CN116995526A - 一种空间耦合窄线宽半导体外腔激光器 - Google Patents
一种空间耦合窄线宽半导体外腔激光器 Download PDFInfo
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- CN116995526A CN116995526A CN202310991232.7A CN202310991232A CN116995526A CN 116995526 A CN116995526 A CN 116995526A CN 202310991232 A CN202310991232 A CN 202310991232A CN 116995526 A CN116995526 A CN 116995526A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 230000008878 coupling Effects 0.000 title claims abstract description 21
- 238000010168 coupling process Methods 0.000 title claims abstract description 21
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 21
- 230000003287 optical effect Effects 0.000 claims abstract description 141
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 58
- 239000010703 silicon Substances 0.000 claims abstract description 58
- 238000001914 filtration Methods 0.000 claims abstract description 8
- 239000013307 optical fiber Substances 0.000 claims description 17
- 230000002401 inhibitory effect Effects 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000001678 irradiating effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 7
- 230000001427 coherent effect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0282—Passivation layers or treatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1071—Ring-lasers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (7)
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CN202310991232.7A CN116995526B (zh) | 2023-08-08 | 2023-08-08 | 一种空间耦合窄线宽半导体外腔激光器 |
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CN202310991232.7A CN116995526B (zh) | 2023-08-08 | 2023-08-08 | 一种空间耦合窄线宽半导体外腔激光器 |
Publications (2)
Publication Number | Publication Date |
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CN116995526A true CN116995526A (zh) | 2023-11-03 |
CN116995526B CN116995526B (zh) | 2024-04-09 |
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CN202310991232.7A Active CN116995526B (zh) | 2023-08-08 | 2023-08-08 | 一种空间耦合窄线宽半导体外腔激光器 |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6570893B1 (en) * | 1998-11-25 | 2003-05-27 | Science & Technology Corporation @ Unm | Precisely wavelength-tunable and wavelength-switchable narrow linewidth lasers |
US20120195332A1 (en) * | 2011-01-27 | 2012-08-02 | Gideon Yoffe | External cavity widely tunable laser using a silicon resonator and micromechanically adjustable coupling |
CN106785882A (zh) * | 2016-11-30 | 2017-05-31 | 武汉光迅科技股份有限公司 | 一种高功率双端口输出的硅基可调谐外腔激光器 |
CN109830891A (zh) * | 2019-03-12 | 2019-05-31 | 南京大学 | 一种窄线宽半导体激光器 |
CN110401101A (zh) * | 2019-07-26 | 2019-11-01 | 中国科学院半导体研究所 | 半导体激光器芯片与硅光芯片的耦合结构及耦合方法 |
CN110459956A (zh) * | 2019-08-23 | 2019-11-15 | 中兴光电子技术有限公司 | 一种窄线宽可调谐激光器 |
US20200259313A1 (en) * | 2017-09-29 | 2020-08-13 | The Trustees Of Columbia University In The City Of New York | Compact narrow-linewidth integrated laser |
US20210159658A1 (en) * | 2019-11-22 | 2021-05-27 | Chongqing University | On-chip ultra-narrow linewidth laser and method for obtaining single-longitudinal mode ultra-narrow linewidth optical signal |
CN116247511A (zh) * | 2022-12-28 | 2023-06-09 | 中国电子科技集团公司第四十四研究所 | 一种基于异构集成的玻璃基高功率窄线宽半导体激光器 |
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2023
- 2023-08-08 CN CN202310991232.7A patent/CN116995526B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6570893B1 (en) * | 1998-11-25 | 2003-05-27 | Science & Technology Corporation @ Unm | Precisely wavelength-tunable and wavelength-switchable narrow linewidth lasers |
US20120195332A1 (en) * | 2011-01-27 | 2012-08-02 | Gideon Yoffe | External cavity widely tunable laser using a silicon resonator and micromechanically adjustable coupling |
CN106785882A (zh) * | 2016-11-30 | 2017-05-31 | 武汉光迅科技股份有限公司 | 一种高功率双端口输出的硅基可调谐外腔激光器 |
US20200259313A1 (en) * | 2017-09-29 | 2020-08-13 | The Trustees Of Columbia University In The City Of New York | Compact narrow-linewidth integrated laser |
CN109830891A (zh) * | 2019-03-12 | 2019-05-31 | 南京大学 | 一种窄线宽半导体激光器 |
CN110401101A (zh) * | 2019-07-26 | 2019-11-01 | 中国科学院半导体研究所 | 半导体激光器芯片与硅光芯片的耦合结构及耦合方法 |
CN110459956A (zh) * | 2019-08-23 | 2019-11-15 | 中兴光电子技术有限公司 | 一种窄线宽可调谐激光器 |
US20210159658A1 (en) * | 2019-11-22 | 2021-05-27 | Chongqing University | On-chip ultra-narrow linewidth laser and method for obtaining single-longitudinal mode ultra-narrow linewidth optical signal |
CN116247511A (zh) * | 2022-12-28 | 2023-06-09 | 中国电子科技集团公司第四十四研究所 | 一种基于异构集成的玻璃基高功率窄线宽半导体激光器 |
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