CN117059619A - Chip, integrated circuit and LED driving system - Google Patents

Chip, integrated circuit and LED driving system Download PDF

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Publication number
CN117059619A
CN117059619A CN202311072429.7A CN202311072429A CN117059619A CN 117059619 A CN117059619 A CN 117059619A CN 202311072429 A CN202311072429 A CN 202311072429A CN 117059619 A CN117059619 A CN 117059619A
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CN
China
Prior art keywords
chip
constant current
led lamp
base island
port
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Pending
Application number
CN202311072429.7A
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Chinese (zh)
Inventor
李照华
唐柳
方吉桐
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Shenzhen Sunmoon Microelectronics Co Ltd
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Shenzhen Sunmoon Microelectronics Co Ltd
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Priority to CN202311072429.7A priority Critical patent/CN117059619A/en
Publication of CN117059619A publication Critical patent/CN117059619A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/345—Current stabilisation; Maintaining constant current

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)

Abstract

The application provides a chip, an integrated circuit and an LED driving system, wherein the chip comprises a first base island and a second base island, a first wafer is arranged on the first base island, and the grounding end of the first wafer is connected with a first reference ground; a second wafer is arranged on the second base island, and the grounding end of the second wafer is connected with a second reference ground; the second base island and the first base island are arranged at intervals, two sides of the second base island adjacent to the first base island are adjacent sides, the side away from the adjacent sides is a deviating side, and the side connected between the adjacent sides and the deviating side is a pin side; at least one first rib claw is arranged on the pin edge of the first base island, and at least one second rib claw is arranged on the pin edge of the second base island. The application solves the problems that the integrated circuits manufactured by different circuit control modules cannot be packaged on the chip frame of a single base island, the stability of the packaging frame of the traditional chip is poor, the wire bonding packaging of a semiconductor wafer is not facilitated, and the quality of the chip packaging is easily affected.

Description

Chip, integrated circuit and LED driving system
Technical Field
The application relates to the technical field of LED driving circuits, in particular to a chip, an integrated circuit and an LED driving system.
Background
At present, a linear constant current driving circuit is generally used for providing stable power supply current for an LED device, a constant current control chip in the linear constant current driving circuit is packaged in a packaging mode with a heat dissipation function, and a metal base island packaged by the chip is exposed at the bottom of the chip and can transfer heat of the chip to a circuit board.
The linear constant current driving circuit comprises a plurality of different circuit control modules, and integrated circuits manufactured by the different circuit control modules cannot be packaged on a chip frame of a single base island. Therefore, the integrated circuits manufactured by different circuit control modules are packaged by adopting the double-base island packaging frame, and the existing double-base island packaging frame only separates one base island into two base islands, and as one base island is fixed and stable through the ribs and claws at two ends, after being separated into two base islands with long and narrow upper and lower sides, the stability of the base island is reduced, and the base island is not beneficial to wire bonding packaging of semiconductor wafers, and the quality of chip packaging is easily affected.
Disclosure of Invention
The embodiment of the application provides a chip, an integrated circuit and an LED driving system, which solve the problems that the integrated circuits manufactured by different circuit control modules cannot be packaged on a chip frame of a single base island, the stability of the packaging frame of the existing chip is poor, the wire bonding packaging of a semiconductor wafer is not facilitated, and the quality of the chip packaging is easily influenced.
The invention is realized in such a way that the chip comprises a first base island and a second base island, wherein a first wafer is arranged on the first base island, and the grounding end of the first wafer is connected with a first reference ground; a second wafer is arranged on the second base island, and the grounding end of the second wafer is connected with a second reference ground; the second base island and the first base island are arranged at intervals, two sides of the second base island adjacent to the first base island are adjacent sides, the side deviating from the adjacent sides is a deviating side, and the side connected between the adjacent sides and the deviating sides is a pin side; at least one first rib claw is arranged on the pin edge of the first base island; and at least one second rib claw is arranged on the pin edge of the second base island.
In one embodiment, a plurality of chip pins are arranged outside the pin edge and are mutually spaced, and the plurality of chip pins comprise a first chip pin and a second chip pin; each first rib claw and each second rib claw are connected with one first chip pin; the second chip pins are electrically connected with the first wafer and the second wafer through metal connecting wires.
In one embodiment, the ground end of the first wafer is electrically connected to the first base island, and the first chip pin connected to any one of the first fingers is used for connecting to the first reference ground;
The grounding end of the second wafer is electrically connected with the second base island, and the first chip pin connected with any one of the second rib claws is used for connecting the second reference ground.
In one embodiment, the first rib claw and the first chip pin which are connected with each other are integrally formed;
the second rib claw and the first chip pin which are mutually connected are integrally formed.
In one embodiment, the ground terminal of the first wafer is electrically connected to one of the second chip pins, and the second chip pin electrically connected to the ground terminal of the first wafer is used for connecting to a first reference ground;
the grounding end of the second wafer is electrically connected with one second chip pin, and the second chip pin which is electrically connected with the grounding end of the second wafer is used for being connected with a second reference ground.
In one embodiment, the first base island and the second base island are made of conductive materials, and a side surface of the first base island away from the first wafer and a side surface of the second base island away from the second wafer are used for contacting a circuit board.
The embodiment of the application also provides an integrated circuit, which comprises a power supply, a charging and discharging unit, the chip, the first LED lamp group and the second LED lamp group, wherein the chip, the first LED lamp group and the second LED lamp group are described in any embodiment, and the power supply is provided with a power supply output end; the charging and discharging unit is electrically connected with the power output end through a first diode, and the chip comprises a power input port, a first grounding port, a first reference voltage port, a second grounding port, a first current input controlled port and a second current input controlled port; the power input port and the second current input controlled port are both connected with the power output end, and the first current input controlled port is connected with the charge-discharge unit; the anode of the first LED lamp group is connected to the first grounding port, the anode of the first LED lamp group is connected to the first reference voltage port through a first resistor, and the cathode of the first LED lamp group is connected to the second reference voltage port; the anode of the second LED lamp set is connected to the second grounding port, the anode of the second LED lamp set is connected with the cathode of the first LED lamp set through a second resistor, and the cathode of the second LED lamp set is grounded.
The embodiment of the application also provides an integrated circuit, which comprises a power supply, a charging and discharging unit, the chip, the first LED lamp group and the second LED lamp group, wherein the chip, the first LED lamp group and the second LED lamp group are described in any embodiment, and the power supply is provided with a power supply output end; the charging and discharging unit is electrically connected with the power supply output end through a first diode; the chip comprises a first reference voltage port, a first grounding port, a second reference voltage port, a second current input controlled port, a first current input controlled port, a second grounding port, an input voltage acquisition port and a power input port; the first reference voltage port is connected with the first grounding port through a first resistor, the second reference voltage port is connected with the second grounding port through a second resistor, the power input port is connected with the charge and discharge unit, and the input voltage acquisition port is connected with the power output end; the anode of the first LED lamp group is connected with the power input port, and the cathode of the first LED lamp group is connected with the first current input controlled port; the anode of the second LED lamp set is connected with the cathode of the first LED lamp set, and the cathode of the second LED lamp set is connected with the second current input controlled port.
The embodiment of the application also provides an LED driving system which is applied to the integrated circuit described in the embodiment, and comprises a power supply unit, a charging and discharging unit, a first constant current control unit, a second constant current control unit, a third constant current control unit and an LED light emitting unit; the charging and discharging unit is electrically connected with the power supply unit; the first constant current control unit is electrically connected with the charge and discharge unit and is connected with a first reference ground; the second constant current control unit is electrically connected with the power supply unit and the first constant current control unit, and is connected with the first reference ground; the third constant current control unit is electrically connected with the charge and discharge unit and is connected with a second reference ground; the LED light emitting unit comprises a first LED lamp group and a second LED lamp group, wherein the anode of the first LED lamp group is connected with the first reference ground, the cathode of the first LED lamp group is electrically connected with the third constant current control unit, the cathode of the first LED lamp group is electrically connected with the anode of the second LED lamp group through a second resistor, and the anode of the second LED lamp group is connected with the second reference ground.
The embodiment of the application also provides an LED driving system which is applied to the integrated circuit described in the embodiment, and comprises a power supply unit, a charging and discharging unit, a sampling signal unit, a first constant current control unit, a second constant current control unit and an LED light-emitting unit; the charging and discharging unit is electrically connected with the power supply unit through a first diode; the sampling signal unit is electrically connected with the power supply unit and is provided with a first signal control end and a second signal control end; the first constant current control unit is electrically connected with the first signal control end and comprises a first constant current source and a second constant current source, and the first constant current source and the second constant current source are both connected with a first reference ground; the second constant current control unit is electrically connected with the second signal control end and the first constant current control unit, the second constant current control unit comprises a third constant current source and a fourth constant current source, and the third constant current source and the fourth constant current source are both connected with a second reference ground; the LED light emitting unit comprises a first LED lamp group and a second LED lamp group which are connected in series, the anode of the first LED lamp group is electrically connected with the charging and discharging unit, the cathode of the first LED lamp group is electrically connected with the first constant current source and the fourth constant current source, and the cathode of the second LED lamp group is electrically connected with the second constant current source and the third constant current source.
The chip, the integrated circuit and the LED driving system provided by the application have the beneficial effects that: compared with the prior art, the chip provided by the application adopts the double base islands which are arranged in parallel at intervals during packaging, so that integrated circuits manufactured by different circuit control modules can be packaged on one chip frame; the two sides of the base island along the direction perpendicular to the arrangement direction of the double base islands are provided with the rib claws connected with the pins of the chips to fix the base islands, so that the stability of the base islands is greatly improved, each base island is provided with a wafer, the wafers are connected with the pins of the chips arranged on the periphery of the edges of the pins, and different wafers are connected with different reference grounds, so that the wire bonding packaging of the wafers is facilitated, and the quality of the chip packaging is improved.
Drawings
Fig. 1 is a schematic diagram of a structure of a chip in the related art;
fig. 2 is a schematic diagram of a chip according to a first embodiment of the present application;
FIG. 3 is a schematic diagram of a chip according to a first embodiment of the present application;
fig. 4 is a schematic diagram of a first embodiment of the present application in which ribs are disposed on a lead side of a base island of a chip;
FIG. 5 is a schematic diagram II of a first embodiment of the present application in which ribs are provided on the lead sides of the island;
Fig. 6 is a schematic diagram III of a rib claw disposed on a lead edge of a base island of a chip according to the first embodiment of the present application;
fig. 7 is a schematic diagram IV of a rib claw disposed on a pin side of a base island of a chip according to the first embodiment of the present application;
fig. 8 is a schematic diagram fifth embodiment of a rib claw disposed on a pin side of a base island of a chip according to the first embodiment of the present application;
FIG. 9 is a circuit diagram of an integrated circuit according to a second embodiment of the present application;
fig. 10 is a circuit diagram of an integrated circuit in the related art;
FIG. 11 is a circuit diagram of an integrated circuit provided in accordance with a third embodiment of the present application;
fig. 12 is a schematic diagram of an LED driving system according to a fourth embodiment of the present application;
fig. 13 is a schematic diagram of an LED driving system according to a fifth embodiment of the present application.
Reference numerals: 1. a first island; 10. a first wafer;
2. a second island; 20. a second wafer; 21. adjacent edges; 22. a deviating edge; 23. a pin edge;
3. a rib claw; 31. a first rib claw; 32. a second rib claw; 33. a third rib claw; 4. chip pins; 41. a metal connecting wire;
100. a power supply; 200. a chip; 300. an LED light emitting unit; 301. a first LED lamp group; 302. a second LED lamp group; 101. a power supply unit; 102. a charge-discharge unit; 103. a sampling signal unit; 201. a first constant current control unit; 202. a second constant current control unit; 203. a third constant current control unit; 2011. a first constant current source; 2012. a second constant current source; 2021. a third constant current source; 2022. and a fourth constant current source.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
It should be further noted that, in the embodiments of the present application, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present application, reference numerals may be given to only one of the parts or the parts in the drawings, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.
The embodiment of the application provides a chip, an integrated circuit and an LED driving system, which solve the problems that the integrated circuits manufactured by different circuit control modules cannot be packaged on a chip frame of a single base island, the stability of the packaging frame of the existing chip is poor, the wire bonding packaging of a semiconductor wafer is not facilitated, and the quality of the chip packaging is easily influenced.
Example 1
Referring to fig. 2-3, a chip provided in a first embodiment of the present application includes a first base island 1 and a second base island 2, a first wafer 10 is disposed on the first base island 1, and a ground terminal of the first wafer 10 is connected to a first reference ground; a second wafer 20 is arranged on the second base island 2, and the grounding end of the second wafer 20 is connected with a second reference ground; the second base island 2 is arranged at intervals with the first base island 1, two sides of the second base island 2 adjacent to the first base island 1 are adjacent sides 21, the side away from the adjacent sides 21 is a deviating side 22, and the side connected between the adjacent sides 21 and the deviating side 22 is a pin side 23; at least one first rib claw 31 is arranged on the pin edge 23 of the first base island 1; at least one second rib claw 32 is arranged on the pin edge 23 of the second base island 2.
In the embodiment of the application, the lead edges 23 of the first base island 1 and the lead edges 23 of the second base island 2 are parallel to the arrangement direction of the first base island 1 and the second base island 2, compared with the prior art shown in fig. 1, the lead edges 23 of the two base islands of the double-base island package frame are perpendicular to the arrangement direction of the two base islands, so that each base island has only one lead edge 23, after the rib claw 3 is arranged on the lead edge 23, the two base islands are applied with tensile force in opposite directions, and the stability of the prior double-base island package frame is poor, the lead edges 23 of the first base island 1 and the second base island 2 are also two, and therefore, the gap between the first base island 1 and the second base island 2 is not enlarged by arranging the rib claw 3 on the lead edge 23, thereby ensuring that the arrangement of the first base island 1 and the second base island 2 is more firm and the stability of the chip package frame is better.
In addition, in the related art, when the grounding ends of different circuit modules are connected with different reference grounds, the integrated circuits manufactured by the different circuit modules cannot be directly packaged in the chip frame of the same base island due to the different reference grounds, so that the different circuit modules need to be packaged in different chips to form the integrated circuits comprising at least two chips, and thus, the whole size of the PCB of the LED driving circuit board manufactured by adopting the integrated circuits is large and the number of discrete devices is large. When the grounding ends of different circuit modules are connected with the same reference ground, different devices on the circuit modules can be manufactured on the wafer technology of the same process, so that an integrated circuit manufactured by adopting the circuit modules can generate negative voltage in a certain process of system application scheme operation, and normal operation is influenced; or packaging into multiple packaged ICs or electronic devices according to the production process attributes of different circuit modules, and then applying the scheme. The integration level of the LED driving scheme combined by multiple chips or devices is not high, and the production efficiency, the production cost and the production consistency are all affected.
In the embodiment of the application, the first wafer 10 and the second wafer 20 are arranged on different islands, the grounding end of the first wafer 10 is connected with the first reference ground, and the grounding end of the second wafer 20 is connected with the second reference ground, so that two circuit modules connected with different reference grounds can be packaged together to form a chip, the packaged size of the chip can be reduced, the connection of a plurality of different circuit modules in an integrated circuit is facilitated, the integrated circuit manufactured by adopting the chip of the application is higher in integrated level, the overall size of a PCB (printed circuit board) of an LED driving circuit manufactured by adopting the integrated circuit is reduced, the integrated level of the LED driving circuit is improved, and the influence on the production efficiency, the production cost and the production consistency is reduced.
In some embodiments, referring to fig. 2-3, a plurality of chip pins 4 are disposed outside the pin edge 23 and spaced apart from each other, and the plurality of chip pins 4 include first chip pins and second chip pins, and each of the first rib claw 31 and each of the second rib claws 32 is connected to one of the first chip pins, and the second chip pins are electrically connected to the first wafer 10 and the second wafer 20 through metal connection wires 41. Therefore, the first base island 1 and the second base island 2 are more firm, the stability of the chip packaging frame is better, terminals of the first wafer 10 and the second wafer 20 can be led to the periphery of a chip, after the chip is packaged, the chip pins 4 are only required to be connected to realize the electric connection with the first wafer 10 and the second wafer 20, the connection difficulty of different circuit modules in an integrated circuit is greatly reduced, and the manufacturing efficiency of the integrated circuit is improved.
Specifically, the number of chip pins 4 is not limited, in the embodiment of the present application, two chip pins 4 are disposed outside each pin edge 23, and 8 chip pins 4 are totally disposed, and referring to fig. 2, the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, the seventh pin and the eighth pin are disposed counterclockwise from the upper right corner, the first rib claw 31 disposed on the pin edge 23 of the first base island 1 is connected with the second pin, the second rib claw 32 disposed on the pin edge 23 of the second base island 2 is connected with the fifth pin, and none of the first pin, the third pin, the fourth pin, the sixth pin, the seventh pin and the eighth pin is directly connected with the base island, where the direct connection refers to an integrally formed connection or other mechanical other communication manner, and the electrical connection between the pins and the chips can be performed by a wire bonding manner during packaging. Of course, the corresponding first, third, fourth, sixth, seventh and eighth pins may be selectively connected to the islands if desired or required by the process. The integrally formed corresponding rib claws are used as pins, and the number of the corresponding rib claws can be increased according to requirements. Referring to fig. 3, the first, second, third, fourth, fifth, sixth, seventh and eighth pins are arranged counterclockwise from the upper right corner, the first rib claw 31 provided at the pin side 23 of the first island 1 is connected to the second pin, the second rib claw 32 provided at the pin side 23 of the second island 2 is connected to the sixth pin, and none of the first, third, fourth, fifth, seventh and eighth pins is directly connected to the island.
In some embodiments, referring to fig. 2-3, the ground terminal of the first wafer 10 is electrically connected to the first island 1, and the first chip pin connected to any one of the at least one first rib claw 31 is used to connect to the first reference ground; the ground terminal of the second wafer 20 is electrically connected to the second island 2, and the first chip pin connected to any one of the second fingers 32 of the at least one second finger 32 is used to connect to a second reference ground.
In the embodiment of the application, the grounding end of the first wafer 10 is connected with the first base island 1, the first chip pin connected with the first rib claw 31 arranged on the pin edge 23 of the first base island 1 is used for connecting a first reference ground, the grounding end of the second wafer 20 is connected with the second base island 2, the first chip pin connected with the second rib claw 32 arranged on the pin edge 23 of the second base island 2 is used for connecting a second reference ground, namely, the grounding end of the first wafer 10 is shifted to the periphery of the first base island 1, the grounding end of the second wafer 20 is shifted to the periphery of the second base island 2, so that the first base island 1 and the second base island 2 can be normally packaged together during chip packaging, the purpose of connection with each wiring end of the first wafer 10 and the second wafer 20 can be achieved through connecting each pin of the chip, the wire bonding packaging of the chip is facilitated, the quality of the chip packaging is improved, two circuit modules connected with different reference places are packaged together to form a chip, the size of the chip packaging can be reduced, connection of a plurality of different circuit modules in an integrated circuit is facilitated, the integrated circuit manufactured by the chip is higher in integrated level, the overall size of a PCB (printed circuit board) of an LED driving circuit manufactured by the integrated circuit is reduced, the integrated level of the LED driving circuit is improved, and the influence on production efficiency, production cost and production consistency is reduced.
In some embodiments, the first rib claw 31 and the first chip pin which are connected with each other are integrally formed; the second rib claw 32 and the first chip pin which are connected with each other are integrally formed. The first rib claw 31 is directly arranged on the pin edge 23 of the first base island 1, so that the chip pin 4 can be arranged, and the second rib claw 32 is arranged on the pin edge 23 of the second base island 2, so that the chip pin 4 can be arranged, the number of the arranged chip pins can be reduced when other chip pins 4 are arranged, and the chip pin arrangement efficiency is improved.
In some embodiments, the ground terminal of the first wafer 10 is electrically connected to a second chip pin, and the second chip pin electrically connected to the ground terminal of the first wafer 10 is used for connecting to the first reference ground; the ground terminal of the second wafer 20 is electrically connected to a second chip pin, and the second chip pin electrically connected to the ground terminal of the second wafer 20 is used for connecting to a second reference ground. I.e. the ground of the first wafer 10 is directly connected to the chip pin 4, which chip pin 4 is intended to be connected to a first reference ground, and likewise the ground of the second wafer 20 is directly connected to the chip pin 4, which chip pin 4 is intended to be connected to a second reference ground. In this way, all the terminals of the first wafer 10 and all the terminals of the second wafer 20 can be connected with different chip pins 4 through the metal leads 41 at one time, so that the connection operation of workers is convenient.
In the embodiment of the application, the first base island 1 and the second base island 2 which are spaced from each other are arranged for arranging two different wafers, so that the purpose that integrated circuits manufactured by different circuit control modules can be packaged on a chip frame is realized, and therefore, the shape and the area of the first base island 1 and the second base island 2 are not strictly limited, that is, the shape and the area of the first base island 1 and the second base island 2 can be the same or different.
In some embodiments, the first and second islands 1 and 2 are symmetrically disposed with respect to each other, and the first and second islands 1 and 2 are identical in shape and area. Thus, the first base island 1 and the second base island 2 can be conveniently manufactured, and the manufacturing efficiency of the chip is greatly improved.
The first base island 1 and the second base island 2 are symmetrically arranged at intervals, and the smaller the chip size is, the smaller the interval distance is, but the isolation between the first base island 1 and the second base island 2 is required to be ensured, and the insulation performance between the first base island 1 and the second base island 2 cannot be influenced by too close.
In some embodiments, referring to fig. 2 and 3, at least one third rib claw 33 is provided on the facing away from the edge 22. Therefore, the rib claws can be arranged on the pin edges 23 and the deviating edges 22 of the first base island 1 and the second base island 2, and the first base island 1 and the second base island 2 are fixed from multiple directions, so that the frame of the chip package is more stable, and the wire bonding package of the chip is facilitated.
It should be noted that, the pin edge 23 of the first base island 1 is provided with the first rib claw 31, the pin edge 23 of the second base island 2 is provided with the second rib claw 32, the deviating edge 22 is provided with the third rib claw 33, the rib claw and the base island can be integrally formed, the rib claw extends to the outer side of the base island to serve as a pin of a chip, the corresponding base island can be firmly ensured by the arrangement of the rib claw, each rib claw forms an included angle with the edge of the corresponding base island, namely, the first rib claw 31 forms an included angle with the pin edge 23, the second rib claw 32 forms an included angle with the pin edge 23, the third rib claw 33 forms an included angle with the deviating edge 22, and the included angle can be 90 degrees.
In some embodiments, the first base island 1 and the second base island 2 are made of conductive materials, and a side surface of the first base island 1 away from the first wafer 10 and a side surface of the second base island 2 away from the second wafer 20 are used for contacting a circuit board.
It should be noted that when the chip is applied to the integrated circuit, the chip needs to be mounted on the PCB, and at this time, the first base island 1 is far away from a side surface of the first wafer 10 and the second base island 2 is far away from a side surface of the second wafer 20, so that the first wafer 10 and the second wafer 20 can be electrically connected with the PCB, and heat generated by the operation of the first wafer 10 and the second wafer 20 can be transferred to the PCB through the first base island 1 and the second base island 2, so that the heat dissipation efficiency of the first wafer 10 and the second wafer 20 is enhanced.
Referring to fig. 4-8, in the embodiment of the present application, two chip pins 4 are disposed on the periphery of each of the pin sides 23 of the first base island 1, one of the pin sides 23 of the first base island 1 is provided with a first rib claw 31, one of the pin sides 23 of the second base island 2 is provided with a second rib claw 32, the pin sides 23 where the first rib claw 31 is located and the pin sides 23 where the second rib claw 32 is located are arranged along a first direction, and the first direction is perpendicular to the arrangement direction of the first base island 1 and the second base island 2. The first rib claw 31 arranged on the lead edge 23 of the first base island 1 can be connected with any chip lead 4 arranged around the first base island 1, the second rib claw 32 arranged on the lead edge 23 of the second base island 2 can be connected with any chip lead 4 arranged around the second base island 2, and thus, the package frame of the chip can have various embodiments, such as chip structure diagrams shown in fig. 4-8.
Example two
Referring to fig. 9, a second embodiment of the present application provides an integrated circuit, which includes a power supply 100, a charging and discharging unit 102, a chip 200 as in the first embodiment, a first LED lamp set 301, and a second LED lamp set 302, where the power supply 100 has a power supply output terminal; the charge-discharge unit 102 is electrically connected with the power supply output end through a first diode D1; the chip 200 includes a power input port VT, a first ground port GND1, a first reference voltage port REXT1, a second reference voltage port REXT2, a second ground port GND2, a first current input controlled port OUT1, and a second current input controlled port OUT2; the power input port VT and the second current input controlled port OUT2 are both connected with the power output end, and the first current input controlled port OUT1 is connected with the charge-discharge unit 102; the anode of the first LED lamp set 301 is connected to the first ground port GND1, the anode of the first LED lamp set 301 is connected to the first reference voltage port REXT1 through the first resistor R1, and the cathode of the first LED lamp set 301 is connected to the second reference voltage port REXT2; the anode of the second LED lamp set 302 is connected to the second ground port GND2, the anode of the second LED lamp set 302 is connected to the cathode of the first LED lamp set 301 through the second resistor R2, and the cathode of the second LED lamp set 302 is grounded.
The first reference voltage port REXT1 is used for adjusting the current of the first LED lamp group 301 and the second LED lamp group 302, the second reference voltage port REXT2 is used for adjusting the current of the second LED lamp group 302, and the power input port VT is used for detecting the fluctuation of the input voltage so as to adjust the reference voltage of the first reference voltage port REXT 1.
It should be noted that fig. 10 is a circuit diagram of an integrated circuit in the related art, two chips 200 are adopted in fig. 10, each chip 200 includes one wafer, and in fig. 9, the chip 200 of the first embodiment is adopted, and the two wafers are packaged in one chip 200, so that comparing fig. 9 and fig. 10, the PCB routing, layout and size of the integrated circuit of the second embodiment of the present application can be intuitively improved.
Example III
Referring to fig. 11, a third embodiment of the present application provides an integrated circuit, including a power supply 100, a charge-discharge unit 102, a chip 200 according to any of the above embodiments, a first LED lamp set 301, and a second LED lamp set 302, where the power supply 100 has a power supply output terminal; the charge-discharge unit 102 is electrically connected with the power supply output end through a first diode D1; the chip 200 includes a first reference voltage port REXT1, a first ground port GND1, a second reference voltage port REXT2, a second current input controlled port OUT2, a first current input controlled port OUT1, a second ground port GND2, an input voltage acquisition port SEN, and a power supply input port VIN; the first reference voltage port REXT1 is connected with a first grounding port GND1 through a first resistor R1, the second reference voltage port REXT2 is connected with a second grounding port GND2 through a second resistor R2, a power input port VIN is connected with the charge-discharge unit 102, and an input voltage acquisition port SEN is connected with a power output end; the anode of the first LED lamp set 301 is connected with the power input port VIN, and the cathode of the first LED lamp set 301 is connected with the first current input controlled port OUT1; the anode of the second LED lamp set 302 is connected to the cathode of the first LED lamp set 301, and the cathode of the second LED lamp set 302 is connected to the second current input controlled port OUT2.
The detailed structure of the chip 200 can refer to the above embodiments, and will not be described herein; it will be appreciated that, since the chip 200 is used in the integrated circuit of the present application, embodiments of the integrated circuit of the present application include all the technical solutions of all the embodiments of the chip 200, and can achieve the technical effects achieved by the technical solutions.
Example IV
Referring to fig. 12, a fourth embodiment of the present application provides an LED driving system, which is applied to the integrated circuit of the second embodiment, and includes a power supply unit 101, a charge-discharge unit 102, a first constant current control unit 201, a second constant current control unit 202, a third constant current control unit 203, and an LED light emitting unit 300; the charge and discharge unit 102 is electrically connected with the power supply unit 101; the first constant current control unit 201 is electrically connected to the charge and discharge unit 102, and the first constant current control unit 201 is connected to the first ground GND1; the second constant current control unit 202 is electrically connected with the power supply unit 101 and the first constant current control unit 201, and the second constant current control unit 202 is connected with the first ground GND1; the third constant current control unit 203 is electrically connected with the charge-discharge unit 102, and the third constant current control unit 203 is connected with the second ground GND2; the LED lighting unit 300 includes a first LED lamp group 301 and a second LED lamp group 302, where an anode of the first LED lamp group 301 is connected to the first ground GND1, a cathode of the first LED lamp group 301 is electrically connected to the third constant current control unit 203, a cathode of the first LED lamp group 301 is electrically connected to an anode of the second LED lamp group 302 through a second resistor R2, and an anode of the second LED lamp group 302 is connected to the second ground GND2.
The first constant current control unit 201 and the second constant current control unit 202 are manufactured together as the first wafer 10, and the third constant current control unit 203 is manufactured as the second wafer 20. The first reference ground GND1 connected to the first wafer 10 and the second reference ground GND2 connected to the second wafer 20 are not at the same reference point in fig. 12, and the chip 200 according to the first embodiment of the present application may be used to implement the package of the first wafer 10 and the second wafer 20. Referring to fig. 2, a first wafer 10 fabricated by a first constant current control unit 201 and a second constant current control unit 202 is placed on a first base island 1 shown in fig. 2, and a second wafer 20 fabricated by a third constant current control unit 203 is placed on a second base island 2 shown in fig. 2. GND1PAD of the first wafer 10 is routed to the first island 1, and the lead edge 23 of the first island 1 is routed to the second lead of the chip 200, which is then GND1 of the first wafer 10. GND2PAD of the second wafer 20 is routed to the second base island 2, and the lead edge 23 of the second base island 2 is routed to the fifth lead of the chip 200, where the fifth lead electrical property is GND2 of the second wafer 20.
The first LED lamp set 301 and the second LED lamp set 302 may be formed by connecting a plurality of LED lamp strings in parallel.
The working principle of the LED driving system provided by the fourth embodiment of the application is as follows: the alternating voltage passes through the power supply unit 101, and the power supply unit 101 is composed of 4 diodes. There is a mechanism of control and controlled between the first constant current control unit 201 and the second constant current control unit 202. After the alternating current is rectified, in a single wire network period, when the real-time voltage output by the power supply unit 101 is greater than the on voltage of the LED light emitting unit 300, the second constant current control unit 202 works, the first constant current control unit 201 is turned off, and meanwhile, the bus voltage charges the charge and discharge unit 102. The first constant current control unit 201 and the second constant current control unit 202 are connected to the same ground GND1.
When the first LED lamp set 301 and the second LED lamp set 302 of the LED lighting unit 300 have current flowing through them, the second resistor R2 has current flowing through them, so that a voltage difference is generated across R2. One end of a second resistor R2 in the LED light-emitting unit 300 is connected with the third constant current control unit 203, the other end of the second resistor R2 is connected with a second ground GND2 of the third constant current control unit 203, and a voltage difference generated by the second resistor R2 is used as a detection signal to be provided for the third constant current control unit 203, so that the third constant current control unit 203 stops working.
After the alternating current is rectified, in a single wire network period, when the real-time voltage output by the power supply unit 101 is smaller than the conduction voltage of the LED light emitting unit 300, the second constant current control unit 202 cannot work, at this time, the voltage on the charge and discharge unit 102 is larger than the conduction voltage of the LED light emitting unit 300, the charge and discharge unit 102 is in a discharge state, the first constant current control unit 201 works, and continuous current flows through the first LED lamp group 301 and the second LED lamp group 302 of the LED light emitting unit 300, so that continuous and stable light emission of LED lamp beads of the first LED lamp group 301 and the second LED lamp group 302 is realized, and the stroboscopic problem is solved. In a normal operation state, in a wire network period, the first constant current control unit 201 and the second constant current control unit 202 work in turn, and the charge and discharge unit 102 is continuously charged and discharged.
The LED driving system of the present application can realize the beneficial effect of inputting wide voltage, as shown in fig. 12, when the network voltage decreases, the network input voltage is smaller than the turn-on voltage of the LED lighting unit 300, the first constant current control unit 201 and the second constant current control unit 202 cannot normally work, at this time, the voltage difference on the second resistor R2 decreases, the detection signal provided to the third constant current control unit 203 informs the third constant current control unit 203 to start working, because the GND2 port of the third constant current control unit 203 is connected to the input end of the second LED lamp set 302, the current passes through the second LED lamp set 302 to light the second LED lamp set 302, so that the network voltage decreases to realize lighting, and wide voltage working is realized.
Example five
Referring to fig. 13, a fifth embodiment of the present application provides an LED driving system, which is applied to the integrated circuit of the third embodiment, and includes a power supply unit 101, a charge and discharge unit 102, a sampling signal unit 103, a first constant current control unit 201, a second constant current control unit 202, and an LED light emitting unit 300; the charge and discharge unit 102 is electrically connected with the power supply unit 101 through a first diode; the sampling signal unit 103 is electrically connected with the power supply unit 101, and the sampling signal unit 103 is provided with a first signal control end EN1 and a second signal control end EN2; the first constant current control unit 201 is electrically connected to the first signal control terminal EN1, the first constant current control unit 201 includes a first constant current source 2011 and a second constant current source 2012, and the first constant current source 2011 and the second constant current source 2012 are both connected to the first ground GND1; the second constant current control unit 202 is electrically connected to the second signal control terminal EN2 and the first constant current control unit 201, the second constant current control unit 202 includes a third constant current source 2021 and a fourth constant current source 2022, and the third constant current source 2021 and the fourth constant current source 2022 are both connected to the second ground GND2; the LED light emitting unit 300 includes a first LED lamp group 301 and a second LED lamp group 302 connected in series, an anode of the first LED lamp group 301 is electrically connected to the charge and discharge unit 102, a cathode of the first LED lamp group 301 is electrically connected to the first constant current source 2011 and the fourth constant current source 2022, and a cathode of the second LED lamp group 302 is electrically connected to the second constant current source 2012 and the third constant current source 2021.
The sampling signal unit 103 and the first constant current control unit 201 are fabricated as the first wafer 10, and the second constant current control unit 202 is fabricated as the second wafer 20. The first reference ground GND1 connected to the first wafer 10 and the second reference ground GND2 connected to the second wafer 20 are not at the same reference point in fig. 13, and the chip 200 according to the first embodiment of the present application may be used to implement packaging of the first wafer 10 and the second wafer 20. Referring to fig. 13, a first wafer 10 fabricated by the sampling signal unit 103 and the first constant current control unit 201 is placed on the first base island 1 shown in fig. 3, and a second wafer 20 fabricated by the second constant current control unit 202 is placed on the second base island 2 shown in fig. 3. GND1PAD of the first wafer 10 is routed to the first island 1, and the lead edge 23 of the first island 1 is routed to the second lead of the chip 200, which is then GND1 of the first wafer 10. GND2PAD of the second wafer 20 is wired to the second base island 2, and the lead edge 23 of the second base island 2 leads to the sixth lead of the package die, where the sixth lead electrical property is GND2 of the second wafer 20.
In some embodiments, referring to fig. 13, the power supply unit 101 includes a rectifier bridge or four diodes, and the power supply unit 101 is configured to connect with alternating current. The LED lighting unit 300 includes a first LED lamp group 301 and a second LED lamp group 302, and the first LED lamp group 301 and the second LED lamp group 302 may be formed by connecting a plurality of LED lamp strings in parallel. The first constant current control unit 201 includes a first constant current source 2011 and a second constant current source 2012, and the second constant current control unit 202 includes a third constant current source 2021 and a fourth constant current source 2022. The charge-discharge unit 102 includes an energy storage capacitor C1 and a diode D2, and the charge-discharge unit 102 is connected to the first ground GND1 of the first constant current control unit 201 and the second ground GND2 of the second constant current control unit 202. There is a mechanism of control and controlled between the first constant current control unit 201 and the second constant current control unit 202.
The working principle of the LED driving system provided by the fifth embodiment of the application is as follows: after the alternating current is rectified, in a single wire network period, when the real-time voltage output by the power supply unit 101 is greater than the on voltage of the LED light emitting unit 300, the third constant current source 2021 of the second constant current control unit 202 operates, the first constant current control unit 201 is turned off, and the bus voltage charges the charge and discharge unit 102. As shown in fig. 13, the constant current sources of the first constant current control unit 201 and the second constant current control unit 202 do not belong to the same reference ground.
After the alternating current is rectified, in a single wire network period, when the real-time voltage output by the power supply unit 101 is smaller than the on voltage of the LED light emitting unit 300, the third constant current source 2021 of the second constant current control unit 202 cannot work, at this time, the voltage on the charge and discharge unit 102 is greater than the on voltage of the LED light emitting unit 300, the charge and discharge unit 102 is in a discharge state, the second constant current source 2012 of the first constant current control unit 201 works, and continuous currents flow on the LED lamp beads of the first LED lamp set 301 and the second LED lamp set 302. The continuous and stable light emission of the lamp beads is realized, and the stroboscopic problem is solved.
When the wire net voltage decreases, the wire net input voltage is greater than the voltage of the first LED lamp group 301 of the LED light emitting unit 300 and less than the sum of the voltages of the first LED lamp group 301 and the second LED lamp group 302, and neither the second constant current source 2012 of the first constant current control unit 201 nor the third constant current source 2021 of the second constant current control unit 202 can function normally. At this time, the first LED lamp group 301 and the first constant current source 2011 form an energizing circuit or the first LED lamp group 301 and the second constant current source 2012 form an energizing circuit within a single wire mesh period. The current passes through the first LED lamp set 301, and the first LED lamp set 301 is lightened, so that the light emission can be realized by reducing the voltage of the wire network, and the wide-voltage operation is realized.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A chip, comprising:
the semiconductor device comprises a first base island (1), wherein a first wafer (10) is arranged on the first base island (1), and the grounding end of the first wafer (10) is connected with a first reference ground;
the second base island (2), a second wafer (20) is arranged on the second base island (2), and the grounding end of the second wafer (20) is connected with a second reference ground;
the second base island (2) and the first base island (1) are arranged at intervals, two sides of the second base island (2) adjacent to the first base island (1) are adjacent sides (21), the side away from the adjacent sides (21) is a deviating side (22), and the side connected between the adjacent sides (21) and the deviating side (22) is a pin side (23); at least one first rib claw (31) is arranged on the pin edge (23) of the first base island (1); at least one second rib claw (32) is arranged on the pin edge (23) of the second base island (2).
2. The chip of claim 1, wherein the chip comprises a plurality of chips,
a plurality of chip pins (4) which are mutually spaced are arranged outside the pin edge (23), and the chip pins (4) comprise a first chip pin and a second chip pin;
each first rib claw (31) and each second rib claw (32) are connected with one first chip pin;
the second chip pins are electrically connected with the first wafer (10) and the second wafer (20) through metal connecting wires (41).
3. The chip of claim 2, wherein the chip comprises a plurality of chips,
the grounding end of the first wafer (10) is electrically connected with the first base island (1), and the first chip pin connected with any one of the first rib claws (31) of at least one first rib claw (31) is used for being connected with the first reference ground;
the grounding end of the second wafer (20) is electrically connected with the second base island (2), and the first chip pin connected with any one of the second rib claws (32) of at least one second rib claw (32) is used for connecting the second reference ground.
4. A chip as claimed in claim 2 or 3, wherein,
the first rib claw (31) and the first chip pin which are mutually connected are integrally formed;
The second rib claw (32) and the first chip pin which are connected with each other are integrally formed.
5. The chip of claim 2, wherein the chip comprises a plurality of chips,
the grounding end of the first wafer (10) is electrically connected with one second chip pin, and the second chip pin which is electrically connected with the grounding end of the first wafer (10) is used for being connected with a first reference ground;
the grounding end of the second wafer (20) is electrically connected with one second chip pin, and the second chip pin which is electrically connected with the grounding end of the second wafer (20) is used for being connected with a second reference ground.
6. The chip according to any one of claims 1 to 3, 5, wherein,
the first base island (1) and the second base island (2) are made of conductive materials, and one side surface of the first base island (1) away from the first wafer (10) and one side surface of the second base island (2) away from the second wafer (20) are used for contacting a circuit board.
7. An integrated circuit, comprising:
a power supply (100) having a power supply output;
a charge-discharge unit (102) electrically connected to the power output terminal through a first diode;
the chip (200) of any of claims 1-5, the chip (200) comprising a power input port, a first ground port, a first reference voltage port, a second ground port, a first current input controlled port, and a second current input controlled port; the power input port and the second current input controlled port are both connected with the power output end, and the first current input controlled port is connected with the charge-discharge unit (102);
The LED lamp comprises a first LED lamp group (301), wherein an anode of the first LED lamp group (301) is connected to the first grounding port, the anode of the first LED lamp group (301) is connected to the first reference voltage port through a first resistor, and a cathode of the first LED lamp group (301) is connected to the second reference voltage port;
the anode of the second LED lamp set (302) is connected to the second grounding port, the anode of the second LED lamp set (302) is connected with the cathode of the first LED lamp set (301) through a second resistor, and the cathode of the second LED lamp set (302) is grounded.
8. An integrated circuit, comprising:
a power supply (100) having a power supply output;
a charge-discharge unit (102) electrically connected to the power output terminal through a first diode;
the chip (200) of any of claims 1-5, the chip (200) comprising a first reference voltage port, a first ground port, a second reference voltage port, a second current input controlled port, a first current input controlled port, a second ground port, an input voltage acquisition port, and a power supply input port;
the first reference voltage port is connected with the first grounding port through a first resistor, the second reference voltage port is connected with the second grounding port through a second resistor, the power input port is connected with the charge and discharge unit (102), and the input voltage acquisition port is connected with the power output end;
A first LED lamp group (301), wherein an anode of the first LED lamp group (301) is connected with the power input port, and a cathode of the first LED lamp group (301) is connected with the first current input controlled port;
the anode of the second LED lamp set (302) is connected with the cathode of the first LED lamp set (301), and the cathode of the second LED lamp set (302) is connected with the second current input controlled port.
9. An LED driving system, applied to the integrated circuit of claim 7, comprising:
a power supply unit (101);
a charge/discharge unit (102) electrically connected to the power supply unit (101);
the first constant current control unit (201) is electrically connected with the charge and discharge unit (102), and the first constant current control unit (201) is connected with a first reference ground;
a second constant current control unit (202) electrically connected to the power supply unit (101) and the first constant current control unit (201), the second constant current control unit (202) being connected to the first reference ground;
the third constant current control unit (203) is electrically connected with the charge and discharge unit (102), and the third constant current control unit (203) is connected with a second reference ground;
the LED light emitting unit (300) comprises a first LED lamp group (301) and a second LED lamp group (302), wherein the anode of the first LED lamp group (301) is connected with the first reference ground, the cathode of the first LED lamp group (301) is electrically connected with the third constant current control unit (203), the cathode of the first LED lamp group (301) is electrically connected with the anode of the second LED lamp group (302) through a second resistor, and the anode of the second LED lamp group (302) is connected with the second reference ground.
10. An LED driving system, applied to the integrated circuit of claim 8, comprising:
a power supply unit (101);
a charge-discharge unit (102) electrically connected to the power supply unit (101) through a first diode;
the sampling signal unit (103) is electrically connected with the power supply unit (101), and the sampling signal unit (103) is provided with a first signal control end and a second signal control end;
the first constant current control unit (201) is electrically connected with the first signal control end, the first constant current control unit (201) comprises a first constant current source (2011) and a second constant current source (2012), and the first constant current source (2011) and the second constant current source (2012) are both connected with a first reference ground;
the second constant current control unit (202) is electrically connected with the second signal control end and the first constant current control unit (201), the second constant current control unit (202) comprises a third constant current source (2021) and a fourth constant current source (2022), and the third constant current source (2021) and the fourth constant current source (2022) are both connected with a second reference ground;
the LED light emitting unit (300) comprises a first LED lamp group (301) and a second LED lamp group (302) which are connected in series, wherein the anode of the first LED lamp group (301) is electrically connected with the charging and discharging unit (102), the cathode of the first LED lamp group (301) is electrically connected with the first constant current source (2011) and the fourth constant current source (2022), and the cathode of the second LED lamp group (302) is electrically connected with the second constant current source (2012) and the third constant current source (2021).
CN202311072429.7A 2023-08-23 2023-08-23 Chip, integrated circuit and LED driving system Pending CN117059619A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311072429.7A CN117059619A (en) 2023-08-23 2023-08-23 Chip, integrated circuit and LED driving system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311072429.7A CN117059619A (en) 2023-08-23 2023-08-23 Chip, integrated circuit and LED driving system

Publications (1)

Publication Number Publication Date
CN117059619A true CN117059619A (en) 2023-11-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311072429.7A Pending CN117059619A (en) 2023-08-23 2023-08-23 Chip, integrated circuit and LED driving system

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Country Link
CN (1) CN117059619A (en)

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