CN116820873A - Equipment monitoring method and device, electronic equipment and storage medium - Google Patents

Equipment monitoring method and device, electronic equipment and storage medium Download PDF

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Publication number
CN116820873A
CN116820873A CN202310573304.6A CN202310573304A CN116820873A CN 116820873 A CN116820873 A CN 116820873A CN 202310573304 A CN202310573304 A CN 202310573304A CN 116820873 A CN116820873 A CN 116820873A
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sensor
manufacturer
identifier
state
state information
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王其林
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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Abstract

The invention provides a device monitoring method, a device, electronic equipment and a storage medium, and relates to the technical field of device management, wherein the method comprises the following steps: acquiring a manufacturer configuration file corresponding to a bill of materials of target equipment; determining state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers; reading measurement data from the registers of the sensors according to the reading strategy corresponding to the state information; and acquiring monitoring information of the target equipment according to the measurement data. The invention can avoid the problem that effective data cannot be acquired or error data is acquired due to incorrect use of the sensor, and can ensure higher accuracy of the read measurement data while improving the flexibility of data reading, thereby improving the accuracy of equipment monitoring.

Description

Equipment monitoring method and device, electronic equipment and storage medium
Technical Field
The present invention relates to the field of device management technologies, and in particular, to a device monitoring method, a device, an electronic device, and a storage medium.
Background
The BMC (Baseboard Management Controller, baseboard control manager) can monitor the machine by the data measured by various sensors in the machine, and can automatically monitor all devices of the machine in real time even if the machine is not started, acquire monitoring information and feed back the monitoring information to operation and maintenance personnel so as to grasp the state of the machine in real time. Therefore, how to accurately acquire measurement data in a sensor so as to realize accurate monitoring of equipment is a technical problem to be solved at present.
In the prior art, after a sensor is manually configured, a unified data reading mode is adopted, namely, the BMC directly reads measurement data from the sensor, so that the accuracy of the measurement data is difficult to ensure, and further, the accurate monitoring of equipment is difficult to perform.
Disclosure of Invention
The invention provides a device monitoring method, a device, electronic equipment and a storage medium, which are used for solving the defect that in the prior art, the accuracy of measured data is difficult to guarantee, so that the accuracy of device monitoring is poor, and improving the accuracy of device monitoring is realized.
The invention provides a device monitoring method, which comprises the following steps:
acquiring a manufacturer configuration file corresponding to a bill of materials of target equipment;
Determining state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers;
reading measurement data from the registers of the sensors according to the reading strategy corresponding to the state information;
and acquiring monitoring information of the target equipment according to the measurement data.
According to the device monitoring method provided by the invention, the determining the state information of each sensor in the target device according to the vendor configuration file comprises the following steps:
analyzing a first manufacturer identification corresponding to each sensor from the manufacturer configuration file;
reading a second manufacturer identification corresponding to each sensor from a register of each sensor;
and matching the first manufacturer identification corresponding to each sensor with the second manufacturer identification corresponding to each sensor, and determining the state information of each sensor according to the matching result.
According to the device monitoring method provided by the invention, the state information of each sensor is determined according to the matching result, and the method comprises the following steps:
the following steps are performed for each of the sensors:
Under the condition that the matching result is that a first manufacturer identifier corresponding to the current sensor is matched with a second manufacturer identifier corresponding to the current sensor, testing the current measurement function of the current sensor according to measurement function test information corresponding to the current sensor in the manufacturer configuration file, and under the condition that the current measurement function of the current sensor is normal, determining that the state information of the current sensor comprises a normal state identifier; the normal state identifier is an identifier which is used for characterizing that manufacturer identifiers are correct and measuring functions are normal;
under the condition that the current measurement function of the current sensor is abnormal, determining that the state information of the current sensor comprises a first abnormal state identifier; the first abnormal state identifier is an identifier for characterizing that manufacturer identifiers are correct and measuring functions are abnormal;
determining that the state information of the current sensor comprises a second abnormal state identifier under the condition that the matching result is that the first manufacturer identifier corresponding to the current sensor is not matched with the second manufacturer identifier corresponding to the current sensor; the second abnormal state identifier is an identifier for characterizing vendor identification abnormality.
According to the method for monitoring equipment provided by the invention, according to the reading strategy corresponding to the state information, the reading of the measurement data from the register of each sensor comprises the following steps:
the following steps are performed for each of the sensors:
under the condition that the state information of the current sensor comprises the normal state identifier, directly reading measurement data from the current sensor;
and under the condition that the state information of the current sensor comprises a first abnormal state identifier, maintaining the hardware of the current sensor until the hardware of the sensor is recovered to be normal, and reading measurement data from the maintained current sensor.
According to the device monitoring method provided by the invention, the method further comprises the following steps:
determining a target structure body corresponding to the equipment type of the target equipment in a shared memory;
encoding the state information of each sensor and the position information of each sensor to obtain a state encoding value corresponding to each sensor;
determining the insertion position of the state code corresponding to each sensor in the target structure according to the type of each sensor;
and synchronizing the state code and the product model corresponding to each sensor into the target structural body according to the insertion position.
According to the device monitoring method provided by the invention, the method further comprises the following steps:
in the case of determining that the measurement data read from any one of the sensors is abnormal, determining a state code corresponding to the any one of the sensors in the target structure according to the product model corresponding to the any one of the sensors;
determining the fault type and the fault position of any sensor according to the state code corresponding to any sensor;
and carrying out fault maintenance on any sensor according to the fault type and the fault position of the any sensor.
According to the device monitoring method provided by the invention, the method further comprises the following steps:
under the condition that an updating instruction of the bill of materials is received, obtaining the model of the product to be updated corresponding to each sensor according to the updating instruction;
according to the product model to be updated, updating the product model corresponding to each sensor in the bill of materials to obtain an updated bill of materials;
the obtaining the vendor configuration file corresponding to the bill of materials of the target device includes:
and acquiring the manufacturer configuration file in a manufacturer configuration file library according to the updated product model corresponding to each sensor in the updated bill of materials.
The invention also provides a device monitoring apparatus, comprising:
the acquisition module is used for acquiring manufacturer configuration files corresponding to the bill of materials of the target equipment;
the determining module is used for determining the state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers;
the reading module is used for reading the measurement data from the registers of the sensors according to the reading strategy corresponding to the state information;
and the monitoring module is used for acquiring the monitoring information of the target equipment according to the measurement data.
The invention also provides an electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the device monitoring method as described in any of the above when executing the program.
The invention also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a device monitoring method as described in any of the above.
The invention also provides a computer program product comprising a computer program which when executed by a processor implements a device monitoring method as described in any of the above.
According to the equipment monitoring method, the equipment monitoring device, the electronic equipment and the storage medium, the state information of each sensor in the target equipment is determined according to the manufacturer configuration file, so that the data reading strategy of each sensor is adaptively determined according to the state information of each sensor, and the measured data is adaptively read from the register of each sensor according to the corresponding data reading strategy, so that the problem that effective data cannot be obtained or error data cannot be obtained due to incorrect use of the sensor is avoided, the data reading flexibility is improved, the read measured data can be ensured to have higher accuracy, and the equipment monitoring accuracy is improved.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a device monitoring method according to the present invention;
FIG. 2 is a second flow chart of the device monitoring method according to the present invention;
FIG. 3 is a schematic diagram of the device monitoring apparatus provided by the present invention;
fig. 4 is a schematic structural diagram of an electronic device provided by the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the prior art, after a sensor is manually configured, the BMC directly reads measurement data from the sensor, so that whether the measurement data of the sensor are accurate or not cannot be ensured, and the accuracy of equipment monitoring is poor.
In order to solve the above-mentioned problems, the present embodiment provides a device monitoring method, which determines, according to a vendor configuration file, status information of each sensor in a target device, so as to adaptively determine a data reading policy according to the status information of each sensor, and reads measurement data from a register of each sensor according to a corresponding data reading policy, so as to improve flexibility of data reading, and simultaneously ensure that the read measurement data has higher accuracy, thereby improving accuracy of device monitoring.
The device monitoring method of the present invention is described below with reference to fig. 1-2, and the execution subject of the method may be a BMC or other control manager, which is not specifically limited in this embodiment.
As shown in fig. 1, one of the flow diagrams of the device monitoring method provided in this embodiment is shown, and the method includes the following steps:
step 101, obtaining a manufacturer configuration file corresponding to a bill of materials of target equipment;
the target device may be a server, a network device, a storage device, or the like, which is not particularly limited in the present invention.
The Bill of materials (BOM) includes information of the product model number, specification, number, etc. of all the components in the target device.
The vendor configuration file at least includes performance parameters, vendor identification, and functional test information of each component, which is not specifically limited in this embodiment. The vendor configuration files herein may be stored in a configuration file library in the format of a config file or an xml file, etc.
Alternatively, the corresponding vendor configuration file may be obtained by matching from the configuration file library according to the product model of each component in the bill of materials. A one-to-one mapping relation is constructed between each product model and the manufacturer configuration file in advance.
Step 102, determining state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers;
the sensor may be a temperature sensor, a voltage sensor, a current sensor, or the like, which is not particularly limited in this embodiment.
Optionally, after the vendor configuration file corresponding to the bill of materials of the target device is obtained, the state of each sensor may be identified according to one or more combinations of performance parameters, vendor identifiers and functional test information of each component in the vendor configuration file, so as to obtain the state information of each sensor. The state of each sensor is identified according to manufacturer identification to obtain state information; or firstly carrying out primary identification on the state of each sensor according to manufacturer identification, then carrying out secondary identification on the state of each sensor according to functional test information, and finally determining state information by combining the primary identification result and the secondary identification result.
Here, the state information may be divided into a normal read state and a plurality of abnormal read states.
Step 103, reading measurement data from the registers of the sensors according to the reading strategy corresponding to the state information;
Optionally, when the status information is obtained, it may be determined whether each sensor has a data reading condition, that is, whether the data measured in each sensor is valid;
when it is determined that any one of the sensors is in a normal state, that is, the data measured in the sensor is valid, according to the state information, the measured data can be directly read from the register of the sensor; when it is determined that the sensor is in an abnormal state, that is, when the data measured in the sensor is invalid, based on the state information, the measured data may be read from the register after the sensor is maintained, or a new sensor having a data reading condition may be added to read the data from the new sensor instead of the data reading.
Compared with the prior art adopting a unified data reading mode, in the embodiment, the data reading strategy can be adaptively determined according to the state information of each sensor, so that the problem that effective data cannot be obtained or error data cannot be obtained due to incorrect use of the sensors is avoided, and the accuracy of measured data is further ensured.
And 104, acquiring monitoring information of the target equipment according to the measurement data.
The monitoring information is used for monitoring whether the target equipment has abnormal operation conditions or not.
Optionally, after the measurement data is acquired, the measurement data may be compared with a pre-configured standard measurement range, so as to determine whether an abnormal operation condition occurs in the target device according to a comparison result; or the measurement data is input into the monitoring model to perform nonlinear learning on the measurement data by the monitoring model, output monitoring information of the target device, and the like, which is not particularly limited in this embodiment.
According to the equipment monitoring method, the state information of each sensor in the target equipment is determined according to the manufacturer configuration file, so that the data reading strategy of each sensor is adaptively determined according to the state information of each sensor, and the measured data is adaptively read from the register of each sensor according to the corresponding data reading strategy, so that the problem that effective data cannot be obtained or error data cannot be obtained due to incorrect use of the sensor is avoided, the data reading flexibility is improved, meanwhile, the read measured data can be ensured to have higher accuracy, and the equipment monitoring accuracy is further improved.
In some embodiments, the step of determining the status information of each sensor in the target device in step 102 according to the vendor configuration file further includes:
Analyzing a first manufacturer identification corresponding to each sensor from the manufacturer configuration file;
reading a second manufacturer identification corresponding to each sensor from a register of each sensor;
and matching the first manufacturer identification corresponding to each sensor with the second manufacturer identification corresponding to each sensor, and determining the state information of each sensor according to the matching result.
Since the monitoring information of the BMC for the target device is determined based on the measurement data parsed from the corresponding sensor. For example, the temperature monitoring information of the BMC for the target device is determined based on measurement data obtained by data analysis of the temperature sensor. When there is an inconsistency between the sensor and BOM requirements used or replaced in the target device, there may be problems with operating the sensor directly, and the operation may be different due to the inconsistent configuration and functionality of the different sensors. Thus, read anomalies or no read situations can occur when there is an inconsistency between the sensor used or replaced in the target device and the BOM requirements.
To sum up, in order to improve the monitoring result, it is necessary to ensure that the measurement data obtained by parsing from the sensor is valid, that is, to avoid that the acquired data has an abnormality (such as failure or error), before the measurement data is read, the state information of the sensor needs to be determined, so that the data is read only when the sensor to be adopted is in a state matched with the BOM, so as to ensure the validity of the measurement data, otherwise, the obtained data cannot be judged to be valid, finally, the data obtained by the BMC is inaccurate, and the accuracy of the monitoring information cannot be ensured. This embodiment
As shown in fig. 2, the step of determining the status information of the sensor specifically includes:
step 201, importing a vendor configuration file corresponding to a bill of materials of a target device, analyzing a first vendor identifier (hereinafter also referred to as a manufacturer ID) corresponding to each sensor from the vendor configuration file, and reading a second vendor identifier corresponding to each sensor from a register of each sensor;
step 202, matching a first manufacturer identifier corresponding to each sensor with a second manufacturer identifier;
and 203, determining state information of each sensor according to the matching result.
For each sensor, determining the state information of the sensor may be performed by determining, according to a matching result, whether the sensor used by a current component in the target device meets a bill of materials requirement, directly determining that the state information of the sensor is in a normal reading state when the sensor meets the bill of materials requirement, directly reading measurement data from a register of the sensor, directly determining that the state information of the sensor is in an abnormal reading state when the sensor does not meet the bill of materials requirement, and not directly reading measurement data from the sensor, or performing maintenance on the sensor and then reading measurement data from the register of the sensor, or not performing data reading on the sensor, but adding a new sensor with a data reading condition to perform data reading from the new sensor;
Or, according to the matching result, firstly judging whether the sensor used by the current component in the target equipment meets the bill of materials requirement, and further testing the performance of the sensor under the condition that the sensor meets the bill of materials requirement, and after the performance test of the sensor is passed, determining that the state information of the sensor is in a normal reading state; when the performance test of the sensor fails or does not meet the bill of materials requirement, the state information of the sensor is determined to be in an abnormal reading state, and the sensor can be maintained and then the measured data can be read from a register of the sensor, or a new sensor with data reading conditions is added to read the data from the new sensor instead of the data reading of the sensor.
According to the method provided by the embodiment, the status information of each sensor can be rapidly and accurately determined through manufacturer identification matching, so that measurement data can be adaptively read from each sensor according to the status information, the conditions of error, invalidity or mismatching of the read measurement data or the actual measurement data caused by mismatching of the sensor and the bill of materials are avoided, the accuracy of the measurement data reading can be effectively improved, and the accuracy of equipment monitoring is further provided.
In some embodiments, the step of determining the status information of each sensor according to the matching result in step 203 further includes:
the following steps are performed for each of the sensors:
under the condition that the matching result is that a first manufacturer identifier corresponding to the current sensor is matched with a second manufacturer identifier corresponding to the current sensor, testing the current measurement function of the current sensor according to measurement function test information corresponding to the current sensor in the manufacturer configuration file, and under the condition that the current measurement function of the current sensor is normal, determining that the state information of the current sensor comprises a normal state identifier; the normal state identifier is an identifier which is used for characterizing that manufacturer identifiers are correct and measuring functions are normal;
under the condition that the current measurement function of the current sensor is abnormal, determining that the state information of the current sensor comprises a first abnormal state identifier; the first abnormal state identifier is an identifier for characterizing that manufacturer identifiers are correct and measuring functions are abnormal;
determining that the state information of the current sensor comprises a second abnormal state identifier under the condition that the matching result is that the first manufacturer identifier corresponding to the current sensor is not matched with the second manufacturer identifier corresponding to the current sensor; the second abnormal state identifier is an identifier for characterizing vendor identification abnormality.
Optionally, the following steps are performed for each sensor:
in order to further ensure accuracy of reading measurement data, if the matching result is that the first manufacturer identifier corresponding to the current sensor is matched with the second manufacturer identifier corresponding to the current sensor, the sensor is characterized to meet the bill of materials requirement, but measurement performance is unknown, measurement function test information corresponding to the current sensor needs to be further analyzed from the manufacturer configuration file, so that the current measurement data of the current sensor is compared with an expected data range in the measurement function test information, and the measurement function of the current sensor is tested according to the comparison result.
And if the comparison result is that the current measurement data of the current sensor is in the expected data range in the measurement function test information, the measurement function of the current sensor is normal, and if the comparison result is that the current measurement data of the current sensor is not in the expected data range in the measurement function test information, the measurement function of the current sensor is abnormal.
Under the condition that the first manufacturer identifier corresponding to the current sensor is matched with the second manufacturer identifier and the measurement function of the current sensor is normal, the state information of the current sensor can be determined to comprise the normal state identifier. Here, the normal status identifier is preset according to the requirement, for example, 0, and is used for characterizing that the manufacturer identifier is correct and the measurement function is normal, that is, the first manufacturer identifier for marking the current sensor is matched with the second manufacturer identifier, and the measurement function is normal.
Under the condition that the first manufacturer identifier corresponding to the current sensor is matched with the second manufacturer identifier and the measurement function of the current sensor is abnormal, the state information of the current sensor can be determined to comprise the first abnormal state identifier. Here, the first abnormal state identifier is preset according to the requirement, for example, 1, is used for characterizing that the manufacturer identifier is correct and measuring the identifier with abnormal function, that is, is used for marking that the first manufacturer identifier of the current sensor is matched with the second manufacturer identifier, but the measuring function is abnormal.
In the case that the first vendor identifier corresponding to the current sensor does not match the second vendor identifier, it may be determined that the state information of the current sensor includes the second abnormal state identifier. Here, the second abnormal state identifier is preset according to the requirement, for example, 2, and is used for marking that the first manufacturer identifier and the second manufacturer identifier of the current sensor are not matched.
According to the method provided by the embodiment, the manufacturer identification matching and the measurement function testing information are combined in the manufacturer configuration file, so that the state information of each sensor is jointly determined, various abnormal states are accurately positioned, the acquired state information is more accurate, and the equipment monitoring accuracy is effectively improved.
In some embodiments, the reading measurement data from the registers of each sensor according to the reading policy corresponding to the state information includes:
the following steps are performed for each of the sensors:
under the condition that the state information of the current sensor comprises the normal state identifier, directly reading measurement data from the current sensor;
and under the condition that the state information of the current sensor comprises a first abnormal state identifier, maintaining the hardware of the current sensor until the hardware of the sensor is recovered to be normal, and reading measurement data from the maintained current sensor.
Optionally, after the status information of each sensor is obtained, different reading strategies may be determined for the status information of different sensors, so that measurement data read from each sensor is more accurate and effective, and the specific steps include:
the following steps are performed for each sensor:
firstly, determining an identifier contained in the state information of the current sensor, and under the condition that the state information of the current sensor comprises a normal state identifier, the manufacturer identifier representing the sensor is matched and the measuring function is normal, so that the measuring data can be directly read from the sensor.
Under the condition that the state information of the current sensor comprises a first abnormal state identifier, manufacturer identifiers representing the sensor are matched, but measuring functions are abnormal, hardware representing the sensor is abnormal, the hardware of the current sensor needs to be maintained, the hardware condition of the current sensor is continuously monitored until the hardware of the sensor is recovered to be normal, and measuring data is read from the maintained current sensor.
Under the condition that the state information of the current sensor comprises a second abnormal state identifier, the manufacturer identifier of the sensor is not matched, the sensor is characterized to not meet the BOM requirement, the first manufacturer identifier of the sensor can be verified again, under the condition that the first manufacturer identifier is correct, the reading of measurement data from the sensor is forbidden, or the reading of measurement data from the sensor is forbidden, a new sensor which is the same as the current sensor is added, and under the condition that the state information of the new sensor comprises a normal state identifier, the reading of measurement data from the new sensor is performed; under the condition that the first manufacturer identification is wrong, acquiring a manufacturer configuration file corresponding to a bill of materials of the target equipment again, analyzing the first manufacturer identification from the latest acquired manufacturer configuration file again to determine the latest state information of the current sensor, and under the condition that the latest state information of the current sensor comprises a normal state identification, reading measurement data from the sensor; in the case that the latest state information of the current sensor includes the second abnormal state identification, measurement data reading from the sensor or measurement data reading from a new sensor is prohibited.
According to the method provided by the embodiment, the measurement data is adaptively read from each sensor by adopting different data reading modes according to different state information, and particularly the problem of measurement data abnormality caused by mismatching of the sensors adopted by component monitoring and measurement function abnormality can be rapidly eliminated in the early stage of testing, so that the accuracy of measurement data reading is effectively improved, and the accuracy of equipment monitoring is further improved.
In some embodiments, the method further comprises:
determining a target structure body corresponding to the equipment type of the target equipment in a shared memory;
encoding the state information of each sensor and the position information of each sensor to obtain a state encoding value corresponding to each sensor;
determining the insertion position of the state code corresponding to each sensor in the target structure according to the type of each sensor;
and synchronizing the state code and the product model corresponding to each sensor into the target structural body according to the insertion position.
Different structures are built in the shared memory in advance for different device types. And the insertion positions of the variable values in each structure are configured according to different types of sensors. For a certain structure, the 1 st to 3 rd fields in the structure are used for storing variables corresponding to the temperature sensor, variables corresponding to the voltage sensor and variables corresponding to the current sensor in sequence; correspondingly, the insertion position of the variable value corresponding to the temperature sensor is the 1 st field, and the insertion position of the variable value corresponding to the voltage sensor is the 2 nd field.
Optionally, after the status information of each sensor is acquired, a target structure corresponding to the device type of the target device may be determined in the shared memory.
Simultaneously, the state information of each sensor and the position information of each sensor are encoded to obtain a state encoding value corresponding to each sensor;
then, according to the types of the sensors, the insertion positions of the state codes corresponding to the sensors are determined in a target structure body, the product model of each sensor is used as a variable name, the state code value corresponding to each sensor is used as a variable value, and the state codes and the product model corresponding to each sensor are synchronized into the target structure body according to the corresponding insertion positions, so that maintenance personnel can search and acquire the states of the sensors in a shared memory in real time, and further, when the measured data read from each sensor is abnormal, the fault type of each sensor can be rapidly determined, and the maintenance efficiency is improved.
In some embodiments, the method further comprises:
in the case of determining that the measurement data read from any one of the sensors is abnormal, determining a state code corresponding to the any one of the sensors in the target structure according to the product model corresponding to the any one of the sensors;
Determining the fault type and the fault position of any sensor according to the state code corresponding to any sensor;
and carrying out fault maintenance on any sensor according to the fault type and the fault position of the any sensor.
Optionally, since the product model and the state code value of each sensor are correspondingly stored by taking the variable name and the variable value as a group member, when it is determined that the measured data read from any sensor is abnormal, the state code corresponding to the sensor can be determined in the target structure body according to the product model corresponding to the sensor, the state code corresponding to the sensor is decoded, the position information and the state information of the sensor can be obtained, the fault type of the sensor is obtained according to the state information, and the fault position of the sensor is obtained according to the position information.
After the fault position and the fault type of the sensor are obtained, the fault position and the fault type can be sent to the client, so that maintenance personnel can quickly position the fault sensor and make a maintenance strategy according to the fault position and the fault type, the fault maintenance efficiency is improved, the sensor can be quickly recovered and put into use, and the equipment monitoring efficiency is further improved.
In some embodiments, the method further comprises:
under the condition that an updating instruction of the bill of materials is received, obtaining the model of the product to be updated corresponding to each sensor according to the updating instruction;
according to the product model to be updated, updating the product model corresponding to each sensor in the bill of materials to obtain an updated bill of materials;
the obtaining the vendor configuration file corresponding to the bill of materials of the target device includes:
and acquiring the manufacturer configuration file in a manufacturer configuration file library according to the updated product model corresponding to each sensor in the updated bill of materials.
The update instruction is an instruction for updating the bill of materials. The instruction may be a user input entered at a client interface of the controller or may be information generated under certain conditions by other controllers, such as a timed trigger update instruction. The user input may be an instruction input by touch input, drop-down selection input, voice input, gesture input, visual input, brain-computer input, or the like.
Optionally, monitoring an update instruction of the bill of materials in real time, and analyzing the model of the product to be updated corresponding to each sensor from the update instruction under the condition that the update instruction of the bill of materials is monitored; or analyzing the update identification from the update instruction, and acquiring the product model to be updated corresponding to each sensor according to the update identification, the mapping relation between the update identification and the product model and the mapping relation between the update identification and the sensors, which is not particularly limited in the embodiment.
After the product model to be updated corresponding to each sensor is obtained, an updating operation can be performed on the product model corresponding to each sensor in the bill of materials according to the product model to be updated corresponding to each sensor, so that the product model of each sensor can be adaptively increased or changed along with an updating instruction, correspondingly, after the product model of each sensor is adaptively increased or changed along with the bill of materials, the corresponding manufacturer configuration file can be adaptively increased and changed according to the updated product model (i.e. the product model after being increased or changed) corresponding to each sensor, the sensors of different manufacturers or the sensors of multiple manufacturers can be supported simultaneously, the replacement of the subsequent sensors can be conveniently supported, the redundancy of the sensors can be increased, and meanwhile, the flexibility can be improved, so that the flexibility and the accuracy of equipment monitoring can be further improved.
The device monitoring apparatus provided by the present invention will be described below, and the device monitoring apparatus described below and the device monitoring method described above may be referred to correspondingly.
As shown in fig. 3, an apparatus monitoring device provided in this embodiment includes:
the acquiring module 301 is configured to acquire a vendor configuration file corresponding to a bill of materials of the target device;
The determining module 302 is configured to determine status information of each sensor in the target device according to the vendor configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers;
the reading module 303 is configured to read measurement data from the registers of the sensors according to a reading policy corresponding to the status information;
the monitoring module 304 is configured to obtain monitoring information of the target device according to the measurement data.
According to the equipment monitoring device, the state information of each sensor in the target equipment is determined according to the manufacturer configuration file, so that the data reading strategy of each sensor is adaptively determined according to the state information of each sensor, and the measured data is adaptively read from the register of each sensor according to the corresponding data reading strategy, so that the problem that effective data cannot be obtained or error data cannot be obtained due to incorrect use of the sensor is avoided, the data reading flexibility is improved, the read measured data can be ensured to have higher accuracy, and the equipment monitoring accuracy is further improved.
In some embodiments, the determining module is specifically configured to:
Analyzing a first manufacturer identification corresponding to each sensor from the manufacturer configuration file;
reading a second manufacturer identification corresponding to each sensor from a register of each sensor;
and matching the first manufacturer identification corresponding to each sensor with the second manufacturer identification corresponding to each sensor, and determining the state information of each sensor according to the matching result.
In some embodiments, the determining module is further to:
the following steps are performed for each of the sensors:
under the condition that the matching result is that a first manufacturer identifier corresponding to the current sensor is matched with a second manufacturer identifier corresponding to the current sensor, testing the current measurement function of the current sensor according to measurement function test information corresponding to the current sensor in the manufacturer configuration file, and under the condition that the current measurement function of the current sensor is normal, determining that the state information of the current sensor comprises a normal state identifier; the normal state identifier is an identifier which is used for characterizing that manufacturer identifiers are correct and measuring functions are normal;
under the condition that the current measurement function of the current sensor is abnormal, determining that the state information of the current sensor comprises a first abnormal state identifier; the first abnormal state identifier is an identifier for characterizing that manufacturer identifiers are correct and measuring functions are abnormal;
Determining that the state information of the current sensor comprises a second abnormal state identifier under the condition that the matching result is that the first manufacturer identifier corresponding to the current sensor is not matched with the second manufacturer identifier corresponding to the current sensor; the second abnormal state identifier is an identifier for characterizing vendor identification abnormality.
In some embodiments, the reading module is specifically configured to:
the following steps are performed for each of the sensors:
under the condition that the state information of the current sensor comprises the normal state identifier, directly reading measurement data from the current sensor;
and under the condition that the state information of the current sensor comprises a first abnormal state identifier, maintaining the hardware of the current sensor until the hardware of the sensor is recovered to be normal, and reading measurement data from the maintained current sensor.
In some embodiments, the apparatus further comprises a storage module for:
determining a target structure body corresponding to the equipment type of the target equipment in a shared memory;
encoding the state information of each sensor and the position information of each sensor to obtain a state encoding value corresponding to each sensor;
Determining the insertion position corresponding to each sensor in the target structure according to the type of each sensor;
and synchronizing the state code and the product model corresponding to each sensor into the target structural body according to the insertion position.
In some embodiments, the apparatus further comprises a fault maintenance module for:
in the case of determining that the measurement data read from any one of the sensors is abnormal, determining a state code corresponding to the any one of the sensors in the target structure according to the product model corresponding to the any one of the sensors;
determining the fault type and the fault position of any sensor according to the state code corresponding to any sensor;
and carrying out fault maintenance on any sensor according to the fault type and the fault position of the any sensor.
In some embodiments, the apparatus further comprises an update module for:
under the condition that an updating instruction of the bill of materials is received, obtaining the model of the product to be updated corresponding to each sensor according to the updating instruction;
according to the product model to be updated, updating the product model corresponding to each sensor in the bill of materials to obtain an updated bill of materials;
The obtaining the vendor configuration file corresponding to the bill of materials of the target device includes:
and acquiring the manufacturer configuration file in a manufacturer configuration file library according to the updated product model corresponding to each sensor in the updated bill of materials.
Fig. 4 illustrates a physical schematic diagram of an electronic device, as shown in fig. 4, which may include: a processor (processor) 401, a communication interface (Communications Interface) 402, a memory (memory) 403 and a communication bus 404, wherein the processor 401, the communication interface 402 and the memory 403 complete communication with each other through the communication bus 404. The processor 401 may call logic instructions in the memory 403 to perform a device monitoring method, the method comprising: acquiring a manufacturer configuration file corresponding to a bill of materials of target equipment; determining state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers; reading measurement data from the registers of the sensors according to the reading strategy corresponding to the state information; and acquiring monitoring information of the target equipment according to the measurement data.
Further, the logic instructions in the memory 403 may be implemented in the form of software functional units and stored in a computer readable storage medium when sold or used as a stand alone product. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
In another aspect, the present invention also provides a computer program product comprising a computer program, the computer program being storable on a non-transitory computer readable storage medium, the computer program, when executed by a processor, being capable of performing the device monitoring method provided by the methods described above, the method comprising: acquiring a manufacturer configuration file corresponding to a bill of materials of target equipment; determining state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers; reading measurement data from the registers of the sensors according to the reading strategy corresponding to the state information; and acquiring monitoring information of the target equipment according to the measurement data.
In yet another aspect, the present invention also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, is implemented to perform the device monitoring method provided by the above methods, the method comprising: acquiring a manufacturer configuration file corresponding to a bill of materials of target equipment; determining state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers; reading measurement data from the registers of the sensors according to the reading strategy corresponding to the state information; and acquiring monitoring information of the target equipment according to the measurement data.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on this understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective embodiments or some parts of the embodiments.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A method of device monitoring, comprising:
acquiring a manufacturer configuration file corresponding to a bill of materials of target equipment;
determining state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers;
reading measurement data from the registers of the sensors according to the reading strategy corresponding to the state information;
and acquiring monitoring information of the target equipment according to the measurement data.
2. The device monitoring method according to claim 1, wherein determining status information of each sensor in the target device according to the vendor profile comprises:
analyzing a first manufacturer identification corresponding to each sensor from the manufacturer configuration file;
reading a second manufacturer identification corresponding to each sensor from a register of each sensor;
and matching the first manufacturer identification corresponding to each sensor with the second manufacturer identification corresponding to each sensor, and determining the state information of each sensor according to the matching result.
3. The apparatus monitoring method according to claim 2, wherein the determining the status information of each of the sensors according to the matching result includes:
The following steps are performed for each of the sensors:
under the condition that the matching result is that a first manufacturer identifier corresponding to the current sensor is matched with a second manufacturer identifier corresponding to the current sensor, testing the current measurement function of the current sensor according to measurement function test information corresponding to the current sensor in the manufacturer configuration file, and under the condition that the current measurement function of the current sensor is normal, determining that the state information of the current sensor comprises a normal state identifier; the normal state identifier is an identifier which is used for characterizing that manufacturer identifiers are correct and measuring functions are normal;
under the condition that the current measurement function of the current sensor is abnormal, determining that the state information of the current sensor comprises a first abnormal state identifier; the first abnormal state identifier is an identifier for characterizing that manufacturer identifiers are correct and measuring functions are abnormal;
determining that the state information of the current sensor comprises a second abnormal state identifier under the condition that the matching result is that the first manufacturer identifier corresponding to the current sensor is not matched with the second manufacturer identifier corresponding to the current sensor; the second abnormal state identifier is an identifier for characterizing vendor identification abnormality.
4. The device monitoring method according to claim 3, wherein the reading measurement data from the register of each sensor according to the reading policy corresponding to the status information includes:
the following steps are performed for each of the sensors:
under the condition that the state information of the current sensor comprises the normal state identifier, directly reading measurement data from the current sensor;
and under the condition that the state information of the current sensor comprises a first abnormal state identifier, maintaining the hardware of the current sensor until the hardware of the sensor is recovered to be normal, and reading measurement data from the maintained current sensor.
5. The device monitoring method of any of claims 1-4, further comprising:
determining a target structure body corresponding to the equipment type of the target equipment in a shared memory;
encoding the state information of each sensor and the position information of each sensor to obtain a state encoding value corresponding to each sensor;
determining the insertion position corresponding to each sensor in the target structure according to the type of each sensor;
And synchronizing the state code and the product model corresponding to each sensor into the target structural body according to the insertion position.
6. The device monitoring method of claim 5, further comprising:
in the case of determining that the measurement data read from any one of the sensors is abnormal, determining a state code corresponding to the any one of the sensors in the target structure according to the product model corresponding to the any one of the sensors;
determining the fault type and the fault position of any sensor according to the state code corresponding to any sensor;
and carrying out fault maintenance on any sensor according to the fault type and the fault position of the any sensor.
7. The device monitoring method of any of claims 1-4, further comprising:
under the condition that an updating instruction of the bill of materials is received, obtaining the model of the product to be updated corresponding to each sensor according to the updating instruction;
according to the product model to be updated, updating the product model corresponding to each sensor in the bill of materials to obtain an updated bill of materials;
The obtaining the vendor configuration file corresponding to the bill of materials of the target device includes:
and acquiring the manufacturer configuration file in a manufacturer configuration file library according to the updated product model corresponding to each sensor in the updated bill of materials.
8. An appliance monitoring apparatus, comprising:
the acquisition module is used for acquiring manufacturer configuration files corresponding to the bill of materials of the target equipment;
the determining module is used for determining the state information of each sensor in the target equipment according to the manufacturer configuration file; the state information comprises a normal state identifier or one of a plurality of abnormal state identifiers;
the reading module is used for reading the measurement data from the registers of the sensors according to the reading strategy corresponding to the state information;
and the monitoring module is used for acquiring the monitoring information of the target equipment according to the measurement data.
9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the device monitoring method of any one of claims 1 to 7 when the program is executed by the processor.
10. A non-transitory computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when executed by a processor, implements the device monitoring method according to any one of claims 1 to 7.
CN202310573304.6A 2023-05-19 2023-05-19 Equipment monitoring method and device, electronic equipment and storage medium Pending CN116820873A (en)

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CN202310573304.6A CN116820873A (en) 2023-05-19 2023-05-19 Equipment monitoring method and device, electronic equipment and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310573304.6A CN116820873A (en) 2023-05-19 2023-05-19 Equipment monitoring method and device, electronic equipment and storage medium

Publications (1)

Publication Number Publication Date
CN116820873A true CN116820873A (en) 2023-09-29

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Country Link
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