CN117019554B - Semiconductor tight rubber stacking sealing device - Google Patents
Semiconductor tight rubber stacking sealing device Download PDFInfo
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- CN117019554B CN117019554B CN202311264053.XA CN202311264053A CN117019554B CN 117019554 B CN117019554 B CN 117019554B CN 202311264053 A CN202311264053 A CN 202311264053A CN 117019554 B CN117019554 B CN 117019554B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 92
- 238000007789 sealing Methods 0.000 title claims abstract description 83
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 239000000084 colloidal system Substances 0.000 claims abstract description 23
- 239000000565 sealant Substances 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims description 39
- 238000007790 scraping Methods 0.000 claims description 21
- 230000002457 bidirectional effect Effects 0.000 claims description 14
- 238000011084 recovery Methods 0.000 claims description 12
- 238000004064 recycling Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000010073 coating (rubber) Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 55
- 238000004026 adhesive bonding Methods 0.000 abstract description 22
- 230000000694 effects Effects 0.000 abstract description 12
- 238000005096 rolling process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
- B05C11/025—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface with an essentially cylindrical body, e.g. roll or rod
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a semiconductor tight rubber stacking and sealing device, which belongs to the technical field of semiconductor processing and comprises a sealing and gluing module and a frame, wherein the sealing and gluing module is arranged on the top surface of the frame; according to the invention, the rubber surface leveling mechanism is arranged in a matching way, through the design, the sealant can be well and quickly released on the surface of the joint rubber by an annular gluing method, so that the uniformity of the sealant can be effectively ensured, the whole process can seal and glue the rubber in all directions, the structural position is not required to be changed, the use is convenient and quick, the rolling can be continuously performed on the rubber surface during gluing, the flatness of the rubber surface is improved, the subsequent sealing effect is improved, the colloid is not easy to quickly solidify, and the use effect of the whole equipment is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor tight rubber stacking and sealing device.
Background
Semiconductors generally refer to materials having electrical conductivity between conductors and insulators at ordinary temperatures, and are widely used in many fields, including integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., and are of great importance from a technological or economic standpoint. Most electronic products, such as computers, mobile phones or digital recorders, have very close association with semiconductors, and different semiconductors are connected by rubber members, so that sealing treatment is required for ensuring tightness.
The existing sealing treatment equipment can finish sealing treatment on rubber, but generally adopts a displacement type sealing gluing structure to realize sealing, the position of a sealing area of the rubber cannot be changed quickly, the application effect is poor, meanwhile, when the sealing treatment is carried out, some redundant sealing glue cannot be recovered synchronously, the glue can overflow into a working area, the later cleaning is difficult, the actual use effect of the whole equipment is poor, and in order to solve the problems, a semiconductor tight rubber stacking sealing device is needed.
Disclosure of Invention
The invention aims at: in order to solve the problems that the sealing treatment of rubber can be completed by the existing sealing treatment equipment, but the sealing is realized by adopting a displacement type sealing gluing structure, the position of a sealing area of the rubber cannot be changed quickly, the application effect is poor, meanwhile, when the sealing treatment is carried out, some redundant sealing glue cannot be recovered synchronously, the glue can overflow into a working area, the later period is difficult to clean, and the actual use effect of the whole equipment is poor, and the semiconductor compact rubber stacking sealing device is provided.
In order to achieve the above purpose, the present invention adopts the following technical scheme: the utility model provides a semiconductor compact rubber stacks sealing device, includes sealed rubberizing module and frame, be provided with sealed rubberizing module on the top surface of frame, the bottom side fixed mounting of frame has the base, be provided with the travel groove on the top surface of base, fixed mounting has driving motor on the outer wall of one side of base, be provided with the mounting groove on the top surface of base, be provided with the face of gluing leveling mechanism in the mounting groove, the face of gluing leveling mechanism is used for the quick leveling of the regional colloid of semiconductor rubber seal, driving motor's output shaft one end fixed mounting has two-way screw thread post, two semiconductor installation mechanisms are installed to the external screw thread of two-way screw thread post, and semiconductor installation mechanism is used for the quick location installation of semiconductor.
As a further description of the above technical solution:
the rubber surface leveling mechanism comprises a rubber surface leveling assembly, the rubber surface leveling assembly is fixedly mounted on the inner wall of the bottom surface of the base, the rubber surface leveling assembly comprises a mounting shaft sleeve, and a built-in spring is fixedly mounted in the mounting shaft sleeve.
As a further description of the above technical solution:
the top of the built-in spring is fixedly provided with a telescopic shaft, one end of the telescopic shaft is in sliding connection with the inner wall of the mounting shaft sleeve, and the outer surface of the telescopic shaft is fixedly provided with a mounting wheel frame and a sealant recycling outer cover.
As a further description of the above technical solution:
the installation wheel carrier is located the top of sealed outer cover of retrieving of gluing, the installation wheel carrier is provided with two about the longitudinal center axle symmetry of telescopic shaft, rotates through the pivot between two installation wheel carriers and installs the smooth pinch roller of gluing the face, the inside of the smooth pinch roller of gluing the face is provided with many heating wires, be provided with the recovery rubber tube on the lateral wall of sealed outer cover of retrieving of gluing, the one end of retrieving the rubber tube is fixed connection with the bottom surface of sealed rubberizing module.
As a further description of the above technical solution:
the rubber scraping device is characterized in that a rubber scraping assembly is arranged on the outer surface of the installation shaft sleeve, the rubber scraping assembly comprises an installation shell, a spring telescopic shaft is arranged in the installation shell, a rubber scraping blade is fixedly arranged at the top end of the spring telescopic shaft, and one end of the rubber scraping blade is in tight contact with the outer surface of the rubber leveling pinch roller and is extruded.
Further, by being provided with a rubber surface leveling mechanism in a matching manner, when the semiconductor rubber is subjected to sealing treatment, firstly, the semiconductor is installed, after the two semiconductors are loaded, a driving motor is started, the driving motor can drive a bidirectional threaded column to rotate, the bidirectional threaded column can drive the two semiconductor installation mechanisms to be close to each other until the rubber end surfaces of the two semiconductors are contacted, at the moment, a sealing gluing module is controlled to be started, the sealing gluing module can beat sealing glue to a rubber joint, at the moment, the driving motor is controlled to be started, the driving motor can drive an installation outer cover to slowly rotate, and synchronously drive the semiconductor to slowly rotate, at the moment, the sealing glue can be effectively and evenly coated on the surface of the joint rubber, and at the same time, after the glue is coated, the rubber surface of the rubber surface leveling mechanism is leveled and continuously contacts with the surface of the rubber joint, at this moment, the leveling pinch roller of the rubber surface can evenly roll the sealing glue, the sealing glue is enabled to be distributed on the surface of a rubber joint more evenly, meanwhile, a plurality of heating wires arranged in the leveling pinch roller of the rubber surface can be automatically opened, the sealing glue is heated, the glue can not be solidified in the rolling process of the sealing glue by the leveling pinch roller of the rubber surface, and the glue treatment effect is guaranteed.
As a further description of the above technical solution:
the semiconductor mounting mechanism comprises a movable slide block, one end of the bidirectional threaded column is in threaded connection with a threaded hole formed in the movable slide block, and the movable slide block is in sliding connection with a guide rail fixedly mounted on the inner wall of the bottom surface of the base through a sliding groove formed in the bottom of the movable slide block.
As a further description of the above technical solution:
the top of the movable sliding block is fixedly provided with a movable plate, the movable sliding block is in sliding connection with the travel groove, and a driving motor is fixedly arranged on the outer wall of one side of the movable plate.
As a further description of the above technical solution:
the driving motor comprises a driving motor, wherein an installation outer cover is fixedly arranged at one end of an output shaft of the driving motor, an inner sliding hole is formed in the installation outer cover, and a positioning assembly is arranged on the inner sliding hole.
As a further description of the above technical solution:
the locating component comprises two locating pins, the locating pins are clamped in inner sliding holes, the top ends of the locating pins are fixedly provided with installation side frames, and one ends of the installation side frames are fixedly provided with threaded shafts.
As a further description of the above technical solution:
the screw thread axle's external screw thread is installed and is changeed the cover, the inside fixed mounting who changes the cover has spacing slide bar, the screw thread axle is through its inside interior sliding connection who sets up hole and spacing slide bar sliding connection.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
1. according to the invention, the rubber surface leveling mechanism is arranged in a matching way, when the semiconductor rubber is subjected to sealing treatment, firstly, the semiconductor is installed, after the two semiconductors are loaded, the driving motor is started, the driving motor can drive the bidirectional threaded column to rotate, the bidirectional threaded column can drive the two semiconductor installation mechanisms to be close to each other until the rubber end surfaces of the two semiconductors are contacted, at the moment, the sealing rubber applying module is controlled to be opened, the sealing rubber can be applied to a rubber connecting part by the sealing rubber applying module, at the moment, the driving motor is controlled to be opened, the installation housing can be driven to slowly rotate, the semiconductor is synchronously driven to slowly rotate, at the moment, the sealing rubber can be effectively and uniformly coated on the surface of the joint, and after the rubber is coated, as the rubber surface leveling pinch roller continuously contacts with the surface of the rubber joint, at the moment, the rubber surface leveling pinch roller can uniformly roll the sealing rubber, a plurality of strips arranged in the rubber surface leveling pinch roller can be automatically opened, the rubber can be heated, the rubber can not be solidified in the process of rolling the sealing rubber, the sealing rubber can not be guaranteed, the rubber can be rapidly cured, the sealing rubber can be quickly and continuously and rapidly released at the same time, the whole sealing rubber can be quickly, the sealing rubber can be conveniently and continuously sealed, the sealing rubber can be quickly and continuously sealed, the sealing effect can be improved, and the sealing position can be quickly and the sealing rubber can be conveniently and continuously sealed.
2. According to the invention, the glue scraping assembly is arranged on the glue surface leveling mechanism in a matching way, when the glue surface leveling pinch roller carries out rolling treatment on the glue surface, some sealant can be remained on the glue surface leveling pinch roller, at the moment, the scraping blade can scrape off residual redundant glue on the glue surface leveling pinch roller, the scraped glue can flow along the inclined surface of the scraping blade and is stored in the sealant recycling outer cover, the glue can be recycled through the recycling rubber pipe after waiting for the follow-up operation, and the material pump in the sealing glue feeding module is started to recycle the recycled glue through the recycling rubber pipe.
3. According to the invention, the semiconductor mounting mechanism is arranged in a matched manner, the positioning assembly is arranged in the semiconductor mounting mechanism, when the semiconductor is mounted, the semiconductor is mounted in the mounting outer cover, the clamping hole of the semiconductor corresponds to the positioning pin, the rotating sleeve is directly rotated at the moment, and the rotating sleeve is in threaded connection with the threaded shaft, so that the threaded shaft can be driven to displace, one end of the threaded shaft is clamped into the clamping hole of the semiconductor, the rapid positioning mounting of the semiconductor is completed, and through the design, the positioning mounting of the semiconductor can be rapidly completed through multiple simple operations without using additional mounting parts and tools, the mounting efficiency of the semiconductor is greatly improved, and the use effect of equipment is improved.
Drawings
Fig. 1 is a schematic perspective view of a semiconductor tight rubber stack sealing device.
Fig. 2 is an exploded perspective view of a semiconductor tight rubber stack sealing device.
Fig. 3 is an exploded perspective view of a semiconductor mounting mechanism and a bi-directional threaded post in a semiconductor tight rubber stack sealing device.
Fig. 4 is an exploded perspective view of a semiconductor mounting mechanism in a semiconductor tight rubber stack sealing device.
Fig. 5 is a schematic perspective view of a mounting enclosure in a semiconductor tight rubber stack sealing device.
Fig. 6 is an exploded perspective view of a positioning assembly in a semiconductor tight rubber stack sealing device.
Fig. 7 is a schematic diagram showing a combined three-dimensional structure of a rubber surface leveling mechanism in a semiconductor tight rubber stack sealing device.
Fig. 8 is an exploded perspective view of a rubber surface leveling mechanism in a semiconductor tight rubber stack sealing device.
Legend description:
1. sealing and gluing the module; 2. a frame; 3. a driving motor; 4. a base; 5. a glue surface leveling mechanism; 51. recycling the rubber tube; 52. a sealant recycling outer cover; 53. a glue surface leveling component; 531. mounting a wheel carrier; 532. the rubber surface levels the pinch roller; 533. a telescopic shaft; 534. a built-in spring; 535. installing a shaft sleeve; 54. a colloid scraping assembly; 541. mounting a shell; 542. a spring telescopic shaft; 543. a doctor blade; 6. a semiconductor mounting mechanism; 61. installing an outer cover; 62. a moving plate; 63. moving the slide block; 64. a drive motor; 65. a positioning assembly; 651. installing a side frame; 652. a positioning pin; 653. a threaded shaft; 654. a limit slide bar; 655. a rotating sleeve; 7. a bidirectional threaded column; 8. a travel groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, the present invention provides a technical solution: the utility model provides a semiconductor closely rubber piles up sealing device, includes sealed rubberizing module 1 and frame 2, be provided with sealed rubberizing module 1 on the top surface of frame 2, the bottom side fixed mounting of frame 2 has base 4, be provided with travel groove 8 on the top surface of base 4, fixed mounting has driving motor 3 on the outer wall of one side of base 4, be provided with the mounting groove on the top surface of base 4, be provided with the face of gluing leveling mechanism 5 in the mounting groove, the face of gluing leveling mechanism 5 is used for the quick leveling of the regional colloid of semiconductor rubber, driving motor 3's output shaft one end fixed mounting has two-way screw thread post 7, two semiconductor installation mechanism 6 are installed to the external screw thread of two-way screw thread post 7, and semiconductor installation mechanism 6 is used for the quick location installation of semiconductor, and wherein the semiconductor is cylindrical carborundum material, and offers two locating holes on the surface of material before processing to be convenient for with this equipment adaptation installation.
The rubber surface leveling mechanism 5 comprises a rubber surface leveling component 53, the rubber surface leveling component 53 is fixedly mounted on the inner wall of the bottom surface of the base 4, the rubber surface leveling component 53 comprises a mounting shaft sleeve 535, an internal spring 534 is fixedly mounted in the mounting shaft sleeve 535, a telescopic shaft 533 is fixedly mounted at the top end of the internal spring 534, one end of the telescopic shaft 533 is in sliding connection with the inner wall of the mounting shaft sleeve 535, and a mounting wheel frame 531 and a sealant recycling outer cover 52 are fixedly mounted on the outer surface of the telescopic shaft 533.
The installation wheel frames 531 are located the top of sealed glue recovery dustcoat 52, the longitudinal center axle symmetry of installation wheel frames 531 about the telescopic shaft 533 is provided with two, rotates through the pivot between two installation wheel frames 531 and installs the smooth pinch roller 532 of rubber face, the inside of the smooth pinch roller 532 of rubber face is provided with many heating wires, be provided with on the lateral wall of sealed glue recovery dustcoat 52 and retrieve rubber tube 51, the one end of retrieving rubber tube 51 and the bottom surface fixed connection of sealed rubberizing module 1.
The specific implementation mode is as follows: when the semiconductor rubber is subjected to sealing treatment, after the two semiconductors are loaded, the driving motor 3 is started, the driving motor 3 can drive the bidirectional threaded column 7 to rotate, the bidirectional threaded column 7 can drive the two semiconductor mounting mechanisms 6 to be close to each other until the rubber end faces of the two semiconductors are contacted, the sealing gluing module 1 is controlled to be started at the moment, the sealing gluing module 1 can beat sealing glue to the rubber connection part, the driving motor 64 is controlled to be started at the moment, the driving motor 64 can drive the mounting housing 61 to slowly rotate, the semiconductors are synchronously driven to slowly rotate, at the moment, sealing glue can be effectively and uniformly coated on the surface of the joint rubber, and meanwhile, after gluing, the glue surface leveling pinch roller 532 can uniformly roll the sealing glue, so that the sealing glue is more uniformly distributed on the surface of the rubber joint, and meanwhile, a plurality of heating wires arranged in the glue surface leveling pinch roller 532 can be automatically started, and the glue cannot be solidified in the rolling process of the sealing glue, so that the glue surface leveling pinch roller 532 can not be solidified, and the glue treatment effect is ensured.
Through this design, through annular rubberizing method, can be with the seal gum release on seam rubber surface fast well, can effectively guarantee the degree of consistency of seal gum, the overall process can seal rubberizing to rubber all-round simultaneously, need not to change the structure position, convenient to use is swift, rubberizes simultaneously, can last to glue the face and roll-in, improves the face roughness of gluing, improves follow-up sealed effect, and guarantees that the colloid is difficult for solidifying fast, improves whole equipment result of use.
The outer surface of the installation shaft sleeve 535 is provided with a colloid scraping component 54, the colloid scraping component 54 comprises an installation shell 541, a spring telescopic shaft 542 is arranged in the installation shell 541, a colloid scraping blade 543 is fixedly arranged at the top end of the spring telescopic shaft 542, and one end of the colloid scraping blade 543 is tightly contacted with the outer surface of the colloid surface leveling pinch roller 532 and is extruded.
The specific implementation mode is as follows: when the rubber surface leveling pinch roller 532 carries out rolling treatment on the rubber surface, some sealant can be remained on the rubber surface leveling pinch roller 532, at the moment, the residual redundant colloid on the rubber surface leveling pinch roller 532 can be scraped by the scraping blade 543, the scraped colloid can flow along the inclined surface of the scraping blade 543 and is stored in the sealant recovery outer cover 52, and the material pump in the sealant module 1 is started to recover the recovered colloid through the recovery rubber tube 51 after the subsequent operation.
Through this design, can be synchronous carry out effective recovery to unnecessary colloid, not only can avoid the waste of resource, guarantee the rational use of resource, also can not cause the colloid to drip simultaneously and produce the pollution.
The semiconductor mounting mechanism 6 comprises a moving slide block 63, one end of a bidirectional threaded column 7 is in threaded connection with a threaded hole formed in the moving slide block 63, the moving slide block 63 is in sliding connection with a guide rail fixedly mounted on the inner wall of the bottom surface of the base 4 through a sliding groove formed in the bottom of the moving slide block 63, a moving plate 62 is fixedly mounted on the top end of the moving slide block 63 and is in sliding connection with a travel groove 8, a driving motor 64 is fixedly mounted on the outer wall of one side of the moving plate 62, a mounting outer cover 61 is fixedly mounted at one end of an output shaft of the driving motor 64, an inner sliding hole is formed in the mounting outer cover 61, and a positioning component 65 is arranged on the inner sliding hole.
The locating component 65 comprises two locating pins 652, the locating pins 652 are clamped in inner sliding holes, a mounting side frame 651 is fixedly mounted at the top end of each locating pin 652, a threaded shaft 653 is fixedly mounted at one end of each mounting side frame 651, a rotating sleeve 655 is mounted on the outer threads of each threaded shaft 653, a limiting sliding rod 654 is fixedly mounted in each rotating sleeve 655, and the threaded shafts 653 are in sliding connection with the limiting sliding rods 654 through inner sliding holes formed in the threaded shafts 653.
The specific implementation mode is as follows: when the semiconductor is mounted, the semiconductor is mounted in the mounting housing 61, the clamping hole of the semiconductor corresponds to the positioning pin 652, at this time, the rotating sleeve 655 is directly rotated, and the rotating sleeve 655 is in threaded connection with the threaded shaft 653, so that the threaded shaft 653 can be driven to displace, one end of the threaded shaft 653 is clamped into the clamping hole of the semiconductor, and the rapid positioning and mounting of the semiconductor are completed.
Through this design, can accomplish the location installation to the semiconductor fast through many simple operations, need not to use extra installation component and instrument, improved the installation effectiveness of semiconductor greatly, improve the result of use of equipment.
Working principle: when the semiconductor rubber is sealed, firstly, the semiconductor is installed in the installation housing 61, the clamping holes of the semiconductor are corresponding to the positioning pins 652, at the moment, the rotating sleeve 655 is directly rotated, the rotating sleeve 655 is in threaded connection with the threaded shaft 653, so that the threaded shaft 653 can be driven to displace, one end of the threaded shaft 653 is clamped into the clamping holes of the semiconductor, the rapid positioning installation of the semiconductor is completed, after the two semiconductors are loaded, the driving motor 3 is started, the driving motor 3 can drive the bidirectional threaded column 7 to rotate, the bidirectional threaded column 7 can drive the two semiconductor installation mechanisms 6 to be close to each other until the rubber end faces of the two semiconductors are contacted, at the moment, the sealing and gluing module 1 is controlled to be started, the sealing glue applying module 1 can apply sealing glue to the rubber joint, at the moment, the driving motor 64 is controlled to be started, the driving motor 64 can drive the mounting housing 61 to slowly rotate, the semiconductor is synchronously driven to slowly rotate, at the moment, the sealing glue can be effectively and uniformly coated on the rubber surface of the joint, and after glue is applied, the glue surface leveling pinch roller 532 of the glue surface leveling mechanism 5 is continuously contacted with the rubber joint surface, at the moment, the glue surface leveling pinch roller 532 can uniformly roll the sealing glue, so that the sealing glue is more uniformly distributed on the rubber joint surface, meanwhile, a plurality of heating wires arranged in the glue surface leveling pinch roller 532 can be automatically started, the sealing glue is heated, the glue can not be solidified in the process of rolling the sealing glue by the glue surface leveling pinch roller 532, and the glue treatment effect is ensured; when the rubber surface leveling pinch roller 532 carries out rolling treatment on the rubber surface, some sealant can be remained on the rubber surface leveling pinch roller 532, at the moment, the residual redundant colloid on the rubber surface leveling pinch roller 532 can be scraped by the scraping blade 543, the scraped colloid can flow along the inclined surface of the scraping blade 543 and is stored in the sealant recovery outer cover 52, and the material pump in the sealant module 1 is started to recover the recovered colloid through the recovery rubber tube 51 after the subsequent operation.
The present invention is not limited to the above-mentioned embodiments, and any person skilled in the art, based on the technical solution of the present invention and the inventive concept thereof, can be replaced or changed within the scope of the present invention.
Claims (4)
1. The utility model provides a semiconductor closely rubber piles up sealing device, includes sealed rubberizing module (1) and frame (2), be provided with sealed rubberizing module (1) on the top surface of frame (2), the bottom side fixed mounting of frame (2) has base (4), be provided with travel groove (8) on the top surface of base (4), fixed mounting has driving motor (3) on the outer wall of one side of base (4), its characterized in that: the semiconductor device comprises a base (4), wherein a mounting groove is formed in the top surface of the base, a rubber surface leveling mechanism (5) is arranged in the mounting groove, the rubber surface leveling mechanism (5) is used for quickly leveling rubber in a semiconductor rubber sealing area, a bidirectional threaded column (7) is fixedly arranged at one end of an output shaft of the driving motor (3), two semiconductor mounting mechanisms (6) are arranged on external threads of the bidirectional threaded column (7), and the semiconductor mounting mechanisms (6) are used for quickly positioning and mounting semiconductors;
the rubber surface leveling mechanism (5) comprises a rubber surface leveling component (53), the rubber surface leveling component (53) is fixedly arranged on the inner wall of the bottom surface of the base (4), the rubber surface leveling component (53) comprises an installation shaft sleeve (535), and an internal spring (534) is fixedly arranged in the installation shaft sleeve (535);
a telescopic shaft (533) is fixedly arranged at the top end of the built-in spring (534), one end of the telescopic shaft (533) is in sliding connection with the inner wall of the mounting shaft sleeve (535), and a mounting wheel frame (531) and a sealant recycling outer cover (52) are fixedly arranged on the outer surface of the telescopic shaft (533);
the mounting wheel frames (531) are positioned above the sealant recovery outer cover (52), two mounting wheel frames (531) are symmetrically arranged on the longitudinal central shaft of the telescopic shaft (533), and a sealant surface leveling pinch roller (532) is rotatably arranged between the two mounting wheel frames (531) through a rotating shaft;
the outer surface of the mounting shaft sleeve (535) is provided with a colloid scraping component (54), the colloid scraping component (54) comprises a mounting shell (541), a spring telescopic shaft (542) is arranged in the mounting shell (541), a colloid scraping blade (543) is fixedly arranged at the top end of the spring telescopic shaft (542), and one end of the colloid scraping blade (543) is tightly contacted with the outer surface of the colloid surface leveling pinch roller (532) and extruded;
the semiconductor mounting mechanism (6) comprises a movable slide block (63), wherein a movable plate (62) is fixedly arranged at the top end of the movable slide block (63), and a driving motor (64) is fixedly arranged on the outer wall of one side of the movable plate (62);
an installation outer cover (61) is fixedly arranged at one end of an output shaft of the driving motor (64), an inner sliding hole is formed in the installation outer cover (61), and a positioning assembly (65) is arranged on the inner sliding hole;
the positioning assembly (65) comprises two positioning pins (652), the positioning pins (652) are clamped and embedded in the inner sliding holes, the top ends of the positioning pins (652) are fixedly provided with mounting side frames (651), and one ends of the mounting side frames (651) are fixedly provided with threaded shafts (653);
a rotating sleeve (655) is arranged on the outer thread of the threaded shaft (653), a limiting slide rod (654) is fixedly arranged in the rotating sleeve (655), and the threaded shaft (653) is in sliding connection with the limiting slide rod (654) through an inner sliding hole arranged in the threaded shaft;
when the semiconductor is installed, the semiconductor is installed in the installation housing (61), the clamping hole of the semiconductor corresponds to the locating pin (652), the rotating sleeve (655) is directly rotated at the moment, and the rotating sleeve (655) is in threaded connection with the threaded shaft (653), so that the threaded shaft (653) can be driven to displace, one end of the locating pin (652) is clamped and embedded into the clamping hole of the semiconductor, and the rapid locating installation of the semiconductor is completed.
2. The semiconductor tight rubber stacking and sealing device according to claim 1, wherein a plurality of heating wires are arranged in the rubber surface leveling pinch roller (532), a recovery rubber tube (51) is arranged on the side wall of the sealing rubber recovery housing (52), and one end of the recovery rubber tube (51) is fixedly connected with the bottom surface of the sealing rubber coating module (1).
3. The semiconductor tight rubber stacking sealing device according to claim 1, wherein one end of the bidirectional threaded column (7) is in threaded connection with a threaded hole formed in the movable slider (63), and the movable slider (63) is in sliding connection with a guide rail fixedly mounted on the inner wall of the bottom surface of the base (4) through a sliding groove formed in the bottom of the movable slider.
4. A semiconductor tight rubber stack sealing arrangement according to claim 3, characterized in that the moving slide (63) is slidingly connected with the travel slot (8).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311264053.XA CN117019554B (en) | 2023-09-28 | 2023-09-28 | Semiconductor tight rubber stacking sealing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311264053.XA CN117019554B (en) | 2023-09-28 | 2023-09-28 | Semiconductor tight rubber stacking sealing device |
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| CN117019554A CN117019554A (en) | 2023-11-10 |
| CN117019554B true CN117019554B (en) | 2024-03-01 |
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| CN218758774U (en) * | 2022-08-16 | 2023-03-28 | 浙江宝盛建设集团有限公司 | Vertical cast-in-place concrete member template clamp |
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| CN206168680U (en) * | 2016-11-12 | 2017-05-17 | 河南金宏印业有限公司 | Even rubber coating device of glue film |
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| CN213551873U (en) * | 2020-09-14 | 2021-06-29 | 宜兴市人民医院 | Head and neck fixing and clamping device for X-ray film shooting |
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| CN117019554A (en) | 2023-11-10 |
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