CN117059501A - Tool structure for semiconductor packaging - Google Patents
Tool structure for semiconductor packaging Download PDFInfo
- Publication number
- CN117059501A CN117059501A CN202311304557.XA CN202311304557A CN117059501A CN 117059501 A CN117059501 A CN 117059501A CN 202311304557 A CN202311304557 A CN 202311304557A CN 117059501 A CN117059501 A CN 117059501A
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- ring
- machine body
- semiconductor packaging
- montant
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 53
- 230000000670 limiting effect Effects 0.000 claims description 30
- 238000003466 welding Methods 0.000 claims description 21
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 230000008275 binding mechanism Effects 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 238000005096 rolling process Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 13
- 230000009471 action Effects 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 10
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000012217 deletion Methods 0.000 description 2
- 230000037430 deletion Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Processing (AREA)
Abstract
The invention belongs to the technical field of semiconductor packaging, and discloses a tooling structure for semiconductor packaging, which comprises a vertical plate, wherein a first motion rod is movably arranged on the front surface of the vertical plate, a machine body is fixedly arranged at the other end of the first motion rod, a vertical pipe is arranged in the machine body in a penetrating manner, a first ring block is movably arranged at the bottom end of the machine body, and the top of the first ring block extends upwards to the interior of the machine body and is fixedly provided with a second ring block. Compared with the traditional device, the device has the advantages that after the cutting operation of the gold wire is finished, the device presses down the cutting power to drive the first roller to rotate, so that the gold wire reversely moves to the initial position, the phenomenon of early dripping caused by overlarge ball burning quality in the length process is avoided, the smooth performance of the packaging operation is ensured, and the working efficiency of staff is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a tooling structure for semiconductor packaging.
Background
The invention mainly aims at improving and optimizing lead welding in a bonding flow process, at present, the lead welding in the prior art generally adopts an EFO ignition rod to burn a gold wire in front of a magnetic nozzle into a molten ball, then contacts and extrudes the molten ball with a circuit board to form a first welding spot, the pad and a lead frame are connected through the gold wire, and a second welding spot is formed on the lead frame for cutting, however, the length of the gold wire is longer than that of the gold wire during the gold wire sintering, and during the second welding operation, the length of the gold wire is too long, so that the fused sintering ball is easy to drop in advance, and normal packaging operation is influenced, so that the improvement and the optimization are needed.
Disclosure of Invention
The present invention is directed to a tooling structure for semiconductor packaging, which solves the above-mentioned problems of the prior art.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a frock structure for semiconductor encapsulation, includes the riser, the positive movable mounting of riser has first motion pole, the other end fixed mounting of first motion pole has the organism, the inside of organism is run through and is installed the standpipe, the bottom movable mounting of organism has first loop wheel, the top of first loop wheel upwards extends to the inside of organism and fixed mounting has the second loop wheel, the surface movable mounting of first loop wheel has first montant, the bottom movable mounting of first montant has the bottom block, the surface fixed mounting of bottom block has the second tooth, the positive fixed mounting of riser has the fixed plate, the positive fixed mounting of fixed plate has first tooth, the breach is seted up to the bottom block surface, the top fixed mounting of second loop wheel has the second montant, the top of second montant upwards runs through the riser, the fixed surface of second montant has cup jointed the diaphragm, the surface elastic connection of second montant has the spring that is located between diaphragm top and the riser inner chamber top, the surface of second montant both sides, movable mounting has the second tooth, the positive fixed mounting of fixed plate has the first gyro wheel, the surface fixed mounting of fixed surface of fixed plate has the first gyro wheel through the inside of first gyro wheel.
Preferably, the bottom fixed mounting of organism has the tooth piece that is located the inside of first ring piece, the medial surface fixed mounting of first ring piece has the ring tooth, the positive movable mounting of riser has the second motion pole, the other end fixed mounting of third ring piece has the third ring piece that is located under the organism, the front of riser is provided with the welding bench.
Preferably, when the bottom block is positioned at the lowest end, the distance between the bottom block and the first ring block is larger than the diameter length of the gold wire.
Preferably, a first limiting groove is formed in the bottom block, and a first limiting block located at the bottom end of the first vertical rod is installed in the first limiting groove in a sliding mode.
Preferably, the height value between the machine body and the fixed plate is larger than the height value of the first ring block and the third ring block.
Preferably, a second limiting groove is formed in the first ring block, and a second limiting block located on the inner side face of the first vertical rod is installed in a sliding mode in the second limiting groove.
Preferably, the bottom end of the third ring block is fixedly provided with a bottom block, and a reinforcing rib is fixedly arranged between the outer surface of the third ring block and the bottom block.
Preferably, a third limiting groove is formed in the vertical plate, and a third limiting block located on the lateral surface of the transverse plate is installed in the third limiting groove in a sliding mode.
Preferably, the number of the first limiting blocks is three, and the arc length of the three first limiting blocks is greater than that of the notch.
Preferably, a wire bundling mechanism is arranged at the top of the machine body.
The beneficial effects of the invention are as follows:
1. according to the invention, the bottom block, the transverse plate, the first roller and the fixed plate are arranged, when the whole machine body is driven to move downwards through the driving device, the first roller is driven to rotate under the cooperation between the bottom block and the first ring block, the gold wire positioned between the bottom block and the first ring block is continuously pressed downwards along with the machine body, the second roller and the first roller are driven to rotate through the fixed plate by moving upwards through the second vertical rod and the transverse plate, and then the gold wire in the vertical pipe is driven to move upwards through the fixed plate, so that the cut gold wire bottom end is retracted upwards to an initial position.
2. According to the invention, the first ring block, the bottom block, the notch, the second teeth and the first teeth are arranged, when the machine body moves leftwards as a whole, the gold wire at the bottom end of the bottom block can move to the top of the bottom block through the cooperation between the first teeth and the second teeth, and the machine body moves downwards as a whole, so that under the mutual extrusion action between the bottom block and the first ring block, the gold wire between the bottom block and the first ring block is cut under the action of high temperature transferred by the machine body when the first ring block is added, and compared with the traditional device, the device can avoid the contact of the machine body and the gold wire to cut the gold wire, thereby avoiding uneven heating of the gold wire caused by breakage and deletion of the machine body, improving the cutting efficiency of the gold wire and prolonging the service life of the device.
3. According to the invention, by arranging the tooth blocks, the ring teeth and the third ring blocks, the contact area between the molten liquid ball and the tooth blocks and the inner wall of the first ring block can be increased through the design of the tooth blocks and the ring teeth, so that the molecular tension in the molten liquid ball is improved, the molten liquid ball is not easy to drop off accidentally, meanwhile, due to the design of the third ring blocks, the molten liquid ball is molded in the third ring blocks, the phenomenon that the molten liquid ball is diffused into irregular shapes everywhere is influenced by beauty is avoided, and the bending point of the bottom end of the gold wire and the first welding point is converted into the contact position of the third ring blocks and the gold wire through the contact of the third ring blocks and the gold wire, so that the stress born by the first welding point is reduced, and the first welding point is prevented from falling off accidentally.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the side face of the present invention;
FIG. 3 is a schematic view of a partial enlarged structure at A in FIG. 2 according to the present invention;
FIG. 4 is a schematic view of the internal structure of the body of the present invention;
FIG. 5 is a schematic view of a partially enlarged structure of the present invention at B in FIG. 4;
FIG. 6 is a schematic view of the structure of the spring of the present invention;
FIG. 7 is a schematic structural view of a fixing plate according to the present invention;
FIG. 8 is a schematic view of the exploded construction of the bottom block, tooth block, ring tooth and first ring block of the present invention;
FIG. 9 is a schematic view of the third ring block of the present invention;
fig. 10 is a schematic structural view of a second tooth according to the present invention.
In the figure: 1. a riser; 2. a first motion bar; 3. a body; 4. a standpipe; 5. a first loop block; 6. a second ring block; 7. a bottom block; 8. a first vertical rod; 9. a first limit groove; 10. a first limiting block; 11. the second limit groove; 12. a second limiting block; 13. a fixing plate; 14. a first tooth; 15. a second tooth; 16. a notch; 17. a second vertical rod; 18. a cross plate; 19. a spring; 20. a third limit groove; 21. a third limiting block; 22. a first roller; 23. a rotating shaft; 24. a second roller; 25. a fixing plate; 26. tooth blocks; 27. ring teeth; 28. a second motion bar; 29. a third ring block; 30. a bottom block; 31. reinforcing ribs; 32. a welding table; 33. and a wire bundling mechanism.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 10, the embodiment of the invention provides a tooling structure for packaging semiconductors, which comprises a vertical plate 1, wherein a first motion rod 2 is movably arranged on the front surface of the vertical plate 1, a machine body 3 is fixedly arranged at the other end of the first motion rod 2, a vertical pipe 4 is arranged on the outer surface of the bottom plate 7 in a penetrating manner, a first annular block 5 is movably arranged at the bottom end of the machine body 3, the top of the first annular block 5 extends upwards to the inner part of the machine body 3 and is fixedly provided with a second annular block 6, a first vertical rod 8 is movably arranged on the outer surface of the first annular block 5, a bottom block 7 is movably arranged at the bottom end of the first vertical rod 8, a second tooth 15 is fixedly arranged on the outer surface of the bottom block 7, a fixed plate 13 is fixedly arranged on the front surface of the vertical plate 1, a first tooth 14 is fixedly arranged on the front surface of the bottom block 7, a notch 16 is formed on the outer surface of the bottom block 7, a second vertical rod 17 is fixedly arranged at the top of the second vertical rod 17, the top of the second annular block 17 upwards penetrates through the vertical plate 1, a transverse plate 18 is fixedly sleeved on the outer surface of the second vertical rod 17, an outer surface of the second vertical rod 17 is elastically connected with a vertical rod 18, a second vertical rod 17 is elastically connected with the outer surface of the second vertical rod 18, a second inner surface of the vertical rod is fixedly arranged on the second inner surface of the vertical rod 22, and is fixedly connected with a second inner surface of the vertical rod 22, and a roller 22 is fixedly arranged on the outer surface of the second roller 22, and is fixedly arranged on the outer surface of the vertical rod 22, and is fixedly arranged on the inner surface of the roller 22, and is arranged on the roller 22, and is fixedly and is arranged on the roller 22;
after the first welding spot operation is performed by a worker, the whole machine body 3 moves upwards to reset through a driving mechanism in the prior art, at the moment, the second tooth 15 is meshed with the first tooth 14 again, the machine body 3 moves leftwards through the driving mechanism, at the moment, under the action of the first tooth 14, the bottom block 7 is driven to rotate through the second tooth 15, when the gold wire is overlapped with the notch 16, under the action of the traction of the first welding spot, the gold wire at the bottom end of the bottom block 7 moves to the top of the bottom block 7 through the notch 16, then the machine body 3 moves downwards through the driving structure, when the bottom end of the bottom block 7 is contacted with the welding table 32 and the bottom block 7 moves upwards relative to the first ring block 5, the gold wire between the first ring block 5 and the bottom block 7 is cut off and continuously pressed downwards, the first ring block 5 moves upwards, the second ring block 6 and the second ring block 17 are pushed upwards through the first ring block vertical rod 5, the second ring block 17 is driven by the first ring block vertical rod 17, the second ring block 17 moves upwards through the first roller 18, the second roller 18 is driven by the elastic rod, the left side of the rolling wheel 19 moves upwards, the rolling wheel 19 is driven by the rolling wheel 19, and the rolling wheel 19 moves upwards, and the rolling wheel 19 is driven by the rolling wheel 18 is driven by the rolling wheel, and the rolling wheel 18 is in the rolling wheel is in the opposite direction, and the rolling wheel is in the state, and the rolling wheel is in the rolling state, and the rolling state is in the rolling state;
when the machine body 3 is driven to move downwards integrally by the driving device, the gold wire between the bottom block 7 and the first ring block 5 is cut off under the cooperation between the bottom block 7 and the first ring block 5, the second vertical rod 17 and the transverse plate 18 move upwards along with the continuous downward pressing of the machine body 3, the second roller 24 and the first roller 22 are driven to rotate by the fixing plate 25, the gold wire inside the vertical tube 4 is driven to move upwards by the fixing plate 25, the cut-off gold wire bottom end is retracted upwards to the initial position, and compared with the traditional device, the device drives the first roller 22 to rotate by the device to push down the cut-off power after the cutting-off operation of the gold wire is completed, so that the gold wire moves reversely to the initial position, the phenomenon of early dripping caused by overlarge ball burning quality in the length process is avoided, the smooth progress of packaging operation is ensured, and the operation efficiency of staff is improved.
When the machine body 3 moves wholly leftwards, through the cooperation between the first teeth 14 and the second teeth 15, the gold wire positioned at the bottom end of the bottom block 7 moves to the top of the bottom block 7 through the notch 16, under the mutual extrusion action between the bottom block 7 and the first ring block 5 through the whole downward movement of the machine body 3, under the high temperature action of the first ring block 5 transmitted by the machine body 3, the gold wire positioned between the bottom block 7 and the first ring block 5 is cut off, compared with the traditional device, the device can avoid the contact of the machine body 3 and gold wire to cut off the gold wire, thereby avoiding uneven heating of the gold wire caused by breakage and deletion of the machine body 3, improving the cutting efficiency of the gold wire and prolonging the service life of the device.
As shown in fig. 4 and 8, the bottom end of the machine body 3 is fixedly provided with a tooth block 26 positioned in the first ring block 5, the inner side surface of the first ring block 5 is fixedly provided with a ring tooth 27, the front surface of the vertical plate 1 is movably provided with a second motion rod 28, the other end of the third ring block 29 is fixedly provided with a third ring block 29 positioned under the machine body 3, and the front surface of the vertical plate 1 is provided with a welding table 32;
the starting device heats the tooth block 26 through the bottom end of the machine body 3, heats the gold wire at the bottom end inside the vertical pipe 4 through the tooth block 26, so that the gold wire is heated into a molten liquid ball, drives the machine body 3 to move downwards integrally through a driving mechanism in the prior art, after the bottom block 7 contacts with the third ring block 29, the bottom block 7 moves upwards, after the bottom block 7 contacts with the first ring block 5, drives the first ring block 5 to move upwards, the upward movement distance of the first ring block 5 is insufficient to enable the transverse plate 18 to contact with the fixed plate 25, at the moment, the molten liquid ball inside the first ring block 5 enters into the third ring block 29 to contact with a circuit board at the bottom end of the third ring block 29 to form a first welding spot, and after the machine body 3 is reset through the driving device, the gold wire moves leftwards to contact with the edge of the third ring block 29;
through the design of tooth piece 26 and ring tooth 27, can increase the area of contact between molten liquid ball and tooth piece 26 and the inner wall of first ring piece 5 to improve the inside molecular tension of molten liquid ball, make the molten liquid ball be difficult for taking place to drop by accident, simultaneously, because the design of third ring piece 29, make molten liquid ball at the inside shaping of third ring piece 29, avoid diffusing into irregular shape everywhere and influence pleasing to the eye, and through the contact of third ring piece 29 with the gold wire, make the bending point of gold wire bottom and first solder joint change into the contact position of third ring piece 29 with the gold wire, thereby reduce the stress that first solder joint received, avoid first solder joint unexpected droing.
As shown in fig. 2, when the bottom block 7 is positioned at the lowest end, the distance between the bottom block and the first ring block 5 is larger than the diameter length of the gold wire;
because of the design of the space between the first ring block 5 and the bottom block 7, the gold wire can smoothly move from the bottom end of the bottom block 7 to the space between the bottom block 7 and the first ring block 5, so that the gold wire can be conveniently cut.
As shown in fig. 10, a first limit groove 9 is formed in the bottom block 7, and a first limit block 10 positioned at the bottom end of the first vertical rod 8 is slidably arranged in the first limit groove 9;
because of the design of the first limiting groove 9, the first vertical rod 8 can be well limited, so that the relative movement between the first vertical rod 8 and the bottom block 7 is more stable, and the gold wires can conveniently enter the top of the bottom block 7 through the notch 16 to be cut off.
As shown in fig. 2, the height value between the machine body 3 and the fixed plate 13 is greater than the height value of the first ring block 5 and the third ring block 29;
wherein, because the height value between the machine body 3 and the fixed plate 13 is greater than the height value between the bottom block 7 and the third ring block 29, the bottom block 7 and the third ring block 29 can be contacted before the impact between the machine body 3 and the fixed plate 13, the welding operation of the first welding spot is realized, and the normal operation of the device is ensured.
As shown in fig. 3, a second limit groove 11 is formed in the first ring block 5, and a second limit block 12 positioned on the inner side surface of the first vertical rod 8 is slidably arranged in the second limit groove 11;
the second limiting groove 11 has a good limiting effect on the first vertical rod 8, so that the first vertical rod 8 can move up and down more stably, and welding and gold wire cutting operations can be conveniently performed.
As shown in fig. 9, a bottom block 30 is fixedly arranged at the bottom end of the third ring block 29, and a reinforcing rib 31 is fixedly arranged between the outer surface of the third ring block 29 and the bottom block 30;
wherein, because of the design of the reinforcing rib 31, the firmness between the bottom block 30 and the third ring block 29 can be enhanced, the third ring block 29 is convenient for guiding the gold wire, and the stress at the first welding point is reduced.
As shown in fig. 5, a third limit groove 20 is formed in the vertical plate 1, and a third limit block 21 positioned on the side surface of the transverse plate 18 is slidably arranged in the third limit groove 20;
wherein, because of the design of the third limit groove 20, the cross plate 18 can be well limited, so that the cross plate 18 can be lifted and lowered more stably, the first roller 22 is driven to rotate by the fixing plate 25, and the metal wire moves upwards reversely.
As shown in fig. 10, the number of the first limiting blocks 10 is three, and the arc length of the three first limiting blocks 10 is greater than the arc length of the notch 16;
because of the design of the first limiting block 10, the arc length of the first limiting block 10 is greater than that of the notch 16, so that the first limiting block 10 is more stable when passing through the notch 16, and thus smoothly enters the first limiting groove 9, and the end part of the first limiting block 10 is not dislocated with the first limiting groove 9.
As shown in fig. 2, the top of the machine body 3 is provided with a wire binding mechanism 33;
because of the design of the wire bundling mechanism 33, the wire bundling mechanism 33 clamps and loosens the wire inside the standpipe 4, when the machine body 3 moves downwards integrally, the wire bundling mechanism 33 clamps the wire, so that the wire is paid out from the reel, and when the machine body 3 moves upwards integrally, the wire bundling mechanism 33 sends the wire, so that the wire smoothly passes through the standpipe 4 and moves downwards relative to the machine body 3.
Working principle and using flow: when the machine body 3 moves leftwards integrally, the gold wire at the bottom end of the bottom block 7 passes through the notch 16 to move to the top of the bottom block 7 through the cooperation between the first teeth 14 and the second teeth 15, and under the mutual extrusion action between the bottom block 7 and the first ring block 5 through the downward movement of the machine body 3 integrally, the gold wire between the bottom block 7 and the first ring block 5 is cut off under the action of the high temperature transferred by the machine body 3 when the first ring block 5 is added;
when the machine body 3 is driven to move downwards integrally by the driving device, under the cooperation between the bottom block 7 and the first ring block 5, the gold wire between the bottom block 7 and the first ring block 5 is cut off, and as the machine body 3 continues to press downwards, the second vertical rod 17 and the transverse plate 18 move upwards, the second roller 24 and the first roller 22 are driven to rotate by the fixing plate 25, and then the gold wire in the vertical tube 4 is driven to move upwards by the fixing plate 25, so that the cut gold wire bottom end upwards retracts to an initial position;
the toothed block 26 is heated through the bottom end of the machine body 3, the metal wire at the bottom end inside the vertical pipe 4 is heated through the toothed block 26, the metal wire is heated to be molten liquid balls, the machine body 3 is driven to move downwards integrally through a driving mechanism in the prior art, after the bottom block 7 contacts with the third annular block 29, the bottom block 7 moves upwards, after the bottom block 7 contacts with the first annular block 5, the first annular block 5 is driven to move upwards, at the moment, the molten liquid balls inside the first annular block 5 can enter the third annular block 29 to contact with a circuit board at the bottom end of the third annular block 29 to form a first welding spot, and after the machine body 3 is reset by the driving device, the metal wire moves leftwards, at the moment, the metal wire contacts with the edge of the third annular block 29.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a frock structure for semiconductor encapsulation, includes riser (1), its characterized in that: the front movable mounting of riser (1) has first motion pole (2), the other end movable mounting of first motion pole (2) has organism (3), the inside of organism (3) runs through and installs standpipe (4), the bottom movable mounting of organism (3) has first ring piece (5), the top of first ring piece (5) upwards extends to the inside of organism (3) and fixed mounting has second ring piece (6), the surface movable mounting of first ring piece (5) has first montant (8), the bottom movable mounting of first montant (8) has bottom block (7), the surface fixed mounting of bottom block (7) has second tooth (15), the front fixed mounting of riser (1) has fixed plate (13), the front fixed mounting of fixed plate (13) has first tooth (14), breach (16) have been seted up to the top fixed mounting of second ring piece (6) to the inside of organism (3), the surface movable mounting of first ring piece (5) has second montant (17), the surface movable mounting of bottom block (7) has bottom block (13), the surface fixed mounting of second montant (17) has second tooth (17) in the top of second montant (17), the surface fixed mounting of top (17) has top diaphragm (17) of second montant (17), the two sides of the outer surface of the vertical pipe (4) are movably provided with first rollers (22), the outer surface of each first roller (22) is located inside the vertical pipe (4), each first roller (22) is fixedly connected with a second roller (24) through a rotating shaft (23), and the outer surface of each second roller (24) is fixedly provided with a fixing plate (25).
2. The tooling structure for semiconductor packaging of claim 1, wherein: the novel vertical plate comprises a machine body (3), wherein a tooth block (26) positioned in a first ring block (5) is fixedly arranged at the bottom end of the machine body (3), ring teeth (27) are fixedly arranged on the inner side surface of the first ring block (5), a second motion rod (28) is movably arranged on the front surface of the vertical plate (1), a third ring block (29) positioned under the machine body (3) is fixedly arranged at the other end of the third ring block (29), and a welding table (32) is arranged on the front surface of the vertical plate (1).
3. The tooling structure for semiconductor packaging of claim 1, wherein: when the bottom block (7) is positioned at the lowest end, the distance between the bottom block and the first ring block (5) is larger than the diameter length of the gold wire.
4. The tooling structure for semiconductor packaging of claim 1, wherein: the inside of bottom block (7) has seted up first spacing groove (9), the inside of first spacing groove (9) slides installs first stopper (10) that are located first montant (8) bottom.
5. The tooling structure for semiconductor packaging of claim 1, wherein: the height value between the machine body (3) and the fixed plate (13) is larger than the height value of the first annular block (5) and the third annular block (29).
6. The tooling structure for semiconductor packaging of claim 1, wherein: the inside of first ring piece (5) has seted up second spacing groove (11), the inside of second spacing groove (11) slides installs second stopper (12) that are located first montant (8) medial surface.
7. The tooling structure for semiconductor packaging of claim 2, wherein: bottom block (30) is fixedly arranged at the bottom end of the third ring block (29), and reinforcing ribs (31) are fixedly arranged between the outer surface of the third ring block (29) and the bottom block (30).
8. The tooling structure for semiconductor packaging of claim 1, wherein: a third limiting groove (20) is formed in the vertical plate (1), and a third limiting block (21) located on the side face of the transverse plate (18) is installed in the third limiting groove (20) in a sliding mode.
9. The tooling structure for semiconductor packaging of claim 1, wherein: the number of the first limiting blocks (10) is three, and the arc length of the three first limiting blocks (10) is larger than that of the notch (16).
10. The tooling structure for semiconductor packaging of claim 1, wherein: the top of the machine body (3) is provided with a wire binding mechanism (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311304557.XA CN117059501B (en) | 2023-10-10 | 2023-10-10 | Tool structure for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311304557.XA CN117059501B (en) | 2023-10-10 | 2023-10-10 | Tool structure for semiconductor packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117059501A true CN117059501A (en) | 2023-11-14 |
| CN117059501B CN117059501B (en) | 2023-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311304557.XA Active CN117059501B (en) | 2023-10-10 | 2023-10-10 | Tool structure for semiconductor packaging |
Country Status (1)
| Country | Link |
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| CN (1) | CN117059501B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021114094A1 (en) * | 2019-12-10 | 2021-06-17 | 苏州锡友微连电子科技有限公司 | Welding device and wire feeding apparatus |
| JP2021109232A (en) * | 2020-01-02 | 2021-08-02 | 王磊 | Terminal part automatic welding device for wire |
| CN115194388A (en) * | 2022-06-29 | 2022-10-18 | 江苏爱矽半导体科技有限公司 | Lead welding equipment for semiconductor and using method thereof |
| CN115194842A (en) * | 2022-08-04 | 2022-10-18 | 杭州国光旅游用品有限公司 | Cutting device and process for producing pet sterilizing wet tissue |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021114094A1 (en) * | 2019-12-10 | 2021-06-17 | 苏州锡友微连电子科技有限公司 | Welding device and wire feeding apparatus |
| JP2021109232A (en) * | 2020-01-02 | 2021-08-02 | 王磊 | Terminal part automatic welding device for wire |
| CN115194388A (en) * | 2022-06-29 | 2022-10-18 | 江苏爱矽半导体科技有限公司 | Lead welding equipment for semiconductor and using method thereof |
| CN115194842A (en) * | 2022-08-04 | 2022-10-18 | 杭州国光旅游用品有限公司 | Cutting device and process for producing pet sterilizing wet tissue |
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