CN116993224A - Method, device and medium for sorting wafers - Google Patents
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Abstract
The embodiment of the invention discloses a method, a device and a medium for sorting wafers; the method may include: determining a first wafer batch and a second wafer batch to be sorted according to process component data, a first evaluation index and a second evaluation index generated in the wafer production process; selecting a first wafer from the first wafer batch according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and recording; stopping the simulation exchange when the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are better than the second evaluation index; and performing actual sorting exchange on the first wafer batch and the second wafer batch according to the simulated exchange record.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductor manufacturing, in particular to a method, a device and a medium for sorting wafers.
Background
To ensure that the quality of the wafer shipment meets customer requirements, the quality of each LOT (LOT) of wafers is typically managed during production according to statistical process control (SPC, statistical Process Control) based on customer quality requirements.
In the process of management and control, when the control index is too strict, most batches of products are intercepted, so that the productivity is seriously damaged. In addition, in each intercepted batch of products, there are still some wafers meeting the internal specification and the customer specification, and the wafers are intercepted and cannot be delivered, so that waste of production resources is caused, and the production cost is increased.
In view of this, manual sorting is currently performed for the shipment products, but the manual sorting belongs to manual sensory inspection, and therefore, deviation of judgment based on an inspector is unavoidable, so that there is a problem that subjective judgment affects accuracy of judgment results; in addition, the manual sensory inspection speed is low, and the efficiency is low; and the inspector is skilled, takes time and is prone to missed judgment.
Disclosure of Invention
Accordingly, embodiments of the present invention are directed to a method, apparatus, and medium for wafer sorting; the wafer sorting device can objectively, efficiently and accurately sort wafers, improve productivity and reduce production cost while meeting customer quality requirements.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a method for sorting wafers, the method including:
Determining a first wafer batch and a second wafer batch to be sorted according to process component data, a first evaluation index and a second evaluation index generated in the wafer production process; wherein the first evaluation index is better than the second evaluation index, the quality index characterized by the process component data of the first wafer lot is better than the first evaluation index, and the quality index characterized by the process component data of the second wafer lot is worse than the second evaluation index;
selecting a first wafer from the first wafer batch according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and recording;
stopping the simulation exchange when the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are better than the second evaluation index;
and performing actual sorting exchange on the first wafer batch and the second wafer batch according to the simulated exchange record.
In a second aspect, an embodiment of the present invention provides an apparatus for sorting wafers, the apparatus including: a determining section, an analog sorting section, a stopping section, and an actual sorting section; wherein,,
The determining part is configured to determine a first wafer batch and a second wafer batch to be sorted according to process component data, a first evaluation index and a second evaluation index generated in the wafer production process; wherein the first evaluation index is better than the second evaluation index, the quality index characterized by the process component data of the first wafer lot is better than the first evaluation index, and the quality index characterized by the process component data of the second wafer lot is worse than the second evaluation index;
the simulation sorting part is configured to select a first wafer from the first wafer batch according to the quality index represented by the process component data, perform simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and record the simulation exchange;
the stopping part is configured to stop the simulation exchange when the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are both better than the second evaluation index;
the actual sort section is configured to perform an actual sort swap on the first wafer lot and the second wafer lot according to an analog swap record.
In a third aspect, embodiments of the present invention provide a computing device, the computing device comprising: a processor and a memory; the processor is configured to execute instructions stored in the memory to implement the method of wafer sorting according to the first aspect.
In a fourth aspect, embodiments of the present invention provide a computer storage medium storing at least one instruction for execution by a processor to implement the method of wafer sorting according to the first aspect.
In a fifth aspect, embodiments of the present invention provide a computer program product comprising computer instructions stored in a computer readable storage medium; the computer instructions are read from a computer-readable storage medium by a processor of a computing device, and executed by the processor, cause the computing device to perform the method of wafer sorting according to the first aspect.
The embodiment of the invention provides a method, a device and a medium for sorting wafers; the first wafers in the first wafer lot with excellent quality and the second wafers in the second wafer lot with extremely poor quality are subjected to simulation exchange, so that the quality index of the extremely poor quality lot is improved by objectively, efficiently and accurately sorting the wafers, the probability of interception of the extremely poor quality lot is reduced, the productivity is improved while the quality requirement of customers is met, the waste of production resources is avoided, and the production cost is reduced.
Drawings
Fig. 1 is a schematic flow chart of a wafer sorting method according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a relationship between LOT and quality index according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of wafer warp in each Lot according to an embodiment of the present invention.
FIG. 4 is a schematic flow chart of a simulation exchange of various process component data according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of process component data of a first wafer lot and a second wafer lot before sorting according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of process component data of a first wafer lot and a second wafer lot after sorting according to an embodiment of the present invention.
Fig. 7 is a schematic diagram of an apparatus for sorting wafers according to an embodiment of the present invention.
Fig. 8 is a schematic structural diagram of a computing device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In the wafer production process, process component data generated at each process stage undergone by each wafer in each production LOT (LOT) may be recorded, for example, flatness (warp), micro morphology (NANO 2 x 2) of a region obtained by dividing the wafer into regions according to 2mm x 2mm, micro morphology (NANO 10 x 10) of a region obtained by dividing the wafer into regions according to 10mm x 10mm, and the like, where the process component data can represent quality indexes of the single wafer. When a LOT of wafers are produced, the LOT's process component data may be represented according to the mean of the process component data of all the LOT's wafers.
In some examples, the process component data of the LOT can generally characterize the quality index of the LOT, as well as determine whether the LOT is shipped, e.g., when the quality index of the LOT characterized by the process component data of the LOT meets or exceeds shipment specifications, it may be determined that the LOT is shipment capable. When the quality index of the LOT, characterized by the process component data of the LOT, is below the shipment specification, it is determined that the LOT cannot be shipped and the LOT must be intercepted.
Along with the increasingly strict quality requirements of downstream customers, not only is the process quality of each process stage in the wafer production process continuously improved at the production end so that the process component data of the wafer can represent better quality indexes, but also strict shipment specifications are required to be set at the quality control end so as to intercept LOTs which do not meet the shipment specifications. However, if the shipment specifications are set too tightly, most batches (LOT) of product are intercepted, resulting in severely impaired capacity. In addition, in each intercepted batch of products, there are still some wafers meeting the internal specification and the customer specification, and the wafers are intercepted and cannot be delivered, so that waste of production resources is caused, and the production cost is increased.
Based on the above, the embodiment of the invention provides a scheme for carrying out wafer sorting based on process component data, and the optimal quality index and the worst LOT are subjected to simulation exchange by taking a single wafer as a unit, so that the quality index of the LOT after the simulation exchange accords with the shipment specification, thereby improving the productivity while meeting the quality requirements of clients and reducing the production cost.
Referring to fig. 1, a method for sorting wafers according to an embodiment of the present invention may be applied to a computing device, and the method includes:
s101: determining a first wafer batch and a second wafer batch to be sorted according to process component data, a first evaluation index and a second evaluation index generated in the wafer production process;
in the embodiment of the present invention, the first evaluation index is better than the second evaluation index, the quality index represented by the process component data of the first wafer lot is better than the first evaluation index, and the quality index represented by the process component data of the second wafer lot is worse than the second evaluation index.
Specifically, as the LOT is produced in the wafer production process, the quality index and the LOT number show a similar normal distribution relationship. For some process component data used to characterize the quality index, such as the flatness (warp) of the wafer, a higher value indicates a worse quality index (flatness) and a less flat wafer; furthermore, for other process component data that are used to characterize the quality indicator, the higher the value thereof, the better the quality indicator that it characterizes. The process component data for each LOT may specifically be the average of the process component data for all wafers in that LOT.
Taking the process component data bits warp as an example, the first evaluation index is set as the lower limit value (lqm_l) of the warp value set according to the intercepted LOT ratio in the history production data, and the second evaluation index is the highest upper limit value (lqm_u) of the warp value set by the client. From the relation between the warp value and the flatness index, LQM_L is the first evaluation index, and LQM_U is the second evaluation index. Then when the warp value is smaller than lqm_l, it indicates that the first evaluation index is better; when the warp value is greater than lqm_l, it indicates that it is inferior to the second evaluation index.
Based on this, the relationship between the LOT produced in the wafer production process and the quality index is shown in fig. 2, and the warp index is between the second evaluation index and the first evaluation index, as shown in LOT-02 in fig. 2, the LOT of wafers can be considered to meet the shipment specification requirement. In addition, there is still a very small portion of the LOT whose warp index is better than the first evaluation index or worse than the second evaluation index. In the embodiment of the present invention, the LOT whose warp index is better than the first evaluation index, i.e., whose warp value is smaller than lqm_l (6000) is referred to as the first LOT (LOT), which indicates that the LOT has an excellent wafer quality index, such as LOT-01 shown in fig. 2, and these LOT wafers naturally also meet the shipment specification requirement. In addition, a LOT whose warp index is inferior to the second evaluation index, i.e., whose warp value is greater than lqm_l (9485), is referred to as a second wafer LOT (LOT), indicating that the LOT's wafer quality index is very poor, such as LOT-03 shown in fig. 2, which LOT's wafers do not meet shipment specification requirements, the LOT-03 will be intercepted according to the current relevant quality control scheme.
S102: selecting a first wafer from the first wafer batch according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and recording;
in the embodiment of the present invention, referring to fig. 2, a warp schematic diagram of a wafer in each Lot shown in fig. 3 is referred to, in fig. 3, lot-01, lot-02 and Lot-03 are respectively indicated by corresponding boxes, the dots in the boxes indicate the wafer, and each dot is dispersed in the corresponding box of each Lot according to the warp value of the corresponding wafer. In Lot-01, as indicated by the black dots, the warp value for the presence of 3 wafers is set to be lower than LQM_L (6000). In Lot-03, as indicated by the black dots, the warp value for the presence of 3 wafers is set to be higher than LQM_U (9485) so that the warp mean value of Lot-03 is greater than LQM_U. As can be seen from fig. 3, there are still wafers with warp values between lqm_l and lqm_u in Lot-03, and even wafers with warp values lower than lqm_l, that is, if Lot-03 is intercepted, wafers meeting the shipment specification (as shown by white filled dots) in Lot-03 cannot be shipped, thereby resulting in waste of production resources and increased production cost.
Based on this, in the embodiment of the invention, the wafer with the warp value lower than LQM_L in Lot-01 and the wafer with the warp value higher than LQM_U in Lot-03 are subjected to simulated exchange, so that the warp average value of Lot-03 after simulated exchange is reduced at the cost of improving the warp average value of Lot-01 after simulated exchange, and the warp average value of Lot-01 after simulated exchange is expected to be reduced to be between LQM_L and LQM_U while being lifted to be not more than LQM_U. Thereby realizing that Lot-03 accords with shipment specifications and is not intercepted.
Specifically, as indicated by the dashed line 31 in fig. 3, in some examples, selecting a first wafer from the first wafer lot according to the quality index characterized by the process component data, and performing a simulated swap with a second wafer from the second wafer lot according to the quality index characterized by the process component data may include:
determining a wafer with the highest quality index represented by the process component data in the first wafer batch as the first wafer;
determining a wafer with the lowest quality index represented by the process component data in the second wafer batch as the second wafer;
after the first wafer is sorted to the second wafer lot and the second wafer is sorted to the first wafer lot, a first wafer lot after simulation exchange and a second wafer lot after simulation exchange are formed.
For the above specific example, in detail, the wafers of Lot-01 may be arranged from small to large according to the warp value, and the wafers in the first position after arrangement represent the first wafers with the highest quality indexes. The wafers of Lot-03 can be arranged according to the warp value from large to small, and the wafers in the first position after arrangement represent the second wafers with the lowest quality indexes.
In addition, each time the simulation exchange is performed, it should be noted that each wafer can be bound with the identifier of the Lot and the serial number of the Lot according to the identifier generated by the laser marking, so that the simulation exchange process can be recorded according to the binding relationship, for example, the 4 th wafer of the Lot-01 is identified by the wafer identifier a, the 2 nd wafer of the Lot-03 is identified by the wafer identifier B, and when the 4 th wafer of the Lot-01 and the 2 nd wafer of the Lot-03 are subjected to the simulation exchange, the simulation exchange between the wafer a and the wafer B can be recorded.
S103: stopping the simulation exchange when the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are better than the second evaluation index;
in the embodiment of the present invention, in combination with the foregoing implementation procedure of S102, after the analog exchange is completed as shown by the dashed line 31 in fig. 3, if the average value of warp of Lot-01 after the analog exchange is smaller than lqm_u and the average value of warp of Lot-03 after the analog exchange is also smaller than lqm_u, then the analog exchange indicating the foregoing implementation procedure makes the Lot-03 conform to the shipment specification and not be intercepted any more, and at this time, the analog exchange may be stopped.
S104: and performing actual sorting exchange on the first wafer batch and the second wafer batch according to the simulated exchange record.
In the embodiment of the invention, after the simulation exchange is stopped, in the actual sorting process, if the actual sorting exchange is carried out according to the simulation exchange record, after the sorting exchange is actually completed, lot-01 and Lot-03 both accord with shipment specifications, so that the Lot-03 is not required to be intercepted, the waste of production resources is avoided, and the production cost is reduced.
According to the technical scheme shown in FIG. 1, the wafers in the extremely-good-quality batch and the wafers in the extremely-poor-quality batch are subjected to simulation exchange, so that the quality index of the extremely-poor-quality batch is improved, the probability of interception of the extremely-poor-quality batch is reduced, waste of production resources is avoided, and the production cost is reduced.
For the technical solution shown in fig. 1, in some possible implementations, the method further includes:
when the quality index represented by the process component data of the second wafer lot after simulation exchange is inferior to the second evaluation index, the wafer with the highest quality index represented by the process component data in the first wafer lot after simulation exchange is simulated and exchanged to the second wafer lot after simulation exchange, and the wafer with the lowest quality index represented by the process component data in the second wafer lot after simulation exchange is simulated and exchanged to the first wafer lot after simulation exchange, so as to form a first wafer lot after simulation exchange again and a second wafer lot after simulation exchange again, and recording;
And until all the wafers are subjected to simulation exchange, or the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are better than the second evaluation index.
For the above implementation, specifically, as shown in fig. 3, after the simulation swap is completed as shown by the dashed line 31, if the warp mean value of Lot-03 after the simulation swap is still greater than lqm_u, it indicates that a better quality wafer still needs to be swapped with a worse quality wafer in Lot-03 from Lot-01. Specifically, the optimal quality wafer of Lot-01 after the simulation exchange shown by the broken line 31 and the worst quality wafer of Lot-03 after the simulation exchange shown by the broken line 31 can be simulated and exchanged according to the broken line 32 to form Lot-01 and Lot-03 after the re-simulation exchange according to the broken line 32, and recorded.
If the warp mean value of Lot-03 after the re-simulation exchange is smaller than LQM_U, the simulation exchange is stopped, and the actual sorting exchange is performed according to the simulation exchange records shown by the broken line 31 and the broken line 32.
If the average value of the warp of the Lot-03 after the simulation exchange is still greater than LQM_U again, the simulation exchange is performed according to the broken line 33 according to the specific embodiment until the average value of the warp of the Lot-01 after the simulation exchange and the Lot-03 after the simulation exchange is smaller than LQM_U.
Or until all the wafers complete the simulation exchange, if the warp mean value of Lot-03 is still larger than LQM_U after all the wafers complete the simulation exchange, the number of the wafers with poor quality in LOT-03 is excessive, and the wafers meeting the shipment specification hardly exist, in this case, the actual sorting exchange of Lot-01 and Lot-03 is not required to be carried out subsequently, the interception of Lot-03 can be directly determined, and the simulation exchange record is deleted.
Alternatively, when the warp mean value of Lot-01 is greater than LQM_U after the simulated exchange according to the dashed line 31, then it may be determined directly that Lot-03 is to be intercepted and the simulated exchange record deleted without the need for subsequent actual sort exchanges for Lot-01 and Lot-03. In addition, lot-01 and Lot-03 can be sorted by manual intervention. Alternatively, lot-01 may be exchanged with another very bad wafer Lot.
In the embodiment of the present invention, it should be noted that, in addition to warp, the process component data may also include NANO2 x 2 and NANO10 x 10, that is, the types of the process component data may be greater than 1. When the number of types of process component data is more than 1, the process component data may be prioritized, for example, warp has a higher priority than NANO2 x 2, and NANO2 x 2 has a higher priority than NANO10 x 10. Accordingly, in some possible implementations, the selecting a first wafer from the first wafer lot according to the quality index represented by the process component data, performing simulation exchange with a second wafer from the second wafer lot according to the quality index represented by the process component data, and recording, where the performing includes:
Determining a wafer with the highest quality index represented by the process component data with the highest priority in the first wafer batch as the first wafer;
determining a wafer with the lowest quality index represented by the process component data with the highest priority in the second wafer batch as the second wafer;
after the first wafer is sorted to the second wafer batch and the second wafer is sorted to the first wafer batch, a first wafer batch after simulation exchange and a second wafer batch after simulation exchange are formed;
when the quality indexes represented by the process component data with the highest priority of the first wafer batch after simulation exchange and the second wafer batch after simulation exchange are better than the second evaluation index, executing a simulation exchange process for the process component data with the highest priority until the simulation exchange process is completed for all the process component data;
when the quality index represented by the process component data with the highest priority in the second wafer lot after simulation exchange is inferior to the second evaluation index, sorting the wafer with the highest quality index represented by the process component data with the highest priority in the first wafer lot after simulation exchange into the second wafer lot after simulation exchange, sorting the wafer with the lowest quality index represented by the process component data with the highest priority in the second wafer lot after simulation exchange into the first wafer lot after simulation exchange, forming a first wafer lot after simulation exchange again and a second wafer lot after simulation exchange again, and recording;
And executing the simulation exchange process for the process component data with the highest priority level until the simulation exchange process is completed for all the process component data when the quality indexes represented by the process component data with the highest priority level of the first wafer batch after the re-simulation exchange and the second wafer batch after the re-simulation exchange are better than the second evaluation index.
For the above implementation, taking 3 types of process component data as an example, in combination with the first wafer Lot-01 and the second wafer Lot-03 in the foregoing example, in detail, as shown in fig. 4, the method may include:
s401: performing simulation exchange on a first wafer with the highest quality index represented by the process component data with the highest priority in Lot-01 and a second wafer with the lowest quality index represented by the process component data with the highest priority in Lot-03;
s402: acquiring process component data with highest priority of Lot-01 after analog exchange and Lot-03 after analog exchange;
s403: and when the quality index represented by the process component data with the highest priority in the Lot-03 after the simulation exchange is lower than the second evaluation index, performing the simulation exchange again on the wafer with the highest quality index represented by the process component data with the highest priority in the Lot-01 after the simulation exchange and the wafer with the lowest quality index represented by the process component data with the highest priority in the Lot-03 after the simulation exchange, and acquiring the process component data with the highest priority in the Lot-01 after the simulation exchange again and the Lot-03 after the simulation exchange again until the quality index represented by the process component data with the highest priority in the Lot-03 after the simulation exchange is better than the second evaluation index, and executing the simulation exchange process on the process component data with the highest priority until the simulation exchange process is completed on all the process component data.
S404: when the quality indexes represented by the process component data with highest priority of Lot-01 after analog exchange and Lot-03 after analog exchange are better than the second evaluation index, executing the analog exchange process on the process component data with highest priority until the analog exchange process is completed on all the process component data;
s405: and after all the wafers are subjected to simulation exchange, determining that the Lot-03 does not meet the shipment requirement, wherein the quality index represented by the process component data with the highest priority of Lot-03 is still lower than the second evaluation index.
The foregoing embodiments illustrate a detailed process of performing a simulated exchange based on a plurality of process component data, and the number of the first wafer lot and the number of the second wafer lot may also be more than one as shown in fig. 2, based on which, in some possible implementations, the determining the first wafer lot and the second wafer lot to be sorted according to the process component data, the first evaluation index and the second evaluation index generated in the wafer production process includes:
determining a wafer batch with the quality index represented by the process component data being better than the first evaluation index as a first wafer batch and determining a wafer batch with the quality index represented by the process component data being worse than the second evaluation index as a second wafer batch from all wafer batches obtained by wafer production;
Arranging the first wafer batch according to the quality index from good to bad, and arranging the second wafer batch according to the quality index from bad to good;
correspondingly, selecting a first wafer from the first wafer batch according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and recording, wherein the method comprises the following steps:
and selecting a first wafer from the first wafer batch with the optimal quality index according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch with the worst quality index according to the quality index represented by the process component data, and recording.
Based on the above implementation, in some examples, the method further comprises:
and after the simulation exchange of all the wafers is completed, the quality index represented by the process component data of the first wafer batch after the simulation exchange and/or the second wafer batch after the simulation exchange is inferior to the second evaluation index, selecting the first wafer from the first wafer batches with the suboptimal quality index according to the quality index represented by the process component data, performing the simulation exchange with the second wafer selected from the second wafer batches with the suboptimal quality index according to the quality index represented by the process component data, and recording until the simulation exchange of all the first wafer batches and all the second wafer batches is completed.
For the above implementation and examples thereof, in detail, when the number of the first wafer lots and the number of the second wafer lots are more than one, the first wafer lots may be arranged from good to bad according to the quality index, and the second wafer lots may be arranged from bad to good according to the quality index. Accordingly, the first wafer lot with the optimal quality index and the second wafer lot with the worst quality index can be subjected to simulation exchange according to the technical scheme, so that the quality index of the second wafer lot with the worst quality index is improved to meet the shipment specification. Then, the first wafer lot with inferior quality index and the second wafer lot with inferior quality index can be subjected to simulation exchange according to the technical scheme, so as to improve the quality index of the second wafer lot with inferior quality index to enable the second wafer lot to meet the shipment specification. Until all the second wafer lots have completed the analog exchange.
For the solution shown in fig. 4, referring to fig. 5, before the simulated sorting, taking as an example that the process component is warp, the warp average value of the first wafer Lot-01 is smaller than lqm_l, and the warp average value of the second wafer Lot-03 is larger than lqm_u. The wafer in each Lot is correspondingly provided with an identifier. After the simulation exchange is performed by the scheme, the identifications of the wafers contained in Lot-01 and Lot-03 are shown in FIG. 6. As can be seen from fig. 6, the identification of the wafer and its corresponding process component data are not changed during the analog exchange, but only the Lot where it is located is changed. The average values of the warp of Lot-01 and Lot-03 after the simulation exchange are both larger than LQM_L and smaller than LQM_U, that is, for warp, the Lot-01 and Lot-03 after the simulation exchange meet the flatness index of shipment requirements.
After the analog sorting is completed for the process component warp, the analog sorting can be further performed for the process component NANO2 x 2 and the process component NANO10 x 10 according to the foregoing analog exchange process, so that the load-01 and the load-03 obtained by the final sorting can meet the shipment specifications of the quality indexes corresponding to warp, NANO2 x 2 and NANO10 x 10.
It should be noted that, after the first wafer lot with the optimal quality index and the second wafer lot with the worst quality index are subjected to the simulation exchange according to the above technical scheme, the quality index of the second wafer lot with the worst quality index still cannot be improved to meet the shipment specification, so that the first wafer lot with the optimal quality index and the second wafer lot with the inferior quality index can be subjected to the simulation exchange according to the above technical scheme, so as to improve the quality index of the second wafer lot with the inferior quality index to meet the shipment specification. If the first wafer lot with the optimal quality index still cannot meet the shipment specification, the first wafer lot with the optimal quality index and the second wafer lots arranged from inferior to superior according to the quality index are subjected to simulation exchange according to the technical scheme, and if the first wafer lot with the optimal quality index cannot raise the quality of any one second wafer lot until the quality of any one second wafer lot meets the shipment specification, the first wafer lot indicates that all second wafer lots do not meet the shipment requirement and need to be intercepted. It can be understood that in the above description, besides the first wafer lot with the optimal quality index, the method can be applied to other first wafer lots arranged according to the quality index from good to bad, which is not described herein.
Based on the same inventive concept as the foregoing technical solution, referring to fig. 7, an apparatus 70 for sorting wafers according to an embodiment of the present invention is shown, where the apparatus 70 includes: a determining section 701, an analog sorting section 702, a stopping section 703, and an actual sorting section 704; wherein,,
the determining part 701 is configured to determine a first wafer lot and a second wafer lot to be sorted according to process component data, a first evaluation index, and a second evaluation index generated in a wafer production process; wherein the first evaluation index is better than the second evaluation index, the quality index characterized by the process component data of the first wafer lot is better than the first evaluation index, and the quality index characterized by the process component data of the second wafer lot is worse than the second evaluation index;
the analog sorting part 702 is configured to select a first wafer from the first wafer lot according to the quality index represented by the process component data, perform analog exchange with a second wafer selected from the second wafer lot according to the quality index represented by the process component data, and record the result;
the stopping portion 703 is configured to stop the simulated swap when the quality index characterized by the process component data of the first wafer lot after the simulated swap and the second wafer lot after the simulated swap are both better than the second evaluation index;
The actual sort section 704 is configured to perform an actual sort swap on the first wafer lot and the second wafer lot according to an analog swap record.
In some examples, the analog sorting portion 702 is configured to:
determining a wafer with the highest quality index represented by the process component data in the first wafer batch as the first wafer;
determining a wafer with the lowest quality index represented by the process component data in the second wafer batch as the second wafer;
after the first wafer is sorted to the second wafer lot and the second wafer is sorted to the first wafer lot, a first wafer lot after simulation exchange and a second wafer lot after simulation exchange are formed.
In some examples, the analog sorting portion 702 is further configured to:
when the quality index represented by the process component data of the second wafer lot after simulation exchange is inferior to the second evaluation index, the wafer with the highest quality index represented by the process component data in the first wafer lot after simulation exchange is simulated and exchanged to the second wafer lot after simulation exchange, and the wafer with the lowest quality index represented by the process component data in the second wafer lot after simulation exchange is simulated and exchanged to the first wafer lot after simulation exchange, so as to form a first wafer lot after simulation exchange again and a second wafer lot after simulation exchange again, and recording;
And until all the wafers are subjected to simulation exchange, or the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are better than the second evaluation index.
In some examples, the process component data for the first wafer lot includes: the average value of the process component data of all wafers in the first wafer batch; process component data for the second wafer lot, comprising: and the average value of the process component data of all wafers in the second wafer batch.
In some examples, the process component data is at least two process component data having a priority order; accordingly, the analog sorting section 702 is configured to:
determining a wafer with the highest quality index represented by the process component data with the highest priority in the first wafer batch as the first wafer;
determining a wafer with the lowest quality index represented by the process component data with the highest priority in the second wafer batch as the second wafer;
after the first wafer is sorted to the second wafer batch and the second wafer is sorted to the first wafer batch, a first wafer batch after simulation exchange and a second wafer batch after simulation exchange are formed;
When the quality indexes represented by the process component data with the highest priority of the first wafer batch after simulation exchange and the second wafer batch after simulation exchange are better than the second evaluation index, executing a simulation exchange process for the process component data with the highest priority until the simulation exchange process is completed for all the process component data;
when the quality index represented by the process component data with the highest priority in the first wafer lot after simulation exchange and/or the second wafer lot after simulation exchange is inferior to the second evaluation index, sorting the wafer with the highest quality index represented by the process component data with the highest priority in the first wafer lot after simulation exchange into the second wafer lot after simulation exchange, sorting the wafer with the lowest quality index represented by the process component data with the highest priority in the second wafer lot after simulation exchange into the first wafer lot after simulation exchange, forming the first wafer lot after simulation exchange again and the second wafer lot after simulation exchange again, and recording;
and executing the simulation exchange process for the process component data with the highest priority level until the simulation exchange process is completed for all the process component data when the quality indexes represented by the process component data with the highest priority level of the first wafer batch after the re-simulation exchange and the second wafer batch after the re-simulation exchange are better than the second evaluation index.
In some examples, the determining portion 701 is configured to:
determining a wafer batch with the quality index represented by the process component data being better than the first evaluation index as a first wafer batch and determining a wafer batch with the quality index represented by the process component data being worse than the second evaluation index as a second wafer batch from all wafer batches obtained by wafer production;
arranging the first wafer batch according to the quality index from good to bad, and arranging the second wafer batch according to the quality index from bad to good;
accordingly, the analog sorting section 702 is configured to:
and selecting a first wafer from the first wafer batch with the optimal quality index according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch with the worst quality index according to the quality index represented by the process component data, and recording.
In some examples, the analog sorting portion 702 is further configured to:
and after the simulation exchange of all the wafers is completed, the quality index represented by the process component data of the first wafer batch after the simulation exchange and/or the second wafer batch after the simulation exchange is inferior to the second evaluation index, selecting the first wafer from the first wafer batches with the suboptimal quality index according to the quality index represented by the process component data, performing the simulation exchange with the second wafer selected from the second wafer batches with the suboptimal quality index according to the quality index represented by the process component data, and recording until the simulation exchange of all the first wafer batches and all the second wafer batches is completed.
Referring to FIG. 8, a block diagram of a computing device is shown, according to one exemplary embodiment of the present application. In some examples, computing device 80 may be at least one of a smart phone, a smart watch, a desktop computer, a laptop computer, a virtual reality terminal, an augmented reality terminal, a wireless terminal, and a laptop portable computer. The computing device 80 has communication capabilities and can access a wired network or a wireless network. Computing device 80 may refer broadly to one of a plurality of terminals, and those skilled in the art will recognize that the number of terminals may be greater or lesser. In some examples, computing device 80 may receive data based on an accessed wired network or a wireless network. It will be appreciated that the computing device 80 is responsible for the computing and processing tasks of the present application, and that embodiments of the application are not limited thereto.
As shown in fig. 8, a computing device in the present application may include one or more of the following components: a processor 810 and a memory 820.
In the alternative, processor 810 utilizes various interfaces and lines to connect various portions of the overall computing device, perform various functions of the computing device, and process data by executing or executing instructions, programs, code sets, or instruction sets stored in memory 820, and invoking data stored in memory 820. Alternatively, the processor 810 may be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field-Programmable gate array (FPGA), programmable logic array (Programmable Logic Array, PLA). The processor 810 may integrate one or a combination of several of a central processing unit (Central Processing Unit, CPU), an image processor (Graphics Processing Unit, GPU), a Neural network processor (Neural-network Processing Unit, NPU), and baseband chips, etc. The CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for rendering and drawing the content required to be displayed by the touch display screen; the NPU is used to implement artificial intelligence (Artificial Intelligence, AI) functionality; the baseband chip is used for processing wireless communication. It will be appreciated that the baseband chip may not be integrated into the processor 810 and may be implemented by a single chip.
The Memory 820 may include a random access Memory (Random Access Memory, RAM) or a Read-Only Memory (ROM). Optionally, the memory 820 includes a non-transitory computer readable medium (non-transitory computer-readable storage medium). Memory 820 may be used to store instructions, programs, code, sets of codes, or sets of instructions. The memory 820 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing the above respective method embodiments, etc.; the storage data area may store data created from the use of the computing device, and the like.
In addition, those skilled in the art will appreciate that the structure of the computing device shown in the above-described figures is not limiting of the computing device, and that the computing device may include more or fewer components than shown, or may combine certain components, or a different arrangement of components. For example, the computing device further includes a display screen, a camera component, a microphone, a speaker, a radio frequency circuit, an input unit, a sensor (such as an acceleration sensor, an angular velocity sensor, a light sensor, etc.), an audio circuit, a WiFi module, a power supply, a bluetooth module, etc., which are not described herein.
Embodiments of the present application also provide a computer readable storage medium storing at least one instruction for execution by a processor to implement the method of wafer sorting as described in the various embodiments above.
Embodiments of the present application also provide a computer program product comprising computer instructions stored in a computer-readable storage medium; the processor of the computing device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions to cause the computing device to perform the method of wafer sorting described in the above embodiments.
Those skilled in the art will appreciate that in one or more of the examples described above, the functions described in the embodiments of the present application may be implemented in hardware, software, firmware, or any combination thereof. When implemented in software, these functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a general purpose or special purpose computer.
It should be noted that: the technical schemes described in the embodiments of the present invention may be arbitrarily combined without any collision.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method of wafer sorting, the method comprising:
determining a first wafer batch and a second wafer batch to be sorted according to process component data, a first evaluation index and a second evaluation index generated in the wafer production process; wherein the first evaluation index is better than the second evaluation index, the quality index characterized by the process component data of the first wafer lot is better than the first evaluation index, and the quality index characterized by the process component data of the second wafer lot is worse than the second evaluation index;
selecting a first wafer from the first wafer batch according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and recording;
Stopping the simulation exchange when the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are better than the second evaluation index;
and performing actual sorting exchange on the first wafer batch and the second wafer batch according to the simulated exchange record.
2. The method of claim 1, wherein selecting a first wafer from the first lot of wafers according to the quality index characterized by the process component data, and performing a simulated swap with a second wafer from the second lot of wafers according to the quality index characterized by the process component data, comprises:
determining a wafer with the highest quality index represented by the process component data in the first wafer batch as the first wafer;
determining a wafer with the lowest quality index represented by the process component data in the second wafer batch as the second wafer;
after the first wafer is sorted to the second wafer lot and the second wafer is sorted to the first wafer lot, a first wafer lot after simulation exchange and a second wafer lot after simulation exchange are formed.
3. The method according to claim 2, wherein the method further comprises:
when the quality index represented by the process component data of the second wafer lot after simulation exchange is inferior to the second evaluation index, the wafer with the highest quality index represented by the process component data in the first wafer lot after simulation exchange is simulated and exchanged to the second wafer lot after simulation exchange, and the wafer with the lowest quality index represented by the process component data in the second wafer lot after simulation exchange is simulated and exchanged to the first wafer lot after simulation exchange, so as to form a first wafer lot after simulation exchange again and a second wafer lot after simulation exchange again, and recording;
and until all the wafers are subjected to simulation exchange, or the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are better than the second evaluation index.
4. The method of claim 1, wherein the process component data for the first wafer lot comprises: the average value of the process component data of all wafers in the first wafer batch; process component data for the second wafer lot, comprising: and the average value of the process component data of all wafers in the second wafer batch.
5. The method of claim 1, wherein the process component data is at least two process component data having a priority order; correspondingly, the selecting a first wafer from the first wafer lot according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer lot according to the quality index represented by the process component data, and recording, including:
determining a wafer with the highest quality index represented by the process component data with the highest priority in the first wafer batch as the first wafer;
determining a wafer with the lowest quality index represented by the process component data with the highest priority in the second wafer batch as the second wafer;
after the first wafer is sorted to the second wafer batch and the second wafer is sorted to the first wafer batch, a first wafer batch after simulation exchange and a second wafer batch after simulation exchange are formed;
when the quality indexes represented by the process component data with the highest priority of the first wafer batch after simulation exchange and the second wafer batch after simulation exchange are better than the second evaluation index, executing a simulation exchange process for the process component data with the highest priority until the simulation exchange process is completed for all the process component data;
When the quality index represented by the process component data with the highest priority in the first wafer lot after simulation exchange and/or the second wafer lot after simulation exchange is inferior to the second evaluation index, sorting the wafer with the highest quality index represented by the process component data with the highest priority in the first wafer lot after simulation exchange into the second wafer lot after simulation exchange, sorting the wafer with the lowest quality index represented by the process component data with the highest priority in the second wafer lot after simulation exchange into the first wafer lot after simulation exchange, forming the first wafer lot after simulation exchange again and the second wafer lot after simulation exchange again, and recording;
and executing the simulation exchange process for the process component data with the highest priority level until the simulation exchange process is completed for all the process component data when the quality indexes represented by the process component data with the highest priority level of the first wafer batch after the re-simulation exchange and the second wafer batch after the re-simulation exchange are better than the second evaluation index.
6. The method of any of claims 1 to 5, wherein determining the first wafer lot and the second wafer lot to be sorted based on the process component data generated during wafer production, the first evaluation index, and the second evaluation index comprises:
determining a wafer batch with the quality index represented by the process component data being better than the first evaluation index as a first wafer batch and determining a wafer batch with the quality index represented by the process component data being worse than the second evaluation index as a second wafer batch from all wafer batches obtained by wafer production;
arranging the first wafer batch according to the quality index from good to bad, and arranging the second wafer batch according to the quality index from bad to good;
correspondingly, selecting a first wafer from the first wafer batch according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and recording, wherein the method comprises the following steps:
and selecting a first wafer from the first wafer batch with the optimal quality index according to the quality index represented by the process component data, performing simulation exchange with a second wafer selected from the second wafer batch with the worst quality index according to the quality index represented by the process component data, and recording.
7. The method of claim 6, wherein the method further comprises:
and after the simulation exchange of all the wafers is completed, the quality index represented by the process component data of the first wafer batch after the simulation exchange and/or the second wafer batch after the simulation exchange is inferior to the second evaluation index, selecting the first wafer from the first wafer batches with the suboptimal quality index according to the quality index represented by the process component data, performing the simulation exchange with the second wafer selected from the second wafer batches with the suboptimal quality index according to the quality index represented by the process component data, and recording until the simulation exchange of all the first wafer batches and all the second wafer batches is completed.
8. An apparatus for wafer sorting, the apparatus comprising: a determining section, an analog sorting section, a stopping section, and an actual sorting section; wherein,,
the determining part is configured to determine a first wafer batch and a second wafer batch to be sorted according to process component data, a first evaluation index and a second evaluation index generated in the wafer production process; wherein the first evaluation index is better than the second evaluation index, the quality index characterized by the process component data of the first wafer lot is better than the first evaluation index, and the quality index characterized by the process component data of the second wafer lot is worse than the second evaluation index;
The simulation sorting part is configured to select a first wafer from the first wafer batch according to the quality index represented by the process component data, perform simulation exchange with a second wafer selected from the second wafer batch according to the quality index represented by the process component data, and record the simulation exchange;
the stopping part is configured to stop the simulation exchange when the quality indexes represented by the process component data of the first wafer batch after the simulation exchange and the second wafer batch after the simulation exchange are both better than the second evaluation index;
the actual sort section is configured to perform an actual sort swap on the first wafer lot and the second wafer lot according to an analog swap record.
9. A computing device, the computing device comprising: a processor and a memory; the processor is configured to execute instructions stored in the memory to implement the method of wafer sorting as claimed in any one of claims 1 to 7.
10. A computer storage medium storing at least one instruction for execution by a processor to implement the method of wafer sorting of any one of claims 1 to 7.
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