CN116867217A - Spider-web-shaped micro-channel heat dissipation device and control system thereof - Google Patents
Spider-web-shaped micro-channel heat dissipation device and control system thereof Download PDFInfo
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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Abstract
The invention provides a spider-web-shaped microchannel heat dissipation device and a control system thereof, belonging to the technical field of microchannel heat dissipaters; the problems of large flow resistance of a heat dissipation medium and uneven temperature distribution of a heat exchange surface of the traditional microchannel radiator are solved; the heat sink comprises a micro-channel main body and a sealing cover plate, wherein the micro-channel main body comprises a fluid inlet, a main flow micro-channel, a fluid outlet, an inlet pressure measuring port and an outlet pressure measuring port, the sealing cover plate is fixed with the front surface of the micro-channel main body, and the back surface of the micro-channel main body is fixed with a heating element; the fluid micro-channels with regular decagons or regular dodecagons or circular structures are uniformly distributed at the central position of the main flow micro-channel in an outward radial way; the fluid inlet of the micro-channel main body is connected with the liquid reservoir through the power pump, the fluid outlet is connected with the inlet of the air-cooled radiator, and the outlet of the air-cooled radiator is connected with the liquid reservoir; the invention is applied to chip heat dissipation.
Description
Technical Field
The invention provides a spider-web-shaped microchannel heat dissipation device and a control system thereof, and belongs to the technical field of microchannel heat sinks.
Background
With the rapid development of electronic technology, miniaturization of devices is a trend of technological development. The high density integration of chip devices is accompanied by a significant increase in power density, resulting in a concentration of device heat generation. And when the heat flux density of the microelectronic device exceeds 100W/cm 2 At the moment, the conventional heat transfer device cannot solve the heat dissipation problem, and the integrated components of the microelectronic chip are increased at a speed of 40% -50% each year, especially in some advanced technical fields such as microelectronic chips of high-power radars, and the transient heat flow density is even as high as 10 7 W/m 2 . If the chip cannot be effectively cooled in time, heat accumulation can cause the performance of the chip to be reduced, the service life to be shortened, and even the device to be burnt. It is counted that more than 55% of the failures of microelectronic chips are caused by heat dissipation problems, and the reliability is reduced by 5% every 1 ℃ increase in the operating environment temperature of the device at 70-80 ℃. Therefore, the research of the miniature heat exchanger becomes a hot problem of industrial production and scientific research, and the characteristics of high heat transfer efficiency and small flow resistance have important application prospects in the industrial field. Microscale heat exchangers are a new cooling technology developed in this context.
At present, the micro cooler which is actively researched by students at home and abroad comprises: microchannel heat sinks, micro freezers, micro heat pipe soaking fins, integrated micro coolers, micro jet array heat sinks, and the like. The microchannel radiator has the advantages of large specific surface area, high heat exchange strength per unit area, light dead weight, small volume, capability of being directly integrated on a radiating chip to avoid the problem of thermal stress matching, and the like, is considered as one of effective methods for solving the problem of radiating of high-heat-flux micro equipment, and is highly valued and widely studied by students at home and abroad. There are two design limitations to microchannel heat sinks. First, the large flow resistance due to the small size; secondly, the high heat flux density causes larger temperature change of the cooling medium between the inlet and the outlet, and uneven temperature distribution of the heat exchange surface is caused.
Therefore, designing a microchannel heat sink with a small pressure drop and uniform temperature distribution becomes a key technology for heat dissipation of microelectronic chips.
Disclosure of Invention
The invention provides a spider-web-shaped microchannel heat radiating device and a control system thereof, which aim to solve the problems of high flow resistance of a heat radiating medium and uneven temperature distribution of a heat exchanging surface of the conventional microchannel heat radiator.
In order to solve the technical problems, the invention adopts the following technical scheme: the spider-web-shaped microchannel heat sink comprises a microchannel main body and a sealing cover plate, wherein the microchannel main body comprises a fluid inlet, a main flow microchannel and a fluid outlet, an inlet pressure measuring port and an outlet pressure measuring port are respectively arranged at the fluid inlet and the fluid outlet, the sealing cover plate is fixed on the plane of the microchannel main body, and a heating element is fixed on the other plane of the microchannel main body;
the sealing cover plate is provided with an inlet pressure measurement sensor fixing hole and an outlet pressure measurement sensor fixing hole which are respectively arranged corresponding to the positions of an inlet pressure measurement port and an outlet pressure measurement port of the micro-channel main body;
the main flow micro-channel, the fluid inlet and the fluid outlet are on the same straight line, and the fluid micro-channel with a regular decagon or a regular dodecagon or a circular structure is uniformly distributed at the center of the main flow micro-channel in an outward radial manner according to a cobweb structure;
the fluid inlet of the micro-channel main body is connected with the liquid reservoir through the power pump, the fluid outlet of the micro-channel main body is connected with the inlet of the air-cooled radiator, and the outlet of the air-cooled radiator is connected with the liquid reservoir, so that liquid in the liquid reservoir is circulated.
The microfluidic channel specifically adopts a spider-web shape of a regular decagon structure.
The widths at the fluid inlet and the fluid outlet are equal, and the width at the center of the main flow microchannel is smaller than the width at the fluid inlet and the fluid outlet.
The fluid micro-channel can also be provided with a diagonal channel.
The width of the main flow micro-channel at the center is 0.4-0.8mm.
The micro-channel main body is made of silicon, stainless steel, copper or metal alloy materials;
the sealing cover plate is made of silicon, stainless steel, copper or temperature-resistant transparent glass materials.
The main flow micro-channel and the fluid micro-channel are formed by one or more of micro-milling, injection molding, casting, laser processing or etching.
The fin of air-cooled radiator adopts the fin of ripple shape, be provided with entry and export on the fin, connect microchannel main part and reservoir respectively, fin upper surface is fixed with the heat dissipation window, the heat dissipation window internal fixation has radiator fan blade.
The control system of the spider-web-shaped micro-channel heat dissipation device adopts the spider-web-shaped micro-channel heat dissipation device, wherein a fluid inlet and a fluid outlet of a micro-channel main body are respectively connected with a thermocouple, the liquid temperatures at the fluid inlet and the fluid outlet are respectively measured, a heating element on the micro-channel main body is connected with a thermocouple, and the temperature of a heating wall surface is measured;
pressure sensors are respectively arranged on the inlet pressure measurement port fixing hole and the outlet pressure measurement port fixing hole and are used for measuring the inlet pressure and the outlet pressure of the micro-channel main body;
the control end of the power pump, the control end of the air cooling radiator, the flowmeter, the thermocouple and the pressure sensor are respectively connected with the temperature control system through wires.
Compared with the prior art, the invention has the following beneficial effects: according to the spider-web-shaped microchannel heat dissipation device and the control system thereof, hydraulic heat dissipation is introduced into the microchannel heat sink, and then the cooling capacity of the heat dissipation device can be greatly improved through the control of the air cooling heat sink and the temperature control system.
Drawings
The invention is further described below with reference to the accompanying drawings:
FIG. 1 is a schematic diagram of a spider-web microchannel heat sink split in an embodiment of the invention;
FIG. 2 is a schematic diagram of a spider-web microchannel heat sink assembly according to an embodiment of the present invention;
FIG. 3 is a schematic view of a micro-channel body according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a connection structure of the control system of the present invention;
fig. 5, 6 and 7 are schematic structural diagrams of an air-cooled radiator according to the present invention;
FIG. 8 is a schematic diagram of a spider web structure of six types, regular hexagons, regular octagons, regular decagons, regular dodecagons, and circles;
FIG. 9 is a plot of temperature versus pressure drop profiles for six spider-web microchannels;
FIG. 10 is a graph showing the temperature profiles of the heating surfaces of six spider-web microchannels;
FIG. 11 shows the temperature distribution and average temperature values of six spider-web microchannel structures along the main channel;
FIG. 12 is a graph of flow field profiles of six spider-web microchannels;
FIG. 13 is a diagram of six spider webs with diagonal channels added;
FIG. 14 is a graph comparing temperature profiles of six spider-web microchannels with diagonal channels added;
FIG. 15 is a graph comparing pressure drop profiles for six spider-web microchannels with diagonal channels added;
FIG. 16 is a graph showing temperature profiles of six spider-web microchannels with diagonal channels added;
FIG. 17 is a flow field distribution diagram of six spider-web microchannels with diagonal channels added;
FIG. 18 is a schematic diagram of a decagonal spider web microchannel with primary channels of different widths;
FIG. 19 is a graph of temperature versus pressure drop profiles for decagonal spider web microchannels for different width main channels;
FIG. 20 is a temperature cloud of decagonal spider web microchannels for different width primary channels;
FIG. 21 is a flow field distribution cloud of decagonal spider web microchannels for different width primary channels;
in the figure: the micro-channel comprises a micro-channel main body 1, a sealing cover plate 2, a fluid inlet 3, an inlet pressure measuring port 4, a fluid micro-channel 5, an outlet pressure measuring port 6, a fluid outlet 7, a main flow micro-channel 8, an inlet pressure measuring sensor fixing hole 9, an outlet pressure measuring sensor fixing hole 10, a first thermocouple 11, a second thermocouple 12, a third thermocouple 13, an inlet pressure sensor 14, an outlet pressure sensor 15, an air-cooled radiator 16, a power pump 17, a liquid reservoir 18, a flowmeter 19, a temperature control system 20, a fin 21, a heat dissipation window 22 and a cooling fan blade 23.
Detailed Description
As shown in fig. 1 to 21, the present invention provides a spider-web-shaped microchannel heat dissipating device for enhancing heat exchange by utilizing hydraulic force, which mainly comprises: the spider-web-shaped microchannel heat sink comprises a microchannel main body 1 and a sealing cover plate 2, wherein one end of the microchannel main body 1 is provided with a fluid inlet 3, an inlet pressure measuring port 4, a main flow microchannel 8, an outlet pressure measuring port 6 and a fluid outlet 7. The air-cooled radiator 16 has corrugated fins adopted as the fins 21 of the air-cooled radiator 16, which have increased specific surface area compared with rectangular fins, and the corrugated fins can continuously change the flow direction of fluid to promote turbulent flow formation, thereby improving heat dissipation efficiency
In the microchannel heat sink, a sealing cover plate 2 is arranged on the plane of a microchannel main body 1, and the sealing cover plate 2 is provided with an inlet pressure measurement sensor fixing hole 9 and an outlet pressure measurement sensor fixing hole 10 which respectively correspond to an inlet pressure measurement port 4 and an outlet pressure measurement port 6 of the microchannel main body 1.
In the microchannel heat sink of the present invention, a heating element is disposed on the other plane of the microchannel body 1.
In the microchannel heat sink of the present invention, the material of the microchannel body 1 is silicon, stainless steel, copper or other metal alloy.
In the microchannel heat sink, the sealing cover plate 2 is made of silicon, stainless steel, copper or temperature-resistant transparent glass.
In the microchannel heat sink, the microchannel main body 1 is designed by imitating a spider-web structure, and can adopt a regular decagon or regular dodecagon or circular structure, so that a microchannel network is uniformly and densely distributed and has the minimum network perimeter, the pressure of a fluid network system is effectively reduced, and the heat exchange efficiency is prevented from being reduced due to the fact that a local flow dead zone is formed by right-angle corners of the regular quadrangle in a conventional rectangular structure.
Meanwhile, in order to control the heat radiation performance of the heat radiation device, the invention provides a control system which mainly comprises a micro-channel heat sink, a temperature control system 20, a power pump 17, a liquid reservoir 18, a thermocouple, a pressure sensor, a flowmeter 19 and the like. Through Solidwork three-dimensional modeling, carrying out structural and parameter design on a micro-channel heat sink and an air-cooled radiator based on a bionic theory and Fluent fluid software simulation; the temperature control system 20 controls the rotation speed of the fan and the power of the power pump 17 so as to realize intelligent cooling of the chip; by analyzing the simulation data and the experimental data, the structure and the parameters are continuously optimized, and the whole set of heat dissipation device is designed.
In the control system, a first thermocouple 11 and a second thermocouple 12 are arranged at a fluid inlet 3 and a fluid outlet 7 of a micro-channel heat sink, and the temperatures of fluids at the inlet and the outlet of the micro-channel heat sink are measured respectively; a third thermocouple 13 is mounted on the surface of the heating element on the back of the microchannel body 1 for measuring the temperature of the heated wall.
In the control system of the present invention, an inlet pressure sensor 14 is installed on an inlet pressure measurement sensor fixing hole 9 of a micro-channel heat sink, and an outlet pressure sensor 15 is installed on an outlet pressure measurement sensor fixing hole 10 of the micro-channel heat sink.
In the control system of the present invention, an air-cooled radiator 16 is mounted downstream of the microchannel heat sink to maintain a constant temperature of the fluid entering the microchannel heat sink.
In the control system of the present invention, a power pump 17 is installed upstream of the micro-channel heat sink, and fluid in a reservoir 18 is input into the micro-channel heat sink by pressurization of the power pump 17.
In the control system of the present invention, the temperature control system 20 is installed at the rear end of the air-cooled radiator 16, and controls the air speed and the water flow rate by detecting the temperature signal of the heating element, thereby realizing the temperature control of the heating element.
In the control system, the temperature control system 20 is based on an STC89C51 singlechip and detects the temperature by adopting a DS8B20 temperature sensor.
In the control system of the present invention, a flow meter 19 is installed between the air-cooled radiator 13 and the reservoir 18 for monitoring the flow rate of the cooling liquid.
The heat dissipation principle of the heat dissipation device of the invention is as follows: the cooling liquid medium enters the microchannel body 1 through the fluid inlet 3, a small portion of the liquid enters the inlet pressure measurement port 4 for measurement, and the remaining portion of the liquid enters each of the fluid microchannels 5 through the main flow microchannel 8. In the microchannel heat sink of the present invention, the number of the fluid microchannels 5 may be determined according to the heat generating area of the heat generating element, and is not limited to the number shown in the figure.
As shown in fig. 5-7, the air-cooled heat sink 16 is modified to a micro-corrugated shape from a conventional flat rectangular fin. The corrugated fins can promote turbulent flow formation by changing the flow direction of fluid, so that the heat dissipation rate of a heat source is further improved, the effective utilization of cooling water circulation is improved, and the heat exchange efficiency is further improved.
As shown in fig. 4, the circulation power of the cooling liquid medium is provided by the power pump 17, after the cooling liquid comes out from the liquid reservoir 18, the cooling liquid enters the micro-channel heat sink through the fluid inlet 3 to cool the heating element, and after cooling, the cooling liquid flows out of the micro-channel heat sink through the fluid outlet 7. In order to accurately measure the heat transfer capability of the microchannel heat sink, it is necessary to ensure that the liquid temperature at the fluid inlet of the microchannel heat sink is constant, so that the cooled liquid is cooled by the air-cooled radiator 16 and then re-entersA reservoir 18. The temperature of the heating wall surface can be measured through the third thermocouple 13 arranged on the heating element, the temperature control system 20 detects the wall surface temperature, so that the cooling condition of the heating element is judged, the wind speed of the air-cooled radiator 16 and the flow rate of water controlled by the power pump 17 are further controlled, and finally the temperature control of the heating element is realized. The liquid temperature of the microchannel heat sink can be measured by the first thermocouple 11 and the second thermocouple 12 provided at the fluid inlet 3 and the fluid outlet 7 of the microchannel body 1. By means of the pressure sensors arranged at the inlet pressure measuring port 4 and the outlet pressure measuring port 6, the liquid pressure at the inlet and the outlet of the micro-channel heat sink can be measured, so that the liquid flow condition in the micro-channel heat sink can be judged. The flow of the cooling liquid in the circulation loop is measured by a flow meter 19. Average heat exchange coefficient of micro-channel heat sinkIs obtained by the following formula:
in the above formula: q is the heat flux density, Δt is the average heat transfer temperature difference, c p The specific heat of the cooling liquid is fixed, ρ is the density of the cooling liquid, Q is the circulation flow of the cooling liquid, A is the heat exchange area, t W Is the wall temperature, t f1 Fluid inlet liquid temperature, t, for a microchannel heat sink f2 Fluid outlet liquid temperature for a microchannel heat sink.
As shown in fig. 3, the microchannel main body 1 is a three-dimensional model diagram obtained by fitting the response surface equation of the spider-web microchannel structure temperature, pressure drop and design parameters based on the BBD response surface method, and provides a theoretical basis for the research of the spider-web microchannel radiator. Specifically, response surface analysis is carried out on the groove width, the wing width and the groove height of the spider-web-shaped micro-channel by a BOX-Behnken Design method, wherein the groove width is 0.1-0.3 mm in value range, the wing width is 0.1-0.3 mm in value range, the groove height is 0.3-0.5 mm in value range, test Design is carried out by using Design Expert software, and the relation among temperature, pressure drop and Design variables obtained by calculating a sample by using Fluent software is established. The different shape spider temperature and pressure drop function equations were fitted by Design Expert software.
As shown in fig. 3, the microchannel main body 1 optimizes parameters of the spider-web microchannel structure based on a multi-target particle swarm algorithm, so that the heat exchange performance of the spider-web microchannel heat sink is further improved. Width W of channel of fluid-taking micro-channel c Width W of fin b Height H of channel c As a design variable. And setting boundaries of various parameter variables of the channel by taking temperature and pressure drop as objective functions, and establishing a multi-target particle swarm taking the parameters of the spider-web micro-channel structure as variables by taking the width of the micro-channel heat sink as constraint conditions.
The following describes spider-web-structured micro-channels of different shapes based on the results of software simulation.
According to the structural characteristics of several cobweb structures in nature, regular hexagons, regular octagons, regular decagons, regular dodecagons, regular tetradecanois and circular cobweb structures are designed, as shown in fig. 8. The fin width, slot depth and heating surface area of these spider-web microchannels are all equal.
The properties of the spider-web structures of the above-described shapes are described below in terms of three aspects of profile structure, diagonal channels, and microfluidic main channel width.
Influence of the shape structure on the performance of the spider-web micro-channel
FIG. 9 shows graphs of highest temperature and inlet-outlet pressure drop trend of heating surfaces of regular hexagons, regular octagons, regular decagons, regular tetradecon, and circular cobweb structures, it can be seen from FIG. 9 that the highest temperature of the regular hexagons is highest, the highest temperature of the regular tetradecon cobweb structures is lowest, the highest temperature starts to decrease along with the increase of the edge number, the decreasing amplitude is the largest at the regular octagons and regular decagons cobweb structures, the decreasing amplitude is very small after the edge number reaches ten, at the moment, the increase of the edge number can not obviously improve the heat dissipation capacity of the micro-channels any more, and the highest temperature is not the lowest as expected when the structure is circular, but is even higher than the highest temperature of the regular dodecagons structure; the pressure drop of the regular hexagonal spider web micro-channel is the lowest, the pressure drop of the regular fourteen-sided spider web micro-channel is the highest, the pressure drop increases along with the increase of the edge number, the increasing amplitude is slowly reduced, the inlet and outlet pressure drops are reduced when the structure is circular, and the pressure drop is lower than when the structure is regular dodecagon.
The temperature distribution of these several spider-web structures is shown in fig. 10, and it can be seen that the heating surface temperature is gradually increased from the inlet to the outlet of the microchannel, and the distribution is approximately the same, and it can be seen that the external structure has no significant influence on the temperature distribution.
The regular decagonal spider-web structure is selected to be most suitable in consideration of heat dissipation performance, pressure drop loss and processing cost.
Taking points uniformly along the main channel, respectively taking temperature distribution and average temperature of the micro-channels with the shapes, wherein the result is shown in fig. 11, and the left side of each group of graphs is a temperature distribution curve, and the right side is an average temperature value; as a comparison, the average temperature of the regular hexagon is 305.4996K, the regular octagon is 305.5415K, the regular decagon is 305.4161K, the regular dodecagon is 305.7699K, the regular tetradecform is 305.7056K, the regular dodecagon is 305.5818K, the round is 306.0532K, and the average temperature of the regular decagon line is the lowest, which also verifies that the heat dissipation performance of the regular decagon is the best.
The state of motion of the fluid within the microchannel is related to its performance, so that the differences in several structural properties can be explained from the state of motion of the fluid. Fig. 12 shows a cloud of flow field distributions for these six spider-web microchannels. As can be seen from analysis of fig. 12 (a) - (e), the improvement of the heat dissipation performance and the increase of the pressure drop loss of the micro-channels can be attributed to the increase of the flow velocity of the fluid in the channels and the increase of the corner structures (the increase of the corner structures makes the flow direction of the fluid change continuously, and the fluid mixing degree deepens). Comparing fig. 12 (c), (d) and (e), it can be seen that the increase of the number of sides from ten to ten in the channel is slow, and the increase of the fluid mixing degree is small, which explains the reason that the highest temperature decrease of the decagon to fourteen-sided spider-web structure is reduced in amplitude. The circular spider-web microchannel has reduced heat dissipation and reduced pressure drop due to the fact that the disappearance of the corner structures results in a reduced degree of mixing of the fluid compared to the first few structures.
Influence of diagonal channels on the performance of spider-web microchannels
The diagonal channels can be communicated with all stages of channels in theory, so that fluid is fully mixed, and the convection heat exchange area is increased. The structure of the six spiders with diagonal channels added is shown in fig. 13.
As can be seen from comparison of the temperature trend of the six spider-web micro-channels (with diagonal channels) with fig. 14, analysis shows that the maximum temperatures of the regular six and regular octagons spider-web structures are raised instead and the maximum temperatures of the other spider-web structures are lowered after the diagonal channels are added, wherein the maximum temperatures of the circular spider-web structures are lowest, the addition of the diagonal channels can improve the heat dissipation performance of the spider-web micro-channels, but the addition of the diagonal channels can achieve a certain degree, and when the addition of the diagonal channels is less, the addition of the diagonal channels can not improve the heat dissipation performance but can reduce the heat dissipation performance.
As shown in fig. 15, analysis shows that the pressure drop trend of six spider-web micro-channels (with diagonal channels) is consistent with that of the non-diagonal channel structure, the pressure drop trend is gradually increased along with the increase of the number of edges, and is reduced at the circular spider-web structure.
A circular spider with diagonal channels may be selected in environments where heat dissipation performance is a high requirement.
FIG. 16 is a graph showing the temperature distribution of six spider-web microchannels (with diagonal channels), and comparing FIG. 10, the temperature distribution of the heated surface of the microchannel is changed after adding the diagonal channels, the low temperature region is radially distributed at the center of the microchannel, and the temperature of the main channel and the center-most region is reduced.
Fig. 17 shows flow field distribution diagrams of six spider-web micro-channels (with diagonal channels), and comparing fig. 12, after adding diagonal channels, the flow rates of the centermost channel and the main channel are accelerated, which explains the reason that the temperature of the inlet main channel and the centermost channel is reduced, and the flow rates of the other branch channels are relatively reduced, which reduces the heat dissipation performance, while adding diagonal channels to the regular hexagonal or octagonal spider-web micro-channels, the number of added diagonal channels is small, the increase of the convective heat exchange area is small, and the effect of the raised cooling effect cannot counteract the influence caused by the reduction of the flow rates, so that the maximum temperature of the hexagonal or octagonal micro-channels (with diagonal channels) is raised.
With the increase of the number of sides, the number of diagonal channels is increased, the convective heat exchange area is increased, all stages of channels are communicated, the fluid mixing degree is increased, the heat dissipation performance of the micro-channel is greatly improved by the factors, and the influence caused by the reduction of the flow velocity is counteracted, so that the highest temperature of the micro-channel with the diagonal channel structure from the regular decagon is lower than that without the diagonal structure.
Effect of Main channel Width on spider-web Microchannel Performance
The main channel is used as the channel with the largest flow in the spider-web micro-channel, has the function of distributing fluid to each level of channels and has certain influence on the performance of the micro-channel. The structure of which is shown in fig. 18.
FIG. 19 shows the relationship between the maximum temperature of the heating surface of the micro-channel and the inlet and outlet pressure drops along with the width of the main channel, and analysis shows that the maximum temperature is reduced along with the reduction of the width of the main channel, the reduction amplitude is maximum between 1mm and 0.8mm, and the amplitude is gradually reduced after that; the inlet and outlet pressure drops are increased along with the reduction of the width of the main channel, the increasing amplitude is gradually increased, the maximum is achieved when the width is 0.4mm to 0.2mm, the influence of the width of the main channel on the heat dissipation performance and the pressure drop loss of the micro channel is large in the whole view, and the small-width main channel is beneficial to the improvement of the heat dissipation performance of the micro channel, but the pressure drop loss is large.
Fig. 20 is a temperature cloud chart, and it can be seen from (a) to (e) that the area of the high temperature region at the outlet is reduced with the reduction of the width of the main channel, the area of the low temperature region at the inlet is increased and expanded to the left and right, and the small width main channel can reduce the highest temperature and improve the temperature distribution.
Considering the influence of the main channel width on the heat dissipation performance, it is suggested to select a main channel of small width.
Fig. 21 is a cloud of microchannel flow field distribution, from (a) to (e), it can be seen that the flow velocity distribution at the inlet main channel of the microchannel is gradually uniform with the decrease of the main channel width, and the flow velocity in the microchannel is gradually increased except the central region, these two factors promote the heat dissipation performance of the microchannel, and in addition, it can be seen by comparing that the flow velocity of the channel near the edge is accelerated with the decrease of the main channel width, the flow velocity of the channel near the central region is reduced even becomes a flow dead zone, which explains why the low temperature region of the microchannel (small width main channel) is expanded to the left and right sides, and the central low temperature region is narrowed.
According to different cobweb structures in the nature, the invention designs regular hexagons, regular octagons, regular decagons, regular dodecagons, regular tetradecgons and circular cobweb structures, explores the influence of cobweb appearance structures, diagonal channels and main channel widths on the performance and temperature distribution of the micro-channels, and attributes the influence, and provides references for the design of the cobweb micro-channel heat sink structure.
Simulation results show that the spider-web appearance structure, the diagonal channels and the main channels have influences on the heat dissipation performance and the pressure loss of the micro channels, and the reasons of the spider-web appearance structure, the diagonal channels and the main channels can be attributed to the flow velocity of fluid, the mixing degree of the fluid and the convective heat transfer area. The conclusion is as follows: (1) The increase of the edge number can improve the heat dissipation capacity of the micro-channel, but the loss of pressure drop can also rise, when the edge number is increased to ten, the highest temperature still shows a descending trend, but the descending amplitude is small, the highest temperature of the circular spider-web structure is not the lowest as expected, but is raised even higher than the highest temperature of the regular dodecagon structure, and in addition, the appearance structure has no obvious influence on the temperature distribution. The regular decagonal spider-web structure is selected to be most suitable in consideration of heat dissipation performance, pressure drop loss and processing cost. And (3) obtaining temperature distribution along the average point of the main channel, obtaining the lowest average temperature of the regular decagon after taking the average temperature, and further verifying the heat dissipation performance of the positive deformation.
(2) The diagonal channels can improve heat dissipation performance, but meanwhile pressure drop loss can be greatly increased, and when the number of the diagonal channels is small, the heat dissipation performance is not improved but is reduced, after the diagonal channels are added in the circular spider-web structure, the highest temperature is lowest in the structures, and in addition, the diagonal channels are added to improve the temperature distribution of a heating surface, so that a low-temperature area is distributed at the central part and is radial. A circular spider with diagonal channels may be selected in environments where heat dissipation performance is a high requirement.
(3) The width of the main channel has great influence on the heat dissipation performance and pressure drop loss of the micro channel, the highest temperature is reduced along with the reduction of the width, the pressure drop is increased along with the reduction of the width, the small-width main channel can greatly reduce the temperature although the pressure loss is improved, the area of a high-temperature area at the outlet of the micro channel is reduced, the low-temperature area at the inlet is expanded to the left side and the right side, the area is increased, and the small-width main channel is recommended to be selected in consideration of the influence of the width of the main channel on the heat dissipation performance.
The specific structure of the invention needs to be described that the connection relation between the component modules adopted by the invention is definite and realizable, and besides the specific description in the embodiment, the specific connection relation can bring about corresponding technical effects, and on the premise of not depending on execution of corresponding software programs, the technical problems of the invention are solved, the types of the components, the modules and the specific components, the connection modes of the components and the expected technical effects brought by the technical characteristics are clear, complete and realizable, and the conventional use method and the expected technical effects brought by the technical characteristics are all disclosed in patents, journal papers, technical manuals, technical dictionaries and textbooks which can be acquired by a person in the field before the application date, or the prior art such as conventional technology, common knowledge in the field, and the like, so that the provided technical scheme is clear, complete and the corresponding entity products can be reproduced or obtained according to the technical means.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (9)
1. A spider-web microchannel heat sink, characterized in that: the cooling device comprises a spider-web-shaped micro-channel heat sink and an air-cooled radiator, wherein the spider-web-shaped micro-channel heat sink comprises a micro-channel main body and a sealing cover plate, the micro-channel main body comprises a fluid inlet, a main flow micro-channel and a fluid outlet, an inlet pressure measuring port and an outlet pressure measuring port are respectively arranged at the fluid inlet and the fluid outlet, the sealing cover plate is fixed on the plane of the micro-channel main body, and a heating element is fixed on the other plane of the micro-channel main body;
the sealing cover plate is provided with an inlet pressure measurement sensor fixing hole and an outlet pressure measurement sensor fixing hole which are respectively arranged corresponding to the positions of an inlet pressure measurement port and an outlet pressure measurement port of the micro-channel main body;
the main flow micro-channel, the fluid inlet and the fluid outlet are on the same straight line, and the fluid micro-channel with a regular decagon or a regular dodecagon or a circular structure is uniformly distributed at the center of the main flow micro-channel in an outward radial manner according to a cobweb structure;
the fluid inlet of the micro-channel main body is connected with the liquid reservoir through the power pump, the fluid outlet of the micro-channel main body is connected with the inlet of the air-cooled radiator, and the outlet of the air-cooled radiator is connected with the liquid reservoir, so that liquid in the liquid reservoir is circulated.
2. A spider-web microchannel heat sink according to claim 1, wherein: the microfluidic channel specifically adopts a spider-web shape of a regular decagon structure.
3. A spider-web microchannel heat sink according to claim 2, wherein: the widths at the fluid inlet and the fluid outlet are equal, and the width at the center of the main flow microchannel is smaller than the width at the fluid inlet and the fluid outlet.
4. A spider-web microchannel heat sink according to claim 3, wherein: the fluid micro-channel can also be provided with a diagonal channel.
5. A spider-web microchannel heat sink according to claim 3, wherein: the width of the main flow micro-channel at the center is 0.4-0.8mm.
6. A spider-web microchannel heat sink according to claim 1, wherein: the micro-channel main body is made of silicon, stainless steel, copper or metal alloy materials;
the sealing cover plate is made of silicon, stainless steel, copper or temperature-resistant transparent glass materials.
7. A spider-web microchannel heat sink according to claim 1, wherein: the main flow micro-channel and the fluid micro-channel are formed by one or more of micro-milling, injection molding, casting, laser processing or etching.
8. A spider-web microchannel heat sink according to claim 1, wherein: the fin of air-cooled radiator adopts the fin of ripple shape, be provided with entry and export on the fin, connect microchannel main part and reservoir respectively, fin upper surface is fixed with the heat dissipation window, the heat dissipation window internal fixation has radiator fan blade.
9. A control system for a spider-web microchannel heat sink employing a spider-web microchannel heat sink as claimed in any one of claims 1-8, wherein: the fluid inlet and the fluid outlet of the micro-channel main body are respectively connected with a thermocouple, the liquid temperatures at the fluid inlet and the fluid outlet are respectively measured, and the heating element on the micro-channel main body is connected with a thermocouple, so that the temperature of the heating wall surface is measured;
pressure sensors are respectively arranged on the inlet pressure measurement port fixing hole and the outlet pressure measurement port fixing hole and are used for measuring the inlet pressure and the outlet pressure of the micro-channel main body;
the control end of the power pump, the control end of the air cooling radiator, the flowmeter, the thermocouple and the pressure sensor are respectively connected with the temperature control system through wires.
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