CN116844866A - Thin film capacitor and vehicle - Google Patents

Abstract

The application relates to a thin film capacitor and a vehicle, and belongs to the technical field of vehicle manufacturing. The thin film capacitor comprises a capacitor shell, a capacitor core and a heat exchange plate; the capacitor core is arranged in the capacitor shell; the heat exchange plate is arranged outside the capacitor core in a surrounding manner and in the capacitor shell, and a heat exchange channel for heat exchange medium to flow is arranged in the heat exchange plate. The vehicle includes a thin film capacitor. According to the thin film capacitor and the vehicle, the heat exchange plate and the capacitor core are integrated in the capacitor shell, so that the space occupied by the heat exchange plate is reduced, the whole structure of the thin film capacitor is more compact, the thin film capacitor is beneficial to miniaturized design, and as the heat exchange plate is arranged outside the capacitor core in a surrounding manner, multiple sides of the capacitor core can be cooled through the heat exchange plate, the heat dissipation effect is effectively improved, and the problem of insufficient heat dissipation performance of the conventional thin film capacitor is solved.

Description

Thin film capacitor and vehicle

Technical Field

The application relates to the technical field of vehicle manufacturing, in particular to a thin film capacitor and a vehicle.

Background

Thin film capacitors are commonly used as capacitors for vehicle interior components such as motor controllers due to their many advantageous properties. With the increase of the heat dissipation requirement of vehicles, the heat dissipation performance requirement of the thin film capacitor is also increased.

The current thin film capacitor cooling mode generally utilizes the water cooling plate structure to exchange heat with the thin film capacitor by arranging the water cooling plate structure, thereby cooling the thin film capacitor. However, the arrangement of the water cooling plate structure can lead to a complex structure of the thin film capacitor, and the space utilization rate is reduced. And because the space in the vehicle is limited, the volume of the water cooling plate structure is generally smaller, the single-sided heat dissipation of the film capacitor can be realized, the heat dissipation capacity is weaker, the tolerance capacity of the film capacitor to the high-temperature environment is poorer, and if the heat cannot be dissipated in time, the service life of the film capacitor is easy to influence.

Disclosure of Invention

The application provides a thin film capacitor and a vehicle, which are used for solving the technical problem of insufficient heat dissipation performance of the conventional thin film capacitor.

According to one aspect of the present application, there is provided a thin film capacitor including a capacitor case, a capacitor core, and a heat exchange plate; the capacitor core is arranged in the capacitor shell; the heat exchange plate is arranged outside the capacitor core in a surrounding mode and in the capacitor shell, and a heat exchange channel for heat exchange medium to flow is arranged in the heat exchange plate.

According to the thin film capacitor provided by the application, the heat exchange plate is arranged in the capacitor shell, the heat exchange channel is arranged in the heat exchange plate, and the heat exchange medium such as cooling medium is introduced into the heat exchange channel, so that the heat exchange plate can be used for cooling the capacitor core in the capacitor shell. And because the heat exchange plate is arranged outside the capacitor core in a surrounding mode, the heat exchange channels in the heat exchange plate are also arranged on the periphery of the capacitor core in a surrounding mode, heat exchange can be carried out between the heat exchange plate and a plurality of sides of the capacitor core in a plurality of directions through the heat exchange plate and the heat exchange channels, and therefore the plurality of sides of the capacitor core are cooled simultaneously, and the heat dissipation effect is effectively improved.

In a further preferred aspect, the heat exchange plate is formed with a plurality of receiving grooves, each receiving a corresponding one of the capacitor cores.

In this scheme, set up the heat exchanger plate to the structural style including a plurality of accepting grooves, then can arrange different electric capacity cores in different accepting grooves respectively to be adapted to simultaneously for a plurality of electric capacity core cooling, be favorable to improving radiating efficiency. And the capacitor cores are arranged in the accommodating grooves, so that heat exchange with the capacitor cores can be performed in multiple directions at the same time, and the heat dissipation effect of each capacitor core is improved.

In a further preferred embodiment, the accommodating groove is provided with a plurality of heat exchange surfaces, and the plurality of heat exchange surfaces are respectively attached to a corresponding surface of the capacitor core.

In this scheme, when the electric capacity core was arranged in the accepting groove, a plurality of heat transfer surfaces of accepting groove attached respectively in the different surfaces of electric capacity core, realize from a plurality of directions and electric capacity core heat transfer for the heat dissipation of electric capacity core is more even, can further promote the radiating effect of film electric capacity.

In a further preferable scheme, the accommodating groove is of a U-shaped structure.

In the scheme, the accommodating groove is of a U-shaped structure, so that the accommodating groove can be directly sleeved on the periphery of the capacitor core, and the connection and installation of the heat exchange plate and the capacitor core are facilitated. And when the capacitor core is placed in the accommodating groove with the U-shaped structure, three surfaces of the capacitor core can be cooled through the accommodating groove, so that the heat dissipation efficiency is improved.

In a further preferred embodiment, the heat exchange channel has an S-shaped cross section.

In this scheme, the heat transfer passageway sets up to S-shaped structure, and correspondingly, the heat transfer board also is S-shaped structure, is favorable to installing the heat transfer board between a plurality of electric capacity cores like this. At this time, the heat exchange plates alternately penetrate between all the capacitor cores and separate adjacent capacitor cores, so that the cooling medium can flow along the S-shaped heat exchange channels, and sequentially flow through all the capacitor cores, and the cooling of all the capacitor cores is realized.

In a further preferred embodiment, the capacitor case includes a main body, a liquid inlet channel, and a liquid outlet channel; the main body is provided with a cavity for accommodating the capacitor core and the heat exchange plate, and is provided with a liquid inlet and a liquid outlet which are communicated with the cavity; the liquid inlet channel and the liquid outlet channel are connected to the outer wall of the main body, the liquid inlet channel is communicated with the heat exchange channel through the liquid inlet, and the liquid outlet channel is communicated with the heat exchange channel through the liquid outlet.

In this scheme, be formed with the cavity in the main part, can with the integrated setting of electric capacity core and heat exchanger plate in the cavity, both can form the protection to electric capacity core and heat exchanger plate, can also reduce the space that the heat exchanger plate occupy, be favorable to carrying out miniaturized design to film electric capacity. And still offered inlet and liquid outlet in the main part, set up the inlet channel of connecting in the inlet and connect in the liquid outlet outside the main part, then connect inlet and liquid outlet in the entry and the export of the heat transfer passageway of heat transfer board respectively, can realize utilizing the inlet channel to supply cooling medium for the heat transfer passageway to discharge cooling medium from the liquid outlet channel, thereby make cooling medium circulation flow in the heat transfer passageway, be favorable to improving radiating efficiency.

In a further preferred scheme, the thin film capacitor further comprises a positive electrode busbar and a negative electrode busbar, and the positive electrode busbar and the negative electrode busbar are respectively connected to two end faces of the capacitor core.

In the scheme, the positive electrode busbar and the negative electrode busbar are matched with each other, so that when the thin film capacitor needs to be charged, the capacitor core can be conducted with an external power supply by utilizing the positive electrode busbar and the negative electrode busbar, and the external power supply is used for supplying power to the capacitor core; when the thin film capacitor needs to be discharged, the positive electrode busbar and the negative electrode busbar can be used for conducting the capacitor core and the electricity utilization element, so that the capacitor core is used for supplying power to the electricity utilization element.

In a further preferred embodiment, the capacitor case is formed with an opening; a portion of the positive busbar and a portion of the negative busbar extend from the opening to outside the capacitor case.

In the scheme, after the capacitor core is arranged in the capacitor shell, part of the positive electrode busbar and part of the negative electrode busbar are also positioned in the capacitor shell so as to be connected with the capacitor core; the other parts of the positive electrode busbar and the negative electrode busbar extend from the opening to the outside of the capacitor shell so as to be connected with an external power supply or an electric element.

In a further preferred embodiment, the thin film capacitor further comprises a sealing member, and the sealing member is disposed at the opening and at least closes the opening.

In this scheme, after the equipment of capacitor core, heat exchange plate, anodal female row and negative pole female row and capacitor casing is accomplished, can seal the opening on the capacitor casing through the sealing member to consolidate each equipment part, thereby ensure that the overall structure of film electric capacity is firm, can avoid external circuit or other interference thing to get into the capacitor casing simultaneously and influence the capacitor core, avoid the condition that the electric leakage appears in the capacitor core.

According to another aspect of the present application, there is provided a vehicle including the above-described thin film capacitor.

In this scheme, the vehicle is favorable to promoting the holistic heat dispersion of vehicle owing to adopt above-mentioned film electric capacity, can save vehicle inner space simultaneously.

In summary, the thin film capacitor and the vehicle provided by the application have at least the following beneficial effects:

the thin film capacitor at least comprises the capacitor shell, the capacitor core and the heat exchange plate, and the heat exchange plate and the capacitor core are integrated in the capacitor shell, so that the space occupied by the heat exchange plate is reduced, the whole structure of the thin film capacitor is more compact, and the thin film capacitor is beneficial to miniaturized design. And because the heat exchange plate is arranged outside the capacitor core in a surrounding mode, the heat exchange channel in the heat exchange plate is also arranged on the periphery of the capacitor core in a surrounding mode, heat exchange can be carried out between the heat exchange plate and a plurality of sides of the capacitor core in a plurality of directions through the heat exchange plate and the heat exchange channel, and therefore the plurality of sides of the capacitor core are cooled simultaneously, the heat dissipation effect is effectively improved, and the problem that the heat dissipation performance of the conventional film capacitor is insufficient is solved.

By adopting the thin film capacitor, the vehicle provided by the application can save the occupied space of the thin film capacitor and can improve the overall heat dissipation performance of the vehicle.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those skilled in the art that the drawings in the following description are of some embodiments of the application, and that other drawings may be obtained from these drawings without inventive effort.

FIG. 1 is a schematic diagram of the overall structure of a thin film capacitor according to an embodiment of the present application;

fig. 2 is a schematic diagram of an internal structure of a thin film capacitor according to an embodiment of the present application;

fig. 3 is a schematic perspective view of a capacitor case according to an embodiment of the present application;

fig. 4 is a schematic bottom view of a capacitor case according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a mounting structure of a capacitive core according to an embodiment of the present application;

fig. 6 is a schematic diagram of a connection structure of a positive electrode busbar and a negative electrode busbar according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of an anode busbar according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of a negative electrode busbar according to an embodiment of the present application;

fig. 9 is a schematic diagram of a connection structure between a capacitor core and a heat exchange plate according to an embodiment of the present application;

fig. 10 is a schematic perspective view of a heat exchange plate according to an embodiment of the present application; and

fig. 11 is a schematic bottom view of a heat exchange plate according to an embodiment of the present application.

The reference numerals are as follows:

100. a capacitor housing; 110. a main body; 111. a cavity; 112. a liquid inlet; 113. a liquid outlet; 114. an opening; 120. a liquid inlet channel; 130. a liquid outlet channel; 140. a mounting frame;

200. a capacitor core;

300. a heat exchange plate; 310. a heat exchange channel; 320. a receiving groove; 330. a heat exchange surface;

400. a positive electrode busbar; 410. a positive electrode input terminal; 420. a positive electrode output terminal;

500. a negative electrode busbar; 510. a negative input terminal; 520. a negative electrode output terminal;

600. and a seal.

Detailed Description

In the description of the present application, it should be understood that, if there are descriptions of terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating orientation or positional relationship, it should be understood that the orientation or positional relationship shown based on the drawings is merely for convenience of description and simplification of the description, and does not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the application.

Furthermore, the presence of features defining "first" and "second" for descriptive purposes only, should not be interpreted as indicating or implying a relative importance or implicitly indicating the number of features indicated. Features defining "first", "second" may include at least one such defined feature, either explicitly or implicitly. If a description of "a plurality" is present, the generic meaning includes at least two, e.g., two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly stated and limited otherwise, terms such as "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; the connection may be mechanical connection, electrical connection, direct connection, indirect connection through an intermediate medium, communication between two elements or interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those skilled in the art according to the specific circumstances.

In the description of the present specification, the terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., as used herein, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The vehicle provided by the embodiment of the application can be a fuel oil vehicle, a fuel gas vehicle or a new energy vehicle, and the new energy vehicle can be a pure electric vehicle, a hybrid electric vehicle or an extended range vehicle and the like. Specifically, the vehicle of the present application includes a thin film capacitor that may be configured to be coupled to a motor controller of the vehicle. The vehicle provided by the application adopts the thin film capacitor, and the heat dissipation effect of the thin film capacitor can be improved based on the structural design of the thin film capacitor, so that the space occupied by the cooling structure of the thin film capacitor can be reduced, the overall heat dissipation performance of the vehicle can be improved, and meanwhile, the internal space of the vehicle can be saved.

FIG. 1 is a schematic diagram of the overall structure of a thin film capacitor according to an embodiment of the present application; fig. 2 is a schematic diagram of an internal structure of a thin film capacitor according to an embodiment of the present application; fig. 3 is a schematic perspective view of a capacitor case according to an embodiment of the present application;

fig. 4 is a schematic bottom view of a capacitor case according to an embodiment of the present application; FIG. 5 is a schematic diagram of a mounting structure of a capacitive core according to an embodiment of the present application; fig. 6 is a schematic diagram of a connection structure of a positive electrode busbar and a negative electrode busbar according to an embodiment of the present application; fig. 7 is a schematic structural diagram of an anode busbar according to an embodiment of the present application; fig. 8 is a schematic structural diagram of a negative electrode busbar according to an embodiment of the present application; fig. 9 is a schematic diagram of a connection structure between a capacitor core and a heat exchange plate according to an embodiment of the present application; fig. 10 is a schematic perspective view of a heat exchange plate according to an embodiment of the present application; fig. 11 is a schematic bottom view of a heat exchange plate according to an embodiment of the present application.

Referring to fig. 1 to 11, the thin film capacitor provided in the embodiment of the application at least includes a capacitor case 100, a capacitor core 200 and a heat exchange plate 300.

The capacitor case 100 serves as an outer contour of the thin film capacitor, and is used for providing support for various components of the thin film capacitor, so as to ensure that the thin film capacitor has a certain structural strength, and facilitate connection and installation of the thin film capacitor and the vehicle interior components.

The capacitor core 200 is disposed in the capacitor case 100, and the capacitor case 100 can protect the capacitor core 200 from being damaged due to direct exposure of the capacitor core 200 to the external environment.

The heat exchange plate 300 is disposed in the capacitor case 100, and a heat exchange channel 310 through which a heat exchange medium flows is disposed in the heat exchange plate 300, for example, the heat exchange medium may be a cooling medium such as cooling oil or cooling water. The heat exchange plate 300 is disposed around the capacitor core 200, and is specifically disposed around a plurality of sides of the capacitor core 200, so as to exchange heat with a plurality of sides of the capacitor core 200 at the same time.

Through the structural design, the heat exchange plate 300 and the capacitor core 200 are integrated in the capacitor shell 100, so that the space occupied by the heat exchange plate 300 is reduced, the integral structure of the thin film capacitor is more compact, and the thin film capacitor is miniaturized. And, through letting in cooling medium such as cooling water in the heat transfer channel 310 of heat exchange plate 300, cooling water can flow through a plurality of sides of electric capacity core 200 in proper order along heat transfer channel 310 for cooling water carries out heat transfer with a plurality of sides of electric capacity core 200, thereby carries out cooling to a plurality of sides of electric capacity core 200 simultaneously, has effectively promoted the radiating efficiency of electric capacity core 200. Further, by circulating cooling water into the heat exchange channel 310, the cooling water can be used to exchange heat with the capacitor core 200 continuously, so as to ensure that the capacitor core 200 is at a lower temperature for a long time, and thus the capacitor core 200 can perform charge and discharge operations normally.

Compared with the prior art that the water cooling plate structure is independently configured for the thin film capacitor, the thin film capacitor provided by the embodiment of the application omits the water cooling plate structure, integrates the heat exchange plate 300 and the capacitor core 200 in the capacitor shell 100, improves the space utilization rate, reduces the overall weight of the thin film capacitor, and reduces the cost of the thin film capacitor. In terms of heat dissipation performance, the thin film capacitor provided by the embodiment of the application can exchange heat with the plurality of sides of the capacitor core 200 from a plurality of directions through the heat exchange plate 300 and the heat exchange channel 310, so that the plurality of sides of the capacitor core 200 are cooled at the same time, and the heat dissipation effect is greatly improved.

As a further preferred embodiment, on the basis of the above-mentioned scheme, in a specific embodiment of the present application, an increase or a combination of one or more of the following may be further included.

In some alternative embodiments, the heat exchange plate 300 may be made of copper, which has better heat conduction performance, so as to improve the heat exchange efficiency between the heat exchange plate 300 and the capacitor core 200, and thus cool the capacitor core 200 rapidly.

In some alternative embodiments, the heat exchange plate 300 is formed with a plurality of receiving grooves 320, each receiving groove 320 receiving a corresponding one of the capacitive cores 200.

Referring to fig. 9 to 11, since a plurality of capacitor cores 200 are generally disposed in the thin film capacitor and the plurality of capacitor cores 200 are arranged at intervals, by disposing the heat exchange plate 300 in a structure including a plurality of receiving grooves 320, different receiving grooves 320 can be surrounded on the outer sides of different capacitor cores 200. The heat exchange plates 300 at different accommodating grooves 320 can be respectively matched with different capacitor cores 200, so that the heat exchange plate is suitable for cooling a plurality of capacitor cores 200 at the same time, and the heat dissipation efficiency is improved. In addition, when the capacitor core 200 is placed in the accommodating groove 320, heat exchange can be performed between the plurality of sides of the accommodating groove 320 and the plurality of sides of the capacitor core 200, so that the heat dissipation effect of the capacitor core 200 can be improved.

Further, each accommodating groove 320 is matched with one capacitor core 200, that is, only one capacitor core 200 is accommodated in each accommodating groove 320, so that cooling of each capacitor core 200 is facilitated, and all capacitor cores 200 can be cooled in time.

It should be appreciated that in alternative embodiments, each receiving slot 320 may also receive a plurality of capacitive cores 200 at the same time, thereby cooling the plurality of capacitive cores 200, which may reduce the number of receiving slots 320 and thus reduce the space occupied by the heat exchange plate 300.

In some alternative embodiments, the accommodating groove 320 has a plurality of heat exchange surfaces 330, and the plurality of heat exchange surfaces 330 are respectively attached to a corresponding surface of the capacitor core 200.

In this embodiment, when the heat exchange plate 300 is disposed between the plurality of capacitor cores 200, the capacitor cores 200 are all accommodated in the accommodating groove 320, and the plurality of heat exchange surfaces 330 of the accommodating groove 320 are respectively attached to different surfaces of the capacitor cores 200, the heat exchange surfaces 330 are the sides of the accommodating groove 320 near the capacitor cores 200. The heat exchange with the capacitor core 200 can be performed from multiple directions through the multiple heat exchange surfaces 330, so that the heat dissipation of the capacitor core 200 is more uniform, and the heat dissipation effect of the capacitor core 200 can be further improved.

In some alternative embodiments, the receiving slot 320 is a U-shaped structure.

Referring to fig. 9 to 11, the accommodating groove 320 is configured to have a U-shaped structure matching with the arc-shaped side surface of the capacitor core 200, so that the accommodating groove 320 can be directly sleeved on the periphery of the capacitor core 200, which is beneficial to connection and installation of the heat exchange plate 300 and the capacitor core 200. And, when the capacitor core 200 is placed in the accommodating groove 320 with the U-shaped structure, the side surface of the capacitor core 200 can be more tightly attached to the inner wall of the U-shaped accommodating groove 320, which is favorable for conducting heat between the capacitor core 200 and the heat exchange channel 310 at the accommodating groove 320 and the cooling medium therein, so that the outer side surface of the capacitor core 200 is uniformly cooled by the cooling medium, and the heat dissipation efficiency of the capacitor core 200 is favorable to be improved.

In some alternative embodiments, heat exchange channel 310 is S-shaped in cross-section.

Referring again to fig. 9-11, the heat exchange plates 300 are arranged in an S-shaped configuration, and accordingly, the heat exchange channels 310 within the heat exchange plates 300 are arranged in an S-shaped configuration extending along the heat exchange plates 300. Specifically, the S-shaped heat exchange plate 300 is formed with a plurality of U-shaped receiving grooves 320 alternately arranged, and openings of adjacent U-shaped receiving grooves 320 face opposite directions, so that adjacent U-shaped receiving grooves 320 just receive adjacent capacitor cores 200, which is advantageous for mounting the heat exchange plate 300 between the plurality of capacitor cores 200. At this time, the heat exchange plates 300 are alternately inserted between all the capacitor cores 200, and adjacent capacitor cores 200 are spaced apart, so that each capacitor core 200 can be surrounded by the heat exchange plates 300. The cooling medium can flow along the S-shaped heat exchange channels 310, so that the cooling medium sequentially flows through all the capacitor cores 200, and the cooling of all the capacitor cores 200 is realized at the same time.

In this embodiment, the heat exchange channels 310 are configured as an S-shaped structure, and the S-shaped heat exchange channels 310 sequentially wrap all the capacitor cores 200, so that the contact area between the heat exchange plate 300 and the capacitor cores 200 can be increased, and the cooling efficiency of the capacitor cores 200 can be improved, thereby maximizing the heat dissipation efficiency.

In some alternative embodiments, the capacitive housing 100 includes a main body 110, a liquid inlet channel 120, and a liquid outlet channel 130; the main body 110 is provided with a cavity 111 for accommodating the capacitor core 200 and the heat exchange plate 300, and the main body 110 is provided with a liquid inlet 112 and a liquid outlet 113 which are communicated with the cavity 111; the liquid inlet channel 120 and the liquid outlet channel 130 are connected to the outer wall of the main body 110, and the liquid inlet channel 120 is communicated with the heat exchange channel 310 via the liquid inlet 112, and the liquid outlet channel 130 is communicated with the heat exchange channel 310 via the liquid outlet 113.

Referring to fig. 3 to 4, the main body 110 is in a rectangular parallelepiped shape, a hollow cavity 111 is formed in the main body 110, and the capacitor core 200 and the heat exchange plate 300 may be integrally disposed in the cavity 111, so that protection is formed for the capacitor core 200 and the heat exchange plate 300 by using the main body 110, and the space occupied by the heat exchange plate 300 may be reduced, which is beneficial to miniaturized design of the thin film capacitor.

The bottom surface of the main body 110 is provided with a liquid inlet 112 and a liquid outlet 113, when the heat exchange plate 300 is arranged in the cavity 111, one end of the heat exchange channel 310 is communicated with the liquid inlet 112, and the other end of the heat exchange channel 310 is communicated with the liquid outlet 113. The bottom outer side of the main body 110 is provided with a liquid inlet channel 120 and a liquid outlet channel 130, and the liquid inlet channel 120 and the liquid outlet channel 130 are respectively communicated with a liquid inlet 112 and a liquid outlet 113 on the main body 110.

In a specific embodiment, when the cooling medium is supplied into the heat exchanging channels 310 of the heat exchanging plate 300, the liquid inlet channel 120 and the liquid outlet channel 130 may be connected to cooling water channels of the vehicle motor, and the circulating cooling water may be supplied to the heat exchanging channels 310 through the cooling water channels of the vehicle motor. Specifically, the cooling water in the cooling water channel of the vehicle motor flows into the heat exchange channel 310 through the liquid inlet 120 and the liquid inlet 112, flows along the heat exchange channel 310 and passes through all the capacitor cores 200, is finally discharged through the liquid outlet 113, and returns to the cooling water channel of the vehicle motor through the liquid outlet 130, so that the cooling water circularly flows in the heat exchange channel 310, and the heat dissipation efficiency is improved.

In some alternative embodiments, the thin film capacitor further includes a positive electrode busbar 400 and a negative electrode busbar 500, and the positive electrode busbar 400 and the negative electrode busbar 500 are respectively connected to two end surfaces of the capacitor core 200.

Referring to fig. 5 to 8, the positive electrode busbar 400 is connected to an end surface above the capacitor core 200, the negative electrode busbar 500 is connected to an end surface below the capacitor core 200, and the positive electrode busbar 400 and the negative electrode busbar 500 are matched with each other, so that when the thin film capacitor needs to be charged, the positive electrode busbar 400 and the negative electrode busbar 500 can be used to be conducted with the capacitor core 200 and an external power supply, and the external power supply is used to supply power to the capacitor core 200. When the thin film capacitor needs to be discharged, the positive electrode busbar 400 and the negative electrode busbar 500 can be used for conducting with the capacitor core 200 and the electricity utilization element, so that the capacitor core 200 is used for supplying electricity to the electricity utilization element.

In some alternative embodiments, positive busbar 400 includes a positive input terminal 410 and a plurality of positive output terminals 420, and negative busbar 500 includes a negative input terminal 510 and a plurality of negative output terminals 520; the positive input terminal 410 and the negative input terminal 510 are used for external power supply; the positive electrode output terminals 420 and the negative electrode output terminals 520 are the same in number and are provided in one-to-one correspondence.

When the thin film capacitor needs to be charged, the positive input terminal 410 and the negative input terminal 510 can be connected with an external power source, so that the capacitor core 200 is powered by the external power source. When the thin film capacitor needs to be discharged, the positive electrode output terminal 420 and the negative electrode output terminal 520 can be used for conducting with the electricity utilization element, so that the capacitor core 200 can be used for supplying electricity to the electricity utilization element. Further, by providing a plurality of pairs of positive output terminals 420 and negative output terminals 520, a plurality of power consuming elements can be connected at the same time, so that the capacitive core 200 simultaneously supplies power to a plurality of parallel power consuming elements. For example, the figure shows a case where three pairs of positive output terminals 420 and negative output terminals 520 are provided, at which time three power consuming elements may be simultaneously powered by the capacitive core 200.

It should be appreciated that in other alternative embodiments, other numbers of positive output terminals 420 and negative output terminals 520 may be provided, such as providing a pair of positive output terminals 420 and negative output terminals 520, two pairs of positive output terminals 420 and negative output terminals 520, four pairs of positive output terminals 420 and negative output terminals 520, and so forth.

In some alternative embodiments, the positive electrode busbar 400 and the negative electrode busbar 500 may be made of copper metal, which is advantageous for improving the electrical conductivity.

In some alternative embodiments, the capacitive housing 100 further includes a mounting bracket 140, the mounting bracket 140 being attached to an outer wall of the body 110.

Referring to fig. 1 to 4, two mounting frames 140 are provided at both sides of the capacitor case 100, respectively, mounting holes such as screw holes may be provided on the mounting frames 140, and the capacitor case 100 may be coupled to the vehicle interior part through the mounting frames 140 to secure the installation of the thin film capacitor.

In some alternative embodiments, the capacitive housing 100 is formed with an opening 114; portions of the positive busbar 400 and portions of the negative busbar 500 extend from the opening 114 to the outside of the capacitor case 100.

Referring to fig. 3, a cavity 111 is formed in a main body 110 of a capacitor case 100, and an opening 114 is defined in the main body 110, and a capacitor core 200, a heat exchange plate 300, a positive electrode busbar 400, and a negative electrode busbar 500 are all mounted in the cavity 111 through the opening 114. When the capacitor core 200 is mounted in the cavity 111, a part of the positive electrode busbar 400 and the negative electrode busbar 500 are connected to the capacitor core 200 in the cavity 111, and the positive electrode input terminal 410 and the positive electrode output terminal 420 of the positive electrode busbar 400 and the negative electrode input terminal 510 and the negative electrode output terminal 520 of the negative electrode busbar 500 extend from the opening 114 to the outside of the cavity 111 so as to be connected with an external power source or an electric element.

In some alternative embodiments, the thin film capacitor further comprises a seal 600, the seal 600 being disposed at the opening 114 and closing at least the opening 114. Referring to fig. 2, the sealing member 600 is not disposed at the opening 114 of the capacitor case 100, and the capacitor core 200, the heat exchange plate 300, and a portion of the positive electrode busbar 400 and the negative electrode busbar 500 are all mounted in the capacitor case 100. Referring to fig. 1, at this time, the opening 114 of the capacitor case 100 is provided with the sealing member 600, and the opening 114 on the capacitor case 100 is sealed by the sealing member 600, so that external lines or other interferents can be prevented from entering the capacitor case 100 to affect the capacitor core 200, and the capacitor core 200 is prevented from leaking.

For example, the sealing member 600 may be formed by injecting glue into the opening 114 of the capacitor case 100 and then solidifying the glue, so that the capacitor core 200, the heat exchange plate 300, and the positive electrode busbar 400 and the negative electrode busbar 500 may be reinforced, thereby ensuring the overall structure of the thin film capacitor to be stable.

While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by those skilled in the art within the scope of the application.

Claims (10)

1. A thin film capacitor, which is characterized by comprising a capacitor shell (100), a capacitor core (200) and a heat exchange plate (300);

the capacitor core (200) is arranged in the capacitor shell (100);

the heat exchange plate (300) is arranged outside the capacitor core (200) in a surrounding mode and is arranged in the capacitor shell (100), and a heat exchange channel (310) for heat exchange medium to flow is arranged in the heat exchange plate (300).

2. The thin film capacitor according to claim 1, wherein the heat exchange plate (300) is formed with a plurality of receiving grooves (320), each receiving groove (320) receiving a corresponding one of the capacitor cores (200).

3. The thin film capacitor according to claim 2, wherein the accommodating groove (320) has a plurality of heat exchange surfaces (330), and the plurality of heat exchange surfaces (330) are respectively attached to a corresponding one of the surfaces of the capacitor core (200).

4. The thin film capacitor of claim 2, wherein the receiving groove (320) has a U-shaped structure.

5. The thin film capacitor of claim 1, wherein the heat exchange channel (310) is S-shaped in cross section.

6. The thin film capacitor of claim 1, wherein the capacitor housing (100) comprises a main body (110), a liquid inlet channel (120), and a liquid outlet channel (130);

the main body (110) is provided with a cavity (111) for accommodating the capacitor core (200) and the heat exchange plate (300), and the main body (110) is provided with a liquid inlet (112) and a liquid outlet (113) which are communicated with the cavity (111);

the liquid inlet channel (120) and the liquid outlet channel (130) are connected to the outer wall of the main body (110), the liquid inlet channel (120) is communicated with the heat exchange channel (310) through the liquid inlet (112), and the liquid outlet channel (130) is communicated with the heat exchange channel (310) through the liquid outlet (113).

7. The thin film capacitor according to claim 1, further comprising a positive busbar (400) and a negative busbar (500), the positive busbar (400) and the negative busbar (500) being connected to two end faces of the capacitor core (200), respectively.

8. The thin film capacitor according to claim 1, wherein the capacitor case (100) is formed with an opening (114);

a portion of the positive busbar (400) and a portion of the negative busbar (500) extend from the opening (114) to outside the capacitive housing (100).

9. The thin film capacitor of claim 8, further comprising a seal (600), the seal (600) being disposed at the opening (114) and closing at least the opening (114).

10. A vehicle comprising a thin film capacitor as claimed in any one of claims 1 to 9.