CN116967340A - Electromagnetic forming device and method for microstructure of metal sheet array - Google Patents
Electromagnetic forming device and method for microstructure of metal sheet array Download PDFInfo
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- CN116967340A CN116967340A CN202310757392.5A CN202310757392A CN116967340A CN 116967340 A CN116967340 A CN 116967340A CN 202310757392 A CN202310757392 A CN 202310757392A CN 116967340 A CN116967340 A CN 116967340A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 14
- 229910000838 Al alloy Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012496 stress study Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D26/00—Shaping without cutting otherwise than using rigid devices or tools or yieldable or resilient pads, i.e. applying fluid pressure or magnetic forces
- B21D26/14—Shaping without cutting otherwise than using rigid devices or tools or yieldable or resilient pads, i.e. applying fluid pressure or magnetic forces applying magnetic forces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
The electromagnetic forming device comprises a forming coil, a current collecting device, an array microstructure die and a pulse power supply, wherein the upper part of the current collecting device is an annular part, the lower part of the current collecting device is provided with a side U-shaped structure in a left-right mode, the forming coil is arranged in the annular part and positioned through a reinforcing device, at least one side of the array microstructure die is provided with array microstructure characteristics, a sheet billet material is arranged on one side of the array microstructure characteristics, and two ends of the sheet billet material are inserted into the side U-shaped structure at the lower part of the current collecting device and are contacted with the current collecting device. When forming, the forming coil is electrified, and strong instantaneous pulse current is induced in the current collecting device by the forming coil, and when the induced current flows through the sheet blank and the metal plate, strong attractive force is generated by the induced current and the formed current is formed. The invention has reasonable structure, good forming effect and high precision, and can solve the problem that the guide frame type uniform pressure coil in the prior art is easy to damage.
Description
Technical Field
The invention belongs to the technical field of metal plastic processing and forming, and relates to an electromagnetic forming device and method for a metal sheet array microstructure.
Background
The thin-wall array microstructure parts are widely applied to the fields of new energy, nuclear energy, chemical industry and the like, and the parts generally require large aspect ratio of the microstructure to better play a role, and require high profile precision to facilitate subsequent assembly. Taking a fuel cell metal bipolar plate as an example, the width of a runner is generally smaller than 1mm, the depth is larger than 0.5mm, and the profile precision deviation is smaller than 1%. The traditional steel die stamping forming is extremely easy to cause excessive thinning cracking at the fillet, and the unloading rebound is large, so that the accuracy of the bipolar plate type surface is low. Therefore, the exploration of a new thin-wall array microstructure part forming process is urgent and has great significance.
The electromagnetic forming method is a high strain rate forming method which utilizes the current-carrying conductor to receive strong Lorentz force in a magnetic field to move at a high speed and form, can effectively improve the forming performance of a metal plate and reduce unloading rebound, and is particularly suitable for forming difficult-to-deform metal plates such as stainless steel, titanium alloy, aluminum alloy and the like. For the electromagnetic forming process of the array microstructure parts, uniformity of magnetic pressure is important.
Through investigation, the conventional "uniform pressure coil and plate stress study during flat electromagnetic forming" published in Huazhong university of science and technology journal of Nature science, volume 39, 2 nd phase, 2011, 2 months introduces a uniform pressure coil which can generate more uniform magnetic pressure and realize high-quality forming of metal sheets. In addition, the Chinese patent publication No. CN 111558646A discloses an electromagnetic manufacturing method and a forming device of mesoscale plates, which adopt a built-in method to realize the generation of uniform magnetic pressure and the electromagnetic forming of the array microstructure parts. However, the uniform pressure coil adopted by the electromagnetic forming method of the metal sheet is a guide frame type coil, mainly comprising a three-dimensional spiral coil and an outer guide frame, and is encapsulated by epoxy resin. However, epoxy resin used for encapsulation is extremely easy to crack under the action of strong impact force during electromagnetic forming, so that the service life of a coil is lower; secondly, the coil is generally processed by wire cutting, and in order to ensure the insulation effect, a large gap exists between each turn of coil, so that the energy density is low, and the forming capability is insufficient; finally, the size of the array microstructure part is severely limited by the coil size, and the machining of the large-sized guide frame type coil is expensive and difficult, so that the area of the thin plate type part produced by the scheme is smaller, and the large-scale commercial requirement is difficult to meet.
Disclosure of Invention
The invention aims to solve the first technical problem of providing the metal sheet array microstructure electromagnetic forming device with reasonable structural design and good forming effect, which can effectively solve the problems that a frame-guiding type uniform pressure coil is easy to damage, the energy density is low and the size of a part is severely limited by the size of the frame-guiding type uniform pressure coil in the prior art.
The second technical problem to be solved by the invention is to provide an electromagnetic forming method for the microstructure of the metal sheet array, which adopts a special electromagnetic forming device for forming, and has the characteristics of convenient operation and good forming effect.
The technical scheme adopted by the invention for solving the first technical problem is as follows: an electromagnetic forming device for a sheet metal array microstructure is characterized in that: the device comprises a forming coil, a current collecting device, an array microstructure die and a pulse power supply for supplying power to the forming coil, wherein the upper part of the current collecting device is an annular part, the lower part of the current collecting device is a side U-shaped structure which is arranged left and right, the forming coil is arranged in the annular part of the current collecting device and is positioned through a reinforcing device, at least one of the upper side and the lower side of the array microstructure die is provided with array microstructure characteristics, a sheet billet is arranged on one side of the array microstructure die which is provided with the array microstructure characteristics, and the left end and the right end of the sheet billet and the left end and the right end of the array microstructure die are respectively inserted into the side U-shaped structure at the lower part of the current collecting device to be contacted with the current collecting device and are pressed and fixed through an external edge pressing device.
As an improvement, the forming coil consists of a wire and a coil framework, the wire is tightly wound on the coil framework in a spiral form, and the pulse power supply is electrically connected with the wire.
Further, the reinforcing device is a circular jacket matched with the annular part of the current collecting device, and is coated outside the annular part of the current collecting device and assembled coaxially with the annular part of the current collecting device and the forming coil.
Further, the lower end opening of the upper annular part of the current collecting device is downwards extended to two sides and is connected with the rear end of the side U-shaped structure of the lower part, the left side and the right side of the array microstructure die are provided with die fixing plates, and the two ends of the die fixing plates and the sheet blank are arranged in the side U-shaped structure and are fixed through the edge pressing device.
Further, the upper side and the lower side of the array microstructure mold are provided with array microstructure characteristics, the sheet blank is arranged on one side of the array microstructure characteristics, the other side of the array microstructure mold is provided with a current carrying plate, two ends of the current carrying plate are contacted with the current collecting device, and an insulating plate is arranged between the current carrying plate and the array microstructure mold.
Still further, the current carrying plate is pure copper, pure aluminum, copper alloy or aluminum alloy.
Further, the upper and lower sides of the array microstructure mold are provided with array microstructure characteristics, and the upper and lower sides of the array microstructure mold are provided with sheet blanks.
Still further, when the sheet metal blank adopts low, high titanium alloy, the stainless steel etc. of intensity of conductivity, the outside of sheet metal blank still is equipped with the drive plate, and the drive plate is pure aluminium, pure copper, aluminum alloy or copper alloy, and the both ends are also inserted in the lower part side U-shaped structure of current collector and are contacted with current collector to the drive plate about, and compress tightly fixedly through the blank holder.
Finally, insulating blocks are arranged between the left end and the right end of the array microstructure die and the die fixing plate.
The invention solves the second technical problem by adopting the technical proposal that: an electromagnetic forming method for a microstructure of a metal sheet array is characterized by comprising the following steps of: the electromagnetic forming device according to claim 9 is used for forming, and the specific steps are as follows:
1) Determining the size and parameters of an array microstructure mould, a current carrying plate and a current collecting device according to the specification requirement of a sheet metal microstructure array to be formed;
2) Manufacturing an array microstructure mould and a current collecting device according to the sizes and parameters of the array microstructure mould, the current carrying plate and the current collecting device obtained in the step 1);
3) Determining whether a driving plate is needed to be used according to the material of the microstructure array of the metal sheet to be formed;
4) Determining discharge parameters according to the material and microstructure characteristics of the microstructure array of the metal sheet to be formed; usually, the discharge capacitance is 20-500 mu F, and the discharge voltage is 5-20 kV;
5) Placing sheet blanks or current-carrying plates to be formed on the upper side and the lower side of an array microstructure die, sleeving side U-shaped structures at the lower part of a current collecting device at the left end and the right end of the array microstructure die, and enabling the current collecting device to be in contact with the sheet blanks or the current-carrying plates;
6) Compacting the plate to be formed by adopting an edge pressing device;
7) Starting a pulse power supply to electrify the forming coil, and starting forming;
8) And after the forming is finished, removing the edge pressing device, and taking out the formed plate.
Compared with the prior art, the invention has the advantages that:
the electromagnetic forming device comprises a pulse power supply, a forming coil, a current collecting device, a reinforcing device, an array microstructure die, a die fixing plate, a material pressing plate and an insulating block, wherein the size of the device is manufactured according to the specification requirement of a metal sheet microstructure array to be formed, the forming coil is utilized to induce strong instantaneous pulse current in the current collector, and when the induced current flows through a sheet blank and a current carrying plate, the two materials generate strong attractive force to form the metal sheet microstructure array. The electromagnetic forming device has reasonable structural design, can effectively solve the problems that the guide frame type uniform pressure coil is easy to damage, the energy density is low and the size of parts is severely limited by the size of the guide frame type uniform pressure coil in the prior art, has good forming effect and high precision, and can meet the large-scale commercial requirements.
Drawings
FIG. 1 is a schematic view of a microstructure electromagnetic forming apparatus of a sheet metal array according to embodiment 1 of the present invention;
FIG. 2 is a schematic diagram of the feature sizes of the microstructures in example 1;
FIG. 3 is a schematic view showing the structure of the lower half of the electromagnetic forming apparatus for a sheet metal array microstructure according to embodiment 2 of the present invention;
FIG. 4 is a schematic view showing the structure of the lower half of the electromagnetic forming apparatus for a sheet metal array microstructure according to embodiment 3 of the present invention;
Detailed Description
The invention is described in further detail below with reference to the embodiments of the drawings.
Example 1
As shown in fig. 1, an electromagnetic forming device for a metal sheet array microstructure comprises a forming coil 2, a current collecting device 1, an array microstructure die 3 and a pulse power supply 4 for supplying power to the forming coil 2, wherein the upper part of the current collecting device 1 is an annular part 11, the lower part of the current collecting device is a side U-shaped structure 12 which is arranged left and right, the forming coil 2 consists of a wire 22 and a coil framework 21, the wire 22 is tightly wound on the coil framework 21 in a spiral mode, and the pulse power supply 4 is electrically connected with the wire 22. The shaped coil 2 is arranged in the annular portion 11 of the current collecting device 1, positioned by the stiffening means 10. The reinforcing device 10 is a circular jacket matched with the annular part 11 of the current collecting device 1, and the reinforcing device 10 is coated outside the annular part 11 of the current collecting device 1 and is coaxially assembled with the annular part 11 and the forming coil 2. The reinforcement means 10 serve to increase the strength of the current collecting means 1 and prevent the current collecting means 1 from being deformed by the lorentz force imparted by the forming coil 2.
At least one of the upper side and the lower side of the array microstructure mold 3 is provided with array microstructure characteristics, the sheet blank 6 is made of aluminum alloy material, the thickness is 0.1mm, and the sheet blank is arranged on one side of the array microstructure mold 3 with the array microstructure characteristics. The upper side of the array microstructure mold 3 of this embodiment has array microstructure features, and the sheet stock 6 is disposed on the upper side of the array microstructure mold 3. The lower side of the array microstructure mold 3 is provided with a current carrying plate 7, and an insulating plate 8 is arranged between the current carrying plate 7 and the array microstructure mold 3. The sheet metal blank 6 and the current-carrying plate 7 are in contact with the current collector 1 at both ends thereof.
The lower end of the upper annular part 11 of the current collecting device 1 is opened, the opening part extends downwards and towards two sides to be connected with the rear end of the side U-shaped structure 12 of the lower part, the left side and the right side of the array microstructure die 3 are provided with die fixing plates 30, and the left end and the right end of the die fixing plates 30, the sheet blanks 6, the current carrying plates 7 and the array microstructure die 3 are respectively inserted into the side U-shaped structure 12 of the lower part of the current collecting device 1 and are pressed and fixed by an external edge pressing device 5.
The current carrying plate 7 is made of pure copper, pure aluminum, copper alloy or aluminum alloy, and the current carrying plate 7 of the embodiment adopts aluminum alloy with the thickness of 1mm; insulating blocks 80 are provided between the left and right ends of the array microstructure mold 3 and the mold fixing plates 30 to prevent induced currents from flowing through the mold.
The electromagnetic forming method of the metal sheet array microstructure adopts the electromagnetic forming device, and a forming coil 2 is utilized to induce strong instantaneous pulse current in a current collecting device 1, and when the induced current flows through a sheet blank 6 and a current carrying plate 7, the induced current generates strong attractive force to form the metal sheet array microstructure, and the electromagnetic forming method specifically comprises the following steps:
1. determining the size and parameters of the array microstructure mould 3 and the current collecting device 1 according to the specification requirements of the sheet metal microstructure array to be formed; the mould microstructure is a semicircular runner array, the width of a single runner is 1mm, the height of the single runner is 0.5mm, and as shown in figure 2, the area of the array is 100mm multiplied by 100mm;
2. manufacturing an array microstructure mold 3 and a current collecting device 1 according to the sizes and parameters of the array microstructure mold 3, the current carrying plate 7 and the current collecting device 1 obtained in the first step;
3. determining whether a driving plate is needed to be used according to the material of the microstructure array of the metal sheet to be formed; the aluminum alloy material is 0.1mm thick, and a driving plate is not needed;
4. determining discharge parameters according to the material and microstructure characteristics of the microstructure array of the metal sheet to be formed; the discharge parameters are determined to be 100 muF of capacitance and 8kV of voltage;
5. placing a sheet blank 6 and a current-carrying plate 7 to be formed on the upper side and the lower side of an array microstructure die 3, sleeving side U-shaped structures 12 at the lower part of a current collecting device 1 at the left end and the right end of the array microstructure die 3, and enabling the current collecting device 1 to be in contact with the sheet blank 6 and the current-carrying plate 7;
6. the plate to be formed is pressed by adopting an edge pressing device 5;
7. energizing the forming coil 2 to start forming;
8. after the forming is finished, the edge pressing device 5 is removed, and the formed plate is taken out.
Compared with the traditional guide frame type electromagnetic forming method, the forming device and the forming method have higher energy density, can realize the forming of the metal sheet array microstructure under lower voltage, have larger size of the formed sheet array microstructure, and can successfully realize the business.
Example 2
As shown in fig. 3, an electromagnetic forming apparatus for a microstructure of a metal sheet array is different from that of embodiment 1 in that: the upper and lower sides of the array microstructure mold 3 are provided with array microstructure features, correspondingly, the upper and lower sides of the array microstructure mold 3 are not provided with insulating plates, the upper and lower sides of the array microstructure mold 3 are provided with sheet blanks 6, and other structures are the same as those of the embodiment 1. After the pulse power supply 4 discharges, strong current in the same direction is generated in the thin plate blanks 6 at the two sides, so that strong mutual attraction force is generated between the thin plate blanks, and the thin plate blanks are shaped like a die moving at a high speed.
The sheet blank 6 of the embodiment is made of magnesium alloy, and has the thickness of 0.1mm; the number of the die microstructures and the array area in this example were the same as those in example 1, and the discharge capacity in this example was 100. Mu.F and the discharge voltage was 9kV. Therefore, the embodiment can realize electromagnetic forming of the micro-structures of the two thin plate microarrays, and greatly improve the forming efficiency.
Example 3
As shown in fig. 3, an electromagnetic forming apparatus for a microstructure of a metal sheet array is different from that of embodiment 2 in that: the outer side of the sheet blank 6 is also provided with a driving plate 9, the driving plate 9 is made of pure aluminum, pure copper, aluminum alloy or copper alloy, and the left and right ends of the driving plate 9 are also inserted into the lower U-shaped structure 12 of the current collecting device 1, contacted with the current collecting device 1 and fixed by an external edge pressing device 5. Other structures are the same as those of embodiment 2.
The sheet blank 6 of the embodiment is made of titanium alloy and has the thickness of 0.1mm; the driving plate 9 is made of aluminum alloy and has a thickness of 0.3mm. Titanium alloys are difficult to form by virtue of only lorentz forces generated by themselves because of their low electrical conductivity and high strength. So the aluminum alloy driving plate 9 with high conductivity and low strength can drive the titanium alloy sheet to be formed at high speed. In addition, the discharge capacitance of this example was 100. Mu.F, and the discharge voltage was 11kV.
Compared with the plate formed by the prior art, the plate formed by the method has better effect and higher precision.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (10)
1. An electromagnetic forming device for a sheet metal array microstructure is characterized in that: the device comprises a forming coil, a current collecting device, an array microstructure die and a pulse power supply for supplying power to the forming coil, wherein the upper part of the current collecting device is an annular part, the lower part of the current collecting device is of a side U-shaped structure which is arranged left and right, the forming coil is arranged in the annular part of the current collecting device and positioned through a reinforcing device, at least one of the upper side and the lower side of the array microstructure die is provided with array microstructure characteristics, a sheet billet is arranged on one side of the array microstructure die which is provided with the array microstructure characteristics, and the left end and the right end of the sheet billet and the left end and the right end of the array microstructure die are respectively inserted into the side U-shaped structure at the lower part of the current collecting device, are contacted with the current collecting device and are pressed and fixed through an external edge pressing device.
2. The electromagnetic forming device according to claim 1, wherein: the forming coil consists of a wire and a coil framework, wherein the wire is tightly wound on the coil framework in a spiral mode, and the pulse power supply is electrically connected with the wire.
3. The electromagnetic forming device according to claim 2, wherein: the reinforcing device is a circular jacket matched with the annular part of the current collecting device, and is coated outside the annular part of the current collecting device and assembled coaxially with the annular part and the forming coil.
4. An electromagnetic forming device according to claim 3, wherein: the lower end opening of the upper annular part of the current collecting device is downwards extended to two sides and is connected with the rear end of the side U-shaped structure of the lower part, the left side and the right side of the array microstructure die are provided with die fixing plates, and the two ends of the die fixing plates and the sheet blank are arranged in the side U-shaped structure and are fixed through the edge pressing device.
5. The electromagnetic forming device according to claim 4, wherein: the upper side and the lower side of the array microstructure mold are provided with array microstructure characteristics, the sheet blank is arranged on one side of the array microstructure characteristics, the other side of the array microstructure mold is provided with a current-carrying plate, two ends of the current-carrying plate are contacted with the current collecting device, and an insulating plate is arranged between the current-carrying plate and the array microstructure mold.
6. The electromagnetic forming device according to claim 5, wherein: the current carrying plate is made of pure copper, pure aluminum, copper alloy or aluminum alloy.
7. The electromagnetic forming device according to claim 4, wherein: the upper side and the lower side of the array microstructure die are provided with array microstructure features, and the upper side and the lower side of the array microstructure die are provided with sheet blanks.
8. The electromagnetic forming device according to claim 7, wherein: when the sheet blank adopts titanium alloy and stainless steel with low conductivity and high strength, the outer side of the sheet blank is also provided with a driving plate which is made of pure aluminum, pure copper, aluminum alloy or copper alloy, and the left end and the right end of the driving plate are also inserted into a U-shaped structure at the lower part of the current collecting device to be in contact with the current collecting device and are pressed and fixed through a side pressing device.
9. Electromagnetic forming device according to any one of claims 4 to 8, characterized in that: insulating blocks are arranged between the left end and the right end of the array microstructure die and the die fixing plate.
10. An electromagnetic forming method for a microstructure of a metal sheet array is characterized by comprising the following steps of: the electromagnetic forming device according to claim 9 is used for forming, and the specific steps are as follows:
1) Determining the size and parameters of an array microstructure mould, a current carrying plate and a current collecting device according to the specification requirement of a sheet metal microstructure array to be formed;
2) Manufacturing an array microstructure mould and a current collecting device according to the sizes and parameters of the array microstructure mould, the current carrying plate and the current collecting device obtained in the step 1);
3) Determining whether a driving plate is needed to be used according to the material of the microstructure array of the metal sheet to be formed;
4) Determining discharge parameters according to the material and microstructure characteristics of the microstructure array of the metal sheet to be formed;
5) Placing sheet blanks or current-carrying plates to be formed on the upper side and the lower side of an array microstructure die, sleeving side U-shaped structures at the lower part of a current collecting device at the left end and the right end of the array microstructure die, and enabling the current collecting device to be in contact with the sheet blanks or the current-carrying plates;
6) Compacting the plate to be formed by adopting an edge pressing device;
7) Starting a pulse power supply to electrify the forming coil, and starting forming;
8) And after the forming is finished, removing the edge pressing device, and taking out the formed plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310757392.5A CN116967340A (en) | 2023-06-25 | 2023-06-25 | Electromagnetic forming device and method for microstructure of metal sheet array |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310757392.5A CN116967340A (en) | 2023-06-25 | 2023-06-25 | Electromagnetic forming device and method for microstructure of metal sheet array |
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| CN116967340A true CN116967340A (en) | 2023-10-31 |
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| CN202310757392.5A Pending CN116967340A (en) | 2023-06-25 | 2023-06-25 | Electromagnetic forming device and method for microstructure of metal sheet array |
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- 2023-06-25 CN CN202310757392.5A patent/CN116967340A/en active Pending
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