles, the orthographic projection of the photocatalysis particles on the substrate and the orthographic projection of the pixel opening on the substrate are not overlapped, and the photocatalysis particles and the invaded water vapor are subjected to oxidation-reduction reaction under the excitation of an external light source or the luminous device to decompose and consume the water vapor.
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