CN117000513A

CN117000513A - Colloid guiding structure, dispensing device and dispensing and bubble removing method

Info

Publication number: CN117000513A
Application number: CN202310873631.3A
Authority: CN
Inventors: 张景南; 陈明展; 王嘉磊
Original assignee: Nanjing Yili Xinchuang Semiconductor Technology Co ltd
Current assignee: Nanjing Yili Xinchuang Semiconductor Technology Co ltd
Priority date: 2023-07-17
Filing date: 2023-07-17
Publication date: 2023-11-07

Abstract

The application discloses a colloid guiding structure which is used for guiding the flow direction of colloid released by a dispensing component. The guide structure includes: a housing; the baffle channel is arranged in the shell; the baffle is accommodated in the baffle channel and can be controllably extended and retracted in the baffle channel; the glue guiding structure is connected with the glue dispensing part through the connecting hole, and a glue outlet of the glue dispensing part is positioned in the connecting hole or extends out of the connecting hole after the connection is completed; when the baffle extends out of the baffle channel, the baffle obliquely intersects with a passing path of the colloid released by the colloid outlet, so that the flow direction of the colloid is changed.

Description

Colloid guiding structure, dispensing device and dispensing and bubble removing method

Technical Field

The application relates to the field of industrial equipment, in particular to a colloid guide structure matched with a colloid-dispensing component, a colloid-dispensing method using the colloid-dispensing component with the colloid guide structure, and a method for curing and defoaming a product after dispensing.

Background

The system in package (System In a Package, SIP) is a packaging mode in which multiple functional chips (including functional chips such as a processor and a memory) are integrated in a package body in a side-by-side or stacked manner, so as to realize a substantially complete function.

With the development of chip technology in recent years, the multi-chip gap on the surface of the SIP package substrate is smaller and smaller, the dispensing distance required by the conventional Underfill process is further compressed, the difficulty in making a reasonable dispensing path is higher and the process efficiency is lower and lower. At the same time, the bubble defect rate also increases. Therefore, the underwill process direction of the SIP packaging product is gradually changed to a mode of short path, multipath, multiple waiting and low-speed slow glue discharging, so that the process stability is ensured.

With the high-speed development of the Chiplet technology, the product is increased in underwill filling difficulty, reduced in efficiency and increased in bubble reject ratio. The application provides a novel underwill valve body supplementing structure which is applicable to the processing of the product, and the novel underwill valve body supplementing structure is matched with a vacuum pressure bubble removal system to carry out the curing operation after dispensing so as to reduce the filling difficulty, improve the process efficiency and improve the product yield.

Disclosure of Invention

The application aims to solve the technical problems that the filling difficulty of an SIP packaging product underwill is increased, the efficiency is reduced, and the bubble reject ratio is high.

In order to solve the above problems, the present application discloses a colloid guiding structure, a dispensing device with the colloid guiding structure, and a dispensing and defoaming method.

One aspect of the application discloses a gel guiding structure for guiding the flow direction of a gel released by a dispensing component. The guide structure includes: a housing; the baffle channel is arranged in the shell; the baffle is accommodated in the baffle channel and can be controllably extended and retracted in the baffle channel; the colloid guide structure is connected with the dispensing component through the connecting hole; the connecting hole penetrates through the shell, and the glue outlet of the glue dispensing part is positioned in the connecting hole or extends out of the connecting hole after the connection is completed; when the baffle extends out of the baffle channel, the baffle obliquely intersects with a passing path of the colloid released by the colloid outlet, so that the flow direction of the colloid is changed.

In one possible implementation manner, the baffle is provided with a sliding piece, and can slide relative to the side wall of the baffle channel to drive the baffle to realize the expansion and contraction in the baffle channel.

In one possible implementation, the baffle channel is communicated with the outside of the shell through an air channel, the sliding piece seals the baffle channel, and air is introduced into the baffle channel through the air channel to apply force to the sliding piece so that the baffle extends out of the baffle channel.

In one possible implementation manner, the baffle is fixedly connected with the baffle channel through an elastic member, and after the gas introduced into the baffle channel is discharged through the air channel, the elastic member applies a retracting force to the baffle so as to retract the baffle into the baffle channel.

In one possible implementation, the elastic member comprises a spring.

In one possible implementation manner, the baffle is fixedly connected with a moving assembly, and the moving assembly drives the baffle to move so as to realize the extension or retraction of the baffle in the baffle channel.

In one possible implementation, the motion assembly comprises a linear actuator.

In one possible implementation, the guiding structure is made of a high temperature resistant material.

The application further discloses a dispensing device. The glue dispensing device comprises the glue guiding structure.

The application further discloses a dispensing and defoaming method. The method comprises the following steps: and (3) performing underfill operation on the target object by using the dispensing device, and transferring the target object to a vacuum pressure foam removing system to perform curing foam removing operation.

According to the colloid guide structure disclosed by the application, the telescopic baffle is used for realizing the change of the flow direction of the colloid, controlling the flow direction of the colloid, improving the phenomenon of bubble wrapping around the colloid and reducing the bubble generation rate. And meanwhile, the bubble removing and curing operation is carried out by combining the vacuum pressure bubble removing system, so that bubbles are completely removed, the yield is improved, and the operation efficiency is increased.

Drawings

The application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. The embodiments are not limiting, in which like numerals represent like structures, wherein:

FIG. 1 is an exemplary schematic diagram of a colloid-guiding structure according to some embodiments of the present application;

FIG. 2 is another exemplary schematic diagram of a colloid-guiding structure according to some embodiments of the present application;

FIG. 3 is an exemplary flow chart of a dispensing and de-bubbling method according to some embodiments of the application;

FIG. 4 is an exemplary dispensing schematic of a dispensing component having a gel guiding structure according to some embodiments of the present application;

fig. 5 is an exemplary comparison of dispensing and curing results according to some embodiments of the present application.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" and/or "as used herein includes any and all combinations of one or more of the associated listed items.

Some embodiments of the application are described below with reference to the accompanying drawings. It should be noted that the following description is for illustrative purposes and is not intended to limit the scope of the present application.

Referring to fig. 1 and 2, fig. 1 is an exemplary schematic diagram of a colloid-guiding structure according to some embodiments of the present application, shown in side view. Fig. 2 is another exemplary schematic diagram of a colloid guidance structure according to some embodiments of the present application, shown in top view. As shown in fig. 1 and 2, the colloid guide structure 100 may include a housing 110, a baffle channel 120, a baffle 130, and a connection hole 140.

The housing 110 is used to define the overall shape of the gel guide structure 100, and may be hollow or solid. In the example shown in fig. 1, the cross-sectional shape of the housing 110 is an inverted "concave" shape. Without limitation, the housing 110 may be a cylinder having a regular shape such as a rectangular parallelepiped, or various shapes that are changed as needed.

The baffle passageway 120 may be disposed inside the housing 110. For example, when the interior of the housing 110 is solid, the interior of the housing 110 may be material cut or removed to form the baffle channel 120. For another example, when the interior of the housing 110 is hollow, the baffle channel 120 may be constructed in the interior of the housing 110 using a material. The barrier passage 120 may communicate with the outside such that the barrier 130 accommodated inside the barrier passage 120 may extend out of the housing 110 and may retract into the inside of the housing 110.

The baffle 130 may extend from the interior of the baffle passageway 120 or retract into the baffle passageway 120. In some possible implementations, the shape of the baffle 130 can be matched to the shape of the baffle channel 120 and can slide relative to the baffle channel 120. For example, similar to the relationship of a piston to a piston cylinder. Thus, the baffle 130 may slide relative to the inner sidewall of the baffle passageway 120, extending the baffle passageway 120, or retracting into the baffle passageway 120. In some possible implementations, a slider may be provided on the baffle 130. For example, assuming that an end of the baffle 130 located inside the baffle channel 120 is defined as an inner end, the inner end may be fixedly connected with a slider. The slide member may slide relative to the inner side wall of the baffle passageway 120 to thereby drive the baffle 130 out of the baffle passageway 120 or retract into the baffle passageway 120.

The telescoping movement of the flapper 130 may be controlled. In some possible implementations, the baffle channel 120 may communicate with the outside through the air channel 150. Gas, such as high pressure gas, may be introduced into the baffle channel 120 through the gas passage 150. The barrier 130, which is adapted to the shape of the barrier channel 120, may be moved under the pressure applied by the high pressure gas to protrude out of the barrier channel 120. The slide may close the baffle passageway 120 when the baffle 130 is moved to set the slide. High pressure gas entering the baffle passageway 120 from the gas channel 150 may apply pressure to the slide, thereby moving the baffle 130 to extend out of the baffle passageway 120.

The baffle 130 may also be fixedly connected with an elastic member. For example, the inner end of the baffle 130 is connected to an elastic member by welding, gluing, or the like. One end of the elastic member is fixedly connected with the baffle 130, and the other end thereof may be fixedly connected with the baffle channel 120. For example, the inner side wall of the baffle passageway 120, or the top end located inside the housing 110. After passing high pressure gas into the baffle passageway 120 through the gas channel 150, the baffle 130 may protrude out of the baffle passageway 120. When the high pressure gas in the baffle passageway 120 is discharged through the gas passage 150, the baffle 130 extending out of the baffle passageway 120 is driven to retract into the baffle passageway 120 due to the inward tension of the elastic member. The elastic member may include a spring, bellows, or the like, having the property of being stretched by a force and retracted by a force.

In some possible implementations, the baffle 130 may be fixedly attached (e.g., by welding, etc.) with a moving assembly. The motion assembly may controllably move the flapper 130 to effect extension or retraction of the flapper 130 within the flapper channel 120. The motion assembly may include a linear actuator. The linearly actuated fixed end may be disposed at the top end of the baffle passageway 120 and the movable end may be fixedly coupled to the baffle 130. Thus, by controlling the rotation of the motor of the linear actuator, the linear movement of the moving end thereof can be controlled, thereby achieving the extension or retraction of the shutter 130. In some other examples, the motion assembly may be a linear actuator formed from a combination of multiple elements that achieves linear motion. For example, the motion assembly may be a combination of nut and screw. The rotating force of the motor is transmitted to the nut through the flexible shaft to drive the nut to rotate. The nut rotates to drive the screw rod to rotate. When the baffle 130 is fixedly connected with the screw sleeve, the screw is rotated to screw in or screw out the screw sleeve, so that the change of the linear length is realized. The reaction to the shutter 130 may then effect extension or retraction of the shutter 130. For another example, the motion assembly may be a combination of worm gears and worms. The rotating force of the motor is transmitted to the worm wheel through the flexible shaft to drive the worm wheel to rotate. The rotation of the worm wheel drives the worm to rotate. When the baffle 130 is fixedly connected with the worm sleeve, the rotation of the worm will effect the screwing of the worm into or out of the worm sleeve, thereby effecting a change in the linear length. The reaction to the shutter 130 may then effect extension or retraction of the shutter 130. The above examples and variations are intended to be within the scope of the claimed application.

The connection holes 140 may enable a fixed connection between the glue guide 100 and a dispensing component (e.g., a dispensing valve). For example, the connecting hole 140 can be clamped with a liquid box of the dispensing valve to realize fixation. In some possible implementations, the connection hole 140 may be formed through the housing 110, and after the connection is completed, the glue outlet of the glue dispensing component may be located in the connection hole 140 or protrude out of the connection hole 140. In this way, the glue released from the glue outlet is not blocked. Of course, the number of the connection holes 140 shown in fig. 1 and 2 is 1, and may be changed according to the configuration of the dispenser connected thereto. For example, the glue guide 100 also has an auxiliary connection hole that can be snapped into place with an underfill connector on the dispensing valve. For example, referring to fig. 2, the length of the housing 110 increases, and the auxiliary connection hole is provided at the left side of the housing 110 shown in fig. 2.

When the baffle 130 extends out of the baffle passageway 120, it may obliquely intersect the path of the glue released by the glue outlet. Due to the blocking of the baffle 130, the colloid changes the original flow direction, and the purpose of directional diversion is realized. For example, flow directed to the left (e.g., right baffle 130 extends in fig. 1) or to the right (e.g., left baffle 130 extends in fig. 1) by vertical drip.

It should be noted that the number of baffle passages 120, baffles 130, and air passages 140 shown in fig. 1 and 2 is not limiting. And can be 1, 2, 3 or more, and can be changed in number according to actual situations and application environments without limitation.

In order to ensure normal implementation of the colloid guiding function and prevent problems due to structural deformation, the colloid guiding structure 100 may be made of a high temperature resistant material, and may effectively avoid thermal deformation. For example, a refractory metal (e.g., a monomer metal such as tungsten, chromium, titanium, etc., a metal compound such as boron carbide, silicon carbide, boron nitride, silicon nitride, boron phosphide, silicon phosphide, etc., or a superalloy based on iron, cobalt, nickel, etc.), or a refractory plastic (e.g., a high temperature nylon, polyphenylene sulfide, polyaryletherketone, polysulfone, polyarylate, fluoroplastic, etc.).

The application also discloses a dispensing device. The dispensing device may include a dispensing valve and a gel guide structure coupled to the dispensing valve. The colloid guide structure can be used for changing the colloid flow direction in the dispensing process and realizing the guide function.

The application also discloses a dispensing and defoaming method. The method can realize bubble-free colloid filling by applying the colloid guiding structure disclosed by the prior art and combining a vacuum pressure bubble removal system. Referring to fig. 3, fig. 3 is an exemplary flow chart of a dispensing and de-bubbling method according to some embodiments of the application. As shown in fig. 3, the flow 300 may include the following operations.

And 310, performing underfill operation on the target object by using the dispensing device with the colloid guide structure.

In some embodiments, the target object may be a package substrate having multiple chips side-by-side or stacked. The process 300 is used for underfill filling and curing of each chip. The Underfill (Underfill) may be similar to the prior art. The difference is that in this step, the underfill released from the dispensing apparatus may be flow-directed using the above-described gel-directing structure 100. According to the application principle of underwill, the minimum flow space of the colloid is 10 μm. When the height of the baffle plate of the colloid guide structure is reduced to a state that the distance from the baffle plate to the substrate is smaller than 10 mu m, the underwill can be controlled to flow to a single side, so that the setting difficulty of a dispensing path is reduced. Referring to fig. 4, fig. 4 is an exemplary dispensing schematic of a dispensing component having a gel guiding structure according to some embodiments of the present application. In fig. 4, chip a and chip B are side-by-side on the substrate. When the chip A is glued, the right baffle plate of the colloid guiding structure can be controlled to extend out, and the colloid released from the colloid outlet can receive the guiding effect of the baffle plate, so that the flow direction of the colloid to the chip A is fixed.

Step 320, transferring the target object to a vacuum pressure bubble removal system for curing and bubble removal operation.

In some embodiments, the vacuum pressure de-bubbling system includes a de-bubbling chamber. The target object may be transferred into the de-bubbling chamber. Subsequently, the interior of the bubble removal chamber is evacuated. After the completion, a certain amount of gas molecules are introduced to maintain a preset pressure in the cavity. The predetermined pressure may be greater than 1 atmosphere. For example, 3atm, 5atm, 6atm, 8atm, etc. The temperature within the de-bubbling chamber may then be raised. The bubble removal is realized under the environment of high temperature and high pressure.

The gel guiding structure and the vacuum pressure bubble removing system used in the process 300 control the capillary action generating direction of the underfill through the gel guiding structure, thereby controlling the flowing state of the underfill at the bottom of the chip before solidification. The auxiliary vacuum pressure bubble removal system is used for curing operation, so that the bubble generation rate can be reduced, the process efficiency is improved, and the product yield is improved.

Referring to fig. 5, fig. 5 is an exemplary comparative graph of dispensing and curing results according to some embodiments of the present application. As shown in fig. 5 (a) and (c), the upper part is the bubble generation condition before bubble removal and curing after underwill using the colloid-guiding structure. The upper part is the bubble generation after underwill without using the colloid-guiding structure, before bubble removal and curing, as shown in the comparison (b) and (d). The black part is a colloid filled area, and the white part is generated bubbles. The colloid guide structure disclosed by the application can reduce the bubble generation rate. Meanwhile, as shown in (a) of fig. 5, the bubble removal and curing are performed using a vacuum pressure bubble removal system, so that no bubbles are realized. While the bubble removal systems of the prior art used in (b) and (c) did not improve the bubble situation. Fig. 5 (d) shows that the present application can effectively improve the bubble condition and reduce the bubbles by using the vacuum pressure bubble removal system.

Having described the basic concepts herein, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present application.

It should be noted that in order to simplify the presentation disclosed in this specification and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are presented in the claims are required for the present description. Indeed, less than all of the features of a single embodiment disclosed above.

In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments are modified in some examples by the modifier "about," approximately, "or" substantially. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and parameters set forth herein are approximations that may be employed in some embodiments to confirm the breadth of the range, in particular embodiments, the setting of such numerical values is as precise as possible.

Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments of this specification. Other variations are possible within the scope of this description. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present specification may be considered as consistent with the teachings of the present specification. Accordingly, the embodiments of the present specification are not limited to only the embodiments explicitly described and depicted in the present specification.

Claims

1. A glue guiding structure for guiding the flow direction of glue released by a dispensing member, the guiding structure comprising:

a housing;

the baffle channel is arranged in the shell;

the baffle is accommodated in the baffle channel and can be controllably extended and retracted in the baffle channel;

the colloid guide structure is connected with the dispensing component through the connecting hole; the connecting hole penetrates through the shell, and the glue outlet of the glue dispensing part is positioned in the connecting hole or extends out of the connecting hole after the connection is completed;

wherein,

when the baffle extends out of the baffle channel, the baffle obliquely intersects with a passing path of the colloid released by the colloid outlet, so that the flow direction of the colloid is changed.

2. The guide structure of claim 1, wherein the baffle is provided with a sliding member and is capable of sliding relative to a sidewall of the baffle channel to drive the baffle to retract within the baffle channel.

3. The guide structure according to claim 2, wherein the baffle passage communicates with the outside of the housing through an air passage, the slider closes the baffle passage, and air is introduced into the baffle passage through the air passage to apply a force to the slider so that the baffle protrudes into the baffle passage.

4. A guide structure according to claim 3, wherein the baffle is fixedly connected to the baffle channel by an elastic member, and the elastic member applies a retracting force to the baffle to retract the baffle into the baffle channel after the gas introduced into the baffle channel is exhausted through the gas channel.

5. The guide structure of claim 4, wherein the resilient member comprises a spring.

6. The guide structure of claim 1, wherein the baffle is fixedly connected to a movement assembly, and the movement assembly drives the baffle to move, so as to achieve extension or retraction of the baffle in the baffle channel.

7. The guide structure of claim 6, wherein the motion assembly comprises a linear actuator.

8. The guide structure of claim 1, wherein the guide structure is made of a high temperature resistant material.

9. A dispensing device comprising a glue guiding structure according to any one of claims 1-8.

10. A method of dispensing and de-bubbling, the method comprising:

performing underfill operation on the target object by using the dispensing device according to claim 9;

transferring the target object to a vacuum pressure bubble removal system for curing bubble removal operation.