CN116885342A

CN116885342A - Battery module and energy storage device

Info

Publication number: CN116885342A
Application number: CN202310822654.1A
Authority: CN
Inventors: 赵红亮; 孙中伟; 唐俊伟; 骆飞燕; 沈高松; 刘轶豪; 林文海; 安欣欣; 陈勇军
Original assignee: Shenzhen Hello Tech Energy Co Ltd
Current assignee: Shenzhen Hello Tech Energy Co Ltd
Priority date: 2023-07-05
Filing date: 2023-07-05
Publication date: 2023-10-13

Abstract

The application discloses a battery module and an energy storage device. The battery module comprises a battery cell, a bracket and a first semiconductor refrigerating sheet. The support is provided with a containing cavity and a loading cavity which are mutually spaced, the containing cavity is used for containing cooling liquid, and the loading cavity is used for loading battery monomers. The first semiconductor refrigerating piece is arranged on the bracket and positioned at one end of the accommodating cavity, the first semiconductor refrigerating piece is used for heating the cooling liquid and/or refrigerating the cooling liquid, and the bracket is used for exchanging heat between the cooling liquid and the battery cell so as to heat or dissipate heat of the battery cell. The battery module is in a heating mode, the first semiconductor refrigerating sheet heats the cooling liquid, and heat is transferred through the bracket to heat the battery cells. The battery module is in a heat dissipation mode, the first semiconductor refrigerating sheet refrigerates cooling liquid, and the cooling liquid absorbs heat of the battery monomer so as to dissipate heat of the battery monomer. The first semiconductor refrigerating sheet of the battery module heats and dissipates heat of the battery module by using the cooling liquid, and the structure of heating and dissipating heat is simpler.

Description

Battery module and energy storage device

Technical Field

The application relates to the technical field of energy storage, in particular to a battery module and an energy storage device.

Background

The battery module is generally provided with a heating device to heat it so as not to generate byproducts at low temperature to damage the battery cells. Meanwhile, a heat dissipation structure is designed to dissipate heat of the battery module, so that the normal use is prevented from being influenced and even potential safety hazards are prevented from being generated due to the fact that the temperature of the battery cell is too high. However, the heating device and the heat dissipation structure of the conventional battery module are complex.

Disclosure of Invention

The embodiment of the application provides a battery module and an energy storage device, which are at least used for solving the problem that a heating device and a radiating structure of the battery module are complex.

The battery module of the embodiment of the application comprises a battery cell, a bracket and a first semiconductor refrigerating sheet. The support is provided with a containing cavity and a loading cavity which are mutually spaced, the containing cavity is used for containing cooling liquid, and the loading cavity is used for loading the battery cells. The first semiconductor refrigerating piece is arranged on the bracket and is positioned at one end of the accommodating cavity, the first semiconductor refrigerating piece is used for heating the cooling liquid and/or refrigerating the cooling liquid, and the bracket is used for exchanging heat between the cooling liquid and the battery cell so as to heat or dissipate heat of the battery cell.

In some embodiments, the first semiconductor refrigeration sheet includes first and second opposite sides, the first side of the first semiconductor refrigeration sheet being closer to the receiving cavity than the second side of the first semiconductor refrigeration sheet.

In some embodiments, the battery module has a heat dissipation mode, and in the heat dissipation mode of the battery module, the first side of the first semiconductor refrigeration sheet is a cold end, and the second side of the first semiconductor refrigeration sheet is a hot end.

In some embodiments, the battery module has a heating mode, and in the heating mode of the battery module, the first side of the first semiconductor refrigeration sheet is a hot side and the second side of the first semiconductor refrigeration sheet is a cold side.

In some embodiments, the battery module is capable of switching between a heat dissipation mode and a heating mode. Wherein: when the battery module is in a heat dissipation mode, the first semiconductor refrigerating piece is electrified with current in a first direction, so that a first side of the first semiconductor refrigerating piece is a cold end, and a second side of the first semiconductor refrigerating piece is a hot end; and under the heating mode of the battery module, the first semiconductor refrigerating sheet is electrified with current in a second direction so that a first side of the first semiconductor refrigerating sheet is a hot end, a second side of the first semiconductor refrigerating sheet is a cold end, and the second direction is opposite to the first direction.

In some embodiments, the battery module further includes a second semiconductor cooling fin mounted to the bracket and located at the other end of the receiving cavity, and the second semiconductor cooling fin is used for heating the cooling liquid and/or for cooling the cooling liquid.

In some embodiments, the first semiconductor refrigeration sheet includes first and second opposite sides, the first side of the first semiconductor refrigeration sheet being closer to the receiving cavity than the second side of the first semiconductor refrigeration sheet; the second semiconductor refrigeration piece comprises a first side and a second side which are opposite to each other, and the first side of the second semiconductor refrigeration piece is closer to the accommodating cavity than the second side of the second semiconductor refrigeration piece.

In some embodiments, the battery module has a heat dissipation mode and a heating mode, and the first semiconductor cooling fin and the second semiconductor cooling fin alternately operate. When the battery module is in a heat dissipation mode, a first side of the first semiconductor refrigerating sheet is a cold end, and a second side of the first semiconductor refrigerating sheet is a hot end; and when the battery module is in a heating mode, the first side of the second semiconductor refrigerating piece is a hot end, and the second side of the second semiconductor refrigerating piece is a cold end.

In some embodiments, the battery module has a heat dissipation mode and a heating mode, and the first semiconductor cooling fin and the second semiconductor cooling fin operate simultaneously. Wherein: when the battery module is in a heat dissipation mode, the first side of the first semiconductor refrigeration piece is a cold end, the second side of the first semiconductor refrigeration piece is a hot end, the first side of the second semiconductor refrigeration piece is a cold end, and the second side of the second semiconductor refrigeration piece is a hot end; and when the battery module is in a heating mode, the first side of the first semiconductor refrigerating sheet is a hot end, the second side of the first semiconductor refrigerating sheet is a cold end, the first side of the second semiconductor refrigerating sheet is a hot end, and the second side of the second semiconductor refrigerating sheet is a cold end.

In some embodiments, the second side of the first semiconductor cooling fin is provided with a first heat sink for transferring heat from the first semiconductor cooling fin.

In some embodiments, a second side of the second semiconductor refrigeration sheet is provided with a second heat sink for transferring heat from the second semiconductor refrigeration sheet.

In some embodiments, the second side of the first semiconductor refrigeration sheet is provided with a first heat sink for transferring heat from the first semiconductor refrigeration sheet; and a second radiator is arranged on the second side of the second semiconductor refrigerating sheet and used for transferring heat of the second semiconductor refrigerating sheet.

In some embodiments, the support includes a first support, the first support is provided with the accommodating cavity and the loading cavity, two opposite ends of the accommodating cavity are respectively provided with a first cover body and a second cover body, the first cover body and the second cover body cover the accommodating cavity, the first semiconductor refrigerating sheet is arranged on the first cover body, and the second semiconductor refrigerating sheet is arranged on the second cover body.

In certain embodiments, the battery module comprises a plurality of battery cells; the first support comprises a center frame and a plurality of layers of sub-supports, the accommodating cavities are formed in the center frame, each layer of sub-support is provided with a plurality of loading cavities, the plurality of layers of sub-supports encircle the center frame, adjacent sub-supports are connected through spokes, and the center frame is connected with the innermost sub-support through spokes.

In some embodiments, the first cover is provided with a first recess for loading the first semiconductor cooling fin.

In some embodiments, the second cover is provided with a second recess for loading the second semiconductor cooling fin.

In some embodiments, the first cover is provided with a first groove for loading the first semiconductor refrigeration sheet; the second cover body is provided with a second groove, and the second groove is used for loading the second semiconductor refrigerating sheet.

In certain embodiments, the height of the first support is 80% -90% of the height of the battery cell in the long axis direction of the battery cell.

In some embodiments, the rack further includes a second rack and a third rack, where the second rack and the third rack are respectively installed at opposite ends of the first rack, the second rack is provided with a first through hole and a second through hole that are spaced from each other, the first through hole corresponds to the accommodating cavity, the second through hole corresponds to the loading cavity, and the first through hole is used for accommodating at least the first semiconductor refrigeration sheet; the third support is provided with a first perforation and a second perforation which are mutually spaced, the first perforation corresponds to the accommodating cavity, the first perforation is used for accommodating at least the second semiconductor refrigerating sheet, and the second perforation corresponds to the loading cavity.

In some embodiments, the battery module further includes an electrical connection assembly mounted to the bracket, the electrical connection assembly being configured to connect a plurality of the battery cells in series.

In some embodiments, the electrical connection assembly includes a first electrical connector and a second electrical connector, the first electrical connector is mounted on the second bracket and is electrically connected to one end of the battery cell through the second through hole; the second electric connecting piece is arranged on the third bracket and is electrically connected with the other end of the battery unit through the second through hole.

In certain embodiments, the battery module comprises a plurality of battery cells; the battery module further comprises a soaking mode, and when the battery module is in the soaking mode, the bracket is used for exchanging heat between the battery cells with different temperatures through the cooling liquid so as to enable the temperature difference between all the battery cells to be within a preset range.

In some embodiments, the bracket is used to transfer heat of the battery cell having a higher temperature to the coolant to vaporize the coolant, and to transfer heat generated by vaporization of the coolant to the battery cell having a lower temperature when the battery module is in the soaking mode.

In certain embodiments, a heat conductive gel is disposed between the battery cell and the inner wall of the loading chamber.

The energy storage device housing according to an embodiment of the present application and the battery module according to any of the above embodiments are mounted to the housing.

In the battery module and the energy storage device in the embodiment of the application, when the battery module is in the heating mode, the first semiconductor refrigerating sheet heats the cooling liquid in the accommodating cavity, the temperature of the cooling liquid is increased, and heat is transferred to the battery cells in the loading cavity through the bracket to heat the battery cells. And when the battery module is in a heat dissipation mode, the first semiconductor refrigerating sheet refrigerates the cooling liquid in the accommodating cavity, and the temperature of the cooling liquid is reduced, so that the heat of the battery monomer transferred through the bracket is absorbed to dissipate heat of the battery monomer. The first semiconductor refrigerating sheet of the battery module of the embodiment of the application heats and dissipates heat of the battery module by using the cooling liquid, and the structure of heating and dissipating heat is simpler.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

Fig. 1 is a schematic perspective assembly view of a battery module according to some embodiments of the present application;

fig. 2 is an exploded perspective view of a battery module according to some embodiments of the present application;

fig. 3 is an exploded perspective view of a bracket of the battery module of fig. 2;

fig. 4 is a schematic cross-sectional view of the battery module shown in fig. 1, taken along the line IV-IV;

fig. 5 is a schematic cross-sectional view illustrating a battery module in a heating mode in the case where the battery module according to some embodiments of the present application includes only a first semiconductor cooling fin;

fig. 6 is a schematic cross-sectional view illustrating a battery module in a heat dissipation mode in the case where the battery module according to some embodiments of the present application includes only a first semiconductor cooling fin;

fig. 7 is a schematic cross-sectional view of a battery module in a heat dissipation mode in the case that the battery module according to some embodiments of the present application includes only a first semiconductor cooling fin and the first semiconductor cooling fin is supplied with a first directional current;

fig. 8 is a schematic cross-sectional view of a battery module in a heat dissipation mode in a case where the battery module according to some embodiments of the present application includes only a first semiconductor cooling fin and the first semiconductor cooling fin is energized with a current in a second direction;

fig. 9 is a schematic cross-sectional view of a battery module according to some embodiments of the present application including both a first semiconductor cooling fin and a second semiconductor cooling fin, wherein the battery module is in a heating mode when one of the semiconductor cooling fins is operated;

Fig. 10 is a schematic cross-sectional view of a battery module according to some embodiments of the present application, including a first semiconductor cooling fin and a second semiconductor cooling fin, wherein the battery module is in a heat dissipation mode when one of the semiconductor cooling fins is operated;

fig. 11 is a schematic cross-sectional view of a battery module according to some embodiments of the present application, including a first semiconductor cooling fin and a second semiconductor cooling fin, in a heating mode, in a case where both semiconductor cooling fins are operated;

fig. 12 is a schematic cross-sectional view of a battery module according to some embodiments of the present application in a heat dissipation mode, in which the battery module includes a first semiconductor cooling fin and a second semiconductor cooling fin, and both semiconductor cooling fins are operated;

fig. 13 is a schematic cross-sectional view of a battery module according to some embodiments of the present application in a soaking mode;

fig. 14 is a schematic structural view of an energy storage device according to some embodiments of the present application.

Description of main reference numerals:

1000. an energy storage device; 100. a battery module; 10. a battery cell; 30. a bracket; 31. a first bracket; 311. a center frame; 3111. a housing chamber; 3113. a cooling liquid; 313. a sub-mount; 3131. a loading chamber; 3133. a heat-conducting adhesive; 315. spokes; 33. a second bracket; 331. a first through hole; 333. a second through hole; 35. a third bracket; 351. a first perforation; 353. a second perforation; 36. a closed space; 37. a first cover; 371. a first groove; 39. a second cover; 391. a second groove; 50. a first semiconductor refrigeration sheet; 51. a first side of the first semiconductor refrigeration sheet; 53. a second side of the first semiconductor refrigeration sheet; 60. a first heat sink; 70. a second semiconductor refrigeration sheet; 71. a first side of a second semiconductor refrigeration sheet; 73. a second side of the second semiconductor refrigeration sheet; 80. a second heat sink; 90. an electrical connection assembly; 91. a first electrical connection; 93. a second electrical connection; 300. a housing.

Detailed Description

Embodiments of the present application are described in detail below, and are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.

In the description of embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

The battery module is generally provided with a heating device to heat it so as not to generate byproducts at low temperature to damage the battery cells. Meanwhile, a heat dissipation structure is designed to dissipate heat of the battery module, so that the battery cell temperature is prevented from being too high to influence normal use and even generate potential safety hazards. However, the conventional battery module heating device and the heat dissipation structure are complex. To solve this problem, the present application provides a battery module 100 (shown in fig. 1) and an energy storage device 1000 (shown in fig. 14).

Referring to fig. 1 and 2, a battery module 100 according to an embodiment of the application includes a battery cell 10, a bracket 30, and a first semiconductor refrigeration sheet 50. Referring to fig. 3 and 4, the bracket 30 is provided with a receiving chamber 3111 and a loading chamber 3131, which are spaced apart from each other, the receiving chamber 3111 is used for receiving the cooling liquid 3113, and the loading chamber 3131 is used for loading the battery cells 10. The first semiconductor cooling fin 50 is mounted to the bracket 30 at one end of the receiving cavity 3111, the first semiconductor cooling fin 50 is used for heating the cooling fluid 3113 and/or for cooling the cooling fluid 3113, and the bracket 30 is used for exchanging heat between the cooling fluid 3113 and the battery cell 10 to heat or dissipate heat of the battery cell 10.

Specifically, the battery module 100 is a structure for supplying electric power to other devices, the battery cells 10 are elements capable of generating electric power, one or more battery cells 10 in the battery module 100 may be provided, and a plurality of battery cells 10 in the battery module 100 according to the embodiment of the present application may be provided. The heat generated by the plurality of battery cells 10 when operated, that is, the temperatures of the plurality of battery cells 10 are different, is different between the plurality of battery cells 10 due to individual differences.

The battery module 100 of the embodiment of the application may have at least one of a heat dissipation mode, a heating mode, and a soaking mode. The heat dissipation mode is a mode in which the battery cells 10 in the battery module 100 are overheated to dissipate heat, and the battery cells 10 in the heating mode battery module 100 are supercooled to heat, and the soaking mode is a mode in which the temperature difference of the plurality of battery cells 10 in the battery module 100 is large to make the temperature between the plurality of battery cells 10 relatively uniform, so that the temperature difference between the plurality of battery cells 10 is within a preset range.

The bracket 30 is a structure for loading other components and capable of transferring heat so that heat exchange is performed between the components. The holder 30 of the present application is used to load the battery cells 10 and the cooling liquid 3113. The bracket 30 also serves for heat exchange between the cooling fluid 3113 and the battery cell 10.

The cooling liquid 3113 in the present application is a phase change material, and the phase change material can absorb heat or emit heat during the phase change, and specifically, the cooling liquid 3113 in the present application is a mixture of ethylene glycol and water.

The first semiconductor cooling fin 50 is a structure for heating or cooling other elements. The first semiconductor refrigerating sheet 50 includes a couple formed of two different types of semiconductor materials connected in series, and heat transfer is generated at both ends of the couple when a current passes through the couple by using a Peltier effect of the semiconductor materials, i.e., the first semiconductor refrigerating sheet 50 can be cooled at one end and heated at the other end to form a cold end and a hot end.

In one embodiment, the first semiconductor refrigeration sheet 50 is used to heat the cooling fluid 3113. At this time, the hot end of the first semiconductor fin 50 is closer to the cooling liquid 3113 than the cold end, and the cooling liquid 3113 absorbs heat generated at the hot end of the first semiconductor fin 50, so that the cooling liquid 3113 is heated. In another embodiment, the first semiconductor refrigeration sheet 50 is used to refrigerate a coolant 3113. At this time, the cold end of the first semiconductor refrigeration sheet 50 is closer to the cooling liquid 3113 than the hot end, and the cold end of the first semiconductor refrigeration sheet 50 absorbs heat of the cooling liquid 3113, thereby cooling the cooling liquid 3113. In yet another embodiment, the first semiconductor refrigeration sheet 50 is used to heat both the cooling fluid 3113 and the first semiconductor refrigeration sheet 50 is used to cool the cooling fluid 3113, at which time the cold and hot ends of the first semiconductor refrigeration sheet 50 can be switched to achieve that in the case of heating the cooling fluid 3113, the hot end of the first semiconductor refrigeration sheet 50 is closer to the cooling fluid 3113 than the cold end. In the case of cooling liquid 3113, the cold side of first semiconductor refrigeration sheet 50 is closer to liquid 3113 than the hot side.

In the battery module 100 according to the embodiment of the application, the first semiconductor refrigeration sheet 50 heats the cooling liquid 3113 in the accommodating chamber 3111 when the battery module 100 is in the heating mode, the temperature of the cooling liquid 3113 increases, and heat is transferred to the battery cells 10 in the loading chamber 3131 through the bracket 30 to heat the battery cells 10. In the heat dissipation mode of the battery module 100, the first semiconductor cooling fin 50 cools the cooling liquid 3113 in the receiving cavity 3111, and the temperature of the cooling liquid 3113 is lowered, thereby absorbing heat of the battery cells 10 transferred through the bracket 30 to dissipate heat of the battery cells 10. The battery module 100 according to the embodiment of the application heats and dissipates heat of the battery module 100 by using the cooling liquid 3113 through the first semiconductor refrigerating sheet 50, and the structure of heating and dissipating heat is relatively simple.

The battery module 100 is further described with reference to the accompanying drawings.

Referring to fig. 2 to 4, in some embodiments, the rack 30 includes a first rack 31, the first rack 31 is provided with a receiving cavity 3111 and a loading cavity 3131, two opposite ends of the receiving cavity 3111 are respectively provided with a first cover 37 and a second cover 39, the first cover 37 and the second cover 39 seal the receiving cavity 3111, and the first semiconductor refrigeration sheet 50 is disposed on the first cover 37.

The first holder 31 is a structure for holding other components and capable of transferring heat. For example, the first holder 31 is used to hold the battery cell 10 and the cooling liquid 3113 and to transfer heat of the cooling liquid 3113 to the battery cell 10, and may also transfer heat of the battery cell 10 to the cooling liquid 3113. The first support 31 may be made of a material with high thermal conductivity, for example, the material of the first support 31 may be, but not limited to, aluminum alloy, magnesium alloy, titanium alloy, or the like.

The housing cavity 3111 is a structure for housing other components therein, and the housing cavity 3111 penetrates opposite ends of the first bracket 31 in the long axis direction of the first bracket 31. The shape of the cross section of the receiving cavity 3111 may be, but is not limited to, circular, elliptical, rectangular, etc.

The number of receiving cavities 3111 may be one or more. In the case where the housing chambers 3111 are one, the housing chambers 3111 may be opened at any position of the first bracket 31. Preferably, the receiving cavity 3111 is opened at the center of the first bracket 31, so that heat transfer between the cooling liquid 3113 in the receiving cavity 3111 and the battery cell 10 is more uniform. At this time, the first bracket 31 has a simple structure and is convenient to process. In the case where there are a plurality of accommodating chambers 3111, the accommodating chambers 3111 may be uniformly or non-uniformly opened in the first bracket 31. Preferably, the plurality of receiving chambers 3111 are uniformly formed at the first bracket 31, so that heat transfer between the cooling fluid 3113 in the receiving chambers 3111 and the battery cells 10 is more uniform. At this time, the heat transfer efficiency between the cooling liquid 3113 and the battery cells 10 is higher, and the heat dissipation and heating rate of the battery module 100 is faster.

The loading chamber 3131 is a space structure for loading other components therein, and the loading chamber 3131 penetrates opposite ends of the first holder 31 in the long axis direction of the first holder 31. The number of the loading chambers 3131 may be one or more, the number of the loading chambers 3131 in the embodiment of the present application is a plurality, the plurality of loading chambers 3131 are annularly distributed on the first bracket 31, and the number of the loading chambers 3131 corresponds to the number of the battery cells 10. A plurality of loading chambers 3131 are opened around the receiving chamber 3111 to make heat transfer between the cooling liquid 3113 in the receiving chamber 3111 and the battery cells 10 in the loading chambers 3131 more uniform.

Generally, the opening size of the loading chamber 3131 is larger than the corresponding size of the battery cell 10, and preferably, the opening size of the loading chamber 3131 is larger than the corresponding size of the battery cell 10 by 0.2mm. For example, if the battery cell 10 is cylindrical, and the loading chamber 3131 is also cylindrical, the inner diameter of the loading chamber 3131 is 0.2mm larger than the outer diameter of the battery cell 10; if the battery cell 10 is square, and the loading chamber 3131 is also square, the width of the loading chamber 3131 is greater than the width of the battery cell 10 by 0.2mm, and the length of the loading chamber 3131 is greater than the length of the battery cell 10 by 0.2mm. Thereby, there is a gap between the battery cell 10 and the inner wall of the loading chamber 3131, which may be filled with the heat conductive adhesive. That is, a heat conductive adhesive 3133 is provided between the battery cell 10 and the inner wall of the loading chamber 3131. On the one hand, the heat conductive adhesive 3133 is used to fix the battery cell 10 so that the battery cell 10 is sufficiently contacted with the inner wall of the loading chamber 3131. On the other hand, the heat conductive paste 3133 is also used to conduct heat, for example, the heat conductive paste 3133 is used to transfer heat of the inner wall of the loading chamber 3131 to the battery cell 10 or transfer heat of the battery cell 10 to the inner wall of the loading chamber 3131. The heat conductive gel 3133 may be a heat conductive silica gel or a heat conductive gel, etc.

With continued reference to fig. 2 to 4, the first cover 37 and the second cover 39 are structures for sealing other components, the first cover 37 and the second cover 39 are respectively connected to the openings at two opposite ends of the accommodating cavity 3111, and the first cover 37 and the second cover 39 are used for sealing the accommodating cavity 3111. The first cover 37 may be made of a metal heat conductive material for transferring heat between the first semiconductor fin 50 and the cooling liquid 3113.

The first cover 37, the second cover 39 and the receiving chamber 3111 together form an enclosed space 36, which enclosed space 36 is used for loading the cooling liquid 3113. The volume of the cooling liquid 3113 in the enclosed space 36 is [40%,60% ] in the whole enclosed space 36, so that the cooling liquid 3113 can be heated and evaporated to fill the whole enclosed space 36 when the battery module 100 is in the heating mode, and thus the inner wall of the accommodating cavity 3111 is heated uniformly, and the heat transferred from the bracket 30 to the battery cell 10 is also uniform. In the case where the volume of the cooling liquid 3113 is less than 40% of the volume of the enclosed space 36, the entire enclosed space 36 cannot be filled when the cooling liquid 3113 evaporates while the battery module 100 is in the heating mode, so that the inner wall of the receiving cavity 3111 is heated unevenly, resulting in uneven heat transfer from the bracket 30 to the battery cell 10. In the case where the volume of the cooling liquid 3113 is greater than 60% of the volume of the enclosed space 36, the pressure of the gas in the enclosed space 36 is too high after the cooling liquid 3113 is evaporated while the battery module 100 is in the heating mode, so that the entire battery module 100 is expanded, and safety accidents such as explosion are easily caused. Under the condition that the volume of the cooling liquid 3113 accounts for [40%,60% ] of the volume range of the enclosed space 36, when the battery module 100 is in the heating mode, the cooling liquid 3113 can fully fill the whole enclosed space 36 after being evaporated and vaporized, so that the inner wall of the accommodating cavity 3111 is ensured to be heated uniformly, the heat transferred from the bracket 30 to the battery cell 10 is also uniform, meanwhile, the pressure in the enclosed space 36 is also within a preset range, safety accidents such as explosion caused by expansion of the battery module 100 are avoided, and the safety of the battery module 100 is ensured.

The enclosed space 36 is a vacuum environment in which the critical boiling point of the cooling fluid 3113 is low so that the cooling fluid 3113 does not need to be at a too high temperature to evaporate and vaporize to fill the entire enclosed space 36. At the same time, the heat loss in the vacuum environment is less, and the heat of the cooling liquid 3113 can be maximally transferred to the battery cell 10 through the bracket 30.

The shape of the cross section of the first cover 37 may be, but not limited to, circular, elliptical, rectangular, or the like, and the shape of the cross section of the first cover 37 may be, but not limited to, circular, elliptical, rectangular, or the like. The cross-sectional shapes of the first cover 37 and the second cover 39 may or may not correspond. Preferably, the cross-sectional area of the first cover 37 is greater than or equal to the cross-sectional area of the accommodating cavity 3111, and the cross-sectional area of the second cover 39 is greater than or equal to the cross-sectional area of the accommodating cavity 3111, so that the first cover 37 and the second cover 39 are sealed to both end openings of the accommodating cavity 3111. The first cover 37 and the second cover 39 are detachably connected with the accommodating cavity 3111, wherein the detachable connection mode can be threaded connection, snap connection or the like.

In some embodiments, the first semiconductor refrigeration sheet 50 is disposed on a side of the first cover 37 that is remote from the receiving cavity 3111.

Referring to fig. 4, in some embodiments, the height of the first bracket 31 in the long axis direction of the battery cell 10 is 80% -90% of the height of the battery cell 10. Specifically, in the case where the battery cell 10 is a cylindrical battery, the long axis direction of the battery cell 10 is the length direction of the cylindrical battery, and in the case where the battery cell 10 is a prismatic battery, the long axis direction of the battery cell 10 is the height direction of the prismatic battery.

Opposite ends of the battery cell 10 protrude from opposite ends of the first bracket 31. In the case where the height of the first holder 31 is greater than 90% of the height of the battery cell 10 in the long axis direction of the battery cell 10, since the first holder 31 is a heat conductive metal material, the first holder 31 has a risk of touching the positive and negative electrodes at both ends of the battery cell 10, thereby causing a short circuit. In the long axis direction of the battery cell 10, in the case that the height of the first bracket 31 is less than 80% of the height of the battery cell 10, the contact area between the first bracket 31 and the battery cell 10 is small, and the heat conduction effect of the first bracket 31 on the battery cell 10 is relatively poor. In the long axis direction of the battery cell 10, under the condition that the height of the first bracket 31 is 80% -90% of the height of the battery cell 10, the first bracket 31 does not touch the positive electrode and the negative electrode at two ends of the battery cell 10 to cause short circuit risk, meanwhile, the contact area between the first bracket 31 and the battery cell 10 is large, and the heat conduction effect of the first bracket 31 on the battery cell 10 is relatively good.

Referring to fig. 3 and 4, further, in some embodiments, the first support 31 includes a central frame 311 and a plurality of sub-supports 313, the accommodating cavity 3111 is disposed in the central frame 311, each sub-support 313 is provided with a plurality of loading cavities 3131, each sub-support 313 surrounds the central frame 311, adjacent sub-supports 313 are connected by spokes 315, and the central frame 311 is connected to the sub-support 313 of the innermost layer by spokes 315.

Specifically, the center frame 311 is provided with a housing chamber 3111, and the housing chamber 3111 is filled with a cooling liquid 3113. In one embodiment, the number of the center frames 311 is one, and one center frame 311 is located at the center position of the first bracket 31. A central frame 311 is provided with a corresponding accommodating cavity 3111. In another embodiment, the number of the center frames 311 is plural, the plurality of center frames 311 are uniformly distributed on the first support 31, and the multi-layered sub-support 313 is distributed around the plurality of center frames 311. The center frames 311 are provided with a plurality of corresponding accommodating cavities 3111. The number of the center frames 311 is one in the embodiment of the present application, and one center frame 311 is provided at the center position of the first bracket 31.

The sub-support 313 is opened with a loading chamber 3131, the loading chamber 3131 loads the battery cell 10, and the sub-support 313 may be, but not limited to, one layer, two layers, or more layers. In the case where the sub-mount 313 is one layer, the one layer of sub-mount 313 is disposed around the center mount 311. At this time, the first holder 31 is applied to the battery module 100 having fewer battery cells 10. In the case that the sub-support 313 is multi-layered, the first-layered sub-support 313 is disposed around the center frame 311, and the second-layered sub-support 313 is disposed around the first-layered sub-support 313, sequentially layer by layer. At this time, the first holder 31 is applied to the battery modules 100 having a large number of battery cells 10. The embodiment of the application comprises two layers of sub-supports 313, wherein an inner layer of sub-supports 313 is arranged around the central frame 311, and an outer layer of sub-supports 313 is arranged around the inner layer of sub-supports 313.

Spokes 315 serve to connect the center frame 311 to the multi-layered sub-mount 313 while serving to transfer heat between the center frame 311 and the sub-mount 313. In the heating mode of the battery module 100, heat of the cooling liquid 3113 is transferred from the center frame 311 to the battery cells 10 in the respective layer sub-frames 313 through the spokes 315. In the case of cooling, the heat of the battery cells 10 in each layer of sub-mount 313 is transferred to the cooling liquid 3113 inside the center frame 311 through the spokes 315.

The center frame 311, the sub-support 313 and the spokes 315 may be of a unitary structure or of a split structure. In the case that the center frame 311, the sub-support 313 and the spokes 315 are of a separate structure, the spokes 315 and the sub-support 313 are sequentially mounted on the center frame 311.

Further, referring to fig. 2 and 3, in one embodiment, the first cover 37 may be provided with a first groove 371, and the first groove 371 is used for loading the first semiconductor refrigeration sheet 50. Wherein, the first groove 371 is opened at one side of the first cover 37 away from the accommodating cavity 3111. The first groove 371 is a sinking space, and the first semiconductor refrigeration sheet 50 is loaded in the first groove 371 to reduce the overall height of the battery module 100.

The depth of the first groove 371 may be the same as the thickness of the first semiconductor refrigeration sheet 50, the depth of the first groove 371 may be smaller than the thickness of the first semiconductor refrigeration sheet 50, and the depth of the first groove 371 may be larger than the thickness of the first semiconductor refrigeration sheet 50. The shape of the cross section of the first groove 371 may be, but not limited to, circular, elliptical, rectangular, etc., and the shape of the cross section of the first groove 371 may or may not correspond to the shape of the cross section of the first semiconductor cooling fin 50. Preferably, the cross-sectional shape of the first groove 371 corresponds to the cross-sectional shape of the first semiconductor refrigeration sheet 50, so that the peripheral wall of the first groove 371 can limit the first semiconductor refrigeration sheet 50 to the maximum extent, and the first semiconductor refrigeration sheet 50 is more firmly mounted.

Referring to fig. 2 and 3, further, in some embodiments, the bracket 30 may further include a second bracket 33 and a third bracket 35, the second bracket 33 and the third bracket 35 are respectively mounted at opposite ends of the first bracket 31, the second bracket 33 is provided with a first through hole 331 and a second through hole 333 spaced apart from each other, the first through hole 331 corresponds to the accommodating cavity 3111, the first through hole 331 is at least used for accommodating the first semiconductor refrigeration sheet 50, and the second through hole 333 corresponds to the loading cavity 3131; the third bracket 35 is provided with a first through hole 351 and a second through hole 353 spaced apart from each other, the first through hole 351 corresponds to the accommodating chamber 3111, and the second through hole 353 corresponds to the loading chamber 3131.

Specifically, the second holder 33 is a structure for fixing other elements, for example, the second holder 33 serves to fix one end of the battery cell 10 protruding from the first holder 31 and insulate between the plurality of battery cells 10. The third holder 35 is a structure for fixing other elements, for example, the third holder 35 serves to fix the other ends of the battery cells 10 protruding from the first holder 31 and insulate the plurality of battery cells 10 from each other. Preferably, the second support 33 and the third support 35 are made of plastic material to achieve the insulation effect. The second bracket 33 and the third bracket 35 are detachably mounted to the first bracket 31, wherein the detachable connection manner can be, but not limited to, a threaded connection, a screw connection, a snap connection, or the like.

The first through hole 331 is for accommodating the first semiconductor refrigeration sheet 50. The second through hole 333 is used for one end of the battery cell 10 to protrude. The second perforation 353 is for the other end of the power supply unit 10 to protrude.

The opening sizes of the first through hole 331 and the first through hole 351 may be the same as the opening size of the receiving cavity 3111, or may be smaller than the opening size of the receiving cavity 3111. Preferably, the opening sizes of the first through hole 331 and the first through hole 351 are smaller than the opening size of the receiving cavity 3111, and at this time, the first through hole 331 may be used for fixing the first cover 37, and the first through hole 351 may be used for fixing the second cover 39. The second through holes 333 and the second penetration holes 353 have the same opening size as the loading chamber 3131 so that the battery cells 10 can protrude from the second through holes 333 and the second penetration holes 353, while the second through holes 333 and the second penetration holes 353 can fix the battery cells 10.

Referring to fig. 2, in some embodiments, the first semiconductor refrigeration sheet 50 includes a first side 51 and a second side 53 opposite to each other, and the first side 51 of the first semiconductor refrigeration sheet 50 is closer to the accommodating cavity 3111 than the second side 53 of the first semiconductor refrigeration sheet 50.

Since the first side 51 of the first semiconductor refrigeration sheet 50 is closer to the receiving cavity 3111 than the second side 53 of the first semiconductor refrigeration sheet 50, the first side 51 of the first semiconductor refrigeration sheet 50 is used to heat or cool the cooling liquid 3113 in the receiving cavity 3111.

In some embodiments, the battery module 100 includes only the first semiconductor cooling fin 50. Referring to fig. 5, in some examples, the battery module 100 has only a heating mode. In the heating mode of the battery module 100, the first side 51 of the first semiconductor refrigeration sheet 50 is a hot side and the second side 53 of the first semiconductor refrigeration sheet 50 is a cold side. The heating mode is used to heat the battery module 100 when the temperature of the battery module 100 is low, so as not to generate byproducts at low temperature and damage the battery cells 10.

Specifically, referring to fig. 5, when the battery module 100 is in the heating mode, the first side 51 (hot end) of the first semiconductor refrigeration sheet 50 is used to heat the cooling liquid 3113. At this time, the cooling liquid 3113 is heated and evaporated, the entire enclosed space 36 is filled by vaporization, the heat of the cooling liquid 3113 is uniformly distributed throughout the center frame 311, and the heat of the center frame 311 is transferred to each layer of sub-frames 313 through the spokes 315, so that the heat of the sub-frames 313 is transferred to the battery cells 10 through the heat conductive adhesive 3133, thereby heating the battery cells 10.

Referring to fig. 6, in the case where the battery module 100 includes only the first semiconductor cooling fin 50, in other examples, the battery module 100 has only a heat dissipation mode. In the heat dissipation mode of the battery module 100, the first side 51 of the first semiconductor refrigeration sheet 50 is a cold end, and the second side 53 of the first semiconductor refrigeration sheet 50 is a hot end. When the temperature of the battery module 100 is high, the heat dissipation mode is adopted to dissipate heat of the battery module 100, so that the normal use is prevented from being influenced and even potential safety hazards are prevented from being generated due to the fact that the temperature of the battery cell 10 is too high.

Specifically, referring to fig. 6, when the battery module 100 is in the heat dissipation mode, the first side 51 (cold end) of the first semiconductor refrigeration sheet 50 is used for refrigerating the cooling fluid 3113. The vaporized cooled liquid 3113 is cooled and condensed back to liquid. At this time, the temperature of the cooling liquid 3113 is lower than the battery cell 10. The heat of the battery cell 10 is transferred to the sub-brackets 313 through the heat conducting glue 3133, the heat of each layer of sub-brackets 313 is transferred to the center frame 311 through the spokes 315, and the cooling liquid 3113 in the accommodating cavity 3111 of the center frame 311 absorbs the heat so as to cool the battery cell 10, thereby achieving the purpose of heat dissipation.

Referring to fig. 7 and 8, in the case where the battery module 100 includes only the first semiconductor cooling fin 50, the battery module 100 can be switched between a heat dissipation mode (shown in fig. 8) and a heating mode (shown in fig. 7) in still other examples. Referring to fig. 8, when the battery module 100 is in the heat dissipation mode, the first semiconductor refrigeration sheet 50 is energized with a current in a first direction, such that the first side 51 of the first semiconductor refrigeration sheet 50 is a cold end and the second side 53 of the first semiconductor refrigeration sheet 50 is a hot end; in the heating mode of the battery module 100, the first semiconductor refrigeration sheet 50 is energized with a current in a second direction, such that the first side 51 of the first semiconductor refrigeration sheet 50 is a hot end, the second side 53 of the first semiconductor refrigeration sheet 50 is a cold end, and the second direction is opposite to the first direction. At this time, the battery module 100 is provided with only the first semiconductor cooling fin 50, but the first semiconductor cooling fin 50 has both heating and heat dissipation functions. By changing the direction of the current, the direction of the cold and hot ends of the first semiconductor cooling fin 50 can be changed, thereby switching the battery module 100 between the heating mode and the heat dissipation mode.

Referring to fig. 2, further, in some embodiments, the battery module 100 further includes a second semiconductor cooling plate 70, the second semiconductor cooling plate 70 is mounted on the bracket 30 and located at the other end of the accommodating cavity 3111, and the second semiconductor cooling plate 70 is used for heating the cooling liquid 3113 and transferring heat through the bracket 30 to heat the battery cells 10; or for cooling the cooling fluid 3113, the cooling fluid 3113 being used to absorb heat transferred from the battery cells 10 through the bracket 30 to dissipate heat from the battery cells 10.

In some embodiments, the second semiconductor refrigeration sheet 70 is disposed on a side of the second cover 39 remote from the receiving cavity 3111. At this time, the second cover 39 may be made of a metal heat conductive material for transferring heat between the second semiconductor refrigeration sheet 70 and the cooling liquid 3113.

Still further, in some embodiments, the second cover 39 may be provided with a second recess 391 for loading the second semiconductor refrigeration sheet 70. The second groove 391 is disposed on a side of the second cover 39 away from the accommodating cavity 3111. The second groove 391 is a sinking space, and the second semiconductor refrigeration sheet 70 is mounted in the second groove 391 to further reduce the overall height of the battery module 100. Meanwhile, the first through hole 351 is at least for accommodating the second semiconductor refrigeration sheet 70.

The depth of the second groove 391 may be the same as the thickness of the second semiconductor cooling fin 70 of the battery module 100, the depth of the second groove 391 may be smaller than the thickness of the second semiconductor cooling fin 70 of the battery module 100, and the depth of the second groove 391 may be larger than the thickness of the second semiconductor cooling fin 70 of the battery module 100. The shape of the cross section of the second groove 391 may be, but not limited to, circular, elliptical, rectangular, or the like, and the shape of the cross section of the second groove 391 may or may not correspond to the shape of the cross section of the second semiconductor refrigeration sheet 70. Preferably, the shape of the cross section of the second groove 391 corresponds to the shape of the cross section of the second semiconductor refrigeration piece 70, so that the peripheral wall of the second groove 391 can limit the second semiconductor refrigeration piece 70 to the maximum extent, and the second semiconductor refrigeration piece 70 is more firmly mounted.

Specifically, the second semiconductor refrigeration sheet 70 is an element for heating or cooling other elements. The second semiconductor cooling fin 70 includes a couple formed of two different types of semiconductor materials connected in series, and heat transfer is generated at both ends of the couple when a current passes through the couple by using a Peltier effect of the semiconductor materials, i.e., the second semiconductor cooling fin 70 can cool at one end and heat at the other end to form a cold end and a hot end.

In one embodiment, the second semiconductor refrigeration sheet 70 is used to heat the cooling liquid 3113. At this time, the hot end of the second semiconductor fin 70 is closer to the cooling liquid 3113 than the cold end, and the cooling liquid 3113 absorbs heat generated at the hot end of the second semiconductor fin 70, so that the cooling liquid 3113 is heated. In another embodiment, a second semiconductor refrigeration sheet 70 is used to cool the cooling fluid 3113. At this time, the cold end of the second semiconductor refrigeration sheet 70 is closer to the cooling liquid 3113 than the hot end, and the cold end of the second semiconductor refrigeration sheet 70 absorbs heat of the cooling liquid 3113, thereby refrigerating the cooling liquid 3113. In yet another embodiment, a second semiconductor refrigeration sheet 70 is used to heat the cooling fluid 3113 and to cool the cooling fluid 3113. At this time, the cold end and the hot end of the second semiconductor refrigeration sheet 70 can be switched to realize that in the case of heating the cooling liquid 3113, the hot end of the second semiconductor refrigeration sheet 70 is closer to the cooling liquid 3113 than the cold end; in the case of cooling liquid 3113, the cold side of second semiconductor refrigeration sheet 70 is closer to liquid 3113 than the hot side.

Still further, in some embodiments, the second semiconductor refrigeration sheet 70 includes a first side 71 and a second side 73 opposite to each other, the first side 71 of the second semiconductor refrigeration sheet 70 being closer to the receiving cavity 3111 than the second side 73 of the second semiconductor refrigeration sheet 70.

Since the first side 71 of the second semiconductor refrigeration sheet 70 is closer to the receiving cavity 3111 than the second side 73 of the second semiconductor refrigeration sheet 70, the first side 71 of the second semiconductor refrigeration sheet 70 is used to heat or cool the cooling fluid 3113 in the receiving cavity 3111.

In some embodiments, the battery module 100 includes both the first semiconductor cooling fin 50 and the second semiconductor cooling fin 70. Referring to fig. 4, 9 and 10, in some examples, the battery module 100 has a heat dissipation mode and a heating mode, and the first semiconductor cooling fin 50 and the second semiconductor cooling fin 70 alternately operate. In the heat dissipation mode of the battery module 100, the first side 51 of the first semiconductor refrigeration sheet 50 is a cold end, and the second side 53 of the first semiconductor refrigeration sheet 50 is a hot end; in the heating mode of the battery module 100, the first side 71 of the second semiconductor refrigeration sheet 70 is a hot end and the second side 73 of the second semiconductor refrigeration sheet 70 is a cold end.

Specifically, when the battery module 100 is in the heating mode (shown in fig. 9), the second semiconductor cooling fin 70 is operated, the hot end of the first side 71 of the second semiconductor cooling fin 70 heats the cooling liquid 3113, at this time, the cooling liquid 3113 is heated and evaporated, the entire enclosed space 36 is filled by vaporization, the heat of the cooling liquid 3113 is uniformly distributed throughout the center frame 311, and the heat of the center frame 311 is transferred to each layer of sub-frames 313 through the spokes 315, so that the heat of the sub-frames 313 is transferred to the battery cells 10 through the heat conductive adhesive 3133, thereby heating the battery cells 10.

When the battery module 100 is in the heat dissipation mode (shown in fig. 10), the first semiconductor cooling fin 50 is operated, the cold end of the first side 51 of the first semiconductor cooling fin 50 cools the cooling liquid 3113, and the cooling liquid 3113 is condensed and returns to liquid, and at this time, the temperature of the cooling liquid 3113 is lower than that of the battery cell 10. The heat of the battery cell 10 is transferred to the sub-brackets 313 through the heat conducting glue 3133, the heat of each layer of sub-brackets 313 is transferred to the center frame 311 through the spokes 315, and the cooling liquid 3113 in the accommodating cavity 3111 of the center frame 311 absorbs the heat so as to cool the battery cell 10, thereby achieving the purpose of heat dissipation.

In some embodiments, the battery module 100 includes both the first semiconductor cooling fin 50 and the second semiconductor cooling fin 70. Referring to fig. 4, 11 and 12, the battery module 100 has a heat dissipation mode and a heating mode, and the first semiconductor cooling fin 50 and the second semiconductor cooling fin 70 operate simultaneously. Wherein: in the heat dissipation mode of the battery module 100, the first side 51 of the first semiconductor refrigeration sheet 50 is a cold end, the second side 53 of the first semiconductor refrigeration sheet 50 is a hot end, the first side 71 of the second semiconductor refrigeration sheet 70 is a cold end, and the second side 73 of the second semiconductor refrigeration sheet 70 is a hot end; in the heating mode of the battery module 100, the first side 51 of the first semiconductor refrigeration sheet 50 is a hot end, the second side 53 of the first semiconductor refrigeration sheet 50 is a cold end, the first side 71 of the second semiconductor refrigeration sheet 70 is a hot end, and the second side 73 of the second semiconductor refrigeration sheet 70 is a cold end.

Specifically, when the battery module 100 is in the heating mode (shown in fig. 11), the first semiconductor refrigeration sheet 50 is energized with a current in a first direction, the second semiconductor refrigeration sheet 70 is energized with a current in a third direction, such that the first side 51 of the first semiconductor refrigeration sheet 50 is a hot end, the second side 53 of the first semiconductor refrigeration sheet 50 is a cold end, the first side 71 of the second semiconductor refrigeration sheet 70 is a hot end, and the second side 73 of the second semiconductor refrigeration sheet 70 is a cold end. Wherein the first direction is opposite to the third direction. The hot side of the first side 51 of the first semiconductor refrigeration sheet 50 and the hot side of the first side 71 of the second semiconductor refrigeration sheet 70 together heat the cooling fluid 3113. At this time, the cooling liquid 3113 is heated and evaporated by the common heating of both ends, vaporization fills the entire enclosed space 36, the heat of the cooling liquid 3113 is uniformly distributed throughout the center frame 311, and the heat of the center frame 311 is transferred to each layer of sub-frames 313 through the spokes 315, so that the heat of the sub-frames 313 is transferred to the battery cells 10 through the heat conductive adhesive 3133, thereby heating the battery cells 10.

In the heat dissipation mode (shown in fig. 12) of the battery module 100, the first semiconductor cooling fin 50 is energized with a current in the second direction, and the second semiconductor cooling fin 70 is energized with a current in the fourth direction, so that the first side 51 of the first semiconductor cooling fin 50 is a cold end, the second side 53 of the first semiconductor cooling fin 50 is a hot end, the first side 71 of the second semiconductor cooling fin 70 is a cold end, and the second side 73 of the second semiconductor cooling fin 70 is a hot end. Wherein the second direction and the fourth direction are opposite. The cold end of the first side 51 of the first semiconductor refrigeration sheet 50 and the cold end of the first side 71 of the second semiconductor refrigeration sheet 70 collectively cool the cooling fluid 3113. The cooling liquid 3113 is condensed to be liquid by cooling both ends. At this time, the temperature of the cooling liquid 3113 is lower than the battery cell 10. The heat of the battery cell 10 is transferred to the sub-brackets 313 through the heat conducting glue 3133, the heat of each layer of sub-brackets 313 is transferred to the center frame 311 through the spokes 315, and the cooling liquid 3113 in the accommodating cavity 3111 of the center frame 311 absorbs the heat so as to cool the battery cell 10, thereby achieving the purpose of heat dissipation.

Referring to fig. 2 to 4 and 13, in some embodiments, the battery module 100 further includes a soaking mode (shown in fig. 13), and the bracket 30 is used to exchange heat between the battery cells 10 with different temperatures through the cooling liquid 3113 so that the temperature difference between all the battery cells 10 is within a preset range when the battery module 100 is in the soaking mode. At this time, the battery module 100 may include only the first semiconductor cooling fin 50, or may include both the first semiconductor cooling fin 50 and the second semiconductor cooling fin 70.

In the case where neither the first semiconductor cooling fin 50 nor the second semiconductor cooling fin 70 is operated, the cooling liquid 3113 and the battery cell 10 exchange heat through the first holder 31, thereby putting the battery module 100 in the soaking mode. In the soaking mode, the temperature between the plurality of battery cells 10 is relatively uniform, and the temperature difference is within a preset range. The preset range refers to: the temperature difference between the plurality of battery cells 10 does not affect the normal operation of the battery module 100, for example, the temperature difference between the plurality of battery cells 10 may be 1 deg.c, 2 deg.c, 3 deg.c, etc., and the present application is not limited thereto.

With continued reference to fig. 2-4 and 13, in some embodiments, further, in the soaking mode of the battery module 100, the rack 30 is used to transfer the heat of the battery cells 10 with higher temperature to the cooling liquid 3113 to vaporize the cooling liquid 3113, and to transfer the heat generated by the vaporization of the cooling liquid 3113 to the battery cells 10 with lower temperature.

In the soaking mode of the battery module 100, the heat of the battery cells 10 with higher temperature is transferred to the sub-supports 313 through the heat conductive adhesive 3133, the heat of each layer of sub-supports 313 is transferred to the center frame 311 through the spokes 315, the cooling liquid 3113 in the accommodating cavity 3111 of the center frame 311 is heated and evaporated, and the whole enclosed space 36 is fully filled by vaporization. The heat of the cooling liquid 3113 is uniformly distributed throughout the center frame 311, and thus the heat of the center frame 311 is transferred to the sub-frames 313 of each layer through the spokes 315, so that the heat of the sub-frames 313 is transferred to the battery cells 10 having a low temperature through the heat conductive adhesive 3133. The battery cells 10 having a higher temperature are radiated and the battery cells 10 having a lower temperature are heated, thereby realizing a uniform temperature among all the battery cells 10, and a temperature difference is within a preset range.

Referring to fig. 1 and 2, in some embodiments, the second side 53 of the first semiconductor refrigeration sheet 50 may be provided with a first heat sink 60, and the first heat sink 60 is used to transfer heat from the first semiconductor refrigeration sheet 50. At this time, the cooling effect of the first semiconductor cooling fin 50 is good. At this time, the first through hole 331 may further be used to accommodate the first heat sink 60, specifically, the first heat sink 60 is at least partially accommodated in the first through hole 331 and is exposed from the first through hole 331 to dissipate heat.

The temperature difference between the cold and hot ends of the first semiconductor refrigeration sheet 50 does not continue to vary in case that the temperature difference reaches a certain value. In the case that the second side 53 of the first semiconductor refrigeration sheet 50 is the hot side, the first heat sink 60 dissipates heat from the hot side of the first semiconductor refrigeration sheet 50 to reduce the temperature difference between the cold side and the hot side, so that the temperature of the cold side can be continuously reduced to achieve a better refrigeration effect. For example, in case the temperature difference between the cold side and the hot side of the first semiconductor refrigeration sheet 50 reaches 40 ℃, the temperature of the cold side is not lowered again and the temperature of the hot side is not raised again. At this time, the radiator is arranged on the hot end, so that the temperature of the hot end is reduced, the temperature difference between the cold end and the hot end is less than 40 ℃, and the temperature of the cold end is reduced continuously, so that a better refrigerating effect is achieved.

The first heat sink 60 is connected to the second side 53 of the first semiconductor refrigeration sheet 50 and exposed from the first through hole 331 to radiate heat of the first semiconductor refrigeration sheet 50. Preferably, the first heat sink 60 is completely attached to the second side 53 of the first semiconductor refrigeration sheet 50, so that the contact area between the first heat sink 60 and the first semiconductor refrigeration sheet 50 is large, thereby rapidly dissipating heat. The cross-sectional area of the first heat sink 60 may be smaller than the cross-sectional area of the first semiconductor refrigeration sheet 50, the cross-sectional area of the first heat sink 60 may be equal to the cross-sectional area of the first semiconductor refrigeration sheet 50, and the cross-sectional area of the first heat sink 60 may also be larger than the cross-sectional area of the first semiconductor refrigeration sheet 50. Preferably, the cross-sectional area of the first heat sink 60 is greater than or equal to the cross-sectional area of the first semiconductor refrigeration sheet 50, so that the first heat sink 60 has a large contact area with the first semiconductor refrigeration sheet 50, thereby rapidly radiating heat.

Referring to fig. 1 and 2, in another embodiment, the second side 73 of the second semiconductor refrigeration sheet 70 is provided with a second heat sink 80, and the second heat sink 80 is used for transferring heat of the second semiconductor refrigeration sheet 70. At this time, the refrigerating effect of the second semiconductor refrigerating sheet 70 is good.

In the case that the second side 73 of the second semiconductor refrigeration sheet 70 is the hot side, the second heat sink 80 dissipates heat to the hot side of the second semiconductor refrigeration sheet 70 to reduce the temperature difference between the cold side and the hot side, so that the temperature of the cold side can be continuously reduced to achieve a better refrigeration effect.

The second heat sink 80 is connected to the second side 73 of the second semiconductor refrigeration sheet 70 and exposed from the second through hole 333 to radiate heat of the second semiconductor refrigeration sheet 70. Preferably, the second heat sink 80 is completely attached to the second side 73 of the second semiconductor refrigeration sheet 70, so that the contact area between the second heat sink 80 and the second semiconductor refrigeration sheet 70 is large, thereby rapidly dissipating heat. The cross-sectional area of the second heat sink 80 may be smaller than the cross-sectional area of the second semiconductor cooling fin 70, the cross-sectional area of the second heat sink 80 may be equal to the cross-sectional area of the second semiconductor cooling fin 70, and the cross-sectional area of the second heat sink 80 may also be larger than the cross-sectional area of the second semiconductor cooling fin 70. Preferably, the cross-sectional area of the second heat sink 80 is greater than or equal to the cross-sectional area of the second semiconductor refrigeration sheet 70, so that the second heat sink 80 has a large contact area with the second semiconductor refrigeration sheet 70, thereby rapidly radiating heat.

In yet another embodiment, the second side 53 of the first semiconductor refrigeration sheet 50 is provided with a first heat sink 60, the first heat sink 60 being for transferring heat from the first semiconductor refrigeration sheet 50; the second side 73 of the second semiconductor cooling fin 70 is provided with a second heat sink 80, the second heat sink 80 being for transferring heat from the second semiconductor cooling fin 70. At this time, the cooling effect of both the first semiconductor cooling fin 50 and the second semiconductor cooling fin 70 is good.

Referring to fig. 1 and 2, in further embodiments, the battery module 100 further includes an electrical connection assembly 90, the electrical connection assembly 90 is mounted on the bracket 30, and the electrical connection assembly 90 is used for connecting a plurality of battery cells 10 in series.

Specifically, the electrical connection assembly 90 may be made of a metal conductive material, and the material of the electrical connection assembly 90 includes, but is not limited to, silver, copper, aluminum, iron, etc. The material of the electrical connection assembly 90 in the embodiment of the application is aluminum, and the electrical connection assembly 90 made of aluminum has better electrical conductivity, higher strength and lighter weight. The electrical connection assembly 90 is used to connect a plurality of battery cells 10 in series into a battery pack.

Referring to fig. 4, in some embodiments, the electrical connection assembly 90 includes a first electrical connector 91 and a second electrical connector 93, where the first electrical connector 91 is mounted on the second bracket 33 and is electrically connected to one end of the battery cell 10 through the second through hole 333; the second electrical connector 93 is mounted to the third bracket 35 and is electrically connected to the other end of the battery cell 10 through the second penetration hole 353.

Wherein, the first electrical connectors 91 are located at a side of the second bracket 33 away from the first bracket 31, the first electrical connectors 91 include a plurality of first electrical connectors 91, and each first electrical connector 91 connects the positive electrode of one of the battery cells 10 and the negative electrode of the other battery cell 10 through the second through hole 333. The second electrical connection members 93 are located at a side of the third holder 35 remote from the first holder 31, the second electrical connection members 93 including a plurality of second electrical connection members 93, each second electrical connection member 93 connecting the positive electrode of one of the battery cells 10 and the negative electrode of the other battery cell 10 through the second penetration holes 353. The first electrical connector 91 and the second electrical connector 93 collectively connect a plurality of battery cells 10 in series into a battery pack.

Referring to fig. 14, an energy storage device 1000 according to an embodiment of the application includes a housing 300 and the battery module 100 according to any of the above embodiments, and the battery module 100 is mounted on the housing 300. The energy storage device 1000 is a device for storing electric energy and capable of supplying electric energy to other elements. The energy storage device 1000 may be, but is not limited to being, an outdoor power source, a household power source, a photovoltaic system, and the like.

In the energy storage device 1000 according to the embodiment of the application, when the battery module 100 is in the heating mode, the first semiconductor refrigeration sheet 50 heats the cooling liquid 3113 in the accommodating chamber 3111, the temperature of the cooling liquid 3113 increases, and heat is transferred to the battery cells 10 in the loading chamber 3131 through the bracket 30 to heat the battery cells 10. In the heat dissipation mode of the battery module 100, the first semiconductor cooling fin 50 cools the cooling liquid 3113 in the receiving cavity 3111, and the temperature of the cooling liquid 3113 is lowered, thereby absorbing heat of the battery cells 10 transferred through the bracket 30 to dissipate heat of the battery cells 10. The battery module 100 according to the embodiment of the application heats and dissipates heat of the battery module 100 by using the cooling liquid 3113 through the first semiconductor refrigerating sheet 50, and the structure of heating and dissipating heat is relatively simple.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description. Also, other implementations may be derived from the above-described embodiments, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure.

The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the patent. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims

1. A battery module, comprising:

a battery cell;

the bracket is provided with a containing cavity and a loading cavity which are mutually spaced, the containing cavity is used for containing cooling liquid, and the loading cavity is used for loading the battery cells; a kind of electronic device with high-pressure air-conditioning system

The first semiconductor refrigerating piece is arranged on the bracket and positioned at one end of the accommodating cavity, the first semiconductor refrigerating piece is used for heating the cooling liquid and/or refrigerating the cooling liquid, and the bracket is used for exchanging heat between the cooling liquid and the battery cell so as to heat or dissipate heat of the battery cell.

2. The battery module of claim 1, wherein the first semiconductor cooling fin includes first and second opposite sides, the first side of the first semiconductor cooling fin being closer to the receiving cavity than the second side of the first semiconductor cooling fin.

3. The battery module according to claim 2, wherein,

the battery module is provided with a heat dissipation mode, and in the heat dissipation mode of the battery module, the first side of the first semiconductor refrigerating sheet is a cold end, and the second side of the first semiconductor refrigerating sheet is a hot end; or (b)

The battery module is provided with a heating mode, the battery module is in the heating mode, the first side of the first semiconductor refrigerating sheet is a hot end, and the second side of the first semiconductor refrigerating sheet is a cold end.

4. The battery module according to claim 2, wherein the battery module is switchable between a heat radiation mode and a heating mode; wherein:

when the battery module is in a heat dissipation mode, the first semiconductor refrigerating piece is electrified with current in a first direction, so that a first side of the first semiconductor refrigerating piece is a cold end, and a second side of the first semiconductor refrigerating piece is a hot end;

and under the heating mode of the battery module, the first semiconductor refrigerating sheet is electrified with current in a second direction so that a first side of the first semiconductor refrigerating sheet is a hot end, a second side of the first semiconductor refrigerating sheet is a cold end, and the second direction is opposite to the first direction.

5. The battery module according to claim 1, further comprising a second semiconductor cooling fin mounted to the bracket and located at the other end of the receiving chamber, the second semiconductor cooling fin being for heating the cooling liquid and/or for cooling the cooling liquid.

6. The battery module of claim 5, wherein the first semiconductor cooling fin comprises first and second opposite sides, the first side of the first semiconductor cooling fin being closer to the receiving cavity than the second side of the first semiconductor cooling fin; the second semiconductor refrigeration piece comprises a first side and a second side which are opposite to each other, and the first side of the second semiconductor refrigeration piece is closer to the accommodating cavity than the second side of the second semiconductor refrigeration piece.

7. The battery module of claim 6, wherein the battery module has a heat dissipation mode and a heating mode, and the first semiconductor cooling fin and the second semiconductor cooling fin alternately operate;

when the battery module is in a heat dissipation mode, a first side of the first semiconductor refrigerating sheet is a cold end, and a second side of the first semiconductor refrigerating sheet is a hot end;

and when the battery module is in a heating mode, the first side of the second semiconductor refrigerating piece is a hot end, and the second side of the second semiconductor refrigerating piece is a cold end.

8. The battery module of claim 6, wherein the battery module has a heat dissipation mode and a heating mode, and the first semiconductor cooling fin and the second semiconductor cooling fin operate simultaneously; wherein:

when the battery module is in a heat dissipation mode, the first side of the first semiconductor refrigeration piece is a cold end, the second side of the first semiconductor refrigeration piece is a hot end, the first side of the second semiconductor refrigeration piece is a cold end, and the second side of the second semiconductor refrigeration piece is a hot end;

and when the battery module is in a heating mode, the first side of the first semiconductor refrigerating sheet is a hot end, the second side of the first semiconductor refrigerating sheet is a cold end, the first side of the second semiconductor refrigerating sheet is a hot end, and the second side of the second semiconductor refrigerating sheet is a cold end.

9. The battery module according to claim 5, wherein,

a first radiator is arranged on the second side of the first semiconductor refrigerating sheet and used for transferring heat of the first semiconductor refrigerating sheet; and/or

And a second radiator is arranged on the second side of the second semiconductor refrigerating sheet and used for transferring heat of the second semiconductor refrigerating sheet.

10. The battery module of claim 5, wherein the bracket comprises a first bracket, the first bracket is provided with the accommodating cavity and the loading cavity, two opposite ends of the accommodating cavity are respectively provided with a first cover body and a second cover body, the accommodating cavity is covered by the first cover body and the second cover body, the first semiconductor refrigerating piece is arranged on the first cover body, and the second semiconductor refrigerating piece is arranged on the second cover body.

11. The battery module of claim 10, wherein the battery module comprises a plurality of battery cells; the first support comprises a center frame and a plurality of layers of sub-supports, the accommodating cavities are formed in the center frame, each layer of sub-support is provided with a plurality of loading cavities, the plurality of layers of sub-supports encircle the center frame, adjacent sub-supports are connected through spokes, and the center frame is connected with the innermost sub-support through spokes.

12. The battery module according to claim 10, wherein the battery module comprises,

the first cover body is provided with a first groove which is used for loading the first semiconductor refrigerating sheet; and/or

The second cover body is provided with a second groove, and the second groove is used for loading the second semiconductor refrigerating sheet.

13. The battery module according to claim 10, wherein the height of the first bracket is 80% -90% of the height of the battery cell in the long axis direction of the battery cell.

14. The battery module according to claim 10, wherein the bracket further comprises a second bracket and a third bracket, the second bracket and the third bracket are respectively mounted at opposite ends of the first bracket, the second bracket is provided with a first through hole and a second through hole which are spaced from each other, the first through hole corresponds to the accommodating cavity, the first through hole is used for accommodating at least the first semiconductor refrigerating sheet, and the second through hole corresponds to the loading cavity; the third support is provided with a first perforation and a second perforation which are mutually spaced, the first perforation corresponds to the accommodating cavity, the first perforation is used for accommodating at least the second semiconductor refrigerating sheet, and the second perforation corresponds to the loading cavity.

15. The battery module of claim 14, further comprising an electrical connection assembly mounted to the bracket, the electrical connection assembly configured to connect a plurality of the battery cells in series.

16. The battery module of claim 15, wherein the electrical connection assembly comprises a first electrical connector and a second electrical connector, the first electrical connector being mounted to the second bracket and electrically connected to one end of the battery cell through the second through hole; the second electric connecting piece is arranged on the third bracket and is electrically connected with the other end of the battery unit through the second through hole.

17. The battery module according to claim 1, wherein the battery module comprises a plurality of battery cells; the battery module further comprises a soaking mode, and when the battery module is in the soaking mode, the bracket is used for exchanging heat between the battery cells with different temperatures through the cooling liquid so as to enable the temperature difference between all the battery cells to be within a preset range.

18. The battery module according to claim 17, wherein the bracket is configured to transfer heat of the battery cell having a higher temperature to the coolant to vaporize the coolant, and to transfer heat generated by vaporization of the coolant to the battery cell having a lower temperature, when the battery module is in the soaking mode.

19. The battery module of claim 1, wherein a heat conductive adhesive is disposed between the battery cells and an inner wall of the loading chamber.

20. An energy storage device, comprising:

a housing; a kind of electronic device with high-pressure air-conditioning system

The battery module of any one of claims 1-19, the battery module being mounted to the housing.