CN117014080A - test suite - Google Patents

Abstract

The invention discloses a test suite, which is used for testing tested equipment and comprises the following components: a socket structure for accommodating the device under test; and a plunger assembly removably coupled to the socket structure, wherein the plunger assembly comprises a multi-layered structure including a nest and at least one interposer substrate mounted below the nest. When the test kit is used for testing, the path of the test signal is shorter, so that the test kit is particularly suitable for testing high-frequency signals such as millimeter waves, the path loss of the high-frequency signals can be reduced, and the accuracy and the reliability of the test are ensured; in addition, the test suite provided by the invention can be suitable for various different types of test equipment, has wider applicability, and has the advantages of cost and test convenience.

Description

Test suite

Technical Field

The invention relates to the technical field of testing, in particular to a testing suite.

Background

Millimeter wave (mmW) communication systems have attracted tremendous interest in meeting the capacity requirements of 5G networks. Transmission in the millimeter wave band places high demands on test electronics to ensure proper operation of the transmission and reception circuitry. To detect electrical characteristics of a device under test (device under test, DUT), the DUT is electrically connected to the test equipment in a stable manner. Generally, a test socket is a tool for electrically connecting a DUT to a test instrument.

Disadvantages of current test systems include longer test times and larger physical dimensions of the test system. In addition, it is difficult to test a DUT that is capable of transmitting millimeter wave signals at its bottom and top because conventional plungers (plungers) designed to pick and place the DUT in sockets cannot capture or transmit millimeter wave signals. It is desirable to have a reliable and cost-effective test system (test suite) for mass testing millimeter wave devices.

Disclosure of Invention

In view of the above, the present invention provides a test kit for testing a device under test to solve the above-mentioned problems.

According to a first aspect of the present invention, there is disclosed a test kit for testing a device under test, comprising:

a socket structure for accommodating the device under test;

and a plunger assembly removably coupled to the socket structure, wherein the plunger assembly comprises a multi-layered structure including a nest and at least one interposer substrate mounted below the nest.

The test kit of the present invention comprises: a socket structure for accommodating the device under test; and a plunger assembly removably coupled to the socket structure, wherein the plunger assembly comprises a multi-layered structure including a nest and at least one interposer substrate mounted below the nest. By adopting the technical scheme, when the tested equipment is tested, after the tested equipment transmits millimeter wave signals, the millimeter wave signals can be received by the antenna structure on at least one medium layer substrate, and then the antenna structure on at least one medium layer substrate is transmitted again and is received by the antenna structure of the tested equipment, so that the test operation is carried out; when the test kit is used for testing, the path of the test signal is shorter, so that the test kit is particularly suitable for testing high-frequency signals such as millimeter waves, the path loss of the high-frequency signals can be reduced, and the accuracy and the reliability of the test are ensured; in addition, the test suite provided by the embodiment of the invention can be suitable for various different types of test equipment, has wider applicability, and has the advantages of cost and test convenience.

Drawings

FIG. 1 is a schematic cross-sectional view of a test kit for testing a DUT in accordance with one embodiment of the invention;

fig. 2 is a schematic side view of the plunger assembly (plunger assembly) of fig. 1 in accordance with one embodiment of the present invention.

FIG. 3 is an exploded view of the plunger assembly of FIG. 2;

fig. 4 is a partial layout view of a spring pin and a partial cross-sectional view of a top socket according to an embodiment of the present invention;

FIG. 5 illustrates various types of top receptacles suitable for different types of DUTs according to some embodiments of the invention;

FIG. 6 is a schematic diagram of a test kit for testing a DUT in accordance with another embodiment of the invention;

FIG. 7 is a schematic diagram of a test kit for testing DUTs according to yet another embodiment of the present invention;

FIG. 8 is a schematic diagram of a test kit for testing DUTs according to yet another embodiment of the present invention;

FIG. 9 is a schematic diagram of a test kit for testing DUTs according to yet another embodiment of the present invention; and

fig. 10 is a schematic diagram illustrating a near field (near field) loop echo beam forming (loopback beamforming) test according to an embodiment of the present invention.

Detailed Description

In the following detailed description of the embodiments of the present invention, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific preferred embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice them, and it is to be understood that other embodiments may be utilized and that mechanical, structural and procedural changes may be made without departing from the spirit and scope of the present invention. The invention relates to a method for manufacturing a semiconductor device. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of embodiments of the present invention is defined only by the appended claims.

It will be understood that, although the terms "first," "second," "third," "primary," "secondary," etc. may be used herein to describe various components, elements, regions, layers and/or sections, these components, elements, regions, these layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first or primary component, region, layer or section discussed below could be termed a second or secondary component, region, layer or section without departing from the teachings of the present inventive concept.

Further, spatially relative terms such as "below," "under," "above," "over," and the like may be used herein for ease of description to describe one component or feature's relationship thereto. Another component or feature as shown. In addition to the orientations depicted in the drawings, the spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. In addition, it will also be understood that when a "layer" is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

The terms "about", "approximately" and "approximately" generally mean within a range of ±20% of a specified value, or ±10% of the specified value, or ±5% of the specified value, or ±3% of the specified value, or ±2% of the specified value, or ±1% of the specified value, or ±0.5% of the specified value. The prescribed value of the present invention is an approximation. When not specifically described, the stated values include the meaning of "about," approximately, "and" about. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular terms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the inventive concepts. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be understood that when an "element" or "layer" is referred to as being "on," "connected to," "coupled to" or "adjacent to" another element or layer, it can be directly on, connected to, coupled to or adjacent to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly connected to," "directly coupled to," or "directly adjacent to" another element or layer, there are no intervening elements or layers present.

Note that: (i) The same features will be denoted by the same reference numerals throughout the figures and not necessarily described in detail in each of the figures in which they appear, and (ii) a series of figures may show different aspects of a single item, each of which is associated with various reference labels that may appear in the entire sequence or may appear only in selected figures of the sequence.

The wireless microelectronic device (Wireless microelectronic device) is typically subjected to various tests to ensure adequate performance and to verify its RF (radio frequency) functionality. Some tests are enforced by the standard, while others are part of product development and validation. When a radio frequency signal is transmitted from a transmitter to a receiver, the signal propagates in the radio channel along one or more paths having different angles of arrival (angles of arrival), signal delays (delays), polarizations (polarization) and powers (powers), resulting in signals of different received durations and strengths. In addition, noise and interference due to other transmitters may also interfere with the radio connection.

The present invention relates to a wireless test system (or test kit) for testing microelectronic devices or modules. Embodiments of the present invention are directed to improvements in test suites for holding and/or testing a Device Under Test (DUT). For example, a method of testing a DUT may include setting the DUT to a simultaneous transmit and receive mode; receiving a lower frequency Radio Frequency (RF) signal (low frequency RF signal) from a test unit; up-converting (up-converting) the lower frequency radio frequency signal into a higher frequency radio frequency signal (high frequency RF signal); circuitry to transmit higher frequency RF signals (high frequency RF signals) from the DUT through the top socket to the interposer substrate (interposer substrate); receiving higher frequency RF signals (high frequency RF signals) through the top jack and DUT; down-converting (converting) the received higher frequency RF signal (high frequency RF signal) into a received test RF signal; the received test RF signal is provided to a test unit.

DUT is a term that is generally used to refer to any electronic device or module that performs any test. In semiconductor testing, a DUT is typically plugged into a test socket that is connected to automated test equipment (automatic test equipment, ATE). ATE is widely used in the manufacturing industry to test various types of semiconductor devices, such as packaged or unpackaged integrated circuit (integrated circuit, IC) devices, antenna input modules or antenna modules (AIM), printed circuit boards (printed circuit board, PCBs), and the like.

The invention is particularly applicable to, but not limited to, radiation testing (or operation, running) of RF microelectronic devices or DUTs that may be driven and/or sensed by RF transmitter and/or receiver circuitry, and may operate (or operate) in a range of, for example, 20GHz to 300GHz (millimeter wave frequency), such as in a frequency band (frequency band) around 24GHz, 60GHz, 77GHz, or 79 GHz. Various circuits and components may be provided on the interposer substrate to implement millimeter wave signal loop back (loopback) according to design requirements. The invention not only reduces the transmission path length to avoid excessive loss, but also implements mmW signal loop-back technique in a limited area.

Referring to FIG. 1, FIG. 1 is a schematic cross-sectional view of a test kit for testing a DUT in accordance with one embodiment of the invention. As shown in fig. 1, the test kit 1a includes a socket structure 10 and a plunger assembly 20 detachably coupled with the socket structure 10. According to one embodiment of the present invention, the socket structure 10 may include a socket housing 100, the socket housing 100 being secured to a load board 30, such as a printed wiring board or a printed circuit board. The load board 30 may also be referred to as a test board. Although not explicitly described, it is understood that the load board 30 generally includes a core (e.g., an FR4 copper clad laminate core), a plurality of dielectric build-up layers, and traces on opposite surfaces (e.g., two opposite surfaces) of the core. The traces of the different layers of the printed circuit board may be electrically connected to each other by plated through holes or vias. The circuitry on load board 30 may be electrically connected to a test unit (not shown) that includes a signal generator configured to generate a test signal.

According to one embodiment of the invention, load board 30 may incorporate custom circuitry specific to testing a particular DUT. For example, the load board 30 may be a custom RF load board that is specifically tailored for the radiation, electrical, and physical characteristics of a particular DUT. According to one embodiment of the invention, for example, the load board 30 may be electrically connected to the rf instrument circuit by rf cables and/or connectors. It will be appreciated that the load board 30 may also be connected to a DC (direct current) power supply, ground, digital input/output and/or a computer, not shown for simplicity. For example, in fig. 1, load board 30 includes a printed circuit board (printed circuit board, PCB) having a DUT side 30a and a non-DUT side 30 b. The DUT 130 may be plugged into the socket structure 10 on the DUT side 30 a. The non-DUT side 30b may access one or more RF connectors 310 to which RF cables 320 may be connected. Each RF connector 310 provides an RF connection to a tester. In embodiments of the present invention, the socket structure 10 may receive (or contain) the DUT 130 to test the DUT 130. Accordingly, the socket structure 10 has a location to receive the DUT 130, thereby facilitating testing of the DUT 130.

According to one embodiment of the present invention, the receptacle housing 100 may be made of a unitary (or monolithic) (monolithic) antistatic material (monolithic may be referred to as an integrally formed monolithic piece), including, but not limited to, durable high performance polyimide-based plastics such as, for example, SP1+ (dupont (tm)) having a dielectric constant (Dk) of about 3.5. According to one embodiment of the present invention, the socket housing 100 may include a plate-shaped base (plate-shaped base portion) 101 integrated with pin assemblies (pin assemblies) PN including, but not limited to, spring pins (pogo pins) P1, conductive pins (conductive pins) P2, and conductive pins P3. Conductive pins P2 and P3 may extend from the socket housing 100 and pass through (penetrate) corresponding through holes formed in the base portion or base 101 for transmitting signals. In accordance with one embodiment of the present invention, the base portion or base 101 serves as an interface between the load board 30 and the DUT, and the pin assembly PN may include at least two different types and lengths of spring pins to accommodate different devices (or apparatuses) under test. The test suite in this embodiment may be used for direct connection between the DUT 130 and the load board 30, and thus for electrical connection and signal transmission between the DUT 130 and the load board 30, when testing the DUT 130. The conductive pins P1, P2, and P3 may be referred to as first pins. The plate-like base (or plate-like base portion) 101 may also be referred to as a base 101, a base portion 101, or the like. Integral (or monolithic, monolithic) may refer to a structure, such as a structure, component, etc., that is integrally formed, etc. According to one embodiment of the present invention, the socket housing 100 is an integrally formed unitary piece that increases the mechanical strength of the structure of the test suite and reduces signal spillage and loss.

According to one embodiment of the invention, the receptacle housing 100 may include an annular peripheral structure 102 surrounding a base portion or base 101, thereby forming a cavity or cavity 110 defined by an inner sidewall of the annular peripheral structure 102 and an upper surface of the annular peripheral structure 102. According to one embodiment of the invention, the annular peripheral structure 102 is integrally formed with the base portion or base 101 to improve mechanical strength. According to one embodiment of the invention, the thickness (height) of the annular peripheral structure 102 is greater than the thickness (height) of the base portion or base 101. According to another embodiment of the present invention, the socket housing 100 may be in direct contact with the load board 30. However, when the receptacle housing 100 overlaps any high frequency signal traces on the load board 30, the receptacle housing 100 may be partially removed, i.e., the receptacle housing 100 may be moved according to wiring conditions on the load board 30. According to one embodiment of the invention, an electrically floating guide plate or plate (electrically floating guide plate) 120 for guiding and adjusting the position and/or rotation angle of the DUT 130 can be fittingly (fit) mounted within the cavity 110. The guide plate (or guide plate) 120 may be in direct contact with the socket housing 100. Electrically floating may refer to not being electrically connected to any voltage (including positive voltage, 0 volts, negative voltage, etc.). According to one embodiment of the present invention, the guide plate 120 is an integrally formed unitary piece that increases the mechanical strength of the structure of the test suite and reduces signal spillage and loss.

According to one embodiment of the invention, the guide plate 120 may be made of a monolithic (monolithic or monolithic) electrostatic-discharge (ESD) control material or a static dissipative material to prevent the DUT 130 from being damaged under high electrostatic voltages during testing. For example, the ESD control materials or static dissipative materials described above may include, but are not limited to, polyetheretherketone (polyether ether ketone, PEEK) based plastics, such as EKH-SS11 (Krefine) having a dielectric constant of about 5.3. Static dissipative materials are defined as materials having a surface resistance (surface resistance, SR) of 1x105 to 1x1011 ohm as defined by the international electrotechnical commission (International Electro-technical Commission, IEC) 61340-5-1. Static dissipative materials are difficult to charge and have low charge transfer rates, making them ideal materials for ESD sensitive applications.

The receptacle structure 10 may further include an annular receptacle base 150 for precise plunger alignment (precise alignment with the plunger assembly 20). According to one embodiment of the present invention, the socket base 150 is mounted and fixed on the upper surface 102S of the annular peripheral structure 102 of the socket housing 100. In accordance with one embodiment of the present invention, socket base 150 includes a through-hole center or central through-hole 150p that allows DUT 130 to pass through and a lower portion of interposer structure 20, which vacuum grips DUT 130 and places DUT 130 in a test position on socket structure 10. According to one embodiment of the invention, the receptacle base 150 may include an interior (portion) 151 surrounding the upper surface 102S of the annular peripheral structure 102 of the receptacle housing 100. The socket base 150 may be made of a monolithic antistatic material including, but not limited to, antistatic FR4 having a dielectric constant of about 4.37. According to one embodiment of the invention, the socket base 150 may include an absorbing material to avoid or mitigate signal coupling. According to one embodiment of the present invention, the socket base 150 is an integrally formed unitary piece that increases the mechanical strength of the structure of the test kit and reduces signal spillage and loss.

Referring to fig. 2 and 3, fig. 2 is a side view of the plunger assembly of fig. 1 according to one embodiment of the present invention. Fig. 3 is an exploded view of the plunger assembly of fig. 2. As shown in fig. 2 and 3, and briefly fig. 1, plunger assembly 20 generally comprises a multi-layer structure including, but not limited to: top receptacle 210, interposer substrate 220, nest 230, and pressing member 240. The interposer substrate 220 is sandwiched between the top socket 210 and the nest (or housing) 230.

The top socket 210 has high precision positioning capabilities when picking up the DUT 130. As shown in fig. 1, top socket 210 has embedded therein a plurality of metal spring pins (spring pins) P4 for mechanically and electrically connecting contact pads on DUT 130 to interposer substrate 220. The top socket 210 helps ensure that the contact pads on both sides of the DUT 130 make precise contact with the spring pins P1-P3 and P4, respectively. When the DUT 130 is tested, the test kit in this embodiment may be connected to the DUT 130 by using the interposer substrate 220 and the spring pin P4, so that the mmw signal sent by the DUT 130 after being transmitted to the interposer substrate 220 may be looped back to the DUT 130 after being looped back to the interposer substrate 220, and then be converted into the test radio frequency signal after being down-converted, so that the high frequency RF signal may be tested, the structure of the test circuit is simpler, the signal path is shorter, the loss is lower, and the accuracy of the test result is higher. In an embodiment of the present invention, mmw signals may be sent by the RF cable 320 and the RF connector 310 to the load board 30, then transmitted to the DUT 130 through a plurality of first pins (e.g., conductive pins P1, P2, and P3), then the DUT 130 transmits mmw signals to the interposer substrate 220 through conductive pins (or spring pins) P4, after passing through the traces of the interposer substrate 220, then looped back to the DUT 130 through conductive pins (or spring pins) P4, then transmitted to the load board 30 through the first pins (e.g., conductive pins P1, P2, and P3), and tested. In addition, signals may continue to be transmitted through RF cable 320 and RF connector 310, such as to detect the results of test signals, and the like. In an embodiment of the present invention, the conductive pin (or the spring pin) P4 may be referred to as a second pin. In the embodiment of the present invention, when the test suite tests the DUT 130, the first pin (e.g., the conductive pins P1, P2 and P3) and the second pin (e.g., the conductive pin P4) may be respectively located on two opposite sides of the DUT 130, so as to perform loopback test on the mmw signal (or the test signal), so that the test path is shorter, and is particularly suitable for testing high-frequency signals such as the mmw signal. Compared with the condition that the signal path is longer in the prior art during testing, and the loss of signals (particularly high-frequency signals such as mmw) during testing is quite large, the embodiment of the invention has obvious advantages and applicability to high-frequency signal testing. During testing of embodiments of the present invention, a second pin (e.g., conductive pin P4) directly connects DUT 130 to load board 30.

Referring to fig. 4, fig. 4 shows a partial layout of the spring pins P4 and a partial cross-sectional view of the top socket 210. At least one radio frequency signal pin P4S is surrounded by a plurality of ground pins P4G. For example, in fig. 4, one radio frequency signal pin P4S is surrounded by five ground pins P4G. The ground pins P4G may contact the ground plane GP of the circuit board or substrate of the DUT 130 or corresponding solder balls SB electrically connected to the ground plane GP. By providing such a configuration, the isolation (isolation) between two adjacent RF signal pins P4S can be improved. In addition, the size or dimension and position of the spring pins P4 can be adjusted to achieve good impedance control without changing the package solder ball map (ball map). Please refer to fig. 5. Fig. 5 shows various types of top receptacles suitable for different types of DUTs, wherein identical layers, elements or regions are indicated by identical numerals or labels, according to some embodiments of the invention. The top socket 210 can be easily changed to accommodate different configurations of the DUT 130, such as different types of in-package antennas or antenna packages (AiP) operating at millimeter-wave frequencies. Meanwhile, in the embodiment of the invention, aiming at DUTs of different types, only the top socket needs to be correspondingly changed, so that the test suite of the embodiment of the invention has high design flexibility and wide application range.

According to one embodiment of the invention, the interposer substrate 220 may be a printed circuit board, and the interposer substrate 220 (or printed circuit board) includes signal traces or test circuits or antennas on the surface facing the DUT that provide mmW signal loop back (signal loop back) during testing. The millimeter wave signal loops back in the relatively short signal transmission path between the transmit and receive ends of DUT 130 without extending the signal to tester or loadboard 30 (which is of course the case in testing, and through the loadboard and tester if the test signal is to be returned for analysis), thereby reducing conversion losses, parasitics, and improving millimeter wave signal performance. According to one embodiment of the present invention, since the first pin (e.g., conductive pins P1, P2, and P3) directly connects the load board 30 and the DUT 130 and the second pin (e.g., conductive pin P4) directly connects the DUT 130 and the interposer substrate 220, the path traversed by the test signal during testing is shorter, thereby reducing path loss during testing and improving test accuracy. Different digital and/or analog and/or RF circuit layouts and different components may be provided on the interposer substrate 220, depending on the design requirements. For example, the interposer substrate 220 may include, but is not limited to, a coupler circuit for coupling signals or changing the signal power ratio (signal power ratio), an attenuator circuit for increasing isolation, a voltage divider circuit for reducing ports (ports), and/or a terminator circuit for reducing signal reflection.

By incorporating the interposer substrate 220 between the top socket 210 and the nest 230 of the plunger assembly 20, tolerances in circuit lines can be reduced, excessive losses at mmW frequencies (due to the shorter length of the signal transmission path) can be avoided, and test costs including test instrumentation and test elements can be reduced.

According to one embodiment of the invention, the nest 230 may be made of an ESD control material or an electrostatic dissipative material, including, but not limited to, PEEK (polyether ether ketone ) having a dielectric constant of about 3.3. According to one embodiment of the invention, nest 230 has an upper side 230a and an underside 230b. During testing, the underside 230b of the nest 230 engages and directly contacts the interior 151 of the socket base 150. According to one embodiment of the invention, the insert 230 may include an absorbing material to avoid or mitigate signal coupling.

According to one embodiment of the invention, the pressing member 240 may be coupled to the upper side 230a of the nest 230. According to one embodiment of the present invention, the pressing member 240 may be made of metal, but is not limited thereto. The pressing member 240 locks the nest 230 to arrange (test) the components of the nest. According to one embodiment of the present invention, the pressing member 240 may be mechanically connected to a robot arm or an automatic handler H. An automated handler H associated with the ATE system may move DUTs 130 from a shipping pallet (not shown) to socket structure 10 mounted on load board 30.

According to one embodiment of the invention, the nest 230 is coupled to at least one suction nozzle (nozzle) 250 for vacuum clamping and/or holding the DUT 130 in the guide plate 120 mounted in the socket housing 100. For illustrative purposes, two nozzles (or nozzles) 250 are shown in FIG. 1. As shown in fig. 1. Two suction nozzles 250 protrude from the bottom surface of the nest 230 and are inserted into corresponding holes of the underlying interposer substrate 220 and top receptacle 210. Nest 230 is also coupled to two alignment pins PA that protrude from the bottom surface of nest 230 at diagonal positions and are inserted into corresponding holes of the underlying interposer substrate 220 and top receptacle 210. In the test, as shown in fig. 1, the positioning pins PA are inserted into the corresponding positioning holes of the socket housing 100. According to one embodiment of the invention, for example, the suction nozzle 250 may be made of an ESD control material or an electrostatic dissipative material, including but not limited to an ESD420 having a dielectric constant of about 5.63. A suction nozzle 250 may be used to pick up (pick) and place a DUT 130 in the socket structure 10 in accordance with one embodiment of the present invention. According to one embodiment of the present invention, the suction nozzle 250 may be used to press the DUT 130 in place during testing, thereby facilitating the mounting of the DUT 130 and improving the efficiency of operation. According to one embodiment of the invention, the suction nozzle 250 may be used to provide coupling factor adjustments (coupling factor tuning) having different shapes and sizes. In one embodiment of the present invention, at least one suction nozzle may penetrate or bypass the nest 230 and the interposer substrate 220.

As shown in fig. 1, according to an embodiment of the present invention, the suction nozzle 250 may communicate with a connection chamber (connection chamber) 230c between the nest 230 and the pressing member 240, the connection chamber 230c being further connected to the vacuum duct 240c. According to one embodiment of the invention, for example, a vacuum seal 222, such as a rubber O-ring, may be provided around vacuum conduit 240c, and a vacuum seal 232, such as a rubber O-ring, may be provided around connection chamber 230 c. According to one embodiment of the invention, for example, the vacuum seals 232 and 242 may be made of a heat resistant material. During testing, a test enclosure TE is defined approximately between the top socket 210 and the guide plate 120. The test method described above for testing the DUT 130 may be implemented within a test enclosure TE.

FIG. 6 is a schematic diagram of a test kit for testing a DUT in accordance with another embodiment of the invention. As shown in fig. 6, the plunger assembly 20 of the test kit 1b may include a plurality of interposer substrates 220 a-220 c. For example, the interposer substrates 220 a-220 c may include different circuits including coupler circuits for coupling signals or changing signal power ratios, attenuator circuits for increasing isolation, voltage divider circuits for reducing ports, or terminator circuits for reducing signal reflection. The interposer substrate having a multi-layered structure (i.e., the plurality of interposer substrates 220 a-220 c, for example) can be used for a wider range of tests, and can be connected to the corresponding interposer substrate as needed or freely replaced as needed when different DUTs need to be tested. Therefore, the testing kit comprises a plurality of intermediate substrates, so that the use flexibility of the testing kit can be improved, and different testing requirements can be met.

FIG. 7 is a schematic diagram of a test kit for testing DUTs according to yet another embodiment of the present invention. As shown in fig. 7, the interposer substrate 220 of the test kit 1c may be electrically connected to the signal analyzer 50 to measure signal performance. Therefore, the test suite of the invention uses the interposer substrate to receive the high-frequency signal and transmits the high-frequency signal to the signal analyzer 50 after conversion, thereby realizing the test of the test suite on the high-frequency signal (mmw signal), solving the problem that the mmw signal of the DUT is difficult to test in the prior art. In embodiments of the present invention, test signals may be provided to the load board 30 via RF connectors or the like, then transmitted to the DUT 130 via a first pin (e.g., conductive pins P1, P2, and P3), then transmitted to the interposer substrate 220 via a second pin (e.g., conductive pin P4), and then looped back to the DUT 130; wherein the interposer substrate 220 may also transmit a portion of the signal to the signal analyzer 50. In embodiments of the present invention, the test signal may also be transmitted by the signal analyzer 50 to the interposer substrate 220, then transmitted by a second pin (e.g., conductive pin P4) to the DUT 130, looped back to the interposer substrate 220, and then transmitted back to the signal analyzer 50. Other manners may be adopted in the embodiments of the present invention for testing, where, since the first pin directly connects the load board 30 and the DUT 130, and the second pin directly connects the DUT 130 and the interposer substrate 220, a path of a test signal is shorter during testing, so that path loss during testing is reduced, and testing accuracy is improved.

Fig. 8 is a schematic diagram of a test kit for testing DUTs according to yet another embodiment of the present invention, wherein like layers, elements or regions are designated by like numerals or labels. As shown in fig. 8, as such, the test kit 1d includes a socket structure 10 and a plunger assembly 20 detachably coupled with the socket structure 10. According to one embodiment of the invention, the socket structure 10 may include a socket housing 100 secured to a load board 30, such as a printed wiring board or a printed circuit board. The load board may include a PCB having a DUT side 30a and a non-DUT side 30 b. The DUT 130 may be plugged into the socket structure 10 on the DUT side 30 a.

According to one embodiment of the present invention, the receptacle housing 100 may be made of a unitary (or monolithic) antistatic material, including but not limited to durable high performance polyimide-based plastics, such as, for example, SP1+ (dupont (tm)) having a dielectric constant (Dk)) of about 3.5. According to one embodiment of the present invention, the socket housing 100 may include a plate-shaped base portion 101, the base portion 101 being integrated with pin assemblies PN including, but not limited to, spring pins P1, conductive pins P2, and conductive pins P3. Conductive pins P2 and P3 may extend from the socket housing 100 and pass through corresponding through holes formed in the base portion 101 to transmit signals. The base portion 101 serves as an interface or interface between the load board 30 and the DUT 130 according to one embodiment of the invention. According to one embodiment of the invention, the pin assembly PN may include at least two different types and lengths of spring pins.

According to one embodiment of the invention, the receptacle housing 100 may include an annular peripheral structure 102 surrounding the base portion 101, thereby forming a cavity 110 defined by an inner sidewall of the annular peripheral structure 102 and an upper surface of the base portion. According to one embodiment of the invention, the annular peripheral structure 102 is integrally formed with the base portion 101. According to one embodiment of the invention, the thickness of the annular peripheral structure 102 is greater than the thickness of the base portion 101. According to another embodiment of the present invention, the socket housing 100 may be in direct contact with the load board 30. However, when the receptacle housing 100 overlaps any high frequency signal traces, the receptacle housing 100 may be partially removed from the load board 30. An electrically floating guide 120 for guiding and adjusting the position and/or rotation angle of the DUT 130 may be suitably mounted within the cavity 110, according to one embodiment of the invention. The guide plate 120 may be in direct contact with the socket housing 100.

In one embodiment of the invention, the guide plate 120 may be made of a single piece of ESD control material or static dissipative material to prevent the DUT 130 from being damaged under high static voltages during testing. For example, the ESD control material or static dissipative material can include, but is not limited to, PEEK based plastics, such as EKH-SS11 having a dielectric constant of about 5.3 Static dissipative materials are defined as materials having a Surface Resistance (SR) of 1x105 (5 th order of 10) of omm to 1x1011 (11 th order of 10) of omm as defined by the International Electrotechnical Commission (IEC) 61340-5-1. Static dissipative materials are difficult to charge and have low charge transfer rates, making them ideal materials for ESD sensitive applications.

The socket structure 10 may also include an annular socket base 150 for precise plunger alignment. According to one embodiment of the present invention, the socket base 150 is mounted and fixed on the upper surface 102S of the annular peripheral structure 102 of the socket housing 100. According to one embodiment of the invention, the socket base 150 includes a central through hole 150p that allows the DUT 130 to pass through and a lower portion of the plunger assembly 20 that vacuum grips the DUT 130 and places the DUT 130 into a testing position on the socket structure 10. According to one embodiment of the invention, the receptacle base 150 may include an inner portion 151 surrounding the upper surface 102S of the annular peripheral structure 102 of the receptacle housing 100. According to one embodiment of the present invention, the socket base 150 may be made of a single piece of antistatic material including, but not limited to, antistatic FR4 having a dielectric constant of about 4.37. According to one embodiment of the invention, the receptacle base 150 may include an absorptive material (absorber material) to avoid or mitigate signal coupling.

According to one embodiment of the invention, the plunger assembly 20 generally includes a multi-layered structure including, but not limited to, a top receptacle 210, an interposer substrate or interposer substrate 220, a nest (or seat) 230, a pressing member 240, and a reflector 270 (disposed between the interposer substrate 220 and the nest 230).

According to one embodiment of the invention, the top socket 210 has high precision positioning capabilities when picking up the DUT 130. The top socket 210 embeds a plurality of metal spring pins P4 for mechanically and electrically connecting the contact pads 130 on the DUT to the interposer substrate 220. The top socket 210 helps ensure that the contact pads on both sides of the DUT 130 make precise contact with the spring pins P1-P3 and P4, respectively.

The interposer substrate 220 may be a printed circuit board including signal lines or test circuits, according to one embodiment of the present invention. Different digital and/or analog and/or RF circuit layouts and different components may be provided on the interposer substrate 220, depending on the design requirements. For example, the interposer substrate 220 may include, but is not limited to, a coupler circuit for coupling signals or changing signal power ratio, an attenuator circuit for increasing isolation, a voltage divider circuit for reducing ports, and/or a terminator circuit for reducing signal reflection. According to one embodiment of the invention, interposer substrate 220 also includes antenna structure AS1 on its top side directly facing reflector 270.

According to one embodiment of the invention, the reflector 270 is fixed to the bottom surface (bottom surface) 230b of the nest (or housing) 230. Reflector 270 may be constructed of a metal, metal alloy, or any suitable conductive material, according to one embodiment of the invention. According to one embodiment of the invention, the reflector 270 is spaced a predetermined distance d from the interposer substrate 220. The reflection distance d between the lower surface 270b of the reflector 270 and the antenna structure AS1 of the interposer substrate 220 can be adjusted to control the received energy and maintain impedance matching. According to one embodiment of the invention, for example, the reflection distance d may preferably be in the range between about 0.25 λ and a multiple of this length (e.g., a positive integer multiple), where λ is the wavelength (mm) of the RF signal having the lowest frequency in the operating band. For example, for a radio frequency signal having a frequency of 24.5GHz, λ is 12.4mm, so the reflection distance D is between 3.1mm and 9.3 mm. RF signals may be transmitted from one antenna to an adjacent antenna by reflection from reflector 270 so that a non-conductive loop-back test may be performed in plunger assembly 20. Therefore, the test suite in this embodiment utilizes the antenna structure AS1 on the interposer substrate 220 to send and receive signals, so that the RF signals can be tested in the test suite, the structure of the test circuit is simpler, the signal path is shorter, the loss is lower, and the accuracy of the test result is higher. In addition, in the embodiment of the present invention, the antenna structure may be disposed at other positions of the interposer substrate 220 to meet the testing requirements of different DUTs, for example, the antenna structure may be disposed on the peripheral side walls of the interposer substrate 220, and so on. Other manners of testing may be adopted in embodiments of the present invention, where, since the first pin (e.g., the conductive pins P1, P2, and P3) directly connects the load board 30 and the DUT 130, and the second pin (e.g., the conductive pin P4) directly connects the DUT 130 and the interposer substrate 220, the path of the test signal during testing is shorter, so that the path loss during testing is reduced, and the test accuracy is improved.

In accordance with one embodiment of the present invention, as such, the nest (or housing) 230 may be made of an ESD control material or a static dissipative material, including but not limited to PEEK having a dielectric constant of about 3.3. According to one embodiment of the invention, the nest (or housing) 230 may include an absorbent material to avoid or mitigate signal coupling. According to one embodiment of the invention, the pressing member 240 may be coupled to the nest 230 using means known in the art. According to one embodiment of the present invention, the pressing member 240 may be made of metal, but is not limited thereto. The pressing member 240 locks the nest 230 to arrange the nest portions. According to one embodiment of the invention, the nest 230 is coupled to at least one suction nozzle 250 for vacuum gripping and/or holding the DUT 130. The nest 230 is also coupled to two locating pins PA that protrude diagonally from the bottom surface of the nest 230 and are inserted into corresponding holes of the underlying reflector 270, interposer substrate 220, and top receptacle 210. At the time of testing, as shown in fig. 1, the positioning pins PA are inserted into corresponding positioning holes 100 in the socket housing, and according to one embodiment of the present invention, the suction nozzle 250 may be made of an ESD control material or a static dissipative material, including but not limited to an ESD420 having a dielectric constant of about 5.63, for example. A suction nozzle 250 may be used to pick up (pick) and place a DUT 130 in the socket structure 10 in accordance with one embodiment of the present invention. According to one embodiment of the present invention, the suction nozzle 250 may be used to press the DUT 130 in place during testing, thereby facilitating the mounting of the DUT 130 and improving the efficiency of operation. According to one embodiment of the invention, the suction nozzle 250 may be used to provide coupling factor adjustments (coupling factor tuning) having different shapes and sizes. In addition, it is noted and understood that all of the test suites of the embodiments of the present invention are for testing DUTs, and thus the test suite does not include DUTs, the test suite is for accommodating DUTs, and there is space or location in the test suite (e.g., in a socket configuration) for accommodating DUTs. Thus, when a DUT is not placed in the test suite, a first pin (e.g., conductive pins P1, P2, and P3) directly connects the load board 30 and the location where the DUT is received and a second pin (e.g., conductive pin P4) directly connects the location where the DUT is received and the interposer substrate 220. Thus, during testing, the first pin directly connects the load board 30 and the DUT 130, and the second pin directly connects the DUT 130 and the interposer substrate 220.

Fig. 9 is a schematic diagram of a test kit for testing DUTs according to yet another embodiment of the present invention, wherein like layers, elements or regions are designated by like numerals or labels. As shown in fig. 9, as such, the test kit 1e includes a socket structure 10 and a plunger assembly 20 detachably coupled with the socket structure 10. According to one embodiment of the invention, the socket structure 10 may include a socket housing 100 secured to a load board 30, such as a printed wiring board or a printed circuit board. The load board may include a PCB having a DUT side 30a and a non-DUT side 30 b. The DUT 130 may be plugged into the socket structure 10 on the DUT side 30 a. The embodiment shown in fig. 9 may be used for near field (near field) loop echo beamforming (loopback beamforming) testing of devices under test.

According to one embodiment of the present invention, the receptacle housing 100 may be made of a unitary (monolithic) antistatic material, including but not limited to durable high performance polyimide-based plastics, such as, for example, SP1+ (dupont (tm)) having a dielectric constant (Dk) of about 3.5. According to one embodiment of the invention, the socket housing 100 may include an integrated (or integrated) plate-like base portion 101 with pin assemblies (not shown) for transmitting signals. The base portion 101 serves as an interface between the load board 30 and the DUT 130, according to one embodiment of the invention.

According to one embodiment of the invention, the socket housing 100 may include an annular peripheral structure 102 surrounding the base portion 101, thereby forming a cavity 110 defined by an inner sidewall of the annular peripheral structure 102 and an upper surface of the base portion 101. According to one embodiment of the invention, the annular peripheral structure 102 is integrally formed with the base portion 101 (e.g., as a unitary structure, or as a one-piece structure, or as a unitary structure, etc.). According to one embodiment of the invention, the thickness of the annular peripheral structure 102 is greater than the thickness of the base portion 101. According to another embodiment of the present invention, the socket housing 100 may be in direct contact with the load board 30. However, when the receptacle housing 100 overlaps any high frequency signal traces on the load board 30, the receptacle housing 100 may be partially removed. An electrically floating guide 120 for guiding and adjusting the position and/or rotation angle of the DUT 130 may be suitably mounted within the cavity 110, according to one embodiment of the invention. The guide plate 120 may be in direct contact with the socket housing 100.

According to one embodiment of the invention, the guide plate 120 may be made of a single piece of ESD control material or static dissipative material to prevent the DUT 130 from being damaged at high static voltages during testing. For example, the ESD control material or static dissipative material can include, but is not limited to, PEEK based plastics, such as EKH-SS11 having a dielectric constant of about 5.3 Static dissipative materials are defined as materials having a Surface Resistance (SR) of 1x105 Ohm to 1x1011 Ohm as defined by the International Electrotechnical Commission (IEC) 61340-5-1. Static dissipative materials are difficult to charge and have low charge transfer rates, making them ideal materials for ESD sensitive applications.

The socket structure 10 may also include an annular socket base 150 for precise plunger alignment. According to one embodiment of the present invention, the socket base 150 is mounted and fixed on the upper surface 102S of the annular peripheral structure 102 of the socket housing 100. According to one embodiment of the invention, the socket base 150 includes a central through hole 150p that allows the DUT 130 to pass through and a lower portion of the plunger assembly 20 that vacuum grips the DUT 130 and places the DUT 130 into a testing position on the socket structure 10. According to one embodiment of the invention, the receptacle base 150 may include an inner portion 151 surrounding the upper surface 102S of the annular peripheral structure 102 of the receptacle housing 100. According to one embodiment of the present invention, the socket base 150 may be made of a single piece of antistatic material including, but not limited to, antistatic FR4 having a dielectric constant of about 4.37. According to one embodiment of the invention, the receptacle base 150 may include an absorptive material (absorber material) to avoid or mitigate signal coupling.

According to one embodiment of the invention, the plunger assembly 20 generally includes a multi-layered structure including, but not limited to, an interposer substrate 220, a nest 230, and a pressing member 240 disposed on the nest 230. In accordance with one embodiment of the present invention, for DUTs whose side surfaces are provided with antennas, the plunger assembly 20 may optionally further comprise a second interposer substrate 220a mounted vertically along the inner periphery (inner perimeter) of the socket base 150. According to one embodiment of the present invention, the second interposer substrate 220a may be fixed to the nest 230, but is not limited thereto.

According to one embodiment of the invention, the interposer substrate 220 and the second interposer substrate 220a may each be a printed circuit board including signal traces, test circuitry, and antennas. Different digital and/or analog and/or RF circuit layouts and different components may be provided on the interposer substrate 220 and the second interposer substrate 220a, depending on the design requirements. For example, the interposer substrate 220 and the second interposer substrate 220a may include, but are not limited to, a coupler circuit for coupling signals or changing a signal power ratio, an attenuator circuit for increasing isolation, a splitter circuit for reducing ports, and/or a terminator circuit for reducing signal reflection. According to one embodiment of the invention, DUT 130 includes antenna structure AS2 on its top side that directly faces interposer substrate 220.

According to one embodiment of the invention, the interposer substrate 220 is spaced a predetermined distance d from the DUT 130. The reflection distance d between the lower surface of interposer substrate 220 and antenna structure AS2 of DUT 130 may be adjusted to control the received energy and maintain impedance matching. According to one embodiment of the invention, for example, the reflection distance d may preferably be in the range between about 0.25 λ and a multiple of this length (e.g., a positive integer multiple), where λ is the wavelength (mm) of the RF signal having the lowest frequency in the operating band. For example, for a radio frequency signal having a frequency of 24.5GHz, λ is 12.4mm, so the reflection distance D is between 3.1mm and 9.3 mm. RF signals may be transmitted from one antenna to an adjacent antenna by reflection from reflector 270 so that a non-conductive loop-back test may be performed in plunger assembly 20. Therefore, the test suite in this embodiment receives and sends signals by using the antenna structure (not shown) on the interposer substrate 220, so that the RF signals can be tested in the test suite, the structure of the test circuit is simpler, the signal path is shorter, the loss is lower, and the accuracy of the test result is higher. In the embodiment of the present invention, the positions, the number, etc. of the antenna structures of the interposer substrates 220 and 220a can be freely set according to the requirements. For example, in one embodiment of the invention, the antenna structure of interposer substrate 220 may be disposed on the antenna structure toward DUT 130 for signal coupling with antenna structure AS2 of DUT 130. In addition, in the embodiment of the present invention, antenna structures may be disposed at other positions of the interposer substrate 220 to meet the testing requirements of different DUTs, for example, antenna structures may be disposed on the sidewalls around the interposer substrate 220; alternatively, the surface of the opposite side of the interposer substrate 220 may be provided with antenna structures for other testing, and so on; therefore, the antenna structure and the position of the interposer substrate 220 in the embodiment of the invention can be freely designed according to the requirement, so as to meet the DUTs with different antenna positions. Therefore, the test suite provided by the embodiment of the invention has higher design elasticity and design flexibility. Embodiments of the present invention may also perform testing in other manners, in which, since the first pins (e.g., conductive pins P1, P2, and P3) (not shown) directly connect the load board 30 and the DUT 130, during testing, for example, test signals are transmitted directly to the DUT 130 via the load board 30 and through the first pins, and then transmitted through the antenna structure AS2 of the DUT 130; after the antenna structures of the interposer substrates 220 and 220a receive the signal transmitted by the antenna structure AS2 of the DUT 130, they loop back to transmit the signal to the DUT 130, and the DUT 130 receives the signal again, thereby performing the test operation. The path of the test signal is shorter, so that the path loss in the test is reduced, and the test accuracy is improved.

According to one embodiment of the invention, the nest 230 may be made of an ESD control material or an electrostatic dissipative material, including, but not limited to, PEEK having a dielectric constant of about 3.3. According to one embodiment of the invention, the insert 230 may include an absorbent material to avoid or mitigate signal coupling. According to one embodiment of the invention, the pressing member 240 may be coupled to the nest 230 using means known in the art. According to one embodiment of the present invention, the pressing member 240 may be made of metal, but is not limited thereto. The pressing member 240 locks the nest 230 to arrange (test) the components of the nest.

According to one embodiment of the invention, the nest 230 is coupled to at least one suction nozzle 250 for vacuum gripping and/or holding the DUT 130. The nest 230 is also connected to two locating pins PA that protrude from the surface of the nest 230 and can be inserted into corresponding holes in the receptacle base 150. According to one embodiment of the invention, for example, the suction nozzle 250 may be made of an ESD control material or an electrostatic dissipative material, including but not limited to an ESD420 having a dielectric constant of about 5.63. A suction nozzle 250 may be used to pick up (pick) and place a DUT 130 in the socket structure 10 in accordance with one embodiment of the present invention. According to one embodiment of the present invention, the suction nozzle 250 may be used to press the DUT 130 in place during testing, thereby facilitating the mounting of the DUT 130 and improving the efficiency of operation. According to one embodiment of the invention, the suction nozzle 250 may be used to provide coupling factor adjustments (coupling factor tuning) having different shapes and sizes

According to one embodiment of the invention, the plunger assembly 20 may further include at least one spacer post (spacer plunger) secured to the nest 230 using screws or any suitable means. For example, two spacer columns 251 are shown in fig. 9. According to one embodiment of the present invention, the spacer posts 251 may be constructed of a harder material than the suction nozzle 250 to maintain the reflected distance d within a desired range between the two, such as 2-6 millimeters. According to one embodiment of the present invention, the spacer columns 251 may be made of a non-metallic material such as plastic or engineering plastic, or a metallic material such as copper, aluminum, alloy, etc. In one embodiment, the spacer posts may be a harder material than air for controlling and positioning the reflected distance d, and the spacer posts may also be used for positioning the lateral position of the DUT 130. For example, the spacer may be a solid cylinder, or a hollow solid cylinder, or a porous cylinder, or the like. In addition, the number and positions of the spacer columns 251 and the like can be freely designed as needed. When the test kit of the embodiment of the invention is adopted, during the test of the tested device 130, the tested device 130 can receive the millimeter wave signal through the antenna structure AS2 after transmitting the millimeter wave signal, and then the millimeter wave signal can be received by the antenna structure on the at least one interposer substrate 220, and then the millimeter wave signal is re-transmitted by the antenna structure on the at least one interposer substrate 220 and is received by the antenna structure AS2 of the tested device 130, so that the test operation is performed; when the test kit is used for testing, the path of the test signal is shorter, so that the test kit is particularly suitable for testing high-frequency signals such as millimeter waves, the path loss of the high-frequency signals can be reduced, and the accuracy and the reliability of the test are ensured. In addition, the test kit of the embodiment of the invention can be suitable for various different types of test equipment. For example, the embodiment of the present invention further includes other interposer substrates such as the interposer substrate 220a (disposed at other positions different from the position of the interposer substrate 220 with respect to the device under test), so the test kit 1e of the embodiment of the present invention has wider applicability, and has cost advantages and test convenience advantages.

Fig. 10 is a schematic diagram illustrating a near field loop echo beam shaping test according to an embodiment of the invention. Near field loop back testing is accomplished by closely spaced antenna arrays disposed at a reflection distance d of 1-6mm on the DUT 130. As shown in fig. 10, DUT 130 may include internal circuitry such as phase shifter (phase shifter) circuitry and power amplifier circuitry. The source Tx from the automatic test equipment (automatic test equipment, ATE) 5 produces an intermediate frequency signal IF1, which is split into n constant-amplitude (equal-amplitude) signals, which are fed into n channels, with the DUT 130 built-in with phase shifters, simplifiers and antennas. A phase shifter on the transmitter can adjust the phase of the signal on each channel. By adjusting the phase shifter, the signals on adjacent channels can have a phase difference phi between the adjacent channels Phase sequence of transmitting terminal>And Rx path->Consistent so as to adjust the phase of each Rx channel to be equal or in phase. By near field loop back, the transmit power on the transmit path may be coupled to the receive path through the transmit and receive antennas. Once the phase difference is defined +.>And the number n of antenna elements, a beam forming curve is generated and the maximum power can be observed at a corresponding direction angle θ off-normal (the normal line). For example, after being transmitted by the DUT 130, the DUT transmits in the beam direction (wave direction) via the wavefront or wavefront wave front) deviates from angle θ. In addition, the distance d shown in fig. 10 is the reflection distance d in the embodiment of fig. 9, and is used to perform the test of the expected (or preset) reflection distance. In an embodiment of the present invention, a (TX) test signal (signal IF 1) may be provided to load board 30 by ATE 5 or the like, then transmitted to DUT 130 via a first pin (e.g., conductive pins P1, P2, and P3) (not shown), then transmitted by DUT 130 to interposer substrate 220, and received by interposer substrate 220 and then sent back to DUT 130, then back to ATE 5, and Received (RX) signal IF0 by ATE 5. In addition, it is noted and understood that all of the test suites of the embodiments of the present invention are for testing DUTs, and thus the test suite does not include DUTs, the test suite is for accommodating DUTs, and there is space or location in the test suite (e.g., in a socket configuration) for accommodating DUTs. Thus, when the DUT is not placed into the test suite, the first pins (e.g., conductive pins P1, P2, and P3) directly connect the load board 30 and the location where the DUT is received. Thus, during testing, the first pin directly connects the load board 30 and the DUT 130.

Those skilled in the art will readily observe that numerous modifications and alterations of the apparatus and method may be made while maintaining the teachings of the present invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims (17)

1. A test kit for testing a device under test, comprising:

a socket structure for accommodating the device under test; and

a plunger assembly removably coupled to the socket structure, wherein the plunger assembly comprises a multi-layered structure including a nest and at least one interposer substrate mounted below the nest.

2. The test kit of claim 1, wherein the plunger assembly further comprises a pressing member coupled to an upper side of the nest.

3. The test kit of claim 2, wherein the pressing member is made of metal.

4. The test kit of claim 1, wherein the socket structure comprises a socket housing and a socket base secured to the socket housing.

5. The test kit of claim 4, wherein the socket base includes a central through hole allowing the device under test to pass therethrough and a lower portion of the plunger assembly that vacuum grips the device under test and places the device under test into a test position on the socket structure.

6. The test kit of claim 1, wherein the kit is made of an electrostatic discharge control material or an electrostatic dissipative material.

7. The test kit of claim 1, further comprising:

at least one suction nozzle for vacuum clamping or holding the device under test, wherein the at least one suction nozzle penetrates or bypasses the nest and the interposer substrate.

8. The test kit of claim 7, wherein the at least one suction nozzle communicates with a connection chamber disposed between the nest and the pressing member.

9. The test kit of claim 1, wherein the socket structure comprises a socket housing secured to the load board and a base portion incorporating a pin assembly for transmitting signals, wherein the socket housing comprises an annular perimeter structure surrounding the base portion, thereby forming a cavity defined by an inner sidewall of the annular perimeter structure and an upper surface of the base portion.

10. The test kit of claim 9, wherein an electrically floating guide plate is mounted within the cavity for guiding and adjusting the position of the device under test.

11. The test kit of claim 10, wherein the guide plate is made of a single piece of electrostatic discharge control material or electrostatic dissipative material.

12. The test kit of claim 4, wherein the plunger assembly further comprises a second interposer substrate mounted along the interior Zhou Shuzhi of the socket base.

13. The test kit of claim 1, wherein the interposer substrate is spaced a predetermined distance from the device under test.

14. The test kit of claim 13, wherein the reflection distance is between 1-6 mm.

15. The test kit of claim 7, wherein the plunger assembly further comprises at least one spacer post secured to the nest.

16. The test kit of claim 15, wherein the spacer posts are constructed of a harder material than the at least one suction nozzle.

17. The test kit of claim 15, wherein the spacer posts are made of engineering plastic.