CN116940065A - Charging gun cooling system - Google Patents
Charging gun cooling system Download PDFInfo
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- CN116940065A CN116940065A CN202310798636.4A CN202310798636A CN116940065A CN 116940065 A CN116940065 A CN 116940065A CN 202310798636 A CN202310798636 A CN 202310798636A CN 116940065 A CN116940065 A CN 116940065A
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- water collecting
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- 238000001816 cooling Methods 0.000 title claims abstract description 107
- 239000007788 liquid Substances 0.000 claims abstract description 285
- 239000002184 metal Substances 0.000 claims abstract description 77
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 73
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 239000000110 cooling liquid Substances 0.000 claims description 128
- 239000003595 mist Substances 0.000 claims description 38
- 238000010079 rubber tapping Methods 0.000 claims description 20
- 239000002826 coolant Substances 0.000 claims description 19
- 238000012360 testing method Methods 0.000 claims description 17
- 230000001502 supplementing effect Effects 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 10
- 238000001802 infusion Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 4
- 239000013589 supplement Substances 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 description 13
- 239000012809 cooling fluid Substances 0.000 description 8
- 238000002637 fluid replacement therapy Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000000889 atomisation Methods 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 210000001503 joint Anatomy 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02T90/10—Technologies relating to charging of electric vehicles
- Y02T90/12—Electric charging stations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
Abstract
The invention provides a charging gun cooling system, which comprises: a liquid outlet device and a liquid return cooling device; the liquid outlet device comprises a liquid storage tank, a pump, a first pipeline and a liquid outlet water collector; the liquid return cooling device comprises a liquid return water collecting and distributing device, a micro-channel radiator, a fan, a drainage tube, an external filter and a semiconductor refrigerating piece, wherein at least one liquid return connector is arranged on the liquid return water collecting and distributing device and used for being connected with a charging gun, the micro-channel radiator is communicated with the liquid return water collecting and distributing device, the fan faces the micro-channel radiator, the first end of the drainage tube is connected with the micro-channel radiator, the second end of the drainage tube is connected with a liquid storage tank, the external filter is arranged outside the liquid storage tank, the two ends of the external filter are connected with the drainage tube, the external filter comprises a metal shell and a detachable filter element accommodated in the metal shell, and the semiconductor refrigerating piece is connected with the metal shell. The charging gun cooling system can reduce impurities, avoid the condition of blockage of the system, and can efficiently cool.
Description
Technical Field
The invention relates to the field of new energy automobile charging stations, in particular to a charging gun cooling system.
Background
With the rapid development of the new energy automobile industry, the endurance mileage of the electric automobile is continuously increased, and in the process that the electric automobile user charges the new energy automobile with high power through the charging gun, the charging gun heats seriously, and the charging gun needs to be cooled rapidly.
When the existing cooling system adopts water cooling, the problems of blockage and too low liquid flow rate often occur, the blockage points are required to be searched by stopping machine, cleaning and maintenance are troublesome, and the cooling effect of the existing cooling system on cooling liquid is poor in high-temperature environment, especially in hot summer.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a cooling system for a charging gun, which can reduce impurities, avoid the condition of blockage of the system and can efficiently cool down.
In order to solve the above-described problems, the present invention provides a charging gun cooling system including:
a liquid outlet device and a liquid return cooling device;
the liquid outlet device comprises a liquid storage tank, a pump, a first pipeline and a liquid outlet water collecting and distributing device, wherein the liquid storage tank is used for containing cooling liquid, a liquid inlet end of the pump is connected with the liquid storage tank so as to extract the cooling liquid in the liquid storage tank, a first end of the first pipeline is connected with a liquid outlet end of the pump, the liquid outlet water collecting and distributing device is connected with a second end of the first pipeline so as to receive the cooling liquid from the first pipeline, and at least one liquid outlet connector is arranged on the liquid outlet water collecting and distributing device and is used for being connected with a charging gun so as to enable the cooling liquid to flow out to the charging gun;
the liquid return cooling device comprises a liquid return water collecting and distributing device, a micro-channel radiator, a fan, a drainage tube, an external filter and a semiconductor refrigerating piece, wherein at least one liquid return connector is arranged on the liquid return water collecting and distributing device and is connected with a charging gun so as to receive cooling liquid passing through the charging gun, the micro-channel radiator is communicated with the liquid return water collecting and distributing device so as to receive the cooling liquid from the liquid return water collecting and distributing device and cool the cooling liquid, the fan faces the micro-channel radiator so as to blow or suck air to the micro-channel radiator, a first end of the drainage tube is connected with the micro-channel radiator, a second end of the drainage tube is connected with the liquid storage box so as to inject the cooling liquid into the liquid storage box, the external filter is arranged outside the liquid storage box, two ends of the external filter are connected with the drainage tube, the external filter comprises a metal shell and a detachable filter core contained in the metal shell, and the semiconductor refrigerating piece is connected with the metal shell so as to cool the metal shell.
Further, the liquid outlet device further comprises:
a temperature detector extending into an interior of the external filter to test a first temperature of the coolant within the external filter,
and the controller is connected with the temperature detector and the semiconductor refrigerating piece and used for controlling the semiconductor refrigerating piece to start according to the fact that the first temperature detected by the temperature detector exceeds a first preset temperature so as to cool the metal shell.
Further, the liquid return cooling device further comprises a liquid return pressure sensor and a liquid return temperature sensor, wherein the liquid return pressure sensor is connected with the liquid return water collecting and distributing device so as to test the pressure of the cooling liquid in the liquid return water collecting and distributing device, and the liquid return temperature sensor is connected with the liquid return water collecting and distributing device and is spaced from the liquid return pressure sensor so as to test the second temperature of the cooling liquid in the liquid return water collecting and distributing device;
the liquid outlet device further comprises a liquid outlet pressure sensor and a liquid outlet temperature sensor, wherein the liquid outlet pressure sensor is connected with the liquid outlet water collecting and distributing device so as to test the pressure of the cooling liquid in the liquid outlet water collecting and distributing device, and the liquid outlet temperature sensor is connected with the liquid outlet water collecting and distributing device and is spaced apart from the liquid outlet pressure sensor so as to test the third temperature of the cooling liquid in the liquid outlet water collecting and distributing device.
Further, the microchannel heat sink includes:
the micro-channel radiator is connected with the liquid return collecting and distributing device through the lower collecting pipe;
the flat pipes are vertically arranged and are arranged at intervals, and the bottom ends of the flat pipes are connected with the lower collecting pipe;
the upper collecting pipe is connected to the top ends of all the flat pipes, the microchannel radiator is connected with the first end of the drainage pipe through the upper collecting pipe, and the cooling liquid can flow from the lower collecting pipe to the upper collecting pipe through a plurality of the flat pipes;
the fins are arranged between two adjacent flat tubes respectively.
Further, the fan is disposed at the rear of the microchannel radiator, and the wind direction formed by rotation of the fan is from front to rear, the liquid return device further comprises an atomization device, the atomization device is on the windward side of the microchannel radiator, so as to spray water mist to the microchannel radiator, and the atomization device comprises:
the mist box is vertically arranged in front of the micro-channel radiator and is a preset distance away from the micro-channel radiator, and a plurality of mist holes which are arranged at intervals are formed in one surface facing the micro-channel radiator;
and the atomizer is communicated with the mist box so as to provide mist to the mist box.
Further, the liquid return cooling device also comprises a temperature measuring instrument which is used for testing the fourth temperature of the flat tube,
the controller is connected with the thermometer, the liquid return temperature sensor and the atomizer, and when the temperature difference between the second temperature and the fourth temperature is smaller than a preset temperature difference and the second temperature exceeds a second preset temperature, the atomizer is controlled to start so as to spray the mist.
Further, the liquid outlet device further comprises:
the metal piece is inserted into the liquid storage tank from the outside of the liquid storage tank;
the semiconductor refrigerator is connected with one end of the metal piece, which is positioned outside;
the controller is also connected with the liquid outlet temperature sensor and the semiconductor refrigerator, so as to control the semiconductor refrigerator to cool the metal piece according to the fact that the third temperature detected by the liquid outlet temperature sensor is larger than a third preset temperature.
Further, the liquid outlet device further comprises:
the liquid level sensor is arranged in the liquid storage tank at the detection end, so that the liquid level of the cooling liquid contained in the liquid storage tank is detected.
Further, the metal piece is a metal pipe, the metal pipe is vertically arranged, two ends of the metal pipe are open, the bottom end of the metal pipe is adjacent to the bottom of the liquid storage tank,
the liquid outlet device further comprises:
a liquid supplementing pipe, a first end of the liquid supplementing pipe is connected with the metal pipe,
the fluid infusion box is connected with the second end of the fluid infusion pipe through an electromagnetic valve,
the controller is also connected with the liquid level sensor and the electromagnetic valve, so as to control the electromagnetic valve to be opened according to the fact that the liquid level detected by the liquid level sensor is lower than a first preset liquid level, so as to supplement the cooling liquid to the liquid storage tank through the liquid supplementing tank, the liquid supplementing pipe and the metal pipe, and control the electromagnetic valve to be closed according to the fact that the liquid level detected by the liquid level sensor is higher than a second preset liquid level.
Further, the liquid outlet device further comprises:
the fluid infusion filter screen is connected with the bottom end of the metal pipe,
and the controller controls the semiconductor refrigerator to cool the metal pipe according to the opening state of the electromagnetic valve.
Due to the technical scheme, the invention has the following beneficial effects:
according to the charging gun cooling system, the liquid inlet device is used for providing cooling liquid for the charging gun, the liquid return cooling device is used for cooling and refluxing the cooling liquid passing through the charging gun, the circulating use of the cooling liquid is realized, the liquid outlet device pumps the cooling liquid of the liquid storage tank and provides the cooling liquid for the liquid outlet water collector through the first pipeline, the liquid outlet water collector is used for providing the cooling liquid for the charging gun through one or more liquid outlet joints, the rapid cooling of the cooling gun is realized, the cooling liquid passing through one or more charging guns enters the liquid return water collector through the liquid return joints and then passes through the micro-channel radiator for cooling, the fan is used for carrying out air cooling on the micro-channel radiator, the cooling liquid cooling capacity is improved, the fan is matched with the micro-channel radiator, the air resistance is lower, the noise can be reduced, the cooling liquid passing through the micro-channel radiator for cooling liquid can be concentrated in the external filter through the drainage tube, the impurities can be conveniently concentrated in the external filter, the impurities are prevented from being scattered and accumulated, the cooling channel blocking caused by the cooling liquid or the cooling liquid can be caused, the metal shell of the cooling liquid can be cooled down rapidly, and the metal shell of the cooling device can be cooled rapidly, and the high-temperature effect on the cooling device is reduced, and the cooling effect is reduced.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the following description will make a brief introduction to the drawings used in the description of the embodiments or the prior art. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a block diagram of a charge gun cooling system according to an embodiment of the invention;
FIG. 2 is a view of the embodiment of FIG. 1, looking from the front to the back;
FIG. 3 is a block diagram of a drain, an external filter, and a temperature detector according to an embodiment of the present invention;
FIG. 4 is a block diagram of a microchannel heat sink and atomizer according to an embodiment of the invention;
fig. 5 is a rear view of the nebulizing cartridge according to the embodiment of fig. 4;
fig. 6 is a block diagram of a liquid storage tank, a semiconductor refrigerator, a liquid replenishing pipe, a solenoid valve and a liquid replenishing tank according to an embodiment of the present invention.
Reference numerals:
1000. a liquid outlet device; 1100. a liquid storage tank; 1200. a first pipeline; 1300. a pump; 1410. a liquid outlet water collecting and dividing device; 1420. a hydraulic pressure sensor is arranged; 1430. a liquid outlet temperature sensor; 1510. a metal tube; 1520. a semiconductor refrigerator; 1610. a fluid supplementing pipe; 1620. an electromagnetic valve; 1630. a fluid supplementing box; 1700. a liquid level sensor; 2000. a liquid return cooling device; 2110. a liquid return water collecting and dividing device; 2120. a liquid return temperature sensor; 2130. a hydraulic pressure sensor; 2200. a drainage tube; 2300. a microchannel heat sink; 2310. a lower collecting pipe; 2320. a flat tube; 2330. a fin; 2340. an upper collecting pipe; 2410 an external filter; 2411. a metal housing; 2412. a filter element; 2420. a semiconductor refrigeration member; 2430. a temperature detector; 2510. An atomizer; 2520. a mist box; 2521. mist pores; 2600. a fan; 3000. and a controller.
Description of the embodiments
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
According to the analysis of the inventor, the blockage and the too low flow rate of the existing cooling system are caused by the fact that impurities fall into a cooling channel through which cooling liquid flows when equipment is installed, or impurities of the cooling gun or impurities of a butt joint pipeline are flushed into the cooling system by the cooling liquid when the cooling system is in butt joint with the cooling gun, the impurities are gradually accumulated in the cooling system in the using process, the cooling channel is blocked easily, the cooling liquid flows smoothly, and the flow rate is reduced.
Based on this, the external filter 2410 is provided in the cooling channel, so that impurities can be concentrated in the external filter, and the problems of blockage of the cooling channel and reduction of the flow rate of the cooling liquid of the cooling system can be avoided by only maintaining the external filter 2410.
Next, a charging gun cooling system according to an embodiment of the present invention is described.
As shown in fig. 1 to 3, a charging gun cooling system of an embodiment of the present invention includes: a liquid outlet device 1000 and a liquid return cooling device 2000.
The liquid outlet device 1000 includes a liquid storage tank 1100, a pump 1300, a first pipeline 1200 and a liquid outlet water collecting and distributing device 1410. The liquid storage tank 1100 is used for containing cooling liquid, the liquid inlet end of the pump 1300 is connected with the liquid storage tank 1100 so as to extract the cooling liquid in the liquid storage tank 1100, the first end of the first pipeline 1200 is connected with the liquid outlet end of the pump 1300, the liquid outlet water collector 1410 is connected with the second end of the first pipeline 1200 so as to receive the cooling liquid from the first pipeline 1200, and at least one liquid outlet connector is arranged on the liquid outlet water collector 1410 and is used for being connected with a charging gun so as to enable the cooling liquid to flow out to the charging gun.
The reservoir 1100 is used to hold a cooling fluid. The liquid inlet end of the pump 1300 is connected to the liquid storage tank 1100 to pump the cooling liquid in the liquid storage tank 1100. The cooling liquid may be water, oil, mixed solution, or the like. Alternatively, the cooling liquid may be water or oil to which an antifreezing agent and an anti-evaporation agent are added. The cooling fluid contained in the reservoir 1100 can be rapidly supplied to the charging gun for use, and the pump 1300 can supply cooling fluid pressure to increase the flow rate of the cooling fluid, thereby enabling the cooling fluid to more rapidly pass through the charging gun and more rapidly cool the charging gun.
First line 1200 and effluent collection separator 1410. A first end of the first conduit 1200 is connected to the outlet end of the pump 1300. The liquid outlet water collector 1410 is connected to the second end of the first pipeline 1200 to receive the cooling liquid from the first pipeline 1200, and at least one liquid outlet connector is arranged on the liquid outlet water collector 1410 and is used for being connected to a charging gun to enable the cooling liquid to flow out to the charging gun. First line 1200 provides coolant pressurized by pump 1300 to a liquid sump water trap 1410.
As shown in fig. 1, two liquid outlet connectors are provided on the liquid outlet water collector 1410, so that cooling liquid can be supplied to the two liquid outlet connectors simultaneously, cooling liquid can be supplied to the two charging guns simultaneously, or cooling liquid can be supplied to the two positions of one charging gun simultaneously. The number of the liquid outlet connectors is not limited herein.
The liquid-back cooling device 2000 includes a liquid-back water collector 2110, a microchannel radiator 2300, a fan 2600, a drain 2200, an external filter 2410, and a semiconductor refrigerator 2420. The liquid return collecting and distributing device 2110 is provided with at least one liquid return connector, the liquid return connector is used for being connected with a charging gun to receive cooling liquid passing through the charging gun, the heat radiator of the micro-channel is communicated with the liquid return collecting and distributing device 2110 to receive cooling liquid from the liquid return collecting and distributing device 2110 and cool the cooling liquid, the fan 2600 faces the micro-channel heat radiator 2300 to blow or suck air to the micro-channel heat radiator 2300, the first end of the drainage tube 2200 is connected with the micro-channel heat radiator 2300, the second end of the drainage tube 2200 is connected with the liquid storage tank 1100 to inject the cooling liquid into the liquid storage tank 1100, the external filter 2410 is arranged outside the liquid storage tank 1100, two ends of the external filter 2410 are connected with the drainage tube 2200, the external filter 2410 comprises a metal shell 2411 and a detachable filter element 2412 accommodated in the metal shell, and the semiconductor refrigerating element 2420 is connected with the metal shell to cool the metal shell.
The liquid return water collector 2110 is provided with at least one liquid return connector for connecting with the charging gun to receive the cooling liquid passing through the charging gun. The liquid return water collector 2110 can be provided with 2, 5 or 7 liquid return connectors, and can be independently connected with one charging gun or synchronously connected with a plurality of charging guns.
The coolant in the tank 1100 of the tapping device 1000 flows into the charging gun, and after passing through the charging gun, flows into the return water collector/separator 2110 through the docking pipe and the return joint.
The micro-channel radiator 2300 communicates with the return water collector-separator 2110 (the micro-channel radiator 2300 may be connected to the return water collector-separator 2110 through a return pipe) to receive the cooling liquid from the return water collector-separator 2110 to cool the cooling liquid. The fan 2600 faces the microchannel heat sink 2300 to blow or suck air to the microchannel heat sink 2300.
In the working state, the cooling liquid flows into the micro-channel radiator 2300, the fan 2600 adopts a direct blowing (blowing) or suction (suction) mode to force air to flow from the surface of the micro-channel radiator 2300 at a certain speed and air quantity, and the micro-channel radiator 2300 is cooled, so that the cooling liquid in the micro-channel radiator 2300 is cooled. The micro-channel radiator 2300 has a larger area and a larger radiating area, and is easier to cool and radiate due to wind power. By adopting the micro-channel radiator 2300, the wind resistance can be reduced while the heat exchange area is not reduced, so that the noise of the liquid return cooling device 2000 is lower during operation.
As shown in fig. 3, the external filter 2410 is connected between the two sections of drainage tubes 2200, impurities can be blocked outside the liquid storage tank 1100 through the external filter 2410, and impurities entering the cooling system can be gathered in the external filter 2410 in the installation process or the use process of the cooling system of the charging gun, so that the situation that a cooling channel is blocked or the charging gun is abnormal due to the dispersion of the impurities is avoided. The external filter 2410 is convenient to maintain outside the tank 1100, avoiding the problems of impurities entering the tank 1100 and troublesome maintenance. When the external filter 2410 is stacked with impurities to a certain degree or used for a certain period of time, the metal housing 2411 can be opened, the filter element 2412 can be taken out, and the filter element 2412 can be cleaned or replaced, so that the impurities in the cooling system are reduced.
The semiconductor refrigerator 2420 is connected to the metal housing 2411 to cool the metal housing 2411. The cooling liquid passes through the external filter 2410, and the semiconductor refrigerating element 2420 cools the metal shell of the external filter 2410, so that the cooling liquid in the external filter 2410 can be cooled, thereby improving the cooling efficiency of the system. The metal shell 2411 can increase heat conduction capability, so that low temperature on the surface of the metal shell 2411 can be conveniently transferred to cooling liquid in the metal shell, and the cooling liquid can be cooled by the semiconductor refrigerating piece 2420 in a high-temperature environment, so that the influence of external high temperature on the cooling liquid is reduced.
The above charging gun cooling system provides the cooling liquid to the charging gun through the feed liquor device, cool down and backward flow the cooling liquid through the charging gun through back liquid cooling device 2000, realize the cyclic use of cooling liquid, the pump 1300 of liquid outlet device 1000 draws the cooling liquid of liquid reserve tank 1100, and provide liquid collection water knockout drum 1410 through first pipeline 1200, liquid collection water knockout drum 1410 provides the charging gun cooling liquid through one or more liquid joint, realize the quick cooling to the cooling gun, the cooling liquid that flows through one or more charging gun gets into back liquid collection water knockout drum 2110 through back liquid joint, cool down through microchannel radiator 2300 again, fan 2600 carries out forced air cooling to microchannel radiator 2300, improve the ability to cool down the cooling liquid, and fan 2600 cooperates with microchannel radiator 2300, the windage is lower, can reduce the noise, the cooling liquid after the microchannel radiator 2300 cools down, flow through 2200 drainage tube and external filter 2410, impurity that produces in the cooling system assembly and use can concentrate in external filter 2410, be convenient for clear up, the cooling liquid that flows through one or more than the cooling liquid is led to the fact the external 2410 to the fact the high-temperature condition of cooling system to the cooling device, thereby the high-efficient cooling effect of cooling device 2411 is avoided cooling liquid to flow through the cooling channel 2410, and the high-temperature condition is reduced, thereby cooling effect is reduced, and the cooling system is cooled down to the external shell 2411.
In some embodiments of the present invention, the tapping device 1000 further comprises a temperature detector 2430 and a controller 3000. The temperature detector 2430 extends into the interior of the external filter 2410 to test a first temperature of the coolant within the external filter 2410. The controller 3000 is connected to the temperature detector 2430 and the semiconductor refrigerator 2420 to control the semiconductor refrigerator 2420 to be started to cool the metal shell 2411 according to the first temperature detected by the temperature detector 2430 exceeding the first predetermined temperature.
As shown in fig. 1, when the temperature detector 2430 detects that the temperature of the cooling liquid in the external filter 2410 exceeds the first predetermined temperature, it indicates that the temperature of the cooling liquid to be flowed into the liquid storage tank 1100 is too high, which indicates that the heat dissipation of the micro-channel heat sink 2300, the fan 2600 and the atomizing device is insufficient or a problem occurs, and at this time, an alarm is given to remind the user of timely processing. The semiconductor refrigerator 2420 cools the coolant, so that the temperature of the coolant can be reduced to the maximum extent, and the coolant flowing into the liquid storage tank 1100 is prevented from being excessively high to influence the cooling of the charging gun. The semiconductor refrigerating element starts refrigerating only when the cooling liquid exceeds the first preset temperature, so that the situation that the semiconductor refrigerating element 2420 is in a refrigerating state for a long time and energy is wasted can be avoided.
In some embodiments of the invention, the return cooling apparatus 2000 further includes a return pressure sensor 2130 and a return temperature sensor 2120, the return pressure sensor 2130 being connected to the return water collector-separator 2110 to test the pressure of the cooling fluid within the return water collector-separator 2110, the return temperature sensor 2120 being connected to the return water collector-separator 2110 and being spaced apart from the return pressure sensor 2130 to test the second temperature of the cooling fluid within the return water collector-separator 2110. The tapping device 1000 further comprises a tapping pressure sensor 1420 and a tapping temperature sensor 1430, the tapping pressure sensor 1420 being connected to the tapping water collector-separator 1410 for testing the pressure of the cooling liquid in the tapping water collector-separator 1410, the tapping temperature sensor 1430 being connected to the tapping water collector-separator 1410 and being spaced apart from the tapping pressure sensor 1420 for testing the third temperature of the cooling liquid in the tapping water collector-separator 1410.
The pressure condition of the cooling liquid can be timely and accurately obtained through the hydraulic return force sensor 2130, and the hydraulic return force sensor can be timely adjusted and maintained, so that the condition that the cooling system is abnormal due to too high or too low hydraulic return force of the cooling liquid is avoided. The state of the cooling liquid can be timely and accurately known through the liquid return temperature sensor 2120, and the cooling liquid can be adjusted or the cooling strategy can be adjusted in a targeted manner. For example, the second temperature is too high, so that the cooling liquid can be replaced or cooled, and the cooling micro-channel radiator 2300 can be cooled in other ways, so that the cooling effect of the charging gun is prevented from being reduced, and the abnormal condition of the charging gun in the charging process is avoided.
The pressure condition of the cooling liquid can be timely and accurately obtained through the liquid outlet pressure sensor 1420, and the cooling liquid can be timely adjusted and maintained, so that the condition that the cooling system is abnormal due to the fact that the liquid outlet pressure of the cooling liquid is too high or too low is avoided. The temperature of the cooling liquid for cooling the charging gun can be accurately obtained through the liquid outlet temperature sensor 1430, so that a user can conveniently and timely perform corresponding treatment, for example, the cooling liquid is too high in temperature, the cooling effect can be reduced, and the user can cool down the cooling liquid or replace the cooling liquid.
In some embodiments of the invention, the microchannel heat sink 2300 includes a lower header 2310, a plurality of flat tubes 2320, an upper header 2340, and a plurality of sets of fins 2330. The micro-channel radiator 2300 is connected to the return liquid collecting and distributing device 2110 through a lower collecting pipe 2310. The flat tubes 2320 are vertically arranged and arranged at intervals, and the bottom ends of the flat tubes 2320 are connected with the lower collecting pipe 2310. The upper header 2340 is connected to the top ends of all the flat tubes 2320, and the upper header 2340 of the microchannel radiator 2300 is connected to the first end of the drain tube 2200, so that the cooling liquid can flow from the lower header 2310 to the upper header 2340 through a plurality of flat tubes 2320. The plurality of groups of fins 2330 are disposed between two adjacent flat tubes 2320.
As shown in fig. 1, the cooling fluid passes through the microchannel radiator 2300, first enters the lower manifold 2310, then enters the plurality of flat tubes 2320, and finally passes through the lower manifold 2310. The coolant flows from bottom to top in microchannel radiator 2300, can be convenient for control the velocity of flow of coolant, avoid coolant top-down's flow in-process, its self gravity influences the velocity of flow, and when can making the liquid back joint close in addition, still there is coolant in its microchannel radiator 2300, avoid the coolant to be owing to gravity influence, independently discharge into liquid reserve tank 1100, cause flat pipe 2320 to exist in the air, when cooling system starts again, with the air discharge into coolant, cause the condition that the cooling effect of coolant liquid drops.
The plurality of groups of fins 2330 can increase the heat dissipation area, thereby improving the cooling capacity of the microchannel heat sink 2300. As shown in fig. 1, a plurality of sets of fins 2330 are disposed facing the edges of the blades of fan 2600. The fan 2600 has the advantages that the wind speed of the corresponding area of the center of the fan blade is small, the fins 2330 are not arranged in the area, wind resistance can be reduced, air circulation is facilitated, the situation that the cooling effect is poor due to too small wind force caused by the fact that the fins 2330 are added in the area is avoided, the wind speed of the corresponding area of the edge of the fan blade of the fan 2600 is large, the fins 2330 are added in the area, wind can pass through the fins 2330, and the cooling effect is enhanced.
In some embodiments of the present invention, the fan 2600 is disposed behind the micro-channel radiator 2300, and the air direction formed by the rotation of the fan 2600 is from front to back, and the liquid-return cooling device 2000 further includes an atomization device, which is disposed on the upwind side of the micro-channel radiator 2300 to spray water mist to the micro-channel radiator 2300, and the atomization device includes a mist box 2520 and an atomizer 2510. The mist box 2520 is vertically disposed in front of the micro-channel heatsink 2300 with a predetermined distance from the micro-channel heatsink 2300, and the mist box 2520 is formed with a plurality of mist holes 2521 arranged at intervals on a surface facing the micro-channel heatsink 2300. The atomizer 2510 communicates with the mist box 2520 to provide mist to the atomizing box.
As shown in fig. 4, the liquid-return cooling device 2000 further includes an atomizing device on the upstream side of the microchannel heat sink 2300 to spray water mist to the microchannel heat sink 2300. The atomizing device may be a device capable of atomizing water, such as a humidifier.
Because atomizer 2510 sets up in the upwind side of microchannel radiator 2300, the water smoke that atomizing device sprayed can float to microchannel radiator 2300 owing to the influence of the wind-force of fan 2600, evaporates on microchannel radiator 2300 to cool down microchannel radiator 2300, and then cool down the inside coolant liquid of microchannel radiator 2300, increase the cooling rate to the coolant liquid.
Furthermore, dust and contaminants on the microchannel heat sink 2300 can be cleaned by the atomizing device, reducing wind resistance of wind passing through the microchannel heat sink 2300.
Further, a fan 2600 is disposed at the rear of the micro-channel radiator 2300, and the fan 2600 rotates to form a wind direction from front to rear, and the atomizing device includes a mist box 2520 and an atomizer 2510. The mist box 2520 is vertically disposed in front of the micro-channel heatsink 2300 with a predetermined distance from the micro-channel heatsink 2300, and the mist box 2520 is formed with a plurality of mist holes 2521 arranged at intervals on a surface facing the micro-channel heatsink 2300. The atomizer 2510 communicates with the mist box 2520 to provide mist to the atomizing box.
As shown in fig. 4 and 5, the atomizer 2510 generates mist, which is charged in the mist box 2520 and is floated toward the microchannel heat sink 2300 through the mist holes 2521, and the rear surface of the mist box may face the entire area of the microchannel heat sink 2300, and the mist holes 2521 are uniformly distributed, thereby achieving uniform heat dissipation to the microchannel heat sink 2300.
The predetermined distance between the mist box 2520 and the micro-channel radiator 2300 may be set according to the amount of air intake not affecting the micro-channel radiator 2300, and the temperature of the external air passing through the mist box 2520 is lower, so that the temperature of the air is reduced, thereby increasing the cooling efficiency.
Further, the liquid return cooling device 2000 further includes a temperature measuring device, the temperature measuring device is used for measuring a fourth temperature of the flat tube 2320, the controller 3000 is connected to the temperature measuring device, the liquid return temperature sensor 2120 and the atomizer 2510, and when a temperature difference between the second temperature and the fourth temperature is smaller than a predetermined temperature difference and the second temperature exceeds the second predetermined temperature, the atomizer 2510 is controlled to start so as to spray mist.
The temperature difference between the fourth temperature of the flat tube 2320 and the second temperature of the cooling liquid before entering the flat tube 2320 can estimate the temperature of the cooling liquid after passing through the flat tube 2320, and the temperature of the cooling liquid after passing through the micro-channel radiator 2300 can be calculated by adding the second temperature of the cooling liquid. When the first temperature exceeds the first predetermined temperature and the difference between the second temperature and the fourth temperature is smaller than the predetermined difference, it can be determined that the temperature after passing through the micro-channel heat sink 2300 is too high. At this time, the atomizing device is started to cool down the micro-channel radiator 2300, so that the cooling liquid is cooled down to a proper temperature and then flows to the liquid storage tank 1100.
In some embodiments of the present invention, the tapping apparatus 1000 further comprises a metal piece and a semiconductor refrigerator 1520. The metal member is inserted into the interior of the tank 1100 from the outside of the tank 1100. The semiconductor refrigerator 1520 is connected to one end of the metal member at the outside. The controller 3000 is further connected to the tapping temperature sensor 1430 and the semiconductor refrigerator 1520 to control the semiconductor refrigerator 1520 to cool down the metal piece according to the temperature detected by the tapping temperature sensor 1430 being greater than a predetermined threshold. The metal piece may be a metal rod, a metal tube 1510, a metal block, or the like. As shown in fig. 6, the metal member is formed in an inverted U shape, with the bottom end extending into the tank 1100 and the top end being connected to the semiconductor refrigerator 1520. It should be noted that the shape of the metal member is not limited herein.
The semiconductor refrigeration can work continuously, has long service life, does not need refrigerant, is environment-friendly, is convenient to install, and can cool the metal piece rapidly. The heat conduction capability of the metal piece is higher, and the low temperature of the metal piece can be timely transferred to the cooling liquid.
When the liquid outlet temperature sensor 1430 detects that the temperature of the cooling liquid is greater than a predetermined threshold, the controller 3000 controls the semiconductor refrigerator 1520 to cool down the metal piece, and the metal piece timely transmits the cooling liquid with a temperature value, thereby being capable of cooling down the cooling liquid conveniently.
The controller 3000 controls the operation of the pump 1300 according to the temperature of the cooling liquid detected by the liquid outlet temperature sensor 1430, and when the detected temperature is high, controls the corresponding increase of the rotation speed of the pump 1300, and increases the flow rate of the cooling liquid, thereby maintaining the cooling rate of the cooling gun and avoiding the reduction of the cooling effect of the cooling gun. In some embodiments of the invention, the tapping device 1000 further comprises a level sensor 1700. The detection end of the liquid level sensor 1700 is disposed in the liquid tank 1100 to detect the liquid level of the cooling liquid contained in the liquid tank 1100.
As shown in fig. 1, a liquid level sensor 1700 is provided at the bottom of the liquid tank 1100 and its detection end is provided in the liquid tank 1100. The liquid level sensor 1700 can enable a user to accurately know the liquid level of the liquid storage tank 1100, timely supplement cooling liquid to the liquid storage tank 1100, and the condition that the cooling effect on the charging gun is reduced due to insufficient cooling liquid in the liquid storage tank 1100 is avoided.
Further, the metal member is a metal tube 1510, the metal tube 1510 is vertically disposed with two ends open, and the bottom end of the metal tube 1510 is disposed adjacent to the bottom of the liquid storage tank 1100. The fluid outlet apparatus 1000 further includes a fluid replacement tube 1610, a solenoid valve 1620, and a fluid replacement tank 1630. The first end of the make-up tube 1610 is connected to the metal tube 1510. The fluid replacement tank 1630 is connected to the second end of the fluid replacement tube 1610 through a solenoid valve 1620. The controller 3000 is further connected to the liquid level sensor 1700 and the solenoid valve 1620 to control the solenoid valve 1620 to be opened according to the liquid level detected by the liquid level sensor 1700 being lower than the first predetermined liquid level, to supplement the liquid tank 1100 with the cooling liquid through the liquid supplementing tank 1630, the liquid supplementing pipe 1610 and the metal pipe 1510, and to control the solenoid valve 1620 to be closed according to the liquid level detected by the liquid level sensor 1700 being higher than the second predetermined liquid level.
As shown in fig. 6, the liquid replenishing tank 1630 communicates with the liquid tank 1100 through a liquid replenishing pipe 1610, and an electromagnetic valve 1620 is provided to the liquid replenishing pipe 1610 to switch the delivery of the cooling liquid.
When the liquid level sensor 1700 detects that the liquid level in the liquid tank 1100 is lower than a first predetermined liquid level (lowest liquid level), the controller 3000 opens the electromagnetic valve 1620, the liquid replenishing pipe 1610 delivers the cooling liquid in the liquid replenishing tank 1630 to the liquid tank 1100, and when the liquid level sensor 1700 detects that the liquid level in the liquid tank 1100 is higher than a second predetermined liquid level (highest liquid level), the controller 3000 closes the electromagnetic valve 1620, and the liquid replenishing pipe 1610 stops delivering the cooling liquid. This allows the tank 1100 to be intelligently replenished with liquid in time.
The bottom end of the metal tube 1510 is adjacent to the bottom of the liquid storage tank 1100 and can be positioned below the first preset liquid level of the liquid storage tank 1100, so that the situation that the cooling liquid splashes and a large amount of bubbles in the cooling liquid are caused by diameter dumping of the cooling liquid can be avoided, and the situation that the cooling effect of the cooling liquid on the charging gun is reduced by the bubbles is avoided. Further, the contact area between the metal pipe 1510 and the coolant is large, and the cooling efficiency of the coolant is improved as compared with the metal rod.
Further, the liquid outlet device 1000 further comprises a liquid supplementing filter screen. The fluid infusion screen is attached to the bottom end of the metal tube 1510. The controller 3000 controls the semiconductor refrigerator 1520 to cool down the metal pipe 1510 according to the opened state of the solenoid valve 1620.
Impurities in the fluid replacement tank 1630 can be prevented from entering the reservoir 1100 by the fluid replacement filter screen. In the process of replenishing, the semiconductor refrigerator 1520 cools the replenished cooling liquid, so that the condition that the temperature of the liquid tank 1100 is higher due to the too high temperature of the cooling liquid in the liquid replenishing tank 1630 is avoided.
Claims (10)
1. The charging gun cooling system is characterized by comprising a liquid outlet device and a liquid return cooling device;
the liquid outlet device comprises a liquid storage tank, a pump, a first pipeline and a liquid outlet water collecting and distributing device, wherein the liquid storage tank is used for containing cooling liquid, a liquid inlet end of the pump is connected with the liquid storage tank so as to extract the cooling liquid in the liquid storage tank, a first end of the first pipeline is connected with a liquid outlet end of the pump, the liquid outlet water collecting and distributing device is connected with a second end of the first pipeline so as to receive the cooling liquid from the first pipeline, and at least one liquid outlet connector is arranged on the liquid outlet water collecting and distributing device and is used for being connected with a charging gun so as to enable the cooling liquid to flow out to the charging gun;
the liquid return cooling device comprises a liquid return water collecting and distributing device, a micro-channel radiator, a fan, a drainage tube, an external filter and a semiconductor refrigerating piece, wherein at least one liquid return connector is arranged on the liquid return water collecting and distributing device and is connected with a charging gun so as to receive cooling liquid passing through the charging gun, the micro-channel radiator is communicated with the liquid return water collecting and distributing device so as to receive the cooling liquid from the liquid return water collecting and distributing device and cool the cooling liquid, the fan faces the micro-channel radiator so as to blow or suck air to the micro-channel radiator, a first end of the drainage tube is connected with the micro-channel radiator, a second end of the drainage tube is connected with the liquid storage box so as to inject the cooling liquid into the liquid storage box, the external filter is arranged outside the liquid storage box, two ends of the external filter are connected with the drainage tube, the external filter comprises a metal shell and a detachable filter core contained in the metal shell, and the semiconductor refrigerating piece is connected with the metal shell so as to cool the metal shell.
2. The charge gun cooling system of claim 1 wherein the tapping means further comprises:
a temperature detector extending into an interior of the external filter to test a first temperature of the coolant within the external filter,
and the controller is connected with the temperature detector and the semiconductor refrigerating piece and used for controlling the semiconductor refrigerating piece to start according to the fact that the first temperature detected by the temperature detector exceeds a first preset temperature so as to cool the metal shell.
3. The charge gun cooling system of claim 2 wherein,
the liquid return cooling device further comprises a liquid return pressure sensor and a liquid return temperature sensor, wherein the liquid return pressure sensor is connected with the liquid return water collecting and distributing device so as to test the pressure of the cooling liquid in the liquid return water collecting and distributing device, and the liquid return temperature sensor is connected with the liquid return water collecting and distributing device and is spaced from the liquid return pressure sensor so as to test the second temperature of the cooling liquid in the liquid return water collecting and distributing device;
the liquid outlet device further comprises a liquid outlet pressure sensor and a liquid outlet temperature sensor, wherein the liquid outlet pressure sensor is connected with the liquid outlet water collecting and distributing device so as to test the pressure of the cooling liquid in the liquid outlet water collecting and distributing device, and the liquid outlet temperature sensor is connected with the liquid outlet water collecting and distributing device and is spaced apart from the liquid outlet pressure sensor so as to test the third temperature of the cooling liquid in the liquid outlet water collecting and distributing device.
4. The charge gun cooling system of claim 3 wherein the microchannel heat sink comprises:
the micro-channel radiator is connected with the liquid return collecting and distributing device through the lower collecting pipe;
the flat pipes are vertically arranged and are arranged at intervals, and the bottom ends of the flat pipes are connected with the lower collecting pipe;
the upper collecting pipe is connected to the top ends of all the flat pipes, the microchannel radiator is connected with the first end of the drainage pipe through the upper collecting pipe, and the cooling liquid can flow from the lower collecting pipe to the upper collecting pipe through a plurality of the flat pipes;
the fins are arranged between two adjacent flat tubes respectively.
5. The charge gun cooling system according to claim 4, wherein the fan is disposed behind the microchannel heat sink, and the wind direction formed by rotation of the fan is from front to back, the liquid return cooling device further comprises an atomizing device on an upstream side of the microchannel heat sink to spray water mist to the microchannel heat sink, the atomizing device comprising:
the mist box is vertically arranged in front of the micro-channel radiator and is a preset distance away from the micro-channel radiator, and a plurality of mist holes which are arranged at intervals are formed in one surface facing the micro-channel radiator;
and the atomizer is communicated with the mist box so as to provide mist to the mist box.
6. The charge gun cooling system of claim 5 wherein,
the liquid return cooling device also comprises a temperature measuring instrument which is used for testing the fourth temperature of the flat tube,
the controller is connected with the thermometer, the liquid return temperature sensor and the atomizer, and when the temperature difference between the second temperature and the fourth temperature is smaller than a preset temperature difference and the second temperature exceeds a second preset temperature, the atomizer is controlled to start so as to spray the mist.
7. The charge gun cooling system of claim 3 wherein the tapping means further comprises:
the metal piece is inserted into the liquid storage tank from the outside of the liquid storage tank;
the semiconductor refrigerator is connected with one end of the metal piece, which is positioned outside;
the controller is also connected with the liquid outlet temperature sensor and the semiconductor refrigerator, so as to control the semiconductor refrigerator to cool the metal piece according to the fact that the third temperature detected by the liquid outlet temperature sensor is larger than a third preset temperature.
8. The charge gun cooling system of claim 7 wherein the tapping means further comprises:
the liquid level sensor is arranged in the liquid storage tank at the detection end, so that the liquid level of the cooling liquid contained in the liquid storage tank is detected.
9. The cooling system of the charging gun according to claim 8, wherein the metal member is a metal pipe which is vertically arranged and has both ends open, a bottom end of the metal pipe is arranged adjacent to a bottom of the liquid storage tank,
the liquid outlet device further comprises:
a liquid supplementing pipe, a first end of the liquid supplementing pipe is connected with the metal pipe,
the fluid infusion box is connected with the second end of the fluid infusion pipe through an electromagnetic valve,
the controller is also connected with the liquid level sensor and the electromagnetic valve, so as to control the electromagnetic valve to be opened according to the fact that the liquid level detected by the liquid level sensor is lower than a first preset liquid level, so as to supplement the cooling liquid to the liquid storage tank through the liquid supplementing tank, the liquid supplementing pipe and the metal pipe, and control the electromagnetic valve to be closed according to the fact that the liquid level of the cooling liquid detected by the liquid level sensor is higher than a second preset liquid level.
10. The charge gun cooling system of claim 9 wherein the tapping means further comprises:
the fluid infusion filter screen is connected with the bottom end of the metal pipe,
and the controller controls the semiconductor refrigerator to cool the metal pipe according to the opening state of the electromagnetic valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310798636.4A CN116940065A (en) | 2023-07-03 | 2023-07-03 | Charging gun cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310798636.4A CN116940065A (en) | 2023-07-03 | 2023-07-03 | Charging gun cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116940065A true CN116940065A (en) | 2023-10-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310798636.4A Pending CN116940065A (en) | 2023-07-03 | 2023-07-03 | Charging gun cooling system |
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| Country | Link |
|---|---|
| CN (1) | CN116940065A (en) |
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- 2023-07-03 CN CN202310798636.4A patent/CN116940065A/en active Pending
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