CN1168618A - High-frequency electron device - Google Patents
High-frequency electron device Download PDFInfo
- Publication number
- CN1168618A CN1168618A CN 97112168 CN97112168A CN1168618A CN 1168618 A CN1168618 A CN 1168618A CN 97112168 CN97112168 CN 97112168 CN 97112168 A CN97112168 A CN 97112168A CN 1168618 A CN1168618 A CN 1168618A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- printed circuit
- electronic component
- metal shell
- circuit backplane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Abstract
A high frequency electronic device enables the joint of an integrated circuit and the electrode of a chip element, which are grounded originally to be connected to a metal casing under low impedance, realizing shield between the electronic elements. The solving method is that a metal conductor is arranged on one surface of a printed circuit substrate, enable the metal conductor to be in electrical connection with the metal shell, meanwhile, the metal conductor is connected with the grounding joint of an electronic element arranged on the printed circuit substrate; and/or enabling the metal conductor to be extended around an element fixing area on one surface of the printed circuit substrate.
Description
The present invention relates to the tuner that is applicable to that TV is used, the good high-frequency electron device of the radio frequency modulator of VTR (video tape recorder) usefulness etc.
In recent years, in order to make this electronics miniaturization, adopt so-called single face mount type electronic component mostly, its formation is that the printed circuit backplane that will be welded with IC (integrated circuit) or not have element electronic components such as (hereinafter referred to as chip components) of lead-in wire form is contained in the metal shell and forms, and electronic components such as this integrated circuit or chip component then are to be welded on work on the given position of a lip-deep wiring pattern of printed chassis.
This high-frequency electron device in the past is illustrated among Fig. 5 and Fig. 6.Fig. 5 is placed on the plane graph of the installment state of the electronic component on the printed circuit backplane in the metal shell for expression explanation, and Fig. 6 represents the key diagram cut open along the A-A line of Fig. 5.Promptly, as Fig. 5, shown in Figure 6, formed electronic component has been interconnected on wiring pattern 2 and the grounding pattern 4 that is connected with metal shell 3 on the side surface (upper surface) of printed circuit backplane 1, the IC of above-mentioned single face mount type (integrated circuit) 5 and chip component 6 usefulness scolding tin are welded on the given position of these wiring patterns 2, grounding pattern 4, constitute the high-frequency electronic loop.
The roughly assemble sequence of this electronic loop is: at first with reprint method or print process, so-called cream scolding tin is coated in wiring pattern 2, on the given position of grounding pattern 4, secondly, utilize automatic installation apparatus with integrated circuit 5, chip component 6 grades are installed on the position that scribbles scolding tin, meanwhile, positioning and fixing in addition is under this stationary state, heat by reflow ovens, make the fusion of cream scolding tin, printed chassis 1 is welded, with the joint 8 of integrated circuit 5,9 and the electrode 10,11 of chip component 6 be connected with wiring pattern 2 or grounding pattern 4.Here, the electrode 10 of the joint 8 of integrated circuit 5 and chip component 6 is connected with the wiring pattern 2 that each element is coupled together.In addition, the joint 9 of integrated circuit 5 is connected with metal shell 3 with the electrode 11 of chip component 6, and as earth terminal and grounding electrode that high frequency down should ground connection, is connected with grounding pattern 4.Then, printed chassis 1 is placed in the metal shell 3 that opening is arranged up and down, utilizes bossing 12 location that on metal shell 3, form.Meanwhile, the welding portion 13 usefulness scolding tin of the fabric width of the grounding pattern 4 that will form at the periphery of printed circuit backplane 1 are fixed on the metal shell 3.Like this, should be connected with metal shell 3 by grounding pattern 4 at ground joint 9 of the integrated circuit 5 of ground connection under the high frequency etc.Then, cover upper and lower opening, just finished the assembling of high-frequency electron device with covering 14,15.
Even under the situation of using mounted integrated circuit 5 of this single face and chip component 6, also there is use must avoid existing with the situation of the element of other element electromagnetic combination of coil 16 1 classes.In this case, do not use the chip component that does not have lead-in wire, these elements leave other element certain distance, have only a spot of electromagnetic combination, and use the element that has lead-in wire.Promptly, in this example in the past, because coil 16 is connected with the joint 8 of integrated circuit 5 by wiring pattern 2, and must avoid electromagnetic combination with this integrated circuit 5 and chip component 6, therefore, by adopting leaded element, the aspect ratio integrated circuit 5 of component body and chip component 6 height, their distances are far apart also.This leaded element with scolding tin be welded on the surperficial identical surface that is welded with the single face installation elements on, and this single face installation elements is to utilize handwork, burn-ons after the integrated circuit 5 of the element of single face being installed with above-mentioned reflow ovens and chip component 6 carry out the scolding tin welding.
In this electronic device in the past, there are some problems.In order to reach miniaturization, wiring pattern 2 and grounding pattern 4 be very dense all, and in addition, in the integrated circuit 5 with a plurality of joints 8,9, because the interval of joint is narrow and small, so the live width of wiring pattern 2 and grounding pattern 4 is also narrower and small.Because like this, for ground connection, can not make the ground joint 9 of the integrated circuit 5 that be connected with metal shell 3 and the grounding electrode 11 of chip component 6, by the narrow and small grounding pattern 4 of live width, be connected with metal shell 3, the result, the ground joint 9 of integrated circuit 5 can not be connected with metal shell a under enough low impedance with the grounding electrode 11 of chip component 6, given loop performance can not get, and the stability of action reduces.
In addition, owing to using the electronic component of single face mount type in order to reach miniaturization, 1 Copper Foil that is pasting the usefulness that connects up on a face of printed circuit backplane promptly uses so-called single face to cover copper soleplate.Yet, because on a surface identical with other element, the element (for example using leaded element) that there is no need with other element electromagnetic combination of coil 16 1 classes is housed,, can not ignores electromagnetic combination with other element even leave certain distance like this.Moreover, adopt barricade, can not form electromagnetic combination fully, but with the surperficial identical surface that electronic component is installed on barricade (not illustrating among the figure) etc. is set, this can harm miniaturization.In addition, because pattern is intensive, make also difficulty, this also is a problem.
In order to address the above problem, high-frequency electron device of the present invention is made of metal shell, printed circuit backplane and metallic conductor.On the surface of this printed circuit backplane the single face electronic components mounted is installed, is placed on simultaneously in the above-mentioned metal shell, and another surface engagement of this metallic conductor and above-mentioned printed circuit backplane is made by the metallic plate that is connected with above-mentioned metal shell simultaneously.Be provided with the relaying pattern of island on a surface of above-mentioned printed circuit backplane, this island relaying pattern is connected with ground joint or grounding electrode that above-mentioned single face is installed electronic component.Make above-mentioned metallic plate, near above-mentioned ground joint or grounding electrode, be connected with above-mentioned island relaying pattern.
In addition, high-frequency electron device of the present invention is made of metal shell, printed circuit backplane, plate shaped metal forming or metallic plate and the electronic component that has a lead-in wire.On the surface of this printed circuit backplane the single face electronic components mounted is installed, is placed on simultaneously in the above-mentioned metal shell, and another surface engagement of this plate shaped metal forming or metallic plate and above-mentioned printed circuit backplane is connected with above-mentioned metal shell again simultaneously.This electronic component that has lead-in wire then is installed on another surface of above-mentioned printed circuit backplane, is connected with above-mentioned single face electronic components mounted simultaneously.Above-mentioned plate shaped metal forming or metallic plate are to extend around the above-mentioned installation region that has the electronic component of lead-in wire to make at least.
Again, in the present invention, high-frequency electron device is made of metal shell, printed circuit backplane, plate shaped metallic conductor and the electronic component that has a lead-in wire.On the surface of this printed circuit backplane the single face electronic components mounted is installed, is placed on simultaneously in the above-mentioned metal shell, and another surface engagement of this plate shaped metallic conductor and above-mentioned printed circuit backplane is connected with above-mentioned metal shell simultaneously.This electronic component that has lead-in wire then is installed on the another side of above-mentioned printed circuit backplane, is connected with above-mentioned single face electronic components mounted simultaneously.On a surface of above-mentioned printed circuit backplane, be provided with the island relaying pattern that is connected with the joint of above-mentioned single face electronic components mounted.Make above-mentioned plate shaped metallic conductor near above-mentioned joint, be connected, meanwhile, make this plate shaped metallic plate, extend round the above-mentioned installation region that has the electronic component of lead-in wire at least with above-mentioned island shape relaying pattern.
Fig. 1 is the plane graph of first embodiment of explanation high-frequency electron device of the present invention;
The sectional view of Fig. 2 for being got along the B-B line of Fig. 1;
Fig. 3 is the perspective view of first embodiment of high-frequency electron device of the present invention;
Fig. 4 is the sectional view of second embodiment of explanation high-frequency electron device of the present invention;
Fig. 5 is the plane graph of the installation situation of the electronic component on the printed circuit backplane that illustrates in the metal shell that is placed on high-frequency electron device in the past;
The longitdinal cross-section diagram of Fig. 6 for being got along the A-A line of Fig. 5.
Fig. 1 to Fig. 3 represents first embodiment of high-frequency electron device of the present invention.Fig. 1 is placed on the plane graph of the installment state of the electronic component on the printed circuit backplane in the metal shell for explanation, and Fig. 2 be the key diagram along the B-B line incision of Fig. 1, and Fig. 3 represents the perspective view seen from the opposite of Fig. 1.In these figure, a surface of printed circuit backplane 21 (above) on integrated circuit 5 as single face mount type electronic component, chip component 6 etc. are installed, and these joints 8,9, electrode 10,11 are welded on wiring pattern 22 with scolding tin, and grounding pattern 4 is on the relaying pattern 23.Relaying pattern 23 is island and constitutes, and it is so that joint 8,9, and in the electrode 10,11, ground joint 9 that should be connected with metal shell 3 and joint connect the mode of piece 11 switchings, with ground joint 9, and grounding electrode 11 connections.And ground joint 9 in the grounding electrode 11, is welded to connect with relaying pattern 23 usefulness scolding tin from distant one of metal shell 3, then is welded to connect with grounding pattern 4 usefulness scolding tin from closer one of metal shell 3.In addition, joint 8, electrode 10 is connected each other with making chip component 6; Or the wiring pattern 22 that is connected with integrated circuit 5 of chip component 6 etc. is welded to connect with scolding tin.
As shown in Figure 3, plate shaped metallic conductor (for example being the metallic plate 24 of iron plate etc. in the present embodiment) roughly is bonded on another surface (following) of printed circuit backplane 21 all sidedly.And the metallic conductor by metallic plate is made can overlap with printed circuit backplane simply, perhaps links together with it.The thickness of metallic plate is wished more than 0.1mm.Form calvus 25 on metallic plate 24, this calvus 25 is then near the grounding electrode 11 of the ground joint 9 of the distant locational integrated circuit 5 of metal shell 3 and chip component 6.This calvus 25 passes the hole 26 of printed circuit backplane 21, highlights in the above, and is welded to connect with relaying pattern 23 usefulness scolding tin above it.In addition, this metallic plate 24 in a plurality of places of its periphery, is welded together with metal casing body scolding tin.In addition, in the present embodiment, as shown in Figure 3, printed circuit backplane 21 utilizes the bossing 12 that forms on metallic plate 24 and metal shell 3, location in metal shell 3.
Moreover, coil 27 is installed on the lower surface of printed circuit backplane 21, its lead-in wire 28 passes the hole 29 of printed circuit backplane 21, by top wiring pattern 22, is welded to connect with the joint 8 usefulness scolding tin of integrated circuit 5.In addition, on metallic plate 24, in the installation region of coil 27, form a punch-out 30, be in contact with one another avoiding.Metallic plate 24 can extend in the zone that the other electron component that should avoid electromagnetic combination is installed, and not necessarily extend on the lower surface of whole printed circuit backplane 21 around the zone that coil 27 is installed at least.In addition, the calvus 25 of wishing metallic plate 24 be located at the ground joint 9 of the integrated circuit 5 that should be connected or chip component 6 with metal shell 3 grounding electrode 11 near, and be connected with relaying pattern 23.Like this, by relaying pattern 23 is set, ground joint 9 grades are being connected with metallic plate 24 than distance metal shell 3 nearer distances.
According to above structure, the ground joint 9 of the integrated circuit 5 that should be connected with metal shell 3 etc. utilize relaying pattern 23, and distance that can be the shortest is connected with broad metallic plate 24.Because this metallic plate 24 is connected with metal shell in a plurality of places, therefore, flow through the electric current dispersion of metallic plate 24, can be under extremely low impedance and metal shell 3 ground connection.Like this, metallic plate 24 can reach the ground connection effect same with metal shell 3.In addition, because coil 27 is installed on another surface of printed circuit backplane 21, and metallic plate 24 extension around it, even therefore produce the magnetic lines of force from coil 27, metallic plate 24 also can cover the magnetic line of force, make be arranged on 21 1 lip-deep elements of printed circuit backplane not with electromagnetic combination.
Moreover the metallic plate 24 that illustrates in first embodiment is to engage on the whole lower surface of printed circuit backplane 21 substantially, but might not be limited to like this.For example, from the zone that comprises calvus 25 to the fabric width scope of the extension of metal shell 3, it is also passable that banded metallic plate is set.
In first embodiment, adopt printed circuit backplane 21 and another piece metallic plate 24 to describe, but be not limited thereto as plate shaped metallic conductor.As second embodiment, as shown in Figure 4, also can use the base plate 31 that copper is all covered on so-called two sides to implement, also can obtain same effect.In this case, adopt the Copper Foil 32 that covers on the lower surface of base plate 31 of copper on the two sides to replace metallic plate 24, and being connected of Copper Foil 32 and relaying pattern 23 is to utilize shaped as pin lead wire of conductor 33 grades of passing printed circuit backplane hole 26 to carry out.In addition, without lead wire of conductor 33, and it is also passable to carry out the plating of conducting on the inwall in hole 26.If use the two sides to cover the base plate 31 of copper, because the structure of component number minimizing and employing metallic plate 24 relatively, assembling work is more superior.
As mentioned above, according to the present invention, metallic plate is bonded on the lower surface of printed circuit backplane, near the ground joint that is installed in the electronic component on the upper surface of printed circuit backplane etc., be connected with this metallic plate, because metallic plate is that scolding tin is welded on the metal shell, therefore, the ground joints of electronic component etc. can be under low impedance and metal shell ground connection, thereby loop performance can improve and stablize.In addition because the metallic plate by on the printed circuit backplane lower surface, can with metal shell ground connection, therefore there is no need to be arranged on the broad grounding pattern on the printed circuit backplane upper surface, can reach miniaturization like this.
Claims (6)
1. high-frequency electron device, it is by metal shell, and printed circuit backplane and metallic conductor constitute; On the surface of this printed circuit backplane the mounted electronic component of single face is installed, be placed on simultaneously in the above-mentioned metal shell, and this metallic conductor is bonded on another surface of above-mentioned printed circuit backplane, and is made of the metallic plate that is connected with above-mentioned metal shell; It is characterized by, on a surface of above-mentioned printed circuit backplane, be provided with the relaying pattern of the island that is connected with the ground joint or the grounding electrode of above-mentioned single face installing type electronic component, the above-mentioned metallic conductor that constitutes by metallic plate, near above-mentioned ground joint or grounding electrode, be connected with the relaying pattern of above-mentioned island.
2. high-frequency electron device, it is by metal shell, printed circuit backplane, plate shaped metal forming or metallic plate and the electronic component that has a lead-in wire are formed; On the surface of this printed circuit backplane single face installing type electronic component is installed, be placed on simultaneously in the above-mentioned metal shell, and another surface engagement of this plate shaped metal forming or metallic plate and above-mentioned printed circuit backplane, and be connected with above-mentioned metal shell, this electronic component that has lead-in wire then is installed on another surface of above-mentioned printed circuit backplane, and is connected with above-mentioned single face installing type electronic component; It is characterized by, above-mentioned plate shaped metal forming or metallic plate extend round the above-mentioned installation region that has the electronic component of lead-in wire at least.
3. high-frequency electron device, it is made up of metal shell, printed chassis, plate shaped metallic conductor and the electronic component that has a lead-in wire; On the surface of this printed circuit backplane single face installing type electronic component is installed, be placed on simultaneously in the above-mentioned metal shell, and another surface engagement of this plate shaped metallic conductor and above-mentioned printed circuit backplane, and be connected with above-mentioned metal shell, this electronic component that has lead-in wire then is installed on another surface of above-mentioned printed circuit backplane, and is connected with above-mentioned single face installing type electronic component; It is characterized by, on a surface of above-mentioned printed circuit backplane, be provided with the island relaying pattern that is connected with the ground joint or the grounding electrode of above-mentioned single face installing type electronic component, make above-mentioned plate shaped metallic conductor, near above-mentioned ground joint or grounding electrode, be connected with above-mentioned island relaying pattern, meanwhile, this plate shaped metallic conductor is extending in the installation region of the above-mentioned electronic component that has a lead-in wire at least.
4. high-frequency electron device as claimed in claim 3 is characterized by, and above-mentioned plate shaped metallic conductor is the Copper Foil that is attached on the above-mentioned printed circuit backplane.
5. high-frequency electron device as claimed in claim 3 is characterized by, and above-mentioned plate shaped metallic conductor is a metallic plate.
6. high-frequency electron device as claimed in claim 5 is characterized by, and forms the calvus that passes above-mentioned printed circuit backplane on above-mentioned metallic plate, and above-mentioned calvus is connected with above-mentioned relaying pattern.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP165374/96 | 1996-06-05 | ||
| JP16537496A JPH09326586A (en) | 1996-06-05 | 1996-06-05 | High frequency electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1168618A true CN1168618A (en) | 1997-12-24 |
| CN1087898C CN1087898C (en) | 2002-07-17 |
Family
ID=15811167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97112168A Expired - Fee Related CN1087898C (en) | 1996-06-05 | 1997-06-05 | High-frequency electron device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH09326586A (en) |
| CN (1) | CN1087898C (en) |
| GB (1) | GB2313962B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1330217C (en) * | 1999-11-26 | 2007-08-01 | 索尼公司 | Electronic apparatus with metal part containing cabinet |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109362U (en) * | 1983-12-28 | 1985-07-25 | アルプス電気株式会社 | Earth structure of multilayer printed circuit board |
| US4829432A (en) * | 1987-12-28 | 1989-05-09 | Eastman Kodak Company | Apparatus for shielding an electrical circuit from electromagnetic interference |
| US4864077A (en) * | 1988-06-10 | 1989-09-05 | Teradyne, Inc. | Shielded enclosure |
| EP0429695B1 (en) * | 1989-11-28 | 1992-11-11 | Siemens Aktiengesellschaft | Control apparatus, particulary for controlling functions of a vehicle |
| JPH066101A (en) * | 1992-06-18 | 1994-01-14 | Nec Corp | Band pass filter mount base |
| US5358774A (en) * | 1993-04-26 | 1994-10-25 | Motorola, Inc. | Electromagnetic shielding assembly and fabrication method |
-
1996
- 1996-06-05 JP JP16537496A patent/JPH09326586A/en active Pending
-
1997
- 1997-05-28 GB GB9710839A patent/GB2313962B/en not_active Expired - Fee Related
- 1997-06-05 CN CN97112168A patent/CN1087898C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1330217C (en) * | 1999-11-26 | 2007-08-01 | 索尼公司 | Electronic apparatus with metal part containing cabinet |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2313962B (en) | 2000-12-06 |
| CN1087898C (en) | 2002-07-17 |
| GB2313962A (en) | 1997-12-10 |
| JPH09326586A (en) | 1997-12-16 |
| GB9710839D0 (en) | 1997-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1323435C (en) | Modular component | |
| CN110392923A (en) | High-frequency model | |
| US6288906B1 (en) | Multiple layer printed circuit board having power planes on outer layers | |
| EP1040739B1 (en) | Surface mount spring gasket and emi enclosure | |
| KR100489860B1 (en) | A method and a device for shielding of electronic components on a circuit board | |
| US9775268B2 (en) | Receiving device and shield case connection method | |
| EP0638225B1 (en) | Feedthrough via connection method and apparatus | |
| CN103187640B (en) | Surface-pasted metal wiring terminal and attaching method thereof can be carried out | |
| JPH07500952A (en) | Printed circuit board shield assembly for tuners etc. | |
| JPWO2006093155A1 (en) | Board-to-board connector and circuit board device using board-to-board connector | |
| JP2639280B2 (en) | Method for manufacturing high-density circuit module | |
| CN1087898C (en) | High-frequency electron device | |
| EP1475863B1 (en) | Filtered connector | |
| JPH1117413A (en) | Strip line power feeding device | |
| US6837747B1 (en) | Filtered connector | |
| US20030089514A1 (en) | Power supply terminal and back board | |
| KR100962631B1 (en) | Filter connector with high frequency shield | |
| CN101404277A (en) | Multichip module | |
| US6707687B2 (en) | Connection structure for radio frequency circuit that exceeds in RF characteristics | |
| JPH11298182A (en) | Electronic apparatus | |
| CN117677029A (en) | Signal transmission structure and manufacturing method | |
| JPH06204629A (en) | Wire interconnection board | |
| JP3000448U (en) | Connection structure between high-frequency connector and printed wiring board | |
| US7396256B2 (en) | Filter connector with high frequency shield | |
| CN115835483A (en) | Circuit board and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |