CN117041756A - Temperature error compensation method for FTTR home gateway BOB module - Google Patents
Temperature error compensation method for FTTR home gateway BOB module Download PDFInfo
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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Abstract
The application provides a temperature error compensation method for a BOB module of an FTTR home gateway, and relates to the technical field of optical network equipment. Aiming at the on-board characteristics of the BOB module, the application firstly realizes temperature monitoring and active heat dissipation control in a machine box, on a main board and on a BOSA device by additionally installing a temperature sensor group and a fan radiator group, realizes temperature real-time acquisition and control real-time processing by an MCU control processing unit, and selects a control strategy according to various temperature data; when the strategy is selected, the control strategy expands the adjustment range of the temperature error compensation of the BOB module by cooperating with the three control strategies, ensures that the equipment is not affected by high temperature, selects the most suitable control strategy for outputting according to different scenes, and can ensure that the network quality of the device is kept stable in real time.
Description
Technical Field
The application relates to the technical field of optical network equipment, in particular to a temperature error compensation method for a BOB module of an FTTR home gateway.
Background
The FTTR technical scheme is that home networking is carried out through optical fiber media, an FTTR main gateway is deployed in a distribution box or a key position, the main gateway is taken as a core, and each FTTR home gateway is connected through an optical splitter and a single-core bidirectional optical fiber to form an FTTR optical network. The FTTR home gateway is used as an edge terminal of the optical network, and the connection stability of the FTTR home gateway and the FTTR main gateway directly influences the quality of the home communication quality. Currently, an FTTR home gateway generally uses an upstream PON port to establish optical signal interfacing with an FTTR main gateway, where the upstream PON port completes connection conversion between an optical signal and an electrical signal through a BOB module.
The BOB module, namely a BOSA On Board (BOSA On Board), is generally composed of a BOB driving chip and a BOSA device (the BOSA device is also arranged in the application), is a technical scheme and a production process of being integrated into zero, and the BOB module enables the design of a circuit Board of a home terminal to be more flexible, is beneficial to reducing the volume of the terminal and is convenient for home installation and placement; the difference between the BOB module and the traditional gateway is the packaging mode of the optical module, namely: the optical module is directly welded on the ONT plate, so that the structure of the product is simplified, the cost of the product is reduced, and the quality of the product is improved.
However, because the FTTR home gateway deployment environment is complex, it cannot be deployed in a stable working environment like the FTTR home gateway; the BOB module is directly arranged on the board and is directly influenced by the factors such as ambient temperature, working heat generation, ventilation condition and the like, so that the temperature range of the working environment of the BOB module is larger and can even reach 80 to 90 degrees; in addition, most of the existing FTTR home gateways adopt a passive heat dissipation mode, the working temperature of the existing FTTR home gateways cannot be actively regulated and controlled, the problem of the working state of the BOSA device serving as an optical precision device is directly affected by the working temperature, factory BOB calibration can only maintain normal working within a certain temperature range, and obvious network fluctuation can occur after the temperature range is exceeded.
Therefore, it is necessary to provide a temperature error compensation method for FTTR home gateway BOB module to solve the above technical problems.
Disclosure of Invention
In order to solve the technical problems, the temperature error compensation method for the BOB module of the FTTR home gateway provided by the application is used for the FTTR home gateway and comprises a gateway equipment installing step, an equipment temperature monitoring step and a temperature error compensation step; wherein,
gateway equipment installs the step additional: a temperature sensor group, a fan radiator group and an MCU control processing unit are additionally arranged on the FTTR home gateway; the temperature sensor group comprises a machine box temperature sensor, an on-board temperature sensor and a BOSA temperature sensor; the fan radiator group comprises a box radiator fan, an on-board radiator fan and a BOSA radiator fan;
and equipment temperature monitoring: acquiring a BOSA optimal working temperature, a BOSA normal working temperature and a BOSA fault working temperature; after the FTTR home gateway is powered on to work, the MCU control processing unit is started, and various temperature data of the FTTR home gateway are collected in real time through the temperature sensor group; wherein, each temperature data comprises a machine box real-time temperature, an on-board real-time temperature and a BOSA real-time temperature;
and temperature error compensation: the MCU control processing unit performs control strategy selection according to various temperature data, and performs control strategy selection again after the current control strategy is completed, until the FTTR home gateway is powered down and turned off; wherein, the control strategy includes: a normal heat dissipation control strategy, a heat dissipation compensation control strategy and a data compensation control strategy.
As a further solution, the machine box temperature sensor is additionally arranged in the machine box of the FTTR home network, the on-board temperature sensor is additionally arranged on the main board of the FTTR home gateway, and the BOSA temperature sensor is additionally arranged on the BOSA device; the box cooling fan is additionally arranged at the air outlet of the box, the on-board cooling fan is additionally arranged on the radiating fins of the main board, and the BOSA cooling fan is additionally arranged on the outer wall of the BOSA device.
As a further solution, the MCU control processing unit synchronously executes the normal heat dissipation control strategy by:
acquiring BOSA real-time temperature: when the BOSA real-time temperature is lower than the BOSA optimal working temperature, BOSA passive heat dissipation is carried out, and a BOSA heat dissipation fan is silent; and when the BOSA real-time temperature exceeds the BOSA optimal working temperature, starting the BOSA cooling fan to conduct BOSA active cooling.
As a further solution, when the normal heat dissipation control strategy cannot control the BOSA real-time temperature requirement, the heat dissipation compensation control strategy is executed by:
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and if the BOSA real-time temperature is not lower than the BOSA normal working temperature, increasing the working power of the BOSA radiator fan until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the BOSA radiator fan is loaded to the maximum working power and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the on-board radiator fan is started to conduct on-board active heat dissipation;
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and if the BOSA real-time temperature is still not lower than the BOSA normal working temperature, increasing the working power of the on-board cooling fan until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the on-board cooling fan is loaded to the maximum working power and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the engine box cooling fan is started to conduct active cooling of the engine box;
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and adding the working power of the cooling fan on the machine box if the BOSA real-time temperature is still not lower than the BOSA normal working temperature until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the box cooling fan is loaded to the maximum working power, and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the fan radiator group is kept to run at the maximum working power, and the cooling compensation control strategy is judged to be incapable of meeting the BOB module temperature error compensation requirement.
As a further solution, when the heat dissipation compensation control strategy cannot meet the BOB module temperature error compensation requirement, the data compensation control strategy is executed by:
acquiring BOSA real-time temperature, and inquiring calibration data corresponding to the BOSA real-time temperature;
loading the calibration data into the BOB driving chip, and recording the time consumption for loading the calibration data;
inputting BOSA real-time temperature, and predicting the BOSA temperature to obtain the BOSA predicted temperature after loading time consumption;
inquiring calibration data corresponding to the BOSA predicted temperature, and preloading the calibration data into a BOB driving chip;
waiting for reaching a loading time consumption corresponding time point, and compensating the data error of the BOSA element at the time point by the BOB driving chip;
repeating the steps until the BOSA real-time temperature falls back to the BOSA normal working temperature or exceeds the BOSA fault working temperature.
As a still further solution, the BOSA predicted temperature is calculated and predicted by the following formula:
；
wherein,predicting the temperature for the next time BOSA, +.>For the BOSA real-time temperature at the current time,for the BOSA real-time temperature of the last moment, < + >>For the heating coefficient of the machine box, < >>Weight influence of the case temperature on the BOSA temperature, +.>，/>The real-time temperature of the machine box at the current moment and the last moment respectively; />Is the heating coefficient of the machine box,weight influence of on-board temperature on BOSA temperature, +.>，/>The real-time temperature on the board at the current moment and the last moment respectively; />Is the interval time between each moment and is equal to the loading time of the calibration data.
As a further solution, before shipment of the FTTR home gateway, the BOSA optimum operating temperature, BOSA normal operating temperature, BOSA fault operating temperature and calibration data are obtained and preloaded by:
setting a working temperature test value of the BOSA element;
acquiring an actual optical parameter value of the BOSA element at the current temperature through an optical instrument;
comparing the actual optical parameter value with the standard optical parameter value to obtain optical parameter error data;
setting a BOSA element and a BOB driving chip combination as a BOB module;
modifying all electric signal parameters in the BOB driving chip, and compensating optical parameter error data until standard optical parameter values are output;
recording the variable quantity of each electric signal parameter in the BOB driving chip at the moment to obtain the calibration data of the current working temperature;
changing the working temperature test value, and repeating the steps to obtain calibration data of the BOSA element at each temperature;
setting the temperature value with the minimum optical parameter error data as the BOSA optimal working temperature; setting the temperature value of the optical parameter error data in the error range as the BOSA normal working temperature, and setting the temperature value of the optical parameter error data exceeding the compensation range of the BOB driving chip as the BOSA fault working temperature; and setting the calibration data and the corresponding temperature as a temperature data comparison table, and preloading the temperature data and the BOSA optimal working temperature, the BOSA normal working temperature and the BOSA fault working temperature into the FTTR home gateway.
As a further solution, when the BOSA real-time temperature is higher than the BOSA fault operating temperature, a BOB module high-temperature alarm strategy is also executed; the high-temperature alarm strategy comprises the following steps: and controlling the FTTR home gateway to send a high-temperature alarm message and a high-temperature control indicator lamp to flash.
Compared with the related art, the temperature error compensation method for the BOB module of the FTTR home gateway has the following beneficial effects:
aiming at the on-board characteristics of the BOB module, the application firstly realizes temperature monitoring and active heat dissipation control in a machine box, on a main board and on a BOSA device by additionally installing a temperature sensor group and a fan radiator group, realizes temperature real-time acquisition and control real-time processing by an MCU control processing unit, and selects a control strategy according to various temperature data; when the strategy is selected, the control strategy expands the adjustment range of the temperature error compensation of the BOB module by cooperating with the three control strategies, ensures that the equipment is not affected by high temperature, selects the most suitable control strategy for outputting according to different scenes, and can ensure that the network quality of the device is kept stable in real time.
Drawings
Fig. 1 is a schematic diagram of a temperature error compensation method for a BOB module of an FTTR home gateway according to the present application.
Detailed Description
The application will be further described with reference to the drawings and embodiments.
As shown in fig. 1, the temperature error compensation method for the BOB module of the FTTR home gateway provided in this embodiment is used for the FTTR home gateway, and includes a gateway device mounting step, a device temperature monitoring step and a temperature error compensation step; wherein,
gateway equipment installs the step additional: a temperature sensor group, a fan radiator group and an MCU control processing unit are additionally arranged on the FTTR home gateway; the temperature sensor group comprises a machine box temperature sensor, an on-board temperature sensor and a BOSA temperature sensor; the fan radiator group comprises a box radiator fan, an on-board radiator fan and a BOSA radiator fan;
and equipment temperature monitoring: acquiring a BOSA optimal working temperature, a BOSA normal working temperature and a BOSA fault working temperature; after the FTTR home gateway is powered on to work, the MCU control processing unit is started, and various temperature data of the FTTR home gateway are collected in real time through the temperature sensor group; wherein, each temperature data comprises a machine box real-time temperature, an on-board real-time temperature and a BOSA real-time temperature;
and temperature error compensation: the MCU control processing unit performs control strategy selection according to various temperature data, and performs control strategy selection again after the current control strategy is completed, until the FTTR home gateway is powered down and turned off; wherein, the control strategy includes: a normal heat dissipation control strategy, a heat dissipation compensation control strategy and a data compensation control strategy.
It should be noted that: the existing FTTR home gateway mostly adopts a passive heat dissipation scheme for cost consideration, and the scheme can meet the general demands of most households on the network. However, after a passive heat dissipation scheme is adopted, the FTTR home gateway works for a period of time, and then certain network fluctuation condition occurs. One of the main reasons is that the BOSA element is greatly affected by temperature, and the optical parameters of the BOSA element are affected to a certain extent due to the thermal expansion effect, which finally appears to be a temperature error condition.
Therefore, in order to meet the high-quality network requirements of users, some FTTR home gateways employ a temperature correction function, for example, the application number is: the application of the application of CN202011304747.8 is to pre-store an initial Wen Buzhi, automatically trigger and call the initial Wen Buzhi after the BOB module is powered on, and re-calibrate the extinction ratio, so as to correct the error calibration flow which originally causes the abnormality of the optical parameters of the BOB module, enable the running program to perform self-correction in the starting process of the net light cat, return to the normal equipment function, and avoid the economic loss caused by batch return rework.
However, the optical parameter anomaly correction by constructing the pre-stored initial Wen Buzhi cannot meet the actual requirement of the FTTR home gateway, and the reason is that: the temperature can influence the BOSA without limiting and adjusting the temperature, so that the adjustable temperature range is too narrow to completely cover the working temperature range of the FTTR home gateway; in addition, since the BOB module is a BOSA On Board (BOSA On Board) scheme, it is affected not only by the temperature itself, but also by the On-Board temperature and the box temperature; therefore, compensation for temperature errors in numerical values alone is far from sufficient.
For this reason, in order to provide better quality home network service, the present embodiment is directed at the on-board feature of the BOB module, and first, temperature monitoring and active heat dissipation control in the box, on the motherboard and on the BOSA device are implemented by adding a temperature sensor group and a fan radiator group, and temperature real-time acquisition and control real-time processing are implemented by the MCU control processing unit, and control policy selection is performed according to each temperature data.
When a strategy is selected, firstly, a normal heat dissipation control strategy is considered to maintain the BOSA element at an optimal working temperature in real time, and when the temperature rises to reach or exceed the BOSA normal working temperature, the working power of the fan radiator group is increased by the heat dissipation compensation control strategy so as to compensate the temperature error; when the maximum working power of the fan radiator group is reached and the temperature rise still cannot be restrained, a data compensation control strategy is considered to correct the deviation of the BOB module in value; the control strategy expands the adjustment range of the temperature error compensation of the BOB module by cooperating with the three control strategies, ensures that the equipment is not affected by high temperature, selects the most suitable control strategy for outputting according to different scenes, and can ensure that the network quality of the device is kept stable in real time.
As a further solution, the machine box temperature sensor is additionally arranged in the machine box of the FTTR home network, the on-board temperature sensor is additionally arranged on the main board of the FTTR home gateway, and the BOSA temperature sensor is additionally arranged on the BOSA device; the box cooling fan is additionally arranged at the air outlet of the box, the on-board cooling fan is additionally arranged on the radiating fins of the main board, and the BOSA cooling fan is additionally arranged on the outer wall of the BOSA device.
As a further solution, the MCU control processing unit synchronously executes the normal heat dissipation control strategy by:
acquiring BOSA real-time temperature: when the BOSA real-time temperature is lower than the BOSA optimal working temperature, BOSA passive heat dissipation is carried out, and a BOSA heat dissipation fan is silent; and when the BOSA real-time temperature exceeds the BOSA optimal working temperature, starting the BOSA cooling fan to conduct BOSA active cooling.
It should be noted that: in the working state, we usually only consider the temperature error of the BOB module caused by high temperature, when the temperature is at the optimal working temperature of the BOSA (or lower value), only the normal passive heat dissipation is needed to be maintained, when the temperature rises so as to deviate from the optimal working temperature of the BOSA, we also only need to start the active heat dissipation of the BOSA by default power to pull back the temperature gently, and the control strategy can meet the operation requirement of the BOB module with low power consumption and is better than the correction of a single comparison table in terms of numerical value.
As a further solution, when the normal heat dissipation control strategy cannot control the BOSA real-time temperature requirement, the heat dissipation compensation control strategy is executed by:
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and if the BOSA real-time temperature is not lower than the BOSA normal working temperature, increasing the working power of the BOSA radiator fan until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the BOSA radiator fan is loaded to the maximum working power and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the on-board radiator fan is started to conduct on-board active heat dissipation;
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and if the BOSA real-time temperature is still not lower than the BOSA normal working temperature, increasing the working power of the on-board cooling fan until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the on-board cooling fan is loaded to the maximum working power and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the engine box cooling fan is started to conduct active cooling of the engine box;
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and adding the working power of the cooling fan on the machine box if the BOSA real-time temperature is still not lower than the BOSA normal working temperature until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the box cooling fan is loaded to the maximum working power, and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the fan radiator group is kept to run at the maximum working power, and the cooling compensation control strategy is judged to be incapable of meeting the BOB module temperature error compensation requirement.
It should be noted that: when the temperature deviates from the normal working temperature of the BOSA, the normal heat dissipation control strategy with default frequency is not capable of controlling the real-time temperature requirement of the BOSA, heat dissipation power is required to be increased to avoid temperature errors, and when the heat dissipation compensation control strategy is carried out, the factors affecting the temperature of the BOB module are firstly analyzed in a targeted mode, so that the influence of heat generated by the BOSA element on the BOB module is understood to be the greatest, the temperature of the BOB module is increased due to heat transfer on the board, and finally the temperature of the BOB module is increased due to the temperature increase in the machine box; and then the step-by-step increasing principle is followed, and the power rising is controlled step by step according to the sequence of the BOSA cooling fan, the on-board cooling fan and the box cooling fan so as to achieve the purposes of lowest power consumption and optimal effect.
As a further solution, when the heat dissipation compensation control strategy cannot meet the BOB module temperature error compensation requirement, the data compensation control strategy is executed by:
acquiring BOSA real-time temperature, and inquiring calibration data corresponding to the BOSA real-time temperature;
loading the calibration data into the BOB driving chip, and recording the time consumption for loading the calibration data;
inputting BOSA real-time temperature, and predicting the BOSA temperature to obtain the BOSA predicted temperature after loading time consumption;
inquiring calibration data corresponding to the BOSA predicted temperature, and preloading the calibration data into a BOB driving chip;
waiting for reaching a loading time consumption corresponding time point, and compensating the data error of the BOSA element at the time point by the BOB driving chip;
repeating the steps until the BOSA real-time temperature falls back to the BOSA normal working temperature or exceeds the BOSA fault working temperature.
It should be noted that: when the heat dissipation compensation control strategy cannot meet the temperature error compensation requirement of the BOB module, the data compensation control strategy is needed, but certain time is consumed when the BOB driving chip loads corresponding calibration data, so that the time consumed by loading is estimated firstly, then the temperature at the time after the time consumed by loading is predicted, and the calibration data corresponding to the BOSA predicted temperature is preloaded into the BOB driving chip, so that more accurate calibration data can be called to carry out temperature error compensation after the time is reached.
As a still further solution, the BOSA predicted temperature is calculated and predicted by the following formula:
；
wherein,predicting the temperature for the next time BOSA, +.>For the BOSA real-time temperature at the current time,for the BOSA real-time temperature of the last moment, < + >>For the heating coefficient of the machine box, < >>Weight influence of the case temperature on the BOSA temperature, +.>，/>The real-time temperature of the machine box at the current moment and the last moment respectively; />Is the heating coefficient of the machine box,weight influence of on-board temperature on BOSA temperature, +.>，/>The real-time temperature on the board at the current moment and the last moment respectively; />Is the interval time between each moment and is equal to the loading time of the calibration data.
It should be noted that: since FTTR home gateway power is not very large and temperature varies linearly, and loading is not very time consuming, on the order of hundred milliseconds to seconds; considering the problems of calculation force demand, response speed, training difficulty and the like of deployment of an intelligent prediction model; therefore, the temperature estimation is performed by adopting an empirical formula, the estimation precision can meet the requirement in the time-consuming loading process, and the temperature estimation method has the advantages of high prediction speed and less occupied resources.
For an empirical formula, temperature data at the next moment is predicted mainly by combining temperature data at the last moment and temperature data at the current moment; wherein,the method is mainly characterized in that the next time is estimated based on the BOSA real-time temperature at the current time and the temperature increment from the last time to the current time, and the premise is that the temperature fluctuation of low-power-consumption equipment is not too large in a short time and the temperature increment at the last time is continued with high probability, and in addition, when the temperature has an inflection point, the temperature passes through the block in the next prediction>Error cancellation is performed. The latter half of the formula is mainly aimed at fitting items of the board and box temperatures so as to reflect the influence of an external heat source on the BOSA temperature, the two influencing factors are regarded as constant temperature heating sources in a short time, the heating sources are estimated through the temperature increment of the last moment and the current moment, the loading time is taken as the heating time of the heating sources, and the approximate influence of the two heating sources on the BOSA temperature at the next moment can be estimated by combining the heating coefficient and the weight coefficient of the relative BOSA, so that the BOSA predicted temperature is obtained.
As a further solution, before shipment of the FTTR home gateway, the BOSA optimum operating temperature, BOSA normal operating temperature, BOSA fault operating temperature and calibration data are obtained and preloaded by:
setting a working temperature test value of the BOSA element;
acquiring an actual optical parameter value of the BOSA element at the current temperature through an optical instrument;
comparing the actual optical parameter value with the standard optical parameter value to obtain optical parameter error data;
setting a BOSA element and a BOB driving chip combination as a BOB module;
modifying all electric signal parameters in the BOB driving chip, and compensating optical parameter error data until standard optical parameter values are output;
recording the variable quantity of each electric signal parameter in the BOB driving chip at the moment to obtain the calibration data of the current working temperature;
changing the working temperature test value, and repeating the steps to obtain calibration data of the BOSA element at each temperature;
setting the temperature value with the minimum optical parameter error data as the BOSA optimal working temperature; setting the temperature value of the optical parameter error data in the error range as the BOSA normal working temperature, and setting the temperature value of the optical parameter error data exceeding the compensation range of the BOB driving chip as the BOSA fault working temperature; and setting the calibration data and the corresponding temperature as a temperature data comparison table, and preloading the temperature data and the BOSA optimal working temperature, the BOSA normal working temperature and the BOSA fault working temperature into the FTTR home gateway.
As a further solution, when the BOSA real-time temperature is higher than the BOSA fault operating temperature, a BOB module high-temperature alarm strategy is also executed; the high-temperature alarm strategy comprises the following steps: and controlling the FTTR home gateway to send a high-temperature alarm message and a high-temperature control indicator lamp to flash.
The foregoing is only illustrative of the present application and is not to be construed as limiting the scope of the application, and all equivalent structures or equivalent flow modifications which may be made by the teachings of the present application and the accompanying drawings or which may be directly or indirectly employed in other related art are within the scope of the application.
Claims (8)
1. The temperature error compensation method for the BOB module of the FTTR home gateway is used for the FTTR home gateway and is characterized by comprising a gateway equipment installing step, an equipment temperature monitoring step and a temperature error compensation step; wherein,
gateway equipment installs the step additional: a temperature sensor group, a fan radiator group and an MCU control processing unit are additionally arranged on the FTTR home gateway; the temperature sensor group comprises a machine box temperature sensor, an on-board temperature sensor and a BOSA temperature sensor; the fan radiator group comprises a box radiator fan, an on-board radiator fan and a BOSA radiator fan;
and equipment temperature monitoring: acquiring a BOSA optimal working temperature, a BOSA normal working temperature and a BOSA fault working temperature; after the FTTR home gateway is powered on to work, the MCU control processing unit is started, and various temperature data of the FTTR home gateway are collected in real time through the temperature sensor group; wherein, each temperature data comprises a machine box real-time temperature, an on-board real-time temperature and a BOSA real-time temperature;
and temperature error compensation: the MCU control processing unit performs control strategy selection according to various temperature data, and performs control strategy selection again after the current control strategy is completed, until the FTTR home gateway is powered down and turned off; wherein, the control strategy includes: a normal heat dissipation control strategy, a heat dissipation compensation control strategy and a data compensation control strategy.
2. The method for compensating for temperature error of a BOB module of an FTTR home gateway according to claim 1, wherein the box temperature sensor is additionally installed in a shutdown box of the FTTR home gateway, the on-board temperature sensor is additionally installed on a motherboard of the FTTR home gateway, and the BOSA temperature sensor is additionally installed on a BOSA device; the box cooling fan is additionally arranged at the air outlet of the box, the on-board cooling fan is additionally arranged on the radiating fins of the main board, and the BOSA cooling fan is additionally arranged on the outer wall of the BOSA device.
3. The method for FTTR home gateway BOB module temperature error compensation according to claim 1, wherein the MCU control processing unit synchronously executes the normal heat dissipation control strategy by:
acquiring BOSA real-time temperature: when the BOSA real-time temperature is lower than the BOSA optimal working temperature, BOSA passive heat dissipation is carried out, and a BOSA heat dissipation fan is silent; and when the BOSA real-time temperature exceeds the BOSA optimal working temperature, starting the BOSA cooling fan to conduct BOSA active cooling.
4. The method for FTTR home gateway BOB module temperature error compensation according to claim 2, wherein when the normal heat dissipation control strategy cannot control the BOSA real-time temperature requirement, the heat dissipation compensation control strategy is executed by:
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and if the BOSA real-time temperature is not lower than the BOSA normal working temperature, increasing the working power of the BOSA radiator fan until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the BOSA radiator fan is loaded to the maximum working power and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the on-board radiator fan is started to conduct on-board active heat dissipation;
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and if the BOSA real-time temperature is still not lower than the BOSA normal working temperature, increasing the working power of the on-board cooling fan until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the on-board cooling fan is loaded to the maximum working power and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the engine box cooling fan is started to conduct active cooling of the engine box;
acquiring the BOSA real-time temperature, continuously comparing the BOSA real-time temperature with the BOSA normal working temperature, and adding the working power of the cooling fan on the machine box if the BOSA real-time temperature is still not lower than the BOSA normal working temperature until the BOSA real-time temperature is lower than the BOSA normal working temperature; when the box cooling fan is loaded to the maximum working power, and the BOSA real-time temperature is not lower than the BOSA normal working temperature, the fan radiator group is kept to run at the maximum working power, and the cooling compensation control strategy is judged to be incapable of meeting the BOB module temperature error compensation requirement.
5. The method for FTTR home gateway BOB module temperature error compensation according to claim 2, wherein when the heat dissipation compensation control policy cannot meet the BOB module temperature error compensation requirement, the data compensation control policy is executed by:
acquiring BOSA real-time temperature, and inquiring calibration data corresponding to the BOSA real-time temperature;
loading the calibration data into the BOB driving chip, and recording the time consumption for loading the calibration data;
inputting BOSA real-time temperature, and predicting the BOSA temperature to obtain the BOSA predicted temperature after loading time consumption;
inquiring calibration data corresponding to the BOSA predicted temperature, and preloading the calibration data into a BOB driving chip;
waiting for reaching a loading time consumption corresponding time point, and compensating the data error of the BOSA element at the time point by the BOB driving chip;
repeating the steps until the BOSA real-time temperature falls back to the BOSA normal working temperature or exceeds the BOSA fault working temperature.
6. The method of claim 5, wherein the BOSA predicted temperature is calculated and predicted by the following equation:
；
wherein,predicting the temperature for the next time BOSA, +.>For the BOSA real-time temperature at the current moment, +.>For the BOSA real-time temperature of the last moment, < + >>For the heating coefficient of the machine box, < >>Weight influence of the case temperature on the BOSA temperature, +.>，/>The real-time temperature of the machine box at the current moment and the last moment respectively; />For the heating coefficient of the machine box, < >>Weight influence of on-board temperature on BOSA temperature, +.>，/>The real-time temperature on the board at the current moment and the last moment respectively; />Is the interval time between each moment and is equal to the loading time of the calibration data.
7. The method for FTTR home gateway BOB module temperature error compensation according to claim 5, wherein before shipment of the FTTR home gateway, the BOSA optimum operation temperature, the BOSA normal operation temperature, the BOSA fault operation temperature and the calibration data are obtained and preloaded by:
setting a working temperature test value of the BOSA element;
acquiring an actual optical parameter value of the BOSA element at the current temperature through an optical instrument;
comparing the actual optical parameter value with the standard optical parameter value to obtain optical parameter error data;
setting a BOSA element and a BOB driving chip combination as a BOB module;
modifying all electric signal parameters in the BOB driving chip, and compensating optical parameter error data until standard optical parameter values are output;
recording the variable quantity of each electric signal parameter in the BOB driving chip at the moment to obtain the calibration data of the current working temperature;
changing the working temperature test value, and repeating the steps to obtain calibration data of the BOSA element at each temperature;
setting the temperature value with the minimum optical parameter error data as the BOSA optimal working temperature; setting the temperature value of the optical parameter error data in the error range as the BOSA normal working temperature, and setting the temperature value of the optical parameter error data exceeding the compensation range of the BOB driving chip as the BOSA fault working temperature; and setting the calibration data and the corresponding temperature as a temperature data comparison table, and preloading the temperature data and the BOSA optimal working temperature, the BOSA normal working temperature and the BOSA fault working temperature into the FTTR home gateway.
8. The method for temperature error compensation of a BOB module of an FTTR home gateway according to claim 1, wherein when the BOSA real-time temperature is higher than the BOSA fault operation temperature, a BOB module high-temperature alarm strategy is also executed; the high-temperature alarm strategy comprises the following steps: and controlling the FTTR home gateway to send a high-temperature alarm message and a high-temperature control indicator lamp to flash.
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