CN116941826A - Atomizer, preparation method and liquid atomizing device - Google Patents
Atomizer, preparation method and liquid atomizing device Download PDFInfo
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- CN116941826A CN116941826A CN202210411478.8A CN202210411478A CN116941826A CN 116941826 A CN116941826 A CN 116941826A CN 202210411478 A CN202210411478 A CN 202210411478A CN 116941826 A CN116941826 A CN 116941826A
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- 239000007788 liquid Substances 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 176
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000000463 material Substances 0.000 claims abstract description 51
- 239000000919 ceramic Substances 0.000 claims abstract description 31
- 239000011159 matrix material Substances 0.000 claims abstract description 18
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 239000006199 nebulizer Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000007639 printing Methods 0.000 abstract description 8
- 238000000889 atomisation Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 210000001124 body fluid Anatomy 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000009688 liquid atomisation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/10—Devices using liquid inhalable precursors
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/48—Fluid transfer means, e.g. pumps
Landscapes
- Resistance Heating (AREA)
Abstract
The invention discloses an atomizer, a preparation method and a liquid atomizing device. It comprises the following steps: a non-metallic matrix having a liquid suction trough therein; the heating assembly comprises a heat conducting substrate and a heating film, wherein the heat conducting substrate is contacted with the heating film, the heat conducting substrate is embedded on the nonmetal substrate, the heating film comprises a supporting film material and a heating electrode, the heating electrode is positioned on one side of the supporting film material, and one side of the supporting film material, which is not provided with the heating electrode, is contacted with the heat conducting substrate. The atomizer has the advantages that the atomizer with the traditional nonmetallic substrate such as ceramic is heated, the heating circuit directly prepared (like the printing) on the substrate is replaced by the embedded heating component, and the heating motor is arranged on the heating film to serve as the heating circuit, so that the atomizer has the advantages of high circuit pattern forming precision, good production process controllability, wide industrial application range and the like.
Description
Technical Field
The invention relates to the field of materials, in particular to an atomizer, a preparation method and a liquid atomizing device.
Background
At present, in order to realize a heating atomization effect, a heating circuit is generally directly arranged on the surface of a substrate, for example, a layer of conductive paste is printed on the surface of the ceramic to form the heating circuit based on a screen printing process, and the resistance value of the heating circuit is controlled by designing the shapes of different heating circuits so as to realize the heating atomization effect at different temperatures. However, the heating circuit forming of the atomization device is based on a screen printing process, and the process has the defects of poor pattern precision control, uneven printing quality, lewis cracking of a heating wire and the like when printing on the surface of ceramic with rough surface and the like, so that the problems of uneven heating of the heating circuit, local easy fatigue deformation and fracture and the like in the using process are easily caused.
Accordingly, there is a need for improvements in current atomizers, methods of manufacture, and liquid atomizing devices.
Disclosure of Invention
The present invention aims to alleviate or even solve at least one of the above problems to a certain extent.
In one aspect of the invention, the invention provides an atomizer. It comprises the following steps: a non-metallic matrix having a liquid suction trough therein; the heating assembly comprises a heat conducting substrate and a heating film, wherein the heat conducting substrate is contacted with the heating film, the heat conducting substrate is embedded on the nonmetal substrate, the heating film comprises a supporting film material and a heating electrode, the heating electrode is positioned on one side of the supporting film material, and one side of the supporting film material, which is not provided with the heating electrode, is contacted with the heat conducting substrate. The atomizer has the advantages that the atomizer with the traditional nonmetallic substrate such as ceramic is heated, the heating circuit directly prepared (like the printing) on the substrate is replaced by the embedded heating component, and the heating motor is arranged on the heating film to serve as the heating circuit, so that the atomizer has the advantages of high circuit pattern forming precision, good production process controllability, wide industrial application range and the like.
According to the embodiment of the invention, the material forming the support film material comprises high-temperature resistant polymer, and the temperature of the high temperature is not lower than 200 ℃. Therefore, the problems of aging, decomposition and the like caused by heating the supporting film material in the heating and atomizing process can be avoided.
According to the embodiment of the invention, the heating electrode comprises a golden finger and a conductive heating part connected with the golden finger. This can further improve the heating atomization effect.
According to the embodiment of the invention, the conductive heating parts are distributed on the supporting film material in a zigzag shape. This can further improve the heating atomization effect.
According to the embodiment of the invention, the liquid suction groove is positioned on the first surface of the ceramic matrix, the depth of the liquid suction groove is smaller than the height of the ceramic matrix, the heating component is positioned on the second surface of the ceramic matrix, the second surface is connected with the first surface, and the distance between two adjacent fold line type conductive heating parts is gradually increased in the direction from the opening side of the liquid suction groove to the bottom side of the liquid suction groove. This can further improve the heating atomization effect.
According to the embodiment of the invention, the heat conducting substrate comprises at least two embedded parts and a heat conducting surface, the heating film is arranged on one side of the heat conducting surface, the embedded parts are arranged on one side of the heat conducting surface, which is not provided with the heating film, the nonmetallic substrate is provided with embedded holes matched with the embedded parts, the embedded parts are in interference fit with the embedded holes, the embedded parts are cylindrical, and the liquid absorbing groove is positioned between the two embedded parts. This can further improve the heating atomization effect.
According to an embodiment of the invention, the atomizer fulfils at least one of the following conditions: the nonmetallic substrate comprises a ceramic substrate, preferably a porous ceramic; the thickness of the heat conducting matrix is not more than 0.05mm; the material forming the heat conducting matrix comprises a metal or alloy containing at least one of copper, gold and silver; a heat-conducting adhesive is arranged between the heat-conducting substrate and the heating film; the heating film is flexible; the material forming the support membrane material comprises polyimide; the material forming the heating electrode comprises at least one of metal, alloy, graphene and nano carbon, and the metal or alloy contains at least one selected from iron, chromium, nickel and copper. This can further improve the heating atomization effect.
In another aspect of the invention, the invention provides a method of preparing the aforementioned atomizer, the method comprising: providing a nonmetallic substrate, wherein a liquid suction groove is formed in the nonmetallic substrate; the heating assembly comprises a heat conducting substrate and a heating film which are in contact, the heating film comprises a supporting film material and a heating electrode, the heating electrode is positioned on one side of the supporting film material, which is not provided with the heating electrode, is in contact with the heat conducting substrate, and the heating assembly is embedded on the nonmetal substrate through the heat conducting substrate. Thus, the above-described atomizer can be easily obtained.
According to an embodiment of the present invention, there is provided the heating assembly including: a heating electrode layer is arranged on the supporting film material, and is etched by using an etching mask to form a conductive heating part, and a golden finger connected with the end part of the conductive heating part is formed to obtain a heating film; and attaching the heating film to one side of the heat conducting substrate. Thus, the heating module can be obtained simply.
In yet another aspect of the invention, the invention provides a liquid atomizing device. Which includes the atomizer described previously. Accordingly, the liquid atomizing device has all the features and advantages of the aforementioned atomizer, and will not be described herein. In general, the liquid atomizing device has at least one of the advantages of higher precision of an atomizer heating part, uniform heating of a heating circuit, difficult deformation and fracture and the like.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 shows a schematic structural view of a nebulizer according to one embodiment of the invention;
fig. 2 shows a schematic structural view of a nebulizer according to yet another embodiment of the invention;
fig. 3 shows a schematic structural view of a nebulizer according to yet another embodiment of the invention;
fig. 4 shows a partial schematic structure of a nebulizer according to still another embodiment of the invention;
fig. 5 shows a schematic structural view of a heat generating film according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In one aspect of the invention, the invention provides an atomizer. Referring to fig. 1 and 2, it includes: the heating assembly 200 comprises a heat conducting substrate 210 and a heating film 220 which are contacted, wherein the non-metal substrate 100 is internally provided with a liquid suction groove 110, the heat conducting substrate 210 is embedded on the non-metal substrate 100, the heating film 220 comprises a supporting film material 221 and a heating electrode 20, the heating electrode 20 is positioned on one side of the supporting film material 221, and one side of the supporting film material 221, on which the heating electrode 20 is not arranged, is contacted with the heat conducting substrate 210. The atomizer has the advantages that the atomizer with the traditional nonmetallic substrate such as ceramic is heated, the heating circuit directly prepared (like the printing) on the substrate is replaced by the embedded heating component, and the heating motor is arranged on the heating film to serve as the heating circuit, so that the atomizer has the advantages of high circuit pattern forming precision, good production process controllability, wide industrial application range and the like.
For easy understanding, the principle by which the above advantageous effects can be achieved by the atomizer will be briefly described below:
as described above, the heating circuit fabricated on a non-metallic substrate, particularly a substrate having a relatively uneven surface such as ceramic, is generally formed by printing a conductive paste in the related art. On one hand, the heating circuit obtained by the method has the defect that the precision is difficult to control, on the other hand, the heating resistor stability has high requirements on the precision of the sintering temperature control of the conductive paste because the conductive paste is required to be sintered at a high temperature in the post-treatment of the printing conductive paste, and the energy waste is large. Although the defects can be relieved to a certain extent by accurately forming the heating circuit on the surface of the ceramic based on Physical Vapor Deposition (PVD) processes such as vacuum evaporation coating, vacuum sputtering coating, vacuum ion coating and the like, the technology has the advantages of complex production equipment, high production cost, low yield and low efficiency, and is not suitable for the production of large-scale common consumer electronic products. The scheme that the conductive ceramic with higher conductivity is directly used for forming the atomizer is difficult to apply to consumer electronic products because the heat conversion efficiency of the conventional conductive ceramic material is obviously lower than that of the conventional metal material, the conductive ceramic with the same heating and atomizing effects needs higher power supply output, and the conductive ceramic has better conductivity, poorer strength and the like.
The atomizer provided by the invention adopts the heating component embedded on the surface of the nonmetallic substrate 100, so that the heating film in the heating component can be obtained by adopting materials and processes similar to an FPC (flexible printed Circuit), thereby improving the precision of a heating circuit pattern, fundamentally solving the problems of poor precision, uneven circuit thickness and the like caused by a heating circuit directly printed on the surface of an uneven nonmetallic substrate, improving the quality stability of an atomization device and improving the yield of mass production. The heating component which is arranged independently can be based on a flexible heating film structure, so that the toughness and the sealing performance of the heating component can be improved, and the service life of an atomizing device taking ceramic and other materials as matrixes can be prolonged. And the structure can transfer heat to the inside of a non-metal matrix such as ceramic and the like, so that higher-efficiency liquid atomization is realized.
The structure of the atomizer will be described in detail below according to an embodiment of the present invention:
according to an embodiment of the invention, the non-metallic matrix may comprise a ceramic matrix, preferably a porous ceramic. This can further improve the heating atomization effect. For example, the porous ceramic may be formed by using alumina, silica, silicon carbide, etc. as aggregate, forming a plurality of mutually penetrating or closed holes in the matrix by physical or chemical method, and sintering after pressing or injection molding. The material forming the support film 221 is not particularly limited as long as stability of chemical properties at the atomizing heating temperature can be ensured. For example, it may include a high temperature resistant polymer, the high temperature being at a temperature of not less than 200 degrees celsius. Therefore, the problems of aging, decomposition and the like caused by heating the supporting film material in the heating and atomizing process can be avoided. Specifically, the support film 221 may maintain stability of chemical properties at a temperature not higher than 350 ℃. Therefore, atomization of most of liquid can be realized, and the increase of production cost caused by the adoption of materials with high requirements on high temperature resistance can be avoided. For example, according to some specific embodiments of the present invention, the support film 221 may be flexible, i.e., the heat generating film 220 may be flexible. The material forming the support membrane material comprises polyimide.
According to an embodiment of the present invention, referring to fig. 3, the heating electrode 20 may include a gold finger (22A and 22B as shown in the drawing) and a conductive heating part 21 connected to the gold finger. This can further improve the heating atomization effect. According to an embodiment of the present invention, the conductive heating portions 21 may be distributed in a zigzag shape on the support film 221. The material forming the heating electrode is not particularly limited, and may include, for example, at least one of a metal, an alloy, graphene, and nanocarbon, and the foregoing metal or alloy contains at least one selected from iron, chromium, nickel, and copper. This can further improve the heating atomization effect. The golden finger can be formed by plating gold and nickel on the surface of the conductive heating part, so that the end part of the circuit has good conductivity and wear resistance, can be conveniently and reliably spliced with an external control circuit, and has extremely low contact resistance compared with a printed circuit.
According to some embodiments of the invention, the heater electrode may be formed by a manufacturing process similar to that of the FPC line. For example, a conductive layer may be formed on the surface of the support film material by a method including but not limited to printing, a mask with a specific shape may be formed by exposing, developing, and etching, and the conductive layer may be etched to remove unnecessary portions of the conductive layer, thereby forming a heating electrode with a predetermined shape. The process has the advantages of no need of high-temperature sintering for forming the circuit, high circuit pattern forming precision, good production process controllability and wide industrial application range.
The material and shape of the heat conductive substrate 210 are not particularly limited according to the embodiment of the present invention, and may be selected by those skilled in the art according to circumstances. For example, to increase its thermal conductivity, the thermally conductive substrate may have a thickness of not more than 0.05mm. The material forming the thermally conductive matrix may comprise a metal or alloy comprising at least one of copper, gold, silver. Therefore, the heat conducting property of the liquid can be improved, and the liquid in the liquid suction groove in the nonmetallic substrate can be heated and atomized better. The thermally conductive substrate 210 may be formed by a process including, but not limited to, stamping. The heat conducting matrix and the heating film can be provided with heat conducting glue therebetween so as to promote the binding force between the heating film and the heat conducting matrix. The thickness of the heat-conductive glue may be not more than 0.05mm. Thereby, the heat conductive property can be further improved.
According to an embodiment of the present invention, referring to fig. 3 and 4, the liquid suction groove 110 is located on the first surface 100A of the non-metal substrate 100, and the depth of the liquid suction groove 110 is smaller than the height of the non-metal substrate, and the heating element is located on the second surface 100B of the non-metal substrate, and the second surface is connected with the first surface. The heat conducting substrate comprises at least two inserts (211A and 211B shown in fig. 3) and a heat conducting surface 212, the heating film is arranged on one side of the heat conducting surface 212, the inserts are arranged on one side of the heat conducting surface, which is not provided with the heating film, and the nonmetallic substrate is provided with an insert hole (11A and 11B shown in fig. 3) matched with the inserts, and the inserts are in interference fit with the insert hole. The inserts may be cylindrical and the wick is located between the two inserts. Specifically, taking a nonmetallic substrate as a porous ceramic as an example, the embedded holes and the liquid suction grooves can be formed in the porous ceramic through pressing or injection molding and other processes. This can further improve the heating atomization effect. The cylindrical embedded part can be used for penetrating and transmitting heat generated by the heating film into the nonmetal matrix, so that the ceramic and other materials are uniformly heated in the horizontal direction, the heating surface of the body fluid in the process of atomizing by the porous ceramic is wider, and the atomization efficiency is improved by using the heat to a greater extent.
According to some embodiments of the invention, the heat conducting substrate of the heating film and the heating film are provided with heat conducting glue, and the heating film and the non-metal substrate are in interference fit. The atomizer with the structure has the advantages that the components are tightly combined, the packaging cost of the device is low, the efficiency is high, the combination is stable, and the risk that the ceramic surface is easy to warp and fall off after the traditional printed circuit is sintered is eliminated.
According to some embodiments of the present invention, the conductive heating parts may have a folded line structure, and the interval between the adjacent two folded line type conductive heating parts 21 is gradually increased (as shown in D2 and D1 of the drawing) in a direction in which the opening side of the liquid suction groove is directed to the bottom side of the liquid suction groove, referring to fig. 5. That is, in the direction in which the opening side of the liquid suction groove is directed to the bottom side of the liquid suction groove, the first distance D2 of the conductive heating portion on the bottom side of the liquid suction groove is larger than the second distance D1 thereof on the opening side of the liquid suction groove. That is, the layout of the conductive heating part is designed in a mode of tightening and loosening, and in the vertical direction, more heat can be transferred to the top of the ceramic atomizing core, so that the smoke output per unit time of the surface of the porous ceramic and other matrixes is improved, and the atomizing speed is increased.
Here, in the present invention, the term "gradually increases" means that the value of any two of the foregoing pitches tends to increase in a specific direction, and the amount of change of the trend is not particularly limited, and may be uniform or gradient. As long as the two adjacent folded-line conductive heating portions do not show a gradual decrease trend in the aforementioned specific direction.
In another aspect of the invention, the invention provides a method of making the aforementioned atomizer. According to an embodiment of the invention, the method comprises the steps of providing a non-metallic substrate, and providing a heating assembly. The heating component comprises a heat conducting substrate and a heating film which are in contact, wherein the heating film comprises a supporting film material and a heating electrode, the heating electrode is positioned on one side of the supporting film material, and one side of the supporting film material, which is not provided with the heating electrode, is in contact with the heat conducting substrate. The specific structure of the nonmetallic substrate and the heating assembly has been described in detail above, and will not be repeated here. The method further includes the step of engaging the heating element to the nonmetallic substrate via the thermally conductive substrate. Thus, the above-described atomizer can be easily obtained.
According to an embodiment of the present invention, providing the heating assembly may include the steps of:
first, a heating electrode layer is provided on the support film. The heating electrode layer is used in a subsequent operation to form a conductive heating portion. The heating electrode layer can be formed in an appropriate manner according to the material selection of the aforementioned conductive heating portion by those skilled in the art. The heating motor layer may cover most or all of the surface of the support film. Which should cover at least the portion where the conductive heating portion needs to be formed. And then, etching the heating electrode layer by using an etching mask to form a conductive heating part and forming a golden finger connected with the end part of the conductive heating part to obtain a heating film. The manner of disposing the etching mask is not particularly limited, and for example, a manner similar to that of forming the FPC may be employed, such as including, but not limited to, a process of exposure, development, etching, and the like. And finally, attaching the formed heating film to one side of the heat conducting substrate. Thus, the heating module can be obtained simply. The structure and materials of the heating film and the heat conducting substrate, and the matching manner between the heating component and the non-metal substrate such as ceramic, etc. are described in detail in the foregoing, and are not repeated here.
In yet another aspect of the invention, the invention provides a liquid atomizing device. Which includes the atomizer described previously. Accordingly, the liquid atomizing device has all the features and advantages of the aforementioned atomizer, and will not be described herein. In general, the liquid atomizing device has at least one of the advantages of higher precision of an atomizer heating part, uniform heating of a heating circuit, difficult deformation and fracture and the like.
In the description of the present invention, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. In the description of the present specification, reference to the term "one embodiment," "another embodiment," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction. In addition, it should be noted that, in this specification, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (10)
1. An atomizer, comprising:
a non-metallic matrix having a liquid suction trough therein;
the heating assembly comprises a heat conducting substrate and a heating film, wherein the heat conducting substrate is contacted with the heating film, the heat conducting substrate is embedded on the nonmetal substrate, the heating film comprises a supporting film material and a heating electrode, the heating electrode is positioned on one side of the supporting film material, and one side of the supporting film material, which is not provided with the heating electrode, is contacted with the heat conducting substrate.
2. The ceramic atomizer according to claim 1, wherein the material forming the support membrane comprises a high temperature polymer, the high temperature being at least 200 degrees celsius.
3. The atomizer of claim 1 wherein said heating electrode comprises a gold finger and a conductive heating portion connected to said gold finger.
4. A nebulizer as claimed in claim 3, wherein the conductive heating portions are distributed in a zigzag pattern on the support film.
5. The atomizer of claim 4 wherein said wick is located on a first surface of said non-metallic substrate and wherein said wick has a depth less than a height of said non-metallic substrate,
the heating component is positioned on the second surface of the nonmetallic substrate, the second surface is connected with the first surface,
the distance between the two adjacent fold line type conductive heating parts is gradually increased in the direction from the opening side of the liquid suction groove to the bottom side of the liquid suction groove.
6. The atomizer according to claim 1, wherein said thermally conductive base comprises at least two inserts and a thermally conductive surface, said heat generating film is disposed on a side of said thermally conductive surface, said inserts are disposed on a side of said thermally conductive surface where said heat generating film is not disposed, and said nonmetallic base has an insert hole thereon for mating with said inserts, said inserts and said insert hole are in interference fit, said inserts are cylindrical,
the wick is located between the two inserts.
7. A nebulizer as claimed in any one of claims 1 to 6, wherein the nebulizer meets at least one of the following conditions:
the nonmetallic substrate comprises a ceramic substrate, preferably a porous ceramic;
the thickness of the heat conducting matrix is not more than 0.05mm;
the material forming the heat conducting matrix comprises a metal or alloy containing at least one of copper, gold and silver;
a heat-conducting adhesive is arranged between the heat-conducting substrate and the heating film;
the heating film is flexible;
the material forming the support membrane material comprises polyimide;
the material forming the heating electrode comprises at least one of metal, alloy, graphene and nano carbon, and the metal or alloy contains at least one selected from iron, chromium, nickel and copper.
8. A method of preparing the nebulizer of any one of claims 1-7, comprising:
providing a nonmetallic substrate, wherein a liquid suction groove is formed in the nonmetallic substrate;
the heating assembly comprises a heat conducting substrate and a heating film which are in contact, the heating film comprises a supporting film material and a heating electrode, the heating electrode is positioned on one side of the supporting film material, which is not provided with the heating electrode, is in contact with the heat conducting substrate, and the heating assembly is embedded on the nonmetal substrate through the heat conducting substrate.
9. The method of claim 8, wherein providing the heating assembly comprises:
a heating electrode layer is arranged on the supporting film material, and is etched by using an etching mask to form a conductive heating part, and a golden finger connected with the end part of the conductive heating part is formed to obtain a heating film;
and attaching the heating film to one side of the heat conducting substrate.
10. A liquid atomizing device comprising the atomizer of any one of claims 1-7.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210411478.8A CN116941826A (en) | 2022-04-19 | 2022-04-19 | Atomizer, preparation method and liquid atomizing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210411478.8A CN116941826A (en) | 2022-04-19 | 2022-04-19 | Atomizer, preparation method and liquid atomizing device |
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| CN116941826A true CN116941826A (en) | 2023-10-27 |
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| CN202210411478.8A Pending CN116941826A (en) | 2022-04-19 | 2022-04-19 | Atomizer, preparation method and liquid atomizing device |
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