CN116837433A

CN116837433A - Electroplating product, electroplating method and application

Info

Publication number: CN116837433A
Application number: CN202310325472.3A
Authority: CN
Inventors: 杨树斌; 施昱
Original assignee: Beihang University
Current assignee: Beihang University
Priority date: 2023-03-29
Filing date: 2023-03-29
Publication date: 2023-10-03

Abstract

The invention discloses an electroplating product, an electroplating method and application, wherein the electroplating product comprises a substrate; the conductive MXene layer is arranged on the surface of the substrate; and at least one electroplated metal layer arranged on the surface of the conductive MXene layer; or, a conductive MXene layer; and an electroplated metal layer disposed on at least one side of the surface of the conductive MXene layer; wherein the conductive MXene layer comprises an MXene material. The invention forms the conductive MXene layer on the non-conductive substrate by simple coating, spraying or dipping and other methods, greatly simplifies the electroplating process steps, provides the production efficiency, reduces the production cost and avoids the problem of environmental pollution.

Description

Electroplating product, electroplating method and application

Technical Field

The invention belongs to the field of electroplating, and particularly relates to an electroplating product, an electroplating method and application.

Background

The purpose of plastic electroplating is to coat metal on the surface of plastic, thereby not only increasing the appearance, but also compensating the defects of the plastic, endowing the plastic with the property of metal, fully playing the characteristics of the plastic and the metal into a whole, and a large number of plastic electroplating products are applied to the industries of electronics, automobiles, household appliances and the like.

Compared with metal products, the plastic electroplated product not only can realize good metal texture, but also can reduce the weight of the product, and effectively improve the appearance and the decoration of the plastic, and simultaneously improve the performances of the plastic in aspects of electricity, heat, corrosion resistance and the like. With the rapid development of industry and the increasingly wide application of plastic electroplating, the plastic electroplating becomes one of the important means for surface decoration in plastic products. Electroplating is widely performed on the surfaces of ABS, polypropylene, polysulfone, polycarbonate, nylon, phenolic glass fiber reinforced plastics, polystyrene and other plastics at home and abroad.

The existing plastic electroplating process generally needs pretreatment to perform electroplating process, and the pretreatment comprises hydrophilization treatment and chemical plating treatment, wherein the hydrophilization treatment aims to make the plastic surface compatible with an aqueous plating solution, and a chemical method is adopted, namely, a strong oxidizing solution containing chromic anhydride and sulfuric acid mixture is adopted for treatment. However, the chemical method uses toxic chemicals, which has the problem of environmental pollution; the electroless plating treatment aims to form a layer of metal conductive film on the surface of the plastic, so as to provide conductivity and electroplating nucleation sites for the subsequent electroplating process. Through chemical plating treatment, noble metal ions such as gold, silver, platinum or palladium with catalysis in the plating solution are reduced and deposited on a plastic substrate to form a metal conductive film (the thickness is about 0.05-0.8 mu m), and the noble metal ions are used in the chemical plating solution, so that the problem of high process cost exists. After electroless plating, an electroplated metal layer (e.g., copper, iron, nickel, etc.) is deposited over the metal conductive film by an electroplating process to complete the electroplating of the plastic part.

Therefore, the existing plastic electroplating has the problems of complex preparation process, low efficiency, environmental pollution and high cost because the hydrophilization treatment, the chemical plating and the electroplating processes are needed.

Disclosure of Invention

The invention aims to solve the problems of complex process, low efficiency, environmental pollution and high cost of the existing plastic electroplating process.

The first aspect of the present invention provides an electroplated product comprising: a base; the conductive MXene layer is arranged on the surface of the substrate; and at least one electroplated metal layer arranged on the surface of the conductive MXene layer. Alternatively, the electroplated product comprises: a conductive MXene layer; and an electroplated metal layer disposed on at least one side of the surface of the conductive MXene layer. Wherein the conductive MXene layer comprises an MXene material.

In some embodiments, the chemical formula of the MXene material described above is represented by M _n+1 X _n T _x Wherein M represents one or more of transition metal elements; x represents one or more of carbon, nitrogen or boron, and T represents a surface functional group; n is more than or equal to 1 and less than or equal to 4, x is more than or equal to 0 and less than or equal to 2; preferably, the M is selected from one or more of Ti, nb, ta, V, mo, zr.

In some embodiments, the mass content of the MXene material in the conductive MXene layer is between 30% and 100%; preferably 50% to 100%, more preferably 90% to 100%.

In some embodiments, the substrate is a non-conductive material.

In some embodiments, the non-conductive material is selected from a polymer, a ceramic, or a glass.

In some embodiments, the polymer is selected from one or more of acrylonitrile-butadiene-styrene copolymer, polysulfone, polycarbonate, polypropylene, phenolic resin, phenolic glass fiber reinforced plastic, nylon, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polypropylene, polyvinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene, polyphenylene sulfide, polyphenylene oxide, polystyrene, polyamide, and derivatives of the above polymers.

In some embodimentsIn an embodiment, the MXene material is selected from the group consisting of Ti ₃ C ₂ T _x 、Ti ₂ CT _x 、V ₂ CT _x 、Nb ₂ CT _x 、Mo ₂ CT _x 、Ti ₄ C ₃ T _x 、Ta ₂ CT _x 、Ta ₄ C ₃ T _x 、TiNbCT _x 。

In some embodiments, the material of the electroplated metal layer is selected from one or more of copper, nickel, chromium, zinc, cadmium, lead, gold, silver, platinum, iron, cobalt, manganese, antimony, bismuth, gallium, indium, thallium, palladium, rhenium, rhodium, osmium, iridium, niobium, and tungsten.

In some embodiments, the thickness of the conductive MXene layer is between 1nm and 50 μm; preferably between 3nm and 20 μm; preferably between 10nm and 10 μm; more preferably between 100nm and 5 μm; and still more preferably between 200nm and 2 μm.

In some embodiments, the thickness of the electroplated metal layer is between 10nm and 50 μm; preferably between 100nm and 10 μm; more preferably between 100nm and 5 μm; and still more preferably between 200nm and 2 μm.

In some embodiments, the substrate is in the form of a sheet, film, tube, braid, wire, or mesh.

The second aspect of the present invention provides a method for preparing the above-mentioned electroplated product, comprising the steps of: and (3) a loading step: coating the surface of the matrix with an MXene material and a conductive MXene layer; electroplating: and electroplating and depositing an electroplated metal layer on the surface of the conductive MXene layer.

In some embodiments, the above-described preparation method further comprises a peeling step of peeling the substrate after the loading step; or, the preparation method further comprises a stripping step after the electroplating step, and the substrate is stripped.

In some embodiments, in the step of overlaying, more specific steps include: coating and/or spraying the MXene dispersion liquid on the substrate, and drying to obtain the conductive MXene layer; or immersing, pulling and/or immersing the substrate from the MXene dispersion liquid, and forming the conductive MXene layer on the surface of the substrate after drying; or, the surface of the substrate is contacted with the liquid phase interface of the MXene dispersion liquid, and the conductive MXene layer is formed on the surface of the substrate.

In some embodiments, the solvent of the MXene dispersion is selected from one or more of water, alcohols; preferably, the alcohol is selected from one or more of ethanol, propanol, isopropanol and butanol; and/or the concentration of MXene in the MXene dispersion is between 0.01mg/ml to 80mg/ml.

In some embodiments, the MXene dispersion described above contains a binder.

In some embodiments, the binder is selected from aqueous binders.

In some embodiments, the aqueous binder is selected from one or more of LA133 aqueous binder, methylcellulose (CMC), polytetrafluoroethylene (PTFE), polyvinyl alcohol (PVA), styrene Butadiene Rubber (SBR), aqueous polyurethane.

In some embodiments, the MXene dispersion described above is composed of an MXene material and a solvent.

The third aspect of the invention provides an electroplated product as described above, or an electroplated product obtained by the preparation method as described above, for use in automobiles, home appliances, and energy storage devices.

In a fourth aspect, the invention provides the use of an MXene material for interfacial plating or electroless plating of a non-conductive material.

The fifth aspect of the present invention provides a composite current collector, which is the above-mentioned electroplated product; or the preparation method of the composite current collector comprises the preparation method of the electroplating product.

A sixth aspect of the present invention provides a battery comprising the composite current collector described above.

The technical conception of the invention is that a conductive MXene layer containing MXene material is formed on the surface of a non-conductive substrate, and then an electroplated metal layer is formed on the conductive MXene layer by electroplating, thus obtaining an electroplated product.

The conductive MXene layer is formed on the non-conductive substrate by simple coating, spraying, dipping or other methods, and the MXene material in the conductive MXene layer has hydrophilicity and can be compatible with water-based electroplating, so that chemical hydrophilic treatment in the prior art is avoided; meanwhile, the MXene material in the conductive MXene layer also has metallic and rich surface functional groups, and can provide nucleation points for electroplated metal in an electroplating process and reduce metal deposition overpotential, so that the step of electroless plating treatment is avoided. Therefore, the preparation method greatly simplifies the process steps of electroplating of non-conductive materials (such as plastics), provides production efficiency, reduces production cost and avoids the problem of environmental pollution.

Drawings

Fig. 1 is a schematic diagram of a plastic electroplated product in embodiment 1 of the present invention.

FIG. 2 is a second schematic diagram of a plastic electroplated product in embodiment 1 of the present invention.

FIG. 3 is a third schematic diagram of a plastic electroplated product according to embodiment 1 of the present invention.

Fig. 4 is a schematic diagram of a preparation step of a composite metal foil of an electroplated product and a schematic diagram of a structure of a composite metal foil in embodiment 1 of the present invention.

Fig. 5 is a schematic diagram of a preparation step of a composite metal foil of another electroplating product in embodiment 1 of the present invention, and a schematic diagram of a structure of the composite metal foil.

FIG. 6 is a schematic diagram of the structure of an ultra-thin conductive MXene layer formed on a substrate surface according to the present invention.

FIG. 7 is a photograph of a PP/MXene composite obtained by spraying MXene dispersion on the surface of a polypropylene sheet according to example 2 (a) of the present invention; (b and c) plating a photograph of metallic copper PP/MXene/Cu on a part of the surface of the PP/MXene composite.

FIG. 8 is a SEM photograph of the (a) cross section of the copper-plated plastic product PP/MXene/Cu of example 2 of the present invention, and photographs of the element distribution of the (b-d) Ti, F and Cu elements.

FIG. 9 is a photograph of (a) of the copper composite film PET/MXene/Cu in example 5 of the present invention; (b) cross-sectional SEM photographs; (c) SEM photograph of the surface of the electroplated copper layer.

FIG. 10 is a photograph of (a) a copper electroplated product obtained in example 6 of the present invention; (b) cross-sectional SEM photograph.

FIG. 11 is a photograph of an electroplated product composite PP/MXene/Cu/Pb in example 7 of the invention.

FIG. 12 SEM photograph of the (a) cross-section and (b) surface of copper plating on the graphene surface in comparative example 1 of the present invention.

FIG. 13 is a photograph of a composite GF/MXene/Cu obtained by plating metallic copper on the surface of a glass fiber braid coated with a conductive MXene layer in example 8 of the present invention.

FIG. 14 is a photograph of a separate substrate on PET/MXene/Cu composite in example 11 of the present invention.

Fig. 15 is a photograph showing a thickness test of the metal copper foil in example 11 of the present invention.

Fig. 16 is an elemental distribution photograph of the surface (a) of the metal copper foil obtained in example 11 of the present invention, (b) Ti element, (c) F element, and (d) Cu element.

FIG. 17 is a cross-sectional SEM photograph of a conductive MXene layer and an electroplated copper layer of a metallic copper composite current collector of example 12 of the invention.

Fig. 18 is a schematic structural view of a lithium metal electrode sheet containing the metal copper foil of the present invention in example 14 of the present invention.

The main reference numerals illustrate:

100. 200, 300 electroplating products; 110. 120 composite metal foil; 400 electrode plates;

10 a substrate; a 20 conductive MXene layer, a 21MXene two-dimensional sheet; 30 electroplating a metal layer; a 40 lithium base layer.

Detailed Description

The technical scheme of the invention is described below through specific examples. It is to be understood that the reference to one or more steps of the invention does not exclude the presence of other methods and steps before or after the combination of steps, or that other methods and steps may be interposed between the explicitly mentioned steps. It should also be understood that these examples are illustrative of the present invention and are not intended to limit the scope of the present invention. Unless otherwise indicated, the numbering of the method steps is for the purpose of identifying the method steps only and is not intended to limit the order of arrangement of the method steps or to limit the scope of the invention, which relative changes or modifications may be regarded as the scope of the invention which may be practiced without substantial technical content modification.

The MXene material and graphene in the embodiment of the invention are purchased from Jinan Sanchuan New Material technologies Co., ltd, wherein Ti ₃ C ₂ T _x Product model SC02003LW of slurry with concentration of 5mg/ml and 50mg/ml, ti ₃ C ₂ T _x Two-dimensional MXene Ti contained in the slurry ₃ C ₂ T _x From MAX phase material Ti ₃ AlC ₂ Etching the Al layer, and then carrying out ultrasonic stripping. The MXene powder is Ti ₃ C ₂ T _x Graphene in the comparative example was prepared using a redox method at a concentration of 0.5wt.%.

The raw materials and instruments used in the examples are not particularly limited in their sources, and may be purchased on the market or prepared according to conventional methods well known to those skilled in the art.

The present invention, when used to prepare electroplated metal layers using conductive MXene layers, finds the following properties and features: 1) The MXene layer has excellent affinity with the electroplating solution, and mainly the surface of the MXene layer has rich hydrophilic functional groups such as-OH, -O and the like; 2) The use of MXene can greatly reduce the deposition overpotential of the metal, and the surface functional groups rich in MXene are used as nucleation sites of the metal; 3) The MXene material can realize the uniform deposition growth of metal ions on the surface of the MXene material, and the MXene material has high conductivity and high specific surface area, so that the electric field and the ion current distribution in the electroplating process are greatly homogenized; 4) An ultra-thin metal layer with a compact structure is obtained on the MXene material, and an ultra-thin composite metal electroplated part is prepared, because of the two-dimensional structure of the MXene atomic layer thickness, the thickness of the composite layer is greatly reduced. The technical features of the present invention will be further described below by way of specific examples.

Example 1

The embodiment provides a plastic electroplated product 100, as shown in FIG. 1, comprising a polymer matrix 10, a conductive MXene layer 20 and an electroplated metal layer 30, wherein the conductive MXene layer 20 contains MXene material; wherein the polymer matrix is sheet-shaped or film-shaped, the conductive MXene layer 20 is arranged on one side surface of the polymer matrix 10, and the electroplated metal layer 30 is arranged on the conductive MXene layer 20. In another embodiment, the conductive MXene layer 20 is disposed on both side surfaces of the polymer matrix 10 (FIG. 2), resulting in an electroplated product 200. The present invention is not limited to the shape of the polymer matrix, and in another embodiment, the polymer matrix 10 is cylindrical or linear (fig. 3) to provide a cylindrical or linear plastic plated product 300. In other embodiments, the polymer matrix may also be tubular, porous, or irregularly shaped.

The embodiment also provides a preparation method of the plastic electroplating product, which comprises the following steps:

s01: coating the surface of the matrix with an MXene material to form a conductive MXene layer;

s02: and electroplating and depositing an electroplated metal layer on the surface of the conductive MXene layer.

The embodiment also provides another electroplated product, which is a metal foil with a sandwich structure, as shown in fig. 4, and the preparation method comprises the following steps:

S11: coating the surface of the matrix with an MXene material to form a conductive MXene layer;

s12: stripping the matrix in the compound obtained in the step S11 to obtain a conductive MXene layer;

s13: and (3) electroplating and depositing the conductive MXene layer obtained in the step (S12) to form an electroplated metal layer, thereby obtaining an electroplated product with a sandwich structure and an electroplated layer on both sides and a conductive MXene layer in the middle, namely the composite metal foil 120.

The embodiment also provides another electroplated product, which is a metal foil with a conductive MXene layer on one side, as shown in FIG. 5, and the preparation method comprises the following steps:

s21: coating the surface of the matrix with an MXene material to form a conductive MXene layer;

s22: electroplating and depositing the compound obtained in the step S21, and forming an electroplated metal layer on the surface of the conductive MXene layer;

s23: the matrix in the composite obtained in step S22 is peeled off to obtain another electroplated product, a composite metal foil 110 having a conductive MXene layer on one side.

In steps S01, S11, and S21, the method of coating the surface of the substrate with the MXene material to form the conductive MXene layer may be a dry method or a wet method, where the dry method refers to forming a film layer on the surface of the substrate by using powder of the MXene material, a binder, and the like under the condition of no solvent; the wet method is to coat the dispersing liquid of MXene on the surface of a substrate by spraying, dipping, coating and other methods, and form a conductive MXene layer after drying and removing the solvent. The dry process avoids the step of removing the solvent, can simplify the process flow, but forms a stable continuous conductive layer, requires the addition of a binder, a non-conductive binder, and reduces the continuous conductivity of the conductive MXene layer surface. Thus, a wet process is preferably employed. The wet process has the beneficial effects that the MXene material can be more uniformly dispersed on the surface of the matrix; although the solvent removal step is included, because of the good hydrophilicity of the MXene material, aqueous solvents (including water and/or alcohol solvents) are typically employed, which have the advantage of low cost and ease of removal. In a specific embodiment, the method comprises the following steps: coating the MXene dispersion liquid on the surface of a substrate through one or more spraying and/or coating to form an MXene film, and drying to form a conductive MXene layer; in another specific embodiment, the method comprises: the substrate is pulled and/or immersed from the MXene dispersion liquid for a plurality of times, so that the MXene two-dimensional sheets in the dispersion liquid are directionally and continuously coated on the surface of the substrate under the action of surface tension, and a conductive MXene layer is formed after drying.

Wherein, the MXene dispersion liquid in the invention refers to a liquid or semi-liquid (gel state or slurry state) mixture containing MXene material; optionally, the MXene dispersion liquid also comprises a certain amount of binder (accounting for 0.01-50% of the mass of the dry material), the content of the binder is comprehensively judged in combination with the binding performance and the electroplating performance, and the smaller the content of the binder is, the better the electroplating effect and the binding performance are under the premise of ensuring; preferably, the binder is an aqueous binder, optionally selected from one or more of LA133 aqueous binder, methylcellulose (CMC), polytetrafluoroethylene (PTFE), polyvinyl alcohol (PVA), styrene Butadiene Rubber (SBR), aqueous polyurethane, etc.

Alternatively, the concentration of the MXene dispersion is between 0.01mg/ml and 80mg/ml, selected according to the method of coating. Methods of coating the substrate with the MXene dispersion optionally include spraying, coating, dipping, and the like. In a specific embodiment, the method comprises the following steps: coating 0.01-2 mg/ml of MXene dispersion liquid on the surface of a matrix through one or more times of spraying, and drying to form a conductive MXene layer; in another embodiment, the method comprises the steps of carrying out one or more times of dipping and pulling on 1-10 mg/ml of MXene dispersion liquid, so that MXene in the dispersion liquid is coated on the surface of a substrate under the action of surface tension, and forming a conductive MXene layer after drying; in another embodiment, the method comprises applying 10-80 mg/ml of the MXene dispersion to the surface of the substrate via a medium (e.g., brush, doctor blade, etc.), and drying to form a conductive MXene layer.

The chemical formula of the MXene material in the invention can be expressed as M _n+1 X _n T _x Wherein M represents one or more of transition metal elements; x represents one or more of carbon, nitrogen or boron, and T represents a surface functional group; n is more than or equal to 1 and less than or equal to 4, x is more than or equal to 0 and less than or equal to 2; in some embodiments M is selected from one or more of Ti, nb, ta, nb, V, mo, zr, cr. The MXene material is typically prepared from a precursor MAX by phase etching the a component therein. Common MXene materials are Ti ₃ C ₂ T _x 、Ti ₂ CT _x 、V ₂ CT _x 、Nb ₂ CT _x 、Mo ₂ CT _x 、Ti ₄ C ₃ T _x 、Ta ₂ CT _x 、Ta ₄ C ₃ T _x 、TiNbCT _x Etc.

In some embodiments, an adhesive is added to the conductive MXene layer as needed to increase the bonding force between the conductive MXene layer and the substrate; i.e. the mass content of the MXene material in the conductive MXene layer is between 30% and 100%; the higher the content of the MXene material in the conductive MXene layer is, the better the conductivity and the hydrophilicity are, but the bonding force between the conductive MXene material and the polymer matrix is reduced; in other embodiments, the conductive MXene layer also functions as a separation layer, which does not contain a binder. Thus, preferably, the mass content of the MXene material in the conductive MXene layer is between 50% and 100%, more preferably between 80% and 100%; and still more preferably, between 90% and 100%.

The invention electroplates the surface of the conductive MXene layer to form the electroplated metal layer, the surface of the substrate is not contacted with the metal layer, but the conductive MXene layer is used as the connecting layer of the substrate and the electroplated metal layer, so the preparation method of the invention has universality for various substrates.

In some embodiments, the bonding force between the conductive MXene layer and the polymer matrix may be enhanced by roughening the surface of the polymer matrix (e.g., corona or etching), i.e., etching "pits" in the surface of the polymer matrix, thereby reducing the amount of binder or eliminating the use of binder.

In some embodiments, the polymer matrix may be selected from the group consisting of acrylonitrile-butadiene-styrene (ABS), polysulfone (PSF or PSU), polycarbonate (PC), phenolic resin, phenolic glass fiber reinforced plastic, nylon, polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyimide (PI), polypropylene, polyvinylchloride (PVC), polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), polyphenylene Sulfide (PPs), polyphenylene oxide (PPO), polystyrene (PS), polyamide (PA), and derivatives of one or more of the foregoing polymers.

In some embodiments, the type of metal in the electroplated metal layer may be selected from one or more of copper, nickel, chromium, zinc, cadmium, lead, gold, silver, platinum, iron, cobalt, manganese, antimony, bismuth, gallium, indium, thallium, palladium, rhenium, rhodium, osmium, iridium, niobium, tungsten.

In some embodiments, the conductive MXene layer has a thickness between 1nm and 20 μm. The conductive MXene layer may be applied by coating, spraying, dip-coating, or the like a dispersion (which may also be a paint) containing MXene on the polymer substrate. Since the MXene material is typically a two-dimensional material, the monolayer is only 1nm thick. When the two-dimensional sheet 21 of MXene is formed as a single layer or a continuous distribution of a small number of layers on the surface of the polymer matrix, such as by dip-coating, the thickness of the conductive MXene layer can be as low as 1nm to 3nm, resulting in an ultra-thin conductive MXene layer (as shown in FIG. 6). When the spray coating method or the coating method is adopted, the thickness of the conductive MXene layer can be controlled to be in the range of several micrometers (1 μm to 100 μm). Thus, the thickness of the conductive MXene layer can be adjusted between 1nm and 100 μm.

The thickness of the electroplated metal layer is controlled by adjusting the conditions of the electroplating process as desired, and in some embodiments, is between 50nm and 500 μm. Because the preparation method of the invention does not need to carry out chemical plating treatment, magnetron sputtering or evaporation plating process and only has one electroplating process, the metal layer of the plastic electroplated product is only the thickness of the electroplated metal layer, namely, the invention can obtain an electroplated part with an ultrathin metal layer (about 50 nm-10 mu m). The electroplating conditions of the electroplated metal layer are optimized according to the conditions of different metal ions; preferably, the electroplating DC voltage is 1V-5V, and the electroplating current is 0.5-100A/dm ² Electroplating time is between 10s and 60 min; more preferably, the plating current is 2 to 65A/dm ² The electroplating time is between 10s and 5 min.

Example 2

The embodiment provides a plastic electroplated copper product and a preparation method thereof, wherein a polymer matrix in the embodiment adopts a PP porous sheet with the thickness of 0.8mm, and the preparation method of the plastic part product comprises the following steps:

(1) Preparing Ti with mass concentration of 1mg/ml ₃ C ₂ T _x An aqueous dispersion to which 0.5% of a binder CMC was added;

(2) The Ti is treated with ₃ C ₂ T _x Spraying the aqueous dispersion liquid on the surface of the PP porous sheet through a spraying machine, naturally airing, placing in a vacuum oven, and vacuum drying at 50 ℃ for 4 hours to obtain a PP/MXene compound (shown in figure 7 a);

(3) Placing the dried PP/MXene compound in an electroplating device for copper electroplating treatment, wherein the specific copper electroplating process comprises the following steps:

a. preparing an electroplating solution formula of electrodeposited copper: copper sulfate pentahydrate with copper ion concentration of 80g/L, concentrated sulfuric acid with copper ion concentration of 100g/L, concentrated hydrochloric acid with copper ion concentration of 15mg/L, polyethylene glycol (PEG) 5mg/L, hydroxyethyl cellulose (HEC) 8mg/L, sodium polydithio-dipropyl Sulfonate (SP) 3mg/L, collagen: 10mg/L;

b. at an operating temperature of 50℃and a current density of 9A/dm ² Under the condition of 2V direct current deposition for 45s, forming an electroplated metal copper layer on the surface of the PP/MXene composite layer, and obtaining the electroplated copper plastic product after cleaning and drying.

In order to facilitate the display of the state of each layer of the plastic electroplated product of the invention, a part of the PP/MXene compound obtained in the step (2) is placed in a copper plating electroplating solution to obtain the plastic product with the conductive MXene layer on the upper part and the metal modification layer electroplated with copper on the lower part (as shown in fig. 7b and c), and the electroplated copper layer is uniformly distributed on the surface of the conductive MXene layer, has good binding force and is bent for multiple times (more than or equal to 20 times) without falling.

FIG. 8a shows a cross-sectional SEM photograph of the copper plated plastic product PP/MXene/Cu, which shows that the electroplated copper layer has a thickness of about 10 μm, and by means of an elemental distribution photograph, the Ti and F elements (FIGS. 8b and c) into MXene, as well as the electroplated copper layer Cu element (FIG. 8 d), which is intimately bonded to the conductive MXene layer, can be characterized.

The thickness range of the electroplated copper layer, in some embodiments, the electroplated metallic copper layer has a thickness of from 10nm to 500 μm, can be easily controlled by controlling electroplating process conditions, including temperature, current density, electroplating time, etc.

Example 3

The embodiment provides a plastic lead electroplating product and a preparation method thereof, similar to the embodiment 2, the PP/MXene compound is prepared by adopting the same method, the PP/MXene compound is placed in an electroplating device for lead electroplating treatment, and the specific lead electroplating process comprises the following steps:

a. Preparing an electroplating solution formula of electrodeposited lead: 15g/L of lead acetate, 25ml/L of titanium trichloride, 60g/L of ethylenediamine tetraacetic acid (EDTA), 120g/L of trisodium citrate and pH value of 9-10;

b. at a working temperature of room temperature and a current density of 2A/dm ² Under the condition of 2V direct current deposition for 5min, forming an electroplated metal lead layer on the surface of the PET/MXene composite layer, and obtaining the PET/MXene composite layer after cleaning and dryingTo the lead plated plastic plated product of the invention.

Example 4

The embodiment provides a plastic nickel electroplating product and a preparation method thereof, which are similar to the embodiment 2, the PP/MXene compound is prepared by adopting the same method, the PP/MXene compound is placed into an electroplating device for nickel electroplating treatment, a nickel electroplating layer is formed on the surface of the PP/MXene compound layer, and the nickel electroplating plastic electroplating product is obtained after cleaning and drying.

In other embodiments, the plated metal layer may be other metals suitable for plating in aqueous plating solutions, such as: chromium, zinc, cadmium, lead, gold, silver, platinum, iron, cobalt, manganese, antimony, bismuth, gallium, indium, thallium, palladium, rhenium, rhodium, osmium, iridium, niobium, tungsten. Specific electroplating conditions can be adjusted by one skilled in the art with limited experimental optimization depending on the specific implementation.

Example 5

The embodiment provides a specific plastic electroplating product and a preparation method thereof, wherein a PET film with the thickness of 10 mu m is selected as a polymer matrix in the embodiment, and the preparation method of the plastic electroplating product comprises the following steps:

(1) Preparing Ti with mass concentration of 2mg/ml ₃ C ₂ T _x Aqueous dispersion (without binder);

(2) A PET film having a thickness of 10 μm was impregnated with Ti ₃ C ₂ T _x After the water-based dispersion, the PET film is slowly pulled out of the water surface at a constant speed to ensure that Ti ₃ C ₂ T _x Two-dimensional Ti in aqueous dispersion ₃ C ₂ T _x Coating the PET film on the surface of the PET film under the action of the surface tension of the aqueous solution, naturally airing the pulled PET film, repeatedly lifting and drying for a plurality of times (5 times), placing the PET film in a vacuum oven, and vacuum drying for 4 hours at 50 ℃ to obtain a PET/MXene compound;

(3) The dried PET/MXene composite was placed in an electroplating apparatus for copper electroplating, and the specific copper electroplating process was similar to example 2, except that the electroplating current was 2A/dm ² ElectroplatingThe time was 30s, and a copper composite film PET/MXene/Cu was obtained as shown in FIG. 9 a.

Fig. 9a shows SEM images of the surface of the copper composite film, and it can be seen that the surface of the electroplated copper layer is smooth and flat, and the surface of the electroplated metallic copper layer has the characteristics of smoothness and compactness. FIG. 9b shows a cross-sectional SEM photograph of the copper composite film, and it can be seen that the conductive MXene layer has a thickness of about 1 μm and the electroplated copper layer has a thickness of about 1 μm. Fig. 9c shows that the electroplated copper layer has a smooth surface, illustrating that the metallic copper achieves uniform electroplating on the conductive MXene layer.

Example 6

This example provides another specific electroplated copper product and a method of making the same. Similar to example 5, except that the polymer film was coated with a high concentration of MXene dispersion (50 mg/ml) by doctor blade in this example. More specific steps include:

(1) Preparing Ti with mass concentration of 50mg/ml ₃ C ₂ T _x Aqueous dispersion (viscous slurry);

(2) The Ti is treated with ₃ C ₂ T _x The aqueous dispersion is coated on one side of the PET film by a scraper to form a layer of Ti ₃ C ₂ T _x Film, ti can be conveniently controlled by scraping the gap between PET films ₃ C ₂ T _x The thickness of the film is dried in vacuum for 4 hours at 50 ℃ to form a conductive MXene layer, and a PET/MXene composite layer is obtained;

(3) The dried PET/MXene composite layer was placed in an electroplating apparatus for electroplating, and the specific electroplating process was similar to example 2, except that the electroplating current was 65A/dm ² The plating time was 30 seconds to obtain a plated copper product of the invention (FIG. 10 a). As can be seen from a cross-sectional SEM photograph (FIG. 10 b), the electroplated copper layer has a thickness of about 10 μm and the conductive MXene layer has a thickness of about 3. Mu.m.

The dip-coating method of example 5 is more preferable than the spray-coating method of example 2 and the coating method of example 6 because during the process of the dip-coating, the film of the polymer matrix is pulled out of the liquid, and the surface tension of the liquid acts to orient and lay the two-dimensional sheets of MXene in the MXene dispersion on the surface of the polymer matrix, so that conductive MXene layers that can completely cover the surface of the polymer matrix and further coat the surface of the polymer matrix are obtained, and as shown in the schematic diagram of fig. 6, the MXene two-dimensional sheets are laid and overlapped on the surface of the polymerized matrix, forming an ultra-thin MXene layer, the thickness of which can be as low as several layers of MXene two-dimensional sheets, which can be adhered to the surface of the polymer matrix due to the flexibility of the MXene two-dimensional sheets.

Since Ti is ₃ C ₂ T _x Has good hydrophilicity, can be stably dispersed in an aqueous solution, and does not need the use of a dispersing agent. Conventional dispersants and binders are non-conductive components that, if added to the dispersion, can affect the conductive properties of the coated MXene layer and thus the surface plating effect of the MXene layer. Of course, the present invention does not exclude the addition of small amounts of binder to the MXene dispersion according to the actual needs.

Similarly, the PET/MXene composites obtained in this example were prepared by the methods of examples 3 and 4 to obtain plastic plated lead and nickel products, respectively.

Example 7

In the embodiment, the plastic electroplated copper product after the electroplated copper treatment is subjected to the electroplated lead treatment, and the electroplated metal lead layer is arranged on the surface of the electroplated metal copper layer. As shown in FIG. 11, a photograph of the composite PP/MXene/Cu/Pb with double-layer plated metal layer obtained after the surface plating of the plastic copper plating product PP/MXene/Cu in example 2 was given.

Comparative example 1

By adopting a method similar to that of the embodiment 5, replacing the MXene dispersion liquid with the graphene dispersion liquid to prepare a compound with a conductive graphene layer on the PET surface, electroplating copper under the same condition, wherein the cross section and the surface SEM (scanning electron microscope) photograph of an electroplated product are as shown in fig. 12, compact electroplating of metal copper is difficult to realize on the graphene layer surface, the binding force between the metal copper and the graphene layer is poor, the plating layer is easy to fall off and peel, a porous structure exists on the uneven surface of the electroplated copper layer, and the electroplating effect is poor.

Because the preparation method of the plastic electroplating product involves an electroplating process, namely, needs to be immersed in an aqueous electroplating solution for electroplating deposition, the conductive nucleation layer on the polymer matrix is required to have good hydrophilicity and conductivity. Although graphene is similar to MXene materials, has a two-dimensional lamellar structure, conductivity, conductive graphene (e.g., reduced mechanically exfoliated, electrochemically or chemically) is generally not hydrophilic; however, graphene oxide having hydrophilicity is not good in conductivity, and is difficult to apply to an electroplating process, or to obtain a good electroplated metal layer.

In addition, compared with graphene, the MXene material provided by the application is further different in that: (1) The surface of the MXene material is provided with rich functional groups, especially halogen-containing functional groups (such as-F). The nucleation overpotential of metal deposition can be reduced, the metal plating layer is promoted to uniformly grow, and a compact and uniform electroplated metal layer is obtained; (2) The MXene material is transition metal carbon and/or nitride, and the constituent elements comprise transition metal elements, when the MXene is used as a nucleating agent, the transition metal elements and the metallic copper have similar metallicity, so that a tightly-combined electroplated metal layer is formed.

In the specific embodiment of the invention, MXene Ti is adopted ₃ C ₂ T _x As the MXene material is a two-dimensional material, the MXene material has similar physical and chemical characteristics, such as hydrophilicity, abundant surface functional groups, conductivity and the like. In other embodiments, other types of MXene materials, such as Ti ₂ CT _x 、V ₂ CT _x 、Mo ₂ CT _x 、Nb ₂ CT _x 、Ta ₂ CT _x 、Ta ₃ C ₂ T _x 、Ta ₄ C ₃ T _x 、Ti ₄ C ₃ T _x Etc. It is reasonably expected that the same production of MXene Ti is possible ₃ C ₂ T _x The same technical effect. The application of these different types of MXene materials in the electroplating process of the non-conductive substrate is within the technical concept of the invention.

Since the metal plating layer is deposited and grown on the conductive MXene layer in the electroplating method of the invention, the type of the substrate material is not limited, that is, the electroplating method of the invention has universality, and the electroplating method of the invention can be performed on other non-polymer substrates such as metal, ceramic, glass materials and the like. The invention also provides an electroplated product, namely a composite material with an electroplated metal layer, which comprises a substrate, a conductive MXene layer on the surface of the substrate and an electroplated metal layer arranged on the surface of the conductive MXene layer. The substrate comprises: including metals, ceramics, glass, polymers.

The invention takes the MXene material with a two-dimensional structure as a nucleating agent for electroplating metal ion deposition, and has the advantages that the MXene material lamination with the two-dimensional structure can completely cover a non-conductive material matrix, the metal ions are nucleated and grown on the conductive MXene layer to avoid the gap exposure or hole defect on the surface of the non-conductive material, and the obtained electroplated metal layer has the characteristics of compactness and smoothness (see figure 9 c); that is, the electroplating method of the invention also solves the problem that the metal particles generated by the chemical plating or the magnetron sputtering or the vapor plating mode nucleate the conductive layer, and the non-conductive substrate is inevitably covered incompletely because the metal particles are discontinuously distributed on the non-conductive substrate, so that the electroplated metal layer has pores.

Example 8

The embodiment provides an electroplated copper composite material with a glass fiber fabric (GF) matrix, and the preparation method comprises the following steps:

(1) Preparing Ti with mass concentration of 1mg/ml ₃ C ₂ T _x An aqueous dispersion to which 0.5wt.% of binder CMC was added;

(2) Impregnating glass fiber braid with Ti ₃ C ₂ T _x Taking out the aqueous dispersion liquid, drying, soaking and drying again, and repeating for several times to form a conductive MXene layer on the surface layer of the glass fiber; in this example, the impregnation was three times, the drying was performed in a vacuum oven, and vacuum drying was performed at 50℃for 4 hours to obtain a GF/MXene complex;

(3) The dried GF/MXene composite was placed in an electroplating apparatus for copper electroplating, and the specific copper electroplating process was similar to example 2, except that the electroplating time was 3min, to obtain a GF/MXene/Cu composite material. Fig. 13 shows a photograph of the GF/MXene/Cu composite material, and it can be seen that the electroplated copper layer also achieves a uniform electroplating effect on a substrate of a fiberglass braid.

Example 9

The glass fiber braid of example 8 was replaced with a ceramic material, in one example an alumina ceramic, and a ceramic composite having an electroplated copper layer on the surface was obtained in a similar manner.

Example 10

The glass fiber braid of example 8 was replaced with a metallic material, in one embodiment a metallic nickel foil, and a similar approach was used to obtain a metallic nickel/MXene/copper structured composite metallic foil material.

Since the metal base itself has conductivity and can be directly plated, the metal base does not have a technical problem that it is difficult to plate. The electroplating method provides a solution for solving the problems that the non-conductive matrix is difficult to electroplate, or the electroplating process is complex and the energy consumption is high, greatly simplifies the electroplating process, obtains the composite material with the surface provided with the electroplated metal layer, and has wide application prospect in the industrial fields of automobiles, household appliances and the like.

The applicant has also found that when the MXene dispersion is composed of an MXene material and a solvent, without a binder, the planar substrate can be easily peeled off due to the excellent binding force of the electroplated metal layer with the conductive MXene layer, resulting in an electroplated product without the substrate, which is a metal foil containing the conductive MXene layer, as shown below by way of example:

example 11

This example provides a metal copper foil as an electroplated product and a method for preparing the same, which is coated on a polymer PET film by a doctor blade with a high concentration of MXene dispersion (50 mg/ml). More specific steps include:

(1) Preparing Ti with mass concentration of 50mg/ml ₃ C ₂ T _x Aqueous dispersion (in the form of a viscous slurry) in which the solvent is water and no binder;

(2) The Ti is treated with ₃ C ₂ T _x The aqueous dispersion was applied to one side of a PET film by doctor blade to form a layer of Ti ₃ C ₂ T _x Film, ti can be conveniently controlled by scraping the gap between PET films ₃ C ₂ T _x The thickness of the film is dried in vacuum for 4 hours at 50 ℃ to form a conductive MXene layer, and a PET/MXene composite layer is obtained;

(3) The dried PET/MXene composite layer is placed in an electroplating device for electroplating treatment, and the specific electroplating process steps are similar to those of the embodiment 2, wherein the electroplating time is 30s, an electroplated copper layer is formed on the surface of the PET/MXene composite layer, and after the PET/MXene/Cu composite layer is cleaned and dried, the composite PET/MXene/Cu is obtained.

For ease of illustration, in the electroplating step, half of the PET/MXene composite layer is placed in an electroplating apparatus for electroplating copper, and a photograph of the resulting product is shown in FIG. 14, where it can be seen that half of the black is the PET/MXene composite layer, where black is the conductive MXene layer; the other half of the metallic copper is an electroplated copper layer, and the matrix PET layer can be easily separated from the composite PET/MXene/Cu by tweezers, so that the metallic copper foil disclosed by the invention is obtained. The metal copper foil was complete and smooth in surface, and the thickness of the obtained metal copper foil was only 7 μm as measured by a thickness gauge (fig. 15). The substrate PET is separated, so that one side of the obtained metal copper foil is also provided with a conductive MXene layer, namely, the metal copper foil obtained by the method is provided with a metal copper surface on one side and a black MXene surface on the other side.

Fig. 16a shows SEM pictures of the surface of the metal copper foil, and it can be seen that the surface of the electroplated copper layer is smooth and flat. Since the method of the present invention is to obtain a metal copper foil by peeling off the base, the surface of the metal copper foil is inevitably able to detect the MXene material. FIGS. 16 b-c show metal copper foil surface element distribution tests (EDS) that characterize the Ti and F elements of MXene, demonstrating the presence of MXene material. That is, the metal copper foil of the present invention has a technical feature that the surface or the inside thereof contains an MXene material. The presence of M element and functional group elements in the MXene material can be detected by elemental analysis test characterization.

Example 12

This example provides another metal copper foil and a method for producing the same, similar to example 11, except that the MXene dispersion was sprayed on the base PP film by a spraying method, and the time for the copper plating was different, and more specific production method includes:

(1) Preparing Ti with mass concentration of 1mg/ml ₃ C ₂ T _x Aqueous dispersion (water as solvent, no binder);

(2) Spraying the dispersion liquid on one side or two side surfaces of a PP film with the thickness of 10 mu m by a spraying machine, naturally airing, placing in a vacuum oven, and vacuum drying for 4 hours at 50 ℃ to obtain a PP/MXene composite layer;

(3) Placing the dried PP/MXene composite layer into an electroplating device for electroplating treatment, wherein the specific electroplating process is similar to that of the embodiment 2, and the electroplating time is 1min, so as to obtain a composite PP/MXene/Cu;

(4) And stripping the PP film in the composite PP/MXene/Cu to obtain the metal copper foil. FIG. 17 shows a cross-sectional SEM photograph of the metal copper foil, and it can be seen that the conductive MXene layer has a thickness of about 1 μm and the electroplated copper layer has a thickness of about 2. Mu.m.

Example 13

In this embodiment, a conductive MXene layer is first prepared, and copper is electroplated on the conductive MXene layer to obtain a metal copper foil with a double-sided copper layer. More specific steps include:

(2) The Ti is treated with ₃ C ₂ T _x The aqueous dispersion was applied to one side of a PET film by doctor blade to form a layer of Ti ₃ C ₂ T _x Film, ti can be conveniently controlled by scraping the gap between PET films ₃ C ₂ T _x The thickness of the film, after vacuum drying for 4 hours at 50 ℃, a conductive MXene layer is formed,obtaining a PET/MXene composite layer;

(3) Stripping the PET film in the dried PET/MXene composite layer to obtain a conductive MXene layer;

(4) The conductive MXene layer was placed in an electroplating apparatus to perform an electroplating process, and the specific electroplating process steps were the same as in example 11, and metal copper was deposited on both sides of the conductive MXene layer by electroplating, to obtain a composite metal copper foil having a "sandwich structure" in which the conductive MXene layer was in the middle.

Example 14

The embodiment provides an application of the metal copper foil of the electroplated product as a current collector and an electrode plate. Specifically, the electrode sheet is a negative electrode sheet for a lithium metal battery, the surface of the metal copper foil containing the conductive MXene layer is coated with molten metal lithium or lithium alloy slurry, and after cooling, a lithium base layer is formed, so that the electrode sheet of the invention is obtained, as shown in fig. 18. The MXene in the conductive MXene layer 30 has lithium-philicity, can reduce the surface tension of molten metal lithium, so that the molten metal lithium can spread on the conductive MXene layer and form a lithium base layer after solidification. Wherein the thickness of the lithium base layer is between 1 μm and 100 μm, preferably between 1 μm and 10 μm.

Example 15

The embodiment provides an electrode sheet using the metal copper foil as a current collector, wherein molten metal lithium or lithium alloy slurry is coated on the surface of a metal copper layer of the metal copper foil, and a lithium base layer is formed after cooling, so that the electrode sheet is obtained, wherein the thickness of the lithium base layer is 1-100 μm, and preferably the thickness of the lithium base layer is 1-10 μm. More specific steps include:

(1) Putting 400mg of lithium metal block into a stainless steel crucible, and heating to 350 ℃ in an argon environment of a glove box to melt the lithium metal block into a liquid state;

(2) Adding 40mg of metal magnesium sheet into the liquid metal lithium, and then adding 50mg of MXene Ti ₃ C ₂ T _x Stirring and mixing the powder, melting the metal magnesium sheet to form liquid lithium magnesium alloy, and continuously stirring for about 30min to enable Ti to be obtained ₃ C ₂ T _x Uniformly dispersedObtaining gel-state mixed lithium slurry;

(3) And coating the mixed lithium slurry on the surface of the electroplated copper layer of the metal copper composite current collector through a scraper, and cooling to form a lithium base layer to obtain the electrode plate with the lithium base layer on the surface of the electroplated copper layer.

In other embodiments, a metallic lithium layer may be formed by adding an MXene material to liquid metallic lithium.

The effect of adding MXene material into liquid metal lithium or lithium alloy is to reduce the surface tension of the liquid metal lithium to form a semi-solid (gel state) compound, which can be simply coated on a metal compound current collector, and the thickness is controlled to obtain an ultrathin lithium base layer (1-5 μm). In addition, in the charge and discharge process of the lithium metal battery, along with repeated stripping and deposition of the metal lithium on the negative plate, the MXene material in the lithium base layer has a nucleation effect on the metal lithium, so that the nucleation overpotential of the metal lithium can be reduced, the nucleation point position of the metal lithium with the MXene is controlled, the controllable growth of the two-dimensional plate is based, the generation of sharp lithium dendrites is avoided, and the safety of the lithium metal battery is further improved. Examples of the preparation method and technical effects of the above-described ultra-thin lithium-based layer are described in patent applications 201911241973.3 and 201911242747.7 of the applicant. However, other methods, such as physical rolling, are used to compound metallic lithium or lithium alloy to the metallic copper current collector of the present invention, and the resulting electrode sheet is also within the technical concept of the present invention.

The electrode sheet in example 14 or 15 was assembled into a battery, specifically, a lithium metal battery was obtained.

The lithium metal electrode plate can also be used for a solid lithium metal battery, and specifically, the electrode plate, a solid electrolyte diaphragm and a positive electrode plate are assembled to obtain the solid lithium metal battery. In a preferred embodiment, the solid-state battery is provided with a positive electrode material selected from high nickel ternary positive electrode materials (LiNi _0.8 Co _0.1 Mn _0.1 O ₂ ，NCM811)。

The metal copper foil of the electroplated product can also replace the current metal copper foil current collector, and is used for the negative electrode current collector (the negative electrode material is graphite and/or silicon material) of the lithium ion battery, and the use amount of the metal copper is reduced, so that the cost of the battery is reduced, the weight of the battery is reduced, and the energy density of the lithium ion battery can be further improved.

Example 16

Because the metal copper foil and the MXene material have better electromagnetic shielding effect, the metal copper foil containing the conductive MXene layer can be used as an electromagnetic shielding material in the electromagnetic shielding field. That is, the present invention also provides an electromagnetic shielding material (electromagnetic shielding film) which is the metal copper foil containing the conductive MXene layer obtained by the present invention. The conductive MXene layer and the metal copper layer can cooperatively play an electromagnetic shielding effect.

In some embodiments, the copper-based layer of the electromagnetic shielding film has a thickness of from 4.5 μm to 100 μm; more preferably between 5 μm and 50 μm; more preferably between 5 μm and 20 μm; the thickness of the conductive MXene layer is between 3nm and 50 mu m; preferably between 10nm and 10 μm; more preferably between 100nm and 5 μm; still more preferably, between 200nm and 2 μm; more preferably between 500nm and 1 μm.

In a preferred embodiment, the copper base layer of the electromagnetic shielding film has a thickness of 10 μm and the conductive MXene layer has a thickness of 10 μm.

The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims

1. An electroplated product, said electroplated product comprising: a base; the conductive MXene layer is arranged on the surface of the substrate; and at least one electroplated metal layer arranged on the surface of the conductive MXene layer;

Or, a conductive MXene layer; and an electroplated metal layer disposed on at least one side of the surface of the conductive MXene layer;

wherein the conductive MXene layer comprises an MXene material.

2. The electroplated product of claim 1, wherein the MXene material has a chemical formula of M _n+1 X _n T _x Wherein M represents one or more of transition metal elements; x represents one or more of carbon, nitrogen or boron, and T represents a surface functional group; n is more than or equal to 1 and less than or equal to 4, x is more than or equal to 0 and less than or equal to 2; preferably, the M is selected from one or more of Ti, nb, ta, V, mo, zr;

and/or the mass content of the MXene material in the conductive MXene layer is between 30% and 100%; preferably 50% to 100%, more preferably 90% to 100%.

3. The electroplated product of claim 1, wherein the substrate is a non-conductive material; preferably, the non-conductive material is selected from a polymer, ceramic or glass; preferably, the polymer is selected from one or more of acrylonitrile-butadiene-styrene copolymer, polysulfone, polycarbonate, polypropylene, phenolic resin, phenolic glass fiber reinforced plastic, nylon, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polypropylene, polyvinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene, polyphenylene sulfide, polyphenylene oxide, polystyrene, polyamide and derivatives of the above polymers;

And/or the MXene material is selected from Ti ₃ C ₂ T _x 、Ti ₂ CT _x 、V ₂ CT _x 、Nb ₂ CT _x 、Mo ₂ CT _x 、Ti ₄ C ₃ T _x 、Ta ₂ CT _x 、Ta ₄ C ₃ T _x 、TiNbCT _x ；

And/or the material of the electroplated metal layer is selected from one or more of copper, nickel, chromium, zinc, cadmium, lead, gold, silver, platinum, iron, cobalt, manganese, antimony, bismuth, gallium, indium, thallium, palladium, rhenium, rhodium, osmium, iridium, niobium and tungsten.

4. The electroplated product of claim 1, wherein the conductive MXene layer has a thickness of from 1nm to 50 μιη; preferably between 3nm and 20 μm; preferably between 10nm and 10 μm; more preferably between 100nm and 5 μm; still more preferably, between 200nm and 2 μm;

and/or the thickness of the electroplated metal layer is 10nm to 50 μm; preferably between 100nm and 10 μm; more preferably between 100nm and 5 μm; still more preferably, between 200nm and 2 μm;

and/or the matrix is sheet-like, film-like, tubular, braid-like or mesh-like.

5. A method of producing an electroplated product as claimed in any one of claims 1 to 4, characterized in that the steps comprise:

and (3) a loading step: coating the surface of the matrix with an MXene material and a conductive MXene layer;

electroplating: and electroplating and depositing an electroplated metal layer on the surface of the conductive MXene layer.

6. The method of producing an electroplated product of claim 5, further comprising a peeling step of peeling the substrate after the loading step;

Or, the preparation method further comprises a stripping step after the electroplating step, and the substrate is stripped.

7. The method of producing an electroplated product according to claim 5 or 6, wherein the step of coating comprises the steps of: coating and/or spraying the MXene dispersion liquid on the substrate, and drying to obtain the conductive MXene layer;

or immersing, pulling and/or immersing the substrate from the MXene dispersion liquid, and forming the conductive MXene layer on the surface of the substrate after drying;

or, the surface of the substrate is contacted with the liquid phase interface of the MXene dispersion liquid, and the conductive MXene layer is formed on the surface of the substrate.

8. The method of producing an electroplated product of claim 7, wherein the solvent of the MXene dispersion is selected from one or more of water, alcohols; preferably, the alcohol is selected from one or more of ethanol, propanol, isopropanol and butanol;

and/or the concentration of MXene in the MXene dispersion is between 0.01mg/ml to 80mg/ml.

9. The method of producing an electroplated product of claim 7 or 8, wherein the MXene dispersion comprises a binder; preferably, the binder is selected from aqueous binders; more preferably, the aqueous binder is selected from one or more of LA133 aqueous binder, methylcellulose, polytetrafluoroethylene, polyvinyl alcohol, styrene-butadiene rubber, aqueous polyurethane;

Alternatively, the MXene dispersion is composed of an MXene material and a solvent.

10. Use of the electroplated product of any one of claims 1 to 5, or the electroplated product obtained by the preparation method of any one of claims 6 to 9, in automobiles, household appliances, energy storage devices.

11. An application of MXene material in non-conductive material interface electroplating or electroless plating.

12. A composite current collector, characterized in that it is an electroplated product according to any one of claims 1 to 5; or, the preparation method of the composite current collector includes the preparation method according to any one of claims 6 to 9.

13. A battery comprising the composite current collector of claim 12.