CN116913832A - Wafer handling device - Google Patents
Wafer handling device Download PDFInfo
- Publication number
- CN116913832A CN116913832A CN202310635500.1A CN202310635500A CN116913832A CN 116913832 A CN116913832 A CN 116913832A CN 202310635500 A CN202310635500 A CN 202310635500A CN 116913832 A CN116913832 A CN 116913832A
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- Prior art keywords
- wafer
- fixing
- block
- handling device
- wafer handling
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003638 chemical reducing agent Substances 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 230000001960 triggered effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 65
- 230000000694 effects Effects 0.000 abstract description 3
- 238000012937 correction Methods 0.000 abstract description 2
- 239000002585 base Substances 0.000 description 10
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to a wafer carrying device which comprises a rotary motion mechanism, a lifting motion mechanism and a horizontal motion mechanism which are respectively used for driving a bearing seat to rotate, lift and move horizontally, and a first fixed block, a second fixed block and a fixed column form six-point support for a wafer, so that the wafer is not easy to damage. The arc surface of the kicking surface of the first fixing block just abuts against the edge of the wafer, the second fixing block and the fixing column abut against the wafer in an inclined plane mode, the wafer naturally has a sliding trend due to the inclined plane, the wafer is easier to abut against the first fixing block, the effect of automatic correction of the position is achieved, and the uniformity of the wafers on different bearing arms is improved.
Description
Technical Field
The application belongs to the technical field of wafer production equipment, and particularly relates to a wafer carrying device.
Background
In the process of preparing wafers, the wafers are required to be stacked, and then the carrying device and the wafers are driven to move by using a manipulator so as to transfer the wafers.
Chinese patent document CN115332151a discloses a carrier device for semiconductor process equipment, the carrier device comprising: the linear driving device comprises a base, a bearing piece and a linear driving assembly; the bearing pieces are used for bearing wafers, the bearing pieces are multiple in number and are stacked along a preset direction, adjacent bearing pieces are spaced apart, the linear driving assemblies are multiple in number and are in one-to-one correspondence with the bearing pieces in driving connection, the bearing pieces are arranged on the base in one-to-one correspondence through the linear driving assemblies, and each linear driving assembly can drive the bearing pieces in driving connection with the bearing pieces to move along the preset direction. The carrier comprises a base, a first fork arm and a second fork arm, wherein the first fork arm and the second fork arm are respectively connected with the base. However, in this document, the two fixing blocks abutting against the first fork arm and the second fork arm are fixed in a limited manner, the support is unstable, and the fixing blocks are not fixed on the side far from the fixing blocks, so that the alignment of the wafer is difficult to achieve.
Disclosure of Invention
The application aims to solve the technical problems that: in order to solve the defects in the prior art, the wafer carrying device is stable in support and capable of improving the uniformity of wafers.
The technical scheme adopted for solving the technical problems is as follows:
a wafer handling device, comprising:
a rotary motion mechanism;
the lifting movement mechanism is arranged on the rotary movement mechanism;
the horizontal movement mechanism is arranged on the lifting movement mechanism;
the bearing seat is arranged on the horizontal movement mechanism and can horizontally displace under the drive of the horizontal movement mechanism;
a plurality of bearing arms which are arranged in a stacked manner are arranged on one side of the bearing seat, each bearing arm comprises a left arm, a right arm and a base, a first fixing block is arranged on each of the left arm and the right arm, two second fixing blocks are arranged on each base, and fixing columns fixed on the bearing seat are arranged on two sides of each bearing arm;
the first fixing block is provided with a step-shaped structure consisting of a high table top and a low table top, a kicking surface between the low table top and the high table top is an arc surface, the second fixing block is provided with an inclined surface, a plurality of annular grooves are formed in the fixing columns, and the bottoms of the annular grooves are conical surfaces;
the circular arc faces of the two first fixing blocks extend to two sides to form a complete cylindrical surface, the horizontal central axis of the second fixing block passes through the central axis of the cylindrical surface, and the cylindrical surface is partially overlapped with the conical surface of the fixing column.
Preferably, in the wafer handling device of the present application, an included angle between the inclined surface of the second fixing block and the horizontal surface is smaller than an included angle between the tapered surface of the fixing column and the horizontal surface. The fixing column provides a sliding force facing the first fixing block for the wafer, so that the wafer further improves the uniformity of the wafer.
Preferably, in the wafer handling device of the present application, the base of the carrying arm is provided with a through hole, and the radiation emitted by the first sensor can pass through the through hole, and when the carrying arm carries the wafer, the wafer can block the through hole, so that the radiation emitted by the first sensor cannot pass through the through hole, and thus the wafer on the carrying arm can be known.
Preferably, in the wafer handling device of the present application, the first fixing block, the second fixing block and the fixing column are all made of polyetheretherketone material.
Preferably, in the wafer handling device of the present application, a platform is disposed at the top of the lifting motion mechanism, the horizontal motion mechanism is disposed on the platform, a support frame is further disposed on the platform, and two third sensors are disposed on the support frame, and are used for sensing whether the wafer exceeds the first fixing block.
Preferably, in the wafer handling device of the present application, the carrier is provided with a mounting block that is open to one side, and the base portion of the carrier arm extends into the mounting block to be fixed.
Preferably, in the wafer handling device of the present application, the fixing posts are mounted on two sides of the mounting block.
Preferably, the wafer carrying device comprises a shell, a motor arranged in the shell, a harmonic speed reducer connected with the motor, and a rotating seat arranged on the harmonic speed reducer, wherein the lifting movement mechanism is arranged on the rotating seat. The motor outputs power outwards, and the rotating seat is driven to rotate through the speed reduction of the harmonic speed reducer, so that the lifting movement mechanism is driven to rotate.
Preferably, in the wafer handling device of the present application, the housing is cylindrical, a circular mounting frame is provided outside the housing, a plurality of second sensors are provided on the mounting frame, a trigger block is provided on the rotating seat, and when the rotating seat rotates, the second sensors can be triggered by the trigger block, so that the rotation angle of the rotating seat is inductively controlled.
The beneficial effects of the application are as follows:
according to the wafer carrying device, the rotary motion mechanism, the lifting motion mechanism and the horizontal motion mechanism are respectively used for driving the bearing seat to rotate, lift and move horizontally, and the first fixing block, the second fixing block and the fixing column form six-point support for the wafer, so that the wafer is not easy to damage. The arc surface of the kicking surface of the first fixing block just abuts against the edge of the wafer, the second fixing block and the fixing column abut against the wafer in an inclined plane mode, the wafer naturally has a sliding trend due to the inclined plane, the wafer is easier to abut against the first fixing block, the effect of automatic correction of the position is achieved, and the uniformity of the wafers on different bearing arms is improved.
Drawings
The technical scheme of the application is further described below with reference to the accompanying drawings and examples.
FIG. 1 is a schematic view of a wafer handling apparatus according to an embodiment of the present application;
FIG. 2 is a schematic view of a carrier according to an embodiment of the present application;
FIG. 3 is a schematic view of a rotary motion mechanism according to an embodiment of the present application;
FIG. 4 is a cross-sectional view of a rotary motion mechanism according to an embodiment of the present application;
the reference numerals in the figures are:
1. a rotary motion mechanism;
2. a lifting movement mechanism;
3. a horizontal movement mechanism;
4. a bearing seat;
5. a load-bearing arm;
9. a wafer;
11. a housing;
12. a mounting frame;
13. a motor;
14. a harmonic speed reducer;
15. a rotating seat;
31. a platform;
32. a support frame;
41. a mounting block;
51. a first fixed block;
52. a second fixed block;
53. fixing the column;
54. a through hole;
61. a first sensor;
62. a second sensor;
63. and a third sensor.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art in a specific case.
The technical scheme of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.
Examples
The present embodiment provides a wafer handling apparatus, as shown in fig. 1, including:
a rotary motion mechanism 1;
the lifting motion mechanism 2 is arranged on the rotary motion mechanism 1;
the horizontal movement mechanism 3 is arranged on the lifting movement mechanism 2;
the bearing seat 4 is arranged on the horizontal movement mechanism 3 and can horizontally displace under the drive of the horizontal movement mechanism 3;
a plurality of carrying arms 5 (each carrying arm 5 can carry a wafer 9) are arranged on one side of the carrying seat 4 in a stacked manner, each carrying arm 5 comprises a left arm, a right arm and a base (which forms a Y-shaped structure), a first fixing block 51 is respectively arranged on the left arm and the right arm, two second fixing blocks 52 are arranged on the base, and fixing columns 53 fixed on the carrying seat 4 are arranged on two sides of each carrying arm 5;
the first fixing block 51 has a step-shaped structure composed of a high table top and a low table top, a kicking surface between the low table top and the high table top is an arc surface, the second fixing block 52 has an inclined surface, a plurality of annular grooves are formed on the fixing columns 53, and the bottoms of the annular grooves are conical surfaces;
the circular arc surfaces of the two first fixing blocks 51 extend to two sides to form a complete cylindrical surface, the horizontal central axis of the second fixing block 52 passes through the central axis of the cylindrical surface, and the cylindrical surface is partially overlapped with the conical surface of the fixing column 53.
According to the wafer carrying device, the rotary motion mechanism 1, the lifting motion mechanism 2 and the horizontal motion mechanism 3 are respectively used for driving the bearing seat 4 to rotate, lift and move horizontally, and the first fixing block 51, the second fixing block 52 and the fixing column 53 form six-point support for the wafer 9, so that the wafer 9 is not easy to damage. The arc surface of the kick surface of the first fixing block 51 just abuts against the edge of the wafer 9, the second fixing block 52 and the fixing column 53 abut against the wafer 9 in an inclined plane manner, the inclined plane enables the wafer 9 to naturally have a sliding trend, the wafer 9 is easier to abut against the first fixing block 51, the effect of automatically correcting positions is achieved, and the uniformity of the wafer 9 on different carrying arms 5 is improved. Meanwhile, the second fixing block 52 and the fixing column 53 are designed by inclined planes, so that the wafer 9 can be smoothly placed on the carrying arm 5.
The height of the kick surface between the low mesa and the high mesa is related to the thickness of the wafer 9, and the height of the kick surface is slightly smaller than the thickness of the wafer 9.
Further, the included angle between the inclined surface of the second fixing block 52 and the horizontal is smaller than the included angle between the tapered surface of the fixing post 53 and the horizontal. The fixing posts 53 provide a sliding force to the wafer 9 facing the first fixing block 51, so that the wafer 9 further improves the uniformity of the wafer 9.
Further, the base of the carrier arm 5 is provided with a through hole 54, the radiation emitted by the first sensor 61 can pass through the through hole 54, and when the wafer 9 is carried on the carrier arm 5, the wafer 9 can block the through hole 54, so that the radiation emitted by the first sensor 61 (the opposite-emitting sensor) cannot pass through the through hole 54, and thus the wafer 9 on the carrier arm 5 can be known.
The first fixing block 51, the second fixing block 52 and the fixing column 53 are all made of a polyetheretherketone material. The polyether-ether-ketone has high mechanical strength, high temperature resistance, impact resistance, flame retardance, acid and alkali resistance, hydrolysis resistance, wear resistance, fatigue resistance and irradiation resistance.
Further, a platform 31 is disposed at the top of the lifting motion mechanism 2, the horizontal motion mechanism 3 is disposed on the platform 31, a supporting frame 32 is further disposed on the platform, two third sensors 63 (correlation sensors) are disposed on the supporting frame 32, and the third sensors 63 are used for sensing whether the wafer exceeds the first fixed block 51.
Further, the bearing seat 4 is provided with a mounting block 41 which is opened to one side, and the base portion of the bearing arm 5 extends into the mounting block 41 to be fixed.
Further, the fixing posts 53 are installed at both sides of the mounting block 41.
Further, as shown in fig. 3 and 4, the rotary motion mechanism 1 includes a housing 11, a motor 13 provided inside the housing 11, a harmonic speed reducer 14 connected to the motor 13, and a rotary seat 15 provided on the harmonic speed reducer 14, and the elevating motion mechanism 2 is provided on the rotary seat 15. The motor 13 outputs power to the outside, and the rotating seat 15 is driven to rotate by the speed reduction of the harmonic speed reducer 14, so as to drive the lifting motion mechanism 2 to rotate.
Further, the shell 11 is cylindrical, a circular mounting frame 12 is arranged outside the shell 11, a plurality of second sensors 62 are arranged on the mounting frame 12, a trigger block is arranged on the rotary seat 15, and when the rotary seat 15 rotates, the second sensors 62 can be triggered through the trigger block, so that the rotation angle of the rotary seat 15 is subjected to induction control.
The lifting movement mechanism 2 and the horizontal movement mechanism 3 are mechanical standard components (linear driving components, which are composed of driving components and sliding tables).
With the above-described preferred embodiments according to the present application as a teaching, the worker skilled in the art could make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.
Claims (9)
1. A wafer handling device, comprising:
a rotary motion mechanism (1);
the lifting movement mechanism (2) is arranged on the rotary movement mechanism (1);
the horizontal movement mechanism (3) is arranged on the lifting movement mechanism (2);
the bearing seat (4) is arranged on the horizontal movement mechanism (3) and can horizontally displace under the drive of the horizontal movement mechanism (3);
a plurality of bearing arms (5) which are arranged in a stacked manner are arranged on one side of the bearing seat (4), each bearing arm (5) comprises a left arm, a right arm and a base, a first fixing block (51) is arranged on each of the left arm and the right arm, two second fixing blocks (52) are arranged on each base, and fixing columns (53) fixed on the bearing seat (4) are arranged on two sides of each bearing arm (5);
the first fixing block (51) is provided with a step-shaped structure consisting of a high table top and a low table top, a kicking surface between the low table top and the high table top is an arc surface, the second fixing block (52) is provided with an inclined surface, a plurality of annular grooves are formed in the fixing columns (53), and the bottoms of the annular grooves are conical surfaces;
the circular arc faces of the two first fixing blocks (51) extend to two sides to form a complete cylindrical surface, the horizontal central axis of the second fixing block (52) passes through the central axis of the cylindrical surface, and the cylindrical surface is partially overlapped with the conical surface of the fixing column (53).
2. The wafer handling device according to claim 1, wherein an angle between the inclined surface of the second fixed block (52) and the horizontal is smaller than an angle between the tapered surface of the fixed column (53) and the horizontal.
3. Wafer handling device according to claim 1, wherein the base of the carrier arm (5) is provided with a through hole (54), through which hole (54) the radiation emitted by the first sensor (61) can pass.
4. The wafer handling device according to claim 1, wherein the first fixed block (51), the second fixed block (52) and the fixed column (53) are each made of a polyetheretherketone material.
5. Wafer handling device according to claim 1, characterized in that the top of the lifting movement mechanism (2) is provided with a platform (31), the horizontal movement mechanism (3) is arranged on the platform (31), the platform (31) is further provided with a support frame (32), the support frame (32) is provided with two third sensors (63), and the third sensors (63) are used for sensing whether the wafer exceeds the first fixed block (51).
6. Wafer handling device according to claim 1, wherein the carrier (4) is provided with a mounting block (41) open to one side, and the base part of the carrier arm (5) extends into the mounting block (41) for fixation.
7. The wafer handling device according to claim 6, wherein the fixing posts (53) are mounted on both sides of the mounting block (41).
8. Wafer handling device according to claim 1, characterized in that the rotary motion mechanism (1) comprises a housing (11), a motor (13) arranged inside the housing (11), a harmonic speed reducer (14) connected with the motor (13), a rotating seat (15) arranged on the harmonic speed reducer (14), and the lifting motion mechanism (2) is arranged on the rotating seat (15).
9. The wafer handling device according to claim 8, wherein the housing (11) is cylindrical, a circular mounting frame (12) is arranged outside the housing (11), a plurality of second sensors (62) are arranged on the mounting frame (12), a trigger block is arranged on the rotating base (15), and when the rotating base (15) rotates, the second sensors (62) can be triggered by the trigger block, so that the rotation angle of the rotating base (15) is inductively controlled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310635500.1A CN116913832A (en) | 2023-05-31 | 2023-05-31 | Wafer handling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310635500.1A CN116913832A (en) | 2023-05-31 | 2023-05-31 | Wafer handling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116913832A true CN116913832A (en) | 2023-10-20 |
Family
ID=88363606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310635500.1A Pending CN116913832A (en) | 2023-05-31 | 2023-05-31 | Wafer handling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116913832A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124995A (en) * | 1992-10-13 | 1994-05-06 | Anelva Corp | Wafer conveying robot |
| CN101351878A (en) * | 2006-09-05 | 2009-01-21 | 东京毅力科创株式会社 | Substrate transfer device, substrate processing apparatus and substrate transfer method |
| JP2011134820A (en) * | 2009-12-24 | 2011-07-07 | Canon Anelva Corp | Wafer transfer robot and substrate processing apparatus equipped with the same |
| CN214569097U (en) * | 2021-02-05 | 2021-11-02 | 苏州新尚思自动化设备有限公司 | Double-arm wafer taking and placing mechanism |
| CN113745140A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer mechanical arm, wafer horizontal supporting device and supporting method |
| CN115513121A (en) * | 2022-11-23 | 2022-12-23 | 智程半导体设备科技(昆山)有限公司 | Wafer supporting mechanism and conveying device |
| CN115552583A (en) * | 2020-06-05 | 2022-12-30 | 日商乐华股份有限公司 | Wafer conveying device and wafer conveying method |
| CN218274546U (en) * | 2022-06-21 | 2023-01-10 | 厦门微亚智能科技有限公司 | Manipulator for calibrating and carrying wafers |
| CN218385147U (en) * | 2022-07-25 | 2023-01-24 | 北京和崎精密科技有限公司 | Wafer handling device |
| CN116141379A (en) * | 2023-02-09 | 2023-05-23 | 上海广川科技有限公司 | Test system of wafer handling robot |
-
2023
- 2023-05-31 CN CN202310635500.1A patent/CN116913832A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124995A (en) * | 1992-10-13 | 1994-05-06 | Anelva Corp | Wafer conveying robot |
| CN101351878A (en) * | 2006-09-05 | 2009-01-21 | 东京毅力科创株式会社 | Substrate transfer device, substrate processing apparatus and substrate transfer method |
| JP2011134820A (en) * | 2009-12-24 | 2011-07-07 | Canon Anelva Corp | Wafer transfer robot and substrate processing apparatus equipped with the same |
| CN115552583A (en) * | 2020-06-05 | 2022-12-30 | 日商乐华股份有限公司 | Wafer conveying device and wafer conveying method |
| CN214569097U (en) * | 2021-02-05 | 2021-11-02 | 苏州新尚思自动化设备有限公司 | Double-arm wafer taking and placing mechanism |
| CN113745140A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer mechanical arm, wafer horizontal supporting device and supporting method |
| CN218274546U (en) * | 2022-06-21 | 2023-01-10 | 厦门微亚智能科技有限公司 | Manipulator for calibrating and carrying wafers |
| CN218385147U (en) * | 2022-07-25 | 2023-01-24 | 北京和崎精密科技有限公司 | Wafer handling device |
| CN115513121A (en) * | 2022-11-23 | 2022-12-23 | 智程半导体设备科技(昆山)有限公司 | Wafer supporting mechanism and conveying device |
| CN116141379A (en) * | 2023-02-09 | 2023-05-23 | 上海广川科技有限公司 | Test system of wafer handling robot |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Applicant after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Applicant before: Jiangsu Yadian Technology Co.,Ltd. |
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