CN116914397A - High-directivity multilayer dielectric substrate coupler - Google Patents
High-directivity multilayer dielectric substrate coupler Download PDFInfo
- Publication number
- CN116914397A CN116914397A CN202310872674.XA CN202310872674A CN116914397A CN 116914397 A CN116914397 A CN 116914397A CN 202310872674 A CN202310872674 A CN 202310872674A CN 116914397 A CN116914397 A CN 116914397A
- Authority
- CN
- China
- Prior art keywords
- port
- transmission line
- dielectric substrate
- coupling
- coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 230000005540 biological transmission Effects 0.000 claims abstract description 88
- 238000010168 coupling process Methods 0.000 claims abstract description 81
- 238000005859 coupling reaction Methods 0.000 claims abstract description 81
- 230000008878 coupling Effects 0.000 claims abstract description 80
- 238000002955 isolation Methods 0.000 claims abstract description 35
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 230000000694 effects Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000002708 enhancing effect Effects 0.000 claims description 3
- 238000013461 design Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
Landscapes
- Waveguides (AREA)
Abstract
The invention discloses a high-directivity multilayer dielectric substrate coupler, which belongs to the technical field of electronics and comprises a dielectric substrate body, an external electrode and an internal conductor; the dielectric substrate body is formed by overlapping a plurality of layers of dielectric substrates, and the external electrode comprises a port electrode and a grounding electrode; the inner conductor comprises a first transmission line, a second transmission line, a counteracting rod, a grounding strip and a conductor column; the two transmission lines are in a broadside coupling mode; the invention creatively provides a counteracting rod structure on the basis of the traditional coupler, the counteracting rod is coupled with the second transmission line near the coupling port in parallel to generate signals, the signals are coupled with the second transmission line near the isolation port in parallel through the counteracting rod to generate signals, and finally, the signals and the leaked signals are counteracted in opposite phase, so that the isolation degree is effectively improved, and the directivity is further improved; the grounding strip and the conductor post adjust the coupling degree by directly influencing the size of the coupling window of the first transmission line and the second transmission line; by three-dimensional wiring of the multilayer dielectric substrate, device miniaturization can be achieved.
Description
Technical Field
The invention belongs to the technical field of electronics, and particularly relates to a high-directivity multilayer dielectric substrate coupler.
Background
The coupler is an important passive device in the radio frequency circuit, is a non-equal power distribution device and has the main function of extracting a part of signals from the signal main channel. A good coupler not only requires small standing waves and low loss, but also has the characteristics of high directivity and the like, and the coupling degree meets the design index.
As shown in fig. 1, the prototype circuit of the coupler is two transmission lines that are close to each other, and coupling occurs when the two transmission lines are close. The two transmission lines are respectively connected with an input port, a through port, an isolation port and a coupling port; the majority of the signal at the input of the coupler flows into the pass-through port, a portion of the signal will be coupled to the coupling port, and a portion will leak to the isolation port. Although in theory the isolated port has no signal, the greater the amount of leakage, the worse the isolation due to signal leakage that is unavoidable through the effects of non-ideal factors such as coupling port and pass-through port reflections, transmission line bends, end vias, line radiation, etc. The directivity of the coupler is obtained by subtracting the coupling degree from the isolation degree; the conventional coupler generally adopts a coupling transmission line mode, and when a weak coupler is required to be designed, the isolation cannot be improved only by a method of repairing a prototype circuit, so that high directivity is difficult to realize. In addition, the miniaturization design of the microwave device has become a development trend, the layout design of the multi-layer dielectric substrate is an effective way for realizing the miniaturization design, and the transmission line or the reactance element can be integrated in three dimensions by the technology, so that the purpose of miniaturization is realized.
Disclosure of Invention
In view of the above, the present invention provides a high-directivity multi-layer dielectric substrate coupler, in which a part of signals of a coupling port are led out through a cancellation rod, and the led out signals and signals leaked from an isolation port are reversely cancelled, so that isolation is effectively improved, directivity of the low-directivity multi-layer dielectric substrate coupler is further improved, and miniaturization is realized through three-dimensional wiring of the multi-layer dielectric substrate.
The invention is realized by the following technical scheme:
a highly directional multilayer dielectric substrate coupler comprising: a dielectric substrate body, an external electrode, and an internal conductor;
the dielectric substrate body is formed by overlapping a plurality of layers of dielectric substrates;
the external electrode is printed on the outer surface of the dielectric substrate body and comprises a grounding electrode and four port electrodes; the four port electrodes are not electrically connected with the grounding electrode; the coupler is provided with four ports, namely an input port, a straight-through port, a coupling port and an isolation port;
the inner conductor includes: the device comprises a counteracting rod, a first transmission line, a second transmission line and more than two grounding bars; the counteracting rod is arranged on the medium substrate; the first transmission line and the second transmission line are respectively arranged on two medium substrates of different layers; more than two grounding strips are divided into a plurality of groups, and the grounding strips of different groups are respectively arranged on the dielectric substrates of different layers;
the two ends of the first transmission line are respectively connected with an input port and a through port of the coupler, the two ends of the second transmission line are respectively connected with a coupling port and an isolation port of the coupler, and the first transmission line and the second transmission line are in a broadside coupling mode;
the counteracting rod is made of a conductor material, acts between the coupling port and the isolation port, and is used for counteracting the signal leaked by the isolation port, so that the directivity is improved;
the two ends of each grounding strip are connected with the grounding electrode and are positioned between the first transmission line and the second transmission line for adjusting the coupling degree deviation of the coupler.
Furthermore, the dielectric substrate body is formed by overlapping a plurality of dielectric substrates with different layer thicknesses.
Further, the distance between the two transmission lines is adjusted by adjusting the number of layers of the dielectric substrate.
Further, the distance between the counteracting rod and the second transmission line is smaller than the distance between the counteracting rod and the first transmission line.
Further, two ends of the offset rod are respectively an A end and a B end, wherein the distance between the A end and the isolation port is smaller than the distance between the A end and the coupling port, and the distance between the B end and the coupling port is smaller than the distance between the B end and the isolation port;
the line segment at the end A of the counteracting rod is parallel to the line segment at the isolation port of the second transmission line and generates coupling; the line segment at the end B of the counteracting rod is parallel to the line segment at the coupling port of the second transmission line and generates coupling.
Further, the size of the coupling window of the two transmission lines and the coupling degree between the two transmission lines can be adjusted by changing the position and the line width of the grounding strip;
wherein the position of the grounding bars is the distance between every two adjacent grounding bars in each group of grounding bars or the distance between grounding bars in different groups.
Further, the internal circuit further comprises more than one conductor post; the conductor posts are arranged along the thickness direction of the multilayer dielectric substrate, the grounding strips of different groups are connected through the conductor posts, and the conductor posts are used for enhancing the effect of the grounding strips.
The beneficial effects are that:
(1) The invention relates to a high-directivity multilayer dielectric substrate coupler, which comprises a dielectric substrate body, an external electrode and an internal electrode, wherein the external electrode is printed on the outer surface of the dielectric substrate body, the internal electrode comprises a first transmission line, a second transmission line, a counteracting rod and more than two grounding strips, the first transmission line and the second transmission line adopt broadside coupling modes, two ends of the first transmission line are respectively connected with an input port and a through port, two ends of the second transmission line are respectively connected with a coupling port and an isolation port, the counteracting rod acts between the coupling port and the isolation port, and the grounding strips are positioned between the two transmission lines; the high-directivity multilayer dielectric substrate coupler realizes three-dimensional integration through the multilayer dielectric substrate, and can realize miniaturization of the coupler; the grounding strips of different groups are respectively arranged on the dielectric substrates of different layers and positioned between the first transmission line and the second transmission line, and the coupling degree deviation of the coupler can be adjusted through the grounding strips, so that the coupling degree of the coupler meets the requirement.
(2) The high-directivity multilayer dielectric substrate coupler provided by the invention has the advantages that the dielectric substrate body is formed by superposing a plurality of dielectric substrates with different layer thicknesses, and the coupling degree and the design thickness can be conveniently adjusted by using the dielectric substrates with different layer thicknesses.
(3) According to the high-directivity multilayer dielectric substrate coupler, the line segment at the end A of the counteracting rod is parallel to the line segment at the isolation port of the second transmission line and is coupled, the line segment at the end B of the counteracting rod is parallel to the line segment at the coupling port of the second transmission line and is coupled, a part of signals are generated through parallel coupling of the counteracting rod and the coupling port, the part of signals are transmitted to the isolation port through the counteracting rod and are coupled with the isolation port again, reverse counteracting is carried out between the generated signals and the signals leaked from the isolation port, isolation degree is effectively improved, and directivity is further improved.
(4) According to the high-directivity multilayer dielectric substrate coupler, the position and the line width of the grounding strip can be changed, and the size of the coupling window of the two transmission lines can be controlled by changing the position and the line width of the grounding strip, so that the coupling degree between the two transmission lines is adjusted, and the coupling degree of the coupler is not adjusted.
(5) The high-directivity multilayer dielectric substrate coupler provided by the invention has the advantages that the internal circuit also comprises the conductor column, and the effect of the grounding strip can be enhanced through the conductor column, so that the coupling degree of the coupler is within the design index.
Drawings
FIG. 1 is a circuit diagram of a prototype circuit of a coupler in the background art;
FIG. 2 is a schematic illustration of a package of the present invention;
FIG. 3 is a schematic diagram of a conductor structure according to the present invention;
FIG. 4 is a graph showing the return loss test results of the present invention;
FIG. 5 is a graph showing the results of the insertion loss test of the present invention;
FIG. 6 is a graph showing the coupling degree test results of the present invention;
FIG. 7 is a graph showing the directivity test result of the present invention;
the device comprises a 1-input port, a 2-through port, a 3-coupling port, a 4-isolation port, a 5-grounding electrode, a 6-counteracting rod, a 7-second transmission line, an 8-grounding strip, a 9-conductor column, a 10-first transmission line, an 11-top electrode and a 12-bottom electrode.
Detailed Description
The invention will now be described in detail by way of example with reference to the accompanying drawings.
The embodiment provides a high directivity multilayer dielectric substrate coupler, including: a dielectric substrate body, an external electrode, and an internal conductor;
the dielectric substrate body is formed by overlapping a plurality of layers of dielectric substrates with the same or different layer thicknesses, the dielectric substrate body is formed by overlapping 18 layers of dielectric substrates according to the height of the coupler, and the 18 layers of dielectric substrates are sequentially C01 layers to C18 layers from bottom to top; in the embodiment, a plurality of layers of dielectric substrates with different layer thicknesses are adopted, and the dielectric substrates comprise two thicknesses of 0.044mm and 0.108mm, and as the coupler adopts a broadside coupling mode, the coupling degree can be conveniently adjusted and the design thickness can be conveniently adjusted through overlapping the dielectric substrates with the two thicknesses; the process of the multilayer dielectric substrate can be realized by any multilayer three-dimensional structure, and the miniaturized design of the coupler can be realized by adopting the process of the multilayer dielectric substrate, wherein the dielectric substrate is made of LTCC (low temperature co-fired ceramic) materials in the embodiment;
as shown in fig. 2, the outer surface of the dielectric substrate body is printed with a plurality of solderable metal conductor surfaces, and the solderable metal conductor surfaces form external electrodes 5, which are marked by oblique lines in fig. 2; the external electrode 5 includes: as shown in fig. 2, four port electrodes and ground electrodes 5, each of which is composed of a top electrode 11, a bottom electrode 12 and a side seal, and the four port electrodes and the ground electrodes 5 are spaced apart from each other without electrical connection therebetween;
the high-directivity multilayer dielectric substrate coupler comprises four ports, and four port electrodes respectively correspond to the four ports; the four ports are respectively: input port 1, pass-through port 2, coupled port 3, and isolated port 4; in this embodiment, the solderable metal conductor surface adopts silver, and four port electrodes are respectively arranged at four edges of the dielectric substrate body, and the sides forming the four port electrodes are printed in a semicircular shape;
the inner conductor is disposed within the dielectric substrate body, as shown in fig. 3, and includes: a cancellation bar 6, a plurality of grounding bars 8, a plurality of conductor posts 9, and a pair of coupled lines composed of two transmission lines; the two transmission lines are respectively arranged on medium substrates of different layers in a broadside coupling mode, the distance between the two transmission lines is controlled by adjusting the layer number of the medium substrates (the distance between the two transmission lines is changed by adjusting the layer number of the medium substrates, so that the coupling amount is controlled); let the two transmission lines be a first transmission line 10 and a second transmission line 7, respectively; wherein, two ends of the first transmission line 10 are respectively connected with the input port 1 and the through port 2, and two ends of the second transmission line 7 are respectively connected with the coupling port 3 and the isolation port 4; in this embodiment, the first transmission line 10 is disposed on the dielectric substrate of the C04 th layer, and the second transmission line 7 is disposed on the dielectric substrate of the C14 th layer; the grounding strips 8 are respectively arranged on the dielectric substrates between the C04 layer and the C14 layer and are positioned between the first transmission line 10 and the second transmission line 7; the grounding strips 8 are strip-shaped, and two ends of each grounding strip 8 are connected with the grounding electrode 5 on the side surface of the dielectric substrate body; the grounding strips 8 are divided into a plurality of groups, and the grounding strips 8 of different groups are respectively arranged on two medium substrates of different layers; the grounding strips 8 are used for adjusting the coupling degree of the coupler, the size of the coupling window of the two transmission lines and the coupling degree deviation between the first transmission line 10 and the second transmission line 7 can be adjusted by adjusting the position and the line width of the grounding strips 8, and meanwhile, the isolation degree can be improved to a certain extent; the positions of the grounding bars 8 comprise the distance between every two adjacent grounding bars 8 in each group of grounding bars 8 and the distance between the grounding bars 8 in different groups; the grounding strips 8 of different groups are connected through conductor posts 9; the conductor column 9 is used for enhancing the action effect of the grounding strip 8, so that the coupling degree of the coupler is within the design index; the embodiment comprises three groups of grounding bars 8, and the grounding bars 8 of different groups are respectively positioned on the C07 th layer, the C09 th layer and the C11 th layer; the coupler in the embodiment is a weak coupler, and the coupling index of the coupler, namely the coupling degree, is 30dB;
the counteracting rod 6 is made of a conductor material, and the distance between the counteracting rod 6 and the second transmission line 7 is smaller than the distance between the counteracting rod 6 and the first transmission line 10; the counteracting rod 6 acts between the coupling port 3 and the isolating port 4; the two ends of the counteracting rod 6 are respectively an A end and a B end, wherein the distance between the A end and the isolating port 4 is smaller than the distance between the A end and the coupling port 3, and the distance between the B end and the coupling port 3 is smaller than the distance between the B end and the isolating port 4; the line segment at the end A of the counteracting rod 6 is parallel to the line segment at the isolation port 4 of the second transmission line 7 and generates coupling; the line segment at the end B of the counteracting rod 6 is parallel to the line segment at the coupling port 3 of the second transmission line 7 and generates coupling; when the distance between the line segments of the canceling rod 6 and the second transmission line 7 is closer and the coupling area is longer, the coupling degree is larger; the canceling bar 6 may be located on the dielectric substrate on which the second transmission line 7 is disposed or any dielectric substrate near the second transmission line 7, and in order to prevent interference of other effects and limit the size requirement, the canceling bar 6 is disposed on the C16 layer (not disposed on the same layer as the second transmission line 7) in this embodiment;
the working frequency of the design is 2GHz-4GHz, standing waves are less than 1.2, the coupling degree requirement is 30dB plus or minus 1.5dB, the insertion loss is less than 0.2dB, and the directivity is more than 25dB; as shown in fig. 4 to 7, the parameter indexes of the coupler after the cancel lever 6 is installed, and fig. 4 to 7 sequentially show the return loss, insertion loss, coupling degree, and directivity of the coupler in the present embodiment; the four line segments contained in fig. 4 represent return loss of the four ports, respectively, where S (1, 1) represents return loss of the input port 1, S (2, 2) represents return loss of the pass-through port 2, S (3, 3) represents return loss of the coupling port 3, and S (4, 4) represents return loss of the isolation port 4; as shown in fig. 6, the coupling degree of the coupler is about 30dB, and the coupler belongs to a weak coupling degree coupler; as shown in fig. 7, the directivity of the weak coupling degree coupler is higher than 25dB, and test data show that the electric properties of the coupler are good, and the high directivity of the coupler can be effectively realized by introducing the cancellation lever 6;
in this embodiment, the dielectric substrate is made of LTCC material, and the device package size needs are: the actual dimensions of the coupler were 3.18mm by 2.54mm by 1.3mm.
Working principle:
let S0 be a part of the signal leaked from the isolated port 4 in the circular circuit; the line segment conductor at the end B of the counteracting rod 6 is coupled with the parallel line segment conductor at the coupling port 3 of the second transmission line 7 to generate a coupling signal, and the coupling signal is transmitted to the end A of the counteracting rod 6 through the counteracting rod 6; the end A of the counteracting rod 6 is coupled with a parallel line conductor at the isolating port 4, and a coupling signal is coupled to the isolating port 4, so that the signal at the moment is recorded as S1; the size and the phase of the S1 are adjusted by adjusting the position, the length, the line width and other parameters of the offset rod 6, so that the S1 and the S0 are equal in size and opposite in phase, and offset is realized between the S1 and the S0; wherein the size of S1 is adjusted by adjusting the coupling distance and length of the cancellation bar 6 and the second transmission line 7, and the phase of S1 is adjusted by adjusting the length of the cancellation bar 6.
In summary, the above embodiments are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A highly directional multilayer dielectric substrate coupler, comprising: a dielectric substrate body, an external electrode, and an internal conductor;
the dielectric substrate body is formed by overlapping a plurality of layers of dielectric substrates;
the external electrode is printed on the outer surface of the dielectric substrate body and comprises a grounding electrode and four port electrodes; the four port electrodes are not electrically connected with the grounding electrode; the coupler is provided with four ports, namely an input port, a straight-through port, a coupling port and an isolation port;
the inner conductor includes: the device comprises a counteracting rod, a first transmission line, a second transmission line and more than two grounding bars; the counteracting rod is arranged on the medium substrate; the first transmission line and the second transmission line are respectively arranged on two medium substrates of different layers; more than two grounding strips are divided into a plurality of groups, and the grounding strips of different groups are respectively arranged on the dielectric substrates of different layers;
the two ends of the first transmission line are respectively connected with an input port and a through port of the coupler, the two ends of the second transmission line are respectively connected with a coupling port and an isolation port of the coupler, and the first transmission line and the second transmission line are in a broadside coupling mode;
the counteracting rod is made of a conductor material, acts between the coupling port and the isolation port, and is used for counteracting the signal leaked by the isolation port, so that the directivity is improved;
the two ends of each grounding strip are connected with the grounding electrode and are positioned between the first transmission line and the second transmission line for adjusting the coupling degree deviation of the coupler.
2. The high directivity multilayer dielectric substrate coupler of claim 1, wherein the dielectric substrate body is composed of a stack of dielectric substrates of different layer thicknesses.
3. The highly directional multi-layer dielectric substrate coupler of claim 1 wherein the distance between two of said transmission lines is adjusted by adjusting the number of layers of dielectric substrate.
4. The highly directional multi-layer dielectric substrate coupler of claim 1 wherein the distance of the cancellation lever from the second transmission line is less than the distance of the cancellation lever from the first transmission line.
5. The high directivity multilayer dielectric substrate coupler of claim 4, wherein the two ends of the cancellation lever are respectively an a end and a B end, wherein the distance between the a end and the isolation port is smaller than the distance between the a end and the coupling port, and the distance between the B end and the coupling port is smaller than the distance between the B end and the isolation port;
the line segment at the end A of the counteracting rod is parallel to the line segment at the isolation port of the second transmission line and generates coupling; the line segment at the end B of the counteracting rod is parallel to the line segment at the coupling port of the second transmission line and generates coupling.
6. The high directivity multilayer dielectric substrate coupler according to claim 1, wherein the size of the coupling window of the two transmission lines can be adjusted and the degree of coupling between the two transmission lines can be adjusted by changing the position and the line width of the grounding bar;
wherein the position of the grounding bars is the distance between every two adjacent grounding bars in each group of grounding bars or the distance between grounding bars in different groups.
7. A highly directional multi-layer dielectric substrate coupler according to any of claims 1-6, wherein said internal circuitry further comprises one or more conductor posts; the conductor posts are arranged along the thickness direction of the multilayer dielectric substrate, the grounding strips of different groups are connected through the conductor posts, and the conductor posts are used for enhancing the effect of the grounding strips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310872674.XA CN116914397A (en) | 2023-07-17 | 2023-07-17 | High-directivity multilayer dielectric substrate coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310872674.XA CN116914397A (en) | 2023-07-17 | 2023-07-17 | High-directivity multilayer dielectric substrate coupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116914397A true CN116914397A (en) | 2023-10-20 |
Family
ID=88366250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310872674.XA Pending CN116914397A (en) | 2023-07-17 | 2023-07-17 | High-directivity multilayer dielectric substrate coupler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116914397A (en) |
-
2023
- 2023-07-17 CN CN202310872674.XA patent/CN116914397A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102696145B (en) | Microwave transition device between a microstrip line and a rectangular waveguide | |
| US7755447B2 (en) | Multilayer balun, hybrid integrated circuit module, and multilayer substrate | |
| US7884682B2 (en) | Waveguide to microstrip transducer having a ridge waveguide and an impedance matching box | |
| JP4133747B2 (en) | Input / output coupling structure of dielectric waveguide | |
| US6515556B1 (en) | Coupling line with an uncoupled middle portion | |
| US7161446B2 (en) | Noise filter | |
| KR100309656B1 (en) | Chip type transformer | |
| KR100282274B1 (en) | Transmission circuit using strip line in three dimensions | |
| US9490768B2 (en) | High frequency band pass filter with coupled surface mount transition | |
| US7961064B2 (en) | Directional coupler including impedance matching and impedance transforming attenuator | |
| US5369379A (en) | Chip type directional coupler comprising a laminated structure | |
| US6686812B2 (en) | Miniature directional coupler | |
| JP3791540B2 (en) | Directional coupler | |
| US8044749B1 (en) | Coupler device | |
| US20140306778A1 (en) | Miniature radio frequency directional coupler for cellular applications | |
| US20140176265A1 (en) | High-frequency signal transmission line and electronic device | |
| JP3686736B2 (en) | Dielectric waveguide line and wiring board | |
| US4288761A (en) | Microstrip coupler for microwave signals | |
| JPH10303611A (en) | Coupling structure for high frequency transmission line and multi-layer wiring board having the same | |
| WO2014157031A1 (en) | High-frequency transmission line and electronic device | |
| EP2140547A1 (en) | Rf re-entrant combiner | |
| CN116914397A (en) | High-directivity multilayer dielectric substrate coupler | |
| JPH11308025A (en) | Directional coupler | |
| US20050062557A1 (en) | Laminated ceramic coupler | |
| JP3439973B2 (en) | Branch structure of dielectric waveguide |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |