CN116867329A

CN116867329A - Light-emitting panel, preparation method thereof, lighting device and automobile

Info

Publication number: CN116867329A
Application number: CN202310931781.5A
Authority: CN
Inventors: 陈立; 高栋雨; 安成国; 刘广超; 孙震; 米红玉
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd; Beijing BOE Technology Development Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd; Beijing BOE Technology Development Co Ltd
Priority date: 2023-07-26
Filing date: 2023-07-26
Publication date: 2023-10-10

Abstract

The present disclosure provides a light emitting panel, a method of manufacturing the same, a lighting device, and an automobile, the light emitting panel comprising: a display area and a non-display area surrounding the display area. The light-emitting panel further includes: the backplate, luminescent layer, encapsulation glue film and the apron of range upon range of setting in proper order. The packaging adhesive layer is arranged between the backboard and the cover plate and surrounds the display area, and light emitted by the light-emitting layer exits through the backboard. The back plate includes: a substrate and a light absorbing layer located in a non-display area of the substrate. The light absorbing layer is disposed around the display region, and an orthographic projection of the light absorbing layer on the substrate and an orthographic projection of the encapsulation glue layer on the substrate overlap at least partially, the light absorbing layer being configured to absorb lateral light in the light emitting panel that is irradiated toward the light absorbing layer.

Description

Light-emitting panel, preparation method thereof, lighting device and automobile

Technical Field

The disclosure relates to the technical field of display, in particular to a light-emitting panel, a preparation method thereof, a lighting device and an automobile.

Background

The OLED (Organic Light Emitting Diode ) display technology has the characteristics of self-luminescence, wide viewing angle, wide color gamut, high contrast, light and thin, foldable, bendable, light and thin, easy to carry, and the like, and becomes a main direction of research and development in the display field. At present, the automobile tail lamp on the market mainly adopts an LED technology, but the temperature rise of the whole lamp is obvious due to serious heating of the LED. So that the light emitted by the OLED panel is slowly penetrated into the field of car lamps. At present, an OLED bottom emission structure design is adopted for a car tail lamp, and because a rigid car lamp substrate is usually glass, and a glass cement packaging mode is adopted for packaging the edge, the edge light leakage phenomenon is easy to occur after the car lamp is lighted, so that the overall display effect is poor.

Disclosure of Invention

In a first aspect, embodiments of the present disclosure provide a light emitting panel, including: a display region and a non-display region surrounding the display region, the light emitting panel further comprising: the display device comprises a back plate, a luminous layer, an encapsulation adhesive layer and a cover plate which are sequentially stacked, wherein the encapsulation adhesive layer is positioned between the back plate and the cover plate and surrounds the display area, and light emitted by the luminous layer exits through the back plate;

the back plate includes: the light-absorbing layer is arranged around the display area, the orthographic projection of the light-absorbing layer on the substrate is at least partially overlapped with the orthographic projection of the packaging adhesive layer on the substrate, and the light-absorbing layer is configured to absorb lateral light irradiated towards the light-absorbing layer in the light-emitting panel.

Optionally, the back plate further includes: a buffer layer disposed on one side of the substrate base plate, the buffer layer including: the light absorption layer is positioned in the opening area, and orthographic projection of the light absorption layer on the substrate is in a closed shape.

Optionally, the buffer layer includes: at least two open areas are arranged at intervals, one light absorption layer is arranged in each open area, and at least two light absorption layers are sequentially distributed around the display area from inside to outside.

Optionally, the buffer layer includes: a plurality of inorganic film layers that are stacked and arranged, wherein at least two inorganic film layers are provided with the opening region, and the light absorbing layer includes: and the at least two light absorption parts are arranged in the opening area in a staggered manner, and orthographic projections of the at least two light absorption parts on the substrate form a closed ring.

Optionally, the plurality of stacked inorganic film layers includes: the first inorganic film layer, the second inorganic film layer and the third inorganic film layer are sequentially stacked along the direction away from the substrate, wherein the refractive index of the first inorganic film layer and the refractive index of the third inorganic film layer are smaller than those of the second inorganic film layer, and the first inorganic film layer and the third inorganic film layer are provided with the opening areas which are respectively a first opening area and a second opening area;

the at least two light absorbing portions include: the light absorption device comprises a substrate, a first opening area, a second opening area, a first light absorption portion and a second light absorption portion, wherein the first light absorption portion is located in the first opening area, the second light absorption portion is located in the second opening area, the first light absorption portion and the second light absorption portion are arranged in a staggered mode, and orthographic projection of the first light absorption portion and the second light absorption portion on the substrate forms a closed ring.

Optionally, the back plate further includes: and the light absorption layer is positioned on one side of the buffer layer close to the substrate, or on one side of the buffer layer far away from the substrate.

Optionally, the light-absorbing layer covers the non-display area of the back plate, and the orthographic projection of the light-absorbing layer on the substrate base plate and the display area do not overlap.

Optionally, the back plate further includes: a buffer layer disposed on one side of the substrate base plate, the buffer layer including: the light emitting device comprises a substrate, a first inorganic film layer, a second inorganic film layer and a third inorganic film layer, wherein the first inorganic film layer, the second inorganic film layer and the third inorganic film layer are sequentially stacked along the direction away from the substrate, the refractive index of the first inorganic film layer and the refractive index of the third inorganic film layer are smaller than that of the second inorganic film layer, and light emitted by the light emitting layer sequentially passes through the third inorganic film layer, the second inorganic film layer and the first inorganic film layer and is emitted after being adjusted to light with a target peak wavelength.

Optionally, the back plate further includes: the buffer layer is arranged on one side of the substrate, the light absorption layer is arranged in an opening area in the buffer layer, one side of the light absorption layer, which is far away from the substrate, is flush with one side of the buffer layer, which is far away from the substrate, or the light absorption layer is positioned on one side of the buffer layer, which is far away from the substrate; the back plate further comprises:

The metal wiring layer is positioned on one side of the buffer layer, which is far away from the substrate base plate;

the protective layer is positioned between the metal wiring layer and the light absorption layer, the material of the protective layer is inorganic insulating material, and the orthographic projection of the light absorption layer on the substrate is positioned in the orthographic projection of the protective layer on the substrate.

In a second aspect, an embodiment of the disclosure provides a lighting device including the light-emitting panel of the first aspect.

In a third aspect, an embodiment of the present disclosure provides an automobile, including the lighting device provided in the second aspect, where the lighting device is a lamp of the automobile.

In a fourth aspect, embodiments of the present disclosure provide a method for manufacturing a light emitting panel, the light emitting panel including: a display area and a non-display area surrounding the display area, the method comprising:

providing a back plate and a cover plate;

forming a light emitting layer covering the display region on the back plate;

forming an encapsulation adhesive layer surrounding the display area on the cover plate;

the backboard and the cover board are aligned and attached to form the light-emitting panel;

wherein, the light that the luminescent layer sent is through the backplate outgoing, the backplate includes: the light-absorbing layer is arranged around the display area, the orthographic projection of the light-absorbing layer on the substrate is at least partially overlapped with the orthographic projection of the packaging adhesive layer on the substrate, and the light-absorbing layer is configured to absorb lateral light irradiated towards the light-absorbing layer in the light-emitting panel.

Optionally, the providing a back plate includes: providing a substrate; and forming a buffer layer and a light absorption layer on the substrate. The forming a buffer layer and a light absorbing layer on the substrate base plate includes: forming a buffer layer on the substrate, forming an opening area in the buffer layer positioned in the non-display area, and filling a light absorption material in the opening area to form the light absorption layer; alternatively, the light absorbing layer is formed on the substrate, and a buffer layer is formed on the side of the substrate on which the light absorbing layer is formed; alternatively, a buffer layer is formed on the substrate base plate, and the light absorbing layer is formed on the buffer layer.

Optionally, the forming a buffer layer includes: sequentially forming a first inorganic film layer, a second inorganic film layer and a third inorganic film layer which are laminated through a chemical vapor deposition process, wherein the refractive index of the first inorganic film layer and the refractive index of the third inorganic film layer are smaller than those of the second inorganic film layer;

wherein the process gas of the chemical vapor deposition process comprises: nitrogen, ammonia and silane, wherein the flow rate of the nitrogen is 30400-33600 sccm, the flow rate of the ammonia is 7056-7344 sccm, and the flow rate of the silane is: 1960-2040 sccm.

The technical scheme provided in the embodiment of the disclosure has at least the following technical effects or advantages:

according to the light-emitting panel, the preparation method thereof, the lighting device and the automobile, the light-absorbing layer positioned in the non-display area is arranged in the back plate, the light-absorbing layer surrounds the display area and is configured to absorb lateral light irradiated towards the light-absorbing layer in the light-emitting panel, so that the problem of light leakage at the edge of the light-emitting panel is effectively solved.

The foregoing description is merely an overview of the technical solutions provided by the embodiments of the present disclosure, and in order to make the technical means of the embodiments of the present disclosure more clear, it may be implemented according to the content of the specification, and in order to make the foregoing and other objects, features and advantages of the embodiments of the present disclosure more understandable, the following detailed description of the embodiments of the present disclosure will be given.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:

Fig. 1 illustrates a mechanism analysis diagram of an edge light leakage phenomenon;

FIG. 2 illustrates a partial cross-sectional schematic view of an exemplary light-emitting panel in an embodiment of the present disclosure;

FIG. 3 illustrates an exemplary light emitting area arrangement;

FIG. 4 shows a spectrum variation diagram;

FIG. 5 illustrates an exemplary top view of a single turn light absorbing layer;

FIG. 6 shows another exemplary top view of a single turn light absorbing layer;

FIG. 7 shows a schematic cross-sectional view of a light absorbing layer;

FIG. 8 illustrates an exemplary top view of a dual turn light absorbing layer;

FIG. 9 shows an exemplary top view of three turns of the light absorbing layer;

FIG. 10 shows a graph of the path of incident light within a buffer layer;

FIG. 11 illustrates a schematic top view of an exemplary light emitting panel in an embodiment of the present disclosure;

FIG. 12 shows a schematic view of section A-A of FIG. 11;

FIG. 13 illustrates a partial cross-sectional schematic view of an exemplary light-emitting panel in an embodiment of the disclosure;

FIG. 14 illustrates a partial cross-sectional schematic view of an exemplary light-emitting panel in an embodiment of the disclosure;

FIG. 15 shows a graph of concentration of light absorbing particles versus absorbance;

fig. 16 is a flowchart illustrating a method of manufacturing a light emitting panel according to an embodiment of the present disclosure.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that the term "plurality" appearing herein includes two or more cases.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

As used herein, "parallel", "perpendicular", "equal" includes the stated case as well as the case that approximates the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be deviations within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present between the layer or element and the other layer or substrate.

At present, an OLED bottom emission structure design is adopted for a car tail lamp, and because a rigid car lamp substrate is glass, and a glass cement packaging mode is adopted for packaging edges, the phenomenon of edge light leakage easily occurs after the car lamp is lighted, so that the whole display effect is poor (the edge of a light-emitting panel is provided with a diaphragm).

Fig. 1 shows a mechanism analysis diagram of the edge light leakage phenomenon. Through analysis, the light leakage at the edge of the automobile tail light panel is caused by: (1) the process of fabricating the buffer layer 01 in the panel is usually PECVD (Plasma Enhanced Chemical Vapor Deposition ), and the thin film is formed by curing after the process deposition, and defects and poor film level may exist in the film due to the manufacturing environment and process instability. Light (indicated by the dashed line with a single arrow in fig. 1) emitted from the OLED enters the buffer layer 01 through the transparent anode 02 (e.g. indium tin oxide layer), and is refracted and scattered at the interfaces of defects and irregularities in the buffer layer 01, so that there is side light L leaking out from the edges of the panel. (2) The light-emitting surface of the bottom emission structure is the surface of the backboard, and the pixel defining layer in the OLED device originally cannot play a role in limiting the light-emitting direction, so that the light-emitting mode is lambertian body light emission. The conventional OLED light emitting panel is designed with a narrow frame, for example, the frame width D is about 1.5mm, so that the incident light has a short optical path, resulting in serious edge light leakage, as shown in fig. 1.

Therefore, the embodiment of the disclosure makes a special design on the backboard, and the light absorption layer is arranged in the backboard and located in the non-display area, and the light absorption layer is arranged around the display area and is configured to absorb lateral light irradiated towards the light absorption layer in the light-emitting panel, so that the problem of light leakage at the edge of the light-emitting panel is effectively improved.

The following describes in detail a light emitting panel provided by an embodiment of the present disclosure with reference to the accompanying drawings. It should be noted that the light-emitting panel provided in the embodiments of the present disclosure may be applied to a lighting device to provide a lighting function, for example, may be applied to a lamp of an automobile. In some application scenarios, the light emitting panel may provide an image display function in addition to an illumination function when applied to an illumination device such as an automotive lamp. Of course, in other application scenarios, the light-emitting panel provided in the embodiments of the present disclosure may also be applied to a display device to provide a color image display function, which is not limited in this embodiment.

Fig. 2 illustrates a partial cross-sectional schematic view of an exemplary light emitting panel in an embodiment of the present disclosure. As shown in fig. 2, the light emitting panel 10 includes: a display area 11 and a non-display area 12 surrounding said display area 11.

From the viewpoint of the laminated structure, the light-emitting panel 10 further includes: the back plate 100, the light emitting layer, the encapsulation adhesive layer 120 and the cover plate 130 are sequentially stacked, and light emitted by the light emitting layer is emitted through the back plate 100.

The encapsulation layer 120 is located between the back plate 100 and the cover plate 130 and disposed around the display area 11 to encapsulate and protect the edge of the light-emitting panel 10. For example, the encapsulation layer 120 may be a glass encapsulation (Frit), or other suitable encapsulation material. For example, a glass cover plate, or other suitable cover plate 130 material, may be used for cover plate 130.

As shown in fig. 2, the back plate 100 includes: a substrate 101. For example, the substrate base 101 may be a rigid substrate. The rigid substrate may include, for example, a Glass substrate, ultra-Thin Glass (UTG), PMMA (Polymethyl methacrylate ) substrate, a silicon substrate, or the like. In this case, the light emitting panel 10 may be a rigid light emitting panel. For example, when applied to an automobile tail lamp, the substrate 101 may be a glass substrate.

For another example, the substrate 101 may be a flexible substrate. The flexible substrate may include, for example, a PET (Polyethylene Terephthalate ) substrate, a PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate) substrate, or a colorless polyimide (Colorless Polyimide, CPI), or the like. In this case, the light emitting panel 10 may be a flexible light emitting panel.

The light emitting layer is positioned on one side of the substrate 101, and may include one or more light emitting devices, and the actual size, shape, and arrangement of the light emitting devices may be set according to the application scene of the light emitting panel 10.

For example, when the light emitting panel 10 is applied to a lighting device, the light emitting layer may be provided in whole, that is, the whole light emitting layer serves as one light emitting device which is in an on state, the light emitting panel 10 is lighted in whole, and the light emitting device is in an off state, and the whole light emitting panel 10 is extinguished. For another example, the light emitting layer may be provided in a partitioned manner, that is, the light emitting layer includes a plurality of light emitting devices, and the switches of each light emitting device are independent of each other. In use, the different light emitting devices may be configured to be independently controlled to light up to achieve some special lighting effects, for example, the light emitting panel 10 may be controlled to display a preset pattern. The light emitting colors of the plurality of light emitting devices may be the same, and the light emitting colors may be set according to an illumination scene of an actual application, for example, each light emitting device may emit red light when applied to a tail light of a vehicle. Of course, in some lighting scenes, there may be a difference in light emission color of each light emitting device, for example, some light emitting devices emit red light and some light emitting devices emit white light, which is not limited in the present embodiment.

For example, the display area 11 may include a plurality of light emitting areas, and the shape, size, arrangement, number of light emitting devices included, and light emitting color of the light emitting devices may be set according to the needs of the actual application scene. For example, the shape of the light emitting region may be triangular, prismatic, rectangular, circular, elliptical, regular pentagonal, regular hexagonal, or the like, which is not limited in this embodiment.

Taking an application to a tail lamp of an automobile as an example, fig. 3 shows an exemplary light emitting region arrangement schematic diagram, as shown in fig. 3, the planar shape of the light emitting panel 10 may be a parallelogram, and a plurality of light emitting region pairs distributed in an array are arranged in a first direction (an X-axis direction as shown in fig. 3) and a second direction (a Y-axis direction as shown in fig. 3) of the light emitting panel 10, each light emitting region pair including two light emitting regions P disposed at intervals, each light emitting region P including one light emitting device. The pair of light emitting regions takes a shape similar to a parallelogram or a rectangle, the shape of the light emitting region P is a triangle, and the two light emitting regions P are symmetrically disposed about a diagonal line of the pair of light emitting regions. It should be noted that, the planar shape of the light-emitting panel shown in fig. 3 is merely illustrative, and for example, in other examples, the shape of the light-emitting panel 10 may be rectangular, triangular, prismatic, circular, or elliptical, etc., and the present embodiment is not limited thereto, specifically according to actual needs.

When the light emitting panel 10 is applied to a display apparatus, the light emitting layer includes a plurality of light emitting devices. At this time, the display area 11 may include: a plurality of pixels arranged in an array, each pixel including a plurality of sub-pixels, each sub-pixel being capable of displaying a single color, e.g., a red sub-pixel displaying red, a green sub-pixel displaying green, and a blue sub-pixel displaying blue. The brightness (gray scale) of the sub-pixels of different colors in each pixel can be adjusted, and display of a plurality of colors can be realized by color combination and superposition, so that full-color display of the light emitting panel 10 can be realized by progressive scanning. For example, the red subpixel may include a light emitting device for emitting red light, the green subpixel may include a light emitting device for emitting green light, and the blue subpixel may include a light emitting device for emitting red light.

For example, the light emitting device may be an OLED or a QLED (Quantum Dot Light Emitting Diodes, quantum dot organic light emitting diode) or the like, which is not limited in this embodiment. Taking an OLED light emitting device as an example, when the light emitting panel 10 is applied to a lighting apparatus, a PMOLED (Passive matrix organic light-emitting diode) may be used; when the light emitting panel 10 is applied to a display device, an Active-matrix organic light-emitting diode (AMOLED) may be used. The following description will be mainly given by taking an example of application to a lighting device such as a tail lamp of an automobile.

The light emitting device may include: a first electrode (not shown in the figure), a light emitting functional layer 110, and a second electrode 111, the first electrode being closer to the substrate 101 than the second electrode 111. In some examples, taking an OLED light emitting device as an example, the first electrode may serve as an anode, the second electrode 111 may serve as an anode, and the light emitting functional layer 110 may include: the organic light emitting material layer, and at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the anode and the organic light emitting material layer, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the anode and the organic light emitting material layer, are specifically disposed according to actual needs, and the present embodiment is not limited thereto.

In some examples, when the light emitting layer includes a plurality of light emitting devices, the first electrodes of the plurality of light emitting devices may be disposed independently of each other so as to independently control lighting of the respective light emitting devices. The second electrodes 111 of the plurality of light emitting devices may be disposed entirely, that is, the second electrodes 111 of the light emitting devices may be electrically connected to each other, in an integrated structure, or may be disposed independently of each other, which is not limited in this embodiment.

The first electrode is a transparent electrode, and the second electrode 111 is a reflective electrode. For example, the first electrode may employ a transparent conductive oxide film; the second electrode 111 may have a metal film layer or a composite structure formed by sequentially stacking a transparent conductive oxide film/a metal film/a transparent conductive oxide film. The material of the transparent conductive oxide film is, for example, any one of ITO (Indium tin oxide) and IZO (Indium zinc oxide Indium zinc oxide); the material of the metal thin film is, for example, any one of gold (Au), silver (Ag), nickel (Ni), and platinum (Pt). For example, in some application scenarios, the first electrode may be an ITO film and the second electrode 111 may be a silver electrode. For example, in order to make the silver electrode have a high emissivity, the thickness of the silver electrode layer may be about 100nm.

As shown in fig. 2, the back plate 100 further includes: a buffer layer 102 provided on the side of the substrate 101. For example, the buffer layer 102 may be a single layer or a multi-layer structure. For example, the material of the buffer layer 102 may include silicon oxide (SiN), silicon oxide (SiO), or the like. For example, the buffer layer 102 may have a total thickness of 100 to 500nm in a direction perpendicular to the base substrate 101. For example, the refractive index of each of the buffer layers may be between 1.5 and 2.5.

Considering that the whole scattering effect and the temperature rise under the highlight are better than those of LEDs after the OLED area light source is adopted by the automobile tail light, the color depth is still a pain point. For example, red taillight OLED materials have a peak wavelength of about 626nm and a color depth (Rx) of about 0.685 (LED peak wavelength > 650nm, rx can reach 0.700), thus resulting in color depths below the LEDs.

Thus, in some examples, buffer layer 102 may include: the first inorganic film 201, the second inorganic film 202, and the third inorganic film 203 are sequentially stacked in a direction away from the substrate 101. The refractive index of the first inorganic film 201 and the third inorganic film 203 is smaller than the refractive index of the second inorganic film 202. For example, the first inorganic film 201 and the third inorganic film 203 may be silicon nitride films, and the second inorganic film 202 may be a silicon oxide film, that is, the buffer layer 102 is a laminated structure of SiN-SiO-SiN. For example, the refractive index of the silicon oxide film layer may be about 2.5, and the refractive index of the silicon nitride film layer may be about 1.5.

By arranging the laminated structure, light incident from the light-emitting layer has an optical path from low refraction to high refraction to low refraction, namely, a layer of microcavity gain system is constructed on the back plate 100 of the bottom emission structure, so that the wavelength of the light-emitting peak can be changed, and the purpose of high color depth is realized. That is, the light emitted from the light emitting layer sequentially passes through the third inorganic film layer 203, the second inorganic film layer 202, and the first inorganic film layer 201, and can be emitted with the target peak wavelength adjusted. In specific implementation, the target peak wavelength is determined according to the needs of the actual application scenario, and the refractive indexes and thicknesses of the first inorganic film 201, the second inorganic film 202 and the third inorganic film 203 are adapted to the target peak wavelength to be achieved.

For example, when the light emitted by the light emitting layer is red light, the thickness of the first inorganic film 201 (SiN) is 100nm, the thickness of the second inorganic film 202 (SiO) is 100nm, and the thickness of the third inorganic film 203 (SiN) is 500nm, wherein the refractive index of the silicon oxide film is about 2.5, and the refractive index of the silicon nitride film is about 1.5, then the peak wavelength of monochromatic red light can reach 650nm, the color depth (Rx) is increased to 0.6899, and the purpose of the LED with color depth comparable to that of the LED is achieved. For example, fig. 4 shows a spectrum variation plot, with wavelength on the abscissa and normalized intensity (Normnalized) on the ordinate. Fig. 4 shows a spectrum of the emitted light when a single layer of SiN is used as the buffer layer 102 and a spectrum of the emitted light when a SiN-SiO-SiN laminated structure is used as the buffer layer 102, respectively. As can be seen from fig. 4, compared with single-layer SiN, peak wavelength of the emitted light corresponding to the SiN-SiO-SiN laminated structure is red shifted, and the emitted light color depth is effectively improved by adjusting from original 626nm to 650 nm.

Of course, in other examples, the buffer layer 102 may also have a single-layer or double-layer structure, such as a single-layer SiN or a laminated structure of SiN-SiO, etc., which is specifically set according to practical needs, and this embodiment is not limited thereto.

As shown in fig. 2, the back plate 100 further includes: the light absorbing layer 103 is located in the non-display area 12 of the substrate 101. The front projection of the light absorbing layer 103 onto the substrate 101 at least partially overlaps the front projection of the encapsulation glue layer 120 onto the substrate 101. For example, the front projection of the light absorbing layer 103 on the substrate 101 and the front projection of the encapsulation adhesive layer 120 on the substrate 101 may substantially completely overlap, or there may be only partial overlapping between the front projection of the light absorbing layer 103 on the substrate 101 and the front projection of the encapsulation adhesive layer 120 on the substrate 101, or the front projection of the encapsulation adhesive layer 120 on the substrate 101 may be located within the front projection of the light absorbing layer 103 on the substrate 101, which may be specifically set according to needs, which is not limited in this embodiment.

The light absorbing layer 103 is disposed around the display area 11. For example, the orthographic projection of the light absorbing layer 103 on the substrate 101 may be a closed shape, such as a triangle ring, a parallelogram ring, a rectangular ring, a circular ring, an elliptical ring, or other shape ring, which is actually disposed according to the planar shape of the light emitting panel 10 and the display area 11. If the shape of the orthographic projection of the light absorbing layer 103 on the substrate 101 is a rectangular ring, the shape of the orthographic projection is substantially a rectangular ring, and may be, for example, a standard rectangular ring or a quasi-rectangular ring with chamfer, saw tooth or rounded corners.

The light absorbing layer 103 is configured to absorb lateral light in the light emitting panel 10 that is irradiated toward the light absorbing layer 103. That is, by providing the above-described light absorbing layer 103 at the non-display region 12 of the back plate 100, scattered light and/or large-angle outgoing light outgoing laterally from the light emitting panel 10 such as shown in fig. 1 can be effectively absorbed, thereby improving the problem of edge light leakage of the light emitting panel 10.

The light-absorbing layer 103 contains light-absorbing particles having light-absorbing properties, and can absorb light incident on the light-absorbing layer 103. For example, light absorbing particles may include, but are not limited to: oxides of elements such as V (vanadium), nb (niobium), and Ta (tantalum) of group VB, for example: v (V) ₂ O ₅ 、V ₂ O ₄ 、V ₂ O ₃ Or VO, etc.; non-oxide ferroelectric single crystal materials of group IVA Ge (germanium), sn (tin), pb (lead) or the like, for example: sn (Sn) ₂ P ₂ S ₆ Etc. Fullerene C composed of group IVA C elements ₂₀ 、C ₆₀ 、C ₇₀ 、C ₇₆ 、C ₈₀ An equal nanometer multi-open pore material; composite materials of VA group Bi (bismuth), sb (antimony), and the like, for example: biPO (BiPO) ₄ Etc.

There are various ways of disposing the light absorbing layer 103 in the back sheet 100, and two embodiments will be mainly described below.

First, the light absorbing layer 103 is obtained by digging holes in the buffer layer 102 to fill the light absorbing material.

For example, as shown in fig. 2, the buffer layer 102 may include an opening region located in the non-display region 12. The orthographic projection of the opening area on the substrate 101 at least partially overlaps with the orthographic projection of the encapsulation glue layer 120 on the substrate 101. The open area is disposed around the display area 11, and the light absorbing layer 103 is located in the open area.

For example, when the buffer layer 102 is a single film layer, the opening region may be a through hole penetrating the buffer layer 102, and the light absorbing layer 103 flush with the buffer layer 102 is obtained by filling the light absorbing material in the through hole. When the buffer layer 102 includes two or more inorganic film layers, the opening region may be a through hole penetrating the entire buffer layer 102, or penetrating two or more inorganic film layers therein, and the light absorbing layer 103 is filled in the through hole. For example, when the opening region is a through hole penetrating the entire buffer layer 102, a side of the light absorbing layer 103 away from the substrate 101 may be flush with a side of the buffer layer 102 away from the substrate 101.

Note that the number of light absorbing layers 103 shown in fig. 2 is merely illustrative, and not limiting. The number of the opening regions adapted to the light absorbing layer 103 may be set according to actual needs. For example, the number of opening regions may be 1, and accordingly, the number of light absorbing layers 103 is 1. For another example, the buffer layer 102 may also include at least two open areas disposed at intervals, where the open areas are all located in the non-display area 12 and sequentially arranged around the display area 11 from inside to outside, and each open area is provided with one light absorbing layer 103, so that at least two light absorbing layers 103 may be disposed, and at least two light absorbing layers 103 are sequentially arranged around the display area 11 from inside to outside.

For example, in order to absorb the edge light leakage well, the position of the light absorbing layer 103 may be set with reference to the position of the encapsulation adhesive layer 120. The front projection of the light absorbing layer 103 on the substrate 101 is a first projection area, and the front projection of the encapsulation glue layer 120 on the substrate 101 is a second projection area. The first projection area and the second projection area are both annular, and an outer edge line of the first projection area may coincide with an outer edge line of the second projection area, where the outer edge line is an edge line relatively far from the display area 11, and the inner edge line is an edge line relatively close to the display area 11.

For example, the edge line of the first projection area may be a straight line, or may be a broken line or an arc line, which is not limited in this embodiment. The fold line or arc line design is beneficial to increasing the light absorption area and reducing the light leakage amplitude.

For example, taking the shape of the light emitting panel 10 and the display area 11 as a rectangle as an example, fig. 5 shows an exemplary top view of the single turn light absorbing layer 103, fig. 6 shows another exemplary top view of the single turn light absorbing layer 103, fig. 7 shows a schematic cross-sectional view of the light absorbing layer 103, small rectangular boxes arrayed in fig. 5 and 6 represent light emitting areas or pixels, and dotted boxes represent edge lines of the display area 11. In order to absorb the edge leakage as comprehensively as possible, the light absorbing layer 103 may be disposed around the display area 11 one turn. Referring to fig. 5 to 7, the light absorbing layer 103 may be designed in a single turn, i.e. 1 in number. In this case, the outer edge line of the second projection area may be used as a reference as a package start point position. The width d of the light absorbing layer 103 may be greater than d1 and less than d2, where d1 represents the width of the encapsulation glue layer 120 and d2 represents the design distance from the encapsulation origin to the display area 11. It should be noted that, the width d of the light absorbing layer 103 needs to be smaller than d2 to ensure that the display area 11 can normally emit light. For example, d1 may be 650 μm and d2 may be 2900 μm. For example, the thickness (i.e., height) h of the light absorbing layer 103 in a direction perpendicular to the base substrate 101 may be greater than 0.1 μm and less than 0.5 μm.

For example, when the planar shapes of the light emitting panel 10 and the display region 11 are rectangular, the orthographic projection of the light absorbing layer 103 on the substrate 101 may be a rectangular ring, and the sides of the rectangular ring may be straight lines, as shown in fig. 5; alternatively, a fold line is also possible, as shown in fig. 6; alternatively, the arc may be an arc, and the present embodiment is not limited thereto.

Fig. 8 shows an exemplary top view of a double turn light absorbing layer 103, and fig. 9 shows an exemplary top view of a triple turn light absorbing layer 103. As shown in fig. 8, the light absorbing layer 103 may also be a double-ring design, i.e., the number of light absorbing layers 103 is 2, and two light absorbing layers 103 are sequentially arranged around the display area 11 from inside to outside. For example, two annular opening regions may be formed in the non-display region 12 of the buffer layer 102 at intervals, and then one light absorbing layer 103 may be disposed in each of the two annular opening regions.

For example, the outer edge line of the orthographic projection of the light absorbing layer 103 arranged on the outer side on the substrate 101 may coincide with the outer edge line of the above-described second projection area; when d1 is 650 μm and d2 is 2900 μm, the width of the single light absorbing layer 103 may be 650 μm, the separation distance t between the two light absorbing layers 103 may be 800 μm, and the distance between the light absorbing layer 103 relatively closer to the display area 11 and the edge of the display area 11 may be 800 μm.

As shown in fig. 9, the light absorbing layer 103 may also be designed in three circles, that is, the number of the light absorbing layers 103 is 3, and three light absorbing layers 103 are sequentially arranged around the display area 11 from inside to outside. For example, three annular opening regions may be formed in the non-display region 12 of the buffer layer 102 at intervals, and then one light absorbing layer 103 may be disposed in each of the three annular opening regions. For example, the outer edge line of the orthographic projection of the light absorbing layer 103 arranged at the outermost side on the substrate 101 may coincide with the outer edge line of the above-described second projection region; the inner edge line of the orthographic projection of the innermost light-absorbing layer 103 arranged on the substrate 101 may coincide with the edge line of the display region; when d1 is 650 μm and d2 is 2900 μm, the width of a single light absorbing layer 103 may be 650 μm and the separation distance t between adjacent two light absorbing layers 103 may be 475 μm.

When applied to a taillight, the limiting ambient temperature was: the high temperature is about 150 ℃, the low temperature is about-40 ℃, the reliability duration is more than 3000 hours, and the environment can lead to the peeling of the film layer of the backboard 100 after the reliability is generated, so that the display is obvious and no display is generated. Compared with the single-circle light absorption layer 103, the adoption of the scheme of the multi-circle light absorption layer 103 can increase the number of holes dug at the edge of the panel buffer layer 102, so that the film stress in the reliability environment can be released, no display caused by edge stripping is avoided, and the reliability of the light-emitting panel 10 is improved.

In some examples, when the buffer layer 102 includes a plurality of inorganic film layers stacked, the opening regions may also be provided in a staggered manner, so that the light absorbing material is filled in the staggered opening regions, resulting in the light absorbing layer 103.

For example, at least two inorganic film layers among the plurality of inorganic film layers stacked one above another are provided with an opening region. Accordingly, the light absorbing layer 103 includes: at least two light-absorbing portions, each light-absorbing portion being located within one of the open areas. The at least two light absorbing portions are arranged in a staggered manner, and orthographic projections of the at least two light absorbing portions on the substrate 101 form a closed ring shape so as to absorb light leakage with one circle at the edge as comprehensively as possible.

The above-described misalignment arrangement scheme will be described below taking the buffer layer 102 as an example that it includes a first inorganic film layer 201, a second inorganic film layer 202, and a third inorganic film layer 203 that are stacked in this order in a direction away from the substrate 101.

Fig. 10 shows a path diagram of incident light in the buffer layer 102, where the incident angle of the incident light at the first interface is θ, the refraction angle is α, that is, the incident angle at the second interface is β, and the first interface is an interface between the third inorganic film layer 203 and the second inorganic film layer 202, and the second interface is an interface between the second inorganic film layer 202 and the first inorganic film layer 201, as shown in fig. 10. Considering that the refractive index of the first inorganic film layer 201 and the third inorganic film layer 203 is smaller than that of the second inorganic film layer 202, the incident light enters the optically dense layer from the optically dense layer at the first interface, the refraction angle α is smaller than the incident angle θ, and the incident light enters the optically dense layer from the optically dense layer at the second interface, the refraction angle β is smaller than the incident angle α. That is, the incident light is inwardly deflected at the second inorganic film layer 202, and thus, in order to save production costs, light absorbing portions that are offset from each other may be provided only in the first inorganic film layer 201 and the third inorganic film layer 203, respectively, without separately providing the light absorbing portions in the second inorganic film layer 202 (e.g., siO layer).

For example, fig. 11 shows a schematic top view of an exemplary light emitting panel 10 in an embodiment of the disclosure, and fig. 12 shows a schematic cross-sectional view A-A of fig. 11. Referring to fig. 11 and 12, the first inorganic film layer 201 and the third inorganic film layer 203 are provided with opening regions, which are a first opening region and a second opening region, respectively; the light absorption layer 103 comprises a first light absorption portion 301 located in a first opening area and a second light absorption portion 302 located in a second opening area, the first light absorption portion 301 and the second light absorption portion 302 are arranged in a staggered mode, and orthographic projections of the first light absorption portion 301 and the second light absorption portion 302 on the substrate 101 form a closed ring shape so as to absorb light leakage with a circle at the edge as comprehensively as possible.

For example, as shown in fig. 11, the second light absorbing portion 302 is closer to the display area 11 than the first light absorbing portion 301, the two light absorbing portions are staggered inside and outside, the front projections of the first light absorbing portion 301 and the second light absorbing portion 302 on the substrate 101 may be half rectangular rings, and the two semi-rings are spliced into a closed rectangular ring. Similar to the single turn design shown in fig. 5 and 6, the sides of the rectangular-like loop may be straight, as shown in fig. 11; alternatively, the line may be a broken line or an arc line, which is not limited in this embodiment.

For example, as shown in fig. 12, the outer edge line of the front projection of the first light absorbing portion 301 on the substrate 101 is substantially coincident with the outer edge line of the front projection of the encapsulation adhesive layer 120 on the substrate 101, the inner edge line of the front projection of the first light absorbing portion 301 on the substrate 101, and the outer edge line of the front projection of the second light absorbing portion 302 on the substrate 101 are substantially coincident with the inner edge line of the front projection of the encapsulation adhesive layer 120 on the substrate 101, and the inner edge line of the front projection of the second light absorbing portion 302 on the substrate 101 is substantially coincident with the edge line of the display area 11, and does not overlap with the display area 11.

In other examples, the light absorbing portions may be arranged in the first inorganic film 201, the second inorganic film 202, and the third inorganic film 203 in a staggered manner according to actual needs, so as to form the light absorbing layer 103 surrounding the display area 11; alternatively, light absorbing portions are arranged in the first inorganic film layer 201 and the second inorganic film layer 202 in a staggered manner to form a light absorbing layer 103 surrounding the display area 11 for one turn; alternatively, the light absorbing portions may be arranged in the second inorganic film 202 and the third inorganic film 203 in a staggered manner to form the light absorbing layer 103 surrounding the display area 11.

Second, a light absorbing layer 103 is added to the buffer layer 102. For example, fig. 13 and 14 respectively show partial cross-sectional schematic views of an exemplary light emitting panel 10 in an embodiment of the present disclosure. As shown in fig. 13, the light absorbing layer 103 may be located at a side of the buffer layer 102 near the substrate 101. Alternatively, as shown in fig. 14, the light absorbing layer 103 may be located on a side of the buffer layer 102 away from the substrate 101. The addition of the light-absorbing coating outside the buffer layer 102 has the advantage of effectively controlling the concentration of the light-absorbing material in the coating and the thickness of the light-absorbing coating, thereby ensuring the degree of absorption of the incident light at the edges of the panel

For example, the light absorbing layer 103 covers the non-display area 12 of the back plate 100 to absorb the edge light leakage as much as possible and reduce the light leakage amplitude. The orthographic projection of the light absorbing layer 103 on the substrate 101 and the display area 11 do not overlap each other, so as to ensure the normal light emission of the display area 11. For example, in the light emitting panel 10 having a bezel width D of about 1.5mm, the width D of the light absorbing layer 103 may be less than 1.5 μm to ensure that no light absorbing layer 103 covers directly under the display area 11. The frame width is the distance from the edge of the panel to the edge of the display area 11. For example, the thickness (i.e., height) of the light absorbing layer 103 in a direction perpendicular to the base substrate 101 may be 100 to 500nm.

The addition of the light absorbing layer 103 outside the buffer layer 102 is advantageous in controlling the concentration of light absorbing particles in the light absorbing layer 103 and the thickness of the light absorbing layer 103, thereby ensuring the extent to which light leakage from the edges of the panel is absorbed. According to the absorbance formula a=a×b×c, where a is the absorbance coefficient, b is the thickness of the light absorbing layer 103, and c is the light absorbing particle concentration. When the value of b of the product design is less than 1.5 mu m, the concentration c of the light-absorbing particles can be 5%, 10%, 15%, 20%, 25% or 30% and the like. For example, fig. 15 shows a graph of the Concentration of light-absorbing particles versus Absorbance, with the abscissa representing the Concentration of light-absorbing particles (Concentration in ug/ml) and the ordinate representing the Absorbance (absorptance (%)). The selection of the concentration of light absorbing particles can be made with reference to fig. 15.

In addition, the back plate 100 further includes: a metal trace layer 104 disposed on a side of the buffer layer 102 facing away from the metal trace layer 104, and a passivation layer 105 (PVX) overlying the metal trace layer 104. For example, the metal trace layer 104 may include: the power signal wiring is connected with the first electrode of the light emitting device and transmits a first voltage signal to the first electrode. For example, the power signal wiring may be directly connected to the first electrode of the light emitting device, or connected to the first electrode through a switching device provided in the back plate 100. The common signal wiring is connected to the second electrode 111 of the light emitting device, and transmits a second voltage signal to the second electrode 111. The light emitting device is controlled to emit light by the first voltage signal and the second voltage signal.

When the side of the light absorbing layer 103 away from the substrate 101 is flush with the side of the buffer layer 102 away from the substrate 101, or when the light absorbing layer 103 is located on the side of the buffer layer 102 away from the substrate 101, in order to avoid direct contact of the light absorbing material with the metal traces located in the non-display area 12 to erode the metal traces, the backplate 100 may further include: a protective layer (not shown) is located between the metal routing layer 104 and the light absorbing layer 103. The orthographic projection of the light absorbing layer 103 onto the substrate 101 is located within the orthographic projection of the protective layer onto the substrate 101. The material of the protective layer is an inorganic insulating material such as silicon nitride or other suitable material, and the thickness of the protective layer in the direction perpendicular to the substrate 101 may be less than 0.1 μm.

Of course, the light emitting panel 10 may include other structures besides the above-described structure, for example, the non-display area 12 may further include bonding pins 140, and the flexible circuit board 150 (Flexible Printed Circuit, FPC) on which the signal transmission lines are disposed may be bonded and connected to the bonding pins 140, thereby achieving signal transmission between the display control device and the light emitting panel 10.

Fig. 16 is a flowchart illustrating a method of manufacturing a light-emitting panel 10 according to an embodiment of the present disclosure, which may be used to manufacture the light-emitting panel 10 according to any of the above embodiments. The light-emitting panel 10 includes: a display area 11, and a non-display area 12 surrounding the display area 11. As shown in fig. 16, the method may include at least the steps of:

Step S101, providing a back plate and a cover plate, where the back plate includes: the display device comprises a substrate and a light absorption layer positioned in a non-display area of the substrate, wherein the light absorption layer is arranged around the display area;

step S102, forming a luminous layer covering the display area on the backboard;

step S103, forming a packaging adhesive layer surrounding the display area on the cover plate;

and S104, aligning and attaching the backboard and the cover plate to form a light-emitting panel, wherein the orthographic projection of the light-absorbing layer on the substrate and the orthographic projection of the packaging adhesive layer on the substrate are at least partially overlapped, the light emitted by the light-emitting layer exits through the backboard, and the light-absorbing layer is configured to absorb the lateral light irradiated towards the light-absorbing layer in the light-emitting panel.

For example, the step of providing the back plate 100 may include: providing a substrate base 101; a buffer layer 102 and a light absorbing layer 103 are formed on a substrate 101. In some examples, the step of forming the buffer layer 102 and the light absorbing layer 103 on the substrate 101 may include: a buffer layer 102 is formed on a substrate 101, an opening region is formed in the buffer layer 102 located in the non-display region 12, and a light absorbing material is filled in the opening region to form a light absorbing layer 103.

Taking a single SiN layer as the buffer layer 102 as an example, there may be two embodiments of forming the buffer layer 102 and the light absorbing layer 103, the first: a layer of 100 μm SiN is deposited on the substrate 101 by PECVD, the light absorbing material filling hole, i.e., the opening region is etched by developing exposure, and then the light absorbing material is printed in the filling hole by Ink-Jet Printing (IJP) and then ultraviolet cured to form the light absorbing layer 103. Second kind: a layer of 100 μm light absorbing material was deposited on the substrate 101 by CVD, the light absorbing layer 103 was formed by exposure and development, and SiN was deposited by PECVD after uv curing.

In other examples, the step of forming the buffer layer 102 and the light absorbing layer 103 on the base substrate 101 may include: firstly, forming a light absorption layer 103 on a substrate 101, and then forming a buffer layer 102 on one side of the substrate 101 on which the light absorption layer 103 is formed; alternatively, the buffer layer 102 is formed on the substrate 101, and then the light absorbing layer 103 is formed on the buffer layer 102. For example, the light absorbing material may be physically deposited on the substrate 101 by PECVD, knife coating or spin coating, and then cured to form a film, to obtain the light absorbing layer 103, and then the buffer layer 102 is formed on the side of the substrate 101 where the light absorbing layer 103 is formed. Alternatively, the buffer layer 102 may be formed on the substrate 101, and then the light-absorbing material may be physically deposited on the buffer layer 102 by PECVD, knife coating or spin coating, and then cured to form the light-absorbing layer 103.

For example, the buffer layer 102 includes: the first inorganic film 201, the second inorganic film 202, and the third inorganic film 203 are sequentially stacked in a direction away from the substrate 101. The refractive index of the first inorganic film 201 and the third inorganic film 203 is smaller than the refractive index of the second inorganic film 202. The process of forming the buffer layer 102 may include: the stacked first inorganic film layer 201, second inorganic film layer 202, and third inorganic film layer 203 are sequentially formed by a chemical vapor deposition process. For example, the first inorganic film 201, the second inorganic film 202, and the third inorganic film 203 may be SiN layers, siO layers, and SiN layers in this order. The process gases of the chemical vapor deposition process include: nitrogen (N) ₂ ) Ammonia (NH) ₃ ) And Silane (SiH) ₄ ). In order to improve the film forming quality of the buffer layer 102 and thus the uniformity of the light-emitting color depth, the flow rate of nitrogen can be controlled to 32000+/-5% sccm, namely 30400-33600 sccm, the flow rate of ammonia can be controlled to 7200+/-2% sccm, namely 7056-7344 sccm, and the flow rate of silane can be controlled to be: 2000.+ -. 2% sccm, i.e. 1960 to 2040sccm.

The disclosed embodiments also provide a lighting device that may include the light emitting panel 10 provided in the above embodiments. The specific structure and technical effects of the light emitting panel 10 have been described in detail above, and will not be described again here. Therefore, the lighting device has the technical effects corresponding to the beneficial technical effects of the light-emitting panel 10, namely, the problem of edge light leakage is improved, and better lighting effect is achieved.

In addition, the embodiment of the disclosure also provides an automobile, which comprises the lighting device in the embodiment. For example, the lighting device may be a lamp of an automobile, such as a tail lamp of an automobile. Thus, the automobile has technical effects corresponding to the beneficial technical effects of the lighting device.

In the above description, technical details such as patterning of the respective layers of the product are not described in detail. Those skilled in the art will appreciate that layers, regions, etc. of the desired shape may be formed by a variety of techniques. In addition, to form the same structure, those skilled in the art can also devise methods that are not exactly the same as those described above. Although the embodiments are described above separately, this does not mean that the measures in the embodiments cannot be used advantageously in combination.

In addition, one of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the disclosure is limited to these examples; combinations of features of the above embodiments or in different embodiments are also possible within the spirit of the present disclosure, steps may be implemented in any order, and there are many other variations of the different aspects of one or more embodiments of the present disclosure as described above, which are not provided in detail for the sake of brevity.

While the preferred embodiments of the present disclosure have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the disclosure.

Claims

1. A light-emitting panel, comprising: a display region and a non-display region surrounding the display region, the light emitting panel further comprising: the display device comprises a back plate, a luminous layer, an encapsulation adhesive layer and a cover plate which are sequentially stacked, wherein the encapsulation adhesive layer is positioned between the back plate and the cover plate and surrounds the display area, and light emitted by the luminous layer exits through the back plate;

2. The light-emitting panel of claim 1, wherein the back plate further comprises: a buffer layer disposed on one side of the substrate base plate, the buffer layer including: the light absorption layer is positioned in the opening area, and orthographic projection of the light absorption layer on the substrate is in a closed shape.

3. The light-emitting panel according to claim 2, wherein the buffer layer includes: at least two open areas are arranged at intervals, one light absorption layer is arranged in each open area, and at least two light absorption layers are sequentially distributed around the display area from inside to outside.

4. The light-emitting panel according to claim 2, wherein the buffer layer includes: a plurality of inorganic film layers that are stacked and arranged, wherein at least two inorganic film layers are provided with the opening region, and the light absorbing layer includes: and the at least two light absorption parts are arranged in the opening area in a staggered manner, and orthographic projections of the at least two light absorption parts on the substrate form a closed ring.

5. The light-emitting panel according to claim 4, wherein the plurality of inorganic film layers stacked and disposed include: the first inorganic film layer, the second inorganic film layer and the third inorganic film layer are sequentially stacked along the direction away from the substrate, wherein the refractive index of the first inorganic film layer and the refractive index of the third inorganic film layer are smaller than those of the second inorganic film layer, and the first inorganic film layer and the third inorganic film layer are provided with the opening areas which are respectively a first opening area and a second opening area;

6. The light-emitting panel of claim 1, wherein the back plate further comprises: and the light absorption layer is positioned on one side of the buffer layer close to the substrate, or on one side of the buffer layer far away from the substrate.

7. The light-emitting panel of claim 6, wherein the light-absorbing layer covers a non-display region of the back plate, and wherein an orthographic projection of the light-absorbing layer on the substrate base plate does not overlap the display region.

8. The light-emitting panel of claim 1, wherein the back plate further comprises: a buffer layer disposed on one side of the substrate base plate, the buffer layer including: the light emitting device comprises a substrate, a first inorganic film layer, a second inorganic film layer and a third inorganic film layer, wherein the first inorganic film layer, the second inorganic film layer and the third inorganic film layer are sequentially stacked along the direction away from the substrate, the refractive index of the first inorganic film layer and the refractive index of the third inorganic film layer are smaller than that of the second inorganic film layer, and light emitted by the light emitting layer sequentially passes through the third inorganic film layer, the second inorganic film layer and the first inorganic film layer and is emitted after being adjusted to light with a target peak wavelength.

9. The light-emitting panel of claim 1, wherein the back plate further comprises: the buffer layer is arranged on one side of the substrate, the light absorption layer is arranged in an opening area in the buffer layer, one side of the light absorption layer, which is far away from the substrate, is flush with one side of the buffer layer, which is far away from the substrate, or the light absorption layer is positioned on one side of the buffer layer, which is far away from the substrate; the back plate further comprises:

10. A lighting device comprising the light-emitting panel of any one of claims 1-9.

11. An automobile comprising the lighting device of claim 10, wherein the lighting device is a lamp of the automobile.

12. A method of manufacturing a light emitting panel, the light emitting panel comprising: a display area and a non-display area surrounding the display area, the method comprising

Providing a back plate and a cover plate;

forming a light emitting layer covering the display region on the back plate;

13. The method of claim 12, wherein providing a back plate comprises:

providing a substrate;

forming a buffer layer and a light absorption layer on the substrate;

the forming a buffer layer and a light absorbing layer on the substrate base plate includes:

forming a buffer layer on the substrate, forming an opening area in the buffer layer positioned in the non-display area, and filling a light absorption material in the opening area to form the light absorption layer; or alternatively, the process may be performed,

forming the light absorption layer on the substrate, and forming a buffer layer on one side of the substrate, on which the light absorption layer is formed; or alternatively, the process may be performed,

and forming a buffer layer on the substrate base plate, and forming the light absorption layer on the buffer layer.

14. The method of claim 13, wherein forming a buffer layer comprises:

sequentially forming a first inorganic film layer, a second inorganic film layer and a third inorganic film layer which are laminated through a chemical vapor deposition process, wherein the refractive index of the first inorganic film layer and the refractive index of the third inorganic film layer are smaller than those of the second inorganic film layer;