CN117005015A - Method and system for obtaining electrolytic polishing process parameters of new nickel-based alloy material - Google Patents
Method and system for obtaining electrolytic polishing process parameters of new nickel-based alloy material Download PDFInfo
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- 239000000956 alloy Substances 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 79
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 76
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 38
- 238000007517 polishing process Methods 0.000 title claims abstract description 31
- 238000005498 polishing Methods 0.000 claims abstract description 346
- 239000000463 material Substances 0.000 claims abstract description 19
- 230000008569 process Effects 0.000 claims description 36
- 229910045601 alloy Inorganic materials 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 24
- 239000008367 deionised water Substances 0.000 claims description 23
- 229910021641 deionized water Inorganic materials 0.000 claims description 23
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000003792 electrolyte Substances 0.000 claims description 18
- 230000008859 change Effects 0.000 claims description 16
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 15
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 11
- 230000007613 environmental effect Effects 0.000 claims description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 6
- 235000011187 glycerol Nutrition 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 5
- 230000003750 conditioning effect Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 49
- 238000003860 storage Methods 0.000 description 12
- 238000011010 flushing procedure Methods 0.000 description 9
- 230000006870 function Effects 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- 229910000990 Ni alloy Inorganic materials 0.000 description 7
- 238000004590 computer program Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
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- 230000000694 effects Effects 0.000 description 5
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- 229910021642 ultra pure water Inorganic materials 0.000 description 5
- 239000012498 ultrapure water Substances 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
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- 235000019441 ethanol Nutrition 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
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- 239000004065 semiconductor Substances 0.000 description 4
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- 238000011161 development Methods 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000861 blow drying Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
- C25F3/22—Polishing of heavy metals
- C25F3/26—Polishing of heavy metals of refractory metals
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The invention relates to the technical field of metal electrolytic polishing, and particularly discloses a method and a system for acquiring new nickel-based alloy material electrolytic polishing process parameters, wherein the method comprises the steps of constructing a polishing device controlled by a program for automatically adjusting polishing parameters, constructing a glossiness index based on a data set, establishing a functional relation between the glossiness of the new nickel-based alloy material after electrolytic polishing and each polishing parameter, and comparing the glossiness index with a preset glossiness to obtain each polishing parameter and polishing index coefficient corresponding to the expected glossiness; when the electrolytic polishing process parameters of the new nickel-base alloy material are obtained, the automatic regulation of each polishing parameter according to the regulation in the set electrolytic parameter range and the automatic polishing in the set polishing time are realized, a large amount of manpower and material resources are not required to be consumed, meanwhile, the problem that the adjustment of the polishing process parameters is complex and difficult is solved, the electrolytic polishing process parameters of the new nickel-base alloy material are obtained efficiently and accurately, and the yield of the new nickel-base alloy material after electrolytic polishing is improved.
Description
Technical Field
The invention relates to the technical field of metal electrolytic polishing, in particular to a method and a system for obtaining technological parameters of electrolytic polishing of a new nickel-based alloy material.
Background
The nickel-based alloy is an alloy which takes nickel element as a matrix and is dissolved into other microelements, has good mechanical property, corrosion resistance and high temperature performance, has been widely applied to the extreme industrial fields including nuclear energy, aerospace and the like, is more severe than the traditional nuclear reactor in the working conditions such as the running temperature, neutron flux, corrosion environment and the like of a fourth-generation nuclear reactor system which is currently being developed at home and abroad, is suitable for the conditions, and is a new nickel-based alloy material with higher safety performance, so that the development of the new nickel-based alloy material is urgent for the popularization of advanced nuclear energy technology, and in the development process of nuclear reactor engineering materials, the development of characterization analysis and test research of the irradiation resistance, the mechanical property, the microstructure morphology and the like of the newly designed and developed material is often required. The electrolytic polishing process is particularly important for preparing an irradiated sample, analyzing microstructures (such as surface electron back scattering diffraction analysis and atomic force microscope analysis) of the sample before and after irradiation, and the like, and is beneficial to accelerating the screening of novel materials.
Electrolytic polishing is an electrochemical process that utilizes an electrolyte to polish a metal surface and improve the surface quality based on the redox reaction that occurs on the metal surface in the electrolyte. The difficulty of the electropolishing technique mainly includes the following aspects: electrolyte selection and control, polishing parameter control, polishing sample element composition influence, and the like. The parameters are controlled by considering the characteristics of the materials and the requirements of polishing effects, and certain tests and adjustments are carried out to achieve the ideal polishing effects and surface quality, so that the progress of material research is greatly influenced.
The novel nickel alloy is subjected to microstructure research and morphology characterization, and has a smooth and flat surface, but the novel nickel alloy is usually provided with a plurality of polishing parameters which are not completely ready for direct use in the electrolytic polishing process due to various types and complex components, in the related technology, when the novel nickel alloy is subjected to electrolytic polishing to prepare a metallographic abrasive disc, polishing results are obtained by continuously adjusting and repeatedly testing the related parameters of the novel nickel alloy in electrolytic polishing, and then the optimal polishing parameters are screened out from a plurality of groups of repeated electrolytic polishing tests, so that the novel nickel alloy can better meet the rigorous requirements of analysis means such as sample electron back scattering diffraction, irradiation damage characterization, material morphology characterization and the like on the surface flatness of the material, and the process is required to consume a large amount of manpower and material resources, and meanwhile, the parameter adjustment is complex, the operation is difficult, the polishing duration is difficult to control, and the parameter sample preparation efficiency obtained by the test is low and the yield is low.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a method and a system for obtaining the electrolytic polishing process parameters of the new nickel-based alloy material.
According to an embodiment of the first aspect of the invention, a method for obtaining the electrolytic polishing process parameters of a new nickel-based alloy material comprises the following steps:
step S100: setting up a polishing device controlled by a polishing parameter program based on a self-feedback program, wherein the polishing parameter program controlled by the self-feedback program comprises different electrolytic polishing liquid settings, different electrolytic polishing environment parameter settings, polishing duration settings and intermittent operation duration settings;
step S200: pretreating the surface of the new nickel-base alloy material, cleaning the pretreated new nickel-base alloy material to remove surface impurities, placing the cleaned new nickel-base alloy material in the polishing device,
step S300: automatically adjusting a polishing parameter program based on the self-feedback program to select electrolytic polishing liquid, setting an electrolytic polishing environment parameter, polishing duration and intermittent operation duration, and polishing the new nickel-based alloy material;
step S400: constructing a gloss index based on a dataset Collecting and recording polishing environment data and glossiness of the nickel-based alloy new material after electrolytic polishing when each polishing is completed, and calculating a polishing index coefficient;
step S500: according to the glossiness indexSo as to obtain the optimal parameter value of the electrolytic polishing process of the new nickel-based alloy material.
According to some embodiments of the invention, the step S100 of setting different electrolytic polishing solutions includes:
polishing solution A: phosphoric acid + chromic anhydride + deionized water;
polishing solution B: sulfuric acid + glycerin + chromic anhydride + deionized water;
polishing solution C: perchloric acid, ethanol and deionized water;
the component concentration ranges of each polishing liquid are set, and the method comprises the following steps:
the polishing solution A comprises 70-75% of phosphoric acid, 3-6% of chromic anhydride and the balance of deionized water by volume percent;
the polishing solution B comprises 60-75% of sulfuric acid, 3-6% of glycerol, 2-6% of chromic anhydride and the balance of deionized water by volume percent;
and the polishing solution C comprises 10-20% of perchloric acid, 70-75% of ethanol and the balance of deionized water in percentage by volume.
According to some embodiments of the invention, the setting of the parameters of the electrolytic polishing environment, the setting of the polishing time period, and the setting of the intermittent operation time period in the step S100 include:
According to the electrolytic polishing requirement, different electrolytic polishing environment parameters are respectively set, wherein the electrolytic polishing environment parameters comprise current density, polishing temperature and polishing solution pH value in the electrolytic polishing process, and the value ranges of the current density, the polishing temperature, the polishing solution pH value, the polishing time and the intermittent operation time are set and pre-stored.
According to some embodiments of the invention, the step S100 further includes:
and setting the priorities of the different electropolishing environment parameters, wherein the polishing time length, the electrolyte composition, the polishing temperature, the current density and the priority of the pH value of the polishing solution are sequentially increased.
According to some embodiments of the invention, the step S300 includes:
selecting an electropolishing solution, sequentially setting values based on the priority of each electropolishing environmental parameter, setting polishing time, electropolishing each electropolishing environmental parameter twice before and after the intermittent operation time, and collecting glossiness information after electropolishing twice before and after, wherein the electropolishing twice before and after only changes one parameter of the electropolishing environmental parameters.
According to some embodiments of the invention, the step S400 specifically includes:
Step S410: constructing a datasetWherein->Respectively comprises the components and the concentration of electrolyte, current density, temperature, pH value and polishing duration;
step S420: based on data setsSelecting +.>The individual properties are set as the main influencing parameters, wherein +.>；
Step S430: according to the data set with main influencing parametersConstructing a glossiness index->A function, wherein,wherein->Polishing index coefficients,/-respectively>Respectively polishing parameters;
step S440: by changing the datasetThe polishing parameter data values in (a) are obtainedTo the gloss index after multiple sets of electropolishing +.>；
Step S450: according to the data value and glossiness index of each polishing parameterAnd calculating to obtain the corresponding polishing index coefficient.
According to some embodiments of the invention, the step S500 specifically includes:
according to the obtained multiple groups of glossiness indexesEach group of glossiness index +.>Comparing with the expected glossiness, judging whether the glossiness of each group of nickel-based alloy new materials after electrolytic polishing accords with the expected glossiness, and selecting a glossiness index which accords with the expected glossiness>。
According to some embodiments of the invention, the method comprises determining whether the gloss level of each set of new nickel-base alloy material after electropolishing meets the desired gloss level, and selecting a gloss index that meets the desired gloss level Comprising the following steps:
if the glossiness accords with the expected glossiness after the electrolytic polishing of a plurality of groups of new nickel-based alloy materials exist, the glossiness index with higher glossiness is stored and recordedCorresponding polishing index coefficients and data values of the polishing parameters;
according to a second aspect of the embodiment of the invention, a system for obtaining the electrolytic polishing process parameters of a new nickel-base alloy material comprises:
the display module is configured to be responsible for displaying the electrolytic polishing parameters in real time, visualizing the polishing parameters, and observing the glossiness index and the polishing progress of the workpiece in real time;
a power conditioning module configured to be responsible for controlling a current density of the electropolishing process;
the temperature control module is configured to control the temperature of the polishing solution in the electrolytic polishing process;
and the data acquisition module is configured to be responsible for acquiring the pH value and the temperature of the polishing solution.
According to some embodiments of the invention, the system for obtaining the electrolytic polishing process parameters of the new nickel-based alloy material further comprises:
the software control module is configured to process the acquired information data, compare the glossiness under polishing operation of different parameters, feed back the change of the glossiness to the polishing parameters, and send out instructions for increasing or decreasing and adjusting the polishing parameters;
And the mechanical control module is configured to realize the operations of the micro equipment and the carrying workpiece moving device according to the control information sent by the software control module, and to actually adjust each polishing environment parameter in the polishing device according to each polishing parameter.
Compared with the prior art, the embodiment of the application at least comprises the following technical effects:
setting an electrolytic parameter range in an automatic polishing parameter adjusting program by setting up a polishing device controlled based on the automatic polishing parameter adjusting program, and constructing a glossiness index based on a data setThe glossiness of the novel nickel-based alloy after electrolytic polishing is established as a function of each polishing parameter by adding the glossiness index +.>Comparing with preset glossiness, when not meeting the requirement, can realize self-feedback and automatically adjust each polishing parameter according to the regulation in the range of the set electrolysis parameters to obtain the glossiness meeting the expectedPolishing parameters and polishing index coefficients corresponding to the degree; when the method is used for obtaining the electrolytic polishing process parameters of the new nickel-base alloy material, the self-feedback automatic adjustment of each polishing parameter is realized, the automatic polishing is realized in the set polishing time, meanwhile, the glossiness after each polishing is compared, so that the optimal process parameter data value of the electrolytic polishing of the new nickel-base alloy material is obtained, a large amount of manpower and material resources are not required to be consumed, the problem that the adjustment of the polishing process parameters is complex and difficult is solved, the electrolytic polishing process parameters of the new nickel-base alloy material can be obtained more efficiently and accurately, and the yield of the new nickel-base alloy material after electrolytic polishing is improved.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for obtaining parameters of an electropolishing process for new nickel-based alloy materials in accordance with an embodiment of the present application;
FIG. 2 is another flow chart of a method for obtaining parameters of an electropolishing process for new nickel-based alloy materials in accordance with an embodiment of the present application;
FIG. 3 is a block diagram of a system for obtaining parameters of an electropolishing process for new nickel-based alloy materials in accordance with an embodiment of the present application.
Detailed Description
The following detailed description of embodiments of the application, with reference to the accompanying drawings, is illustrative of the embodiments described herein, and it is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the embodiment provides a method for obtaining parameters of an electrolytic polishing process for a new nickel-base alloy material, which includes:
step S100: setting up a polishing device controlled by a polishing parameter program based on a self-feedback program, wherein the polishing parameter program controlled by the self-feedback program comprises different electrolytic polishing liquid settings, different electrolytic polishing environment parameter settings, polishing duration settings and intermittent operation duration settings;
in this step, in the process of determining the optimal electropolishing process parameters of the novel nickel-based alloy, a great deal of manpower and material resources are consumed in the electropolishing process by the traditional method, meanwhile, the sample preparation efficiency is low and the yield is low, in order to solve the problem, in one embodiment, a self-feedback control system is built based on Python language, and according to the glossiness, pH value and temperature of polishing liquid and the recorded polishing time length of a workpiece collected in real time by a sensor in a glossiness meter, a pH meter and a thermometer component, the self-feedback control system compares the glossiness under the polishing operation of different parameters, and the accurate regulation and control of the pH value, the electrolyte component and the polishing time length are realized by means of a liquid injection nozzle, the pH meter, the glossiness meter and the like contained in the device.
In order to obtain more efficient electropolishing process parameters, three polishing baths need to be built in the electropolishing apparatus, each containing a different type of polishing liquid, illustratively polishing liquid a in the first polishing bath: phosphoric acid + chromic anhydride + deionized water; and (3) storing the polishing solution B in a second polishing pool: sulfuric acid + glycerin + chromic anhydride + deionized water; and (3) storing the polishing solution C in a third polishing pool: perchloric acid, ethanol and deionized water; three polishing baths were controlled by an established self-feedback control system, each polishing liquid comprising a different composition, specifically including but not limited to the following concentration ranges: the polishing solution A comprises 70-75% of phosphoric acid, 3-6% of chromic anhydride and the balance of deionized water by volume percent; the polishing solution B comprises 60-75% of sulfuric acid, 3-6% of glycerol, 2-6% of chromic anhydride and the balance of deionized water by volume percent; and the polishing solution C comprises 10-20% of perchloric acid, 70-75% of ethanol and the balance of deionized water in percentage by volume.
In the self-feedback control system, the component concentration ranges of each polishing solution are pre-stored in a program, the component concentrations of the polishing solution of the polishing device are actually collected through each sensor, the self-feedback control system realizes automatic control of the component concentrations of the polishing solution through a control valve body according to collected information, and after the component concentrations of the polishing solution are regulated and controlled, the magnetic stirrer at the bottom of a polishing pool is controlled to stir the electrolyte during polishing, wherein the rotating speed is 30-50 r/min.
It should be further noted that the self-feedback program for automatically adjusting polishing parameters further has the functions of setting different electropolishing environment parameters, polishing time length and intermittent operation time length, and for example, different electropolishing environment parameters can be set according to electropolishing requirements, wherein the electropolishing environment parameters include current density, polishing temperature and polishing solution pH in the electropolishing process, and the current density, polishing temperature, polishing solution pH, polishing time length and intermittent operation time length are set in advance, and meanwhile, priority of different electropolishing environment parameters is set, wherein the priority of polishing time length, electrolyte composition, polishing temperature, current density and polishing solution pH are sequentially increased.
Step S200: pretreating the surface of the new nickel-base alloy material, cleaning the pretreated new nickel-base alloy material to remove surface impurities, and placing the cleaned new nickel-base alloy material in the polishing device;
in the step, before electrolytic polishing, the surface of a newly developed nickel-base alloy workpiece is pretreated to remove an oxide layer, the pretreated nickel-base alloy material is clamped on a carrying clamp of a polishing device, and a control system pulls the nickel-base alloy material to a cleaning tank for cleaning in the polishing device to remove surface impurities;
The method for removing the oxide layer of the new nickel-based alloy material comprises the following steps: and mechanically polishing the surface of the nickel-base alloy workpiece by using No. 800 water sand paper until no obvious bulge exists on the surface of the workpiece. In the polishing process, uneven thickness of the workpiece caused by uneven force application should be avoided; the method for removing the surface impurities comprises the following steps: and (3) washing the nickel-base alloy workpiece after removing the oxide layer with ultrapure water for 30 seconds, then carrying out ultrasonic treatment in absolute ethyl alcohol for 1 minute, and carrying out cold air drying treatment by using a blower after each ultrasonic treatment.
Step S300: automatically adjusting a polishing parameter program based on the self-feedback program to select electrolytic polishing liquid, setting an electrolytic polishing environment parameter, polishing duration and intermittent operation duration, and polishing the new nickel-based alloy material;
in the step, an electrolytic polishing solution is selected, values are set in sequence based on the priority of each electrolytic polishing environmental parameter, polishing time is set at the same time, electrolytic polishing is carried out twice on each electrolytic polishing environmental parameter before and after the intermittent operation time, and glossiness information after the electrolytic polishing is collected before and after twice, wherein only one parameter of the electrolytic polishing environmental parameters is changed during the electrolytic polishing before and after twice;
Because the electrolytic polishing technology needs to consider the influence of a plurality of factors and effectively control and adjust the polishing effect and the surface quality, the polishing parameters comprise the components and the concentration of the electrolyte, the current density, the temperature, the pH value, the polishing duration and the like. In the step, according to the sample components, the range of electrolysis parameters is set by referring to the conventional experience, the components and concentration of the electrolyte are selected, the current density, the temperature of the polishing solution, the pH value, the change range and the change gradient of the polishing duration are set, the intermittent operation duration is set, and the intermittent operation duration is input into a system;
illustratively, the polishing temperature range is set in the self-feedback procedure at 35-55 ℃; setting the current density range to be 0.3-0.9A/cm 2 The method comprises the steps of carrying out a first treatment on the surface of the The intermittent operation time ranges from 5 to 8 seconds, and the maximum polishing time ranges from 3 to 5 minutes; setting up each parameter when increasing according to experimental requirements,
in the step, firstly immersing the nickel-base alloy workpiece into the polishing solution A, carrying out time sequence electrolytic polishing on the nickel-base alloy workpiece with a set intermittent operation time length, changing the pH value of the polishing solution by means of adding deionized water, enabling the pH value of the polishing solution to be increased to 4.5-5.5 at the maximum under the step length of 0.05-0.2 on the basis of an initial value, injecting deionized water into a polishing pool by a liquid injection nozzle, removing excessive polishing solution by a drain outlet, and maintaining the polishing liquid level constant in order to avoid overflow of the polishing solution. The adding amount of deionized water is monitored in real time by a pH meter and is transmitted to a control system, and the adding amount is automatically controlled by a software control module, so that the accurate regulation and control of the pH value are realized.
In the time sequence polishing process, when the intermittent operation time is up, current is cut off, polishing operation is stopped, a gloss meter is started to detect the gloss of the surface of a workpiece, the gloss is transmitted to a software control module to analyze the gloss, and if the expected gloss can be met, polishing is finished; if the polishing time is not longer than the previous time, carrying out electrolytic polishing operation on the nickel alloy workpiece again in the operation time, then carrying out glossiness analysis again, if the expected glossiness can be met, finishing polishing, if the polishing time is not longer than the previous time, continuing to carry out time sequence polishing, and repeating the steps, wherein the longest polishing time is the upper limit of the polishing time. And if the glossiness of the polished nickel-base alloy workpiece is lower than that of the polished nickel-base alloy workpiece in the previous period, ending the electrolytic polishing of the nickel-base alloy workpiece in the polishing solution A under the environment of a certain pH value. The pH value is increased by 0.05-0.2 by injecting deionized water, and the steps are repeated until the polishing reaches the upper limit of the preset pH value under the condition that the expected glossiness is not achieved.
When the nickel-base alloy workpiece does not reach the expected glossiness in all pH values and polishing time ranges in the polishing solution A, moving the nickel-base alloy workpiece to a cleaning area, flushing the nickel-base alloy workpiece with ultrapure water for 15 seconds, then carrying out ultrasonic treatment in absolute ethyl alcohol for 30 seconds, and carrying out cold air drying treatment by a blower after each ultrasonic treatment. Immersing the cleaned nickel-base alloy workpiece into the polishing solution B, and repeating the steps. If polishing is performed to the desired glossiness in each of the polishing liquids A and B, the polishing step is continued until the desired glossiness is reached by moving to the polishing liquid C.
Step S400: construction based on data setsIndex of glossCollecting and recording polishing environment data and glossiness of the nickel-based alloy new material after electrolytic polishing when each polishing is completed, and calculating a polishing index coefficient;
step S500: according to the glossiness indexSo as to obtain the optimal parameter value of the electrolytic polishing process of the new nickel-based alloy material.
In this step, according to the obtained multiple sets of glossiness indexesEach group of glossiness index +.>Comparing with the expected glossiness, judging whether the glossiness of each group of nickel-based alloy new materials after electrolytic polishing accords with the expected glossiness, and selecting a glossiness index which accords with the expected glossiness>If a plurality of groups of nickel-based alloy new materials exist and the glossiness accords with the expected glossiness after electrolytic polishing, the glossiness index of higher storage record glossiness is +.>Corresponding polishing index coefficient and data value of each polishing parameter.
Illustratively, when the finish of the workpiece is marked as the workpiece gloss reaches (80-90 GU), the nickel-base alloy workpiece is moved to a rinsing bath to be rinsed with ultrapure water for 30 seconds in the device, then is put into absolute ethyl alcohol to be ultrasonically cleaned for 1 minute, and finally is taken out after being dried by a blower in the rinsing bath.
In one embodiment, based on the steps of the method, the specific process in actual operation is as follows: and (3) sequentially carrying out electrolytic polishing on the workpiece twice according to the set intermittent operation time length in the polishing device, wherein the electrolytic polishing is carried out for the second time only by increasing the pH value of the solution, the mechanical control module controls the liquid injection nozzle to inject deionized water into the polishing pool to control the increase of the pH value, and when the pH value increment of the polishing liquid detected by the pH meter is equal to the set gradient in the step two, the injection is stopped immediately, and after each polishing is finished, the gloss meter is started to detect the glossiness of the workpiece. The self-feedback control system judges the glossiness of the polishing machine in the front and back time periods:
1. if the glossiness of the workpiece meets a preset value (80-90 GU), finishing polishing;
2. if the gloss GU of the previous period 1 GU greater than the next period 2 It is proved that increasing the pH value of the polishing solution has negative influence on the glossiness of the workpiece, and continuous time sequence polishing can not realize that the glossiness of the workpiece meets the preset value, and the polishing is finished;
3. if the gloss GU of the previous period 1 GU less than the latter period 2 It is proved that increasing the pH value of the polishing solution has a positive effect on the glossiness of the workpiece, continuing the time sequence polishing can enable the workpiece to reach higher glossiness, increasing the pH value of the solution again with a set gradient, carrying out electrolytic polishing on the workpiece for a period of time of intermittent operation, starting a glossiness meter, and carrying out the foregoing judgment on the glossiness under the polishing operation in the front and rear time periods by a self-feedback control system until the glossiness of the workpiece meets a preset value (80-90 GU) or reaches the upper limit of the set pH change range.
If the pH value is changed to reach the upper limit of the set pH value change range, the workpiece still does not meet the preset value (80-90 GU), the pH value when the nickel-base alloy workpiece glossiness is obtained through fixed polishing, the current density is regulated and controlled to be increased or decreased by changing the direct voltage of the power supply regulating module and the input size of the direct current, in the polishing solution, the device sequentially carries out electrolytic polishing on the workpiece for two times according to the intermittent operation time set in the second step, the current density is only increased in the second electrolytic polishing, the power supply regulating module regulates and controls the increase of the current density by changing the direct voltage and the input size of the direct current, when the current density increment is equal to the gradient set in the second step, the current density is stopped to be changed immediately, and a gloss meter is started to detect the workpiece glossiness after each polishing is finished. The self-feedback control system judges the glossiness of the polishing machine in the front and back time periods:
1. if the glossiness of the workpiece meets a preset value (80-90 GU), finishing polishing;
2. if the gloss GU of the previous period 1 GU greater than the next period 2 It is proved that increasing the current density has a negative effect on the workpiece glossiness, and continuous time sequence polishing can not achieve that the workpiece glossiness meets a preset value, and polishing is finished;
3. if the gloss GU of the previous period 1 GU less than the latter period 2 It is proved that increasing the current density has a positive effect on the glossiness of the workpiece, continuing the time sequence polishing can enable the workpiece to reach higher glossiness, increasing the current density again with a set gradient, carrying out electrolytic polishing on the workpiece to reach intermittent operation time, starting a glossiness meter, judging the glossiness under the polishing operation in the front-back time period by a self-feedback control system, and repeating the steps until the glossiness of the workpiece meets a preset value (80-90 GU) or reaches the upper limit of the set current density change range.
If the pH value and the current density are changed to reach the upper limit of the pH value and the current density change range set in the second step, and the nickel-base alloy workpiece still does not meet the preset value (80-90 GU), fixedly polishing to obtain the pH value and the current density when the nickel-base alloy workpiece has the maximum glossiness, controlling a semiconductor refrigerating/heating device to change the temperature of the polishing liquid through a temperature control module, sequentially carrying out electrolytic polishing on the workpiece in the polishing liquid according to the intermittent operation time set in the second step by the device, only increasing the temperature of the polishing liquid in the second electrolytic polishing, controlling the semiconductor refrigerating/heating device to change the temperature of the polishing liquid by the temperature control module, stopping immediately when the temperature increment of the polishing liquid is equal to the gradient set in the second step, and starting a glossiness meter to detect the glossiness of the workpiece after each polishing is finished. The self-feedback control system judges the glossiness of the polishing machine in the front and back time periods:
1. If the glossiness of the workpiece meets a preset value (80-90 GU), finishing polishing;
2. if the gloss GU of the previous period 1 GU greater than the next period 2 It is proved that increasing the temperature of the polishing solution has negative influence on the glossiness of the workpiece, and continuous time sequence polishing can not achieve that the glossiness of the workpiece meets the preset value, and polishing is finished;
3. if the gloss GU of the previous period 1 GU less than the latter period 2 The polishing solution temperature is proved to have positive influence on the glossiness of the workpiece, the polishing solution temperature is increased by setting gradient again to achieve higher glossiness of the workpiece, the electrolytic polishing is carried out on the workpiece to achieve intermittent operation time, a glossiness meter is started, the glossiness under the polishing operation in the front-back period is judged by a self-feedback control system, and the steps are repeated until the glossiness of the workpiece meets a preset value (80-90 GU) or the upper limit of the polishing solution temperature change range set in the second step is achieved.
If the pH value, the current density and the electrolyte temperature are changed to reach the upper limit of the set pH value, the current density and the electrolyte temperature change range, the nickel-base alloy workpiece still does not meet the preset value (80-90 GU), the mechanical control system pulls the nickel-base alloy workpiece to a cleaning tank for cleaning, a blower in the cleaning tank blows cold air to dry the nickel-base alloy workpiece, the polishing tank is replaced, the nickel-base alloy workpiece is immersed in another polishing solution, the pH value, the current density and the electrolyte temperature are sequentially changed according to the working principle of the self-feedback control system built based on Python language, and time sequence polishing is carried out on the nickel-base alloy workpiece until the glossiness of the nickel-base alloy workpiece meets the preset value (80-90 GU).
Example 2
As shown in fig. 2, the specific steps of step S400 in the method for obtaining the technological parameters of electropolishing the new nickel-base alloy material in embodiment 1 are described in this embodiment, including:
step S410: constructing a datasetWherein->Respectively comprises the components and the concentration of electrolyte, current density, temperature, pH value and polishing duration;
step S420: based on data setsSelecting +.>The individual properties are set as the main influencing parameters, wherein +.>；
Step S430: according to the data set with main influencing parametersConstructing a glossiness index->A function, wherein,wherein->Polishing index coefficients,/-respectively>Respectively polishing parameters;
step S440: by changing the datasetThe polishing parameter data values in the polishing process are used for obtaining a plurality of groups of glossiness indexes after electrolytic polishing>；
Illustratively, with the above method steps, when the polishing parameters are considered only five,wherein->Respectively polishing index coefficients; />The polishing parameters respectively represent pH value, current density, temperature, electrolyte composition and polishing duration; />Is gloss, when->When the value reaches the expected glossiness (80-90 GU), the pH value, the current density, the temperature, the electrolyte component and the polishing time index of the polishing environment which finally meet the glossiness requirement are recorded, the polishing index coefficient is calculated, and the polishing index coefficient is stored according to the above method to be used as a novel nickel-based alloy electrolytic polishing process for polishing subsequent nickel-based alloy samples with the same components.
Example 3
Referring to fig. 3, the system 200 for obtaining the electrolytic polishing process parameters of the new nickel-base alloy material according to the present embodiment includes:
the display module 210 is configured to display the electropolishing parameters in real time, visualize the electropolishing parameters, and observe the glossiness index and the polishing progress of the workpiece in real time;
a power conditioning module 220 configured to control a current density of the electropolishing process;
a temperature control module 230 configured to control a polishing liquid temperature in an electropolishing process;
a data acquisition module 240 configured to be responsible for acquiring the pH and temperature of the polishing solution;
control module 250, control module 250 includes a machine control module 251 and a software control module 252
The software control module 251 is configured to process the collected information data, compare the glossiness under polishing operation with different parameters, feed back the change of the glossiness to the polishing parameters, and send out instructions for increasing or decreasing and adjusting the polishing parameters;
the mechanical control module 252 is configured to implement operations of the micro-device and the workpiece moving device according to the control information sent by the software control module 251, and to actually adjust each polishing environment parameter in the polishing device according to each polishing parameter.
Illustratively, the software control module 251 composes a self-feedback control system based on a self-feedback program built by the Python language, and is responsible for processing the acquired information: according to the data acquired by sensors in parts such as a gloss meter, a pH meter, a thermometer and the like in real time, the self-feedback program compares the gloss under polishing operation with different parameters, feeds back the change of the gloss to the polishing parameters, and sends out instructions for increasing or decreasing and adjusting the polishing parameters (pH value, temperature, polishing duration and the like); the machine control module 252 is responsible for executing feedback control information sent by the software control module 251: the micro equipment and the workpiece carrying mobile device (the sliding rod and the object carrying clamp) are operated, the polishing parameters such as pH value, temperature, polishing time length and the like are increased and decreased and adjusted under the change gradient of the preset parameter value, and the auxiliary equipment in the device is controlled. The control module 250 can realize bidirectional interaction with information among the display module 210, the power supply adjusting module 220, the electrode module, the flushing module, the temperature control module 230 and the data acquisition module 240, and control the modules.
The display module 210 is responsible for displaying the electrolytic polishing parameters in real time, visualizing the polishing parameters, and observing the glossiness index and polishing progress of the workpiece in real time; the display module 210 serves as a visual carrier of the control module 250, and by means of control keys of the display, the operation of the internal equipment of the manual operation control device and the control of the device can be realized.
The power supply adjusting module 220 comprises a 0-60V and 0-30A adjustable voltage-stabilizing direct current power supply which is responsible for controlling current density and is fixed outside the heat preservation frame body;
the electrode module is characterized in that a copper sheet is used as a cathode to be connected with a negative electrode of a direct-current stabilized voltage supply and is fixed on the inner side of an electrolytic cell, an anode nickel alloy material is fixed on a slide bar through stainless steel tweezers (carrying clamps), the copper sheet can move along with the inner frame of the heat-insulating frame, and the polar distance can be adjusted along with the movement of the slide bar;
the flushing module is responsible for carrying out ultrapure water flushing and cold air blow-drying on the workpiece and comprises a miniature ultrapure water diaphragm water pump (the flushing pressure is more than 0.4 and less than or equal to 0.7 MPa) and a miniature blower (the blow-drying temperature is more than 30 and less than or equal to 40 ℃), and is fixed on the side surface of the flushing tank;
the temperature control module 230 is responsible for controlling the temperature of the polishing solution and consists of a semiconductor refrigerator/heater, wherein the semiconductor refrigerator/heater is fixed at the lower part of the heat preservation frame body and wraps the pool;
the data acquisition module 240 comprises a lead type gloss meter, a pH meter and a thermometer, and is responsible for acquiring the gloss value of a workpiece, the pH value and the temperature of a polishing solution. The sensing probe of the gloss meter is fixed on the carrying clamp, and the data line terminal is connected with the software control system and displays the gloss index on the display; the pH sensor and the temperature sensor probe are fixed on the side surface of the polishing pool, and the data wire terminal is connected with the software control system and displays the pH value and the temperature on the display.
The heat preservation frame body comprises, but is not limited to, three polishing tanks, a cleaning tank, a flushing tank, a frame body inner frame and packaging equipment, wherein the three polishing tanks are respectively provided with polishing liquid A, B, C, the cleaning tank is provided with absolute ethyl alcohol, and the flushing tank comprises flushing module equipment; the packaging apparatus includes an integrated sensor and a device housing.
Correspondingly, the embodiment of the application also provides a storage medium, wherein instructions are stored in the storage medium, and when the storage medium runs on a computer, the computer is caused to execute the method steps for acquiring the electrolytic polishing process parameters of the new nickel-based alloy material.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In one typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include volatile memory in a computer-readable medium, random Access Memory (RAM) and/or nonvolatile memory, etc., such as Read Only Memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.
Computer readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of storage media for a computer include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Disks (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium, which can be used to store information that can be accessed by a computing device. Computer-readable media, as defined herein, does not include transitory computer-readable media (transmission media), such as modulated data signals and carrier waves. It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises an element.
The terms first, second, third and the like in the description and in the claims and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprising," "including," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion. For example, a series of steps or elements may be included, or alternatively, steps or elements not listed or, alternatively, other steps or elements inherent to such process, method, article, or apparatus may be included.
Only some, but not all, of the details relating to the application are shown in the accompanying drawings. Before discussing the exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart depicts operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently, or at the same time. Furthermore, the order of the operations may be rearranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figures. The processes may correspond to methods, functions, procedures, subroutines, and the like.
As used in this specification, the terms "component," "module," "system," "unit," and the like are intended to refer to a computer-related entity, either hardware, firmware, a combination of hardware and software, or software in execution. For example, a unit may be, but is not limited to being, a process running on a processor, an object, an executable, a thread of execution, a program, and/or being distributed between two or more computers. Furthermore, these units may be implemented from a variety of computer-readable media having various data structures stored thereon. The units may communicate by way of local and/or remote processes such as in accordance with a signal having one or more data packets (e.g., second unit data from another unit interacting with a local system, distributed system, and/or across a network).
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
It will be apparent that the described embodiments are only some, but not all, embodiments of the application. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application for the embodiment. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The method for obtaining the technological parameters of the electrolytic polishing of the new nickel-based alloy material is characterized by comprising the following steps:
Step S100: setting up a polishing device controlled by a polishing parameter program based on a self-feedback program, wherein the polishing parameter program controlled by the self-feedback program comprises different electrolytic polishing liquid settings, different electrolytic polishing environment parameter settings, polishing duration settings and intermittent operation duration settings;
step S200: pretreating the surface of the new nickel-base alloy material, cleaning the pretreated new nickel-base alloy material to remove surface impurities, and placing the cleaned new nickel-base alloy material in the polishing device;
step S300: automatically adjusting a polishing parameter program based on the self-feedback program to select electrolytic polishing liquid, setting an electrolytic polishing environment parameter, polishing duration and intermittent operation duration, and polishing the new nickel-based alloy material;
step S400: constructing a gloss index based on a datasetCollecting and recording polishing environment data and glossiness of the nickel-based alloy new material after electrolytic polishing when each polishing is completed, and calculating a polishing index coefficient;
step S500: according to the glossiness indexSo as to obtain the optimal parameter value of the electrolytic polishing process of the new nickel-based alloy material.
2. The method according to claim 1, wherein the step S100 of setting different electrolytic polishing solutions comprises:
Polishing solution A: phosphoric acid + chromic anhydride + deionized water;
polishing solution B: sulfuric acid + glycerin + chromic anhydride + deionized water;
polishing solution C: perchloric acid, ethanol and deionized water;
the component concentration ranges of each polishing liquid are set, and the method comprises the following steps:
the polishing solution A comprises 70-75% of phosphoric acid, 3-6% of chromic anhydride and the balance of deionized water by volume percent;
the polishing solution B comprises 60-75% of sulfuric acid, 3-6% of glycerol, 2-6% of chromic anhydride and the balance of deionized water by volume percent;
and the polishing solution C comprises 10-20% of perchloric acid, 70-75% of ethanol and the balance of deionized water in percentage by volume.
3. The method for obtaining new nickel-base alloy material electropolishing process parameters according to claim 1, wherein the different electropolishing environment parameter settings, polishing duration settings and intermittent operation duration settings in step S100 comprise:
according to the electrolytic polishing requirement, different electrolytic polishing environment parameters are respectively set, wherein the electrolytic polishing environment parameters comprise current density, polishing temperature and polishing solution pH value in the electrolytic polishing process, and the value ranges of the current density, the polishing temperature, the polishing solution pH value, the polishing time and the intermittent operation time are set and pre-stored.
4. The method for obtaining the new nickel-base alloy material electropolishing process parameters according to claim 3, wherein said step S100 further comprises:
and setting the priorities of the different electropolishing environment parameters, wherein the polishing time length, the electrolyte composition, the polishing temperature, the current density and the priority of the pH value of the polishing solution are sequentially increased.
5. The method of claim 1, wherein the step S300 includes:
selecting an electropolishing solution, sequentially setting values based on the priority of each electropolishing environmental parameter, setting polishing time, electropolishing each electropolishing environmental parameter twice before and after the intermittent operation time, and collecting glossiness information after electropolishing twice before and after, wherein the electropolishing twice before and after only changes one parameter of the electropolishing environmental parameters.
6. The method for obtaining the new nickel-base alloy material electropolishing process parameters according to claim 1, wherein said step S400 specifically comprises:
step S410: constructing a datasetWherein->Respectively comprises the components and the concentration of electrolyte, current density, temperature, pH value and polishing duration;
Step S420: based on data setsSelecting +.>The individual properties are set as the main influencing parameters, wherein +.>；
Step S430: according to the data set with main influencing parametersConstructing a glossiness index->A function, wherein,wherein->Polishing index coefficients,/-respectively>Respectively polishing parameters;
step S440: by changing the datasetThe polishing parameter data values in the polishing process are used for obtaining a plurality of groups of glossiness indexes after electrolytic polishing>；
Step S450: according to the data value and glossiness index of each polishing parameterAnd calculating to obtain the corresponding polishing index coefficient.
7. The method for obtaining the new nickel-base alloy material electropolishing process parameters according to claim 1, wherein said step S500 specifically comprises:
according to the obtained multiple groups of glossiness indexesEach group of glossiness index +.>Comparing with the expected glossiness, judging each group of nickel-based alloyWhether the glossiness of the new gold material after electrolytic polishing meets the expected glossiness or not, and selecting the glossiness index meeting the expected glossiness +.>。
8. The method as claimed in claim 7, wherein the step of determining whether the gloss of each group of new nickel-base alloy material after the electrolytic polishing meets the desired gloss is performed and selecting a gloss index meeting the desired gloss Comprising the following steps:
if the glossiness accords with the expected glossiness after the electrolytic polishing of a plurality of groups of new nickel-based alloy materials exist, the glossiness index with higher glossiness is stored and recordedCorresponding polishing index coefficient and data value of each polishing parameter.
9. A system for obtaining parameters of an electrolytic polishing process for new nickel-based alloy materials, comprising:
the display module is configured to be responsible for displaying the electrolytic polishing parameters in real time, visualizing the polishing parameters, and observing the glossiness index and the polishing progress of the workpiece in real time;
a power conditioning module configured to be responsible for controlling a current density of the electropolishing process;
the temperature control module is configured to control the temperature of the polishing solution in the electrolytic polishing process;
and the data acquisition module is configured for acquiring the pH value and the temperature of the polishing solution.
10. The system for obtaining parameters of the new nickel-base alloy material electropolishing process of claim 9, further comprising:
the software control module is configured to process the acquired information data, compare the glossiness under polishing operation of different parameters, feed back the change of the glossiness to the polishing parameters, and send out instructions for increasing or decreasing and adjusting the polishing parameters;
And the mechanical control module is configured to realize the operations of the micro equipment and the carrying workpiece moving device according to the control information sent by the software control module, and to actually adjust each polishing environment parameter in the polishing device according to each polishing parameter.
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