CN116944701A

CN116944701A - Cutting device for processing semiconductor chip

Info

Publication number: CN116944701A
Application number: CN202311165322.7A
Authority: CN
Inventors: 陈妙旋; 林雄
Original assignee: Shenzhen Detrui Technology Co ltd
Current assignee: Shenzhen Detrui Technology Co ltd
Priority date: 2023-09-11
Filing date: 2023-09-11
Publication date: 2023-10-27

Abstract

The invention relates to the technical field of chip laser cutting, and discloses a cutting device for processing a semiconductor chip, which comprises a base, wherein a supporting arm is arranged at the upper end of the base, a laser cutting mechanism is arranged at the end part of the supporting arm, a movable laser head is movably arranged in the laser cutting mechanism downwards, a workbench is arranged right below the laser cutting mechanism, an outer die holder is arranged on the workbench, an inner die is arranged in the middle of the outer die holder and is used for placing a wafer, and a plurality of groups of adsorption units are uniformly distributed on the upper end surface of the inner die. According to the cutting device for processing the semiconductor chip, the sucking pump is started, the air in the sealing cavity is sucked by the short ventilation pipe, and the negative pressure state is formed in the sealing cavity, so that the adsorption fixing effect on the wafer is enhanced by matching with the rubber sucker, the adsorption fixing effect is improved, the chip deviation during cutting is avoided, the cutting device is applicable to different working conditions, and a better use prospect is brought.

Description

Cutting device for processing semiconductor chip

Technical Field

The invention relates to the technical field of chip laser cutting, in particular to a cutting device for processing a semiconductor chip.

Background

In the manufacturing process of semiconductor chips, chips are required to be separated from wafers, laser cutting machines are generally used in equipment for processing wafers in the market, the principle of the laser cutting machines is that the laser cutting machines are used for cutting the wafers by moving a platform and adopting a laser fixing processing mode, and high-energy laser beams are used for irradiating the surfaces of the wafers, so that the irradiated areas are partially melted and gasified.

The existing laser cutting machine for cutting the wafer has the following technical problems that a first wafer needs to be fixed on a sucker during cutting, an adsorption groove is designed on the surface of the sucker, and the wafer is adsorbed on the surface of the sucker by generating low-pressure vacuum in the adsorption groove, but the adsorption groove and the wafer are not good in direct contact effect, gaps cannot be reduced, the sealing performance is poor, the adsorption fixing effect of the adsorption method is poor, and the cutting is easy to deviate; the second laser cutting can generate a large amount of heat near the chip, and the silicon is easily oxidized and damaged at high temperature, so that the structure of the chip can be damaged, and the chip is scrapped; and when smoke generated by laser cutting is absorbed by the third existing fan, silicon in the smoke is easily solidified and adsorbed on the inner wall of the air pipe, so that the air pipe can be polluted after a long time, and smoke waste is intercepted and adsorbed by the filter screen, the fan has high temperature and is easy to damage the filter screen, and the service life of the use effect of the filter screen is reduced.

In summary, considering that the existing facilities cannot meet the working and use requirements, we propose a cutting device for processing semiconductor chips.

Disclosure of Invention

The invention mainly aims to provide a cutting device for processing a semiconductor chip, which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:

the utility model provides a cutting device is used in semiconductor chip processing, includes the base, the support arm is installed to the upper end of base, the tip of support arm is provided with laser cutting mechanism, the inside activity downwards of laser cutting mechanism is provided with the removal laser head.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: a workbench is arranged right below the laser cutting mechanism, and an outer die holder is arranged on the workbench.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: and a pressing structure is arranged on one periphery of the inner part of the outer die seat.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: an inner die is arranged in the middle of the outer die holder and used for placing a wafer, and a plurality of groups of adsorption units are uniformly distributed on the upper end face of the inner die.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: cutting flow passages are formed in the periphery of the adsorption unit, and each group of cutting flow passages of the adsorption unit are communicated and serve as cutting paths of the movable laser head.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the structure is held to pressure includes external gear, external tooth, internal tooth, rotation groove, internal gear, shaft, first bearing frame and pressure hold the pole, internal and external sides of external gear evenly is provided with internal tooth and external tooth respectively, the rotation groove has all been seted up to the up and down terminal surface of external gear, external mold seat internal fixation is provided with the stopper of inserting the rotation groove, the inboard evenly distributed of external gear has a plurality of groups internal gear, internal gear and internal tooth mesh mutually, the internal gear cup joints on the shaft, the upper and lower end of shaft is all fixed through the inner wall of first bearing frame and outer die holder, every group one side of internal gear all is provided with presses the pole of holding, the quantity of internal gear and pressure pole of holding is 8-16 groups preferably.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the pressing rod comprises a toothed bar, a toothed bar sliding sleeve, a connecting pressing rod, a guide part and a cam pressing surface, wherein the toothed bar is meshed with the inner gear by the upper position, the toothed bar is movably mounted in the toothed bar sliding sleeve, the toothed bar sliding sleeve is fixed in the outer die holder, the end part of the toothed bar is welded with the connecting pressing rod, the upper end of the connecting pressing rod is obliquely provided with the guide part, the lower end face of the connecting pressing rod is provided with the cam pressing surface acting on a wafer, the pressing space is formed in the position between the outer die holder and the upper end of the inner die, and the connecting pressing rod inwards extends into the pressing space from the position of the toothed bar sliding sleeve.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the outside meshing of external gear is provided with drive gear, drive gear and external tooth mesh mutually, drive gear is located servo motor's output shaft, drive gear and servo motor are all installed in the inside of motor cabinet, motor cabinet and external die seat are connected.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the adsorption unit comprises a carrier table, a sealing cavity is formed in the middle position of the carrier table, a rubber sucker is mounted at the upper end of the sealing cavity, the rubber sucker is adsorbed on a wafer, a short ventilation pipe is arranged at the bottom of the sealing cavity, each group of short ventilation pipes are located on a pipe seat, a plurality of groups of short ventilation pipes are arranged at the lower end of each group of short ventilation pipes and are connected with a porous split joint on an air pump, the air pump is mounted at the bottom of an inner die, and a liquid pressing device is arranged in the sealing cavity.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the liquid pressing device comprises a liquid pressing outer cylinder, connecting plates, column limiting holes, telescopic columns and cylindrical heads, wherein the outer side of the liquid pressing outer cylinder is fixed through a plurality of groups of connecting plates and the inner wall of a sealing cavity, the number of the connecting plates is preferably 2-4 groups, the column limiting holes are formed in the middle position of the upper end of the liquid pressing outer cylinder, the telescopic columns penetrate through the column limiting holes, the cylindrical heads are arranged at the upper ends of the telescopic columns, and the heights of the cylindrical heads are flush with the rubber suction disc.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the liquid pressing device comprises a carrier table, and is characterized by further comprising a piston, springs, a liquid storage inner cavity, liquid pressing holes and liquid guide bent pipes, wherein the piston is arranged at the lower end of the telescopic column, the springs are fixedly arranged between the piston and the inner surface of the upper end of the liquid pressing outer cylinder and are positioned outside the telescopic column, the piston is positioned in the liquid storage inner cavity, electronic fluorinated liquid is stored at the lower position of the liquid storage inner cavity, four groups of liquid pressing holes are symmetrically formed in the periphery of the bottom of the liquid storage inner cavity, four groups of liquid pressing holes are outwards connected with the liquid guide bent pipes, the number of the liquid guide bent pipes is 4, and the liquid guide bent pipes extend upwards in the carrier table and extend into the cutting flow channel.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the liquid storage device is characterized in that a liquid inlet is formed in the inner wall of the liquid storage inner cavity and close to the middle, the liquid inlet is externally connected with a liquid adding pipe, a metering pump is installed at the end part of the liquid adding pipe, a pump seat is arranged on the outer side of the metering pump, a liquid adding box is arranged at the upper end of the pump seat, an opening is formed in the upper end of the liquid adding box, and a sealing cover is hinged to the opening.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the automatic feeding device is characterized in that a suction cover is arranged on the workbench and positioned on one side of the outer die holder, a guide channel is arranged in the suction cover in a downward extending mode, a suction fan is arranged in the guide channel in the workbench in a downward extending mode, one side of the middle of the guide channel is connected with a flow pipe, one end of the flow pipe, far away from the guide channel, is connected with an atomization cavity, one side of the atomization cavity is provided with a water supply tank, the upper end of the water supply tank is provided with a blowing tank, and the blowing tank downwards extends into the atomization cavity through a gas spraying pipe.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: an inner channel is arranged in the guide channel, a drying cylinder is rotatably arranged in the inner channel near the bottom, dry particles are stored in the drying cylinder, adsorption holes are uniformly formed in the cylinder surface of the drying cylinder, shaft parts are welded in the middle positions of the two ends of the drying cylinder, one group of shaft parts are fixed on the inner wall of the guide channel through a second bearing seat, the other group of shaft parts are connected with the output shaft of a constant-speed motor through a shaft coupling, and the constant-speed motor is horizontally arranged on the inner wall of the guide channel.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: and an electromagnetic pressure release valve is arranged on the side surface of the ventilation short pipe.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the bottom of the outer die holder is provided with supporting feet, and the number of the supporting feet is preferably 3-4 groups.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the laser cutting mechanism comprises a laser driver, a focusing lens group, a movable cylinder combination and a coaxial air source.

As a preferable mode of the dicing apparatus for semiconductor chip processing according to the present invention, wherein: the liquid adding box is positioned at the position close to the corner in the carrier table.

The invention provides a cutting device for processing a semiconductor chip through improvement, which has the following remarkable improvements and advantages compared with the prior art:

(1) The structure is held in the design, start servo motor, drive gear rotation, thereby make the external gear rotate follow, thereby drive a plurality of groups of internal gear synchronous rotation, each group rack bar of drive is in opposite directions along the centre of a circle when the internal gear rotates, thereby drive and connect depression bar linear motion, let the cam pressure face of connecting the depression bar lower extreme slowly move to the border department of wafer, a plurality of groups of cam pressure faces produce effort in step, thereby make the even atress of wafer pushed down, avoid artifical suppression pressure inhomogeneous condition, make the wafer suppress in a plurality of groups of rubber sucking disc inboard, both fully laminate, play primary absorbing effect.

(2) By starting the air pump, the air in the sealing cavity is sucked by the air suction pipe, and a negative pressure state is formed in the sealing cavity, so that the adsorption and fixation effect on the wafer is enhanced by matching with the rubber sucker, the adsorption and fixation effect is improved, and the chip deviation during cutting is avoided.

(3) When the wafer is pressed down, cylindrical heads contacted with the wafer are pressed down, so that the telescopic columns and the piston move downwards, the piston is made to extrude electronic fluorinated liquid at the bottom of the liquid storage cavity, the electronic fluorinated liquid is extruded out from four groups of liquid pressing holes and flows upwards along the liquid guide bent pipes, flows out from the pipe orifices of the liquid guide bent pipes and enters the cutting flow passages at the outer sides of the adsorption units, the four groups of liquid guide bent pipes are respectively filled with liquid into the surrounding cutting flow passages, and when the laser head is moved to cut the wafer along the cutting flow passages, the heat generated by cutting can enable the electronic fluorinated liquid in the cutting flow passages to be vaporized, so that the heat generated by laser cutting at the periphery is absorbed, and the cooling effect is achieved.

(4) The smog is absorbed by the atmospheric pressure effort of inhaling the material cover, and then flows downwards in entering interior passageway, simultaneously through opening the pulse valve of jet-propelled pipe, to atomizing intracavity blowout high pressure gas, arouses the atomizing of atomizing intracavity to through the negative pressure effort of guide passageway, make the atomized liquid drop enter into interior passageway along the flow pipe is synchronous, fully mix with smog, and the atomized liquid drop adsorbs the solid silicon in the smog at random, avoid its adhesion in interior passageway department, the atomized liquid drop also plays the effect of cooling.

(5) The atomized mixture then passes through the drying cylinder which is rolling slowly downwards, enters from the adsorption hole, contacts with the dry particles in the drying cylinder, absorbs moisture, achieves the purpose of drying, and part of the smog mixture is attached to the surface of the dry particles along with the moisture, and part of the smog mixture subjected to cooling continuously moves downwards and is fully intercepted and filtered by the filter screen, so that the adsorption and filtration effects are improved.

Drawings

Fig. 1 is a schematic view showing the overall structure of a dicing apparatus for semiconductor chip processing according to the present invention;

FIG. 2 is a schematic view of the structure of an outer die holder of the present invention;

FIG. 3 is a schematic view of a pressing structure according to the present invention;

FIG. 4 is a schematic transmission diagram of an external gear of the present invention;

FIG. 5 is a schematic view of a pressing rod according to the present invention;

FIG. 6 is a schematic view showing the external structure of the adsorption unit of the present invention;

FIG. 7 is a schematic view of the bottom structure of the adsorption unit of the present invention;

FIG. 8 is a schematic view of the bottom structure of the inner mold of the present invention;

FIG. 9 is a schematic view showing the external structure of the liquid pressing device of the present invention;

FIG. 10 is a cross-sectional view of a liquid press of the present invention;

FIG. 11 is a view of the mounting location of the suction structure of the present invention;

fig. 12 is a schematic view showing a specific structure of the drying cylinder according to the present invention.

In the figure: 1. a base; 2. a support arm; 3. a laser cutting mechanism; 4. moving the laser head; 5. a work table; 6. an outer die holder; 8. pressing the holding rod; 81. a toothed bar; 82. a toothed bar sliding sleeve; 83. connecting a compression bar; 84. a guide part; 85. cam pressing surface; 9. a liquid pressing device; 90. a liquid guide elbow; 91. a liquid pressing outer cylinder; 92. a connecting plate; 93. a column limit hole; 94. a telescopic column; 95. cylindrical heads; 96. a piston; 97. a spring; 98. a liquid storage cavity; 99. a liquid pressing hole; 10. an external gear; 11. external teeth; 12. internal teeth; 13. a rotating groove; 14. an internal gear; 15. a wheel axle; 16. a first bearing seat; 17. a drive gear; 18. a servo motor; 19. a motor base; 20. an inner mold; 21. a holding space; 22. an adsorption unit; 23. cutting the flow channel; 24. a carrier stage; 25. sealing the cavity; 26. a rubber suction cup; 27. a short ventilation pipe; 28. a tube seat; 29. a soft catheter; 30. a porous shunt joint; 31. an air extracting pump; 40. a liquid inlet hole; 41. a liquid adding tube; 42. a metering pump; 43. a pump base; 44. a liquid adding box; 45. sealing cover; 50. a suction cover; 51. a material guiding channel; 52. a flow tube; 53. an atomizing chamber; 54. a water supply tank; 55. a blowing tank; 56. a gas lance; 60. an inner channel; 61. a drying cylinder; 62. adsorption holes; 63. a shaft portion; 64. a constant-speed motor; 70. a laser driver; 71. supporting feet; 72. an electromagnetic pressure release valve.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Example 1

As shown in fig. 1 to 10, the embodiment provides a cutting device for processing a semiconductor chip, which comprises a base 1, wherein a supporting arm 2 is installed at the upper end of the base 1, a laser cutting mechanism 3 is arranged at the end part of the supporting arm 2, a movable laser head 4 is movably arranged in the laser cutting mechanism 3 downwards, and a workbench 5 is arranged under the laser cutting mechanism 3.

Further, an outer die holder 6 is mounted on the workbench 5, and a pressing structure is arranged on the periphery of the inner portion of the outer die holder 6, as shown in fig. 1 and 2.

Specifically, the holding structure includes an external gear 10, external teeth 11, internal teeth 12, a rotation groove 13, an internal gear 14, a hub 15, a first bearing housing 16, and a holding rod 8, as shown in fig. 3 and 4.

In this embodiment, the inner teeth 12 and the outer teeth 11 are uniformly disposed on the inner and outer sides of the outer gear 10, the upper and lower end surfaces of the outer gear 10 are provided with rotating grooves 13, limiting blocks inserted into the rotating grooves 13 are fixedly disposed in the outer die holder 6, and the rotating grooves 13 rotate around the upper and lower limiting blocks in a limiting manner.

In this embodiment, a plurality of groups of internal gears 14 are uniformly distributed on the inner side of the external gear 10, the central point of the external gear 10 is used as the center, the internal gears 14 are meshed with the internal gears 12, the internal gears 14 are sleeved on the wheel shafts 15, the upper ends and the lower ends of the wheel shafts 15 are fixed through the first bearing seats 16 and the inner walls of the external mold seats 6, and one side of each group of internal gears 14 is provided with a pressing rod 8, and the central point of the external gear 10 is used as the center.

Specifically, the holding lever 8 includes a rack bar 81, a rack bar sliding sleeve 82, a connecting lever 83, a guide 84, and a cam pressing surface 85, as shown in fig. 5.

In this embodiment, the rack bar 81 is engaged with the internal gear 14 at an upper position, the rack bar 81 is movably mounted in the rack bar sliding sleeve 82, the rack bar sliding sleeve 82 is telescopically moved in the rack bar sliding sleeve 82, the rack bar sliding sleeve 82 is fixed in the outer die holder 6, a connecting compression bar 83 is welded at the end part of the rack bar 81, the connecting compression bar 83 is in an inverted L shape, a guide part 84 is obliquely arranged at the upper end of the connecting compression bar 83, the guide part 84 plays a role of guiding and sliding downwards, a cam pressing surface 85 acting on a wafer is arranged on the lower end surface of the connecting compression bar 83, the cam pressing surface 85 protrudes downwards, the surface is smooth, the protruding amplitude is smaller, and the edge of the wafer is pressed downwards in the moving process.

Wherein, the middle position of outer mold base 6 is provided with interior mold base 20, and the position between outer mold base 6 and the interior mold base 20 upper end has seted up presses and holds the space 21, presses and holds the space 21 and reserves the space for the motion of connecting the depression bar 83, connects the depression bar 83 and inwards stretches into in holding the space 21 from rack bar sliding sleeve 82 position, as shown in fig. 2.

Wherein, the outside meshing of external gear 10 is provided with drive gear 17, and drive gear 17 meshes with external tooth 11, and drive gear 17 is located the output shaft of servo motor 18, and drive gear 17 and servo motor 18 are all installed in the inside of motor cabinet 19, and motor cabinet 19 and external mold seat 6 are connected, as shown in fig. 2 and 3.

Further, the inner mold 20 is used for placing a wafer, a plurality of groups of adsorption units 22 are uniformly distributed on the upper end surface of the inner mold 20, cutting flow passages 23 are formed around the adsorption units 22, the cutting flow passages 23 of each group of adsorption units 22 are communicated, and as a cutting path of the moving laser head 4, a cutting point of the moving laser head 4 is located at the center of each group of cutting flow passages 23, as shown in fig. 2.

Further, the adsorption unit 22 includes a carrier stage 24, as shown in fig. 6.

Specifically, a sealing cavity 25 is provided in the middle position inside the carrier table 24, a rubber suction cup 26 is mounted at the upper end of the sealing cavity 25, the rubber suction cup 26 is adsorbed on the wafer and is adsorbed at the center position of each formed chip, a short ventilation tube 27 is arranged at the bottom of the sealing cavity 25, each group of short ventilation tubes 27 is positioned on the tube seat 28, an electromagnetic pressure release valve 72 is mounted on the side surface of each short ventilation tube 27, and the electromagnetic pressure release valve 72 is opened to release gas inside the sealing cavity 25 conveniently, so that the formed chips are taken out, as shown in fig. 6 and 7.

Specifically, the lower end of each group of short ventilation pipes 27 is provided with a flexible pipe 29, and a plurality of groups of flexible pipes 29 are connected with a porous split joint 30 on an air pump 31, so as to play a role in uniform distribution, and the air pump 31 is arranged at the bottom of the inner die 20, as shown in fig. 8.

Further, a liquid pressing device 9 is provided in the seal chamber 25, as shown in fig. 6.

Specifically, the liquid pressing device 9 includes a liquid pressing outer cylinder 91, a connecting plate 92, a column stopper hole 93, a telescopic column 94, and a cylindrical head 95, as shown in fig. 9 and 10.

In this embodiment, the outside of the cylinder of the liquid-pressing outer cylinder 91 is fixed by a plurality of groups of connecting plates 92 and the inner wall of the sealing cavity 25, a column limiting hole 93 is formed in the middle position of the upper end of the liquid-pressing outer cylinder 91, a sealing ring is arranged around the column limiting hole 93, the column limiting hole 93 is used for the telescopic column 94 to penetrate through, a cylindrical head 95 is mounted at the upper end of the telescopic column 94, and the natural height of the cylindrical head 95 is flush with the rubber sucker 26.

Further, the hydraulic press 9 further includes a piston 96, a spring 97, a liquid storage cavity 98, a hydraulic hole 99 and a liquid guide elbow 90, as shown in fig. 10.

In this embodiment, the piston 96 is mounted at the lower end of the telescopic column 94, a spring 97 is fixedly disposed between the piston 96 and the inner surface of the upper end of the liquid pressing outer cylinder 91 and located outside the telescopic column 94, the spring 97 drives the piston 96 and the telescopic column 94 to reset upwards, the piston 96 is located in the liquid storage cavity 98 and moves up and down in the liquid storage cavity 98, a small amount of electronic fluorinated liquid is stored at the lower position of the liquid storage cavity 98, the boiling point of the electronic fluorinated liquid is low, and vaporization and heat absorption are easy.

In this embodiment, four sets of liquid pressing holes 99 are symmetrically formed around the bottom of the liquid storage cavity 98, and the four sets of liquid pressing holes 99 are all connected with the liquid guiding bent pipe 90 outwards, and the liquid guiding bent pipe 90 extends upwards in the carrier table 24 and extends into the cutting flow channel 23.

Further, a liquid inlet 40 is formed on the inner wall of the liquid storage cavity 98 near the middle, the liquid inlet 40 is located under the piston 96 in a natural state, and the liquid inlet 40 is connected with a liquid adding pipe 41 outwards, as shown in fig. 9 and 10.

The metering pump 42 is installed at the end of the liquid adding pipe 41, the metering pump 42 quantitatively adds electronic fluorinated liquid into the liquid storage cavity 98 through the liquid adding pipe 41, a pump seat 43 is arranged on the outer side of the metering pump 42, a liquid adding box 44 is arranged at the upper end of the pump seat 43, an opening is formed in the upper end of the liquid adding box 44 and used for adding liquid into the liquid adding box 44, a sealing cover 45 is hinged to the opening and plays a role in sealing, and the liquid adding box 44 is located in a position close to a corner in the carrier table 24, as shown in fig. 9.

Further, the bottom of the outer mold base 6 is provided with a supporting leg 71, as shown in fig. 8.

Further, the laser cutting mechanism 3 includes a laser driver 70, a focusing lens group, a moving cylinder combination and a coaxial gas source, using conventional laser cutting techniques.

When the wafer to be cut is put on the inner die 20 in use, the wafer to be cut is horizontally placed along the guide part 84 of the pressing rod 8 (the annular area formed between the pressing rods 8 is just matched with the size of the wafer) so that the wafer can slide along the guide part 84 and just fall to the central position of the inner die 20, the aim of centering and calibrating is achieved, at the moment, the wafer is horizontally placed on a plurality of groups of rubber suckers 26, the two are not attached and adsorbed, the servo motor 18 is started, the driving gear 17 is driven to rotate, so that the external gear 10 is driven to rotate, a plurality of groups of internal gears 14 are driven to synchronously rotate, the toothed bars 81 of each group are driven to move oppositely along the circle center when the internal gears 14 rotate, so that the connecting compression rods 83 are driven to linearly move, the cam compression faces 85 at the lower ends of the connecting compression rods 83 are slowly moved to the edges of the wafer, the cam compression faces 85 synchronously generate acting forces, the wafer is pressed down under uniform stress, the wafer is pressed on the inner sides of a plurality of groups of rubber suckers 26, the two groups of rubber suckers are fully attached to play a role of primary adsorption, at the moment, by starting the air suction pump 31 and sucking the gas in the sealing cavity 25 by utilizing the short ventilation pipe 27, a negative pressure state is formed in the sealing cavity 25, thereby matching with the rubber sucker 26 to strengthen the adsorption fixing function on the wafer, when the wafer is pressed down, the cylindrical head 95 contacted with the wafer is pressed down, the telescopic column 94 and the piston 96 are caused to move downwards, the piston 96 is caused to press the electronic fluorinated liquid at the bottom of the liquid storage cavity 98, the electronic fluorinated liquid is pressed out from four groups of liquid pressing holes 99 and flows upwards along the liquid guide bent pipes 90, flows out from the pipe mouths of the liquid guide bent pipes 90, enters the cutting flow channels 23 at the outer sides of the adsorption units 22, the four groups of liquid guide bent pipes 90 are respectively injected into the surrounding cutting flow channels 23, when the laser head 4 is moved to cut the wafer along the cutting flow channel 23, the heat generated by cutting can vaporize the electronic fluoridation liquid in the cutting flow channel 23, thereby absorbing the heat generated by laser cutting around and achieving the effect of cooling.

Example two

On the basis of implementation one, when the existing fan absorbs smoke generated by laser cutting, silicon in the smoke is easy to solidify and adsorb at the position of an air pipe, so that the air pipe can be polluted after a long time, when smoke waste is intercepted and adsorbed by a filter screen, the smoke waste is provided with high temperature, the filter screen is easy to damage, and the service life of the filter screen is reduced.

Specifically, a material suction cover 50 is arranged on the workbench 5 and positioned on one side of the outer die holder 6, smoke absorbed by the material suction cover 50 contains silicon, silicide and electronic fluorinated liquid, the material suction cover 50 is provided with a material guide channel 51 in a downward extending mode, the section of the material guide channel 51 is in an inverted trapezoid shape, and a material suction fan is arranged in the material guide channel 51 in the downward extending mode and enters the workbench 5, as shown in fig. 11.

In this embodiment, a flow tube 52 is connected to one side of the middle portion of the material guiding channel 51, and an atomization cavity 53 is connected to one end of the flow tube 52 away from the material guiding channel 51, as shown in fig. 11.

In this embodiment, a water supply tank 54 is disposed at one side of the atomizing chamber 53, which plays a role in adding water into the atomizing chamber 53, a blowing tank 55 is disposed at the upper end of the water supply tank 54, which plays a role in supplying air, the blowing tank 55 extends downward into the atomizing chamber 53 through a gas spraying pipe 56, and a pulse valve is installed on the gas spraying pipe 56, as shown in fig. 11.

Further, an inner channel 60 is provided in the material guiding channel 51, and a drying cylinder 61 is rotatably installed in the inner channel 60 near the bottom, as shown in fig. 12.

Specifically, the drying cylinder 61 stores dry particulate matters, which may be porous silica gel particulate matters, the cylinder surface of the drying cylinder 61 is uniformly provided with adsorption holes 62, shaft portions 63 are welded at intermediate positions of two ends of the drying cylinder 61, one group of shaft portions 63 are fixed with the inner wall of the material guide channel 51 through a second bearing seat, the other group of shaft portions 63 are connected with an output shaft of the constant speed motor 64 through a shaft coupling, the constant speed motor 64 drives the drying cylinder 61 to move slowly, and the constant speed motor 64 is horizontally arranged on the inner wall of the material guide channel 51, as shown in fig. 12.

Further, a filter screen is installed between the suction fan and the drying drum 61, using conventional technical means.

In use of the embodiment, after the smoke is absorbed by the air pressure acting force of the suction cover 50, the smoke enters the inner channel 60 to flow downwards, meanwhile, by opening the pulse valve of the air spraying pipe 56, high-pressure air is sprayed into the atomizing cavity 53 to cause water in the atomizing cavity 53 to be atomized, and by the negative pressure acting force of the guide channel 51, atomized liquid drops synchronously enter the inner channel 60 along the flow pipe 52 to be fully mixed with the smoke, and the atomized liquid drops randomly adsorb solid silicon in the smoke, then pass through the drying cylinder 61 which is rolling slowly downwards, enter from the adsorption hole 62 to contact with dry particles in the drying cylinder 61, moisture is absorbed, part of the smoke mixture is attached to the surface of the dry particles, part of the smoke mixture (fully cooled by atomization mixing) continues to move downwards and is fully intercepted and filtered by the filter screen.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a cutting device is used in semiconductor chip processing, includes base (1), its characterized in that: the automatic cutting machine is characterized in that a supporting arm (2) is arranged at the upper end of the base (1), a laser cutting mechanism (3) is arranged at the end part of the supporting arm (2), a movable laser head (4) is movably arranged in the laser cutting mechanism (3) downwards, a workbench (5) is arranged right below the laser cutting mechanism (3), an outer die holder (6) is arranged on the workbench (5), and a pressing structure is arranged on one circle of the inner part of the outer die holder (6);

the middle position of outer mould seat (6) is provided with interior mould (20), interior mould (20) are used for laying the wafer, the up end evenly distributed of interior mould (20) has a plurality of groups adsorption unit (22), cutting runner (23) have been seted up around adsorption unit (22), every group cutting runner (23) of adsorption unit (22) are linked together, are as the cutting route of removal laser head (4).

2. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: the utility model provides a press structure includes external gear (10), external tooth (11), internal tooth (12), rotary groove (13), internal gear (14), shaft (15), first bearing frame (16) and presses holding rod (8), internal and external sides of external gear (10) evenly are provided with internal tooth (12) and external tooth (11) respectively, rotary groove (13) have all been seted up to the up and down terminal surface of external gear (10), external mold seat (6) internal fixation is provided with the stopper of inserting rotary groove (13), the inboard evenly distributed of external gear (10) has a plurality of groups internal gear (14), internal gear (14) and internal tooth (12) mesh, internal gear (14) cup joint on shaft (15), the upper and lower end of shaft (15) is all fixed through the inner wall of first bearing frame (16) and external mold seat (6), and every group internal gear (14) one side all is provided with presses holding rod (8).

3. The dicing apparatus for semiconductor chip processing according to claim 2, wherein: the utility model provides a press and hold pole (8) including ratch (81), ratch slip cap (82), connection depression bar (83), guide part (84) and cam pressure face (85), the position is leaned on last position phase meshing with internal gear (14) ratch (81), ratch (81) movable mounting is in ratch slip cap (82), ratch slip cap (82) are fixed in the inside of die holder (6), the tip welding of ratch (81) has connection depression bar (83), the upper end slope of connection depression bar (83) is provided with guide part (84), the lower terminal surface of connection depression bar (83) is provided with cam pressure face (85) that acts on the wafer, press holding space (21) have been seted up to the position between outer die holder (6) and interior mould (20) upper end, connection depression bar (83) inwards stretch into from ratch slip cap (82) position and hold in space (21).

4. A dicing apparatus for semiconductor chip processing according to claim 3, wherein: the outer side of the outer gear (10) is meshed with a driving gear (17), the driving gear (17) is meshed with an outer gear (11), the driving gear (17) is located on an output shaft of a servo motor (18), the driving gear (17) and the servo motor (18) are mounted inside a motor base (19), and the motor base (19) is connected with an outer die base (6).

5. The dicing apparatus for semiconductor chip processing according to claim 4, wherein: the adsorption unit (22) comprises a carrier table (24), a sealing cavity (25) is formed in the middle position of the carrier table (24), a rubber sucker (26) is installed at the upper end of the sealing cavity (25), the rubber sucker (26) is adsorbed on a wafer, a short ventilation pipe (27) is arranged at the bottom of the sealing cavity (25), each group of short ventilation pipes (27) is located on a pipe seat (28), a soft guide pipe (29) is arranged at the lower end of each group of short ventilation pipes (27), a plurality of groups of soft guide pipes (29) are connected with a porous diverting joint (30) on an air pump (31), the air pump (31) is installed at the bottom of an inner die (20), and a liquid pressing device (9) is arranged in the sealing cavity (25).

6. The dicing apparatus for semiconductor chip processing according to claim 5, wherein: the liquid pressing device is characterized in that the liquid pressing device (9) comprises a liquid pressing outer cylinder (91), a connecting plate (92), a column limiting hole (93), a telescopic column (94) and a cylindrical head (95), wherein the outer side of the liquid pressing outer cylinder (91) is fixed through a plurality of groups of connecting plates (92) and the inner wall of a sealing cavity (25), the column limiting hole (93) is formed in the middle position of the upper end of the liquid pressing outer cylinder (91), the telescopic column (94) is provided to pass through the column limiting hole (93), the cylindrical head (95) is arranged at the upper end of the telescopic column (94), and the height of the cylindrical head (95) is flush with the rubber sucker (26).

7. The dicing apparatus for semiconductor chip processing according to claim 6, wherein: the liquid pressing device is characterized in that the liquid pressing device (9) further comprises a piston (96), a spring (97), a liquid storage cavity (98), liquid pressing holes (99) and a liquid guide bent pipe (90), the piston (96) is arranged at the lower end of the telescopic column (94), the spring (97) is fixedly arranged between the inner surfaces of the upper ends of the piston (96) and the liquid pressing outer cylinder (91) and located outside the telescopic column (94), the piston (96) is located the liquid storage cavity (98), electronic fluorinated liquid is stored in the lower portion of the liquid storage cavity (98), four groups of liquid pressing holes (99) are symmetrically formed in the periphery of the bottom of the liquid storage cavity (98), the four groups of liquid pressing holes (99) are outwards connected with the liquid guide bent pipe (90), and the liquid guide bent pipe (90) extends upwards in the carrier table (24) and stretches into the cutting flow channel (23).

8. The dicing apparatus for semiconductor chip processing according to claim 7, wherein: liquid inlet (40) have been seted up to the position near the middle part on stock solution inner chamber (98) inner wall, liquid inlet (40) outwards are connected with liquid feeding pipe (41), metering pump (42) are installed to the tip of liquid feeding pipe (41), the outside of metering pump (42) is provided with pump seat (43), the upper end of pump seat (43) is provided with liquid feeding case (44), the opening has been seted up to liquid feeding case (44) upper end, articulated be provided with sealed lid (45) on the opening.

9. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: the novel spraying device is characterized in that a suction cover (50) is arranged on the workbench (5) and located on one side of the outer die holder (6), a guide channel (51) is arranged in the suction cover (50) in a downward extending mode, a suction fan is arranged in the workbench (5) in the guide channel (51) in a downward extending mode, a flow pipe (52) is connected to one side of the middle of the guide channel (51), an atomization cavity (53) is connected to one end, far away from the guide channel (51), of the flow pipe (52), a water supply tank (54) is arranged on one side of the atomization cavity (53), a blowing tank (55) is arranged at the upper end of the water supply tank (54), and the blowing tank (55) extends into the atomization cavity (53) downward through a gas spraying pipe (56).

10. The dicing apparatus for semiconductor chip processing according to claim 9, wherein: an inner channel (60) is arranged in the guide channel (51), a drying cylinder (61) is rotatably arranged in the inner channel (60) close to the bottom, dry particles are stored in the drying cylinder (61), adsorption holes (62) are uniformly formed in the cylinder surface of the drying cylinder (61), shaft portions (63) are welded at the middle positions of the two ends of the drying cylinder (61), one group of shaft portions (63) are fixed on the inner wall of the guide channel (51) through a second bearing seat, the other group of shaft portions (63) are connected with the output shaft of a constant-speed motor (64) through a shaft coupler, and the constant-speed motor (64) is horizontally arranged on the inner wall of the guide channel (51).