CN116900440A - Soldering tin selecting nozzle and manufacturing method thereof - Google Patents
Soldering tin selecting nozzle and manufacturing method thereof Download PDFInfo
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- CN116900440A CN116900440A CN202311172774.8A CN202311172774A CN116900440A CN 116900440 A CN116900440 A CN 116900440A CN 202311172774 A CN202311172774 A CN 202311172774A CN 116900440 A CN116900440 A CN 116900440A
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- Prior art keywords
- layer
- solder
- nozzle
- plating layer
- tin
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000005476 soldering Methods 0.000 title description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 76
- 238000007747 plating Methods 0.000 claims abstract description 67
- 229910000679 solder Inorganic materials 0.000 claims abstract description 55
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 38
- 238000009736 wetting Methods 0.000 claims abstract description 34
- 150000004767 nitrides Chemical class 0.000 claims abstract description 8
- 238000005121 nitriding Methods 0.000 claims description 33
- 230000007704 transition Effects 0.000 claims description 22
- 238000011282 treatment Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims 2
- 230000003647 oxidation Effects 0.000 abstract description 28
- 238000007254 oxidation reaction Methods 0.000 abstract description 28
- 230000002035 prolonged effect Effects 0.000 abstract description 22
- 238000005260 corrosion Methods 0.000 abstract description 21
- 230000007797 corrosion Effects 0.000 abstract description 20
- 238000003466 welding Methods 0.000 abstract description 16
- 238000012423 maintenance Methods 0.000 abstract description 13
- 230000004907 flux Effects 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000007654 immersion Methods 0.000 description 5
- 230000003111 delayed effect Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The application relates to a solder selecting nozzle and a manufacturing method thereof, comprising the following steps: the body is internally provided with a passage for solder to pass through; the surface of the body is coated with the nitride layer, the nickel plating layer and the wetting layer, and the nitride layer, the nickel plating layer and the wetting layer are sequentially distributed from inside to outside. According to the application, the nitride layer, the nickel plating layer and the wetting layer are coated outside the tin nozzle body, so that the corrosion resistance and the oxidation resistance of the tin nozzle are improved, the service life of the tin nozzle is prolonged, the heat conduction efficiency is improved, the wetting property of the tin nozzle to welding flux is ensured, the stability of solder wave crest is promoted, the corrosion resistance and the oxidation resistance of the surface of the tin nozzle are further improved, the oxidation time of the tin nozzle is prolonged, the maintenance time interval of the tin nozzle is prolonged, the maintenance times are reduced, the nitride layer, the nickel plating layer and the wetting layer are matched, the oxidation resistance and the corrosion resistance of the tin nozzle are improved, the service life of the tin nozzle is prolonged, the oxidation time of the tin nozzle is prolonged, the stability of the wave crest is promoted, and the welding quality is improved.
Description
Technical Field
The application relates to the technical field of selective wave soldering equipment, in particular to a selective soldering tin nozzle and a manufacturing method thereof.
Background
Selective wave soldering is a device applied to the field of PCB soldering, and is becoming a popular trend in the field of PCB soldering in recent years due to different soldering advantages, and has a wide application range. In selective wave soldering apparatus, solder is ejected through a solder nozzle to form a wave peak, and the performance of the solder nozzle is critical to solder quality.
During the use process of the selected soldering tin mouth, the surface roughness of the selected soldering tin mouth is increased and the wall thickness is lost due to the reasons of solder corrosion, oxidation and the like, so that impurities are accumulated on the surface of the soldering tin mouth during welding, wave crest instability is caused, and the problems of missing soldering, false soldering, component falling and the like are caused, so that the soldering tin mouth needs to be maintained to ensure the welding quality. The current tin nozzle has short oxidation time, frequent oxidation, influences welding quality, and needs frequent maintenance of the tin nozzle, thereby influencing production efficiency.
Disclosure of Invention
Based on the above expression, the application provides a selected soldering tin nozzle and a manufacturing method thereof, so as to solve the problems of short oxidation time, frequent oxidation and influence on welding quality and production efficiency of the soldering tin nozzle in the related art.
The technical scheme for solving the technical problems is as follows:
in a first aspect, the present application provides a solder selecting nozzle, which adopts the following technical scheme:
a solder selection nozzle comprising:
the body is internally provided with a passage for solder to pass through;
the surface of the body is coated with the nitride layer, the nickel plating layer and the wetting layer, and the nitride layer, the nickel plating layer and the wetting layer are sequentially distributed from inside to outside.
On the basis of the technical scheme, the application can be improved as follows.
Further, the wetting layer comprises one of a gold plating layer, a silver plating layer, a platinum plating layer and a tin plating layer.
Further, the channel comprises an inlet section, a transition section and an outlet section which are distributed in sequence along the axial direction of the channel, the transition end is connected with the outlet section and the inlet section, the diameter of the inlet section is larger than that of the outlet section, and the diameter of the transition section from the inlet section to the direction of the outlet section is gradually reduced.
Further, the outlet section length is greater than the inlet section length.
Further, the wall thickness of the body near the outlet end of the channel is 1-2.5mm.
Further, the thickness of the nickel plating layer is 0.1-6 mu m.
Further, the thickness of the wetting layer is 0.05-2 mu m.
In a second aspect, the present application also provides a method of manufacturing a solder selection nozzle as described above, comprising:
nitriding the body to form a nitrided layer;
nickel plating is carried out on the body after nitriding treatment to form a nickel plating layer;
plating an infiltration layer on the body after nitriding treatment.
Further, before the nitriding treatment is performed on the body to form a nitride layer, the method includes: and polishing the body.
Further, the wetting layer comprises one of a gold plating layer, a silver plating layer, a platinum plating layer and a tin plating layer.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
1. according to the application, the nitriding layer, the nickel plating layer and the wetting layer are coated outside the tin nozzle body, so that the surface hardness, the wear resistance and the corrosion resistance of the body can be improved, the service life of the tin nozzle can be prolonged, the nickel plating layer is coated outside the nitriding layer, the solder corrosion resistance of the tin nozzle can be improved, the service life of the tin nozzle can be further improved, the heat conduction efficiency is improved, the wetting layer is used for improving the heat conduction efficiency, the wettability of the tin nozzle to the solder is ensured, the solder wave crest is further stabilized, the corrosion resistance and the oxidation resistance of the surface of the tin nozzle can be further improved, the oxidation time of the tin nozzle can be further prolonged, the welding quality is ensured, the maintenance time interval of the tin nozzle is prolonged, the maintenance times is reduced, the service life of the tin nozzle is prolonged, the oxidation time of the tin nozzle can be prolonged, the wetting layer is directly contacted with the solder at the outermost layer, the wettability of the tin nozzle to the solder is ensured, the wave crest is further improved, and the stability of the welding quality is further improved;
2. the wall thickness of the outlet part of the tin nozzle is set in the range of 1-2.5mm, the peak is offset and unstable due to the thinner wall thickness, the peak size is influenced due to the thicker wall thickness, and the missing welding or component falling is caused, so that the wall thickness of the outlet part is set in the range of 1-2.5mm, and the service life of the tin nozzle can be prolonged on the premise of ensuring the stability of the peak;
3. according to the method, nitriding treatment, nickel plating and immersion plating are sequentially carried out on the body, the surface hardness, wear resistance and corrosion resistance of the body are improved through the nitriding treatment, meanwhile, the binding force between the nickel plating layer and the body during subsequent nickel plating can be improved, finally, the immersion plating is carried out outside the nickel plating layer, and the immersion plating layer is directly contacted with solder at the outermost layer of the body to ensure the wettability of a tin nozzle to the solder;
4. the method of the application comprises the steps of polishing the body before nitriding the body, namely polishing the surface of the body after turning the body, so as to eliminate micro cracks and turning marks formed by the machining, thereby ensuring the optimal performance of the body.
Drawings
FIG. 1 is a schematic diagram of a solder selecting nozzle according to an embodiment of the present application;
FIG. 2 is an enlarged schematic view of area A of FIG. 1;
fig. 3 is a table showing test results of tin nozzles obtained by four different processing methods in the method for manufacturing a selected tin nozzle according to an embodiment of the present application.
In the drawings, the list of components represented by the various numbers is as follows:
1. a body; 2. a nitriding layer; 3. a nickel plating layer; 4. a wetting layer; 5. a channel; 51. an inlet section; 52. a transition section; 53. an outlet section.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. Embodiments of the application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. In the following embodiments, "connected" is understood to mean "electrically connected", "communicatively connected", and the like, if the connected circuits, modules, units, and the like have electrical or data transferred therebetween.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
Referring to fig. 1-2, an embodiment of the application provides a soldering tin selecting nozzle, which comprises a body 1, and a nitriding layer 2, a nickel plating layer 3 and a wetting layer 4 which are coated on the surface of the body 1, wherein a channel 5 for solder to pass through is arranged in the body 1, and the nitriding layer 2, the nickel plating layer 3 and the wetting layer 4 are sequentially distributed from inside to outside.
Specifically, the channel 5 includes an inlet section 51, a transition section 52 and an outlet section 53, the inlet section 51 is coaxial with the outlet section 53, the diameter of the inlet section 51 is larger than that of the outlet section 53, the transition section 52 connects the inlet section 51 and the outlet section 53, and the diameter of the transition section 52 gradually decreases from the inlet section 51 to the outlet section 53. The inlet section 51 and the outlet section 53 are cylindrical and coaxial, the transition section 52 is communicated with the inlet section 51 and the outlet section 53 to form a complete channel 5, the diameter of the transition section 52 gradually decreases from the inlet section 51 to the outlet section 53, the transition section 52 is in a truncated cone shape and coaxial with the inlet section 51 and the outlet section 53, the maximum diameter of the transition section 52 is consistent with the diameter of the inlet section 51, the minimum diameter is consistent with the diameter of the outlet section 53, and therefore smooth transition between the inlet section 51 and the outlet section 53 is achieved, the flowing resistance of solder is reduced, and a stable wave crest is formed after the solder flows out from the outlet section 53.
Further, the length of the outlet section 53 is set to be greater than that of the inlet section 51, and when the solder enters the outlet section 53 through the transition section 52, the solder is disturbed due to the change of the flow cross section, and the flow time of the solder in the outlet section 53 is prolonged by prolonging the length of the outlet section 53, so that the solder flow is restored to be stable, and a stable wave crest is formed after the solder flows out of the outlet section 53.
Further, the body 1 comprises an inlet part, a transition part and an outlet part, the transition part is connected with the inlet part and the outlet part corresponding to the inlet section 51, the transition part 52 and the outlet section 53 of the channel 5, the inlet section 51 is arranged in the inlet part, the transition part 52 is arranged in the transition part, and the outlet section 53 is arranged in the outlet part. Specifically, the inlet portion and the outlet portion are both cylindrical and coaxial, the inlet section 51 and the outlet section 53 of the channel 5 are coaxial with the inlet portion and the outlet portion, and the diameter of the inlet portion is larger than that of the outlet portion, that is, the appearance of the body 1 is designed according to the shape of the channel 5, so that the volume and the material consumption of the body 1 are reduced, the surface area of the body 1 is reduced to reduce the material consumption of the plating layer, the contact area with solder is reduced to delay the corrosion and oxidation of the tin nozzle, and more uniform heat conduction can be realized.
Further, the wall thickness of the body 1 near the outlet end of the passage 5 is set to 1-2.5mm, specifically, in this embodiment, the wall thickness of the outlet section 53 of the body 1 is set to 1-2.5mm, and more specifically, the wall thickness of the outlet section 53 is set to 1.4-2.0mm. Because thinner wall thickness can lead to crest offset, unstable, thicker wall thickness can influence crest size, can lead to leaking the welding above or components and parts drop, consequently, establish the wall thickness of export section 53 in this within range can improve the life of tin mouth under the stable prerequisite of guaranteeing the crest.
Further, the outer edge of the end of the outlet section 53, which is far away from the inlet section 51, is in arc transition, so that the solder remained on the surface of the solder nozzle is facilitated to flow back into the solder bath, and the disturbance of the solder at the edge can be reduced, so that the stability of wave crest can be improved.
Further, the tin nozzle body 1 adopts iron with iron content more than 99.50% and carbon content less than 0.12%, more preferably iron with iron content 99.99% and carbon content 0.005%, so that the tin nozzle has good anti-corrosion and anti-oxidation properties. In other embodiments, the material of the body 1 may also be titanium alloy, which has better corrosion and oxidation resistance, and the specific material is selected according to practical requirements and cost considerations.
Further, the nitriding layer 2 is formed by nitriding the surface of the body 1 by an ion nitriding method, and the nitriding layer 2 can improve the surface hardness, wear resistance and corrosion resistance of the body 1.
Further, the thickness of the nickel plating layer 3 is 0.1-6 mu m, more specifically, the thickness of the nickel plating layer 3 is 0.2-5 mu m, after the body 1 is plated with nickel, the corrosion resistance of a matrix to solder can be further improved, the corrosion and oxidation processes of a tin nozzle are delayed, and the service life of the tin nozzle is prolonged.
Further, the wetting layer 4 comprises one of a gold plating layer, a silver plating layer, a platinum plating layer and a tin plating layer, a proper material can be selected as a plating material according to actual requirements and cost, the setting of the wetting layer 4 is used for improving the heat conduction efficiency of the tin nozzle and ensuring the wettability of the tin nozzle to welding flux, so that the stability of a solder wave crest is promoted, and meanwhile, the corrosion resistance and the oxidation resistance of the tin nozzle can be further improved.
The thickness of the wetting layer 4 is 0.05-2 μm, more specifically, the thickness of the wetting layer 4 is 0.1-1.5 μm.
According to the selected tin nozzle, the flow resistance of solder can be reduced through the design of the structure of the tin nozzle, the stability of wave crest is ensured, and uniform heat conduction can be realized, and through the matching of the nitriding layer 2, the nickel plating layer 3 and the wetting layer 4, the oxidation resistance and corrosion resistance of the tin nozzle can be improved, the oxidation and corrosion of the tin nozzle are delayed, the service life of the tin nozzle is prolonged, the maintenance time interval of the tin nozzle is prolonged, the maintenance times are reduced, the production efficiency is improved, meanwhile, the wetting layer 4 is directly contacted with the solder at the outermost layer, the wettability of the tin nozzle to the solder can be ensured, the wave crest is promoted to be stable, and the welding quality is improved.
The embodiment of the application also provides a manufacturing method of the solder selecting nozzle, which is used for manufacturing the solder selecting nozzle and comprises the following steps:
the body 1 is nitrided to form a nitrided layer 2.
The body 1 after nitriding is nickel-plated to form a nickel-plated layer 3.
The body 1 after nitriding treatment is plated with a wetting layer 4.
Specifically, the body 1 is formed by turning iron or titanium alloy, and during forming, the body is processed according to designed dimension parameters, so that each dimension parameter of the tin nozzle is in a design range, the stability of wave crests is ensured, and the service life is prolonged.
After the body 1 is formed, before the body 1 is nitrided to form the nitrided layer 2, the turned body 1 is polished, turning marks on the surface of the body 1 are ground flat, so that high-consistency surface finish and uniform thickness are obtained, the surface roughness of the inner wall and the outer wall of the body 1 is reduced, the accumulation of impurities, soldering flux and oxides can be reduced, tin flow and wave peaks are more stable, and meanwhile, a good surface foundation is provided for subsequent surface treatment by the smooth surface.
After the body 1 is polished, the body 1 is nitrided by adopting an ion nitriding method, so that a nitrided layer 2 is formed on the surface of the body 1, the hardness, the wear resistance and the corrosion resistance of the surface of the body 1 are improved, and the service life of the tin nozzle is prolonged.
After nitriding the body 1, nickel is plated on the body 1 after nitriding to form a nickel plating layer 3 coated outside the nitriding layer 2, and the oxidation resistance and corrosion resistance of the body 1 can be further improved by nickel plating after nitriding, so that the service life of the tin nozzle is further prolonged.
After the body 1 is plated with nickel, the body 1 plated with nickel is plated with a wetting layer 4, and specifically, the wetting layer 4 comprises one of a gold plating layer, a silver plating layer, a platinum plating layer and a tin plating layer. The wetting layer 4 is arranged on the outermost layer of the body 1 and is directly contacted with solder, the wetting layer 4 can improve the heat conduction efficiency, and has good oxidation resistance, so that the oxidation resistance of the surface of the body 1 is improved, the oxidation process is delayed, the maintenance time interval of a tin nozzle is prolonged, the maintenance times are reduced, and the production efficiency is improved; meanwhile, the wetting layer 4 is directly contacted with the solder at the outermost layer, so that the wettability of a tin nozzle to the solder can be ensured, wave crest stability is promoted, and the welding quality is improved.
The body 1 after the turning formation was subjected to various surface treatments including a first treatment method of polishing only (group 1 in the table), a second treatment method of polishing and nickel plating (group 2 in the table), a third treatment method of polishing, nickel plating and immersion layer 4 (group 3 in the table), and a fourth treatment method of polishing, nitriding, nickel plating and immersion layer 4 (group 4 in the table), and tin nozzles obtained by the four different treatment methods were respectively tested, and the results are shown in the table of fig. 3. Wherein the oxidation time is the time from the beginning of the first use of the tin nozzle to the occurrence of oxidation and impurity accumulation on the surface.
According to the test result, the second treatment method is compared with the first treatment method, the third treatment method is compared with the fourth treatment method, the nitriding treatment and nickel plating of the tin nozzle body 1 can be used for effectively prolonging the service life of the tin nozzle, and the third treatment method is compared with the second treatment method, the plating wetting layer 4 can be used for effectively prolonging the oxidation time of the surface of the tin nozzle, so that the maintenance time interval of the tin nozzle is prolonged, the maintenance times are reduced, the stability of solder wave crest is promoted, and the stability of the wave crest is improved so as to improve the welding quality; therefore, by nitriding treatment, nickel plating and plating the wetting layer 4 on the body 1, the corrosion resistance and oxidation resistance of the body 1 can be effectively improved, the service life of the tin nozzle is prolonged, the tin nozzle corrosion and oxidation process is delayed, the maintenance time interval of the tin nozzle is prolonged, the maintenance times are reduced, the production efficiency is improved, the wetting property of the tin nozzle to welding materials is ensured, the stability of wave peaks is promoted, and the welding quality is improved.
The foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the application are intended to be included within the scope of the application.
Claims (10)
1. A solder selection nozzle, comprising:
a body (1) in which a passage (5) for solder to pass is provided;
the nickel plating device comprises a body (1), a nitriding layer (2), a nickel plating layer (3) and a soaking layer (4) which are coated on the surface of the body (1), wherein the nitriding layer (2), the nickel plating layer (3) and the soaking layer (4) are sequentially distributed from inside to outside.
2. The solder selection nozzle of claim 1, wherein: the wetting layer (4) comprises one of a gold plating layer, a silver plating layer, a platinum plating layer and a tin plating layer.
3. The solder selection nozzle of claim 1, wherein: the channel (5) comprises an inlet section (51), a transition section (52) and an outlet section (53), wherein the inlet section (51) and the outlet section (53) are coaxial, the diameter of the inlet section (51) is larger than that of the outlet section (53), the transition end is connected with the outlet section (53) and the inlet section (51), and the diameter of the transition section (52) from the inlet section (51) to the direction of the outlet section (53) is gradually reduced.
4. A solder selection nozzle according to claim 3, wherein: the outlet section (53) has a length greater than the inlet section (51).
5. The solder selection nozzle of claim 1, wherein: the wall thickness of the body (1) near the outlet end of the channel (5) is 1-2.5mm.
6. The solder selection nozzle of claim 1, wherein: the thickness of the nickel plating layer (3) is 0.1-6 mu m.
7. The solder selection nozzle of claim 1, wherein: the thickness of the wetting layer (4) is 0.05-2 mu m.
8. A method of manufacturing a solder mask selection nozzle according to any one of claims 1 to 7, comprising:
nitriding the body (1) to form a nitrided layer (2);
nickel plating is carried out on the body (1) after nitriding treatment to form a nickel plating layer (3);
plating the body (1) after nitriding with an impregnating layer (4).
9. The method of manufacturing a solder nozzle according to claim 8, wherein the nitriding process of the body (1) to form the nitride layer (2) is preceded by: polishing the body (1).
10. The method of manufacturing a solder nozzle of claim 8, wherein: the wetting layer (4) comprises one of a gold plating layer, a silver plating layer, a platinum plating layer and a tin plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311172774.8A CN116900440A (en) | 2023-09-12 | 2023-09-12 | Soldering tin selecting nozzle and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311172774.8A CN116900440A (en) | 2023-09-12 | 2023-09-12 | Soldering tin selecting nozzle and manufacturing method thereof |
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| CN116900440A true CN116900440A (en) | 2023-10-20 |
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| CN202311172774.8A Pending CN116900440A (en) | 2023-09-12 | 2023-09-12 | Soldering tin selecting nozzle and manufacturing method thereof |
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