CN117042318A - Comprehensive treatment process for gold plating, nickel-palladium-gold deposition and tin spraying of circuit board - Google Patents
Comprehensive treatment process for gold plating, nickel-palladium-gold deposition and tin spraying of circuit board Download PDFInfo
- Publication number
- CN117042318A CN117042318A CN202310797583.4A CN202310797583A CN117042318A CN 117042318 A CN117042318 A CN 117042318A CN 202310797583 A CN202310797583 A CN 202310797583A CN 117042318 A CN117042318 A CN 117042318A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- bonding pad
- gold
- adhesive tape
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 67
- 239000010931 gold Substances 0.000 title claims abstract description 67
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 62
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 238000005507 spraying Methods 0.000 title claims abstract description 51
- 238000011282 treatment Methods 0.000 title claims abstract description 46
- 238000007747 plating Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 26
- 230000008569 process Effects 0.000 title claims abstract description 25
- 230000008021 deposition Effects 0.000 title description 5
- 239000002390 adhesive tape Substances 0.000 claims abstract description 108
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 40
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 20
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 20
- 238000000151 deposition Methods 0.000 claims abstract description 17
- 238000001035 drying Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000000428 dust Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 8
- 238000005485 electric heating Methods 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 description 11
- 239000000243 solution Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Abstract
The invention discloses a comprehensive treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board, which comprises the following steps: after a circuit board is etched on the circuit board, covering solder resist ink on the area where a first bonding pad at the edge of the circuit board is located, reserving the first bonding pad, covering a dry film on the area where gold plating is not needed at the second bonding pad position in the middle of the circuit board, and reserving a vacancy of the second bonding pad at the second bonding pad position; sticking a first adhesive tape for the first time, and sticking the first adhesive tape around the reserved first bonding pad; a first layer of metal treatment, wherein nickel, palladium and gold are deposited on the first bonding pad, and gold is plated on the second bonding pad; attaching the adhesive tape for the second time, and attaching the second adhesive tape around the first bonding pad and the second bonding pad; a second layer of metal treatment, wherein the first bonding pad is plated with gold, and the second bonding pad is plated with nickel, palladium and gold; tin spraying, namely, passing the circuit board through a tin spraying device; leveling, namely leveling the solder paste by using hot air; and (3) post-treatment, namely drying the circuit board after tin spraying.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a comprehensive treatment process for gold plating, nickel-palladium-gold plating and tin spraying of a circuit board.
Background
Along with the gradual transformation of the conventional single or two types of surface treatment designs to more than three types of surface treatment designs in the current circuit board industry, the current industry is basically free of reliable and realizable process flow methods, wherein when multiple types of surface treatments exist in the same circuit board design, the basic unified practice in the industry is to suggest that the circuit board design end is adjusted to be two types, and the design end requirement cannot be realized.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a surface treatment process for the second bonding pad of the circuit board, which can concentrate different surface treatment processes in the same circuit board design and meet the requirements of a design end.
According to an embodiment of the first aspect of the invention, the comprehensive treatment process for the gold plating, the nickel-palladium-gold plating and the tin spraying of the circuit board comprises the following steps:
after a circuit board is etched, a first welding disc at the edge of the circuit board is exposed after a first preset area of the circuit board is covered with solder resist ink, and then a second welding disc at the middle part of the circuit board is exposed after a second preset area of the circuit board is covered with a dry film;
sticking a first adhesive tape for the first time, sticking a first adhesive tape around a reserved first bonding pad, cutting out a clearance gap according to design when sticking the first adhesive tape, wherein the clearance gap is arranged in one-to-one correspondence with the first bonding pad, and the first bonding pad can be exposed from the clearance gap;
a first layer of metal treatment, namely plating nickel, palladium and gold on a first bonding pad in a sinking mode, and tearing off the first adhesive tape after plating the nickel, palladium and gold in a sinking mode; gold-plating the second bonding pad, etching the residual wire after gold-plating the second bonding pad by using etching liquid, removing a dry film in the circuit board, covering the solder resist ink on the circuit board at the position which is not covered by the solder resist ink, exposing the second bonding pad, blowing the position, on the circuit board, where the first adhesive tape is stuck, by using hot air after the first adhesive tape is torn off, and then erasing the position, where the first adhesive tape is stuck, by using sponge;
attaching a second adhesive tape for the second time, attaching a second adhesive tape around the first bonding pad and the second bonding pad, and exposing the first bonding pad and the second bonding pad after the second adhesive tape is attached;
the second layer of metal treatment is carried out, gold is plated on the first bonding pad, a lead is removed by a knife after the first bonding pad is plated with gold, nickel plating palladium gold is deposited on the second bonding pad, the second adhesive tape is torn off after the second layer of metal treatment is finished, before the second adhesive tape is torn off, the edge of the second adhesive tape is firstly blown by hot air, then the second adhesive tape is shoveled by the knife, and then the second adhesive tape is torn off;
printing blue glue, namely printing blue glue around the first bonding pad and the second bonding pad, and covering the edges of the first bonding pad and the second bonding pad by 0-0.05mm when the blue glue is printed;
tin spraying, namely, a circuit board passes through a tin spraying device, a tin layer is covered on each of a first bonding pad and a second bonding pad, and in the tin spraying process, the circuit board with two metal layers manufactured is placed in a drying box, and after the circuit board is dried in the drying box, the circuit board is placed in an electrostatic dust removing box for dust removal;
leveling, namely leveling the solder paste by using hot air after tin spraying, wherein the hot air adopts constraint air and leveling air, the constraint air is used for limiting the solder paste from overflowing, and the leveling air is used for leveling the tip after tin spraying;
and (3) post-treatment, namely washing and drying the circuit board after tin spraying.
The comprehensive treatment process for the circuit board gold plating, nickel-plating palladium-gold plating and tin spraying has at least the following beneficial effects: in the circuit board manufacturing process, two different covering layers are manufactured on the same circuit board, and the arranged solder resist ink layer and the arranged dry film layer are respectively positioned at corresponding positions on the circuit board, so that the subsequent surface treatment of the first bonding pad and the second bonding pad can be simultaneously satisfied, the complicated separate treatment is avoided, and the surface treatment efficiency of the circuit board is improved; in the step of first sticking the adhesive tape, in order to stick the area covered with the edge of the first bonding pad of the solder mask, the solder mask is not damaged when the nickel-palladium-gold is deposited, and because the gold-plated wires of the second bonding pad in the middle area of the circuit board are not well picked, the non-gold-plated area on the circuit board is protected by using the electroplating-resistant dry film, the gold plating of the first bonding pad and the nickel-palladium-gold deposition of the second bonding pad are alternately carried out, different surface treatments are concentrated on one circuit board, thereby not only ensuring the effective production of the circuit board, but also improving the production efficiency of the circuit board, and finally, after the first bonding pad and the second bonding pad are treated by the metal layer, the tin spraying is carried out on the first bonding pad and the second bonding pad, so that tin spraying of two different circuit structures can be finished at one time on the circuit board, and the efficiency is greatly improved; in addition, when the tin spraying, the electrostatic dust collection is adopted, the problem that the tin spraying is not carried out due to the fact that the first bonding pad and the second bonding pad are stained with dust is avoided, in addition, the tin paste is leveled by constraint wind and leveling wind, a contact leveling mode is avoided, and the tin layer is prevented from being damaged.
According to some embodiments of the invention, in the post-treatment step, the circuit board is inclined to pass through the low-pressure clean water jet flow, so that dust stained on the circuit board is washed away, and then the circuit board is placed in a drying oven, and is dried at normal temperature.
According to some embodiments of the invention, in the step of sticking the second adhesive tape for the second time, the second adhesive tape is provided with a rectangular strip adhesive tape, and the second adhesive tape is provided with a matching step, the second adhesive tapes are mutually overlapped to cover the first bonding pad and the surrounding area of the second bonding pad, and after the second adhesive tape is stuck, the adhesive tape is removed at the positions of the first bonding pad and the second bonding pad.
According to some embodiments of the invention, when the first adhesive tape is torn off, a warm air blowing pipe is used for heating and drying the first adhesive tape above the first adhesive tape, then a blade is used for shoveling the first adhesive tape, then the first adhesive tape is pulled and torn off, and the adhesive on the first adhesive tape can be softened by heating and drying, so that the first adhesive tape can be conveniently peeled off.
According to some embodiments of the present invention, after the corresponding adhesive tape is applied in the first adhesive tape applying step and the second adhesive tape applying step, a pinch roller is used to roll the adhesive tape back and forth, an electric heating wire is disposed in the pinch roller, the electric heating wire is used to heat the adhesive on the adhesive tape, so that the adhesive is combined with the circuit board more tightly, and the pinch roller with heat can soften the adhesive in the adhesive tape when rolling, so that the adhesive tape is attached with the circuit board more tightly under the action of pressure.
According to some embodiments of the invention, in the step of manufacturing the circuit board, the dry film is an electroplating-resistant dry film, and the electroplating-resistant dry film needs to be developed to leave a gap of the second bonding pad.
According to some embodiments of the invention, in the first layer metal treatment step, the wire is etched by dipping the wire in an etching solution using a cotton swab and then repeatedly smearing and rubbing on the root of the wire, and etching the wire by using friction and chemical etching.
According to some embodiments of the invention, in the second layer metal processing step, a knife is applied against an edge of the circuit board to scrape the root of the wire on the first pad, thereby breaking the wire on the first pad.
According to some embodiments of the invention, in the step of tin spraying, the circuit board is placed in an incubator at 8-18 ℃ for 10 minutes after film forming, so that the structural strength of the tin layer is increased.
According to some embodiments of the invention, in the post-treatment step, a piece of water absorbing paper is hung on one side of the circuit board, and a cold air blower is adopted to blow the other side of the circuit board, so that cold air passes through the surface of the circuit board, and the water absorbing paper is used for absorbing water vapor.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic diagram of a first adhesive tape and a dry film attached to a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of a second tape applied to the circuit board shown in FIG. 1;
FIG. 3 is a schematic illustration of a second application of a second tape;
FIG. 4 is a schematic diagram showing the air tap blowing to planarize the solder paste in the leveling step;
FIG. 5 is a schematic structural view of a rectangular second tape;
fig. 6 is a schematic diagram of a blue printing paste.
A wiring board 100, a first pad 110, a second pad 120;
dry film 200, first adhesive tape 300, second adhesive tape 400, blue adhesive 500.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a plurality means one or more, and a plurality means two or more, and it is understood that greater than, less than, exceeding, etc. does not include the present number, and it is understood that greater than, less than, within, etc. include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1 to 6, a comprehensive treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board comprises the following steps:
after the circuit board 100 is etched with the circuit, a first predetermined area of the circuit board 100 is covered with solder resist ink to expose a first bonding pad 110 at the edge of the circuit board 100, and a second predetermined area of the circuit board 100 is covered with a dry film 200 to expose a second bonding pad 120 in the middle of the circuit board 100;
sticking a first adhesive tape 300 on the periphery of a reserved first bonding pad 110, exposing a first bonding pad 110 area needing nickel-palladium-gold deposition after sticking the first adhesive tape 300, cutting out avoidance holes according to design when sticking the first adhesive tape 300, arranging the avoidance holes in one-to-one correspondence with the first bonding pad 110, exposing the first bonding pad 110 from the avoidance holes, wiping the periphery area of the first bonding pad 110 by alcohol when sticking the first adhesive tape 300, heating the adhesive surface of the first adhesive tape 300 in hot air for 1 to 3 seconds, and then sticking the adhesive surface of the first adhesive tape 300 on the periphery of the first bonding pad 110;
a first metal treatment, namely, depositing nickel-palladium-gold on the first bonding pad 110, tearing off the first adhesive tape 300 after the nickel-palladium-gold is deposited, plating gold on the second bonding pad 120, etching the residual wires after the gold plating of the second bonding pad 120 by using etching liquid, removing the dry film 200 in the circuit board, covering the positions, which are not covered by the solder resist ink, on the circuit board 100 with the solder resist ink to leave the second bonding pad 120, performing oxidation layer removal treatment on the surface of the first bonding pad 110 before the nickel-palladium-gold is deposited, wiping the surface of the first bonding pad 110 for 3 to 5 times by using a mixed solution of ammonia water and hydrochloric acid after dipping by using a cotton swab, spraying residual acidic substances on the surface of the first bonding pad 110 towards the edge of the circuit board by using high-pressure water mist, sweeping the positions, which are adhered with the first adhesive tape 300, on the circuit board 100 by using hot air after tearing off the first adhesive tape 300, and then erasing the positions, which are adhered with the first adhesive tape 300 by using sponge;
a second adhesive tape 400 is attached to the peripheries of the first bonding pad 110 and the second bonding pad 120, and the first bonding pad 110 and the second bonding pad 120 are exposed after the second adhesive tape 400 is attached;
a second layer of metal treatment, wherein gold is plated on the first bonding pad 110, a lead is removed by a knife after the first bonding pad 110 is plated with gold, nickel, palladium and gold are plated on the second bonding pad 120, the second adhesive tape 400 is torn off after the second layer of metal treatment is finished, before the second adhesive tape 400 is torn off, the edge of the second adhesive tape 400 is firstly blown by hot air, then the second adhesive tape 400 is shoveled by the knife, and then the second adhesive tape 400 is torn off;
printing blue glue, namely printing blue glue 500 around the first bonding pad 110 and the second bonding pad 120, pre-cutting an avoidance port on the blue glue 500 when the blue glue 500 is pasted, pasting the blue glue 500 on the circuit board 100, covering the edges of the first bonding pad 110 and the second bonding pad 120 by the blue glue 500, and adopting a high-temperature-resistant adhesive tape for the blue glue 500;
tin spraying, namely, a circuit board 100 passes through a tin spraying device, a tin layer is covered on each of a first bonding pad 110 and a second bonding pad 120, and in the tin spraying process, the circuit board with two metal layers manufactured is placed in a drying box, the circuit board 100 is dried in the drying box, and then the circuit board 100 is placed in an electrostatic dust removing box for dust removal;
leveling, namely leveling the solder paste by using hot air after tin spraying, wherein the hot air adopts constraint air and leveling air, the constraint air is used for limiting the solder paste from overflowing, and the leveling air is used for leveling the tip after tin spraying;
after the post-treatment, the circuit board 100 after tin spraying is washed with water and dried.
In the process of manufacturing the circuit board, two different covering layers are manufactured on the same circuit board 100, and the arranged solder resist ink layer and the arranged dry film 200 layer are respectively positioned at corresponding positions on the circuit board 100, so that the subsequent surface treatment of the first bonding pad 110 and the second bonding pad 120 can be simultaneously satisfied, the complicated separate treatment is avoided, and the surface treatment efficiency of the circuit board 100 is improved; in the first tape pasting step, in order to paste the area covered with the edge of the first bonding pad 110 of the solder mask, the solder mask is not damaged when the nickel-palladium-gold is deposited, and because the gold-plated wires of the second bonding pad 120 in the middle area of the circuit board 100 are not well removed, the non-gold-plated area on the circuit board 100 is protected by using the electroplating-resistant dry film 200, the gold-plating of the first bonding pad 110 and the nickel-palladium-gold deposition of the second bonding pad 120 are alternately performed, different surface treatments are concentrated on one circuit board 100, thereby not only ensuring the effective production of the circuit board 100, but also improving the production efficiency of the circuit board 100, and finally, after the first bonding pad 110 and the second bonding pad 120 are processed by the metal layer, the tin spraying is performed on the first bonding pad 110 and the second bonding pad 120, so that the tin spraying of two different circuit structures can be completed at one time on the circuit board 100, and the efficiency is greatly improved. It can be understood that the solder mask layer and the dry film layer in the circuit board are both present on the circuit board 100, because the first bonding pad 110 is at the edge portion of the circuit board 100, and when gold is plated, the gold-plated wire can be connected to the edge of the first bonding pad 110, and then removed by a knife at a later stage; however, if the second bonding pad 120 is simply removed by a knife, the second bonding pad 120 is easily scratched, so that the gold-plated wire on the second bonding pad needs to be etched away by etching solution, so that two different surface coverage protection modes are needed to protect other circuits, solder resist ink and adhesive tape are used to protect other circuits around the first bonding pad 110, the circuit board 100 can be covered with a solder resist layer by the way, and a dry film is needed to protect the periphery of the second bonding pad 120, the dry film can prevent the attack of the circuit board by etching solution, and electroplating can be resisted during electroplating, and the dry film is a plating resisting dry film. It can be appreciated that tin spraying is a common treatment process for circuit boards; in addition, when spraying tin, the electrostatic dust collection is adopted, so that the problem that the tin spraying is not carried out due to dust contamination of the first bonding pad 110 and the second bonding pad 120 is avoided, in addition, the tin paste is leveled by adopting constraint wind and leveling wind, the contact leveling mode is avoided, and the tin layer is prevented from being damaged. The metal layer refers to a nickel palladium gold layer and a gold-plated layer, the blue glue 500 is common glue for circuit boards, and sponge erasing is used for removing the glue remained on the circuit board 100 so as to prevent the blue glue 500 from being jacked up to a cavity or a convex hull when the blue glue 500 is printed next time.
In some embodiments, in the post-treatment step, the circuit board 100 is inclined by the low-pressure water jet so that dust stained on the circuit board 100 is washed away, and then the circuit board 100 is placed in a drying oven, and the circuit board 100 is dried at normal temperature.
Referring to fig. 2, 3 and 5, in the step of taping the second time, the second tape 400 is provided as a rectangular strip-shaped tape, and the second tape 400 is provided with a matching step, and the second tape 400 is overlapped with each other to cover the surrounding areas of the first pad 110 and the second pad 120, it is understood that the rectangular strip-shaped tape is convenient to paste, and compared with a large-sized tape capable of covering the entire circuit board 100, the rectangular strip-shaped tape is more convenient to operate, improves the accuracy of taping, reduces the influence of bubbles, and avoids pasting distortion.
In some embodiments, in the step of applying the second tape, the second tape 400 is removed from the first pad 110 and the second pad 120 after the second tape is applied, and it is understood that when the tape at the solder mask windowing position is removed, the tape at the solder mask windowing position is cut off by a knife, and then the cut tape is picked up by the knife.
In some embodiments, when the first adhesive tape 300 is torn off, the first adhesive tape 300 is baked by hot air above the first adhesive tape 300 through a warm air blowing pipe, then the first adhesive tape 300 is shoveled up by a blade, then the first adhesive tape 300 is dragged and torn off, and the adhesive on the first adhesive tape 300 can be softened through the baking, so that the first adhesive tape 300 can be conveniently torn off.
In some embodiments, after the corresponding adhesive tape is applied in the first adhesive tape applying step and the second adhesive tape applying step, the adhesive tape is rolled back and forth on the adhesive tape by using a pressing roller, an electric heating wire is arranged in the pressing roller, the adhesive on the adhesive tape is heated by using the electric heating wire, so that the adhesive is combined with the circuit board 100 more tightly, the adhesive in the adhesive tape can be softened by the pressing roller with heat when the adhesive tape is rolled, and the adhesive tape is attached to the circuit board 100 more tightly under the action of pressure.
In some embodiments, in the step of manufacturing the circuit board, the dry film 200 is a plating-resistant dry film, and the dry film 200 is developed to leave the empty space of the second pad 120.
In some embodiments, in the first layer metal treatment step, the wire is etched using a cotton swab dipped with an etching solution and then repeatedly smeared and rubbed on the root of the wire, and the wire is etched away using friction and chemical etching.
In some embodiments, in the second metallization step, the knife scrapes the root of the wire on the first pad 110 against the edge of the circuit board 100, thereby breaking the wire on the first pad.
In some embodiments, in the step of tin spraying, the circuit board 100 is kept in an incubator at 8-18 ℃ for 10 minutes after film formation, resulting in an increase in the structural strength of the tin layer.
In some embodiments, in the post-treatment step, a piece of absorbent paper is hung on one side of the circuit board 100, and a cold air blower is used to blow the cold air through the surface of the circuit board 100, where the absorbent paper is used to absorb water vapor, it is understood that the cold air blower blows because the tin layer cannot be excessively heated, and if the tin layer is too much heated, it will be decomposed, and the second bonding pad and the first bonding pad will not be protected.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
1. A comprehensive treatment process for gold plating, nickel-palladium-gold depositing and tin spraying of a circuit board is characterized by comprising the following steps:
manufacturing a circuit board, after etching a circuit on the circuit board (100), exposing a first bonding pad (110) at the edge of the circuit board (100) after covering solder resist ink on a first preset area of the circuit board (100), and then exposing a second bonding pad (120) at the middle part of the circuit board (100) after covering a dry film (200) on a second preset area of the circuit board (100);
sticking a first adhesive tape (300) on the periphery of a reserved first bonding pad (110), cutting out avoidance spaces according to design when sticking the first adhesive tape (300), wherein the avoidance spaces are arranged in one-to-one correspondence with the first bonding pad (110), and the first bonding pad (110) can be exposed from the avoidance spaces;
a first layer of metal treatment, namely plating nickel, palladium and gold on the first bonding pad (110), and tearing off the first adhesive tape (300) after plating the nickel, palladium and gold; the second bonding pad (120) is plated with gold, a wire left after the second bonding pad (120) is plated with gold is etched by etching liquid, then a dry film (200) in the circuit board is removed, the position, which is not covered with solder resist ink, of the circuit board (100) is covered with solder resist ink, the second bonding pad (120) is exposed, after the first adhesive tape (300) is torn off, the position, which is attached to the circuit board (100) and is attached to the first adhesive tape (300), is purged by hot air, and then the position, which is attached to the first adhesive tape (300), is erased by sponge;
a second adhesive tape is stuck on the periphery of the first bonding pad (110) and the second bonding pad (120), and after the second adhesive tape (400) is stuck, the first bonding pad (110) and the second bonding pad (120) are exposed;
a second layer of metal treatment, wherein gold is plated on a first bonding pad (110), a wire is removed by a knife after the first bonding pad (110) is plated with gold, nickel plating palladium gold is deposited on a second bonding pad (120), the second adhesive tape (400) is torn off after the second layer of metal treatment is finished, before the second adhesive tape (400) is torn off, the edge of the second adhesive tape (400) is firstly blown by hot air, then the second adhesive tape (400) is shoveled by the knife, and then the second adhesive tape (400) is torn off;
printing blue glue, namely printing blue glue (500) around the first bonding pad (110) and the second bonding pad (120), and covering the edges of the first bonding pad (110) and the second bonding pad (120) by 0-0.05mm when printing the blue glue (500);
tin spraying, namely, a circuit board (100) passes through a tin spraying device, a tin layer is covered on each of a first bonding pad (110) and a second bonding pad (120), and in the tin spraying process, the circuit board with two metal layers manufactured is placed in a drying oven, and after the circuit board (100) is dried in the drying oven, the circuit board (100) is placed in an electrostatic dust removal box for dust removal;
leveling, namely leveling the solder paste by using hot air after tin spraying, wherein the hot air adopts constraint air and leveling air, the constraint air is used for limiting the solder paste from overflowing, and the leveling air is used for leveling the tip after tin spraying;
and (3) post-treatment, namely washing and drying the circuit board (100) after tin spraying.
2. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the post-treatment step, the circuit board (100) is inclined to pass through low-pressure clear water jet flow, so that dust stained on the circuit board (100) is washed away, the circuit board (100) is placed in a drying box, and the circuit board (100) is dried at normal temperature.
3. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the step of sticking the adhesive tape for the second time, the second adhesive tape (400) is set to be a rectangular strip adhesive tape, and the second adhesive tape (400) is provided with a matching ladder, the second adhesive tape (400) is mutually overlapped to cover the solder mask opening of the first bonding pad (110) and the surrounding area of the solder mask opening of the bonding pad (120), and the second adhesive tape (400) is removed at the positions of the first bonding pad (110) and the second bonding pad (120) after the second adhesive tape (400) is stuck.
4. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: when the first adhesive tape (300) is torn off, a warm air blowing pipe is used for heating and drying the first adhesive tape (300) above, then a blade is used for shoveling the first adhesive tape (300), and then the first adhesive tape (300) is pulled and torn off.
5. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the first adhesive tape sticking and the second adhesive tape sticking steps, after the corresponding adhesive tapes are stuck, a pinch roller is adopted to roll the adhesive tapes back and forth, an electric heating wire is arranged in the pinch roller, and the electric heating wire is utilized to heat the adhesive on the adhesive tapes, so that the adhesive is combined with a circuit board (100) more tightly.
6. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the step of manufacturing the circuit board, the dry film (200) uses an electroplating-resistant dry film, and the electroplating-resistant dry film needs to be developed to leave a vacancy of the second bonding pad (120).
7. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the first metal treatment step, when the wire is etched, the cotton swab is used for dipping etching liquid, then repeatedly smearing and rubbing are carried out on the root of the wire, and the wire is etched and broken by friction and chemical etching.
8. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the second metal treatment step, a knife is attached to the edge of the circuit board (100) to scrape the root of the wire on the first bonding pad (110), thereby breaking the wire on the first bonding pad.
9. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the step of tin spraying, after film formation, the circuit board (100) is placed in an incubator at 8-18 ℃ and kept for 10 minutes, so that the structural strength of the tin layer is increased.
10. The integrated treatment process for plating gold, depositing nickel, palladium and gold and spraying tin on a circuit board according to claim 1, which is characterized in that: in the post-treatment step, water absorbing paper is hung on one side of the circuit board (100), and a cold air blower is adopted on the other side to blow the cold air to pass through the surface of the circuit board (100), wherein the water absorbing paper is used for absorbing water vapor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310797583.4A CN117042318A (en) | 2023-06-30 | 2023-06-30 | Comprehensive treatment process for gold plating, nickel-palladium-gold deposition and tin spraying of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310797583.4A CN117042318A (en) | 2023-06-30 | 2023-06-30 | Comprehensive treatment process for gold plating, nickel-palladium-gold deposition and tin spraying of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117042318A true CN117042318A (en) | 2023-11-10 |
Family
ID=88634315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310797583.4A Pending CN117042318A (en) | 2023-06-30 | 2023-06-30 | Comprehensive treatment process for gold plating, nickel-palladium-gold deposition and tin spraying of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117042318A (en) |
-
2023
- 2023-06-30 CN CN202310797583.4A patent/CN117042318A/en active Pending
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