CN116855180A - Packaging film material and photovoltaic module - Google Patents
Packaging film material and photovoltaic module Download PDFInfo
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- CN116855180A CN116855180A CN202310791795.1A CN202310791795A CN116855180A CN 116855180 A CN116855180 A CN 116855180A CN 202310791795 A CN202310791795 A CN 202310791795A CN 116855180 A CN116855180 A CN 116855180A
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- film material
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- ethylene
- packaging film
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- 239000000463 material Substances 0.000 title claims abstract description 158
- 229920006280 packaging film Polymers 0.000 title claims abstract description 60
- 239000012785 packaging film Substances 0.000 title claims abstract description 60
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 79
- 238000002834 transmittance Methods 0.000 claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 229920001577 copolymer Polymers 0.000 claims description 22
- 239000011159 matrix material Substances 0.000 claims description 22
- 238000005538 encapsulation Methods 0.000 claims description 21
- 239000003431 cross linking reagent Substances 0.000 claims description 19
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 18
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 12
- 239000012752 auxiliary agent Substances 0.000 claims description 11
- -1 polyethylene, ethylene butene copolymer Polymers 0.000 claims description 11
- 229920005549 butyl rubber Polymers 0.000 claims description 10
- 239000011358 absorbing material Substances 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 9
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 9
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- 229920006225 ethylene-methyl acrylate Polymers 0.000 claims description 7
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 claims description 7
- 230000035699 permeability Effects 0.000 claims description 7
- 239000010445 mica Substances 0.000 claims description 6
- 229910052618 mica group Inorganic materials 0.000 claims description 6
- 239000002808 molecular sieve Substances 0.000 claims description 6
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 5
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- 229920000247 superabsorbent polymer Polymers 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 14
- 239000005022 packaging material Substances 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 description 27
- 239000011521 glass Substances 0.000 description 20
- 239000011342 resin composition Substances 0.000 description 18
- 238000001125 extrusion Methods 0.000 description 10
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 8
- 239000002313 adhesive film Substances 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- 239000004611 light stabiliser Substances 0.000 description 8
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 7
- 239000006229 carbon black Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229920002367 Polyisobutene Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical group C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 239000002671 adjuvant Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229940116351 sebacate Drugs 0.000 description 3
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 1
- GOAHRBQLKIZLKG-UHFFFAOYSA-N 1-tert-butylperoxybutane Chemical compound CCCCOOC(C)(C)C GOAHRBQLKIZLKG-UHFFFAOYSA-N 0.000 description 1
- HTCRKQHJUYBQTK-UHFFFAOYSA-N 2-ethylhexyl 2-methylbutan-2-yloxy carbonate Chemical compound CCCCC(CC)COC(=O)OOC(C)(C)CC HTCRKQHJUYBQTK-UHFFFAOYSA-N 0.000 description 1
- BWOITHKYQUJGSB-UHFFFAOYSA-N 2-methylbutan-2-ylperoxycyclohexane Chemical compound CCC(C)(C)OOC1CCCCC1 BWOITHKYQUJGSB-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- PFRLCKFENIXNMM-UHFFFAOYSA-N 3-trimethylsilylpropan-1-amine Chemical compound C[Si](C)(C)CCCN PFRLCKFENIXNMM-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 241000227425 Pieris rapae crucivora Species 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000011132 calcium sulphate Nutrition 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- UFQXGXDIJMBKTC-UHFFFAOYSA-N oxostrontium Chemical compound [Sr]=O UFQXGXDIJMBKTC-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical compound [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 239000004583 superabsorbent polymers (SAPs) Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/21—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being formed by alternating adhesive areas of different nature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The application provides a packaging film material which is used for packaging a photovoltaic module, and comprises a second area and a first area, wherein the second area and the first area are arranged in parallel along a first direction; the second areas are arranged on two sides of the first area, and the second areas comprise a first second area and a second area and extend along the first direction; the second regionThe water vapor transmission rate of the domain is lower than the water vapor transmission rate of the first region; the water vapor transmittance of the second area is less than or equal to 5g/m 2 .d ‑1 The water vapor transmittance of the first area is less than or equal to 35g/m 2 .d ‑1 . The edge water-blocking performance of the packaging film material is effectively improved, meanwhile, compared with the conventional high water-blocking packaging film material, the cost is lower, and the packaging material corresponding to the battery piece area can be kept to have the performances of high light transmittance, high adhesion and the like.
Description
Technical Field
The application relates to the technical field of solar cell packaging, in particular to a photovoltaic packaging film material and a photovoltaic module.
Background
With the increasing severity of energy and environmental problems, the utilization of clean renewable energy is not sustained, wherein the photovoltaic power generation technology has been greatly developed and mature, and the application of photovoltaic cells is also gradually popularized.
The photovoltaic cell mainly comprises a crystalline silicon cell, an amorphous silicon cell, a TOPCon cell, a HJT cell, an IBC cell, a perovskite cell and the like, and particularly the TOPCon cell, the HJT cell, the IBC cell, the perovskite cell and the like are extremely sensitive to water vapor due to the working principle of the photovoltaic cell.
Two component structures currently in the market: the single glass component comprises a five-layer structure of glass/upper packaging film material/battery piece/lower packaging film material/backboard; and the second structure is a double-glass structure and comprises a five-layer structure of glass/upper packaging film material/battery piece/lower packaging film material/glass.
The current mainstream method for improving the water vapor permeability of the packaging adhesive film comprises adding an additional inorganic water-blocking layer, and the method has higher cost and is not suitable for improving the water-blocking performance of the front packaging adhesive film; or water-blocking filler is added, the overall water-blocking effect can be improved, but excessive water-blocking filler can reduce the light transmittance of the packaging adhesive film, and meanwhile, the adhesion between the packaging adhesive film and the battery piece and the glass is insufficient, so that the long-term power generation efficiency of the photovoltaic module is reduced; or the main resin material with higher water resistance is used instead, so that the scheme has higher production cost and lacks competitive advantage.
The battery is sensitive to water vapor, which accelerates the power decay of the battery. The backboard in the single glass assembly is made of high polymer materials, and the waterproof capability of the backboard is not high whether the backboard is a common white backboard or a transparent backboard; the upper layer and the lower layer of the double-glass component are made of glass with excellent water resistance, so that the front and the back of the photovoltaic component basically have no problem of water vapor permeation, but the edge of the photovoltaic component still has the risk of water vapor permeation. The main flow of the edge packaging of the existing photovoltaic module adopts organic silicon sealant or butyl rubber, the organic silicon sealant has extremely poor water blocking performance and basically only plays a role in bonding; butyl rubber has a good water vapor barrier effect, but has poor adhesive property and still has insufficient long-term water blocking performance.
It can be seen that, in practice, the water blocking performance requirements of different areas are inconsistent for the photovoltaic module, and the water blocking performance requirements of the edges of the photovoltaic module need to be higher than those of the inside of the photovoltaic module, and the inside of the photovoltaic module needs to have good light transmittance and cohesiveness.
Therefore, an encapsulation film material with excellent water blocking performance is urgently needed, and meanwhile, the light transmittance and the cohesiveness can be considered, so that the long-term stable operation of the photovoltaic module can be kept.
Disclosure of Invention
The application mainly aims to provide an encapsulation film material for solving the problem of power attenuation caused by the transmission of water vapor at the edge when the encapsulation film material is used in a photovoltaic module in the prior art.
In order to achieve the above object, according to one aspect of the present application, there is provided an encapsulation film material for encapsulation of a photovoltaic module, the encapsulation film material including a second region and a first region, the second region and the first region being disposed substantially in parallel along a first direction;
the second areas are arranged on two sides of the first area, and the second areas comprise a first second area and a second area and extend along the first direction;
the water vapor transmission rate of the second area is lower than that of the first area;
the water vapor transmittance of the second area is less than or equal to 5g/m2.D-1, and the water vapor transmittance of the first area is less than or equal to 35g/m2.D-1.
Further, the water vapor transmittance of the second area is less than or equal to 3g/m 2 .d -1 The water vapor permeability of the first area is 10-25 g/m 2 .d -1 。
Further, the width of the first second region and the second region of the packaging film material in the second direction is 5-100mm independently.
Further, the thickness of the packaging film material is 0.1-2mm.
Further, the encapsulating film material first region composition includes: a first matrix material, a first crosslinking agent, and a first auxiliary agent;
the second region of encapsulating film material comprises: a second matrix material, a hygroscopic material and a second auxiliary agent.
The encapsulating film material of claim 5 wherein the hygroscopic material is one or more of a superabsorbent polymer, an inorganic porous material, an alkaline earth oxide, a sulfate; preferably, the moisture absorption material is flaky montmorillonite, flaky mica sheet and molecular sieve.
Further, the moisture absorption material accounts for 0.01% -10% of the weight of the second matrix material in parts by weight.
Further, the first matrix material is selected from one or more of ethylene-vinyl acetate copolymer, metallocene catalyzed polyethylene, ethylene butene copolymer, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer and ethylene methyl methacrylate copolymer, and is formed by mixing according to any proportion; the second matrix material is selected from one or more of ethylene-vinyl acetate copolymer, metallocene catalyzed polyethylene, ethylene butene copolymer, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, ethylene methyl methacrylate copolymer and butyl rubber, and is formed by mixing according to any proportion.
Further, the packaging film material further comprises a third area, wherein the third area is arranged on one side of the second area away from the first area and extends along the first direction.
A photovoltaic module employing the encapsulating film material of any one of the above.
By applying the technical scheme of the application, the edge water blocking performance of the packaging film material is effectively improved by splicing the side edges of the packaging film material, and meanwhile, compared with the conventional high water blocking packaging film material, the cost is lower, and the packaging material corresponding to the battery piece area can be kept to have the performances of high light transmission, high adhesion and the like. Meanwhile, the photovoltaic module can effectively reduce the problem of power attenuation and maintain good appearance performance when the packaging film material is used for packaging the battery piece.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
FIG. 1 is a schematic illustration of an encapsulating film material;
FIG. 2 is a schematic illustration of an encapsulating film material;
the reference numerals are: 11. a first region; 12. a second region; 121. a first second region; 122. a second region; 13. a third region; x, a first direction; y, second direction.
Detailed Description
In order to solve the problem of large water vapor transmittance of the long-term edge of the existing photovoltaic module, the inventor conducts intensive research on the structure of the packaging film material, and researches find that the technical effects of synergistically improving the water resistance and the cohesiveness can be achieved by customizing the packaging film material in a regional mode, so that the problems of high cost, cohesiveness, light transmittance loss and the like of the conventional high-water-resistance packaging film material are solved.
The present application is completed based on the above, and the present application will be described in detail with reference to the drawings and the embodiments, and it should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict, and the embodiments should not be construed as limiting the scope of the present application as claimed.
An encapsulation film material for encapsulation of a photovoltaic module, the encapsulation film material comprising a first region 11 and a second region 12, the first region 11 and the second region 12 being arranged substantially parallel along a first direction X;
the second areas 12 are arranged on two sides of the first area 11 and extend along the first direction X;
the second region 12 has a lower water vapor transmission rate than the first region 11;
the water vapor transmission rate of the second region 12 is less than or equal to 5g/m 2 .d -1 The water vapor transmittance of the first region 11 is less than or equal to 35g/m 2 .d -1 。
Further, the water vapor transmission rate of the second region 12 is less than or equal to 3g/m 2 .d -1 The water vapor permeability of the first region 11 is 10-25 g/m 2 .d -1 。
Specifically, as shown in fig. 1, the encapsulating film material includes a first region 11 and a second region 12, the first region 1111 and the second region 1212 are located on the same horizontal plane, and the first region 11 and the second region 12 are disposed substantially in parallel along a first direction X. It should be noted that, substantially parallel means that the first region 11 and the second region 12 of the encapsulating film material are elongated, and that the boundaries of the first region 11 and the second region 12 of the encapsulating film material are substantially parallel, and that, since the actual production process is not necessarily completely parallel, a certain deviation may exist, which is understood, and that is, a substantially fault-tolerant expression. The second regions 12 of the encapsulation film material are arranged on both sides of the first region 11 and extend along the first direction X.
The second region 12 of the encapsulating film material comprises a first second region 121 and a second region 122, the second region 12 having a lower water vapor transmission rate than the first region 11. In the second direction Y, the encapsulation film material is disposed for the first second region 121, the first region 11, and the second region 122 in this order. At this time, the water vapor transmittance in the second direction Y of the packaging film material is set differently, the second area 12 of the packaging film material corresponds to the edge position of the photovoltaic module, and the first area 11 corresponds to the position of the photovoltaic module cell. Because the front plate and the back plate of the photovoltaic module generally adopt sheets with higher water blocking performance such as glass, high water blocking polymer materials and the like, the photovoltaic module does not need to have particularly strict water blocking performance requirements on packaging film materials in the direction perpendicular to the cell sheet layer. The water vapor permeability of the second area 12 is lower than that of the first area 11, and the low water vapor permeability of the second area 12 can well reduce the water vapor invasion problem at the edge of the photovoltaic module, so that the overall service life of the photovoltaic module is prolonged. Meanwhile, the first region 11 and the second region 12 of the photovoltaic module are arranged in a differentiated mode, the problem that the requirements of different regions of the photovoltaic module on water blocking performance are different can be solved in a targeted mode, and meanwhile production cost can be further controlled.
In order to ensure the water blocking performance of the photovoltaic module, the water vapor transmittance of the second region 12 is less than or equal to 5g/m 2 .d -1 The water vapor transmittance of the first region 11 is less than or equal to 35g/m 2 .d -1 . When the water vapor transmission rate of the second region 12 of the encapsulating film material exceeds 5g/m 2 .d -1 When the edge water resistance of the photovoltaic module is insufficient, the service life of the photovoltaic module is easily reduced due to the invasion of edge water vapor, the generation power is reduced, and the like, and the water vapor transmittance of the first area 11 exceeds 35g/m 2 .d -1 When facing the single glass assembly, the water blocking performance is insufficient. Further, the water vapor transmission rate of the second region 12 is less than or equal to 3g/m 2 .d -1 The water vapor permeability of the first region 11 is 10-25 g/m 2 .d -1 。
Further, the width of the second region 12 in the second direction Y is 5-100mm.
Specifically, the overall width of the encapsulating film material may be customized according to the size of the photovoltaic module, so the width of the encapsulating film material is not particularly required, and thus the width of the overall encapsulating film material including the width of the first region 11 of the encapsulating film material is not particularly limited. The width of the second region 12 of the packaging film material in the second direction Y is important, if the width of the second region 12 is smaller, the permeation path of the water vapor is shorter, and the edge water blocking performance of the photovoltaic module is insufficient; the width of the second region 12 is larger, so that more second region 12 material covers the region where the battery piece is located, the adhesion between the second region 12 of the packaging film material and the battery piece is difficult to ensure, and the light transmittance is insufficient, so that the power generation efficiency of the photovoltaic module is reduced. From the viewpoints of aesthetic appearance, water-blocking performance, light transmittance and the like, the width of the second region 12 of the packaging film material on the photovoltaic module is preferably between the frame and the first battery piece, and the packaging film material has better water-blocking performance and higher power generation efficiency. The packaging film material can be cut after lamination in the use process and the application stage of the photovoltaic module, so that the width of the second area 12 of the packaging film material can be properly wider from the viewpoint of production convenience, but the lower limit of the width of the second area is ensured, and the water blocking performance of the second area is ensured. Thus, the width of the encapsulation film material second region 12 in the second direction Y is greater than 5mm, and it is further preferable that the width of the encapsulation film material second region 12 in the second direction Y is 5 to 100mm.
Further, the thickness of the packaging film material is 0.1-2mm; the thickness of the packaging film material is not specially selected, and generally, the thickness of the packaging film material is too thick to cause higher cost, and too thin to cause poor packaging effect, insufficient water resistance, adhesiveness and the like, and also cannot have enough protection effect on the battery piece. Further preferably, the thickness of the encapsulating film material is 0.3-1mm
Further, the peel strength of the first region 11 and the front plate is 80-140N/cm, and the peel strength of the second region 12 and the front plate is 30-100N/cm.
Further, the light transmittance of the first region 11 is greater than 88%, and the light transmittance of the second region 12 is greater than 20%.
Further, the first region 11 composition includes: a first matrix material, a first crosslinking agent, and a first auxiliary agent;
the second region 12 composition comprises: a second matrix material, a hygroscopic material, and a second adjuvant.
Further, the first region 11 composition includes: a first matrix material, a first crosslinking agent, and a first auxiliary agent;
the second region 12 composition comprises: a second matrix material, a hygroscopic material, and a second adjuvant.
The first region 11 of encapsulating film material is selected for conventional materials, and specifically comprises a first matrix material, a first cross-linking agent and a first auxiliary agent.
The first matrix material has no special requirement, and can be formed by mixing one or more of ethylene-vinyl acetate copolymer (EVA), metallocene catalyzed polyethylene, ethylene butene copolymer, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer and ethylene methyl methacrylate copolymer according to any proportion. From the viewpoint of cost, the first base material is preferably EVA.
The first cross-linking agent is selected from triallyl isocyanurate, triallyl cyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tert-butyl peroxyisopropyl carbonate, 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) hexane, 1, -di (t-butylperoxy) -3, 5-trimethylcyclohexane, t-butylperoxy-2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane, 1-bis (t-butylperoxy) -3, 5-trimethylcyclohexane, 1-bis (t-amyl peroxy) cyclohexane any one or more of 1, 1-bis (tert-butylperoxy) cyclohexane, 2-bis (tert-butylperoxy) butane, tert-amyl peroxy-2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (benzoyl peroxide) -hexane, tert-amyl peroxy (2-ethylhexyl) carbonate, tert-butyl peroxy-3, 5-trimethylhexanoate.
The auxiliary cross-linking agent is 0.1-5 parts by weight and comprises the following components: any one or a combination of a plurality of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and pentaerythritol triacrylate.
The tackifier comprises: gamma-aminopropyl triethoxysilane, gamma-methacryloxypropyl trimethoxysilane, gamma- (2, 3-epoxypropoxy) propyl trimethoxysilane, vinyl trimethoxysilane, N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane, gamma-glycidol ether oxypropyl trimethylsilane, 3-aminopropyl trimethylsilane, low molecular polyisobutylene, C5 petroleum resin, terpene resin.
The first auxiliary agent can be one or more selected from a crosslinking assistant, a tackifier, an antioxidant, a hindered amine light stabilizer, an ultraviolet absorber, a plasticizer and the like according to the requirement. Here, no excessive deployment is done.
Specifically, the first region 11 of the encapsulating film material includes 100 parts of a base material, 0.1 to 10 parts of a first crosslinking agent, and 0.01 to 5 parts of an auxiliary agent.
No additional water absorbing material is added to the composition of the first region 11 of encapsulating film material, thereby ensuring its adhesive properties and high light transmittance.
The second region 12 composition comprises: a second matrix material, a hygroscopic material, and a second adjuvant.
The second matrix material has no special requirement, and can be formed by mixing one or more of ethylene-vinyl acetate copolymer (EVA), metallocene catalyzed polyethylene, ethylene butene copolymer, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, ethylene methyl methacrylate copolymer and polyisobutylene according to any proportion. From the viewpoint of water blocking performance, the second base material is preferably one or more of metallocene-catalyzed polyethylene, ethylene butene copolymer, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, ethylene methyl methacrylate copolymer, polyisobutylene.
Further, the moisture absorption material is one or more of super absorbent polymer, inorganic porous material, alkaline earth metal oxide and sulfate;
as the moisture absorbing material, a super absorbent polymer, an inorganic porous material, an alkaline earth metal oxide, sulfate, or the like can be used; examples of superabsorbent polymers include vinyl alcohol, acrylic acid, sodium acrylate, acrylic acid, methacrylic acid, sodium methacrylate, and the like.
Examples of the inorganic porous material include molecular sieves, zeolites, silica gel, and kaolin;
as the alkaline earth metal oxide, for example, calcium oxide (CaO), barium oxide (BaO), magnesium oxide (MgO), strontium oxide (SrO), talc, or the like is used;
examples of the sulfate include lithium sulfate, sodium sulfate, calcium sulfate, magnesium sulfate, and cobalt sulfate;
from the perspective of water absorption effect, the moisture absorption material is flaky montmorillonite, mica sheet and molecular sieve, and the flaky montmorillonite, mica sheet and molecular sieve can be subjected to hydrophobic modification according to requirements.
The second auxiliary agent can be one or more selected from a cross-linking agent, a secondary cross-linking agent, an antioxidant, a hindered amine light stabilizer, an ultraviolet absorber, a plasticizer and the like according to requirements.
Specifically, the encapsulation film material second region 12 includes 100 parts of a base material, 0.005-10 parts of a moisture absorbing material, and 0.01-10 parts of a second auxiliary agent.
When the moisture absorption material is less than 0.005 part, the water blocking performance of the second region 12 of the encapsulation film material is insufficient, and when the moisture absorption material is more than 10 parts, the adhesion of the second region 12 of the encapsulation film material is lowered, and delamination is liable to occur.
Specifically, as an embodiment, the base materials of the first region 11 and the second region 12 are the same base material. The difference in water blocking performance between the first region 11 and the second region 12 of the encapsulating film material is achieved by the difference in the amount of the moisture absorbing material added. When the same substrate material is used for the first region 11 and the second region 12, the fusion degree between the first region 11 and the second region 12 is optimal, and the problem of delamination between the first region 11 and the second region 12 during processing and use is not easy to occur.
Specifically, as another embodiment, the base materials of the first region 11 and the second region 12 are different base materials. The difference in water blocking performance between the first region 11 and the second region 12 of the encapsulation film material is achieved by the difference in the base material and the difference in the amount of the moisture absorbing material added.
Specifically, as a preferable scheme, the first substrate material in the first region 11 is EVA, the second substrate material in the second region 12 is metallocene catalytic polyolefin, and the water blocking performance of the substrate material in the second region 12 is better than that of EVA resin, so that the addition of the moisture absorbing material can be reduced, and the problems of reduced adhesion and the like caused by the addition of excessive moisture absorbing material can be reduced, meanwhile, the processing temperatures between EVA and POE are similar, the resin structure is similar, and the connection reliability between the first region 11 and the second region 12 of the packaging film material is higher.
Specifically, as a preferable scheme, the first region 11 base material is selected from one of EVA or POE, and the second region 12 base material is selected from butyl rubber. The second area 12 is extremely excellent in water blocking performance, extremely low in water vapor transmittance can be achieved on the premise that no moisture absorbing material is added, the butyl rubber is similar to EVA or POE in structure, and good connection reliability is achieved.
When the second region 12 employs butyl rubber as a base material, the second region 12 includes 100 parts of butyl rubber; 10-40 parts of tackifier; 2-15 parts of reinforcing filler; 2-20 parts of a moisture absorption material; 10-40 parts of filling filler.
The tackifier comprises one or a combination of a plurality of low molecular polyisobutene, C5 petroleum resin and terpene resin.
The reinforcing filler comprises one or two of carbon black and white carbon black; the average particle diameter of the carbon black is 10-60nm; the white carbon black is vapor phase white carbon black, and the average grain diameter is 5-50nm.
The filling filler comprises one or a combination of a plurality of talcum powder, mica and light calcium carbonate.
Weighing the resin composition of the first region 11 and the resin composition of the second region 12 of the packaging film material, respectively, fully mixing the resin compositions, and then adding the mixture into different extruders; the extrusion materials in the high water blocking area and the extrusion materials in the light transmitting area of the packaging film material are melted and then enter a T die head through a distributor to be combined into a melt flow in a boundary mode, the melt flow is extruded in a film shape, the melt flow is pre-crosslinked through cooling and transmitting irradiation equipment, and the packaging film material is obtained after irradiation.
Further, the temperature of the extruder is 70-140 ℃ and the temperature of the T die head is 70-140 ℃.
Still further, the encapsulating film material further comprises a third region 13, and the third region 13 is disposed on a side of the second region 12 away from the first region 11 and extends along the first direction X. As shown in fig. 2, the third area 13 plays a role in improving the adhesive force of the edge of the packaging film material, and the width of the third area 13 is 5-100mm. Further, the material of the third region 13 of the packaging film material may be identical to that of the first region 11, which is not described herein.
The photovoltaic module is made of the packaging film material, and particularly comprises a front plate, a first packaging layer, a battery piece layer, a second packaging layer and a back plate, wherein the frame of the photovoltaic module is sealed by an aluminum frame, and silicone structural adhesive or butyl adhesive is adopted between the aluminum frame and the edge of the photovoltaic module.
The front plate and the back plate are selected from glass and high-molecular transparent organic materials, and glass is preferred for the front plate and the back plate from the viewpoints of light transmittance and water blocking performance.
Any one or two layers of the first packaging layer and the second packaging layer adopt the packaging film material.
The advantageous effects of the present application will be further described below with reference to examples and comparative examples.
Example 1
First region 11:100 parts of VA (vinyl acetate) copolymer with the mass fraction of 33%, 0.2 part of cross-linking agent tert-butyl peroxyisopropyl carbonate, 0.7 part of auxiliary cross-linking agent triallyl isocyanurate, 0.1 part of hindered amine light stabilizer bis-2, 6-tetramethyl piperidinol sebacate and 3 parts of tackifier gamma-aminopropyl triethoxysilane.
Second region 12:100 parts of ethylene-vinyl acetate copolymer with the VA mass fraction of 33%, 10 parts of flaky montmorillonite, 1 part of trimethylolpropane triacrylate as a crosslinking agent, 0.1 part of hindered amine light stabilizer sebacic acid bis-2, 6-tetramethyl piperidinol ester, and 2 parts of tackifier gamma-aminopropyl triethoxysilane.
The resin composition of the first area 11 and the resin composition of the second area 12 are fully mixed and then are added into different extruders, the temperature of the extruders is 85 ℃, and the temperature of a T die head is 90 ℃; and after the extrusion materials in the first area 11 and the second area 12 are melted, the extrusion materials enter a T die head through a distributor to be extruded into films, and the films are cooled, cut and rolled to obtain the packaging film material E1. The resin compositions of the first region 11 and the second region 12 were melt-extruded under the above conditions, and formed into films, respectively, to obtain E1-1 and E1-2.
The thickness of the E1, E1-1 and E1-2 adhesive films is 0.5mm, the width of the first area 11 of the packaging film material is 900mm, and the width of the second area 12 on one side is 50mm.
Example 2
First region 11:100 parts of VA (vertical alignment) copolymer with the mass fraction of 33%, 0.2 part of cross-linking agent tert-butyl peroxyisopropyl carbonate, 0.7 part of auxiliary cross-linking agent trimethylolpropane triacrylate, 0.1 part of hindered amine light stabilizer bis-2, 6-tetramethyl piperidinol sebacate and 3 parts of tackifier gamma-aminopropyl triethoxysilane;
second region 12:100 parts of ethylene-alpha-octene copolymer, 5 parts of flaky montmorillonite, 1 part of a sensitizer trimethylolpropane trimethacrylate/pentaerythritol triacrylate compound (the mass ratio is 3:2), 0.1 part of hindered amine light stabilizer sebacic acid bis-2, 6-tetramethylpiperidinol ester and 0.4 part of tackifier vinyl trimethoxysilane;
mixing the resin composition of the first region 11 and the resin composition of the second region 12, adding the mixture into different extruders, wherein the temperature of the extruder of the first region 11 is 85 ℃, the temperature of the extruder of the second region 12 is 90 ℃, and the temperature of a T die head is 95 ℃; and after the extrusion materials in the first area 11 and the second area 12 are melted, the extrusion materials enter a T die head through a distributor to be extruded into films, and the films are cooled, cut and rolled to obtain the packaging film material E2. The resin compositions of the first region 11 and the second region 12 were melt-extruded under the above conditions, and formed into films, respectively, to obtain E2-1 and E2-2.
The thickness of the E2, E2-1 and E2-2 adhesive films is 0.5mm, the width of the first area 11 of the packaging film material is 900mm, and the width of the second area 12 on one side is 50mm.
Example 3
First region 11:100 parts of VA (vinyl acetate) copolymer with the mass fraction of 33%, 0.2 part of cross-linking agent tert-butyl peroxyisopropyl carbonate, 0.7 part of auxiliary cross-linking agent trimethylolpropane triacrylate, 0.1 part of hindered amine light stabilizer sebacic acid bis-2, 6-tetramethylpiperidinol ester and 3 parts of tackifier gamma-aminopropyl triethoxysilane.
Second region 12:100 parts of butyl rubber, 15 parts of polyisobutylene, 15 parts of white carbon black, 5 parts of flaky montmorillonite and 20 parts of talcum powder.
Mixing the resin composition of the first region 11 and the resin composition of the second region 12, adding the mixture into different extruders, wherein the temperature of the extruder of the first region 11 is 85 ℃, the temperature of the extruder of the second region 12 is 120 ℃, and the temperature of a T die head is 120 ℃; and after the extrusion materials in the first area 11 and the second area 12 are melted, the extrusion materials enter a T die head through a distributor to be extruded into films, and the films are cooled, cut and rolled to obtain the packaging film material E3. The resin compositions of the first region 11 and the second region 12 were melt-extruded under the above conditions, and formed into films, respectively, to obtain E3-1 and E3-2.
The thickness of the E3, E3-1 and E3-2 adhesive films is 0.5mm, the width of the first area 11 of the packaging film material is 900mm, and the width of the single-side second area 12 is 50mm.
Example 4
The difference from example 2 is that the water-absorbing filler is 0.01 part of molecular sieve;
e4, E4-1 and E4-2 were obtained.
Example 5
The difference from example 2 is that the water-absorbent filler is 1 part of flaky montmorillonite;
e5, E5-1 and E5-2 were obtained.
Example 6
The difference from example 2 is that the water-absorbing filler is 10 parts of mica flakes modified with gamma-aminopropyl triethoxysilane;
e6, E6-1 and E6-2 were prepared.
Example 7
The difference from example 2 is that,
the matrix material of the first region 11 is: 60 parts of VA 33% ethylene-vinyl acetate copolymer and 40 parts of ethylene-alpha-octene copolymer;
e7, E7-1 and E7-2 were prepared.
Example 8
The difference from example 2 is that,
the matrix material of the first region 11 is: 30 parts of VA copolymer with 33% of ethylene-vinyl acetate and 70 parts of ethylene-alpha-octene copolymer;
e8, E8-1 and E8-2 were obtained.
Example 9
The difference from embodiment 3 is that a third region 13 is further included;
first region 11:100 parts of VA (vertical alignment) copolymer with the mass fraction of 33%, 0.2 part of cross-linking agent tert-butyl peroxyisopropyl carbonate, 0.7 part of auxiliary cross-linking agent trimethylolpropane triacrylate, 0.1 part of hindered amine light stabilizer bis-2, 6-tetramethyl piperidinol sebacate and 3 parts of tackifier gamma-aminopropyl triethoxysilane;
second region 12:100 parts of butyl rubber, 15 parts of polyisobutylene B, 15 parts of white carbon black, 5 parts of flaky montmorillonite and 20 parts of talcum powder;
the third region 13 is consistent with the first region 11;
the resin composition of the first region 11, the resin composition of the second region 12 and the resin composition of the third region 13 are respectively fully mixed and then added into different extruders, wherein the temperature of the extruder of the first region 11 is 85 ℃, the temperature of the extruder of the second region 12 is 120 ℃, the temperature of the extruder of the third region 13 is 85 ℃, and the temperature of a T die head is 120 ℃; and after the extrusion materials of the first area 11, the second area 12 and the third area 13 are melted, the extrusion materials enter a T die head through a distributor to be extruded into films, and the films are cooled, cut and rolled to obtain the packaging film material E9. The resin compositions of the first region 11 and the second region 12 were melt-extruded under the above conditions, and formed into films, respectively, to obtain E9-1 and E9-2.
The thickness of the E9, E9-1 and E9-2 adhesive films is 0.5mm, the width of the first region 11 of the packaging film material is 800mm, the width of the single-side second region 12 is 50mm, and the width of the single-side third region 13 is 50mm.
Example 10
The difference from example 2 is that the width of the second region 12 is 5mm;
e10, E10-1 and E10-2 were produced, the width of the first region 11 of the encapsulation film material being 990mm and the width of the second region 12 on one side being 5mm.
Example 11
The difference from example 2 is that the width of the second region 12 is 100mm;
e11, E11-1 and E11-2 were produced, the width of the first region 11 of the encapsulation film material was 800mm, and the width of the second region 12 on one side was 100mm.
Comparative example 1
The difference from the example 1 is that,
forming a film from the resin composition of the first region 11 without providing the second region 12;
s1 is prepared.
Comparative example 2
The difference from example 2 is that,
forming a film from the resin composition of the second region 12 without providing the first region 11;
s2 is prepared.
Test item and test method
The performance indexes are measured by the following methods:
performance test scheme:
1. light transmittance test:
the surface of the sample is free of patterns after lamination. Taking the average value of the light transmittance in the interval of 400-1100nm according to the spectrophotometry method of GB/T2410-2008.
2. Peel strength test:
preparing two samples with 300 mm-150 mm sizes, one clean glass with 3mm thickness and one backboard; after stacking the glass/two layers of samples/back plate in order, placing the glass/two layers of samples/back plate in a laminating machine for lamination, wherein the laminating condition is 145 ℃, and cutting three samples and the back plate layer according to the width of 10mm for testing the bonding strength between the samples and the glass.
The test was carried out on a tensile machine at a speed of 100mm/min according to the test method of GB/T2790.
3. Water vapor transmission rate test
The water vapor transmission WVTR was measured using an analytical device (MoconPermatran W Model K), 38 ℃,100% rh; units: g/(m2·day). The thickness of the test specimen was sufficiently laminated.
TABLE 1
1. Power of photovoltaic module
The packaging film materials of examples 1 to 11 and comparative examples 1 to 2 were used for a single glass module packaging test, and were put into a vacuum laminator in the order of glass/packaging film material/battery sheet/packaging film material/back sheet (BEC-301M), and a 60-sheet module N-type double-sided battery was laminated (evacuated for 6min, laminated for 12 min) at 145 ℃ to prepare a single glass module, which was subjected to power attenuation conditions of Shan Boguang v modules after aging for 2000 hours at 85 ℃ and 85% humidity according to the specifications in IEC61215, and the power attenuation rate of the photovoltaic modules= (module initial power-module PID aged power)/module initial power.
TABLE 2
From the data in table 2, the experimental results of examples 1-11 are substantially better than those of comparative example 1, and it can be seen that the adoption of the packaging film material with different water blocking rates in a transverse differential manner can effectively delay the corrosion problem caused by water vapor permeation, and further reduce the power attenuation of the photovoltaic module. As is clear from examples 1-3, the encapsulating film material matrix material itself has a large influence on the encapsulating material properties, and preferably the second region 12 matrix material is a matrix material having a high water blocking property. As can be seen from examples 3 and 9, by adding the third region 13, the problems of corrosion and power attenuation caused by intrusion of moisture due to deterioration of the adhesiveness of the encapsulation material can be effectively solved, and the power attenuation can be further reduced. Comparative example 2 adopts POE packaging film material with low water vapor transmittance, has excellent corrosion resistance and smaller power attenuation, but has higher cost compared with EVA material, and example 2 can obtain similar water blocking effect and reduce power attenuation by only adopting high water blocking material with higher part of cost for edge setting.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. An encapsulating film material for encapsulation of a photovoltaic module, characterized in that the encapsulating film material comprises a second region (12) and a first region (11), the second region (12) and the first region (11) being arranged substantially parallel in a first direction;
the second areas (12) are arranged on two sides of the first area (11), and the second areas (12) comprise a first second area (121) and a second area (122) and are arranged in an extending mode along the first direction;
the second region (12) has a lower water vapour transmission than the first region (11);
the water vapor permeability of the second region (12) is less than or equal to 5g/m 2 .d -1 The water vapor transmittance of the first area (11) is less than or equal to 35g/m 2 .d -1 。
2. The encapsulating film material as claimed in claim 1, characterized in that the second region (12) has a water vapor transmission rate of 3g/m or less 2 .d -1 The first region (11) has a water vapor transmission rate of 10-25 g/m 2 .d -1 。
3. The packaging film material according to claim 1, characterized in that the width of the packaging film material first and second areas (121, 122) in the second direction is each independently 5-100mm.
4. The encapsulating film material of claim 1 wherein the encapsulating film material has a thickness of 0.1-2mm.
5. The packaging film material according to claim 1, characterized in that the packaging film material first region (11) comprises the composition: a first matrix material, a first crosslinking agent, and a first auxiliary agent;
the encapsulating film material second region (12) composition comprises: a second matrix material, a hygroscopic material and a second auxiliary agent.
6. The encapsulating film material of claim 5 wherein the hygroscopic material is one or more of a superabsorbent polymer, an inorganic porous material, an alkaline earth oxide, a sulfate; preferably, the moisture absorption material is flaky montmorillonite, flaky mica sheet and molecular sieve.
7. The encapsulating film material as claimed in claim 5, wherein the moisture absorbing material is 0.01 to 10% by weight of the second base material.
8. The packaging film material according to claim 5, wherein the first matrix material is selected from one or more of ethylene-vinyl acetate copolymer, metallocene-catalyzed polyethylene, ethylene butene copolymer, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, and ethylene methyl methacrylate copolymer, and is mixed according to any proportion; the second matrix material is selected from one or more of ethylene-vinyl acetate copolymer, metallocene catalyzed polyethylene, ethylene butene copolymer, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, ethylene methyl methacrylate copolymer and butyl rubber, and is formed by mixing according to any proportion.
9. Packaging film material according to claim 1, characterized in that the packaging film material further comprises a third region (13), which third region (13) is arranged on the side of the second region (12) remote from the first region (11) and extends in the first direction.
10. A photovoltaic module, characterized in that it employs the encapsulating film material according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310791795.1A CN116855180A (en) | 2023-06-29 | 2023-06-29 | Packaging film material and photovoltaic module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310791795.1A CN116855180A (en) | 2023-06-29 | 2023-06-29 | Packaging film material and photovoltaic module |
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| CN116855180A true CN116855180A (en) | 2023-10-10 |
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| CN202310791795.1A Pending CN116855180A (en) | 2023-06-29 | 2023-06-29 | Packaging film material and photovoltaic module |
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