CN116930556A - Socket for testing electrical components - Google Patents

Socket for testing electrical components Download PDF

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Publication number
CN116930556A
CN116930556A CN202210368805.6A CN202210368805A CN116930556A CN 116930556 A CN116930556 A CN 116930556A CN 202210368805 A CN202210368805 A CN 202210368805A CN 116930556 A CN116930556 A CN 116930556A
Authority
CN
China
Prior art keywords
probe
socket
electrode
electrical component
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210368805.6A
Other languages
Chinese (zh)
Inventor
安住玲雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enplas Corp
Original Assignee
Enplas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enplas Corp filed Critical Enplas Corp
Priority to CN202210368805.6A priority Critical patent/CN116930556A/en
Publication of CN116930556A publication Critical patent/CN116930556A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The embodiment of the application provides a socket for testing an electrical component, which comprises the following components: the socket comprises a socket body, wherein a first probe accommodating part and a second probe accommodating part are arranged in the socket body, a first conductive layer is arranged on the inner wall of the first probe accommodating part, a groove is formed in the bottom of the socket body and communicated with the second probe accommodating part, and a second conductive layer is arranged on the wall of the groove; the contact probe comprises a grounding probe and a signal probe, the grounding probe is accommodated in the first probe accommodating part, the signal probe is accommodated in the second probe accommodating part, and a space is arranged between the signal probe and the second conductive layer; the base plate, the base plate sets up in the bottom of socket body, and the base plate includes insulating layer and first through electrode, and the one end of first through electrode contacts with signal probe's first end, and first through electrode is provided with the accommodation area in the one side that is close to the socket body, and accommodation area is used for holding signal probe's first end.

Description

Socket for testing electrical components
Technical Field
The application relates to the technical field of electrical component testing, in particular to a socket for electrical component testing.
Background
In the production of electrical components such as IC (Integrated Circuit ) packages, it is necessary to perform performance tests thereon using associated test equipment. The test equipment typically includes a socket that is electrically connected to another electrical component, such as a wiring substrate.
A socket in the related art comprises a socket body and a contact probe, wherein a containing part capable of containing a first electric component is formed on the socket body, a probe containing hole is formed on the socket body, and the contact probe is contained in the probe containing hole. The contact probe is made of metal, one end of the contact probe is used for contacting with the first electric component, and the other end of the contact probe is used for contacting with the second electric component, so that electric connection between the first electric component and the second electric component is established.
The contact probes are divided into a grounding probe and a signal probe, a conductive layer is arranged on the hole wall of a probe accommodating hole for accommodating the grounding probe, and the grounding probe is connected with the conductive layer and grounded. The signal probe is used for transmitting a test signal, and the contact part of the signal probe and the socket body is made of insulating materials so as to prevent leakage current. However, the conductive layer has a certain influence on the high-frequency characteristic of the signal probe, and a certain distance is arranged between the signal probe and the grounding probe, so that the distance between the signal probe and the conductive layer is larger, and further the high-frequency characteristic of the signal probe is less ideal, and the reliability of electrical test is poor.
Disclosure of Invention
An object of an embodiment of the present application is to provide a socket for electrical component testing to improve the high frequency characteristics of a signal probe. The specific technical scheme is as follows:
the embodiment of the application provides a socket for testing an electrical component, which comprises a socket body, wherein a first probe accommodating part and a second probe accommodating part are arranged in the socket body, a first conductive layer is arranged on the inner wall of the first probe accommodating part, a groove is arranged at the bottom of the socket body, the groove is communicated with the second probe accommodating part, and a second conductive layer is arranged on the wall of the groove; the contact probe comprises a grounding probe and a signal probe, the grounding probe is accommodated in the first probe accommodating part, the signal probe is accommodated in the second probe accommodating part, and a distance is arranged between the signal probe and the second conductive layer; the base plate, the base plate sets up the bottom of socket body, the base plate includes the insulating layer and installs first through electrode on the insulating layer, the one end of first through electrode with signal probe's first end contact, first through electrode is being close to one side of socket body is provided with the accommodation area, the accommodation area is used for holding signal probe's first end.
In the embodiment of the application, a first probe accommodating part and a second probe accommodating part are arranged in the socket body, wherein the first probe accommodating part is used for accommodating a grounding probe, the second probe accommodating part is used for accommodating a signal probe, a first conductive layer is arranged on the inner wall of the first probe accommodating part, and the grounding probe is contacted with the first conductive layer and grounded. The bottom of socket body is provided with the recess, and second probe accomodates portion and recess intercommunication for a part of signal probe is located second probe accomodate portion, and another part is located the recess. The cell wall of the recess is provided with the second conductive layer, is provided with the interval between signal probe and the second conductive layer to avoid producing leakage current. Compared with the first conductive layer, the second conductive layer is arranged on the wall of the groove, so that the distance between the second conductive layer and the signal probe is smaller, and further, in the electrical test process, the high-frequency characteristic of the signal probe is improved, and the reliability of the electrical test is improved.
In addition, in the above-described structure, the second probe housing portion communicates with the groove, meaning that the length of the second probe housing portion is shortened, and since the second probe housing portion is used for guiding the axial movement of the signal probe, the length of the second probe housing portion is shortened, so that the guiding action of the second probe housing portion on the signal probe is weakened, thereby causing the first end of the signal probe to be easily skewed. In order to reduce the situation that the signal probe is easy to skew when the high-frequency characteristic of the signal probe is improved, in the embodiment of the application, the socket body further comprises a substrate, the substrate comprises an insulating layer and a first through electrode arranged on the insulating layer, one end of the first through electrode is in contact with the first end of the signal probe, and the electrical connection between the signal probe and the second electrical component is realized by utilizing the conductive performance of the first through electrode. The first through electrode is fixed on the insulating layer to prevent leakage current. The first through electrode is provided with the accommodation area in the one side that is close to the socket body, and the accommodation area is used for holding the first end of signal probe, is limited the range of motion of first end of signal probe through setting up the accommodation area to make signal probe be in the more ideal vertical state, reduce the signal probe that appears when improving signal probe's high frequency characteristic and warp the condition easily, improve electrical test's reliability.
In some embodiments of the present application, the first through electrode includes a first contact portion, a second contact portion, and a conductive connector penetrating the insulating layer, the first contact portion being disposed on a side of the conductive connector near the socket body, the second contact portion being disposed on a side of the conductive connector remote from the socket body.
In some embodiments of the present application, the first contact portion includes a first flat plate and protrusions disposed on the first flat plate, the first flat plate is used for contacting with the signaling probes, the protrusions are provided in plurality, the distances between the protrusions and the signaling probes are equal, and the accommodating area is defined by one side, close to the signaling probes, of the protrusions.
In some embodiments of the application, the shape of the side of the protuberance adjacent to the signaling probe is adapted to the shape of the end of the signaling probe.
In some embodiments of the present application, the first contact portion includes a first flat plate, a limit groove is disposed on the first flat plate, and the receiving area is formed by the limit groove.
In some embodiments of the application, the limit slot extends through the first plate and to the conductive connector.
In some embodiments of the application, the limiting slot extends through the first plate, the conductive connector, and the second contact portion to allow the signaling probe to directly contact the second electrical component.
In some embodiments of the application, the substrate further comprises a second through electrode mounted on the insulating layer, one end of the second through electrode being in contact with the first end of the ground probe.
In some embodiments of the application, the second through electrode is provided with a receiving area at a side close to the socket body, the receiving area being for receiving the first end of the ground probe.
In some embodiments of the present application, the socket body includes a first body portion and a second body portion, the first body portion is located at an upper portion of the socket body, the second body portion is located at a lower portion of the socket body, the groove is located at the second body portion and penetrates the second body portion, the first probe receiving portion penetrates the first body portion and the second body portion, and the second probe receiving portion penetrates the first body portion.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the application, and other embodiments may be obtained according to these drawings to those skilled in the art.
Fig. 1 is a schematic structural diagram of a socket according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of a receptacle according to one embodiment of the present application;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a cross-sectional view of a receptacle according to another embodiment of the present application;
fig. 5 is an enlarged view of a portion B of fig. 4.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by the person skilled in the art based on the present application are included in the scope of protection of the present application.
As described in the background art, in the related art, the contact probes are divided into the ground probes and the signal probes, the conductive layer is provided on the wall of the probe receiving hole receiving the ground probes, and the ground probes are connected to the conductive layer and grounded. The signal probe is used for transmitting a test signal, and the contact part of the signal probe and the socket body is made of insulating materials so as to prevent leakage current. However, the conductive layer may have a certain influence on the high frequency characteristic of the signal probe, and a certain distance is provided between the signal probe and the ground probe, so that the distance between the signal probe and the conductive layer is larger, and the high frequency characteristic of the signal probe is less than ideal.
Aiming at the technical problem, the embodiment of the application provides a socket for testing an electrical component, which is used for improving the high-frequency characteristic of a signal probe so as to improve the reliability of the electrical test.
In an embodiment of the application, the electrical component includes, but is not limited to, an IC package or a semiconductor package. In some embodiments, the IC package is, for example, a BGA (Ball Grid Array) having a plurality of Ball terminals arranged in a Grid pattern on a lower surface thereof and protruding downward. When the electrical test is performed, the BGA is placed in the contact accommodating portion of the socket body, so that the plurality of ball terminals are electrically contacted with the contact accommodating portion, and further, the electrical connection with the second electrical component (such as the wiring substrate) is realized through the contact probe. In this state, performance testing of the BGA may be performed. The content of the performance test includes, but is not limited to, electrical performance test (such as voltage, current, frequency and other test) and electrical reliability test (such as anti-magnetic, antistatic, anti-interference and other test).
As shown in fig. 1 to 5, the embodiment of the present application provides a socket 10 for electrical component testing, the socket 10 including a socket body 100, contact probes 200, and a substrate 300. Wherein, the inside of socket body 100 is provided with first probe portion 101 and second probe portion 102 that accomodates, and the inner wall of first probe portion 101 is provided with first conducting layer 104, and the bottom of socket body 100 is provided with recess 103, and recess 103 communicates with second probe portion 102, and the cell wall of recess 103 is provided with second conducting layer 107. The contact probe 200 includes a ground probe 220 and a signal probe 210, the ground probe 220 is accommodated in the first probe accommodating portion 101, the signal probe 210 is accommodated in the second probe accommodating portion 102, and a space is provided between the signal probe 210 and the second conductive layer 107; the substrate 300 is disposed at the bottom of the socket body 100, the substrate 300 includes an insulating layer 320 and a first through electrode 310 mounted on the insulating layer 320, one end of the first through electrode 310 contacts with the first end 211 of the signal probe 210, and the first through electrode 310 is provided with a receiving area at a side close to the socket body 100, the receiving area being used for receiving the first end 211 of the signal probe 210.
In the embodiment of the present application, the socket body 100 is internally provided with a first probe accommodating part 101 and a second probe accommodating part 102, wherein the first probe accommodating part 101 is used for accommodating a ground probe 220, the second probe accommodating part 102 is used for accommodating a signal probe 210, the inner wall of the first probe accommodating part 101 is provided with a first conductive layer 104, and the ground probe 220 is in contact with the first conductive layer 104 and grounded. The bottom of the socket body 100 is provided with a groove 103, and the second probe receiving part 102 communicates with the groove 103 such that a part of the signal probe 210 is located in the second probe receiving part 102 and another part is located in the groove 103. The second conductive layer 107 is disposed on the wall of the groove 103, and a space is provided between the signal probe 210 and the second conductive layer 107 to avoid leakage current. Compared with the first conductive layer 104, the second conductive layer 107 is arranged on the wall of the groove 103, so that the distance between the second conductive layer 107 and the signal probe 210 is smaller, and further, in the electrical test process, the high-frequency characteristic of the signal probe 210 is improved, and the reliability of the electrical test is improved.
In addition, in the above-described configuration, the second probe housing portion 102 communicates with the groove 103, meaning that the length of the second probe housing portion 102 is shortened, and since the second probe housing portion 102 serves to guide the axial movement of the signal probe 210, the length of the second probe housing portion 102 is shortened, so that the guide effect of the second probe housing portion 102 on the signal probe 210 is weakened, thereby causing the first end 211 of the signal probe 210 to be easily skewed. In order to reduce the situation that the signal probe 210 is easy to skew when improving the high frequency characteristic of the signal probe 210, in the embodiment of the present application, the socket body 100 further includes a substrate 300, the substrate 300 includes an insulating layer 320 and a first through electrode 310 mounted on the insulating layer 320, one end of the first through electrode 310 contacts with the first end 211 of the signal probe 210, and the electrical connection between the signal probe 210 and the second electrical component is achieved by using the electrical conductivity of the first through electrode 310. The first through electrode 310 is fixed on the insulating layer 320 to prevent leakage current. The first through electrode 310 is provided with a receiving area at a side close to the socket body 100, the receiving area is used for receiving the first end 211 of the signal probe 210, and the moving range of the first end 211 of the signal probe 210 is limited by the receiving area, so that the signal probe 210 is in a more ideal vertical state, the situation that the signal probe 210 is easy to skew when the high-frequency characteristic of the signal probe 210 is improved is reduced, and the reliability of the electrical test is improved.
The bottom of the socket body 100 refers to an end of the socket body 100 for contacting a second electrical component (e.g., a wiring substrate). The first probe accommodating part 101 and the second probe accommodating part 102 are hollow structures formed inside the socket body 100, respectively, the first probe accommodating part 101 is used for providing accommodating space for the ground probe 220, and the second probe accommodating part 102 is used for providing accommodating space for the signal probe 210. Specifically, the first and second probe receiving parts 101 and 102 may be receiving holes or receiving grooves formed inside the socket body 100. The substrate 300 may be a flexible board or a rigid board.
In some embodiments of the present application, the first through electrode 310 includes a first contact portion 311, a second contact portion 312, and a conductive connector 313, the conductive connector 313 is disposed through the insulating layer 320, the first contact portion 311 is disposed on a side of the conductive connector 313 near the socket body 100, and the second contact portion 312 is disposed on a side of the conductive connector 313 far from the socket body 100. In the embodiment of the present application, the conductive connector 313 is provided, so that the first through electrode 310 and the insulating layer 320 are conveniently installed; by providing the first contact portion 311 at an end of the conductive connector 313 remote from the socket body 100, the first contact portion 311 is brought into contact with the signal probe 210; the second contact portion 312 is provided at one end of the conductive connector 313 adjacent to the socket body 100, so that the second contact portion 312 contacts the second electrical component, thereby electrically connecting the signal probe 210 and the second electrical component. It is understood that the first contact portion 311, the second contact portion 312, and the conductive connector 313 of the first through electrode 310 are all made of conductive materials. Preferably, the first contact portion 311, the second contact portion 312, and the conductive connector 313 of the first through electrode 310 are all made of copper, and surfaces of the first contact portion 311 and the second contact portion 312 are provided with a gold plating layer or a nickel plating layer.
In some embodiments of the present application, the first contact part 311 includes a first flat plate 3111 and protrusions 3112 disposed on the first flat plate 3111, the first flat plate 3111 is for contacting the signal probes 210, the protrusions 3112 are provided in plurality, distances from each protrusion 3112 to the signal probes 210 are equal, and the receiving area is defined by one side of the protrusions 3112 near the signal probes 210. In an embodiment of the present application, the signaling probe 210 is connected to the first through electrode 310 by contacting the first plate 3111. The first end 211 of the signaling probe 210 is received in a receiving area surrounded by the plurality of protrusions 3112, and thus, the first end 211 of the signaling probe 210 is restricted to the receiving area, thereby reducing a tilting phenomenon of the signaling probe 210 and improving reliability of an electrical test.
As shown in fig. 2 and 3, in some embodiments of the present application, the shape of the side of the protrusion 3112 near the signaling probe 210 is adapted to the shape of the first end 211 of the signaling probe 210. Thereby, the defining action of the receiving area on the first end 211 of the signaling probe 210 can be enhanced, so that the signaling probe 210 is maintained in a desired vertical state. In a specific embodiment, the first end 211 of the signaling probe 210 is terminated by a table, the side of the protrusion 3112 near the signaling probe 210 is shaped as a slope, and the slope of the protrusion 3112 is adapted to the side of the table, so as to further limit the movement of the first end 211 of the signaling probe 210 in the receiving area, and maintain the signaling probe 210 in a desired vertical state.
In some embodiments of the application, the protrusions 3112 are vertebral bodies, cylinders, or tables. Thus, the protrusions 3112 are regular in shape, and convenient to process.
In some embodiments of the application, the number of protrusions 3112 is two, three or more.
As shown in fig. 4 and 5, in other embodiments of the present application, the first contact portion 311 includes a first plate 3111, and a limiting slot 314 is provided on the first plate 3111, and the receiving area is formed by the limiting slot 314. In the embodiment of the present application, the connection between the signal probe 210 and the first through electrode 310 is achieved by providing the limiting groove 314 on the first plate 3111 and positioning the first end 211 of the signal probe 210 in the limiting groove 314. The movement range of the first end 211 of the signal probe 210 is limited by the limiting groove 314, so that the skew condition of the signal probe 210 is improved, and the reliability of the electrical test is improved.
In some embodiments of the present application, the limiting groove 314 penetrates the first plate 3111 and extends to the conductive connector 313. Thus, the dimension of the limiting groove 314 in the axial direction of the signal probe 210 is larger, so that the limiting effect of the limiting groove 314 on the first end 211 of the signal probe 210 can be further enhanced.
In other embodiments of the present application, the limiting slot 314 extends through the first plate 3111, the conductive connector 313, and the second contact 312, so that the signal probe 210 directly contacts the second electrical component. Accordingly, when the size of the first through electrode 310 is small, the size of the limiting groove 314 in the axial direction of the signal probe 210 is increased, and the limiting effect of the limiting groove 314 on the first end 211 of the signal probe 210 is ensured. In addition, the limiting groove 314 penetrates through the first flat plate 3111, the conductive connector 313 and the second contact portion 312, so that the limiting groove 314 is convenient to process. It will be appreciated that since the signal probe 210 is in direct contact with the second electrical component, no hole site is provided at the portion of the second electrical component in contact with the signal probe 210 to avoid sagging of the signal probe 210.
As shown in fig. 2 to 5, in some embodiments of the present application, the substrate 300 further includes a second penetration electrode 330 mounted on the insulating layer 320, one end of the second penetration electrode 330 being in contact with the first end 221 of the ground probe 220. By this, by utilizing the conductive performance of the second penetration electrode 330, the electrical connection of the ground probe 220 and the second electrical component is achieved.
As shown in fig. 2 to 5, in some embodiments of the present application, the second penetration electrode 330 is provided with a receiving area at a side near the socket body 100, the receiving area being for receiving the first end 221 of the ground probe 220. In the embodiment of the present application, the moving range of the first end 221 of the ground probe 220 is defined by providing the receiving area, so that the ground probe 220 is in a more ideal vertical state.
Further, the second through electrode 330 has the same structure as the first through electrode 310. Therefore, the first through electrode 310 and the second through electrode 330 are conveniently processed, the processing cost is reduced, and the first through electrode 310 and the second through electrode 330 are conveniently fixed with the substrate 300.
In some embodiments of the present application, the socket body 100 includes a first body 105 and a second body 106, the first body 105 is located at an upper portion of the socket body 100, the second body 106 is located at a lower portion of the socket body 100, the groove 103 is located at the second body 106 and penetrates the second body 106, the first probe receiving portion 101 penetrates the first body 105 and the second body 106, and the second probe receiving portion 102 penetrates the first body 105. In the embodiment of the application, the first body part 105 and the second body part 106 are arranged, so that the groove 103 is positioned on the second body part 106 and penetrates through the second body part 106, thereby facilitating the processing of the groove 103; the second probe accommodating portion 102 is inserted through the first body portion 105, so that the second probe accommodating portion 102 is conveniently machined, and finally the whole socket body 100 is simpler to machine and manufacture.
In some embodiments of the application, the second contact 312 comprises a second plate. The first through electrode 310 can be stably mounted on the insulating layer 320 by the clamping action of the first plate 3111 and the second plate on the insulating layer 320.
In some embodiments of the present application, the first contact portion 311, the second contact portion 312, and the conductive connector 313 are in a unitary structure. Therefore, the number of assembly parts can be reduced, the assembly of the first through electrode 310 is convenient, the structure of the first through electrode 310 is stable, and the electric connection effect of the signal probe 210 and the second electric component is ensured.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims (10)

1. A socket for electrical component testing, comprising:
the socket comprises a socket body, wherein a first probe accommodating part and a second probe accommodating part are arranged in the socket body, a first conductive layer is arranged on the inner wall of the first probe accommodating part, a groove is formed in the bottom of the socket body and communicated with the second probe accommodating part, and a second conductive layer is arranged on the wall of the groove;
the contact probe comprises a grounding probe and a signal probe, the grounding probe is accommodated in the first probe accommodating part, the signal probe is accommodated in the second probe accommodating part, and a distance is arranged between the signal probe and the second conductive layer;
the base plate, the base plate sets up the bottom of socket body, the base plate includes the insulating layer and installs first through electrode on the insulating layer, the one end of first through electrode with signal probe's first end contact, first through electrode is being close to one side of socket body is provided with the accommodation area, the accommodation area is used for holding signal probe's first end.
2. The socket for electrical component testing according to claim 1, wherein the first through electrode includes a first contact portion, a second contact portion, and a conductive connector penetrating the insulating layer, the first contact portion being disposed on a side of the conductive connector near the socket body, the second contact portion being disposed on a side of the conductive connector remote from the socket body.
3. The socket for electrical component testing according to claim 2, wherein the first contact portion includes a first flat plate for contacting the signal probes and a plurality of projections provided on the first flat plate, each of the projections being equidistant from the signal probes, and the receiving area is defined by a side of the plurality of projections adjacent to the signal probes.
4. A socket for electrical component testing according to claim 3, wherein the shape of the side of the protrusion adjacent to the signaling probe is adapted to the shape of the first end of the signaling probe.
5. The socket for electrical component testing according to claim 2, wherein the first contact portion comprises a first flat plate on which a limit groove is provided, and the accommodation area is constituted by the limit groove.
6. The socket for electrical component testing according to claim 5, wherein the limit slot extends through the first plate and to the conductive connector.
7. The socket for electrical component testing according to claim 5, wherein the limiting slot extends through the first plate, the conductive connector, and the second contact portion to allow the signal probe to directly contact a second electrical component.
8. The socket for electrical component testing according to claim 1, wherein the substrate further comprises a second through electrode mounted on the insulating layer, one end of the second through electrode being in contact with the first end of the ground probe.
9. The socket for electrical component testing according to claim 8, wherein the second through electrode is provided with a receiving area on a side close to the socket body, the receiving area being for receiving the first end of the ground probe.
10. The socket for electrical component testing according to claim 1, wherein the socket body includes a first body portion and a second body portion, the first body portion being located at an upper portion of the socket body, the second body portion being located at a lower portion of the socket body, the recess being located at and extending through the second body portion, the first probe receiving portion extending through the first body portion and the second body portion, the second probe receiving portion extending through the first body portion.
CN202210368805.6A 2022-04-08 2022-04-08 Socket for testing electrical components Pending CN116930556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210368805.6A CN116930556A (en) 2022-04-08 2022-04-08 Socket for testing electrical components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210368805.6A CN116930556A (en) 2022-04-08 2022-04-08 Socket for testing electrical components

Publications (1)

Publication Number Publication Date
CN116930556A true CN116930556A (en) 2023-10-24

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CN202210368805.6A Pending CN116930556A (en) 2022-04-08 2022-04-08 Socket for testing electrical components

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