CN117029695A - Material width measuring method and device - Google Patents
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- CN117029695A CN117029695A CN202311287198.1A CN202311287198A CN117029695A CN 117029695 A CN117029695 A CN 117029695A CN 202311287198 A CN202311287198 A CN 202311287198A CN 117029695 A CN117029695 A CN 117029695A
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- 239000000463 material Substances 0.000 title claims abstract description 148
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000013077 target material Substances 0.000 claims abstract description 63
- 238000005259 measurement Methods 0.000 claims abstract description 13
- 238000000691 measurement method Methods 0.000 claims description 18
- 238000003384 imaging method Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 238000004590 computer program Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
- B23Q17/2471—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces of workpieces
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Geometry (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The embodiment of the specification provides a material width measuring method and a device, wherein the material width measuring method comprises the following steps: acquiring a first image of the calibration material through a first camera device, and acquiring a second image of the calibration material through a second camera device; determining a target resolution based on the first image and the second image; acquiring a third image of the target material through the first image pickup device, and acquiring a fourth image of the target material through the second image pickup device; a material width of the target material is determined based on the target resolution, the third image, and the fourth image. Acquiring a first image of the calibration material through a first camera device, and acquiring a second image of the calibration material through a second camera device; determining a target resolution based on the first image and the second image; the material width of the target material is determined based on the target resolution, the third image and the fourth image, so that the distortion of the material width measurement is smaller, and the width of the material can be accurately measured for the warped material.
Description
Technical Field
The embodiment of the specification relates to the technical field of data measurement, in particular to a material width measurement method.
Background
In the lithium battery cutting process, as for the width of a material, a single-phase machine is currently used to measure two boundaries of a piece of material, resulting in a final width of the material. Sometimes, in the field, materials are tilted in the production process, and after the materials are tilted, one camera can not accurately measure the width of the materials. Thus, a better solution is needed.
Disclosure of Invention
In view of this, the present specification embodiments provide a material width measurement method. One or more embodiments of the present specification are also directed to a material width measuring apparatus, a computing device, a computer-readable storage medium, and a computer program to solve the technical drawbacks of the prior art.
According to a first aspect of embodiments of the present specification, there is provided a material width measurement method comprising:
acquiring a first image of the calibration material through a first camera device, and acquiring a second image of the calibration material through a second camera device;
determining a target resolution based on the first image and the second image;
acquiring a third image of the target material through the first image pickup device, and acquiring a fourth image of the target material through the second image pickup device;
a material width of the target material is determined based on the target resolution, the third image, and the fourth image.
In one possible implementation, acquiring a first image of the calibration material by a first camera device and acquiring a second image of the calibration material by a second camera device includes:
acquiring a first image of the calibration material on one side of the calibration material through a first camera device;
acquiring a second image of the calibration material on the other side of the calibration material through a second camera device;
wherein there is an overlapping portion of the first image and the second image.
In one possible implementation, determining the target resolution based on the first image and the second image includes:
determining a first number of pixels based on the first image;
determining a second number of pixels based on the second image;
the target resolution is determined based on the first number of pixels and the second number of pixels.
In one possible implementation, determining the target resolution based on the first number of pixels and the second number of pixels includes:
determining a number of coincident pixels based on the first number of pixels and the second number of pixels;
determining a first integrated pixel number based on the first pixel number, the second pixel number, and the coincident pixel number;
the target resolution is determined based on the first integrated pixel count and the measurement width.
In one possible implementation, acquiring a third image of the target material by the first imaging device and acquiring a fourth image of the target material by the second imaging device includes:
acquiring a third image of the target material on one side of the target material by a first image pickup device;
acquiring a fourth image of the target material on the other side of the target material by a second camera device;
wherein there is an overlapping portion of the third image and the fourth image.
In one possible implementation, determining the material width of the target material based on the target resolution, the third image, and the fourth image includes:
determining a second integrated pixel count based on the third image and the fourth image;
a material width of the target material is determined based on the second integrated pixel count and the target resolution.
In one possible implementation, determining the second integrated pixel count based on the third image and the fourth image includes:
determining a third number of pixels based on the third image;
determining a fourth number of pixels based on the fourth image;
determining a number of coincident pixels based on the third number of pixels and the fourth number of pixels;
the second integrated pixel number is determined based on the third pixel number, the fourth pixel number, and the overlapping pixel number.
According to a second aspect of embodiments of the present specification, there is provided a material width measurement device comprising:
the first image acquisition module is configured to acquire a first image of the calibration material through the first camera device and acquire a second image of the calibration material through the second camera device;
a resolution calibration module configured to determine a target resolution based on the first image and the second image;
a second image acquisition module configured to acquire a third image of the target material by the first image pickup device, and acquire a fourth image of the target material by the second image pickup device;
a width determination module configured to determine a material width of the target material based on the target resolution, the third image, and the fourth image.
According to a third aspect of embodiments of the present specification, there is provided a computing device comprising:
a memory and a processor;
the memory is configured to store computer-executable instructions that, when executed by the processor, perform the steps of the material width measurement method described above.
According to a fourth aspect of embodiments of the present specification, there is provided a computer readable storage medium storing computer executable instructions which, when executed by a processor, implement the steps of the above-described material width measurement method.
According to a fifth aspect of embodiments of the present specification, there is provided a computer program, wherein the computer program, when executed in a computer, causes the computer to perform the steps of the above-described material width measurement method.
The embodiment of the specification provides a material width measuring method and a device, wherein the material width measuring method comprises the following steps: a method of measuring a width of a material, comprising: acquiring a first image of the calibration material through a first camera device, and acquiring a second image of the calibration material through a second camera device; determining a target resolution based on the first image and the second image; acquiring a third image of the target material through the first image pickup device, and acquiring a fourth image of the target material through the second image pickup device; the material width of the target material is determined based on the target resolution, the third image and the fourth image, so that the distortion of the material width measurement is smaller, and the width of the material can be accurately measured for the warped material.
Drawings
FIG. 1 is a schematic view of a method for measuring width of a material according to one embodiment of the present disclosure;
FIG. 2 is a flow chart of a method of measuring width of a material provided in one embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a method for measuring width of a material according to one embodiment of the present disclosure;
FIG. 4 is a schematic view of a material width measuring device according to one embodiment of the present disclosure;
FIG. 5 is a block diagram of a computing device provided in one embodiment of the present description.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present description. This description may be embodied in many other forms than described herein and similarly generalized by those skilled in the art to whom this disclosure pertains without departing from the spirit of the disclosure and, therefore, this disclosure is not limited by the specific implementations disclosed below.
The terminology used in the one or more embodiments of the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the one or more embodiments of the specification. As used in this specification, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used in one or more embodiments of the present specification refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that, although the terms first, second, etc. may be used in one or more embodiments of this specification to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, a first may also be referred to as a second, and similarly, a second may also be referred to as a first, without departing from the scope of one or more embodiments of the present description. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "responsive to a determination", depending on the context.
In the present specification, a material width measuring method is provided, and the present specification relates to a material width measuring apparatus, a computing device, and a computer-readable storage medium, one by one, in the following embodiments.
Referring to fig. 1, fig. 1 shows a schematic view of a scenario of a material width measurement method according to an embodiment of the present specification.
In the application scenario of fig. 1, the computing device 101 may acquire a first image 102 of the calibration material through a first camera and a second image 103 of the calibration material through a second camera. The computing device 101 may then determine the target resolution 104 based on the first image 102 and the second image 103. Thereafter, the computing device 101 may acquire a third image of the target material through the first image capturing apparatus, and acquire a fourth image of the target material through the second image capturing apparatus. Finally, the computing device 101 may determine a material width of the target material based on the target resolution 104, the third image, and the fourth image, as indicated by reference numeral 105.
The computing device 101 may be hardware or software. When the computing device 101 is hardware, it may be implemented as a distributed cluster of multiple servers or terminal devices, or as a single server or single terminal device. When the computing device 101 is embodied as software, it may be installed in the hardware devices listed above. It may be implemented as a plurality of software or software modules, for example, for providing distributed services, or as a single software or software module. The present invention is not particularly limited herein.
Referring to fig. 2, fig. 2 shows a flowchart of a method for measuring width of a material according to an embodiment of the present disclosure, which specifically includes the following steps.
Step 201: and acquiring a first image of the calibration material through the first camera device, and acquiring a second image of the calibration material through the second camera device.
In one possible implementation, acquiring a first image of the calibration material by a first camera device and acquiring a second image of the calibration material by a second camera device includes: acquiring a first image of the calibration material on one side of the calibration material through a first camera device; acquiring a second image of the calibration material on the other side of the calibration material through a second camera device; wherein there is an overlapping portion of the first image and the second image.
In practice, as shown in fig. 3, there are two industrial cameras above, the line in the figure represents the material, the two fields of view of the two industrial cameras below the industrial cameras 1 and 2, respectively, the camera, in the figure a represents the distance from the left boundary of the material under the field of view of the industrial camera 1 to the field of view of the field of view camera 1, in the figure b represents the overlapping pixel between the industrial camera 1 and the industrial camera 2, and in the figure c represents the distance from the boundary of the material to the field of view of the industrial camera 2.
Step 202: a target resolution is determined based on the first image and the second image.
In one possible implementation, determining the target resolution based on the first image and the second image includes: determining a first number of pixels based on the first image; determining a second number of pixels based on the second image; the target resolution is determined based on the first number of pixels and the second number of pixels.
Specifically, determining the target resolution based on the first pixel number and the second pixel number includes: determining a number of coincident pixels based on the first number of pixels and the second number of pixels; determining a first integrated pixel number based on the first pixel number, the second pixel number, and the coincident pixel number; the target resolution is determined based on the first integrated pixel count and the measurement width.
In practical application, the method for calculating the width of the material without warping comprises the steps of firstly, obtaining the numbers a and c of pixels in the fields of view of an industrial camera 1 and an industrial camera 2 by extracting boundaries in the fields of view of the cameras, calculating the overlapped pixels b of the two cameras, and the final pixel d=a+c-b of the width of the material, then detaching the current material, and measuring the actual width as e by a high-precision instrument, wherein the final resolution is f=e/d.
Step 203: a third image of the target material is acquired by the first imaging device, and a fourth image of the target material is acquired by the second imaging device.
In one possible implementation, acquiring a third image of the target material by the first imaging device and acquiring a fourth image of the target material by the second imaging device includes: acquiring a third image of the target material on one side of the target material by a first image pickup device; acquiring a fourth image of the target material on the other side of the target material by a second camera device; wherein there is an overlapping portion of the third image and the fourth image.
In practical applications, after the resolution is obtained, a piece of other material is put, and images of the other material are acquired by the industrial camera 1 and the industrial camera 2.
Step 204: a material width of the target material is determined based on the target resolution, the third image, and the fourth image.
In one possible implementation, determining the material width of the target material based on the target resolution, the third image, and the fourth image includes: determining a second integrated pixel count based on the third image and the fourth image; a material width of the target material is determined based on the second integrated pixel count and the target resolution.
Specifically, determining the second integrated pixel count based on the third image and the fourth image includes: determining a third number of pixels based on the third image; determining a fourth number of pixels based on the fourth image; determining a number of coincident pixels based on the third number of pixels and the fourth number of pixels; the second integrated pixel number is determined based on the third pixel number, the fourth pixel number, and the overlapping pixel number.
In practical applications, the width of the material is h=g×f when the width of the other material is g, and the calculation method is the same as described above, and no further description is given here.
Further, the material width calculation method after material tilting and the material calculation method when the material is not tilted are the same, and the final width of the material is k=j×f when the number of pixels of the current width of the material is calculated to be j.
The embodiment of the specification provides a material width measuring method and a device, wherein the material width measuring method comprises the following steps: a method of measuring a width of a material, comprising: acquiring a first image of the calibration material through a first camera device, and acquiring a second image of the calibration material through a second camera device; determining a target resolution based on the first image and the second image; acquiring a third image of the target material through the first image pickup device, and acquiring a fourth image of the target material through the second image pickup device; the material width of the target material is determined based on the target resolution, the third image and the fourth image, so that the distortion of the material width measurement is smaller, and the width of the material can be accurately measured for the warped material.
Corresponding to the above method embodiments, the present disclosure further provides an embodiment of a material width measurement device, and fig. 4 shows a schematic structural diagram of a material width measurement device provided in one embodiment of the present disclosure. As shown in fig. 4, the apparatus includes:
a first image acquisition module 401 configured to acquire a first image of the calibration material by a first image pickup device and acquire a second image of the calibration material by a second image pickup device;
a resolution calibration module 402 configured to determine a target resolution based on the first image and the second image;
a second image acquisition module 403 configured to acquire a third image of the target material by the first image pickup device, and acquire a fourth image of the target material by the second image pickup device;
the width determination module 404 is configured to determine a material width of the target material based on the target resolution, the third image, and the fourth image.
In one possible implementation, the first image acquisition module 401 is further configured to:
acquiring a first image of the calibration material on one side of the calibration material through a first camera device;
acquiring a second image of the calibration material on the other side of the calibration material through a second camera device;
wherein there is an overlapping portion of the first image and the second image.
In one possible implementation, the resolution calibration module 402 is further configured to:
determining a first number of pixels based on the first image;
determining a second number of pixels based on the second image;
the target resolution is determined based on the first number of pixels and the second number of pixels.
In one possible implementation, the resolution calibration module 402 is further configured to:
determining a number of coincident pixels based on the first number of pixels and the second number of pixels;
determining a first integrated pixel number based on the first pixel number, the second pixel number, and the coincident pixel number;
the target resolution is determined based on the first integrated pixel count and the measurement width.
In one possible implementation, the second image acquisition module 403 is further configured to:
acquiring a third image of the target material on one side of the target material by a first image pickup device;
acquiring a fourth image of the target material on the other side of the target material by a second camera device;
wherein there is an overlapping portion of the third image and the fourth image.
In one possible implementation, the width determination module 404 is further configured to:
determining a second integrated pixel count based on the third image and the fourth image;
a material width of the target material is determined based on the second integrated pixel count and the target resolution.
In one possible implementation, the width determination module 404 is further configured to:
determining a third number of pixels based on the third image;
determining a fourth number of pixels based on the fourth image;
determining a number of coincident pixels based on the third number of pixels and the fourth number of pixels;
the second integrated pixel number is determined based on the third pixel number, the fourth pixel number, and the overlapping pixel number.
The embodiment of the specification provides a material width measuring method and a device, wherein the material width measuring device comprises: a method of measuring a width of a material, comprising: acquiring a first image of the calibration material through a first camera device, and acquiring a second image of the calibration material through a second camera device; determining a target resolution based on the first image and the second image; acquiring a third image of the target material through the first image pickup device, and acquiring a fourth image of the target material through the second image pickup device; the material width of the target material is determined based on the target resolution, the third image and the fourth image, so that the distortion of the material width measurement is smaller, and the width of the material can be accurately measured for the warped material.
The above is a schematic version of a material width measuring device of the present embodiment. It should be noted that, the technical solution of the material width measuring device and the technical solution of the material width measuring method belong to the same conception, and details of the technical solution of the material width measuring device, which are not described in detail, can be referred to the description of the technical solution of the material width measuring method.
Fig. 5 illustrates a block diagram of a computing device 500 provided in accordance with one embodiment of the present description. The components of the computing device 500 include, but are not limited to, a memory 510 and a processor 520. Processor 520 is coupled to memory 510 via bus 530 and database 550 is used to hold data.
Computing device 500 also includes access device 540, access device 540 enabling computing device 500 to communicate via one or more networks 560. Examples of such networks include public switched telephone networks (PSTN, public Switched Telephone Network), local area networks (LAN, local Area Network), wide area networks (WAN, wide Area Network), personal area networks (PAN, personal Area Network), or combinations of communication networks such as the internet. The access device 540 may include one or more of any type of network interface, wired or wireless (e.g., network interface card (NIC, network interface controller)), such as an IEEE802.11 wireless local area network (WLAN, wireless Local Area Network) wireless interface, a worldwide interoperability for microwave access (Wi-MAX, worldwide Interoperability for Microwave Access) interface, an ethernet interface, a universal serial bus (USB, universal Serial Bus) interface, a cellular network interface, a bluetooth interface, near field communication (NFC, near Field Communication).
In one embodiment of the present description, the above-described components of computing device 500, as well as other components not shown in FIG. 5, may also be connected to each other, such as by a bus. It should be understood that the block diagram of the computing device shown in FIG. 5 is for exemplary purposes only and is not intended to limit the scope of the present description. Those skilled in the art may add or replace other components as desired.
Computing device 500 may be any type of stationary or mobile computing device, including a mobile computer or mobile computing device (e.g., tablet, personal digital assistant, laptop, notebook, netbook, etc.), mobile phone (e.g., smart phone), wearable computing device (e.g., smart watch, smart glasses, etc.), or other type of mobile device, or a stationary computing device such as a desktop computer or personal computer (PC, personal Computer). Computing device 500 may also be a mobile or stationary server.
Wherein the processor 520 is configured to execute computer-executable instructions that, when executed by the processor, perform the steps of the material width measurement method described above. The foregoing is a schematic illustration of a computing device of this embodiment. It should be noted that, the technical solution of the computing device and the technical solution of the material width measurement method belong to the same concept, and details of the technical solution of the computing device, which are not described in detail, can be referred to the description of the technical solution of the material width measurement method.
An embodiment of the present disclosure also provides a computer-readable storage medium storing computer-executable instructions that, when executed by a processor, implement the steps of the above-described material width measurement method.
The above is an exemplary version of a computer-readable storage medium of the present embodiment. It should be noted that, the technical solution of the storage medium and the technical solution of the material width measurement method belong to the same concept, and details of the technical solution of the storage medium, which are not described in detail, can be referred to the description of the technical solution of the material width measurement method.
An embodiment of the present specification also provides a computer program, wherein the computer program, when executed in a computer, causes the computer to perform the steps of the above-described material width measurement method.
The above is an exemplary version of a computer program of the present embodiment. It should be noted that, the technical solution of the computer program and the technical solution of the material width measurement method belong to the same conception, and details of the technical solution of the computer program, which are not described in detail, can be referred to the description of the technical solution of the material width measurement method.
The foregoing describes specific embodiments of the present disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
The computer instructions include computer program code that may be in source code form, object code form, executable file or some intermediate form, etc. The computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth. It should be noted that the computer readable medium contains content that can be appropriately scaled according to the requirements of jurisdictions in which such content is subject to legislation and patent practice, such as in certain jurisdictions in which such content is subject to legislation and patent practice, the computer readable medium does not include electrical carrier signals and telecommunication signals.
It should be noted that, for simplicity of description, the foregoing method embodiments are all expressed as a series of combinations of actions, but it should be understood by those skilled in the art that the embodiments are not limited by the order of actions described, as some steps may be performed in other order or simultaneously according to the embodiments of the present disclosure. Further, those skilled in the art will appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily all required for the embodiments described in the specification.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments.
The preferred embodiments of the present specification disclosed above are merely used to help clarify the present specification. Alternative embodiments are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the teaching of the embodiments. The embodiments were chosen and described in order to best explain the principles of the embodiments and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. This specification is to be limited only by the claims and the full scope and equivalents thereof.
Claims (10)
1. A method of measuring a width of a material, comprising:
acquiring a first image of a calibration material through a first camera device, and acquiring a second image of the calibration material through a second camera device;
determining a target resolution based on the first image and the second image;
acquiring a third image of a target material through a first image pickup device, and acquiring a fourth image of the target material through a second image pickup device;
a material width of the target material is determined based on the target resolution, the third image, and the fourth image.
2. The method of claim 1, wherein the acquiring a first image of the calibration material by a first camera device and acquiring a second image of the calibration material by a second camera device comprises:
acquiring a first image of the calibration material on one side of the calibration material through a first camera device;
acquiring a second image of the calibration material on the other side of the calibration material through a second camera device;
wherein there is an overlapping portion of the first image and the second image.
3. The method of claim 1, wherein the determining a target resolution based on the first image and the second image comprises:
determining a first number of pixels based on the first image;
determining a second number of pixels based on the second image;
a target resolution is determined based on the first number of pixels and the second number of pixels.
4. A method according to claim 3, wherein said determining a target resolution based on said first and second numbers of pixels comprises:
determining a number of coincident pixels based on the first number of pixels and the second number of pixels;
determining a first integrated pixel count based on the first pixel count, the second pixel count, and the coincident pixel count;
a target resolution is determined based on the first integrated pixel count and a measurement width.
5. The method of claim 1, wherein the acquiring a third image of the target material by the first imaging device and a fourth image of the target material by the second imaging device comprises:
acquiring a third image of the target material on one side of the target material by a first image pickup device;
acquiring a fourth image of the target material on the other side of the target material by a second camera;
wherein the third image and the fourth image have overlapping portions.
6. The method of claim 1, wherein the determining the material width of the target material based on the target resolution, the third image, and the fourth image comprises:
determining a second integrated pixel count based on the third image and the fourth image;
a material width of the target material is determined based on the second integrated pixel count and the target resolution.
7. The method of claim 6, wherein the determining a second number of integrated pixels based on the third image and the fourth image comprises:
determining a third number of pixels based on the third image;
determining a fourth number of pixels based on the fourth image;
determining a number of coincident pixels based on the third number of pixels and the fourth number of pixels;
a second integrated pixel count is determined based on the third pixel count, the fourth pixel count, and the coincident pixel count.
8. A material width measurement apparatus, comprising:
the first image acquisition module is configured to acquire a first image of the calibration material through the first camera device and acquire a second image of the calibration material through the second camera device;
a resolution calibration module configured to determine a target resolution based on the first image and the second image;
a second image acquisition module configured to acquire a third image of a target material by a first image pickup device, and acquire a fourth image of the target material by a second image pickup device;
a width determination module configured to determine a material width of the target material based on the target resolution, the third image, and the fourth image.
9. A computing device, comprising:
a memory and a processor;
the memory is configured to store computer-executable instructions, the processor being configured to execute the computer-executable instructions, which when executed by the processor, implement the steps of the material width measurement method of any one of claims 1 to 7.
10. A computer readable storage medium storing computer executable instructions which when executed by a processor perform the steps of the material width measurement method of any one of claims 1 to 7.
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