CN116970372A - Composite phase change material and preparation method and application thereof - Google Patents
Composite phase change material and preparation method and application thereof Download PDFInfo
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- CN116970372A CN116970372A CN202310391709.8A CN202310391709A CN116970372A CN 116970372 A CN116970372 A CN 116970372A CN 202310391709 A CN202310391709 A CN 202310391709A CN 116970372 A CN116970372 A CN 116970372A
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- phase change
- change material
- heat
- polydopamine
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- 239000002131 composite material Substances 0.000 title claims abstract description 68
- 239000012782 phase change material Substances 0.000 title claims abstract description 58
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 70
- 239000004917 carbon fiber Substances 0.000 claims abstract description 70
- 239000002088 nanocapsule Substances 0.000 claims abstract description 60
- 230000008859 change Effects 0.000 claims abstract description 45
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 41
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 26
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 26
- 229920001690 polydopamine Polymers 0.000 claims abstract description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 14
- 239000001257 hydrogen Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 65
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 43
- 239000012188 paraffin wax Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 229920002545 silicone oil Polymers 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000945 filler Substances 0.000 abstract description 23
- 239000011159 matrix material Substances 0.000 abstract description 16
- 238000005338 heat storage Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 2
- 125000000524 functional group Chemical group 0.000 abstract description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract description 2
- 238000003756 stirring Methods 0.000 description 48
- 239000012071 phase Substances 0.000 description 30
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 18
- 238000001035 drying Methods 0.000 description 16
- 238000005406 washing Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- CTENFNNZBMHDDG-UHFFFAOYSA-N Dopamine hydrochloride Chemical compound Cl.NCCC1=CC=C(O)C(O)=C1 CTENFNNZBMHDDG-UHFFFAOYSA-N 0.000 description 15
- 229960001149 dopamine hydrochloride Drugs 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 13
- 239000008367 deionised water Substances 0.000 description 13
- 229910021641 deionized water Inorganic materials 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 11
- 239000011259 mixed solution Substances 0.000 description 11
- 239000007764 o/w emulsion Substances 0.000 description 11
- 235000012239 silicon dioxide Nutrition 0.000 description 11
- 238000001914 filtration Methods 0.000 description 10
- 239000007983 Tris buffer Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical group OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 9
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 8
- 238000012696 Interfacial polycondensation Methods 0.000 description 8
- 235000011114 ammonium hydroxide Nutrition 0.000 description 8
- 239000003921 oil Substances 0.000 description 8
- 238000005303 weighing Methods 0.000 description 8
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical group [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 7
- 239000007853 buffer solution Substances 0.000 description 7
- 239000003208 petroleum Substances 0.000 description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 description 7
- 238000010992 reflux Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 230000002431 foraging effect Effects 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000002775 capsule Substances 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- VYFYYTLLBUKUHU-UHFFFAOYSA-N dopamine Chemical compound NCCC1=CC=C(O)C(O)=C1 VYFYYTLLBUKUHU-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 241000237536 Mytilus edulis Species 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical group OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 229960003638 dopamine Drugs 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 235000020638 mussel Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
- C09K5/066—Cooling mixtures; De-icing compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a composite phase change material, a preparation method and application thereof, and belongs to the technical field of composite material heat storage. According to the invention, the carbon fibers and the phase change nanocapsules attached by polydopamine are both heat-conducting fillers, so that the problems that in the prior art, the heat-conducting fillers and a matrix (polydimethylsiloxane prepolymer) are directly mixed to cause low interface bonding strength and the heat-conducting property cannot catch up with an expected value are solved, and particularly under the condition of high load of the fillers, the problems further cause the deterioration of the mechanical property of the composite material, the high hardness is shown, good contact with a rigid interface is not facilitated, the carbon fibers attached by polydopamine have large roughness, contain hydroxyl and amino functional groups, can form a physical interlocking effect and a hydrogen bond with the matrix, effectively improve the interface compatibility between the heat-conducting fillers and the matrix, avoid holes between the fillers and the matrix, reduce phonon scattering, thereby improving the heat-conducting property and reducing the interface thermal resistance between the heat-conducting fillers and the matrix.
Description
Technical Field
The invention relates to the technical field of composite material heat storage, in particular to a composite phase change material and a preparation method and application thereof.
Background
The phase change material is a substance which absorbs or releases a large amount of latent heat in the phase transition process, and is a working medium of the latent heat storage technology. The phase change material is introduced into the thermal interface material, so that a novel thermal interface material with heat conduction and heat storage functions, namely the phase change thermal interface material, is hopeful to be obtained. There are two main approaches to introducing phase change materials into thermal interface materials: one is to directly mix a solid-liquid phase change material into a thermal interface material, improve interface wettability of the phase change thermal interface material by means of a liquid phase change material obtained by causing solid-liquid phase change to occur by temperature rise, and even reduce thermal resistance; however, given the risk of flow and leakage of liquid phase change materials, this approach typically introduces less phase change material content. The other strategy is that the solid-liquid phase change material is packaged to prepare a phase change capsule, and then the phase change capsule is introduced into the thermal interface material to prepare the phase change thermal interface material. Only the phase change capsules are introduced into the polymer base material, and the obtained phase change thermal interface material has the defect of low thermal conductivity. The high-heat-conductivity filler is introduced to improve the heat-conducting property of the composite material. However, the surface of the heat conducting filler is smooth and has chemical inertia, so holes appear between the filler and the matrix, phonon scattering is caused, the interface problem affects the heat conducting coefficient and cannot reach the expected effect, and the heat conducting filler is difficult to adapt to the requirements of high-efficiency heat management at present. Therefore, it is necessary to surface-treat the heat conductive filler, enhance compatibility between the filler and the matrix, and promote heat conduction. The conventional surface treatments such as oxidation and ultrasonic vibration can reduce the mechanical property and heat conduction property of the filler, and have great defects.
Chinese patent CN107815286a discloses treating the thermally conductive filler with a silane coupling agent to improve compatibility, but the filler modification effect is only reflected in thermal conductivity. For the aspect of hardness, the heat-conducting filler is added to reduce the flexibility of the composite material, which is not beneficial to filling the rigid interface gap; CN114774086a discloses that the inorganic shell nanocapsule can form hydrogen bond with the curing agent of polydimethylsiloxane to enhance compatibility with the matrix, but the heat conductive filler is directly added without treatment, so that the obtained composite material has low heat conductivity coefficient.
Disclosure of Invention
In view of the above, the present invention aims to provide a composite phase change material, and a preparation method and application thereof. The composite phase change material prepared by the invention has low hardness and high heat conduction performance.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a composite phase change material which is prepared from the following raw materials in percentage by mass: 5 to 15 percent of phase change nanocapsules, 20 percent of polydopamine-attached carbon fibers, 59.09 to 68.18 percent of polydimethylsiloxane prepolymers and 5.91 to 6.82 percent of curing agents.
Preferably, the phase-change nanocapsules are paraffin @ silicon dioxide phase-change nanocapsules, wherein the paraffin @ silicon dioxide phase-change nanocapsules take silicon dioxide as shells and paraffin as cores.
Preferably, the mass ratio of paraffin to silicon dioxide in the paraffin@silicon dioxide phase-change nanocapsule is 5-15: 7.5 to 15.
Preferably, the average particle size of the paraffin wax@silicon dioxide phase-change nanocapsules is 800-1000 nm, the phase-change temperature is 66-70 ℃, and the phase-change latent heat is 80-140J/g.
Preferably, the mass ratio of polydopamine to carbon fiber in the polydopamine-attached carbon fiber is 0.02-0.18: 1 to 10.
Preferably, the curing agent comprises hydrogen-containing silicone oil.
Preferably, the phase change enthalpy value of the composite phase change material is 6-21J/g, the thermal conductivity is 1.39-1.66W/(m.K), and the room temperature hardness is 15-35 HA.
The invention also provides a preparation method of the composite phase-change material, which comprises the following steps:
and mixing the phase-change nanocapsules, the polydopamine-attached carbon fibers, the polydimethylsiloxane prepolymer and the curing agent, and then sequentially defoaming and curing to form the composite phase-change material.
Preferably, the temperature of the solidification forming is 25-40 ℃ and the time is 48-72 h.
The invention also provides application of the composite phase-change material prepared by the technical scheme or the preparation method of the technical scheme in chip heat management.
The invention provides a composite phase change material which is prepared from the following raw materials in percentage by mass: 5 to 15 percent of phase change nanocapsules, 20 percent of polydopamine-attached carbon fibers, 59.09 to 68.18 percent of polydimethylsiloxane prepolymers and 5.91 to 6.82 percent of curing agents.
The beneficial effects of the invention are as follows:
according to the invention, the carbon fibers and the phase change nanocapsules attached by polydopamine are both heat-conducting fillers, so that the problems that in the prior art, the heat-conducting fillers and a matrix (polydimethylsiloxane prepolymer) are directly mixed to cause low interface bonding strength and the heat-conducting performance cannot catch up with an expected value are solved, and particularly under the condition of high load of the fillers, the problems further cause the deterioration of the mechanical performance of the composite material, such as high hardness, unfavorable formation of good contact with a rigid interface, and the carbon fibers attached by polydopamine are large in roughness, contain hydroxyl and amino functional groups, can form a physical interlocking effect and a hydrogen bond with the matrix, effectively improve the interface compatibility between the heat-conducting fillers and the matrix, avoid holes between the fillers and the matrix, reduce phonon scattering, thereby improving the heat-conducting performance and reducing the interface thermal resistance between the heat-conducting fillers and the matrix; the carbon fiber attached to the polydopamine is directly used with the phase-change nanocapsule, so that the dispersibility of the heat-conducting filler in the matrix is enhanced, the pores between the heat-conducting filler and the matrix are reduced, and further, the interface thermal resistance between the heat-conducting filler and the matrix is reduced.
The composite phase-change material provided by the invention HAs the phase-change enthalpy value of 6-21J/g, the thermal conductivity of 1.39-1.66W/(m.K) and the room-temperature hardness of 15-35 HA.
The invention also provides a preparation method of the composite phase-change material, which is simple and feasible and is easy to realize industrial production.
The invention also provides application of the composite phase-change material in chip heat management, the low-hardness composite phase-change material can realize good interface contact, can rapidly conduct heat away, and can reduce the heat productivity of a chip by means of heat absorption, so that the temperature curve of the chip is smoother.
Drawings
FIG. 1 is a flow chart of a preparation method of a composite phase change material according to an embodiment of the invention;
FIG. 2 is a graph of the microscopic morphology of the paraffin wax @ silica nanocapsules prepared by the invention;
FIG. 3 is a graph showing the microscopic morphology contrast of the original carbon fiber and polydopamine-attached carbon fiber according to the present invention;
FIG. 4 is a schematic diagram of a chip thermal management application of the low hardness, high thermal conductivity shaped composite phase change material of the present invention;
FIG. 5 is a graph showing the comparison of the chip temperature curves of the composite phase change material of example 3 of the present invention and the comparison example;
FIG. 6 is a graph showing the comparison of temperature profiles of the composite phase change material of example 3 of the present invention and the chips of the comparative example after heating/cooling cycles.
Detailed Description
The invention provides a composite phase change material which is prepared from the following raw materials in percentage by mass: 5 to 15 percent of phase change nanocapsules, 20 percent of polydopamine-attached carbon fibers, 59.09 to 68.18 percent of polydimethylsiloxane prepolymers and 5.91 to 6.82 percent of curing agents.
In the invention, the sum of the mass percentages of the raw materials is 100%.
In the invention, the mass percentage of the phase-change nanocapsules in the raw materials is preferably 8-10%.
In the invention, the phase-change nanocapsules are preferably paraffin@silicon dioxide phase-change nanocapsules, wherein the paraffin@silicon dioxide phase-change nanocapsules take silicon dioxide as a shell and paraffin as a core.
In the invention, the mass ratio of paraffin to silicon dioxide in the paraffin@silicon dioxide phase-change nano-capsule is preferably 5-15: 7.5 to 15.
In the invention, the average particle size of the paraffin wax@silicon dioxide phase-change nanocapsules is preferably 800-1000 nm, the phase-change temperature is preferably 66-70 ℃, and the phase-change latent heat is preferably 80-140J/g.
In the present invention, the paraffin @ silica phase-change nanocapsules are preferably prepared by an interfacial polycondensation method, and more preferably are prepared by a method comprising the steps of:
mixing paraffin and an organosilicon source to obtain liquid;
mixing the liquid, the surfactant, the water and the alcohol solvent to obtain a mixed solution;
emulsifying the mixed solution to obtain an oil-in-water emulsion;
and (3) aging the oil-in-water emulsion after reacting in an inorganic alkaline environment to obtain the paraffin@silicon dioxide phase change nanocapsule.
According to the invention, paraffin and an organosilicon source are mixed to obtain liquid.
In the present invention, the organosilicon source is preferably ethyl orthosilicate.
In the invention, the mass ratio of the paraffin to the organosilicon source is preferably 5-15: 7.5 to 15, more preferably 10:12.5.
in the present invention, the mixing means is preferably oil bath heating, and the temperature of the oil bath heating is preferably 80 ℃.
In the present invention, the liquid is a clear transparent liquid.
After the liquid is obtained, the liquid, the surfactant, the water and the absolute ethyl alcohol are mixed to obtain a mixed solution.
In the present invention, the surfactant is preferably cetyltrimethylammonium bromide.
In the present invention, the alcohol solvent is preferably absolute ethanol.
In the present invention, the ratio of the amount of the surfactant, water and the alcohol solvent is preferably 1g:71mL:35.5mL.
In the invention, the mass ratio of the paraffin to the surfactant is preferably 10:1.
after the mixed solution is obtained, the mixed solution is emulsified to obtain the oil-in-water emulsion.
In the present invention, the emulsification is preferably performed under condensation reflux conditions.
After the oil-in-water emulsion is obtained, the oil-in-water emulsion is aged after being reacted in an inorganic alkaline environment, and the paraffin@silicon dioxide phase change nanocapsule is obtained.
In the present invention, the inorganic alkaline environment is preferably provided by aqueous ammonia, and the mass concentration of the aqueous ammonia is preferably 30%.
In the present invention, the temperature of the reaction is preferably 80℃and the time is preferably 16 hours.
In the present invention, the temperature of the aging is preferably 80℃and the time is preferably 2 hours, and the aging is preferably performed under a stationary condition.
In the reaction and aging processes, the organic silicon source is hydrolyzed and condensed into a silicon dioxide shell which is coated on the surface of the paraffin.
After the aging is finished, the obtained material is preferably washed by petroleum ether, absolute ethyl alcohol and deionized water in sequence and then dried, so that the paraffin wax@silicon dioxide nanocapsule is obtained.
The specific manner of washing and drying is not particularly limited in the present invention, and may be a manner well known to those skilled in the art, and in the specific embodiment of the present invention, the drying is preferably performed in an oven, and the drying temperature is preferably 30 ℃ and the time is preferably 48 hours.
In the invention, the mass ratio of polydopamine to carbon fiber in the polydopamine-attached carbon fiber is preferably 0.02-0.18: 1 to 10.
In the present invention, the polydopamine-attached carbon fiber is preferably produced by a method comprising the steps of:
dissolving dopamine hydrochloride in an alkaline buffer solution, regulating the pH value to be alkaline, adding carbon fibers, and sequentially filtering, washing and vacuum drying to obtain the polydopamine-attached carbon fibers.
In the invention, the mass ratio of the dopamine hydrochloride to the carbon fiber is preferably 0.025-0.2: 1 to 10, more preferably 0.05 to 0.2:1.
in the invention, the dosage ratio of the dopamine hydrochloride to the alkaline buffer solution is preferably 0.025-0.2 g:100 to 400mL, more preferably 0.05g:100mL of the alkaline buffer is preferably a tris buffer.
In the alkaline buffer solution, dopamine is oxidized into quinone, and is crosslinked to form polydopamine particles after undergoing an inverse disproportionation reaction, so that the consumption of dopamine hydrochloride and the alkaline buffer solution is controlled, and further different polydopamine concentrations can be obtained, and the adhesion quantity of polydopamine on the carbon fiber can be regulated and controlled, specifically, if the consumption of dopamine hydrochloride is 0.025g, the consumption of alkaline buffer solution is 100mL, the consumption of carbon fiber is 1g, and the adhesion quantity of polydopamine on the carbon fiber is 2.0wt%; the usage amount of the dopamine hydrochloride is 0.05g, the usage amount of the alkaline buffer solution is 100mL, the usage amount of the carbon fiber is 1g, the adhesion amount of the polydopamine on the carbon fiber is 4.5wt%, the usage amount of the dopamine hydrochloride is 0.1g, the usage amount of the alkaline buffer solution is 100mL, the usage amount of the carbon fiber is 1g, the adhesion amount of the polydopamine on the carbon fiber is 8wt%, the adhesion amount refers to the mass ratio of the polydopamine to the carbon fiber, and pi-pi interaction is formed between the polydopamine and the carbon fiber by utilizing the catechol structure of the polydopamine, so that the polydopamine adheres to the surface of the carbon fiber, the surface of the carbon fiber becomes rough, has polarity, is mild compared with other surface treatment reactions, the conditions are easy to control, the polydopamine is derived from mussel protein, and the raw material is green and friendly.
In the present invention, the pH is preferably 7.5 to 8.5.
The specific modes of filtration, washing and vacuum drying are not particularly limited in the present invention, and may be those well known to those skilled in the art.
In the present invention, the mass percentage of the polydopamine-attached polydimethylsiloxane prepolymer in the raw material is preferably 63.64%.
In the invention, the mass percentage of the curing agent in the raw materials is preferably 6.36%.
In the present invention, the curing agent preferably includes hydrogen-containing silicone oil, more preferably methyl hydrogen-containing silicone oil.
In the invention, the phase change enthalpy value of the composite phase change material is preferably 6-21J/g, the thermal conductivity is preferably 1.39-1.66W/(m.K), and the room temperature hardness is preferably 15-35 HA.
The invention also provides a preparation method of the composite phase-change material, which comprises the following steps:
and mixing the phase-change nanocapsules, the polydopamine-attached carbon fibers, the polydimethylsiloxane prepolymer and the curing agent, and then sequentially defoaming and curing to form the composite phase-change material.
In the present invention, the deaeration is preferably vacuum deaeration at room temperature for 30 to 40 minutes, the temperature is preferably 25 ℃, the pressure is preferably 101kPa, and the deaeration is preferably performed in a mold.
In the present invention, the curing and molding temperature is preferably 25 to 40 ℃ and the time is preferably 48 to 72 hours.
In the present invention, the mixing is preferably planetary stirring, and the procedure of the planetary stirring is preferably: 500rpm pre-stirring for 30s, 500rpm stirring for 5min under 101kPa, 2000rpm stirring for 1min.
After the solidification forming is finished, the composite phase change material is obtained by demolding preferably.
The invention also provides application of the composite phase-change material prepared by the technical scheme or the preparation method of the technical scheme in chip heat management.
According to the invention, the composite phase change material is preferably used as a heat conduction gasket to be placed between the chip and the radiator, and can realize good interface contact, quickly conduct heat away, reduce the heat productivity of the chip by means of heat absorption and enable the temperature curve of the chip to be smoother.
For further explanation of the present invention, the composite phase change material provided by the present invention, and the preparation method and application thereof are described in detail below with reference to examples, but they should not be construed as limiting the scope of the present invention.
The preparation flow chart of the composite phase change material in the embodiment of the invention is shown in figure 1. Firstly, preparing the paraffin wax @ silicon dioxide phase change nanocapsules by adopting an interfacial polycondensation method. Adding carbon fiber and dopamine hydrochloride into a tris buffer solution, stirring, filtering and vacuum drying to obtain polydopamine-attached carbon fiber. Weighing paraffin @ silicon dioxide phase change nanocapsules, polydopamine-attached carbon fibers, polydimethylsiloxane prepolymer and curing agent, and carrying out planetary stirring. And placing the obtained mixture in a mould, defoaming at room temperature, solidifying for forming, and demoulding to obtain the composite phase change material.
Example 1
The composite phase change material is prepared from the following raw materials in percentage by mass: 5% of phase-change nanocapsules, 20% of polydopamine-attached carbon fibers, 68.18% of polydimethylsiloxane prepolymer and 6.82% of curing agent.
The preparation method comprises the following steps:
(1) Preparing paraffin @ silicon dioxide phase-change nanocapsules by adopting an interfacial polycondensation method: 10g of paraffin and 12.5g of tetraethoxysilane are placed in a 250mL three-neck flask, and the oil bath is heated to 80 ℃ to enable the mixed system to become clear and transparent liquid; a mixed solution of 1g of cetyltrimethylammonium bromide, 71mL of deionized water and 35.5mL of absolute ethanol was added and stirred at 350rpm for 4 hours under reflux conditions to form a stable oil-in-water emulsion; adding 1.5mL of ammonia water, keeping the temperature at 80 ℃, stopping stirring for aging after the reaction is completed for 16 hours, so that the tetraethoxysilane is hydrolyzed and condensed into a silicon dioxide shell to be coated on the surface of the paraffin; washing the product for several times by petroleum ether, absolute ethyl alcohol and deionized water, and drying in a baking oven at 30 ℃ for 48 hours to obtain the paraffin@silicon dioxide phase change nanocapsule;
(2) Dissolving 0.05g of dopamine hydrochloride in 100mL of tris buffer solution, adjusting the pH to 8.5, adding 1.0g of carbon fiber, stirring for 12h, filtering, washing, and drying in vacuum for 24h to obtain the polydopamine-attached carbon fiber;
(3) Weighing paraffin wax @ silicon dioxide nanocapsules, polydopamine-attached carbon fibers, polydimethylsiloxane prepolymer and methyl hydrogen-containing silicone oil, and performing planetary stirring, wherein the procedure is set to 500rpm pre-stirring for 30s, 500rpm stirring for 5min and 2000rpm stirring for 1min in a 101kPa state;
(4) Placing the mixture obtained in the step (3) in a polytetrafluoroethylene mould with the thickness of 20 multiplied by 1mm, standing in a vacuum defoaming barrel, and defoaming for 30min at the temperature of 25 ℃ and under the pressure of 101 kPa; taking out, standing for 72h at 40 ℃ for curing and molding, and demolding to obtain the black complete gasket, wherein the phase change enthalpy value is 6.8J/g, the heat conductivity coefficient is 1.57W/(m.K), and the normal-temperature (25 ℃) hardness is 34HA.
FIG. 2 is a microstructure of the paraffin wax @ silica nanocapsules prepared by the invention, and the paraffin wax @ silica nanocapsules have a core-shell structure.
Fig. 3 is a graph showing the microscopic morphology comparison of the original carbon fiber and the polydopamine-attached carbon fiber according to the present invention, and illustrates that the carbon fiber surface of the polydopamine-attached carbon fiber prepared according to the present invention becomes rough.
Example 2
The composite phase change material is prepared from the following raw materials in percentage by mass: 10% of phase-change nanocapsules, 20% of polydopamine-attached carbon fibers, 63.64% of polydimethylsiloxane prepolymer and 6.36% of curing agent.
The preparation method comprises the following steps:
(1) Preparing paraffin @ silicon dioxide phase-change nanocapsules by adopting an interfacial polycondensation method: 10g of paraffin and 12.5g of tetraethoxysilane are placed in a 250mL three-neck flask, and the oil bath is heated to 80 ℃ to enable the mixed system to become clear and transparent liquid; a mixed solution of 1g of cetyltrimethylammonium bromide, 71mL of deionized water and 35.5mL of absolute ethanol was added and stirred at 350rpm for 4 hours under reflux conditions to form a stable oil-in-water emulsion; adding 1.5mL of ammonia water, keeping the temperature at 80 ℃, stopping stirring for aging after the reaction is completed for 16 hours, so that the tetraethoxysilane is hydrolyzed and condensed into a silicon dioxide shell to be coated on the surface of the paraffin; washing the product for several times by petroleum ether, absolute ethyl alcohol and deionized water, and drying in a baking oven at 30 ℃ for 48 hours to obtain the paraffin@silicon dioxide phase change nanocapsule;
(2) Dissolving 0.05g of dopamine hydrochloride in 100mL of tris buffer solution, adjusting the pH to 8.5, adding 1.0g of carbon fiber, stirring for 12h, filtering, washing, and drying in vacuum for 24h to obtain the polydopamine-attached carbon fiber;
(3) Weighing paraffin wax @ silicon dioxide nanocapsules, polydopamine-attached carbon fibers, polydimethylsiloxane prepolymer and methyl hydrogen-containing silicone oil, and performing planetary stirring, wherein the procedure is set to 500rpm pre-stirring for 30s, 500rpm stirring for 5min and 2000rpm stirring for 1min in a 101kPa state;
(4) Placing the mixture obtained in the step (3) in a polytetrafluoroethylene mould with the thickness of 20 multiplied by 1mm, standing in a vacuum defoaming barrel, and defoaming for 30min at the temperature of 25 ℃ and under the pressure of 101 kPa; taking out, standing for 72h at 40 ℃ for curing and molding, and demolding to obtain the black complete gasket, wherein the phase change enthalpy value is 13.1J/g, the heat conductivity coefficient is 1.61W/(m.K), and the hardness at normal temperature (25 ℃) is 17.1HA.
Example 3
The composite phase change material is prepared from the following raw materials in percentage by mass: 15% of phase-change nanocapsules, 20% of polydopamine-attached carbon fibers, 59.09% of polydimethylsiloxane prepolymer and 5.91% of curing agent.
The preparation method comprises the following steps:
(1) Preparing paraffin @ silicon dioxide phase-change nanocapsules by adopting an interfacial polycondensation method: 10g of paraffin and 12.5g of tetraethoxysilane are placed in a 250mL three-neck flask, and the oil bath is heated to 80 ℃ to enable the mixed system to become clear and transparent liquid; a mixed solution of 1g of cetyltrimethylammonium bromide, 71mL of deionized water and 35.5mL of absolute ethanol was added and stirred at 350rpm for 4 hours under reflux conditions to form a stable oil-in-water emulsion; adding 1.5mL of ammonia water, keeping the temperature at 80 ℃, stopping stirring for aging after the reaction is completed for 16 hours, so that the tetraethoxysilane is hydrolyzed and condensed into a silicon dioxide shell to be coated on the surface of the paraffin; washing the product for several times by petroleum ether, absolute ethyl alcohol and deionized water, and drying in a baking oven at 30 ℃ for 48 hours to obtain the paraffin@silicon dioxide phase change nanocapsule;
(2) Dissolving 0.05g of dopamine hydrochloride in 100mL of tris buffer solution, adjusting the pH to 8.5, adding 1.0g of carbon fiber, stirring for 12h, filtering, washing, and drying in vacuum for 24h to obtain the polydopamine-attached carbon fiber;
(3) Weighing paraffin wax @ silicon dioxide nanocapsules, polydopamine-attached carbon fibers, polydimethylsiloxane prepolymer and methyl hydrogen-containing silicone oil, and performing planetary stirring, wherein the procedure is set to 500rpm pre-stirring for 30s, 500rpm stirring for 5min and 2000rpm stirring for 1min in a 101kPa state;
(4) Placing the mixture obtained in the step (3) in a polytetrafluoroethylene mould with the thickness of 20 multiplied by 1mm, standing in a vacuum defoaming barrel, and defoaming for 30min at the temperature of 25 ℃ and under the pressure of 101 kPa; taking out, standing for 72h at 40 ℃ for curing and molding, and demolding to obtain the black complete gasket, wherein the phase change enthalpy value is 20.1J/g, the heat conductivity coefficient is 1.66W/(m.K), and the hardness at normal temperature (25 ℃) is 15.1HA.
Example 4
The composite phase change material is prepared from the following raw materials in percentage by mass: 5% of phase-change nanocapsules, 20% of polydopamine-attached carbon fibers, 68.18% of polydimethylsiloxane prepolymer and 6.82% of curing agent.
The preparation method comprises the following steps:
(1) Preparing paraffin @ silicon dioxide phase-change nanocapsules by adopting an interfacial polycondensation method: 10g of paraffin and 12.5g of tetraethoxysilane are placed in a 250mL three-neck flask, and the oil bath is heated to 80 ℃ to enable the mixed system to become clear and transparent liquid; a mixed solution of 1g of cetyltrimethylammonium bromide, 71mL of deionized water and 35.5mL of absolute ethanol was added and stirred at 350rpm for 4 hours under reflux conditions to form a stable oil-in-water emulsion; adding 1.5mL of ammonia water, keeping the temperature at 80 ℃, stopping stirring for aging after the reaction is completed for 16 hours, so that the tetraethoxysilane is hydrolyzed and condensed into a silicon dioxide shell to be coated on the surface of the paraffin; washing the product for several times by petroleum ether, absolute ethyl alcohol and deionized water, and drying in a baking oven at 30 ℃ for 48 hours to obtain the paraffin@silicon dioxide phase change nanocapsule;
(2) Dissolving 0.025g of dopamine hydrochloride in 100mL of tris buffer solution, adjusting the pH to 8.5, adding 1.0g of carbon fiber, stirring for 12h, filtering, washing, and drying in vacuum for 24h to obtain the polydopamine-attached carbon fiber;
(3) Weighing paraffin wax @ silicon dioxide nanocapsules, polydopamine-attached carbon fibers, polydimethylsiloxane prepolymer and methyl hydrogen-containing silicone oil, and performing planetary stirring, wherein the procedure is set to 500rpm pre-stirring for 30s, 500rpm stirring for 5min and 2000rpm stirring for 1min in a 101kPa state;
(4) Placing the mixture obtained in the step (3) in a polytetrafluoroethylene mould with the thickness of 20 multiplied by 1mm, standing in a vacuum defoaming barrel, and defoaming for 30min at the temperature of 25 ℃ and under the pressure of 101 kPa; taking out, standing for 72h at 40 ℃ for curing and molding, and demolding to obtain the black complete gasket, wherein the phase change enthalpy value is 6.8J/g, the heat conductivity coefficient is 1.47W/(m.K), and the hardness at normal temperature (25 ℃) is 34.5HA.
Example 5
The composite phase change material is prepared from the following raw materials in percentage by mass: 5% of phase-change nanocapsules, 20% of polydopamine-attached carbon fibers, 68.18% of polydimethylsiloxane prepolymer and 6.82% of curing agent.
The preparation method comprises the following steps:
(1) Preparing paraffin @ silicon dioxide phase-change nanocapsules by adopting an interfacial polycondensation method: 10g of paraffin and 12.5g of tetraethoxysilane are placed in a 250mL three-neck flask, and the oil bath is heated to 80 ℃ to enable the mixed system to become clear and transparent liquid; a mixed solution of 1g of cetyltrimethylammonium bromide, 71mL of deionized water and 35.5mL of absolute ethanol was added and stirred at 350rpm for 4 hours under reflux conditions to form a stable oil-in-water emulsion; adding 1.5mL of ammonia water, keeping the temperature at 80 ℃, stopping stirring for aging after the reaction is completed for 16 hours, so that the tetraethoxysilane is hydrolyzed and condensed into a silicon dioxide shell to be coated on the surface of the paraffin; washing the product for several times by petroleum ether, absolute ethyl alcohol and deionized water, and drying in a baking oven at 30 ℃ for 48 hours to obtain the paraffin@silicon dioxide phase change nanocapsule;
(2) Dissolving 0.1g of dopamine hydrochloride in 100mL of tris buffer solution, adjusting the pH to 8.5, adding 1.0g of carbon fiber, stirring for 12h, filtering, washing, and drying in vacuum for 24h to obtain the polydopamine-attached carbon fiber;
(3) Weighing paraffin wax @ silicon dioxide nanocapsules, polydopamine-attached carbon fibers, polydimethylsiloxane prepolymer and methyl hydrogen-containing silicone oil, and performing planetary stirring, wherein the procedure is set to 500rpm pre-stirring for 30s, 500rpm stirring for 5min and 2000rpm stirring for 1min in a 101kPa state;
(4) Placing the mixture obtained in the step (3) in a polytetrafluoroethylene mould with the thickness of 20 multiplied by 1mm, standing in a vacuum defoaming barrel, and defoaming for 30min at the temperature of 25 ℃ and under the pressure of 101 kPa; taking out, standing for 72h at 40 ℃ for curing and molding, and demolding to obtain the black complete gasket, wherein the phase change enthalpy value is 6.8J/g, the heat conductivity coefficient is 1.39W/(m.K), and the normal-temperature (25 ℃) hardness is 33HA.
Example 6
The composite phase change material is prepared from the following raw materials in percentage by mass: 5% of phase-change nanocapsules, 20% of polydopamine-attached carbon fibers, 68.18% of polydimethylsiloxane prepolymer and 6.82% of curing agent.
The preparation method comprises the following steps:
(1) Preparing paraffin @ silicon dioxide phase-change nanocapsules by adopting an interfacial polycondensation method: 10g of paraffin and 7.5g of tetraethoxysilane are placed in a 250mL three-neck flask, and the oil bath is heated to 80 ℃ to enable the mixed system to become clear and transparent liquid; a mixed solution of 1g of cetyltrimethylammonium bromide, 71mL of deionized water and 35.5mL of absolute ethanol was added and stirred at 350rpm for 4 hours under reflux conditions to form a stable oil-in-water emulsion; adding 1.5mL of ammonia water, keeping the temperature at 80 ℃, stopping stirring for aging after the reaction is completed for 16 hours, so that the tetraethoxysilane is hydrolyzed and condensed into a silicon dioxide shell to be coated on the surface of the paraffin; washing the product for several times by petroleum ether, absolute ethyl alcohol and deionized water, and drying in a baking oven at 30 ℃ for 48 hours to obtain the paraffin@silicon dioxide phase change nanocapsule;
(2) Dissolving 0.05g of dopamine hydrochloride in 100mL of tris buffer solution, adjusting the pH to 8.5, adding 1.0g of carbon fiber, stirring for 12h, filtering, washing, and drying in vacuum for 24h to obtain the polydopamine-attached carbon fiber;
(3) Weighing paraffin wax @ silicon dioxide nanocapsules, polydopamine-attached carbon fibers, polydimethylsiloxane prepolymer and methyl hydrogen-containing silicone oil, and performing planetary stirring, wherein the procedure is set to 500rpm pre-stirring for 30s, 500rpm stirring for 5min and 2000rpm stirring for 1min in a 101kPa state;
(4) Placing the mixture obtained in the step (3) in a polytetrafluoroethylene mould with the thickness of 20 multiplied by 1mm, standing in a vacuum defoaming barrel, and defoaming for 30min at the temperature of 25 ℃ and under the pressure of 101 kPa; taking out, standing for 72h at 40 ℃ for curing and molding, and demolding to obtain the black complete gasket, wherein the phase change enthalpy value is 6.3J/g, the heat conductivity coefficient is 1.48W/(m.K), and the normal-temperature (25 ℃) hardness is 32HA.
Comparative example
The high-heat-conductivity composite material is prepared from the following raw materials in percentage by mass: 20% of polydopamine-attached carbon fibers, 72.73% of polydimethylsiloxane prepolymer and 7.27% of curing agent.
The preparation method comprises the following steps:
(1) Dissolving 0.05g of dopamine hydrochloride in 100mL of tris buffer solution, adjusting the pH to 8.5, adding 1.0g of carbon fiber, stirring for 12h, filtering, washing, and drying in vacuum for 24h to obtain the polydopamine-attached carbon fiber;
(2) Weighing carbon fiber attached to polydopamine, polydimethylsiloxane prepolymer and methyl hydrogen-containing silicone oil, performing planetary stirring, and setting the procedure to 500rpm pre-stirring for 30s, 500rpm stirring for 5min under 101kPa state, and 2000rpm stirring for 1min;
(3) Placing the mixture obtained in the step (2) in a polytetrafluoroethylene mould with the thickness of 20 multiplied by 1mm, standing in a vacuum defoaming barrel, and defoaming for 30min at the temperature of 25 ℃ and under the pressure of 101 kPa; taking out, standing for 72h at 40 ℃ for curing and molding, and demolding to obtain the black complete gasket, wherein the heat conductivity coefficient is 1.55W/(m.K), and the hardness at normal temperature (25 ℃) is 42HA.
For comparison, the composite phase change material obtained in example 3 and the high thermal conductivity composite material obtained in comparative example were subjected to chip thermal management application:
the chip heat sink is shown in fig. 4. The device consists of a ceramic heating plate, a direct-current power supply, a radiator, a fan, a thermocouple, an Agilent data acquisition system and a computer, wherein the ceramic heating plate, the direct-current power supply, the radiator and the fan are arranged on an insulating base, the thermocouple is connected to the lower surface of the heating plate, and the Agilent data acquisition system is connected with the thermocouple. The ceramic heating plate (namely the simulation chip) is placed in the groove of the insulation base, the lead wire of the ceramic heating plate is fixed on the insulation base by adopting an insulation tape, then the composite phase-change material or the high-heat-conductivity composite material with the same area as the simulation chip is placed on the upper surface of the simulation chip, and the radiator and the fan are reloaded above the composite phase-change material or the high-heat-conductivity composite material and are screwed by screws. During testing, the power supply is started, the output power is adjusted, the temperature is stabilized for a period of time at room temperature, the analog chip is heated for 300 seconds with constant 18W power, the power supply is turned off, and meanwhile the temperature change of the analog chip along with time in the whole process is recorded. The low hardness, high thermal conductivity shaped composite phase change material was found to achieve a lower equilibrium temperature than the high thermal conductivity composite, see fig. 5, with a 18.4 ℃ difference between the two.
The chip is continuously affected by the heating/cooling cycle in practical application, so that it is necessary to observe the temperature behavior of the chip when the sample is used for heat dissipation under the pulse behavior. Therefore, in addition to constant power, heating/cooling cycles of the analog chip at pulse power up to 30W were studied. The power supply is turned on, the analog chip is heated for 10s under the power of 30W, then the power supply is turned off, the analog chip is cooled for 60s under the forced convection condition, and the heating/cooling process is repeated. The low hardness, high thermal conductivity shaped composite phase change material achieves a lower temperature peak than the high thermal conductivity composite material, see fig. 6, with a 10.0 ℃ difference between the two.
Table 1 shows comparative data of performance parameters of the composites of the examples and comparative examples. The composite phase change material has lower hardness, higher thermal conductivity and increased heat storage capacity, so that the chip obtains the lowest working temperature under the same power and the same time, and has more excellent heat dissipation performance.
Table 1 results of performance tests of examples and comparative examples
The foregoing is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The composite phase change material is characterized by being prepared from the following raw materials in percentage by mass: 5 to 15 percent of phase change nanocapsules, 20 percent of polydopamine-attached carbon fibers, 59.09 to 68.18 percent of polydimethylsiloxane prepolymers and 5.91 to 6.82 percent of curing agents.
2. The composite phase change material according to claim 1, wherein the phase change nanocapsules are paraffin @ silica phase change nanocapsules, the paraffin @ silica phase change nanocapsules having silica as a shell and paraffin as a core.
3. The composite phase change material according to claim 2, wherein the mass ratio of paraffin to silica in the paraffin @ silica phase change nanocapsule is 5-15: 7.5 to 15.
4. The composite phase change material according to claim 2, wherein the paraffin wax @ silica phase change nanocapsules have an average particle diameter of 800-1000 nm, a phase change temperature of 66-70 ℃ and a latent heat of phase change of 80-140J/g.
5. The composite phase change material according to claim 1, wherein the mass ratio of polydopamine to carbon fiber in the polydopamine-attached carbon fiber is 0.02-0.18: 1 to 10.
6. The composite phase change material of claim 1, wherein the curing agent comprises hydrogen-containing silicone oil.
7. The composite phase change material according to claim 1, wherein the composite phase change material HAs a phase change enthalpy value of 6 to 21J/g, a thermal conductivity of 1.39 to 1.66W/(m-K), and a room temperature hardness of 15 to 35HA.
8. The method for preparing a composite phase change material according to any one of claims 1 to 7, comprising the steps of:
and mixing the phase-change nanocapsules, the polydopamine-attached carbon fibers, the polydimethylsiloxane prepolymer and the curing agent, and then sequentially defoaming and curing to form the composite phase-change material.
9. The method according to claim 8, wherein the curing and molding temperature is 25 to 40 ℃ and the time is 48 to 72 hours.
10. Use of a composite phase change material according to any one of claims 1 to 7 or a composite phase change material prepared by a method of preparation according to claim 8 or 9 in chip thermal management.
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