CN116885501B - Connector terminal and PCB (printed circuit board) patch structure - Google Patents
Connector terminal and PCB (printed circuit board) patch structure Download PDFInfo
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- CN116885501B CN116885501B CN202311137353.1A CN202311137353A CN116885501B CN 116885501 B CN116885501 B CN 116885501B CN 202311137353 A CN202311137353 A CN 202311137353A CN 116885501 B CN116885501 B CN 116885501B
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- 238000012545 processing Methods 0.000 claims description 41
- 230000001681 protective effect Effects 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 230000007246 mechanism Effects 0.000 claims description 25
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 4
- 230000001276 controlling effect Effects 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
Abstract
The invention discloses a connector terminal and a PCB patch structure, which relate to the technical field of connectors, and comprise a shielding group and a signal group which are arranged in a plastic main body, wherein the signal group is a signal terminal of one group, is positioned between two adjacent shielding terminals, and also comprises an I-shaped first shielding groove which is arranged on the side wall of the two signal terminals, which is close to the PCB, a concave-convex saddle-shaped second shielding groove is arranged between the signal terminal and the adjacent shielding terminal, and the adjacent two second shielding grooves form a third shielding groove of a Chinese character 'ri'. According to the connector terminal and the PCB patch structure, resonance can be controlled, crosstalk can be improved and impedance can be regulated through the arrangement of the I-shaped first shielding groove, and meanwhile, the I-shaped third shielding groove can be formed through the concave-convex saddle-shaped second shielding groove and the two adjacent second shielding grooves, so that the effects of controlling impedance and facilitating material connection can be achieved.
Description
Technical Field
The invention relates to the technical field of connectors, in particular to a connector terminal and a PCB (printed circuit board) patch structure.
Background
A connector is a device that connects two active devices to transmit current or signals. The connector is an indispensable part of electronic equipment, is applied to various electronic equipment, communication equipment, control equipment and the like, and is mainly composed of a plastic main body, signal terminals and shielding terminals, wherein the signal terminals are arranged in the plastic main body in a staggered manner and are mainly used for transmitting differential signals, the shielding terminals are used for shielding differential signals transmitted by two adjacent signal groups, the shielding terminals and the signal terminals are arranged in a staggered manner, the shielding effect between the transmission signals can be achieved, a return path is provided for the transmission signals, and along with the continuous improvement of the signal transmission rate, higher requirements are put on the integrity of the transmission signals. Therefore, the specific design of the shield pack, shield blades, and signal return path is important, while the connector is assembled and connected with the PCB board patch during use, thereby facilitating the transfer of current or signals between the blocked or isolated devices in the circuit to achieve the intended function.
In the practical use process of the connector, in order to solve the problem of crosstalk, a plurality of raised ribs are usually stamped on a shielding substrate, and a signal group is installed in a concave shielding cavity defined by adjacent protrusions, so that signal interference of the adjacent signal group is isolated, but the strength of the single rib for signal isolation is insufficient, so that uncertainty of impedance on a reflux path is generated, shielding performance is fluctuated, transmission performance is affected, and resonance is not controlled.
And when the terminal of the connector is assembled with the PCB patch, after the solder paste is smeared on the patch, when the solder paste smeared on the patch is melted at high temperature, the solder paste is easy to overflow due to the high-temperature melting, so that the solidification effect of the terminal is affected.
Disclosure of Invention
The invention aims to provide a connector terminal and a PCB patch structure which can reduce the residue of crushed materials so as to solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a connector terminal and PCB board paster structure, includes shielding group and signal group that sets up in the plastic main part, signal group is two liang of signal terminal of a set of, and is located between two adjacent shielding terminals, still including setting up the first shielding groove of "worker" style of calligraphy on two signal terminals are close to the PCB board lateral wall, the second shielding groove of unsmooth saddle shape has been seted up between signal terminal and the adjacent shielding terminal, and two adjacent second shielding grooves form the third shielding groove of "day" style of calligraphy.
Preferably, each shielding terminal and signal terminal are provided with a protective frame for protecting solder paste, the protective frame is in a U-shaped arrangement, two opposite side walls of the opening end of the protective frame are fixedly connected with baffle plates, the other ends of the two baffle plates are propped against the side walls of the shielding terminal and the signal terminal, and the protective frame is provided with a processing mechanism for carrying out rough processing on the surface of the patch body.
Preferably, the processing mechanism comprises a processing plate which is in sliding connection with one side of the protective frame far away from the patch body and is shaped like a Chinese character 'shan', one side of the processing plate close to the protective frame is provided with a plurality of processing rods, the other ends of the processing rods are fixedly connected with conical heads, processing grooves are formed in the shielding terminals and the signal terminals, the processing rods slide on the processing grooves, and a pushing mechanism for pushing the processing rods is arranged on the protective frame.
Preferably, the pushing mechanism comprises two L-shaped plates which are fixedly connected to one side of the protective frame away from the patch body and are symmetrically arranged, two pushing blocks are fixedly connected to the other ends of the L-shaped plates, one end of the shielding terminal, which is close to the L-shaped plates, is fixedly connected with a first connecting plate, one side of the first connecting plate away from the patch body is fixedly connected with a second connecting plate, one side of the second connecting plate, which is close to the shielding terminal, is fixedly connected with a plurality of pushing plates, pushing rods are connected to the pushing blocks in a sliding mode, one ends of the pushing rods are connected with the processing plates, and round corners are rounded at the other ends of the pushing rods.
Preferably, inclined planes are formed on two sides of each pushing plate, and one end, away from the shielding terminal, of each pushing rod slides on each inclined plane.
Preferably, the reset component for resetting the treatment plate is arranged on the push rod, the reset component comprises a fixed ring fixedly connected to the push rod, a first spring is sleeved on the push rod, and two ends of the first spring are respectively connected with the fixed ring and the push block.
Preferably, the shielding terminal is provided with a driving mechanism for driving the shielding frame to contact with the PCB body, the driving mechanism comprises two driving plates which are fixedly connected with one end of the shielding terminal and are symmetrically arranged, two driving plates are connected with T-shaped rods in a sliding mode, one ends of the T-shaped rods, which are close to the PCB body, are fixedly connected with fixing blocks, the other ends of the fixing blocks are fixedly connected with driving blocks, the driving blocks are connected with the inner wall of the shielding frame, two second springs are sleeved on the side walls of the T-shaped rods, and two ends of the second springs are respectively connected with the driving plates and the fixing blocks.
Preferably, the side wall of each inclined plane is polished.
Preferably, a plurality of reinforcing grooves are formed in one end, close to the driving block, of the shielding terminal.
Preferably, one side of the PCB body, which is close to the signal terminal and the shielding terminal, is provided with a patch body, solder paste is smeared on the patch body, and the signal terminal and the shielding terminal are fixed on the surface of the PCB body through high-temperature melting of the solder paste.
Compared with the prior art, the invention has the beneficial effects that:
according to the connector terminal and the PCB patch structure, resonance can be controlled, crosstalk can be improved and impedance can be regulated through the arrangement of the I-shaped first shielding groove, and meanwhile, the I-shaped third shielding groove can be formed through the concave-convex saddle-shaped second shielding groove and the two adjacent second shielding grooves, so that the effects of controlling impedance and facilitating material connection can be achieved.
According to the connector terminal and the PCB patch structure, through the arrangement of the protective frame, one side of the protective frame is firstly contacted with the PCB body under the driving action of the driving mechanism, so that solder paste on the patch body is surrounded under the protection shielding action of the protective frame, overflow of the solder paste when the solder paste is melted at high temperature is prevented, and the solidification effect of the terminal is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
fig. 2 is a schematic structural view of a shielding set and a signal set in the plastic body 1 according to the present invention;
FIG. 3 is a schematic view of the structure of the first, second and third shield slots according to the present invention;
fig. 4 is a schematic structural view of a PCB board according to the present invention;
FIG. 5 is a schematic view showing the position structure of the shielding frame, the shielding terminal and the signal terminal according to the present invention;
FIG. 6 is a schematic view of the structure of the treatment tank and the reinforcement tank of the present invention;
FIG. 7 is a schematic view of the pushing mechanism of the present invention;
FIG. 8 is an enlarged view of FIG. 7 at A;
fig. 9 is a schematic structural view of the driving mechanism of the present invention.
In the figure: 101. a plastic body; 102. a shield terminal; 103. a signal terminal; 104. a PCB body; 105. a patch body; 106. solder paste; 2. a first shielding groove; 3. a second shielding groove; 4. a protective frame; 501. a treatment plate; 502. a treatment rod; 503. a conical head; 504. a treatment tank; 601. an L-shaped plate; 602. a pushing block; 603. a first connection plate; 604. a second connecting plate; 605. a pushing plate; 606. a push rod; 607. round corners; 608. an inclined plane; 701. a fixing ring; 702. a first spring; 801. a driving block; 802. a fixed block; 803. a T-shaped rod; 804. a driving plate; 806. a second spring; 9. a reinforcing groove; 10. and a baffle.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-9, a connector terminal and PCB patch structure in the drawings includes a shielding group and a signal group disposed in a plastic body 101, wherein the signal group is a signal terminal 103 of two groups, and is located between two adjacent shielding terminals 102, and further includes an "i" shaped first shielding groove 2 disposed on a side wall of the PCB adjacent to the two signal terminals 103, a concave-convex saddle-shaped second shielding groove 3 is disposed between the signal terminal 103 and the adjacent shielding terminal 102, and the two adjacent second shielding grooves 3 form a "ri" shaped third shielding groove;
what needs to be explained here is: as can be seen from fig. 3, five terminals in the middle, which are not specially designed, are called "rectangular terminals", and are low-speed terminals, and there is no need to improve their SI performance, and thus there is no need for special design.
What needs to be explained here is: through the setting of "I" style of calligraphy first shield groove 2, can control resonance, improve crosstalk and adjust impedance, simultaneously, rethread unsmooth saddle-shaped second shield groove 3 and two adjacent second shield grooves 3 form "day" style of calligraphy third shield groove, can play control impedance and the effect of convenient company material.
Each shielding terminal 102 and each signal terminal 103 are provided with a protective frame 4 for protecting solder paste 106, the protective frames 4 are arranged in a U shape, two opposite side walls of the opening end of the protective frame 4 are fixedly connected with baffle plates 10, the other ends of the two baffle plates 10 are propped against the side walls of the shielding terminal 102 and the signal terminals 103, and the protective frame 4 is provided with a processing mechanism for roughening the surface of the patch body 105;
what needs to be explained here is: through the setting of protection frame 4, under the protection shielding effect of protection frame 4, with the solder paste 106 on the paster body 105 surrounding, prevented solder paste 106 when high temperature melting take place the overflow to the solidification effect to the terminal has been improved.
The processing mechanism comprises a processing plate 501 which is connected with one side of the protective frame 4 far away from the patch body 105 in a mountain shape, a plurality of processing rods 502 are arranged on one side of the processing plate 501 close to the protective frame 4, the other end of each processing rod 502 is fixedly connected with a conical head 503, processing grooves 504 are formed in each shielding terminal 102 and the signal terminal 103, each processing rod 502 slides on the processing groove 504, and a pushing mechanism for pushing each processing rod 502 is arranged on the protective frame 4;
what needs to be explained here is: the length of the treatment tank 504 provides sufficient movement space for the treatment rod 502 to slide back and forth.
What needs to be explained here is: through the setting of processing mechanism for the surface of paster body 105 produces the mar, has increased the surface roughness of paster body 105, thereby makes high temperature melting solder paste 106 permeate into in the paster body 105, further increased the joint strength between shielding terminal 102 and the PCB board body 104.
The pushing mechanism comprises two L-shaped plates 601 which are fixedly connected to one side, far away from the patch body 105, of the protective frame 4, wherein the two L-shaped plates 601 are symmetrically arranged, a pushing block 602 is fixedly connected to the other ends of the two L-shaped plates 601, a first connecting plate 603 is fixedly connected to one end, close to the L-shaped plates 601, of the shielding terminal 102, a second connecting plate 604 is fixedly connected to one side, far away from the patch body 105, of the first connecting plate 603, a plurality of pushing plates 605 are fixedly connected to one side, close to the shielding terminal 102, of the second connecting plate 604, pushing rods 606 are connected to the pushing block 602 in a sliding manner, one ends of the pushing rods 606 are connected to the processing plates 501, and round corners 607 are chamfered at the other ends of the pushing rods 606;
what needs to be explained here is: through the setting of pushing mechanism, with the continuous promotion to shielding terminal 102, will drive the reciprocal and pushing rod 606 of pushing plate 605 and offset to further promotion the conical head 503 of handling pole 502 one end carries out reciprocal back and forth slip at the surface of paster body 105, makes the surface of paster body 105 produce the mar.
Inclined planes 608 are formed on two sides of each pushing plate 605, and one end of each pushing rod 606, which is far away from the shielding terminal 102, slides on each inclined plane 608;
what needs to be explained here is: by the provision of the inclined surface 608, when the push plate 605 abuts against the push rod 606, the push processing plate 501 is moved away from the push block 602 by the interaction force of the inclined surface 608.
The push rod 606 is provided with a reset component for resetting the treatment plate 501, the reset component comprises a fixed ring 701 fixedly connected to the push rod 606, the push rod 606 is sleeved with a first spring 702, and two ends of the first spring 702 are respectively connected with the fixed ring 701 and the push block 602;
what needs to be explained here is: through the setting of reset subassembly, when catch bar 606 passes over push plate 605, under the elastic force of first spring 702, will drive conical head 503 and carry out the reverse slip on the surface of paster body 105.
The shielding terminal 102 is provided with a driving mechanism for driving the protective frame 4 to contact with the PCB body 104 firstly, the driving mechanism comprises two driving plates 804 which are fixedly connected with one end of the shielding terminal 102 and are symmetrically arranged, the two driving plates 804 are connected with T-shaped rods 803 in a sliding manner, one ends of the two T-shaped rods 803, which are close to the PCB body 104, are fixedly connected with fixing blocks 802, the other ends of the two fixing blocks 802 are fixedly connected with driving blocks 801, the driving blocks 801 are connected with the inner wall of the protective frame 4, the side walls of the two T-shaped rods 803 are sleeved with second springs 806, and two ends of the two second springs 806 are respectively connected with the driving plates 804 and the fixing blocks 802;
what needs to be explained here is: through the setting of actuating mechanism, under the elastic force of second spring 806, will promote protection frame 4 and PCB board body 104's surface contact earlier to the surrounding of solder paste 106 has been realized.
The side walls of each inclined plane 608 are polished;
what needs to be explained here is: the surface of the inclined plane 608 is polished, so that friction force is reduced, and transmission efficiency of the extruded inclined plane 608 is improved.
A plurality of reinforcing grooves 9 are formed in one end, close to the driving block 801, of the shielding terminal 102;
what needs to be explained here is: through the setting of a plurality of enhancement grooves 9, under the extrusion effect of shielding terminal 102, will promote solder paste 106 and enter into the clearance between drive piece 801 and the shielding terminal 102, further make solder paste 106 enter into enhancement groove 9, when carrying out the high temperature melting to solder paste 106, solder paste 106 in the enhancement groove 9 will increase the area of contact with shielding terminal 102 to improve the joint strength between shielding terminal 102 and the PCB board body 104.
A patch body 105 is arranged on one side of the PCB body 104, which is close to the signal terminal 103 and the shielding terminal 102, solder paste 106 is smeared on the patch body 105, and the signal terminal 103 and the shielding terminal 102 are fixed on the surface of the PCB body 104 through high-temperature melting of the solder paste 106;
what needs to be explained here is: through the setting of PCB board paster structure, be convenient for with electric current or signal transmission between the equipment that is blocked or keep apart in the circuit to realize predetermined function.
In the scheme, the method comprises the following steps: a connector terminal and PCB patch structure comprises the following steps:
the arrangement of the H-shaped first shielding groove 2 is used for connecting two independent ground planes, so that the integrity of the ground (the integrity of a ground reference plane) is ensured, resonance control, crosstalk improvement and impedance adjustment are realized, meanwhile, the arrangement of the concave-convex saddle-shaped second shielding groove 3 is realized, as the shielding terminal 102 is concave, the adjacent signal terminal 103 is convex, so that a saddle shape is formed, the width between the shielding terminal 102 and the signal terminal 103 is wider at the saddle shape, the gap between the terminals is larger, and therefore, a wider terminal is required to keep the consistency of the impedance, the effect of controlling the impedance is realized through the arrangement of the concave-convex saddle-shaped second shielding groove 3, and the adjacent two second shielding grooves 3 form a three-day-shaped shielding groove, so that the two terminals are in a wide, narrow, wide and excessively wide structure, and the impedance is in a low, so that the design is favorable for maintaining the impedance to be fluctuated on a level, so that the impedance cannot be excessively high or excessively low, and meanwhile, the impedance can be conveniently connected with the H-shaped second shielding groove 3 at the position of the concave-convex saddle-shaped second shielding groove 3;
when the terminal needs to be connected with the PCB body 104 (the shielding terminal 102 is taken as an example here), the shielding terminal 102 is moved close to the PCB body 104, and when the shielding terminal 102 is close to the PCB body 104, one side of the protective frame 4 is contacted with the PCB body 104 under the driving action of the driving mechanism, so that the solder paste 106 on the patch body 105 is enclosed under the protection shielding action of the protective frame 4, the solder paste 106 is prevented from overflowing when melted at high temperature, and the curing effect of the terminal is improved.
With the continuous pushing of the shielding terminal 102, when the end face of the shielding terminal 102 is in contact with the PCB board body 104, the solder paste 106 is extruded under the action of force, and as a certain gap exists between the driving block 801 and the shielding terminal 102, the solder paste 106 is pushed into the gap between the driving block 801 and the shielding terminal 102 under the extrusion action of the shielding terminal 102, so that the solder paste 106 further enters the reinforcing groove 9, and when the solder paste 106 is melted at high temperature, the contact area between the solder paste 106 in the reinforcing groove 9 and the shielding terminal 102 is increased, and the connection strength between the shielding terminal 102 and the PCB board body 104 is improved;
and when the protective frame 4 is abutted against the end face of the PCB body 104, the processing rod 502 on the processing plate 501 is driven to be abutted against the surface of the patch body 105, and when the shielding terminal 102 is continuously pushed, the pushing plate 605 on the second connecting plate 604 is synchronously driven to move downwards, when the pushing plate 605 is abutted against the pushing rod 606 in the downward moving process of the pushing plate 605, the pushing processing plate 501 is far away from the pushing block 602 under the interaction force of the inclined plane 608, at the moment, the first spring 702 is stressed to deform to form elastic force, and when the processing plate 501 is far away from the pushing block 602, the conical head 503 on the pushing processing rod 502 slides on the surface of the patch body 105, thereby make the surface of paster body 105 produce the mar, when catch bar 606 passes over catch plate 605, under the elastic force of first spring 702, will drive conical head 503 and carry out the reverse slip at the surface of paster body 105, along with the continuous promotion to shield terminal 102, will drive catch plate 605 reciprocal and catch bar 606 offset, thereby further promotion the conical head 503 of handling pole 502 one end carries out reciprocal round trip slip at the surface of paster body 105, make the surface of paster body 105 produce the mar, surface roughness of paster body 105 has been increased, thereby make high temperature molten solder paste 106 infiltrate into paster body 105, further increased the joint strength between shield terminal 102 and the PCB board body 104.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A connector terminal comprising:
the shielding group and the signal group are arranged in the plastic main body (101), the signal groups are signal terminals (103) of one group, and the signal groups are positioned between two adjacent shielding terminals (102);
characterized by further comprising:
the PCB comprises two signal terminals (103) which are close to I-shaped first shielding grooves (2) on the side wall of the PCB, wherein concave-convex saddle-shaped second shielding grooves (3) are formed between the signal terminals (103) and the adjacent shielding terminals (102), and the adjacent two second shielding grooves (3) form a Y-shaped third shielding groove;
the shielding terminal (102) and the signal terminal (103) are respectively provided with a protective frame (4) for protecting solder paste (106), the protective frames (4) are U-shaped, two opposite side walls of the opening end of the protective frame (4) are fixedly connected with baffle plates (10), the other ends of the two baffle plates (10) are propped against the side walls of the shielding terminal (102) and the signal terminal (103), and the protective frames (4) are provided with a processing mechanism for carrying out rough treatment on the surface of the patch body (105);
the processing mechanism comprises a processing plate (501) which is in sliding connection with one side of a protective frame (4) far away from a patch body (105) and is shaped like a Chinese character 'shan', one side of the processing plate (501) close to the protective frame (4) is provided with a plurality of processing rods (502), the other ends of the processing rods (502) are fixedly connected with conical heads (503), processing grooves (504) are formed in the shielding terminals (102) and the signal terminals (103), the processing rods (502) slide on the processing grooves (504), and a pushing mechanism used for pushing the processing rods (502) is arranged on the protective frame (4).
2. A connector terminal according to claim 1, wherein: the utility model discloses a shielding terminal, including protection frame (4), the L template (601) that two mutual symmetries set up of paster body (105) one side are kept away from to pushing mechanism, two the other end fixedly connected with pushing block (602) of L template (601), shielding terminal (102) are close to one end fixedly connected with first connecting plate (603) of L template (601), one side fixedly connected with second connecting plate (604) of paster body (105) are kept away from to first connecting plate (603), one side fixedly connected with a plurality of pushing plates (605) of second connecting plate (604) are close to shielding terminal (102), sliding connection has catch bar (606) on pushing block (602), one end and processing board (501) of catch bar (606) are connected, the other end of catch bar (606) is rounded corner (607).
3. A connector terminal according to claim 2, wherein: inclined planes (608) are formed on two sides of each pushing plate (605), and one end of each pushing rod (606) far away from the shielding terminal (102) slides on each inclined plane (608).
4. A connector terminal according to claim 2, wherein: the device is characterized in that a reset component for resetting the treatment plate (501) is arranged on the push rod (606), the reset component comprises a fixed ring (701) fixedly connected to the push rod (606), a first spring (702) is sleeved on the push rod (606), and two ends of the first spring (702) are respectively connected with the fixed ring (701) and the push block (602).
5. A connector terminal according to claim 3, wherein: be equipped with the actuating mechanism who is used for driving protection frame (4) earlier and PCB board body (104) to contact on shielding terminal (102), actuating mechanism includes two drive plates (804) that mutual symmetry set up of fixed connection in shielding terminal (102) one end, two sliding connection has T type pole (803) on drive plate (804), two one end fixedly connected with fixed block (802) that T type pole (803) is close to PCB board body (104), two the other end fixedly connected with drive block (801) of fixed block (802), drive block (801) are connected with the inner wall of protection frame (4), and two cover is equipped with second spring (806) on the lateral wall of T type pole (803), two the both ends of second spring (806) are connected with drive plate (804) and fixed block (802) respectively.
6. A connector terminal according to claim 3, wherein: the sidewalls of each of the inclined surfaces (608) are polished.
7. A connector terminal according to claim 5, wherein: a plurality of reinforcing grooves (9) are formed in one end, close to the driving block (801), of the shielding terminal (102).
8. A PCB board patch structure, applied to the connector terminal of any one of claims 1-7, characterized in that, a patch body (105) is disposed on one side of the PCB board body (104) close to the signal terminal (103) and the shielding terminal (102), solder paste (106) is smeared on the patch body (105), and the signal terminal (103) and the shielding terminal (102) are fixed on the surface of the PCB board body (104) through high temperature melting of the solder paste (106).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311137353.1A CN116885501B (en) | 2023-09-05 | 2023-09-05 | Connector terminal and PCB (printed circuit board) patch structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311137353.1A CN116885501B (en) | 2023-09-05 | 2023-09-05 | Connector terminal and PCB (printed circuit board) patch structure |
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| CN116885501A CN116885501A (en) | 2023-10-13 |
| CN116885501B true CN116885501B (en) | 2023-11-28 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201656026U (en) * | 2009-12-07 | 2010-11-24 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN215118913U (en) * | 2021-05-10 | 2021-12-10 | 广州市骏宏光电科技有限公司 | SMD infrared receiving head |
| CN113964567A (en) * | 2021-11-13 | 2022-01-21 | 深圳市方向电子股份有限公司 | High-speed signal transmission electric connector |
| CN218160366U (en) * | 2022-09-21 | 2022-12-27 | 江苏芯德半导体科技有限公司 | Integrated circuit chip packaging structure |
| CN219514302U (en) * | 2023-02-22 | 2023-08-11 | 精电(河源)显示技术有限公司 | FPC structure and electronic equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110255850A1 (en) * | 2010-04-19 | 2011-10-20 | Richard Hung Minh Dinh | Electronic subassemblies for electronic devices |
| KR102271880B1 (en) * | 2014-02-10 | 2021-07-01 | 삼성전자주식회사 | Electrical connection device |
-
2023
- 2023-09-05 CN CN202311137353.1A patent/CN116885501B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201656026U (en) * | 2009-12-07 | 2010-11-24 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN215118913U (en) * | 2021-05-10 | 2021-12-10 | 广州市骏宏光电科技有限公司 | SMD infrared receiving head |
| CN113964567A (en) * | 2021-11-13 | 2022-01-21 | 深圳市方向电子股份有限公司 | High-speed signal transmission electric connector |
| CN218160366U (en) * | 2022-09-21 | 2022-12-27 | 江苏芯德半导体科技有限公司 | Integrated circuit chip packaging structure |
| CN219514302U (en) * | 2023-02-22 | 2023-08-11 | 精电(河源)显示技术有限公司 | FPC structure and electronic equipment |
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| Publication number | Publication date |
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| CN116885501A (en) | 2023-10-13 |
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