CN117015155A - Processing method and system of flexible circuit board - Google Patents
Processing method and system of flexible circuit board Download PDFInfo
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- CN117015155A CN117015155A CN202311149708.9A CN202311149708A CN117015155A CN 117015155 A CN117015155 A CN 117015155A CN 202311149708 A CN202311149708 A CN 202311149708A CN 117015155 A CN117015155 A CN 117015155A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application provides a processing method and a processing system of a flexible circuit board. The method comprises the following steps: selecting a flexible circuit board substrate to be processed; designing a circuit pattern to be designed and processed, importing the circuit pattern into a computer, and converting the circuit pattern into a digital file through computer aided design software; loading the digitized file into a flexible circuit board processing system; coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking the light-transmitting glue to solidify the light-transmitting glue; covering the light-transmitting layer with photoresist, and exposing through a mask; forming a circuit pattern to be processed; carrying out metallization treatment on the photoresist template to form a conductive layer; stripping the photoresist template, and cleaning and treating to obtain a processed flexible circuit board; and (3) comprehensively detecting the processed flexible circuit board, wherein the detection comprises electric performance detection and reliability verification, and repairing the existing defects.
Description
Technical Field
The application provides a processing method and a processing system of a flexible circuit board, and belongs to the technical field of electronic manufacturing.
Background
A flexible circuit board (Flexible Printed Circuit Board, abbreviated as FPCB) is an electronic circuit board having a flexible substrate (typically, a polyamide film or a polyester film) as a supporting structure. It has high flexibility and bendability, and can be used in devices with different shapes or in narrow spaces. The flexible wiring board can be better adapted to a complex three-dimensional structure and normally operate in a bent, folded or curled state, as compared to a rigid wiring board. They are typically composed of a conductive copper foil, an insulating layer and a cover layer, and the circuit pattern is made on a flexible substrate by printing techniques. The flexible circuit board has the characteristics of light weight, small volume, high reliability, excellent conductivity and the like, and is widely applied to the fields of consumer electronics (such as mobile phones and tablet computers), automotive electronics, medical equipment, aerospace and the like so as to meet special requirements of circuit connection.
Disclosure of Invention
The application provides a processing method and a processing system of a flexible circuit board, which are used for solving the problems of low processing precision, complex process and higher cost of the flexible circuit board in the prior art:
the application provides a processing method of a flexible circuit board, which is characterized by comprising the following steps:
s1: selecting a flexible circuit board substrate to be processed;
s2: designing a circuit pattern to be designed and processed, importing the circuit pattern into a computer, and converting the circuit pattern into a digital file through computer aided design software;
s3: loading the digitized file into a flexible circuit board processing system;
s4: coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking the light-transmitting glue to solidify the light-transmitting glue;
s5: covering the light-transmitting layer with photoresist, and exposing through a mask; forming a circuit pattern to be processed;
s6: carrying out metallization treatment on the photoresist template to form a conductive layer;
s7: stripping the photoresist template, and cleaning and treating to obtain a processed flexible circuit board;
s8: and (3) comprehensively detecting the processed flexible circuit board, wherein the detection comprises electric performance detection and reliability verification, and repairing the existing defects.
Further, the flexible circuit board substrate comprises a polyimide film, a polyester film and a polyether film.
Furthermore, the design needs to design a circuit pattern to be processed, the circuit pattern is imported into a computer, and the circuit pattern is converted into a digital file through computer aided design software; comprising the following steps:
the function and the application of the circuit pattern are defined, and the final finished product requirement is determined;
designing a circuit pattern of the flexible circuit board according to the requirements of the finished product and the application scene, wherein the circuit pattern comprises a shape, a size, a position and a conductivity type;
the designed circuit pattern is imported into a computer through circuit design software;
the imported line patterns are converted into digitized files by computer aided design software.
Further, before designing the circuit pattern of the flexible circuit board, the circuit is laid out and optimized through design software and algorithms, wherein the algorithms comprise a wiring algorithm and a noise interference analysis algorithm, and the wiring algorithm comprises a genetic algorithm, a simulated annealing algorithm and a tabu search algorithm.
Furthermore, the circuit pattern is converted into a digitized file through computer aided design software, the circuit pattern is divided into a plurality of areas, and the areas are distributed to different processing units for parallel processing through a parallel processing technology.
Further, a layer of light-transmitting glue is coated on the surface of the substrate of the flexible circuit board, and baking treatment is carried out on the light-transmitting glue to enable the light-transmitting glue to be solidified; comprising the following steps:
selecting a novel light-transmitting adhesive material with high light transmittance and adhesive force;
before coating the light-coating adhesive, treating the surface of the flexible circuit board substrate, wherein the treatment comprises plasma treatment and chemical treatment;
coating the surface of the flexible circuit board substrate by selecting a proper coating method according to technical requirements and scale, wherein the coating method comprises blade coating, spraying and printing;
and carrying out light curing on the surface of the coated flexible circuit board through ultraviolet curing equipment.
Further, the reliability verification includes detecting durability, abrasion resistance and bending resistance of the flexible circuit board.
Further, the metallization processing process is monitored in real time through the sensor, metallization processing process data are obtained, the metallization processing process data are analyzed, and predictive maintenance and exception handling are performed on analysis results through artificial intelligence.
The application provides a processing system of a flexible circuit board, which comprises:
and (3) selecting a base material: selecting a flexible circuit board substrate to be processed;
and a circuit design module: designing a circuit pattern to be designed and processed, importing the circuit pattern into a computer, and converting the circuit pattern into a digital file through computer aided design software;
a file loading module: loading the digitized file into a flexible circuit board processing system;
and (3) baking a module: coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking the light-transmitting glue to solidify the light-transmitting glue;
a pattern forming module: covering the light-transmitting layer with photoresist, and exposing through a mask; forming a circuit pattern to be processed;
and a metallization processing module: carrying out metallization treatment on the photoresist template to form a conductive layer;
stripping module: stripping the photoresist template, and cleaning and treating to obtain a processed flexible circuit board;
and (3) comprehensively detecting the processed flexible circuit board, wherein the detection comprises electric performance detection and reliability verification, and repairing the existing defects.
The application provides an electronic device, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the memory, wherein the processor executes the program to realize the processing method of the flexible circuit board.
The application has the beneficial effects that: the flexible circuit board can be precisely processed by adopting the flexible processing method; including cutting of film material, fabrication of printed circuits, assembly, etc. Compared with the traditional rigid circuit board processing method, the flexible processing method is more suitable for meeting the requirements of complex shapes such as curved surfaces, bending and the like, and can meet the design requirements of more flexible and diversified products; the flexible circuit board has better flexibility and stretchability, and can adapt to the assembly requirements of various complex shapes. The flexible processing method can be more flexible in design, and meets the requirements of light weight, miniaturization, high reliability and the like of products. Meanwhile, the processing method of the flexible circuit board can also realize innovative designs and functional realization such as multilayer stacking, three-dimensional assembly and the like; the processing method of the flexible circuit board adopts automatic equipment and advanced production technology, and can improve the production efficiency. Compared with the traditional manual operation, the flexible processing method can reduce the labor cost, shorten the processing period and improve the productivity and the production efficiency; the processing method of the flexible circuit board can realize accurate material utilization and reduce waste. Meanwhile, the flexible processing method can realize high-density wiring, improve the space utilization rate, reduce the product size and reduce the material cost. In addition, the flexible circuit board has the characteristics of better heat resistance, vibration resistance, corrosion resistance and the like, and can reduce maintenance and replacement cost; the circuit board manufactured by the flexible processing method has better reliability and stability. Through accurate processing and quality control, the flexible circuit board can ensure that the connection between the electronic components is good to can adapt to complicated operational environment and stress, improve reliability and the durability of product.
Drawings
Fig. 1 is a process step diagram of a flexible circuit board according to the present application.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It should be noted that, without conflict, the embodiments of the present application and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
According to one embodiment of the application, the processing method of the flexible circuit board is characterized by comprising the following steps:
s1: selecting a flexible circuit board substrate to be processed;
s2: designing a circuit pattern to be designed and processed, importing the circuit pattern into a computer, and converting the circuit pattern into a digital file through computer aided design software;
s3: loading the digitized file into a flexible circuit board processing system;
s4: coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking the light-transmitting glue to solidify the light-transmitting glue;
s5: covering the light-transmitting layer with photoresist, and exposing through a mask; forming a circuit pattern to be processed;
s6: carrying out metallization treatment on the photoresist template to form a conductive layer;
s7: stripping the photoresist template, and cleaning and treating to obtain a processed flexible circuit board;
s8: and (3) comprehensively detecting the processed flexible circuit board, wherein the detection comprises electric performance detection and reliability verification, and repairing the existing defects.
The flexible circuit board substrate comprises a polyimide film, a polyester film and a polyether film.
The working principle of the technical scheme is as follows: suitable materials are selected from the alternative flexible circuit board substrates, such as polyimide films, polyester films, polyether films, and the like. The choice of substrate is typically based on application requirements and performance requirements. The circuit pattern to be processed is designed and is imported into a computer. The circuit pattern is converted into a digital file through computer aided design software, so that the digital file is loaded into a flexible circuit board processing system for subsequent processing, and the processing equipment is controlled to perform automatic processing. And coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking to solidify the light-transmitting glue. This step facilitates the formation of a photoresist layer for subsequent patterning. And covering the photoresist on the light-transmitting adhesive layer, and exposing through a mask. The mask defines a circuit pattern to be processed, and the pattern is transferred to the photoresist layer through exposure; carrying out metallization treatment on the photoresist template to form a conductive layer; the metallization process may use various techniques such as etching or depositing metal to impart conductive properties to the circuit; and stripping the photoresist template, and cleaning and treating the photoresist template to obtain the processed flexible circuit board. This step, also known as the process of removing residue, ensures that the surface of the circuit board is clean. And carrying out comprehensive detection on the processed flexible circuit board, including electrical property detection and reliability verification. In the process, potential circuit faults, short circuits or open circuits can be detected and the existing defects repaired.
The technical scheme has the effects that: by using computer aided design software and a digital file, high-precision circuit pattern design and processing can be realized, and the flexible circuit board is ensured to have accurate circuit connection; after the digitized file is loaded into the flexible circuit board processing system, the whole processing process can be automatically carried out, so that the production efficiency and consistency are improved; different base materials such as polyimide film, polyester film, polyether film and the like can be used for the flexible circuit board, and proper materials can be selected according to application requirements. This flexibility allows the flexible circuit board to be adapted for use with a variety of different types of electronic devices and products; compared with the traditional rigid circuit board, the flexible circuit board can be bent and rolled, saves space and meets the compact design requirement; because the flexible circuit board uses a light and thin substrate, the overall weight is lighter than that of a rigid circuit board; through comprehensive detection and reliability verification, the flexible circuit board can be ensured to have stable electrical performance and long service life in the use process.
In one embodiment of the application, the circuit pattern to be designed and processed is designed, the circuit pattern is imported into a computer, and the circuit pattern is converted into a digital file through computer aided design software; comprising the following steps:
the function and the application of the circuit pattern are defined, and the final finished product requirement is determined;
designing a circuit pattern of the flexible circuit board according to the requirements of the finished product and the application scene, wherein the circuit pattern comprises a shape, a size, a position and a conductivity type;
the designed circuit pattern is imported into a computer through circuit design software;
the imported line patterns are converted into digitized files by computer aided design software.
The working principle of the technical scheme is as follows: before designing the flexible circuit board, defining the functions and purposes to be realized by the circuit pattern and the requirements of finished products, such as circuit connection mode, current transmission requirements, size limitation and the like; and then designing a circuit pattern of the flexible circuit board according to the requirements of the finished product and the application scene: according to the clear finished product requirements and application scenes, designing a circuit graph by using design software; including determining the shape, size, location, conductivity type, etc. of the circuit pattern; the designed circuit pattern is imported into circuit design software, and common circuit design software such as aluminum Designer and Cadence Allegro can be used; the designed line graph is converted to a digitized file by computer aided design software, typically using a standard file format, such as the Gerber file format. The digitized file contains various information of the line pattern, such as a hierarchical structure, a wire path, a component layout, and the like.
The technical scheme has the effects that: before design, the function and the purpose of the clear circuit pattern can ensure that the designed circuit meets the requirement and the final finished product can achieve the expected effect; according to the requirements of finished products and application scenes, the circuit pattern of the flexible circuit board is designed to ensure the accuracy and reliability of the circuit, so that the flexible circuit board can adapt to different application requirements; the circuit can be further optimized and verified by importing the circuit pattern through the circuit design software. The software can provide an automatic checking function, so that potential problems can be eliminated, and the correctness and stability of the circuit are ensured; by converting the line pattern into a digitized file, standardization and convenient transmission of data can be realized. The digital file can be conveniently shared with other related parties and used for processing and manufacturing processes, so that the production efficiency is improved.
In one embodiment of the application, before designing the circuit pattern of the flexible circuit board, the layout and optimization of the circuit are carried out through design software and algorithms, wherein the algorithms comprise a wiring algorithm and a noise interference analysis algorithm, and the wiring algorithm comprises a genetic algorithm, a simulated annealing algorithm and a tabu search algorithm.
The working principle and the effect of the technical scheme are as follows: the wiring algorithm can be used for automatically laying out the circuits, so that the time and labor cost of manual wiring are reduced. The wiring algorithm can quickly generate various wiring schemes, so that a designer is helped to quickly select the optimal layout scheme; the wiring algorithm can consider the factors such as the length, the path and the connection relation of the wires, and the like, and reduces the length and the path of the wires as much as possible on the premise of meeting the functional requirement, thereby reducing the delay and the loss during signal transmission and improving the reliability and the stability of signals; the noise interference analysis algorithm can analyze and optimize the circuit, reduce the interference received in the signal transmission process, improve the anti-interference capability and reduce the occurrence of signal distortion and errors; wiring algorithms such as a genetic algorithm, a simulated annealing algorithm, a tabu search algorithm and the like have different search strategies and optimization effects, and the most suitable algorithm can be selected to perform wiring optimization according to specific conditions, so that the quality and effect of a wiring result are improved; through the optimization of a wiring algorithm and a noise interference analysis algorithm, the problems of electromagnetic interference, cross coupling and the like in a circuit can be reduced, the reliability and stability of the design are improved, and the failure rate is reduced.
In one embodiment of the application, the circuit pattern is converted into a digitized file by the aid of computer aided design software, the circuit pattern is divided into a plurality of areas, and the areas are distributed to different processing units for parallel processing by a parallel processing technology.
The working principle of the technical scheme is as follows: first, a hand-drawn or electronically drawn line graphic is entered into computer aided design software. The line graph is then converted into a digitized file, such as a common format, e.g., a Gerber file, a DXF file, etc., by scanning or manual input, for processing and analysis by a computer; for large line patterns, they can be segmented into multiple regions. The purpose of segmentation is to realize parallel processing and improve processing efficiency and speed. The segmentation can be performed in a spatial position, a circuit module or a hierarchical structure and the like, so that each region can be independently processed; different areas are distributed to different processing units for parallel processing through a parallel processing technology. Parallel processing may be implemented using a multi-core processor, clustered computing, or distributed computing, among others. Each processing unit independently processes the area which is responsible for the processing unit, so that the processing speed and the processing efficiency are improved.
The technical scheme has the effects that: multiple areas can be processed simultaneously by a parallel processing technology, so that the processing speed of a circuit graph is increased, and the design efficiency and the working efficiency are improved; the circuit graph is divided into a plurality of areas and is distributed to different processing units for processing, so that the computing resources can be fully utilized, and the resource utilization rate is improved; the parallel processing technology can provide real-time performance and interactivity, so that a designer can quickly acquire a processing result and timely adjust and improve the processing result; by dividing the line graph into a plurality of areas, the parallel processing technology has better expandability and flexibility, and can increase or decrease processing units according to the needs, thereby adapting to the line graph processing requirements of different scales and complexity.
According to one embodiment of the application, a layer of light-transmitting glue is coated on the surface of a flexible circuit board substrate, and baking treatment is carried out on the light-transmitting glue to enable the light-transmitting glue to be solidified; comprising the following steps:
selecting a novel light-transmitting adhesive material with high light transmittance and adhesive force;
before coating the light-coating adhesive, treating the surface of the flexible circuit board substrate, wherein the treatment comprises plasma treatment and chemical treatment;
coating the surface of the flexible circuit board substrate by selecting a proper coating method according to technical requirements and scale, wherein the coating method comprises blade coating, spraying and printing;
and carrying out light curing on the surface of the coated flexible circuit board through ultraviolet curing equipment.
The working principle of the technical scheme is as follows: firstly, a novel light-transmitting adhesive material with high light transmittance and adhesive force is selected. This material needs to be capable of forming a uniform and transparent film on the surface of the flexible circuit board substrate and to have good adhesion to ensure that the coated light-transmitting glue is fixed to the substrate; before the light-transmitting glue is coated, the surface of the substrate of the flexible circuit board is treated. The treatment method comprises plasma treatment and chemical treatment. The plasma treatment can remove dirt and grease on the surface, increase the roughness of the surface of the substrate and improve the adhesive force of the transparent adhesive. Chemical treatment can improve the chemical property of the surface of the substrate by using a specific cleaning agent, an activating agent or a precoating agent, so as to improve the adhesiveness of the light-transmitting glue; and (3) selecting a proper coating method according to technical requirements and scale to coat the surface of the flexible circuit board substrate. Common coating methods include knife coating, spray coating, and printing. The doctor blade coating method uses a doctor blade to coat the transparent glue on the surface of the substrate, the spraying method uses a spray gun to uniformly spray the transparent glue on the surface of the substrate, and the printing method uses a die or a printing machine to print the transparent glue on the surface of the substrate; and carrying out light curing on the coated flexible circuit board through ultraviolet curing equipment. The light irradiation of ultraviolet rays can trigger the photoinitiator in the light-transmitting glue to generate a crosslinking reaction, so that the light-transmitting glue is solidified into a hard transparent film. The solidified light-transmitting glue is adhered on the base material to form a surface layer with high light transmission.
The technical scheme has the effects that: by coating the transparent adhesive, a transparent film can be formed on the surface of the substrate of the flexible circuit board, and the light transmittance of the circuit board is remarkably improved. The transparent surface layer can enable light to penetrate better, so that loss of the light in the circuit board is avoided, and visibility and brightness of the electronic device are improved; the novel light-transmitting adhesive material with high adhesive force is selected, and the surface of the base material is subjected to plasma treatment and chemical treatment, so that the adhesive force between the light-transmitting adhesive and the base material can be increased, the light-transmitting adhesive is ensured to be closely adhered to the base material, and the risks of falling and stripping are reduced; different coating methods such as knife coating, spray coating or printing can be selected according to the technical requirements and the scale. The method has flexibility and adaptability, can meet the requirements of different products, and realizes uniform and consistent coating effect of the transparent adhesive; the light-transmitting glue can be quickly cured and form a hard film by carrying out light curing through ultraviolet curing equipment. The cured light-transmitting glue has good durability and stability, and can effectively maintain the light-transmitting performance in the use process.
In one embodiment of the application, the reliability verification includes detecting the durability, wear resistance and bending resistance of the flexible circuit board.
The working principle of the technical scheme is as follows: the durability test is performed by simulating the durability performance of a flexible circuit board over long periods of use and environmental conditions. Common testing methods include hot cold shock, wet heat cycling, vibration and shock, and the like. In the test, the flexible circuit board coated with the light-transmitting glue is exposed under different stresses, the change conditions of indexes such as adhesiveness, light transmittance and integrity of a surface layer of the light-transmitting glue are observed, and the durability of the flexible circuit board is evaluated; the abrasion resistance test is mainly used for evaluating the abrasion resistance of the surface layer of the light-transmitting adhesive. Common test methods include friction tests and abrasive wear tests. In the test, the flexible circuit board coated with the light-transmitting glue on the surface is contacted with a friction object or an abrasive, the light-transmitting glue is subjected to repeated reciprocating friction or rotary abrasion, and the abrasion resistance of the light-transmitting glue is evaluated by observing the abrasion condition of the light-transmitting glue; the bending resistance test is used for evaluating the performance of the light-transmitting adhesive of the flexible circuit board under bending stress. Common test methods include bend tests and bend life tests. In the test, the flexible circuit board coated with the light-transmitting glue is bent for a plurality of times, and the adhesiveness, light transmittance and surface damage condition of the surface layer of the light-transmitting glue are observed to evaluate the bending resistance.
The technical scheme has the effects that: through reliability verification, the light-transmitting adhesive coating can be ensured to have good durability, wear resistance and bending resistance on the flexible circuit board. Thus, the stability and reliability of the product under long-time use and various environmental conditions can be ensured; the durability of the light-transmitting glue coating determines the service life of the flexible circuit board. After the reliability verification, the light-transmitting adhesive coating can be confirmed to withstand long-time use and various stresses, and damage and degradation caused by use environment and stress are reduced, so that the service life and durability of the product are prolonged; the light-transmitting adhesive coating has good wear resistance, and can effectively protect the flexible circuit board and the electronic device from physical damage such as external friction, scraping and the like. This helps to reduce the risk of damage to the circuit board, improving the reliability and stability of the product; through durability verification, the light-transmitting glue coating can keep good light-transmitting performance, and the visibility and brightness of the product are improved while the circuit board is protected. This is advantageous to enhance the user experience so that the product is clearly visible in various environments.
According to one embodiment of the application, the metallization process is monitored in real time through the sensor, metallization process data are obtained, the metallization process data are analyzed, and predictive maintenance and exception handling are performed on analysis results through artificial intelligence.
The working principle of the technical scheme is as follows: during the metallization process, key parameters such as temperature, humidity, current, voltage, etc. are monitored in real time by arranging appropriate sensor devices. The sensors can transmit the acquired data to a computer or a data acquisition system in the form of digital signals; the computer or the data acquisition system receives the data transmitted by the sensor, acquires and records the data, and stores the data in a database or related data storage equipment. Thus, the integrity and traceability of the data can be ensured, and basic data is provided for subsequent analysis and processing; the metallization process data is extracted from the database, and the data is processed and analyzed using data analysis techniques such as statistical analysis, machine learning, artificial intelligence, and the like. Extracting key information by identifying modes, trends and anomalies in the data, exploring rules and laws behind the data for predictive maintenance and anomaly handling; based on the result of the data analysis, a prediction model and an anomaly detection model are established by using an artificial intelligence algorithm. The prediction model can predict the performance and the fault probability of the metallization processing device according to the historical data and the current state, and reasonable maintenance planning and arrangement can be performed. The abnormal detection model can detect abnormal conditions in the real-time monitoring process, and timely give an alarm or take measures to avoid equipment faults or production accidents.
The technical scheme has the effects that: the sensor is used for monitoring the metallization processing process in real time, so that the change condition of key parameters can be timely obtained, and the real-time understanding of the processing process is realized. Problems can be found in time, accidents can be prevented, and measures can be quickly taken to adjust and correct the problems; through obtaining the data of the metallization processing process and analyzing the data, the change trend and rule in the process can be known in depth; the processing parameters can be optimized, the production process is improved, and the product quality and the production efficiency are improved; analyzing the metallization processing process data through an artificial intelligence algorithm, and establishing a prediction model, so that the fault probability and the performance condition of the equipment can be predicted; reasonable maintenance plans can be formulated, equipment faults can be prevented in advance, and downtime and maintenance cost are reduced; abnormal conditions in the process of processing, such as temperature fluctuation, current abnormality and the like, can be timely found out by carrying out abnormal detection on the metallization processing process data through an artificial intelligence algorithm. Measures can be taken in time, production accidents are avoided, normal operation of a production line is guaranteed, and product quality and safety are improved; through real-time monitoring, data analysis, predictive maintenance and exception handling, enterprises can be helped to optimize the production process, and the production efficiency and the product quality are improved. And problems are found in time, and are adjusted and corrected, so that faults and downtime are reduced, the defective rate is reduced, and the stability and reliability of the production line are improved.
In one embodiment of the present application, a system for processing a flexible circuit board, the system comprising:
and (3) selecting a base material: selecting a flexible circuit board substrate to be processed;
and a circuit design module: designing a circuit pattern to be designed and processed, importing the circuit pattern into a computer, and converting the circuit pattern into a digital file through computer aided design software;
a file loading module: loading the digitized file into a flexible circuit board processing system;
and (3) baking a module: coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking the light-transmitting glue to solidify the light-transmitting glue;
a pattern forming module: covering the light-transmitting layer with photoresist, and exposing through a mask; forming a circuit pattern to be processed;
and a metallization processing module: carrying out metallization treatment on the photoresist template to form a conductive layer;
stripping module: stripping the photoresist template, and cleaning and treating to obtain a processed flexible circuit board;
and (3) comprehensively detecting the processed flexible circuit board, wherein the detection comprises electric performance detection and reliability verification, and repairing the existing defects.
The working principle of the technical scheme is as follows: suitable materials are selected from the alternative flexible circuit board substrates, such as polyimide films, polyester films, polyether films, and the like. The choice of substrate is typically based on application requirements and performance requirements. The circuit pattern to be processed is designed and is imported into a computer. The circuit pattern is converted into a digital file through computer aided design software, so that the digital file is loaded into a flexible circuit board processing system for subsequent processing, and the processing equipment is controlled to perform automatic processing. And coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking to solidify the light-transmitting glue. This step facilitates the formation of a photoresist layer for subsequent patterning. And covering the photoresist on the light-transmitting adhesive layer, and exposing through a mask. The mask defines a circuit pattern to be processed, and the pattern is transferred to the photoresist layer through exposure; carrying out metallization treatment on the photoresist template to form a conductive layer; the metallization process may use various techniques such as etching or depositing metal to impart conductive properties to the circuit; and stripping the photoresist template, and cleaning and treating the photoresist template to obtain the processed flexible circuit board. This step, also known as the process of removing residue, ensures that the surface of the circuit board is clean. And carrying out comprehensive detection on the processed flexible circuit board, including electrical property detection and reliability verification. In the process, potential circuit faults, short circuits or open circuits can be detected and the existing defects repaired.
The technical scheme has the effects that: by using computer aided design software and a digital file, high-precision circuit pattern design and processing can be realized, and the flexible circuit board is ensured to have accurate circuit connection; after the digitized file is loaded into the flexible circuit board processing system, the whole processing process can be automatically carried out, so that the production efficiency and consistency are improved; different base materials such as polyimide film, polyester film, polyether film and the like can be used for the flexible circuit board, and proper materials can be selected according to application requirements. This flexibility allows the flexible circuit board to be adapted for use with a variety of different types of electronic devices and products; compared with the traditional rigid circuit board, the flexible circuit board can be bent and rolled, saves space and meets the compact design requirement; because the flexible circuit board uses a light and thin substrate, the overall weight is lighter than that of a rigid circuit board; through comprehensive detection and reliability verification, the flexible circuit board can be ensured to have stable electrical performance and long service life in the use process.
An embodiment of the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and capable of running on the memory, where the processor executes the program to implement a method for processing a flexible circuit board as described in any one of the above.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A method of processing a flexible circuit board, the method comprising:
selecting a flexible circuit board substrate to be processed;
designing a circuit pattern to be designed and processed, importing the circuit pattern into a computer, and converting the circuit pattern into a digital file through computer aided design software;
loading the digitized file into a flexible circuit board processing system;
coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking the light-transmitting glue to solidify the light-transmitting glue;
covering the light-transmitting layer with photoresist, and exposing through a mask; forming a circuit pattern to be processed;
carrying out metallization treatment on the photoresist template to form a conductive layer;
stripping the photoresist template, and cleaning and treating to obtain a processed flexible circuit board;
and (3) comprehensively detecting the processed flexible circuit board, wherein the detection comprises electric performance detection and reliability verification, and repairing the existing defects.
2. The method of claim 1, wherein the flexible circuit substrate comprises polyimide film, polyester film, and polyether film.
3. The method for processing a flexible printed circuit according to claim 1, wherein the circuit pattern to be designed and processed is designed, the circuit pattern is imported into a computer, and the circuit pattern is converted into a digital file by computer aided design software; comprising the following steps:
the function and the application of the circuit pattern are defined, and the final finished product requirement is determined;
designing a circuit pattern of the flexible circuit board according to the requirements of the finished product and the application scene, wherein the circuit pattern comprises a shape, a size, a position and a conductivity type;
the designed circuit pattern is imported into a computer through circuit design software;
the imported line patterns are converted into digitized files by computer aided design software.
4. A method of manufacturing a flexible printed circuit board according to claim 3, wherein the layout and optimization of the wiring is performed by design software and algorithms including a wiring algorithm including a genetic algorithm, a simulated annealing algorithm, and a tabu search algorithm, before the wiring pattern of the flexible printed circuit board is designed.
5. A method for processing a flexible printed circuit according to claim 3, wherein the circuit pattern is converted into a digitized file by computer aided design software, the circuit pattern is divided into a plurality of areas, and the areas are distributed to different processing units for parallel processing by parallel processing technology.
6. The method for processing the flexible circuit board according to claim 1, wherein a layer of light-transmitting glue is coated on the surface of the substrate of the flexible circuit board, and the substrate is baked to be solidified; comprising the following steps:
selecting a novel light-transmitting adhesive material with high light transmittance and adhesive force;
before coating the light-coating adhesive, treating the surface of the flexible circuit board substrate, wherein the treatment comprises plasma treatment and chemical treatment;
coating the surface of the flexible circuit board substrate by selecting a proper coating method according to technical requirements and scale, wherein the coating method comprises blade coating, spraying and printing;
and carrying out light curing on the surface of the coated flexible circuit board through ultraviolet curing equipment.
7. The method of claim 1, wherein the reliability verification includes detecting durability, wear resistance, and bending resistance of the flexible circuit board.
8. The method for processing a flexible printed circuit according to claim 1, wherein the metallization process is monitored in real time by a sensor to obtain metallization process data, the metallization process data is analyzed, and predictive maintenance and exception handling are performed on the analysis result by artificial intelligence.
9. A processing system of a flexible circuit board is characterized in that: the system comprises:
and (3) selecting a base material: selecting a flexible circuit board substrate to be processed;
and a circuit design module: designing a circuit pattern to be designed and processed, importing the circuit pattern into a computer, and converting the circuit pattern into a digital file through computer aided design software;
a file loading module: loading the digitized file into a flexible circuit board processing system;
and (3) baking a module: coating a layer of light-transmitting glue on the surface of the substrate of the flexible circuit board, and baking the light-transmitting glue to solidify the light-transmitting glue;
a pattern forming module: covering the light-transmitting layer with photoresist, and exposing through a mask; forming a circuit pattern to be processed;
and a metallization processing module: carrying out metallization treatment on the photoresist template to form a conductive layer;
stripping module: stripping the photoresist template, and cleaning and treating to obtain a processed flexible circuit board;
and (3) comprehensively detecting the processed flexible circuit board, wherein the detection comprises electric performance detection and reliability verification, and repairing the existing defects.
10. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the memory, the processor executing the program to implement the method of processing a flexible circuit board according to any one of claims 1-8.
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| CN118315120A (en) * | 2024-06-07 | 2024-07-09 | 珠海智锐科技有限公司 | Flexible transparent conductive film and preparation process thereof |
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