CN116959844A - Surface-mounted inductor and manufacturing method thereof - Google Patents

Surface-mounted inductor and manufacturing method thereof Download PDF

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Publication number
CN116959844A
CN116959844A CN202311036803.8A CN202311036803A CN116959844A CN 116959844 A CN116959844 A CN 116959844A CN 202311036803 A CN202311036803 A CN 202311036803A CN 116959844 A CN116959844 A CN 116959844A
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CN
China
Prior art keywords
coil
plate
surface mount
mount inductor
copper wires
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Pending
Application number
CN202311036803.8A
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Chinese (zh)
Inventor
陈洁新
林友祥
谢奕君
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Shantou Xinji Electronic Technology Co ltd
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Shantou Xinji Electronic Technology Co ltd
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Priority to CN202311036803.8A priority Critical patent/CN116959844A/en
Publication of CN116959844A publication Critical patent/CN116959844A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F2027/2857—Coil formed from wound foil conductor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

The application relates to an inductor, in particular to a surface-mounted inductor and a manufacturing method thereof. In the surface mount inductor of the present application, the coil is formed by connecting a plurality of copper wires in parallel, and compared with the coil formed by the conventional copper wire, the coil has not only equal direct current resistance but also reduced alternating current resistance (high frequency resistance), thereby greatly reducing the loss of the whole inductor.

Description

Surface-mounted inductor and manufacturing method thereof
Technical Field
The application relates to an inductor, in particular to a surface-mounted inductor and a manufacturing method thereof.
Background
In DC-DC converters mounted on electric information devices such as Smartphone, notePC, which require miniaturization, inductors molded from a metal magnetic material are required.
These devices have a need for energy conservation, and the installed DC-DC converter requires high efficiency and low loss performance.
Since the DC-DC converter needs to be miniaturized and the SW frequency needs to be increased, the inductor is also required to have a lower loss performance.
The loss of the inductor is roughly classified into iron loss and copper loss, and in order to reduce the loss, it is necessary to reduce both losses.
Regarding the iron loss, there are low-loss materials such as amorphous materials made of magnetic powder materials, and proposals such as reduction in particle size.
In general, referring to fig. 8, in order to reduce copper loss, a thick and thick copper wire 201a is wound into a coil 2a to reduce direct current resistance. However, when operating at high frequencies, current flows only at the surface of the copper wire due to the skin effect of the copper wire, and loss increases at high frequencies (current flows only through the surface of the copper wire at higher frequencies). Thick and thick copper wire can reduce copper loss under direct current, but has no effect in high frequency region.
Disclosure of Invention
The present application is directed to a surface mount inductor and a method for manufacturing the same, which solve the problems set forth in the background art.
In order to achieve the above purpose, the present application provides the following technical solutions:
a surface-mounted inductor comprises a molded body and a coil arranged in the molded body, wherein the initial end and the tail end of the coil leak out of the molded body, a plurality of copper wires are longitudinally and/or transversely overlapped to form an integral wire, and at least two layers of integral wires are wound to form the coil.
The subject matter described above: the end face of the copper wire is one of flat, round and square.
The subject matter described above: the forming body is formed by stacking a first plate and a second plate in a forming die and heating, and a protruding part for coil sleeving is formed on the first plate.
A method of manufacturing a surface mount inductor, comprising the steps of:
s1, winding after integrating a plurality of copper wires to form an air-core coil, wherein the beginning and the tail ends of the coil are respectively led out from the periphery of the coil;
s2, sleeving the coil on the convex part of the first plate, covering the second plate, integrally placing the second plate in a forming die, heating the forming die, pressurizing the angular PIN from above to form, integrating the first plate, the second plate and the coil, enabling the beginning and the tail end of the coil to leak out of the formed body, and polishing the formed body if the coil does not leak out;
and S3, removing the insulating film and connecting with an external electrode to form the surface-mounted inductor when the insulation film is incomplete at the initial and terminal non-leakage parts of the coil.
The subject matter described above: the method for integrating the plurality of copper wires comprises the following steps: and overlapping the copper wires coated by the self-adhesive layers, and then fusing the self-adhesive layers by hot air or a solvent to form an integrated wire.
The subject matter described above: the self-adhesive layer is made of thermoplastic resin.
The subject matter described above: the first plate and the second plate are preformed by adopting packaging materials composed of magnetic powder and resin.
Compared with the prior art, the application has the beneficial effects that: in the surface mount inductor of the present application, the coil is formed by connecting a plurality of copper wires in parallel, and compared with the coil formed by the conventional copper wire, the coil has not only equal direct current resistance but also reduced alternating current resistance (high frequency resistance), thereby greatly reducing the loss of the whole inductor.
Drawings
Fig. 1 is a schematic diagram of a coil structure in embodiment 1 of a surface mount inductor.
Fig. 2 is a schematic structural view of a molded body in a surface mount inductor.
Fig. 3 is a schematic diagram of the structure of the coil in embodiment 2 of the surface mount inductor.
Fig. 4 is a schematic diagram of the structure of the coil in embodiment 3 of the surface mount inductor.
Fig. 5 is a schematic structural diagram of a first board in the surface mount inductor.
Fig. 6 is a schematic structural diagram of a second board in the surface mount inductor.
Fig. 7 is a diagram showing a change in the composition of the integrated line in the surface mount inductor.
Fig. 8 is a schematic diagram of a coil structure in a conventional surface mount inductor.
In the figure:
1-a molded body; 101-a first plate; 1011-lobes; 102-a second plate;
2. 2 a-coil; 201. 201 a-copper wire;
3-self-adhesive layer.
Detailed Description
Various exemplary embodiments, features and aspects of the application will be described in detail below with reference to the drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. Although various aspects of the embodiments are illustrated in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The word "exemplary" is used herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
In addition, numerous specific details are set forth in the following examples in order to provide a better illustration of the application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, well known methods, procedures, and components have not been described in detail so as not to obscure the present application.
The application provides a surface-mounted inductor which can enlarge a built-in coil, improve Isat and Rdc, and facilitate the exposure of the end of the coil and the connection with an external electrode, and a manufacturing method thereof.
Copper wire skin effect:
taking copper wire phi of 1.0mm as an example, the skin effect of copper is the following formula:
at a frequency f=3 MHz, δ=0.038 mm, current flows only 0.038mm of the phi 1.0mm surface,
at higher frequencies, e.g., f=10 MHz, δ=0.021 mm, becomes thinner.
The direct current resistance of the copper wire with phi of 1.0mm is 0.785mm 2 Is 0.115mm at f=3 MHz 2 The resistance (loss) increases by about 6.8 times.
Example 1
Please refer to fig. 1 anddrawing of the figure2, this embodiment proposes a surface mount inductor, which includes a molded body 1 and a coil 2 disposed in the molded body 1, wherein a start end and a tail end of the coil 2 leak out of the molded body 1, and a plurality of flat copper wires 201 are overlapped in a transverse direction to form an integral wire, and at least two layers of the integral wire are wound to form the coil 2.
Referring to fig. 5 and 6, the molded body 1 is formed by stacking a first plate 101 and a second plate 102 in a molding die and heating, and a protruding portion 1011 for sleeving the coil 2 is formed on the first plate 101.
In this embodiment, the plurality of copper wires 201 are connected in parallel, so that the cross-sectional area of the plurality of copper wires 201 is equal to the cross-sectional area of one existing copper wire, so that the direct-current resistance is also equal, and meanwhile, the surface area of the copper wires 201 is increased by transversely overlapping the plurality of copper wires 201, so that the high-frequency resistance (alternating-current resistance) is greatly reduced.
Example 2
Please refer to fig. 2 anddrawing of the figureThe embodiment provides a surface mount inductor, which comprises a molding body 1 and a coil 2 arranged in the molding body 1, wherein the beginning and the end of the coil 2 leak out of the molding body 1, a plurality of flat copper wires 201 are overlapped along the longitudinal direction to form an integral wire, and at least two layers of integral wires are wound to form the coil 2.
Referring to fig. 5 and 6, the molded body 1 is formed by stacking a first plate 101 and a second plate 102 in a molding die and heating, and a protruding portion 1011 for sleeving the coil 2 is formed on the first plate 101.
In this embodiment, the plurality of copper wires 201 are connected in parallel, so that the sectional area of the plurality of copper wires 201 is equal to the sectional area of one existing copper wire, so that the direct current resistance is also equal, and meanwhile, the surface area of the copper wires 201 is increased by longitudinally overlapping the plurality of copper wires 201, so that the high frequency resistance (alternating current resistance) is greatly reduced.
Example 3
Please refer to fig. 2 anddrawing of the figure4, the present embodiment proposes a surface mount inductor, which includes a molding body 1 and a coil 2 disposed in the molding body 1, wherein a start end and an end of the coil 2 leak out of the molding body 1, and a plurality of flat copper wires 201 are overlapped in a longitudinal direction and a transverse direction to form an integral wire, and at least two layers of the integral wire are wound to form the coil 2.
Referring to fig. 5 and 6, the molded body 1 is formed by stacking a first plate 101 and a second plate 102 in a molding die and heating, and a protruding portion 1011 for sleeving the coil 2 is formed on the first plate 101.
In this embodiment, the plurality of copper wires 201 are connected in parallel, so that the cross-sectional area of the plurality of copper wires 201 is equal to the cross-sectional area of one existing copper wire, so that the direct-current resistance is also equal, and meanwhile, the surface area of the copper wires 201 is increased by vertically and horizontally overlapping the plurality of copper wires 201, so that the high-frequency resistance (alternating-current resistance) is greatly reduced.
Example 4
The distinguishing feature from embodiments 1-3 is that the end face shape of the copper wire 201 is circular.
Example 5
The distinguishing feature from embodiments 1-3 is that the end face shape of the copper wire 201 is square.
As described above, in the surface mount inductor according to the present application, the coil 2 is formed by connecting the plurality of copper wires 201 in parallel, and compared with the coil 2 formed by one copper wire 201 in the related art, not only the dc resistance is equal, but also the ac resistance (high frequency resistance) can be reduced, and the loss of the entire inductor can be greatly reduced.
Referring to fig. 1-7, a method for manufacturing a surface mount inductor is provided, which includes the following steps:
s1, overlapping a plurality of copper wires 201 coated by the self-adhesive layers 3, then melting the self-adhesive layers 3 by hot air or a solvent to form an integral wire, and then winding the integral wire to form an air-core coil 2, wherein the beginning and the tail ends of the coil 2 are respectively led out from the periphery of the coil 2;
s2, sleeving the coil 2 on the protruding part 1011 of the first plate 101, covering the second plate 102, and integrally placing the coil in a molding die, wherein the molding die is preferably a quadrangular molding die, heating the molding die, and then pressurizing an angular PIN from above to mold, wherein the first plate 101, the second plate 102 and the coil 2 are integrated, the beginning and the end of the coil 2 leak out of the molded body 1, and polishing the molded body 1 if the coil does not leak out;
s3, removing the insulating film and connecting with an external electrode to form a surface-mounted inductor under the defect that the insulating film is arranged at the initial and terminal non-leakage parts of the coil 2, wherein the method for removing the insulating film comprises the following steps: mechanical stripping or laser (laser) irradiation removal.
The external electrode is formed by thermally curing a resin containing Ag powder or the like after DIP coating (silver paste+ni plating+sn plating) or by performing plating such as copper plating (Cu plating+ni plating+sn plating).
Preferably, the material of the self-adhesive layer 3 is a thermoplastic resin.
Preferably, the first plate 101 and the second plate 102 are preformed by using an encapsulation material composed of magnetic powder and resin.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (7)

1. Surface mount inductor comprising a shaped body (1) and a coil (2) placed in the shaped body (1), wherein the beginning and the end of the coil (2) leak out of the shaped body (1), characterized in that a plurality of copper wires (201) are overlapped in the longitudinal direction and/or the transverse direction to form an integral wire, and at least two layers of the integral wire are wound to form the coil (2).
2. The surface mount inductor as claimed in claim 1, wherein the end face shape of the copper wire (201) is one of a flat shape, a round shape and a square shape.
3. A surface mount inductor according to claim 1, wherein the molded body (1) is formed by stacking a first plate (101) and a second plate (102) in a molding die and heating, and a boss (1011) for fitting the coil (2) is formed on the first plate (101).
4. A method of manufacturing a surface mount inductor as claimed in any one of claims 1 to 3, comprising the steps of:
s1, winding after integrating a plurality of copper wires (201) to form an air-core coil (2), wherein the beginning and the tail ends of the coil (2) are respectively led out from the periphery of the coil (2);
s2, sleeving the coil (2) on the protruding part (1011) of the first plate (101), covering the second plate (102), integrally placing the coil in a forming die, heating the forming die, and then pressing the angular PIN from above to form, wherein the first plate (101), the second plate (102) and the coil (2) are integrated, the beginning and the tail ends of the coil (2) leak out of the formed body (1), and polishing the formed body (1) if the coil does not leak out;
s3, removing the insulating film and connecting with the external electrode to form the surface-mounted inductor when the insulation film is incomplete at the initial and terminal non-leakage parts of the coil (2).
5. The method of manufacturing a surface mount inductor according to claim 4, wherein the method of integrating the plurality of copper wires (201) is: the copper wires (201) coated with the self-adhesive layers (3) are overlapped, and then the self-adhesive layers (3) are melted by hot air or solvent to form an integral wire.
6. A method of manufacturing a surface mount inductor according to claim 5, characterized in that the material of the self-adhesive layer (3) is a thermoplastic resin.
7. The method of manufacturing a surface mount inductor according to claim 4, wherein the first and second plates (101, 102) are preformed using an encapsulating material composed of magnetic powder and resin.
CN202311036803.8A 2023-08-16 2023-08-16 Surface-mounted inductor and manufacturing method thereof Pending CN116959844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311036803.8A CN116959844A (en) 2023-08-16 2023-08-16 Surface-mounted inductor and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311036803.8A CN116959844A (en) 2023-08-16 2023-08-16 Surface-mounted inductor and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN116959844A true CN116959844A (en) 2023-10-27

Family

ID=88449266

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311036803.8A Pending CN116959844A (en) 2023-08-16 2023-08-16 Surface-mounted inductor and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN116959844A (en)

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