CN117038657A - Light source structure, backlight module and display device - Google Patents

Light source structure, backlight module and display device Download PDF

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Publication number
CN117038657A
CN117038657A CN202311034191.9A CN202311034191A CN117038657A CN 117038657 A CN117038657 A CN 117038657A CN 202311034191 A CN202311034191 A CN 202311034191A CN 117038657 A CN117038657 A CN 117038657A
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China
Prior art keywords
light
transmitting
light source
source structure
layer
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CN202311034191.9A
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Chinese (zh)
Inventor
朋朝明
文勇兵
邹文聪
陈伟雄
侯亚荣
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Shenzhen Skyworth RGB Electronics Co Ltd
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Shenzhen Skyworth RGB Electronics Co Ltd
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Priority to CN202311034191.9A priority Critical patent/CN117038657A/en
Publication of CN117038657A publication Critical patent/CN117038657A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention discloses a light source structure, a backlight module and display equipment, wherein the light source structure comprises a mounting seat and a light transmission structure, and an LED chip is arranged on the mounting seat; the light-transmitting structure is arranged on the mounting seat and is coated with the LED chip, the light-transmitting structure comprises at least two light-transmitting layers which are arranged layer by layer in the light-emitting direction of the light source structure, and the refractive indexes of the at least two light-transmitting layers are gradually decreased along the light-emitting direction; an interface is formed between the at least two light-transmitting layers, and the interface is in convex-concave arrangement. By arranging the convex-concave interface surface, the light energy emitted by the LED chip is subjected to forced light mixing at the interface, so that the required light mixing distance of the LED chip is reduced, and the ultrathin requirement of a product can be met.

Description

Light source structure, backlight module and display device
Technical Field
The invention relates to the technical field of LED display, in particular to a light source structure, a backlight module and display equipment.
Background
MiniLED is also called as a hundred-micron-sized light-emitting diode, is a novel LED display technology derived on the basis of small-pitch LEDs in recent years, is a transition technology between a traditional LED and a Micro LED, has pixel size and preparation difficulty between the traditional LED and the Micro LED, and is an improved version of the traditional LED backlight. The current industry considers that the chip size of 200-300 microns can be called MiniLED, compared with other display technologies, the Mini LED inherits the characteristics of high efficiency, high brightness, high reliability, quick response time and the like of an inorganic LED, and in addition, the Mini LED has the characteristics of energy conservation, simple mechanism, small volume and the like. However, at present, LEDs are all characterized by langbo-type luminous intensity, and have the distribution characteristics of strong middle light intensity and strong and weak side light intensity, and a sufficient light mixing distance is needed to meet the requirement of uniform light emission, so that the ultrathin requirement of products cannot be met.
Disclosure of Invention
The invention mainly aims to provide a light source structure, a backlight module and display equipment, and aims to solve the problem that the ultrathin requirement of a product cannot be met due to the fact that the light mixing distance required by the conventional LED is large.
In order to achieve the above object, the present invention provides a light source structure comprising:
the mounting seat is provided with an LED chip;
the light-transmitting structure is arranged on the mounting seat and is coated with the LED chip, the light-transmitting structure comprises at least two light-transmitting layers which are arranged layer by layer in the light-emitting direction of the light source structure, and the refractive indexes of the at least two light-transmitting layers are gradually decreased along the light-emitting direction;
an interface is formed between the at least two light-transmitting layers, and the interface is in convex-concave arrangement.
Optionally, the light-transmitting layer is provided with three layers, and refractive indexes of the three layers of light-transmitting layers are gradually decreased along the light-emitting direction;
one of the light-transmitting layers is arranged as a fluorescent glue layer.
Optionally, the fluorescent glue layer coats the LED chip.
Optionally, in the light emitting direction of the light source structure, the light-transmitting layer located on the outer layer is arranged in a protruding manner.
Optionally, one of the at least two light-transmitting layers has a refractive index n 1 The refractive index of the other layer is n 2 Wherein n is 1.65.ltoreq.n 1 Not more than 1.8, and/or, 1.4 not more than n 2 ≤1.5。
Optionally, the mounting base is formed with a mounting protrusion, and the mounting protrusion is formed with a plurality of side mounting surfaces;
the LED chips are arranged in a plurality, and are respectively and correspondingly arranged on the side mounting surfaces.
Optionally, the mounting seat is formed with a mounting groove, the mounting protrusion is formed on the bottom wall of the mounting groove, the side wall of the mounting groove is adjacent to the plurality of side mounting surfaces, and the light-transmitting structure is arranged in the mounting groove; and/or the number of the groups of groups,
the mounting boss is further formed with a top mounting surface on which the LED chip is further provided.
Optionally, the plurality of LED chips includes at least one blue light chip and at least one green light chip.
In order to achieve the above object, the backlight module provided by the present invention includes the light source structure described in any one of the above, where the light source structure includes:
the mounting seat is provided with an LED chip;
the light-transmitting structure is arranged on the mounting seat and is coated with the LED chip, the light-transmitting structure comprises at least two light-transmitting layers which are arranged layer by layer in the light-emitting direction of the light source structure, and the refractive indexes of the at least two light-transmitting layers are gradually decreased along the light-emitting direction;
an interface is formed between the at least two light-transmitting layers, and the interface is in convex-concave arrangement.
In order to achieve the above object, a display device according to the present invention includes a backlight module according to any one of the above embodiments.
According to the technical scheme provided by the invention, the light-transmitting structure is arranged on the outer side of the LED chip, and the light-transmitting structure comprises two light-transmitting layers which are arranged in a layer-by-layer manner, and as the refractive indexes of the two light-transmitting layers decrease along the light-emitting direction, light emitted by the LED chip is subjected to at least two times of refraction in the process of being diffused to the external environment through the light-transmitting structure, so that a larger diffusion angle can be obtained; meanwhile, as the boundary surface between the at least two light-transmitting layers is in convex-concave arrangement, in the divergence angle range of the LED chip, the inclination degree of the boundary surface is continuously changed, so that light emitted by the LED chip is refracted towards all directions when passing through the boundary surface, the effect of forced light mixing can be achieved, the light is more uniform, the light mixing distance is greatly reduced, the ultrathin requirement of a product can be met, the divergence angle of the LED chip can be further increased, the light scattering effect of the light source structure is further improved, the use quantity of the light source structure in the backlight module is reduced, and the production cost of the product is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of an embodiment of a light source structure according to the present invention;
FIG. 2 is a schematic view of the light source structure (excluding the light transmissive structure) in FIG. 1;
fig. 3 is a schematic view of a part of the light-transmitting structure and the interface in fig. 1.
Reference numerals illustrate:
reference numerals Name of the name Reference numerals Name of the name
100 Light source structure 3 Light-transmitting structure
1 Mounting base 31 Light-transmitting layer
11 Mounting boss 31a First light-transmitting layer
111 Side mounting surface 31b Second light-transmitting layer
112 Roof mounting surface 31c Fluorescent layer
12 Mounting groove 311 Interface surface
2 LED chip
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the case where a directional instruction is involved in the embodiment of the present invention, the directional instruction is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional instruction is changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
MiniLED is also called as a hundred-micron-sized light-emitting diode, is a novel LED display technology derived on the basis of small-pitch LEDs in recent years, is a transition technology between a traditional LED and a Micro LED, has pixel size and preparation difficulty between the traditional LED and the Micro LED, and is an improved version of the traditional LED backlight. The current industry considers that the chip size of 200-300 microns can be called MiniLED, compared with other display technologies, the Mini LED inherits the characteristics of high efficiency, high brightness, high reliability, quick response time and the like of an inorganic LED, and in addition, the Mini LED has the characteristics of energy conservation, simple mechanism, small volume and the like. However, at present, LEDs are all characterized by langbo-type luminous intensity, and have the distribution characteristics of strong middle light intensity and strong and weak side light intensity, and a sufficient light mixing distance is needed to meet the requirement of uniform light emission, so that the ultrathin requirement of products cannot be met.
In view of the above, the present invention provides a light source structure, which aims to solve the problem that the existing LED has a large light mixing distance and cannot meet the ultrathin requirement of the product, wherein fig. 1 is a schematic cross-sectional structure of an embodiment of the light source structure provided by the present invention; FIG. 2 is a schematic view of the light source structure (excluding the light transmissive structure) in FIG. 1; fig. 3 is a schematic view of a part of the light-transmitting structure and the interface in fig. 1.
Referring to fig. 1 to 2, the light source structure 100 includes a mounting base 1 and a light-transmitting structure 3: the mounting seat 1 is provided with an LED chip 2; the light-transmitting structure 3 is arranged on the mounting seat 1 and is used for coating the LED chip 2, the light-transmitting structure 3 comprises at least two light-transmitting layers 31 which are arranged in a layer-by-layer manner in the light-emitting direction of the light source structure 100, and the refractive indexes of the at least two light-transmitting layers 31 are arranged in a decreasing manner along the light-emitting direction; wherein, an interface 311 is formed between the at least two light-transmitting layers 31, and the interface 311 is in convex-concave arrangement.
The shape and the material of the mounting base 1 may be selected in various ways, as long as the LED chip 2 can be supported and mounted, and the light-transmitting structure 3 is covered on the surface thereof, which is not limited in this embodiment; the light-transmitting structure 3 includes at least two light-transmitting layers 31 stacked on each other, and it can be understood that the number of the light-transmitting layers 31 may be two, three, or more; the material of the light-transmitting structure 3 may have various choices, so long as the light-transmitting structure has a light-transmitting effect, and meanwhile, the shape of the light-transmitting structure 3 may have various choices, so long as the effect that the final divergence angle of the LED chip 2 becomes large can be achieved; the convex-concave arrangement of the interface 311 means that some local areas of the interface 311 are concavely arranged in the direction of the LED chip 2, and other local areas of the interface 311 are convexly arranged along the light emitting direction of the LED chip 2, and it is understood that the convexly arranged areas are adjacently arranged with the concaved areas and are continuously arranged within the range corresponding to the light emitting angle of the LED chip 2.
According to the technical scheme provided by the invention, the light-transmitting structure 3 is arranged on the outer side of the LED chip 2, and the light-transmitting structure 3 comprises two layers of light-transmitting layers 31 which are arranged in a layer-by-layer manner, and as the refractive indexes of the two layers of light-transmitting layers 31 decrease along the light-emitting direction, light emitted by the LED chip 2 is subjected to at least two times of refraction in the process of being diffused to the external environment through the light-transmitting structure 3, so that a larger diffusion angle can be obtained; meanwhile, as the interface 311 between the at least two light-transmitting layers 31 is in a convex-concave arrangement, in the divergence angle range of the LED chip 2, the inclination degree of the interface 311 is continuously changed, so that when the light emitted by the LED chip 2 passes through the interface 311, the light is refracted towards all directions, on the one hand, the effect of forced light mixing can be achieved, on the other hand, the light emitting distance is greatly reduced, the ultrathin requirement of a product can be met, on the other hand, the divergence angle of the LED chip 2 can be further increased, the astigmatism effect of the light source structure 100 is further improved, and on the other hand, the increase of the divergence angle means the reduction of the use quantity of the light source structure 100 in the backlight module, and the production cost of the product is saved.
The shapes of the interface 311 are various, specifically, the interface 311 may be sinusoidal, and may also be in a zigzag shape, and now, as an example of the interface 311 being in a zigzag shape, referring to fig. 3, in this embodiment, the at least two light-transmitting layers 31 include a first light-transmitting layer 31a and a second light-transmitting layer 31b, and the refractive index of the second light-transmitting layer 31b is smaller than that of the first light-transmitting layer 31a, where when the light a is collimated and incident on the zigzag segment with a smaller inclination on the interface 311, the outgoing direction and the incident direction are consistent, and no deviation occurs; when the light b is collimated and incident on the folded line section with larger inclination degree on the interface 311, the light b is firstly totally reflected in the first light-transmitting layer 31a to the folded line section with smaller inclination degree, is incident on the second light-transmitting layer 31b after being refracted for the first time, is emitted to the external environment after being refracted for the second time, and is deflected for the third time in the whole process, so that wide-angle light emission is realized, the brightness of the periphery can be supplemented by the light emitted by the middle part, and uniform light emission is facilitated; when the light ray c enters the fold line section with smaller inclination degree on the interface 311 at the positive viewing angle, the light ray c is reflected twice and then exits from the positive viewing angle to the external environment, so that wide-angle light emission is realized; when the light ray d enters the folded line segment with larger inclination degree on the interface 311 along the front view angle, the light ray d exits to the external environment along the collimation direction after being sequentially refracted through the interface 311, so that the brightness of the central view angle is compensated, and uniform light emission is facilitated.
The white light generated by the LED is generally formed by mixing the light generated by the LED chip 2 and the light generated by the fluorescent powder excited by the LED chip 2, where the fluorescent powder may be disposed on the backlight module or on the LED light source, specifically, in this embodiment, the light-transmitting layer 31 is three layers, and the refractive indexes of the three layers of light-transmitting layer 31 are progressively reduced along the light-emitting direction; one of the light-transmitting layers 31 is provided as a fluorescent glue layer. It can be understood that there is no mutual limitation between the refraction of light transmission and fluorescence, so the light transmission layer 31 may be a fluorescent layer 31c, and the fluorescent layer 31c is set to one of the three light transmission layers 31, so that the light can excite the fluorescent powder in the fluorescent layer 31c to emit light while being refracted and mixed by the light transmission structure 3, and white light can be emitted by mixing.
The material selection of the fluorescent layer 31c needs to be determined according to the material characteristics of the fluorescent layer, in general, the fluorescent layer 31c has three types of silica gel selection, namely high-refraction silica gel, medium-refraction silica gel and low-refraction silica gel, wherein most of the illumination products with medium and small power generally use high-refraction silica gel, and in the direct type products with high backlight power generally use medium-refraction silica gel, so that the problem of glue cracking caused by the working heat of the LED chip 2 can be effectively avoided.
The fluorescent layer 31c may be disposed on a first layer (innermost layer), a second layer, or even a third layer (outermost layer) along the light emitting direction, and its specific disposition position may be selected in various ways, specifically, in this embodiment, the fluorescent adhesive layer is disposed to cover the LED chip 2. That is, the fluorescent layer 31c is arranged at the innermost layer along the light emitting direction, and the thickness of the fluorescent layer 31c affects the color of the final light, so that the fluorescent layer is coated on the LED chip 2 to obtain stable white light more easily by controlling the thickness of the fluorescent layer 31c, the light emitting quality can be preferentially ensured, the two light transmitting layers 31 on the outer side can be reprocessed on the basis, the interface 311 between the two light transmitting layers is formed, and the fluorescent layer 31c can be coated to avoid damage.
In order to further improve the effect of the light-transmitting structure 3 on the light-emitting angle of the LED chip 2, in this embodiment, in the light-emitting direction of the light source structure 100, the light-transmitting layer 31 on the outer layer is arranged in a protruding manner, so that the incident angle of light entering the light-transmitting layer 31 and the external interface 311 can be increased, and the exit angle of light is further increased, so that the further expansion of the light-emitting angle of the LED chip 2 is realized, and the light scattering effect is further improved.
Since the refractive indexes of the at least two light-transmitting layers 31 are progressively reduced along the light-emitting direction, the refractive indexes of the respective light-transmitting layers 31 are selected to be plural, so long as the refractive index of the light-transmitting layer 31 at the outer layer is smaller than the refractive index of the light-transmitting layer 31 at the inner layer, in this embodiment, the refractive index of one of the at least two light-transmitting layers 31 isn 1 The refractive index of the other layer is n 2 Wherein n is 1.65.ltoreq.n 1 Not more than 1.8, and/or, 1.4 not more than n 2 Less than or equal to 1.5. Refractive index n of one layer 1 Is arranged between 1.65 and 1.8, and has a moderate range, wherein the refractive index n 1 Can be selected to be 1.65, 1.7, 1.75 or 1.8, but can also be any value in the above intervals, and the refractive index n in the embodiment 1 The specific numerical values of (2) are not limited; refractive index n of another layer 2 Is arranged between 1.4 and 1.5, and has a moderate range, wherein the refractive index n 2 Can be selected to be 1.4, 1.45 or 1.5, and can be any value in the above intervals, and the refractive index n in the embodiment 2 The specific numerical value of (2) is not limited.
By providing the light-transmitting structure 3, the light-emitting angle can be increased, so as to realize uniform light emission, and in order to obtain a more uniform light-emitting effect, the LED chip 2 can also be designed, specifically, in this embodiment, the mounting base 1 is formed with a mounting protrusion 11, and the mounting protrusion 11 is formed with a plurality of side mounting surfaces 111; the LED chips 2 are provided in plural numbers and are provided correspondingly to the side mounting surfaces 111. By providing the LED chips 2 on the respective side mounting surfaces 111, the placement angle values of the LED chips 2 can be changed, and the light can be emitted around the mounting convex portions 11, which improves the overall luminous flux of the light source structure 100, and thus makes the light source structure more suitable for a backlight product with a large power, and on the other hand, the light emitting overall composed of the LED chips 2 mounted on the plurality of side mounting surfaces 111 corresponds to an active increase in the light emitting angle, and the wide-angle effect of the light source structure 100 can be further improved.
Furthermore, in the present embodiment, the mounting base 1 is formed with a mounting groove 12, the mounting protrusion 11 is formed on a bottom wall of the mounting groove 12, a side wall of the mounting groove 12 is disposed adjacent to the plurality of side mounting surfaces 111, and the light-transmitting structure 3 is disposed in the mounting groove 12. The mounting groove 12 can provide a mounting base for the light-transmitting structure 3, and the side walls of the mounting groove 12 are adjacent to the plurality of side mounting surfaces 111, so that light emitted from the side mounting surfaces 111 can be reflected towards the light-emitting direction, and a good wide-angle light-emitting effect can be obtained under the refraction effect of the light-transmitting structure 3.
Furthermore, in the present embodiment, the mounting boss 11 is also formed with a top mounting surface 112, and the LED chip 2 is further provided on the top mounting surface 112. By arranging the LED chip 2 on the top mounting surface 112, the LED chip 2 at the top overlaps with the light emitted by the LED chip 2 at the side at the langerhans edge position, so that the light intensities of the top and the side can be balanced, and the effect of uniform light intensity between the center and the edge can be achieved while the wide-angle light emitting effect is achieved.
The above two parallel technical features "the mounting base 1 is formed with a mounting groove 12, the mounting protrusion 11 is formed on the bottom wall of the mounting groove 12, the side walls of the mounting groove 12 are disposed adjacent to the plurality of side mounting surfaces 111, the light-transmitting structure 3 is disposed in the mounting groove 12" and "the mounting protrusion 11 is further formed with a top mounting surface 112, and the top mounting surface 112 is further provided with the LED chip 2" which may be alternatively disposed or may be disposed simultaneously, and it is obvious that the effect of the simultaneous disposition is more.
The specifications of the LED chip 2 on the top mounting surface 112 and the LED chip 2 on the side mounting surface 111 may be set to be different, and by adjusting the light emitting intensity of the LED chip 2 on the top, the light emitting energy can be flexibly controlled, which is beneficial to quickly realizing overall high-uniformity light emission.
At present, most of high-color-gamut LEDs in the industry use a common blue (B) chip to excite red (R) fluorescent powder and green (G) fluorescent powder so as to achieve the purposes of improving the color gamut and mixing white light, and the B+RG mode is the most common in the industry and is limited by the characteristics (wavelength, half-wave width, concentration and the like) of the green fluorescent powder, so that the color gamut of the LEDs in the B+RG light-emitting mode can not be optimized any more at present so as to improve the color gamut in a further step.
In view of this, in the present embodiment, the plurality of LED chips 2 includes at least one blue light chip and at least one green light chip. The blue light chip and the green light chip are combined to emit light, and the red fluorescent layers are arranged outside the LED chips 2 to convert, so that a light emitting mode of BG+R can be formed to generate white light.
In addition, in order to achieve the above objective, the present invention further provides a backlight module, which includes the light source structure 100 described in the above technical scheme. It should be noted that, the detailed structure of the light source structure 100 of the backlight module may refer to the embodiment of the light source structure 100 described above, and will not be described herein again; because the light source structure 100 is used in the backlight module of the present invention, embodiments of the backlight module of the present invention include all technical solutions of all embodiments of the light source structure 100, and the achieved technical effects are identical, and are not described herein again.
In addition, in order to achieve the above purpose, the invention also provides a display device, which comprises the backlight module set in the technical scheme. It should be noted that, the detailed structure of the backlight module of the display device may refer to the embodiment of the backlight module, and will not be described herein again; because the backlight module is used in the display device of the present invention, embodiments of the display device of the present invention include all technical solutions of all embodiments of the backlight module, and the achieved technical effects are identical, and are not described in detail herein. Including but not limited to televisions, computer monitors, advertising screens, etc.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the specification and drawings of the present invention or direct/indirect application in other related technical fields are included in the scope of the present invention.

Claims (10)

1. A light source structure, comprising:
the mounting seat is provided with an LED chip;
the light-transmitting structure is arranged on the mounting seat and is coated with the LED chip, the light-transmitting structure comprises at least two light-transmitting layers which are arranged layer by layer in the light-emitting direction of the light source structure, and the refractive indexes of the at least two light-transmitting layers are gradually decreased along the light-emitting direction;
an interface is formed between the at least two light-transmitting layers, and the interface is in convex-concave arrangement.
2. The light source structure according to claim 1, wherein the light-transmitting layer is provided with three layers, and refractive indexes of the three layers of light-transmitting layers are arranged in a decreasing manner along the light-emitting direction;
one of the light-transmitting layers is arranged as a fluorescent glue layer.
3. The light source structure of claim 2, wherein the phosphor glue layer encapsulates the LED die arrangement.
4. The light source structure according to claim 1, wherein the light-transmitting layer in the outer layer is provided in a convex shape in a light-emitting direction of the light source structure.
5. The light source structure of claim 1, wherein one of the at least two light-transmitting layers has a refractive index n 1 The refractive index of the other layer is n 2 Wherein n is 1.65.ltoreq.n 1 Not more than 1.8, and/or, 1.4 not more than n 2 ≤1.5。
6. The light source structure according to claim 1, wherein the mounting base is formed with a mounting projection formed with a plurality of side mounting surfaces;
the LED chips are arranged in a plurality, and are respectively and correspondingly arranged on the side mounting surfaces.
7. The light source structure according to claim 6, wherein the mount is formed with a mounting groove, the mounting projection is formed on a bottom wall of the mounting groove, a side wall of the mounting groove is disposed adjacent to the plurality of side mounting surfaces, and the light-transmitting structure is disposed in the mounting groove; and/or the number of the groups of groups,
the mounting boss is further formed with a top mounting surface on which the LED chip is further provided.
8. The light source structure of claim 6, wherein the plurality of LED chips comprises at least one blue light chip and at least one green light chip.
9. A backlight module comprising a light source structure according to any one of claims 1 to 8.
10. A display device comprising the backlight module of claim 9.
CN202311034191.9A 2023-08-15 2023-08-15 Light source structure, backlight module and display device Pending CN117038657A (en)

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