CN117036532A - Wafer map generation method and device, electronic equipment and storage medium - Google Patents

Wafer map generation method and device, electronic equipment and storage medium Download PDF

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Publication number
CN117036532A
CN117036532A CN202311302048.3A CN202311302048A CN117036532A CN 117036532 A CN117036532 A CN 117036532A CN 202311302048 A CN202311302048 A CN 202311302048A CN 117036532 A CN117036532 A CN 117036532A
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Prior art keywords
chip
wafer
legend
target
chips
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CN202311302048.3A
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Chinese (zh)
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CN117036532B (en
Inventor
李婷婷
周伟航
马晓迪
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Hangzhou Chipwing Technology Co ltd
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Hangzhou Chipwing Technology Co ltd
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Priority to CN202311302048.3A priority Critical patent/CN117036532B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/002D [Two Dimensional] image generation
    • G06T11/001Texturing; Colouring; Generation of texture or colour
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0481Interaction techniques based on graphical user interfaces [GUI] based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0484Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
    • G06F3/04845Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range for image manipulation, e.g. dragging, rotation, expansion or change of colour
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0484Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
    • G06F3/0486Drag-and-drop
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/002D [Two Dimensional] image generation
    • G06T11/60Editing figures and text; Combining figures or text

Abstract

The application provides a wafer map generation method, a device, electronic equipment and a storage medium, wherein the method comprises the following steps: acquiring test data of a plurality of chips on a target wafer, and generating a chart set of the target wafer according to the test data of the plurality of chips, wherein the chart set comprises: and a chip color pattern of the plurality of chips, wherein the plurality of chips are respectively mounted with: and the chip cursor event is used for carrying out three-dimensional image rendering according to the chart set of the target wafer, generating a wafer chart of the target wafer, displaying chip data of the target chip on the wafer chart based on the chip cursor event aiming at the target chip in the wafer chart, wherein the chip data comprises: test data of the target chip. By mounting the chip cursor event on the chip, the wafer map generated by rendering provides rich interaction capability, and by adopting the scheme, the smooth interactivity can be maintained on the premise of supporting the rendering of a large amount of data.

Description

Wafer map generation method and device, electronic equipment and storage medium
Technical Field
The present application relates to the field of data display technologies, and in particular, to a method and apparatus for generating a wafer map, an electronic device, and a storage medium.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, and a silicon wafer, namely the wafer, is formed after a silicon crystal bar is ground, polished and sliced.
At present, after a wafer is tested, massive wafer test data are often generated, and a static picture is usually generated from a visual result of the wafer test data for a user to browse, however, the display of the static picture is relatively dead and lacks of dynamic interactivity.
Disclosure of Invention
In view of the above, the embodiments of the present application provide a wafer map generating method, apparatus, electronic device and storage medium, so as to solve the problem that the display of static pictures of wafer album test data is relatively dead and lacks dynamic interactivity.
In a first aspect, an embodiment of the present application provides a method for generating a wafer map, including:
acquiring test data of a plurality of chips on a target wafer;
generating a chart set of the target wafer according to the test data of the chips, wherein the chart set comprises: the chip color patterns of the plurality of chips are respectively mounted with: a chip cursor event;
Performing image rendering according to the chart set of the target wafer, and generating a wafer chart of the target wafer so as to display chip data of the target chip on the wafer chart based on a chip cursor event aiming at the target chip in the wafer chart, wherein the chip data comprises: and the test data of the target chip.
In an alternative embodiment, the generating the chart set of the target wafer according to the test data of the plurality of chips includes:
determining the chip color of each chip according to the test data of each chip;
acquiring a chip color pattern of each chip according to the chip color of each chip;
and generating a chart set of the target wafer according to the chip color patterns of the chips.
In an optional embodiment, the obtaining the chip color pattern of each chip according to the chip color of each chip includes:
and determining the chip color pattern of each chip from the color patterns of a plurality of colors cached on a preset canvas according to the chip color of each chip.
In an alternative embodiment, the chart set is loaded with a plurality of interaction events, the method further comprising:
Judging whether the target interaction event belongs to the plurality of interaction events according to the target interaction event aiming at the wafer map;
and if the target interaction event belongs to the interaction events, performing interaction operation corresponding to the target interaction event on the wafer map.
In an optional embodiment, before the image rendering is performed according to the chart set of the target wafer and the wafer chart of the target wafer is generated, the method further includes:
generating a legend set of the target wafer according to the chip colors of the plurality of chips, wherein the legend set comprises: a legend element for the plurality of chips, the legend element carrying: a legend click event and a legend cursor event, the legend elements comprising: legend color graphics and legend text;
and performing image rendering according to the chart set of the target wafer to generate a wafer chart of the target wafer, wherein the method comprises the following steps:
and performing image rendering according to the chart set and the legend set, generating the wafer map, displaying or hiding the chip color graph corresponding to the first legend element in the wafer map based on the legend clicking event aiming at the first legend element in the wafer map, and adjusting the display style of the chip color graph corresponding to the second legend element in the wafer map based on the legend cursor event aiming at the second legend element.
In an alternative embodiment, the generating the set of legends of the target wafer according to the chip colors of the plurality of chips includes:
determining a legend color of the plurality of chips according to the chip colors of the plurality of chips;
respectively generating legend color graphs of the chips according to the legend colors of the chips and preset legend graphs;
and generating the legend group according to the legend color figures of the chips and the legend characters of the chips.
In an optional embodiment, before the image rendering is performed according to the chart set of the target wafer and the wafer chart of the target wafer is generated, the method further includes:
generating an initial image of the target wafer according to the layout of the chips on the target wafer;
if the initial image does not meet the preset shape, stretching the initial image so that the stretched initial image meets the preset shape;
and performing image rendering according to the chart set of the target wafer to generate a wafer chart of the target wafer, wherein the method comprises the following steps:
and performing image rendering on the stretched initial image according to the chart set to generate the wafer chart.
In a second aspect, an embodiment of the present application further provides a wafer map generating apparatus, including:
the acquisition module is used for acquiring test data of a plurality of chips on the target wafer;
the generating module is configured to generate a chart set of the target wafer according to the test data of the plurality of chips, where the chart set includes: the chip color patterns of the plurality of chips are respectively mounted with: a chip cursor event;
the generating module is further configured to perform image rendering according to the graph group of the target wafer, and generate a wafer map of the target wafer, so as to display test data of the target chip on the wafer map based on a chip cursor event for the target chip in the wafer map.
In an alternative embodiment, the generating module is specifically configured to:
determining the chip color of each chip according to the test data of each chip;
acquiring a chip color pattern of each chip according to the chip color of each chip;
and generating a chart set of the target wafer according to the chip color patterns of the chips.
In an alternative embodiment, the generating module is specifically configured to:
And determining the chip color pattern of each chip from the color patterns of a plurality of colors cached on a preset canvas according to the chip color of each chip.
In an alternative embodiment, the chart set is loaded with a plurality of interaction events, and the apparatus further comprises:
the judging module is used for judging whether the target interaction event belongs to the plurality of interaction events according to the target interaction event aiming at the wafer map;
and the processing module is used for carrying out interaction operation corresponding to the target interaction event on the wafer map if the target interaction event belongs to the plurality of interaction events.
In an alternative embodiment, the generating module is further configured to:
generating a legend set of the target wafer according to the chip colors of the plurality of chips, wherein the legend set comprises: a legend element for the plurality of chips, the legend element carrying: a legend click event and a legend cursor event, the legend elements comprising: legend color graphics and legend text;
the generating module is specifically configured to:
and performing image rendering according to the chart set and the legend set, generating the wafer map, displaying or hiding the chip color graph corresponding to the first legend element in the wafer map based on the legend clicking event aiming at the first legend element in the wafer map, and adjusting the display style of the chip color graph corresponding to the second legend element in the wafer map based on the legend cursor event aiming at the second legend element.
In an alternative embodiment, the generating module is specifically configured to:
determining a legend color of the plurality of chips according to the chip colors of the plurality of chips;
respectively generating legend color graphs of the chips according to the legend colors of the chips and preset legend graphs;
and generating the legend group according to the legend color figures of the chips and the legend characters of the chips.
In an alternative embodiment, the generating module is further configured to:
generating an initial image of the target wafer according to the layout of the chips on the target wafer;
the processing module is further configured to stretch the initial image if the initial image does not satisfy a preset shape, so that the stretched initial image satisfies the preset shape;
the generating module is specifically configured to:
and performing image rendering on the stretched initial image according to the chart set to generate the wafer chart.
In a third aspect, an embodiment of the present application further provides an electronic device, including: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor in communication with the memory over the bus when the electronic device is running, the processor executing the machine-readable instructions to perform the wafer map generation method of any of the first aspects.
In a fourth aspect, an embodiment of the present application further provides a computer readable storage medium, where a computer program is stored, where the computer program when executed by a processor performs the wafer map generating method according to any one of the first aspects.
The application provides a wafer map generation method, a device, electronic equipment and a storage medium, wherein the method comprises the following steps: acquiring test data of a plurality of chips on a target wafer, and generating a chart set of the target wafer according to the test data of the plurality of chips, wherein the chart set comprises: and a chip color pattern of the plurality of chips, wherein the plurality of chips are respectively mounted with: and the chip cursor event is used for carrying out image rendering according to the chart set of the target wafer, generating a wafer chart of the target wafer, displaying chip data of the target chip on the wafer chart based on the chip cursor event aiming at the target chip in the wafer chart, wherein the chip data comprises: test data of the target chip. By mounting the chip cursor event on the chip, the wafer map generated by rendering provides rich interaction capability, and by adopting the scheme, the smooth interactivity can be maintained on the premise of supporting the rendering of a large amount of data.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart illustrating a wafer map generation method according to an embodiment of the present application;
FIG. 2 is a second flowchart of a wafer map generating method according to an embodiment of the present application;
fig. 3 is a flowchart illustrating a method for generating a wafer map according to an embodiment of the present application;
fig. 4 is a flowchart illustrating a wafer map generating method according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a wafer map rendering process according to an embodiment of the present application;
fig. 6 is a flowchart of a wafer map generating method according to an embodiment of the present application;
fig. 7 is a flowchart illustrating a wafer map generating method according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of a wafer map generating apparatus according to an embodiment of the present application;
Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
In general, a still picture is generated from a visual result of wafer test data for a user to browse in order to cope with a situation of massive data, but the still picture is insufficient in that dynamic interactivity is lacking, and when partial operations such as zooming are performed, phenomena such as blurring may occur due to the fact that the picture itself is a bitmap. Based on this, a dynamic interaction scheme is also provided at present, and a common implementation manner includes a third party data visualization library such as ECharts, highcharts, and by using a chart of a thermodynamic diagram or the like in the third party data visualization library, the visualization of wafer data can be realized. However, these class libraries present significant performance problems in processing data renderings above the hundred thousand levels, especially in processing big data, where the interaction is stuck, not smooth, and even results in browser crashes.
In the integrated circuit field, the visualization process of the wafer test data needs to display complete data, so that the rendering performance cannot be improved in a manner such as downsampling, and the existing technology cannot render a large amount of data at low cost while maintaining good performance and interactive experience.
Based on the method, aiming at the characteristic of large visual data volume of the wafer and the requirements of various man-machine interactions such as rotation, mirror image overturning, amplifying and shrinking, displaying information of a certain chip when a mouse passes through the chip, mapping the chip by using a legend and the like, the wafer map generated by rendering provides rich interaction capability through mounting interaction events, and compared with the prior art, the method can maintain smooth interaction on the premise of supporting a large amount of data rendering.
Fig. 1 is a schematic flow chart of a wafer map generation method according to an embodiment of the present application, where an execution body of the embodiment may be an electronic device, such as a terminal device, a server, or the like.
As shown in fig. 1, the method may include:
s101, acquiring test data of a plurality of chips on a target wafer.
The target wafer is provided with a plurality of chips, and when the target wafer is tested by chip testing, the test data of the chips on the target wafer can be obtained, wherein the target wafer can be tested by a preset test item, and the test data of the chips on the target wafer aiming at the preset test item can be obtained.
S102, generating a chart group of the target wafer according to the test data of the chips.
The test data and the chip color have a certain mapping relationship, for example, the test data is 1, the chip color is red, the test data is 2, and the chip color is yellow.
According to the test data of each chip, the mapping relation is queried, the chip color of each chip can be determined, and then the chip color pattern of each chip is determined according to the chip color of each chip, wherein the chip color pattern is a preset pattern filled with the chip color, and the preset pattern can be rectangular, for example.
Generating a chart set of the target wafer according to the chip color patterns of the plurality of chips, wherein the chart set comprises: and a chip color pattern of a plurality of chips, wherein the plurality of chips are respectively mounted with: the chip cursor event is used for indicating the chip data of the display chip when the cursor passes through the chip, and in addition, the chip color graph of the chip can be displayed in a preset display mode when the cursor passes through the chip, and the preset display mode can be highlighting, for example.
And S103, performing image rendering according to the chart set of the target wafer, and generating a wafer chart of the target wafer so as to display chip data of the target chip on the wafer chart based on a chip cursor event aiming at the target chip in the wafer chart.
And performing image rendering according to the chart set of the target wafer to generate a wafer chart of the target wafer, if a chip cursor event aiming at a target chip in the wafer chart is received on the basis of the wafer chart, displaying chip data of the target chip on the wafer chart based on the chip cursor event aiming at the target chip, wherein the chip data comprises: test data of the target chip.
That is, based on the rendering of the wafer map, the chip data of the target chip is displayed superimposed on the wafer map based on the chip cursor event for the target chip, and the chip data may further include: identification of the target chip, model, etc.
In some embodiments, the chip data for the target chip may be displayed in a pop-up window, and the chip color graphic for the target chip may also be highlighted based on the chip cursor event for the target chip.
In some embodiments, a web graphic library (Web Graphics Library, webGL) technology may be used to perform image rendering on a preset canvas according to a chart set, and generate a wafer map of a target wafer, so as to generate a mapping relationship between data and an image, and the association between the interaction event and the image is realized through the mapping between the data and the image.
In the wafer map generation method of the present embodiment, test data of a plurality of chips on a target wafer is obtained, and a graph group of the target wafer is generated according to the test data of the plurality of chips, where the graph group includes: and a chip color pattern of the plurality of chips, wherein the plurality of chips are respectively mounted with: and the chip cursor event is used for carrying out image rendering according to the chart set of the target wafer, generating a wafer chart of the target wafer, displaying chip data of the target chip on the wafer chart based on the chip cursor event aiming at the target chip in the wafer chart, wherein the chip data comprises: test data of the target chip. By mounting the chip cursor event on the chip, the wafer map generated by rendering provides rich interaction capability, and by adopting the scheme, the smooth interactivity can be maintained on the premise of supporting the rendering of a large amount of data.
Fig. 2 is a second flowchart of a wafer map generation method according to an embodiment of the present application, as shown in fig. 2, in an alternative implementation, step S102, generating a map set of a target wafer according to test data of a plurality of chips may include:
s201, determining the chip color of each chip according to the test data of each chip.
The test data and the chip color have a certain mapping relation, and the chip color of each chip can be determined by inquiring the mapping relation according to the test data of each chip.
S202, obtaining a chip color pattern of each chip according to the chip color of each chip.
And drawing a chip color pattern of each chip according to the chip color of each chip, wherein the chip color pattern is a preset pattern filled with the corresponding chip color, and the preset pattern can be rectangular, for example.
In an alternative embodiment, obtaining a chip color pattern of each chip according to a chip color of each chip includes:
and determining the chip color graph of each chip from the color graphs of a plurality of colors cached on the preset canvas according to the chip color of each chip.
The color graphics are preset graphics filled with corresponding colors, and the preset graphics can be rectangular, for example.
And determining the chip color pattern of each chip from the color patterns of a plurality of colors cached on a preset canvas according to the color information of each chip, for example, determining the color information of the chip as red, and determining the red pattern as the chip color pattern if the preset canvas is cached with the red pattern.
In the embodiment, by caching the color graphics of a plurality of colors, when the wafer graphics are rendered, the corresponding color graphics are repeatedly used according to the color information of the chip, so that the performance cost of shape drawing is reduced, the cache graphics are used in the rendering process to save the rendering cost, and finally, the purposes of saving the rendering time, optimizing the performance and providing rich interaction capability are achieved.
S203, generating a chart set of the target wafer according to the chip color patterns of the chips.
The set of charts for the target wafer includes: and a chip color pattern of the plurality of chips.
In the wafer map generation method of the present embodiment, the chip color of each chip is determined according to the test data of each chip, the chip color pattern of each chip is obtained according to the chip color of each chip, and the map group of the target wafer is generated according to the chip color patterns of the plurality of chips. The chart group is generated through data processing, and smooth interactivity can be maintained on the premise of supporting a large amount of data rendering.
Fig. 3 is a flowchart illustrating a third method for generating a wafer map according to an embodiment of the present application, as shown in fig. 3, in an alternative implementation, a chart set is loaded with a plurality of interaction events, where the method may further include:
S301, judging whether the target interaction event belongs to a plurality of interaction events according to the target interaction event aiming at the wafer map.
S302, if the target interaction event belongs to a plurality of interaction events, performing interaction operation corresponding to the target interaction event on the wafer map.
The chart set is populated with a plurality of interactivity events, which may include: a drag event, a zoom event, a rotate event, a mirror flip event, etc., wherein the drag event may be a click drag event, and the zoom event may include: scroll zoom event and drag zoom event.
And receiving a target interaction event aiming at the wafer map, judging whether the target interaction event belongs to a plurality of interaction events mounted on the chart set, and if the target interaction event belongs to a plurality of interaction events mounted on the chart set, performing interaction operation corresponding to the target interaction event on the wafer map.
For example, the target interaction event is a drag event, and the corresponding interaction operation is to drag the wafer map to drag and move the wafer map, and for example, the target interaction event is a zoom event, and the corresponding interaction operation is to zoom the wafer map.
It should be noted that, when the target interaction event is triggered, the scaling amount or the offset of the wafer map may also be calculated by triggering the end position and the start position of the cursor of the target interaction event, so as to perform the scaling operation or the drag movement operation on the wafer map. The end position and the start position of the cursor triggering the target interaction event can be obtained according to the fact that the cursor mounted on the preset canvas passes through a canvas event, and the fact that the cursor passes through the canvas event can be understood as an event that the cursor position is obtained when the cursor passes through the preset canvas.
In the wafer map generation method of the embodiment, the wafer map provides richer interaction capability by mounting the interaction event on the chart set, and by adopting the scheme, the smooth interaction can be maintained on the premise of supporting a large amount of data rendering.
Fig. 4 is a flowchart of a wafer map generation method according to an embodiment of the present application, as shown in fig. 4, in an optional implementation manner, step S103, performing image rendering according to a graph group of a target wafer, before generating a wafer map of the target wafer, the method may further include:
s401, generating a legend group of the target wafer according to the chip colors of the chips.
The legend can be understood as descriptions of the contents and indexes represented by various symbols and colors concentrated on one corner or one side of the wafer map, which is helpful for better understanding of the wafer map.
For a chip, the legend color is consistent with the chip color, the legend color of the chip is determined according to the chip color of each chip, and then a legend color graph of each chip is generated according to the legend color of each chip, wherein the legend color graph is a preset graph filled with the legend color, and the preset graph can be a rounded rectangle, for example.
Generating a legend element of the plurality of chips according to the legend color graph of the plurality of chips and the legend text of the plurality of chips, wherein the legend element comprises: legend color graphics and legend text, and generating a legend set comprising: legend elements for multiple chips.
The legend characters are the characters of the chip corresponding to the legend color graph, for example, the identification, the model number, the test data and the like of the chip can be included, and the legend characters can be arranged in the legend color graph or can be arranged at the periphery of the legend color graph.
Legend element carries: and when the legend clicking event is used for indicating clicking the legend element, the display state of the corresponding chip color graph is adjusted, namely the legend element is clicked, so that the chip color graph is switched between the display state and the hidden state.
The legend cursor event is used to adjust the display style of the corresponding chip color graphic, such as highlighting the chip color graphic, when the cursor is indicated to pass through the legend element.
In some embodiments, the test data and the chip color have a certain mapping relationship, so that the legend color can be determined according to the test data, the mapping relationship between the test data and the legend color can be established, the legend color graph and the legend text can be created, and the legend group can be generated.
Step S103, performing image rendering according to the graph group of the target wafer to generate a wafer graph of the target wafer, including:
and S402, performing image rendering according to the chart set and the legend set, generating a wafer map, displaying or hiding a chip color graph corresponding to a first legend element in the wafer map based on a legend click event for the first legend element in the wafer map, and adjusting a display style of the chip color graph corresponding to a second legend element in the wafer map based on a legend cursor event for the second legend element.
And performing image rendering according to the chart set and the legend set to generate a wafer map, if a chip cursor event aiming at a target chip in the wafer map is received on the basis of the wafer map, displaying chip data of the target chip on the wafer map based on the chip cursor event aiming at the target chip, wherein the chip data comprises: test data of the target chip.
If a legend clicking event for a first legend element in the wafer map is received, displaying or hiding a chip color graph corresponding to the first legend element on the wafer map based on the legend clicking event.
If a legend cursor event for a second legend element in the wafer map is received, based on the legend cursor event, adjusting a display style of a chip color graphic corresponding to the second legend element in the wafer map, for example, highlighting the chip color graphic.
In some embodiments, a preset canvas is created, a chart set and a legend set are added to the preset canvas, image rendering is performed on the preset canvas according to the chart set and the legend set by using a WebGL technology, and a wafer map of a target wafer is generated, so that a mapping relation between data and images is generated, and association between interaction events and images is achieved through the mapping between the data and the images.
Fig. 5 is a schematic diagram of a wafer map rendering process according to an embodiment of the present application, as shown in fig. 5, color information of each chip is corresponding to a color group, a plurality of graphic elements corresponding to the color information, that is, chip color graphics, are included in the color group, the color group is added to a chart group to generate a chart group, the chart group includes a plurality of chart elements, that is, chart color graphics, the chart group and the chart group are added to a preset canvas, thereby processing data into a tree structure, rendering a data tree using WebGL technology, generating a mapping relationship between the data and an image, and realizing association of an interaction event and the image through the mapping between the data and the image.
In the wafer map generation method of the embodiment, image rendering is performed according to the chart group and the legend group, so that the wafer map is generated, man-machine interaction based on the legend mapping chip is realized, and the legend clicking event and the legend cursor event are mounted on the legend elements, so that the wafer map generated by rendering provides rich interaction capability, and by adopting the scheme, the smooth interactivity can be maintained on the premise of supporting a large amount of data rendering.
Fig. 6 is a flowchart fifth of a wafer map generation method according to an embodiment of the present application, as shown in fig. 6, in an alternative implementation, step S401, generating a legend set of a target wafer according to chip colors of a plurality of chips may include:
s501, determining the legend colors of the chips according to the chip colors of the chips.
S502, respectively generating legend color patterns of the chips according to legend colors of the chips and preset legend patterns.
The chip color of each chip is consistent with the legend color of each chip, the legend color graph of each chip is drawn according to the legend color of each chip and a preset legend graph, the legend color graph is a preset legend graph filled with the legend color, the preset legend graph can be a round corner rectangle, and the legend color graph of each chip is generated.
S503, generating a legend group according to the legend color patterns of the chips and legend characters of the chips.
The legend elements for each chip include: the method comprises the steps of generating a legend element of each chip according to a legend color graph of each chip and legend characters of each chip, wherein the legend group comprises: legend elements for multiple chips.
In the wafer map generation method of the present embodiment, the legend colors of the plurality of chips are determined according to the chip colors of the plurality of chips, the legend color patterns of the plurality of chips are respectively generated according to the legend colors of the plurality of chips and the preset legend patterns, and the legend groups are generated according to the legend color patterns of the plurality of chips and the legend characters of the plurality of chips. The legend group is generated through data processing, and smooth interactivity can be maintained on the premise of supporting a large amount of data rendering.
Fig. 7 is a flowchart sixth of a wafer map generation method according to an embodiment of the present application, as shown in fig. 7, in an optional implementation manner, in step S103, image rendering is performed according to a graph group of a target wafer, and before generating a wafer map of the target wafer, the method may further include:
s601, generating an initial image of the target wafer according to the layout of a plurality of chips on the target wafer.
The layout of the chips on the target wafer may be a serial number in an x-axis direction of the target wafer and a serial number in a y-axis direction of the target wafer, where the x-axis direction of the target wafer is a transverse direction based on a center of the target wafer, the y-axis direction is a longitudinal direction based on the center of the target wafer, the serial number of the chips in the x-axis direction of the target wafer may be, for example, 3 th, and the serial number in the y-axis direction of the target wafer may be, for example, 4 th.
According to the layout of the plurality of chips on the target wafer, the number of chips in the x-axis direction and the number of chips in the y-axis direction of the target wafer can be determined, and an initial image of the target wafer can be generated based on the number of chips in the x-axis direction and the number of chips in the y-axis direction, wherein the width of the initial image in the x-axis direction is the product of the number of chips in the x-axis direction and the preset width, the height of the initial image in the y-axis direction is the product of the number of chips in the y-axis direction and the preset height, and the preset width is the length of the preset chip pattern and the preset height is the width of the preset chip pattern.
S602, if the initial image does not meet the preset shape, stretching the initial image so that the stretched initial image meets the preset shape.
If the initial image does not meet the preset shape, the preset shape is a circle, and the shape of the generated initial image can be an ellipse according to the layout of the plurality of chips on the target wafer, and the initial image is stretched because the initial image does not meet the preset shape, so that the stretched initial image meets the preset shape.
In some embodiments, from the total width and height of the initial image, a maximum value of the width and height of the initial image may be determined, and then from the maximum value, a stretch ratio is calculated, and the initial image is stretched based on the stretch ratio, such that the stretched initial image is circular.
Step S103, performing image rendering according to the graph group of the target wafer, to generate a wafer graph of the target wafer, which may include:
and S603, performing image rendering on the stretched initial image according to the chart set to generate a wafer chart.
On the basis of the stretched initial image, performing image rendering on the stretched initial image according to the chart set to generate a wafer chart of the target wafer, and if a chip cursor event aiming at a target chip in the wafer chart is received, displaying chip data of the target chip on the wafer chart based on the chip cursor event aiming at the target chip, wherein the chip data comprises: test data of the target chip.
In addition, the image rendering can be carried out on the stretched initial image according to the chart set and the legend set to generate a wafer map.
In the wafer map generation method of the embodiment, the initial image is processed according to the characteristic that the wafer is in the preset shape, and on the premise of supporting a large amount of data rendering, the smooth interactivity can be maintained.
Based on the above examples, the technical solutions of the present application and the prior art are compared in terms of technical performance, interaction support, and the following in combination with tables 1 to 2.
TABLE 1
As shown in table 1, taking 19 ten thousand chips on a wafer as an example, the chip test data is rendered into a still picture, the required time is 3.1 seconds, and no interaction capability exists; the time required for rendering the wafer map according to the third party data visualization library is 40 seconds, not Chang Kadu; the time required for rendering the wafer map by adopting the scheme is 3.8 seconds and is slightly stuck.
Scheme interaction mode Still picture scheme Third party data visualization library scheme The proposal is that
Highlighting cursors through chip and displaying related data Not support Support for Support for
Mouse drag Not support Support for Support for
Roller enlarging and reducing Not support Support for Support for
Region enlargement, reduction, revocation Not support Support for Support for
Rotation visualization results Not support Not support Support for
Mirror image flip visualization results Not support Not support Support for
Derived as pictures Not support Support for Support for
Modifying legend color Not support Support for Support for
Clicking the legend to correspond to chip display and hiding Not support Support for Support for
Displaying the outline of the outer ring of the wafer Not support Not support Support for
Displaying wafer notch orientation Not support Not support Support for
Showing the XY self-increasing direction of the wafer Not support Not support Support for
TABLE 2
As can be seen from table 2, the still picture obtained by adopting the still picture scheme does not support all the above interaction modes; the wafer map rendered by adopting the third party data visualization library scheme does not support a rotation visualization result, a mirror image overturning visualization result, a wafer outer ring outline display, a wafer notch direction display and a wafer XY self-increasing direction display; the wafer map obtained by the scheme supports all the interaction modes.
In summary, through the rendering test on different wafer data, the rendering speed and the interaction fluency of the scheme are obviously superior to those of the third party data visualization library with interactivity as well, and compared with a static picture, the method realizes richer interaction capability on the premise of hardly increasing the rendering time.
Fig. 8 is a schematic structural diagram of a wafer map generating apparatus according to an embodiment of the present application, where the apparatus may be integrated in an electronic device.
As shown in fig. 8, the apparatus may include:
an acquiring module 701, configured to acquire test data of a plurality of chips on a target wafer;
the generating module 702 is configured to generate a chart set of the target wafer according to the test data of the plurality of chips, where the chart set includes: and a chip color pattern of the plurality of chips, wherein the plurality of chips are respectively mounted with: a chip cursor event;
the generating module 702 is further configured to perform image rendering according to the graph set of the target wafer, and generate a wafer map of the target wafer, so as to display test data of the target chip in the wafer map based on a chip cursor event for the target chip in the wafer map.
In an alternative embodiment, the generating module 702 is specifically configured to:
determining the chip color of each chip according to the test data of each chip;
Acquiring a chip color pattern of each chip according to the chip color of each chip;
and generating a chart group of the target wafer according to the chip color patterns of the plurality of chips.
In an alternative embodiment, the generating module 702 is specifically configured to:
and determining the chip color graph of each chip from the color graphs of a plurality of colors cached on the preset canvas according to the chip color of each chip.
In an alternative embodiment, the chart set is loaded with a plurality of interaction events, the apparatus further comprising:
a judging module 703, configured to judge whether the target interaction event belongs to a plurality of interaction events according to the target interaction event for the wafer map;
and the processing module 704 is configured to perform an interaction operation corresponding to the target interaction event on the wafer map if the target interaction event belongs to the plurality of interaction events.
In an alternative embodiment, the generating module 702 is further configured to:
generating a legend group of the target wafer according to the chip colors of the plurality of chips, wherein the legend group comprises: legend elements for the plurality of chips, the legend elements carrying: a legend click event and a legend cursor event, the legend elements including: legend color graphics and legend text;
the generating module 702 is specifically configured to:
And performing image rendering according to the chart set and the legend set, generating a wafer map, displaying or hiding the chip color graph corresponding to the first legend element in the wafer map based on the legend click event aiming at the first legend element in the wafer map, and adjusting the display style of the chip color graph corresponding to the second legend element in the wafer map based on the legend cursor event aiming at the second legend element.
In an alternative embodiment, the generating module 702 is specifically configured to:
determining a legend color of the plurality of chips according to the chip colors of the plurality of chips;
respectively generating legend color graphs of the chips according to the legend colors of the chips and preset legend graphs;
and generating a legend group according to the legend color patterns of the chips and the legend characters of the chips.
In an alternative embodiment, the generating module 702 is further configured to:
generating an initial image of the target wafer according to the layout of the chips on the target wafer;
the processing module is further used for stretching the initial image if the initial image does not meet the preset shape, so that the stretched initial image meets the preset shape;
the generating module 702 is specifically configured to:
And performing image rendering on the stretched initial image according to the chart set to generate a wafer chart.
The process flow of each module in the apparatus and the interaction flow between the modules may be described with reference to the related descriptions in the above method embodiments, which are not described in detail herein.
Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application, as shown in fig. 9, where the device may include: comprising the following steps: the wafer map generation system comprises a processor 801, a memory 802 and a bus 803, wherein the memory 802 stores machine-readable instructions executable by the processor 801, and when the electronic device is running, the processor 801 and the memory 802 communicate through the bus 803, and the processor 801 executes the machine-readable instructions to execute the wafer map generation method.
The embodiment of the application also provides a computer readable storage medium, and the computer readable storage medium stores a computer program which is executed by a processor when the computer program is executed by the processor, and the processor executes the wafer map generation method.
In an embodiment of the present application, the computer program may further execute other machine readable instructions when executed by a processor to perform the method as described in other embodiments, and the specific implementation of the method steps and principles are referred to in the description of the embodiments and are not described in detail herein.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments provided in the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
It should be noted that: like reference numerals and letters in the following figures denote like items, and thus once an item is defined in one figure, no further definition or explanation of it is required in the following figures, and furthermore, the terms "first," "second," "third," etc. are used merely to distinguish one description from another and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above examples are only specific embodiments of the present application, and are not intended to limit the scope of the present application, but it should be understood by those skilled in the art that the present application is not limited thereto, and that the present application is described in detail with reference to the foregoing examples: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or perform equivalent substitution of some of the technical features, while remaining within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the corresponding technical solutions. Are intended to be encompassed within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The wafer map generation method is characterized by comprising the following steps of:
acquiring test data of a plurality of chips on a target wafer;
generating a chart set of the target wafer according to the test data of the chips, wherein the chart set comprises: the chip color patterns of the plurality of chips are respectively mounted with: a chip cursor event;
Performing image rendering according to the chart set of the target wafer, and generating a wafer chart of the target wafer so as to display chip data of the target chip on the wafer chart based on a chip cursor event aiming at the target chip in the wafer chart, wherein the chip data comprises: and the test data of the target chip.
2. The method of claim 1, wherein generating the set of charts of the target wafer based on the test data of the plurality of chips comprises:
determining the chip color of each chip according to the test data of each chip;
acquiring a chip color pattern of each chip according to the chip color of each chip;
and generating a chart set of the target wafer according to the chip color patterns of the chips.
3. The method of claim 2, wherein the obtaining the chip color pattern of each chip according to the chip color of each chip comprises:
and determining the chip color pattern of each chip from the color patterns of a plurality of colors cached on a preset canvas according to the chip color of each chip.
4. The method of claim 1, wherein the chart set is populated with a plurality of interaction events, the method further comprising:
Judging whether the target interaction event belongs to the plurality of interaction events according to the target interaction event aiming at the wafer map;
and if the target interaction event belongs to the interaction events, performing interaction operation corresponding to the target interaction event on the wafer map.
5. The method of claim 2, wherein the image rendering is performed from the set of charts of the target wafer, and wherein prior to generating the wafer map of the target wafer, the method further comprises:
generating a legend set of the target wafer according to the chip colors of the plurality of chips, wherein the legend set comprises: a legend element for the plurality of chips, the legend element carrying: a legend click event and a legend cursor event, the legend elements comprising: legend color graphics and legend text;
and performing image rendering according to the chart set of the target wafer to generate a wafer chart of the target wafer, wherein the method comprises the following steps:
and performing image rendering according to the chart set and the legend set, generating the wafer map, displaying or hiding the chip color graph corresponding to the first legend element in the wafer map based on the legend clicking event aiming at the first legend element in the wafer map, and adjusting the display style of the chip color graph corresponding to the second legend element in the wafer map based on the legend cursor event aiming at the second legend element.
6. The method of claim 5, wherein generating the set of legends for the target wafer based on the chip colors of the plurality of chips comprises:
determining a legend color of the plurality of chips according to the chip colors of the plurality of chips;
respectively generating legend color graphs of the chips according to the legend colors of the chips and preset legend graphs;
and generating the legend group according to the legend color figures of the chips and the legend characters of the chips.
7. The method of claim 1, wherein the image rendering is performed from the set of charts of the target wafer, and wherein prior to generating the wafer map of the target wafer, the method further comprises:
generating an initial image of the target wafer according to the layout of the chips on the target wafer;
if the initial image does not meet the preset shape, stretching the initial image so that the stretched initial image meets the preset shape;
and performing image rendering according to the chart set of the target wafer to generate a wafer chart of the target wafer, wherein the method comprises the following steps:
and performing image rendering on the stretched initial image according to the chart set to generate the wafer chart.
8. A wafer map generating apparatus, comprising:
the acquisition module is used for acquiring test data of a plurality of chips on the target wafer;
the generating module is configured to generate a chart set of the target wafer according to the test data of the plurality of chips, where the chart set includes: the chip color patterns of the plurality of chips are respectively mounted with: a chip cursor event;
the generating module is further configured to perform image rendering according to the graph group of the target wafer, and generate a wafer map of the target wafer, so as to display test data of the target chip on the wafer map based on a chip cursor event for the target chip in the wafer map.
9. An electronic device, comprising: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory in communication over the bus when the electronic device is running, the processor executing the machine-readable instructions to perform the wafer map generation method of any of claims 1 to 7.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when executed by a processor, performs the wafer map generation method of any of claims 1 to 7.
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