CN116984985B - Copper-clad plate edge polishing device - Google Patents
Copper-clad plate edge polishing device Download PDFInfo
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- CN116984985B CN116984985B CN202311243874.5A CN202311243874A CN116984985B CN 116984985 B CN116984985 B CN 116984985B CN 202311243874 A CN202311243874 A CN 202311243874A CN 116984985 B CN116984985 B CN 116984985B
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- Prior art keywords
- conveying table
- plate
- copper
- conveying
- mounting plate
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- 238000005498 polishing Methods 0.000 title claims abstract description 52
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 230000000903 blocking effect Effects 0.000 claims 2
- 238000011065 in-situ storage Methods 0.000 claims 1
- 238000007494 plate polishing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/02—Bench grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The application provides a copper-clad plate edge polishing device, which belongs to the technical field of copper-clad plate polishing equipment and comprises a first conveying table, a second conveying table and a polishing mechanism, wherein a first pushing plate is arranged on the top surface of the first conveying table, and a second pushing plate is arranged on the top surface of the second conveying table; the polishing mechanism comprises a first polishing device, a second polishing device and a third polishing device, the third polishing device is positioned in an included angle between the first conveying table and the second conveying table and is arranged at the top of a bidirectional sliding block, and the bidirectional sliding block is provided with a first mounting plate and a second mounting plate which are mutually perpendicular in a penetrating way; the first mounting plate is vertically arranged below the first conveying table, the first sander is arranged at the top of the front end of the first mounting plate, and the first sander is arranged at the outer side of the first conveying table; the second mounting panel is located the below of second transport platform perpendicularly, and the top of second mounting panel front end is located to the second sander, and the second sander is located the outside of second transport platform. The device has higher polishing efficiency.
Description
Technical Field
The application belongs to the technical field of copper-clad plate polishing equipment, and particularly relates to a copper-clad plate edge polishing device.
Background
The copper-clad plate is a main material for manufacturing a printed circuit board and mainly comprises a pressed substrate, a prepreg and a copper foil. The copper-clad plate is usually prefabricated into a raw material plate with larger area, then is cut into small plates with proper sizes according to actual demands, and the edges of the small copper-clad plate are required to be polished after cutting is completed so as to eliminate flash, prevent an operator from being scratched in the process of pattern electroplating, and facilitate forming electroplating process edges at the edges of the copper-clad plate. The traditional polishing device can only polish four sides of the copper-clad plate in sequence, and the polishing efficiency is low.
Disclosure of Invention
In order to solve the defects in the prior art, the application provides the copper-clad plate edge polishing device which has higher polishing efficiency.
In order to achieve the object of the application, the following scheme is adopted:
a copper-clad plate edge polishing device, comprising: the first conveying table and the second conveying table are connected end to end and are arranged in a vertical structure, the top surfaces of the first conveying table and the second conveying table are positioned on the same plane and are used for conveying the copper-clad plate, the top surface of the first conveying table is provided with a first pushing plate which is arranged in a moving mode along the conveying direction of the first conveying table, and the top surface of the second conveying table is provided with a second pushing plate which is arranged in a moving mode along the conveying direction of the second conveying table;
the polishing device comprises a first polishing device, a second polishing device and a third polishing device, wherein the third polishing device is positioned in an included angle between the first conveying table and the second conveying table, is arranged at the top of a bidirectional sliding block, protrudes out of the top surfaces of the first conveying table and the second conveying table, is penetrated with a first mounting plate and a second mounting plate which are mutually perpendicular, and is arranged in a moving way along the length direction of the first mounting plate and the second mounting plate;
the first mounting plate is vertically arranged below the first conveying table and parallel to the conveying direction of the second conveying table, the first grinder is arranged at the top of the front end of the first mounting plate and protrudes out of the top surface of the first conveying table, the first grinder is arranged at the outer side of the first conveying table, and a connecting line between the first grinder and the third grinder is perpendicular to the first conveying table;
the second mounting panel is located the below of second transport platform perpendicularly, and is on a parallel with the direction of transport of first transport platform, and the top of second mounting panel front end is located to the second sander, and the protrusion is in the top surface of second transport platform, and the second sander is located the outside of second transport platform, and the line perpendicular to second transport platform between second sander and the third sander.
The application has the beneficial effects that: the three grinders are adopted to form two groups of grinding mechanisms, so that the grinding work of four sides of the copper-clad plate can be rapidly completed, and the grinding efficiency is high; and the device overall structure is simple, and the polishing process need not to carry out repeated gesture adjustment to the copper-clad plate, further shortens the interrupt time of polishing, can further improve polishing efficiency.
Drawings
The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the application.
Fig. 1 shows a schematic overall structure of a preferred embodiment of the present application.
Fig. 2 shows a schematic structural diagram of the present application when a first push plate pushes a copper-clad plate to a predetermined position of a second conveying table.
Fig. 3 shows a schematic structural diagram of the present application when copper clad laminate is disposed on top of each of the first conveying table and the second conveying table in the embodiment of the present application.
Figure 4 shows a preferred mounting configuration view of the connection block, conduit and rodless cylinder of an embodiment of the present application.
Fig. 5 shows a schematic view of the bottom structure of a preferred embodiment of the application.
Fig. 6 shows a partial enlarged view at a in fig. 5.
Fig. 7 shows a partial enlarged view at B in fig. 5.
Fig. 8 shows a partial enlarged view at C in fig. 5.
Fig. 9 is a schematic diagram showing a connection structure of a connection block and a rectangular frame according to an embodiment of the present application.
Fig. 10 shows an exploded view of the structure of a catheter according to an embodiment of the present application.
Fig. 11 shows a partial cross-sectional view of a catheter according to an embodiment of the application.
The marks in the figure: the first conveying table 1, the first push plate 11, the second conveying table 2, the second push plate 21, the proximity switch 22, the first grinder 31, the second grinder 32, the third grinder 33, the bidirectional slider 34, the first mounting plate 341, the second mounting plate 342, the infrared sensor 35, the rodless cylinder 4, the slider 41, the guide rod 42, the retaining plate 43, the guide pipe 5, the ejector rod 51, the triangle 511, the telescopic spring 52, the strip plate 53, the chute 531, the connecting block 6, the semicircle orifice 601, the stopper 61, the rectangular frame 611, the bottom orifice 612, the cylindrical spring 62, the pressure spring 63, the slide rail 7, and the telescopic device 71.
Description of the embodiments
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of the embodiments of the present application will be given with reference to the accompanying drawings, but the described embodiments of the present application are some, but not all embodiments of the present application.
As shown in fig. 1 to 5, a copper-clad plate edge polishing device includes: the first conveying table 1 and the second conveying table 2 are connected end to end and are arranged in a vertical structure, and a polishing mechanism.
Specifically, the top surfaces of the first conveying table 1 and the second conveying table 2 are in the same plane, and are all used for conveying the copper-clad plate, namely, the rear end of the first conveying table 1 is connected with the front end of the second conveying table 2, and the conveying directions of the first conveying table 1 and the second conveying table 2 are mutually perpendicular, so that the friction force is reduced, the abrasion is reduced, rollers can be paved at the tops of the first conveying table 1 and the second conveying table 2, the top surface of the first conveying table 1 is provided with a first push plate 11 which is arranged in a moving manner along the conveying direction of the first push plate 11, the top surface of the second conveying table 2 is provided with a second push plate 21 which is arranged in a moving manner along the conveying direction of the second push plate 21, and the first push plate 11 and the second push plate 21 can be driven by an air cylinder, a linear motor or a motor screw rod.
Specifically, as shown in fig. 1 to 5, the polishing mechanism includes a first polishing device 31, a second polishing device 32 and a third polishing device 33, where the third polishing device 33 is located in an included angle between the first conveying table 1 and the second conveying table 2, and is located at the top of a bidirectional sliding block 34, and protrudes out of the top surfaces of the first conveying table 1 and the second conveying table 2, the bidirectional sliding block 34 is penetrated with a first mounting plate 341 and a second mounting plate 342 that are perpendicular to each other, the bidirectional sliding block 34 is movably disposed along the length directions of the first mounting plate 341 and the second mounting plate 342, specifically, the bidirectional sliding block 34 can be controlled to move along the length directions of the first mounting plate 341 and the second mounting plate 342 by a linear motor or an air cylinder, or a driving air cylinder or a linear motor can be respectively disposed corresponding to the first mounting plate 341 and the second mounting plate 342, and the bidirectional sliding block 34 is driven to move by controlling the movement modes of the first mounting plate 341 and the second mounting plate 342; because the first mounting plate 341 and the second mounting plate 342 are vertically arranged on the bidirectional slider 34 in a penetrating manner, when the bidirectional slider 34 moves along the first mounting plate 341, the second mounting plate 342 moves together therewith; as the bi-directional slider 34 moves along the second mounting plate 342, the first mounting plate 341 will also move therewith.
Specifically, as shown in fig. 1 to 3, the first mounting plate 341 is vertically disposed below the first conveying table 1 and parallel to the conveying direction of the second conveying table 2, the first grinder 31 is disposed on the top of the front end of the first mounting plate 341 and protrudes out of the top surface of the first conveying table 1, the first grinder 31 is disposed on the outer side of the first conveying table 1, and a connection line between the first grinder 31 and the third grinder 33 is perpendicular to the first conveying table 1, where the two perpendicular points are perpendicular to the conveying direction of the first conveying table 1.
Specifically, as shown in fig. 1 to 3, the second mounting plate 342 is vertically disposed below the second conveying table 2 and parallel to the conveying direction of the first conveying table 1, the second sander 32 is disposed on top of the front end of the second mounting plate 342 and protrudes out of the top surface of the second conveying table 2, the second sander 32 is disposed outside the second conveying table 2, and a connection line between the second sander 32 and the third sander 33 is perpendicular to the second conveying table 2, where the two perpendicular points are perpendicular to the conveying direction of the second conveying table 2.
Specifically, the polishing rotation direction of the third sander 33 is opposite to the rotation directions of the first sander 31 and the second sander 32, and the rotation of the opposite sides of the first sander 31 and the third sander 33 faces the front end of the first conveying table 1, and the rotation of the opposite sides of the second sander 32 and the third sander 33 faces the front end of the second conveying table 2.
The polishing process mainly comprises the following steps:
the third sander 33 is adjusted for the first time, the bidirectional sliding block 34 is moved along the first mounting plate 341, so that the distance between the third sander 33 and the first sander 31 is adjusted, two opposite sides of the copper-clad plate can be polished by the third sander 33 and the first sander 31 at the same time, in order to facilitate expression, the two polished sides of the third sander 33 and the first sander 31 are positioned on the long side of the copper-clad plate, the other two sides of the copper-clad plate are wide sides, and the length direction of the copper-clad plate is consistent with the length direction of the first conveying table 1 during discharging. On the other hand, because the second mounting plate 342 is disposed through the bidirectional slider 34, the second mounting plate 342 is perpendicular to the first mounting plate 341, and the second sander 32 is disposed on the second mounting plate 342, when the bidirectional slider 34 moves along the first mounting plate 341, the second sander 32 will also move along the first mounting plate 341, so that the connection between the second sander 32 and the third sander 33 is perpendicular to the second conveying table 2, and the moving direction of the second sander 32 is parallel to the conveying direction of the second conveying table 2, so that the second sander 32 and the third sander 33 polish two opposite sides of the copper clad laminate simultaneously, and the offset of the copper clad laminate caused by the front-back position difference during polishing is avoided.
The long side polishing can be started after the position of the third polisher 33 is adjusted, the first push plate 11 is utilized to gradually push the copper-clad plate from the front end to the rear end of the first conveying table 1, and in the process, the third polisher 33 and the first polisher 31 polish two long sides of the copper-clad plate simultaneously; the first push plate 11 can be stopped moving until the copper-clad plate is pushed to the preset position of the front end of the second conveying table 2, and in the long-side polishing process of the copper-clad plate, the second push plate 21 can be utilized to limit and guide the polished long side of the copper-clad plate to prevent the copper-clad plate from shifting, and in order to further prevent the copper-clad plate from shifting, side baffles can be arranged on the outer sides of the top surfaces of the first conveying table 1 and the second conveying table 2 and used for guiding and limiting the copper-clad plate.
The third sander 33 is adjusted for the second time, the bidirectional slider 34 is moved along the second mounting plate 342 to adjust the distance between the third sander 33 and the second sander 32, so that the third sander 33 and the second sander 32 can polish two wide sides of the copper-clad plate at the same time, and when the position of the third sander 33 is adjusted for the second time, three possible states exist in the position of the third sander 33: the first position state is that the distance between the third sander 33 and the second sander 32 is exactly the same as the distance between the broadsides of the copper-clad plates, so that the broadsides can be directly sanded without adjustment; the second position state is that the third sander 33 is located in the long side range of the copper-clad plate, at this time, the bidirectional sliding block 34 needs to be moved towards the front end of the first conveying table 1, in this process, the third sander 33 will polish the rest of the long side, the same as when the third sander 33 is adjusted for the first time, when the bidirectional sliding block 34 is moved along the second mounting plate 342, the first sander 31 will also move along the conveying direction of the first conveying table 1 along with the first mounting plate 341, so that the effect that the connecting line between the first sander 31 and the third sander 33 is perpendicular to the first conveying table 1 can be achieved; the third position state is that the third sander 33 is located outside the copper-clad plate, and the long side of the copper-clad plate is polished completely, and only the distance between the second sander 32 and the third sander 33 is required to be reduced to a proper size.
The broadside is polished, the second push plate 21 is utilized to push the copper-clad plate to the rear end of the second conveying table 2, so that the broadside of the copper-clad plate is gradually contacted with the second polisher 32 and the third polisher 33, polishing processing of the broadside of the copper-clad plate is realized, and in the moving process of the copper-clad plate, the first push plate 11 always keeps the limiting effect on the broadside of the copper-clad plate, so that the copper-clad plate is prevented from shifting in the moving process.
Utilize this device to adopt above-mentioned polishing to polish to the copper-clad plate, can accomplish the work of polishing of copper-clad plate four sides fast, have higher efficiency of polishing to device overall structure is simple, and the process of polishing need not to carry out the gesture adjustment that is repeated to the copper-clad plate, further shortens the interrupt time of polishing, thereby improves the efficiency of polishing.
Preferably, as shown in fig. 1 to 3, an infrared sensor 35 is disposed above the bidirectional slider 34, the emitted light beam is perpendicular to the first conveying table 1, a feedback disc is disposed on the end surface of the first push plate 11 facing one side of the bidirectional slider 34, the infrared sensor 35 detects the position of the feedback disc by moving the bidirectional slider 34 along the second mounting plate 342, when the infrared sensor 35 detects the feedback disc, the polishing surface of the third sander 33 is located on the lateral extension surface of the first push plate 11, that is, the position of the third sander 33 is just used for polishing the edge where the copper-clad plate contacts with the first push plate 11, and the purpose of automatically adjusting the position of the third sander 33 can be achieved by using the disposed infrared sensor 35 and the feedback disc, and meanwhile, the purpose of synchronously moving the first sander 31 is also achieved.
Further preferably, as shown in fig. 1 and fig. 2, a proximity switch 22 is disposed on the outer side of the second conveying table 2 corresponding to the extending track of the first conveying table 1, and is used for detecting a copper-clad plate entering the front end of the second conveying table 2, and when the proximity switch 22 detects the copper-clad plate, the first push plate 11 stops pushing the copper-clad plate, so that a reference can be provided for adjusting the starting time of the third sander 33 for the second time, and further automation is realized.
Preferably, as shown in fig. 4 and 5, the bottoms of the first conveying table 1 and the second conveying table 2 are respectively provided with a rodless cylinder 4, the bottoms of the first push plate 11 and the second push plate 21 are respectively arranged on a slide block 41 of the rodless cylinder 4, and the first push plate 11 and the second push plate 21 can be pushed by the rodless cylinder 4 to be automatically pushed out and reset.
Preferably, as shown in fig. 4 to 8, a conduit 5 with a length consistent with the respective conveying direction is arranged below each of the first conveying table 1 and the second conveying table 2; wherein, the front end of the conduit 5 below the first conveying table 1 is arranged on the first mounting plate 341, and the rear end of the conduit 5 faces the rear end of the first conveying table 1; the front end of the duct 5 below the second transfer table 2 is provided on the second mounting plate 342, and the rear end of the duct 5 faces the rear end of the second transfer table 2. More specifically, the connecting blocks 6 are slidably arranged on the guide pipes 5, the connecting blocks 6 are respectively provided with a stop block 61 which is arranged along the top surfaces of the first conveying table 1 and the second conveying table 2 vertically, the upper sections of the stop blocks 61 vertically pass through the corresponding first conveying table 1 or second conveying table 2 upwards, namely the stop block 61 below the first conveying table 1 vertically passes through the first conveying table 1, the stop block 61 below the second conveying table 2 vertically passes through the second conveying table 2 upwards, when the connecting blocks 6 are positioned at the front ends of the guide pipes 5, the connecting blocks 6 are in the original positions, and the connecting blocks 6 are automatically returned to the original positions through a cylindrical spring 62, namely the cylindrical spring 62 is in a natural state or in the natural state restoring trend, the connecting blocks 6 can be returned to the original positions, and the connecting blocks 6 can be moved from the original positions to the rear ends of the guide pipes 5, so that the cylindrical spring 62 is prolonged or compressed, and reaction force is generated for realizing the clamping effect, when the corresponding connecting block 6 of the first conveying table 1 is in the original position, the stop block 61 and the first push plate 11 are pressed at two opposite ends of the copper-clad plate together, the first push plate 11 clamps and fixes the copper-clad plate by utilizing the stop block 61 and the first push plate 11 together in the process of pushing the copper-clad plate to polish the rear end of the first conveying table 1, the stop block 61 can also move towards the rear end of the guide tube 5 together with the copper-clad plate under the pushing of the first push plate 11, after the stop block 61 moves to a preset position, the copper-clad plate can be loosened by downwards moving the stop block 61, the lifting of the stop block 61 can be controlled by an air cylinder or a motor, and the specific loosening time is controlled, as a preferable scheme of the application, the stop block 61 can be loosened after two thirds of the long side of the copper-clad plate is polished, at this time, most of the area of the copper-clad plate enters the second conveying table 2, and limit guiding can be performed by means of a side baffle arranged on the top surface of the second conveying table 2; when the connecting block 6 corresponding to the second conveying table 2 is in the original position, the stop block 61 and the second push plate 21 are pressed at the other opposite ends of the copper-clad plate together, and the stop block 61 and the second push plate are also used for improving the stability of the copper-clad plate in the polishing process. The specific descending time of the stop block 61 can be adaptively set according to the position of the side baffle plate and the length and width dimensions of the copper-clad plate; in order to meet the movement of the stop block 61, the first push plate 11 and the second push plate 21, the first conveying table 1 and the second conveying table 2 should be provided with avoiding holes along the length direction so as to facilitate the stop block 61 to pass through and facilitate the connection parts of the first push plate 11 and the second push plate 21 and the sliding block 41 to pass through.
Preferably, as shown in fig. 4 to 9, the upper section of the connection block 6 is sleeved on the guide rod 42 of the rodless cylinder 4 through a round hole, the lower end of the connection block 6 is provided with a semicircular hole 601, the lower end of the stop block 61 is provided with a rectangular frame 611, the rectangular frame 611 is sleeved outside the connection block 6, the connection block 6 is arranged in the rectangular frame 611 in a moving way along the up-down direction, the bottom of the rectangular frame 611 is provided with a bottom hole 612 matched with the semicircular hole 601, the radius of the bottom hole 612 is identical to that of the semicircular hole 601, a pressure spring 63 is arranged between the top of the connection block 6 and the top of the rectangular frame 611, when the pressure spring 63 is in a natural state, the semicircular hole 601 is combined with the bottom hole 612 and sleeved outside the guide pipe 5, at this time, the top of the stop block 61 protrudes out of the top surface of the first conveying table 1 or the second conveying table 2, and the installation stability of the connection block 6 and the stop block 61 can be effectively improved, and the consistency of the movement direction of the connection block 6 and the slide block 41 is kept, so that the connection block 6 and the corresponding first push plate 11 or the second push plate 21 are moved along the same direction, and the structure of the connection block 6 and the stop block 61 is more compact and the structure is convenient to convey the first conveying table 1 and the second table 2.
Further preferably, as shown in fig. 10 and 11, a push rod 51 is penetrated in the conduit 5, a plurality of triangular plates 511 are protruded from the bottom surface of the push rod 51 along the length direction, the inclined surface of the triangular plates 511 faces the rear end of the conduit 5, a telescopic spring 52 is arranged between the tail end of the push rod 51 and the rear end of the conduit 5, a strip-shaped hole is formed in the bottom of the conduit 5 along the length direction, a strip-shaped plate 53 is arranged in the strip-shaped hole, the strip-shaped plate 53 is arranged in a moving manner along the normal direction of the conduit 5, a chute 531 is formed in the strip-shaped plate 53 corresponding to the triangular plates 511, when the triangular plates 511 are attached to the chute 531, the outer wall of the strip-shaped plate 53 is engaged with the outer wall of the conduit 5 to form a complete cylindrical structure, therefore, when the push rod 51 moves towards the rear end, as shown in fig. 6, the triangular plates 511 are pushed to move downwards the conduit 5 through the inclined surface and the chute 531, thereby pushing the rectangular frame 611 to move downwards so as to enable the stop block 61 to move downwards, the front end of the ejector rod 51 protrudes out of the front end of the guide pipe 5, a baffle plate 43 is arranged at the bottom of the sliding block 41, when the sliding block 41 moves to a preset position, the baffle plate 43 pushes the ejector rod 51 to move towards the rear end so as to drive the stop block 61 to move downwards, the length dimension of the ejector rod 51 protruding out of the guide pipe 5 can be used for accurately controlling the downward movement position of the stop block 61, so that the stop block can be automatically moved downwards when the first push plate 11 or the second push plate 21 moves to the preset position, the copper-clad plate is released, the device is more automatic, and the cylindrical spring 62 is sleeved outside the guide rod 42 and is not sleeved outside the guide pipe 5, and the aim is to avoid influencing the downward movement of the rectangular frame 611.
Preferably, as shown in fig. 1 and 3, the bottoms of the first conveying table 1 and the second conveying table 2 are respectively provided with a sliding rail 7, which is respectively used for slidably arranging a first mounting plate 341 and a second mounting plate 342, and the end parts of the sliding rails 7 are respectively provided with a telescopic device 71, which are respectively used for pushing the first mounting plate 341 and the second mounting plate 342, so that the purpose of automatically adjusting the bidirectional sliding block 34 is achieved, and then the purpose of automatically adjusting the third sander 33 is met.
The foregoing description of the preferred embodiments of the application is merely exemplary and is not intended to be exhaustive or limiting of the application. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the application.
Claims (9)
1. Copper-clad plate limit portion grinding device, its characterized in that includes:
the copper-clad plate conveying device comprises a first conveying table (1) and a second conveying table (2) which are connected end to end and are arranged in a vertical structure, wherein the top surfaces of the first conveying table (1) and the second conveying table (2) are positioned on the same plane and are used for conveying a copper-clad plate, a first push plate (11) which is movably arranged along the conveying direction of the first conveying table (1) is arranged on the top surface of the first conveying table, and a second push plate (21) which is movably arranged along the conveying direction of the second conveying table (2) is arranged on the top surface of the second conveying table;
the polishing mechanism comprises a first polisher (31), a second polisher (32) and a third polisher (33), wherein the third polisher (33) is positioned in an included angle between the first conveying table (1) and the second conveying table (2), is arranged at the top of a bidirectional sliding block (34), protrudes out of the top surfaces of the first conveying table (1) and the second conveying table (2), is penetrated by the bidirectional sliding block (34) and is provided with a first mounting plate (341) and a second mounting plate (342) which are perpendicular to each other, and the bidirectional sliding block (34) is arranged in a moving way along the length direction of the first mounting plate (341) and the second mounting plate (342);
the first mounting plate (341) is vertically arranged below the first conveying table (1) and parallel to the conveying direction of the second conveying table (2), the first grinder (31) is arranged at the top of the front end of the first mounting plate (341) and protrudes out of the top surface of the first conveying table (1), the first grinder (31) is arranged on the outer side of the first conveying table (1), and a connecting line between the first grinder (31) and the third grinder (33) is perpendicular to the first conveying table (1);
the second mounting plate (342) is vertically arranged below the second conveying table (2) and is parallel to the conveying direction of the first conveying table (1), the second sander (32) is arranged at the top of the front end of the second mounting plate (342) and protrudes out of the top surface of the second conveying table (2), the second sander (32) is arranged on the outer side of the second conveying table (2), and a connecting line between the second sander (32) and the third sander (33) is perpendicular to the second conveying table (2).
2. The copper-clad plate edge polishing device according to claim 1, wherein an infrared sensor (35) is arranged above the bidirectional sliding block (34), the emitted light beam is perpendicular to the first conveying table (1), a feedback disc is arranged on the end face of the first push plate (11) facing one side of the bidirectional sliding block (34), the infrared sensor (35) is used for detecting the position of the feedback disc when the bidirectional sliding block (34) moves along the second mounting plate (342), and when the infrared sensor (35) detects the feedback disc, the polishing surface of the third polisher (33) is located on the lateral extension surface of the first push plate (11).
3. The copper-clad plate edge polishing device according to claim 2, wherein a proximity switch (22) is arranged on an extension track of the second conveying table (2) corresponding to the first conveying table (1) and used for detecting a copper-clad plate entering the front end of the second conveying table (2), and when the proximity switch (22) detects the copper-clad plate, the first push plate (11) stops pushing the copper-clad plate.
4. The copper-clad plate edge polishing device according to claim 1, wherein the bottoms of the first conveying table (1) and the second conveying table (2) are respectively provided with a rodless cylinder (4), and the bottoms of the first pushing plate (11) and the second pushing plate (21) are respectively arranged on a sliding block (41) of the rodless cylinder (4).
5. The copper-clad plate edge polishing device according to claim 4, wherein the lower parts of the first conveying table (1) and the second conveying table (2) are respectively provided with a guide pipe (5) with the length consistent with the respective conveying direction; the front end of the guide pipe (5) below the first conveying table (1) is arranged on the first mounting plate (341), and the rear end of the guide pipe (5) faces the rear end of the first conveying table (1); the front end of the guide pipe (5) below the second conveying table (2) is arranged on the second mounting plate (342), and the rear end of the guide pipe (5) faces the rear end of the second conveying table (2);
the guide pipe (5) is provided with a connecting block (6) in a sliding manner, the connecting block (6) is provided with a stop block (61) which is arranged along the top surfaces of the first conveying table (1) and the second conveying table (2) in a moving manner, the upper section of the stop block (61) vertically upwards passes through the corresponding first conveying table (1) or second conveying table (2), the connecting block (6) is positioned at the front end of the guide pipe (5) when being positioned at the original position, the connecting block (6) is in-situ reset through a cylindrical spring (62) connected with/arranged on the connecting block, and when the connecting block (6) corresponding to the first conveying table (1) is positioned at the original position, the stop block (61) and the first push plate (11) are jointly pressed at two opposite ends of the copper-clad plate; when the connecting block (6) corresponding to the second conveying table (2) is in the original position, the stop block (61) and the second push plate (21) are pressed together at the other two opposite ends of the copper-clad plate.
6. The copper-clad plate edge polishing device according to claim 5, wherein the upper section of the connecting block (6) is sleeved on the guide rod (42) of the rodless cylinder (4) through a round hole, the lower end of the connecting block (6) is provided with a semicircular hole (601), the lower end of the stop block (61) is provided with a rectangular frame (611), the rectangular frame (611) is sleeved outside the connecting block (6), the connecting block (6) is arranged in the rectangular frame (611) in a moving manner along the direction vertical to the top surfaces of the first conveying table (1) and the second conveying table (2), the bottom of the rectangular frame (611) is provided with a bottom hole (612) matched with the semicircular hole (601), the radius of the bottom hole (612) is identical to that of the semicircular hole (601), a pressure spring (63) is arranged between the top of the connecting block (6) and the top of the rectangular frame (611), when the pressure spring (63) is in a natural state, the semicircular hole (601) is combined with the bottom hole (612) and sleeved outside the guide tube (5), and at this time, the top of the stop block (61) protrudes out of the first conveying table (1) or the second conveying table (2).
7. The copper-clad plate edge polishing device according to claim 6, wherein a push rod (51) is arranged in the guide pipe (5) in a penetrating manner, a plurality of protruding triangular plates (511) are arranged on the bottom surface of the push rod (51) along the length direction, the inclined surfaces of the triangular plates (511) face the rear end of the guide pipe (5), an extension spring (52) is arranged between the tail end of the push rod (51) and the rear end of the guide pipe (5), a strip-shaped hole is formed in the bottom of the guide pipe (5) along the length direction, a strip-shaped plate (53) is arranged in the strip-shaped hole, the strip-shaped plate (53) is arranged in the normal direction of the guide pipe (5) in a moving manner, inclined grooves (531) are formed in the strip-shaped plate (53) corresponding to the triangular plates (511), when the triangular plates (511) are attached to the inclined grooves (531), a complete cylindrical structure is formed, the front end of the push rod (51) protrudes out of the front end of the guide pipe (5), and a blocking plate (43) is arranged at the bottom of the sliding block (41), and when the sliding block (41) moves to a preset position, the blocking plate (43) moves to the rear end of the push rod (51).
8. The copper-clad plate edge polishing device according to claim 7, wherein the cylindrical spring (62) is sleeved outside the guide rod (42).
9. The polishing device for the copper-clad plate edge according to claim 1, wherein the bottoms of the first conveying table (1) and the second conveying table (2) are respectively provided with a sliding rail (7) for slidably arranging the first mounting plate (341) and the second mounting plate (342), and the end parts of the sliding rails (7) are respectively provided with a telescopic device (71) for pushing the first mounting plate (341) and the second mounting plate (342).
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| CN202311243874.5A CN116984985B (en) | 2023-09-26 | 2023-09-26 | Copper-clad plate edge polishing device |
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| CN202311243874.5A CN116984985B (en) | 2023-09-26 | 2023-09-26 | Copper-clad plate edge polishing device |
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| CN116984985B true CN116984985B (en) | 2023-12-05 |
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| CN116984985A (en) | 2023-11-03 |
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