CN116820216A

CN116820216A - Laminated conduction type power supply unit, power supply system and server

Info

Publication number: CN116820216A
Application number: CN202310663700.8A
Authority: CN
Inventors: 罗嗣恒; 孔财
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2023-06-06
Filing date: 2023-06-06
Publication date: 2023-09-29

Abstract

The application relates to a laminated conductive power supply unit, a power supply system and a server. The laminated conductive power supply unit includes: a housing; the power motherboard is arranged at the bottom in the shell; a first golden finger is arranged on one side of the power motherboard, and protrudes out of the side wall of the shell; the power daughter card is arranged in the shell and is positioned on the power motherboard; the power daughter card is electrically connected with the power motherboard; a second golden finger is arranged on one side of the power supply sub-card, protrudes out of the side wall of the shell, and is positioned above the first golden finger; the first golden finger and the second golden finger can be electrically connected with a power connector at the same time. According to the application, the gold finger of the power supply unit is set to be of a laminated current conduction structure, so that high-power supply of the power distribution main board is realized, and the power supply requirement of the power distribution main board on high-power utilization components is met.

Description

Laminated conduction type power supply unit, power supply system and server

Technical Field

The present application relates to the technical field of stacked conductive power supply units, and in particular, to a stacked conductive power supply unit, a power supply system, and a server.

Background

With the continuous rise of cloud computing and AI technology, the internet traffic is continuously increasing. Higher requirements are put on the data processing capacity and the storage capacity of the server of the data center machine room. As a unit-server cabinet system in a traditional machine room, data processing capability of server computing nodes deployed inside a cabinet is required to be stronger and deployment density is higher and higher.

As internet user traffic grows, so does network data throughput, so does the workload of servers acting as the basic data processing unit of the data center. Particularly, the working load current of a Central Processing Unit (CPU) chip and a Graphic Processing Unit (GPU) component inside the server is larger and larger, and the working current of a single CPU chip can reach 300A to 600A.

The current server power supply structure adopts a 12V direct-input power distribution main board of a Power Supply Unit (PSU), and the power is transferred to components such as a Central Processing Unit (CPU) chip, a memory, a pattern processor (GPU) and the like through an Electronic Fuse (EFUSE).

With the increase of power consumption of data computing processing core components such as a Central Processing Unit (CPU) chip and a Graphic Processing Unit (GPU), the overall power consumption of the server is also increased, and the limitation on the structural size of the cabinet and the servers deployed therein is stricter due to the size and cost of a data center machine room. As such, there are increasingly stringent size constraints on PSUs within servers and power distribution hosts.

In order to keep the continuity of server products in a chassis mechanism, the data center meets the severe requirements on the structural size of the server, and meanwhile, a Central Processing Unit (CPU) chip and a pattern processor (GPU) component which support higher operation capability and higher power consumption are considered. Therefore, how to implement the internal Power Supply Unit (PSU) and the high power energy transfer from the Power Supply Unit (PSU) to the board end while maintaining the existing server chassis structure unchanged and the 12V board-level power supply structure presents a great challenge.

Disclosure of Invention

Based on the above, a stacked conduction type power supply unit, a power supply system and a server are provided, which can solve the problem of current flow bottleneck at the interconnection part of the current power supply unit and a power distribution main board.

In one aspect, there is provided a stacked conduction type power supply unit including:

A housing;

the power motherboard is arranged at the bottom in the shell; a first golden finger is arranged on one side of the power motherboard, and protrudes out of the side wall of the shell;

the power daughter card is arranged in the shell and is positioned on the power motherboard; the power daughter card is electrically connected with the power motherboard; a second golden finger is arranged on one side of the power supply sub-card, protrudes out of the side wall of the shell, and is positioned above the first golden finger;

the first golden finger and the second golden finger can be electrically connected with a power connector at the same time.

In one embodiment, an anode busbar and a cathode busbar are arranged between the power daughter card and the power motherboard to realize electrical connection.

In another aspect, a power supply system is provided that includes the laminated conductive power supply unit described above and a power connector.

In one embodiment, the power connector is provided with a power access face and a transfer output face; a first pair of connection terminals and a second pair of connection terminals extending from the power access face to the transfer output face are arranged in the power connector; and at one side of the power supply access surface, the pins of the first pair of connecting terminals are in butt joint with the first golden fingers, and the pins of the second pair of connecting terminals are in butt joint with the second golden fingers.

In one embodiment, the power supply access surface is one side surface of the power supply connector, and the transfer output surface is a bottom surface or a top surface of the power supply connector; alternatively, the power supply access surface and the transfer output surface are two side surfaces of the power supply connector respectively.

In one embodiment, the power supply system further comprises a power distribution motherboard; the power distribution main board is electrically connected with pins of the first pair of connecting terminals and the second pair of connecting terminals on the transfer output surface of the power connector.

In one embodiment, the power supply system further comprises a power supply busbar; one end of the power supply busbar is connected to the power distribution main board, and the other end of the power supply busbar is connected to electric equipment.

In one embodiment, the power supply busbar is provided with a copper bar main body and welding pins arranged at two ends of the copper bar main body, the copper bar main body is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction, and the welding pins are cylindrical.

In one embodiment, the power supply system further comprises an electronic fuse; the electronic fuse is arranged between the power supply busbar and the electric equipment.

In another aspect, a server is provided, which includes the power supply system and the electric equipment described above; the powered device includes at least one of a central processing unit, a memory, a pattern processor, a voltage regulator, or a fan.

According to the laminated conduction type power supply unit, the power supply system and the server, the gold finger of the power supply unit is set to be of the laminated current conduction structure, so that high-power supply from the power supply unit to the power distribution main board is realized, and the power supply requirement of the power distribution main board on high-power utilization components is met.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a power supply structure of a 2U universal server system in the prior art;

FIG. 2 is a schematic diagram of a prior art interconnection of a single PSU gold finger with a single PSU connector;

FIG. 3 is a schematic diagram showing a power supply unit with a power connector according to an embodiment of the present application, wherein the power supply unit is configured with a stacked current conducting structure;

FIG. 4 is a schematic diagram of a stacked conductive power supply unit according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a power connector according to an embodiment of the present application;

FIG. 6 is a schematic diagram illustrating a connection structure of a power supply system according to an embodiment of the application;

FIG. 7 is a schematic perspective view of a power bus bar according to an embodiment of the present application;

FIG. 8 is a schematic diagram of three different-shape power supply busbar configurations according to an embodiment of the present application;

fig. 9 is an internal structural diagram of a server in one embodiment of the present application.

Detailed Description

The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

Example 1

As described in the background art, as shown in fig. 1, a power supply structure of a 2U universal server system is schematically shown. The 12V of power module psu0\psu1 goes directly into the power distribution motherboard. The 12V is transferred out of the 12V0 through the electronic fuse EFUSE0 to supply power to the CPU0 VR\CPU1 VR\DDR VR0\DDR VR1\DDR VR2\DDR VR 3. The 12V is transferred out of the 12V1 through the electronic fuse EFUSE1 to supply power for PCIE equipment (such as GPU, network card and the like). The 12V is transferred out of the 12V2 via the electronic fuse EFUSE2 to power the hard disk array. The 12V is transferred out of the 12V_FAN through the FAN electronic fuse FAN EFUSE to supply power for the FAN FAN0\FAN1\FAN2\FAN3.

The PSU is called a power supply unit, the CPU is called a CPU, the GPU is called a pattern processor, the VR is called a voltage regulator, the EFUSE is called an electronic fuse, the BUSBAR is called a power supply BUSBAR, and the FAN is called a FAN. DDR is a shorthand for Double Data Rate, which is herein referred to as Double Rate.

Because the power consumption of the CPU, the memory, the GPU and the hard disk of the server is continuously increased, in order to take away more heat, so as to meet the heat dissipation requirement of the system, the power consumption of the system fan is also increased. Therefore, there are more through-flow bottlenecks on the PSU to the power distribution motherboard side and on the power distribution motherboard side 12V power supply path. As shown in fig. 1, the 4 positions (1), (2), (3), and (4).

Position (1): and the PSU is connected with the power distribution main board. Usually, the PSU with the golden finger is plugged into the PSU connector at the power distribution main board end. Because of the increase in power consumption of the whole machine, the current flowing through the position (1) is continuously increasing. As shown in fig. 2, the previous interconnection mode of the single PSU GOLD FINGER and the single PSU connector has the problem of insufficient through-flow of the PSU GOLD FINGER (GOLD FINGER).

Positions (2), (3), (4): because the public system interface (QPI) bus signal, the high-speed serial computer expansion bus standard (PCIE) signal and the DDR5 signal of the CPU occupy most space of the power distribution main board, the space reserved for the PCB copper foil through which current flows is limited. Where DDR5 is a computer memory specification. If the board layer is added, the cost of the power distribution main board is greatly increased and the structure of the chassis is adjusted. On the premise that the power distribution main board layer is not increased, along with the continuous increase of power consumption of PCIE equipment such as a GPU (peripheral component interconnect express), a CPU (central processing unit), a memory and a fan, the currents flowing through the positions (2), (3) and (4) can be large, and the large currents are conducted through the copper foil of the power distribution main board PCB, so that the through-flow problem exists.

Thus, in connection with fig. 1 and 2, the drawbacks of the prior art are: 1) Under the application scene of supporting a CPU, a GPU and a memory with higher power, a through flow bottleneck exists at the interconnection part of the PSU and the power distribution main board. 2) In the application scenario supporting higher power CPU, GPU and memory, the power supply distribution main board terminal is insufficient to pass through the PCB copper foil on the power supply paths of the CPU, the memory, the GPU and the fan.

As shown in fig. 3, fig. 3 is a schematic structural diagram of a power supply unit with a laminated current conducting structure and a power connector. In order to solve the problem that a through-flow bottleneck exists at the interconnection position of a Power Supply Unit (PSU) and a power distribution main board, the embodiment of the invention provides a stacked conductive power supply unit, and based on the existing power supply structure, the interconnection mode of the Power Supply Unit (PSU) and the power distribution main board adopts: the current conducting structure is laminated.

As shown in fig. 4, fig. 4 is a schematic structural view of a Power Supply Unit (PSU) of a laminated current conducting structure. The laminated current conducting structure is characterized in that a power supply motherboard (PSU motherboard) and a power supply daughter card (PSU daughter card) which are arranged in a laminated manner are arranged in a shell of a Power Supply Unit (PSU), one side of the power supply motherboard is provided with a first golden finger, and the first golden finger protrudes out of the side wall of the shell; the power daughter card is electrically connected with the power motherboard; a second golden finger is arranged on one side of the power supply sub-card, protrudes out of the side wall of the shell, and is positioned above the first golden finger; therefore, the first golden finger and the second golden finger can be electrically connected with a power connector at the same time, so that the Power Supply Unit (PSU) is switched to the power distribution main board through the power connector.

As shown in fig. 3 and 4, the specific scheme is as follows: and adding a PSU daughter card with a golden finger on the PSU mother board. The PSU 12V interconnection is achieved between the PSU daughter card and the PSU motherboard by a pair of conductive power supply bus bars (BUSBAR). In fig. 3, a pair of conductive power supply bus bars includes a positive bus bar and a negative bus bar (GND) for transmitting a 12V voltage.

As shown in fig. 5, fig. 5 is a schematic structural view of a power supply connector (PSU connector). The PSU connector adopted by the power distribution main board end is a connector which is stacked up and down and integrally formed, fig. 5 shows a cross-sectional view of the power connector, the left side of the cross-sectional view is a power supply access surface, and the bottom surface is a transfer output surface. And at one side of the power supply access surface, the pins of the first pair of connecting terminals are in butt joint with the first golden finger, the pins of the second pair of connecting terminals are in butt joint with the second golden finger, and the pins of the first pair of connecting terminals and the pins of the second pair of connecting terminals of the transfer output surface can be welded or pressed on the power supply distribution main board.

As shown in fig. 6, fig. 6 is a schematic diagram of a connection structure of a power supply system, which mainly shows a high-power supply structure of a stacked current conducting structure. The structure shown in fig. 6 is compared with the structure shown in fig. 1, and the power supply BUSBAR (BUSBAR) is adopted for the 4 positions (1), (2), (3) and (4) to realize PSU 12V interconnection.

Fig. 7 is a schematic perspective view of a power supply busbar as shown in fig. 7. One end of the power supply busbar is connected to the power distribution main board, and the other end of the power supply busbar is connected to electric equipment.

The power supply busbar is provided with a copper bar main body and welding pins arranged at two ends of the copper bar main body, the copper bar main body is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction, and the welding pins are cylindrical.

In fig. 7, positions a and B represent the solder pins of the power supply BUSBAR (BUSBAR). The C position represents a supporting gasket (generally made of a temperature-resistant insulating material) of the BUSBAR, and is used for supporting and fixing the position of the BUSBAR and preventing potential risks such as contact and collision with the surface of the PCB when the BUSBAR is transported or vibrated by a machine.

As shown in fig. 8, the structure of three special-shaped power supply BUSBAR (BUSBAR) is schematically shown. Comprising: L-BUSBAR, Z-BUSBAR, E-BUSBAR. The method comprises the following steps:

the L-shaped BUSBAR and the Z-shaped BUSBAR both comprise welding pins at the left end and the right end, and the quantity of the welding pins at the left end and the right end is equal. E-type BUSBAR, wherein a left end welding pin is a power supply input end, and a middle and right end welding pins are power supply output ends. Left end welding pin number = middle welding pin number + right end welding pin number.

Wherein: the pin count may be determined based on BUSBAR throughput I and single pin throughput capability I0. The pin number N has the following relation: n= [ I/I0] +1.

To ensure the solder ratio of the BUSBAR solder, the solder pins need to be designed as: the cylindrical or elliptic cylindrical shape, thereby improving the uniformity and plumpness of tin on the surface of the pin during welding.

Referring to fig. 6, in this embodiment, an L-type, Z-type, and E-type power supply BUSBAR (BUSBAR) is sequentially used from the power supply input end of the power distribution motherboard to the fan power end, to the CPU and memory power end, and to the GPU and hard disk array power end.

For clarity of explanation of the implementation of the present invention, the specific working procedure of the technical solution of the present invention is described below with reference to fig. 3, 5, 6 and 8:

1) First, according to the server system configuration:the total power consumption P of the power distribution main board of the node of the GPU comprises a CPU, a memory, a hard disk array, a system fan and a power distribution main board of the node of the GPU _T The slave PSU was determined according to the 80% derating standard>Maximum current value I of power supply path of power distribution main board _T 。

2) Then, selecting the flow size to be 0.5 _T Is a power bus bar BUSBAR0, and the BUSBAR can be customized according to the standard of 3.

3) Then, a block capable of supporting 0.5 x I of through flow is designed _T A pair of manufactured power supply BUSBAR bus bar0 is selected to interconnect the PSU motherboard and the PSU daughter card.

4) According to the right illustration of fig. 3, an integrally formed connector mating with PSU motherboard and PSU daughter card fingers is fabricated and mounted on the power distribution motherboard end.

5) PCIE equipment (GPU) I at power consumption end of power distribution main board _G Rated operating current I of hard disk array _H . E-type BUSBAR is manufactured according to the actual layout of the power distribution main board: BUSBAR1. So that the flow of the left input part thereof satisfies 1.25 (I _G +I _H ). BUSBAR1 middle section through flow meets 1.25 x I _G . The flow through the right side segment of BUSBAR1 satisfies 1.25. Mu.I _H . As shown in fig. 5, the bus bar1 input pins are soldered beside the power distribution motherboard PSU connector, the middle pins are soldered beside the power utilization end of the GPU, and the right pins are soldered beside the power utilization end of the hard disk array.

6) According to the total rated working current I of CPU and memory at the power consumption end of the power distribution main board _C +I _D Manufacturing a Z-shaped BUSBAR according to the actual layout of the power distribution main board: BUSBAR2. So that the flow through it satisfies 1.25 (I _C +I _D ). As shown in fig. 6, the left pin of BUSBAR2 is soldered beside the PSU connector of the power distribution motherboard, through the gap between the DIMM slot and the CPU, and the other pin is soldered near the right of the power distribution motherboard near the CPU and the VR input of the memory.

7) According to the total rated working current I of the system fan power utilization end _F Manufacturing an L-shaped BUSBAR according to the actual layout of the power distribution main board: BUSBAR3. So that the through flow meets 1.25 x I _F . As shown in FIG. 6, the BUSBAR3 left side pin is soldered to the electricityBesides the PSU connector of the source distribution main board, a gap is reserved between the edge of the source distribution main board and the DIMM slot, and pins at the other end are welded near the right side of the source distribution main board close to the power utilization end of the fan.

According to the layout of the power distribution main board and the power of the electric equipment, the L-shaped, Z-shaped and E-shaped BUSBAR is selected and adapted. The L-shaped, Z-shaped and E-shaped BUSBAR is adopted in sequence from the power supply input end of the power distribution main board to the fan power utilization end, to the CPU and memory power utilization end and to the GPU and hard disk array power utilization end. The BUSBAR is used for replacing the PCB copper foil to conduct large current, so that the power distribution mainboard layer is reduced, the wireless cable design on the power distribution mainboard is realized, and the power supply requirement of high-power utilization components of the power distribution mainboard is met.

Example 2

All the technical features of example 1 are included in example 2.

Specifically, as shown in fig. 3 and 4, in embodiment 2, there is provided a laminated conductive power supply unit 10 including:

a housing 1;

a power motherboard 2 arranged at the bottom of the shell 1; a first golden finger 4 is arranged on one side of the power motherboard 2, and the first golden finger 4 protrudes out of the side wall of the shell 1;

A power daughter card 3 disposed in the housing 1 and located on the power motherboard 2; the power daughter card 3 is electrically connected with the power motherboard 2; a second golden finger 5 is arranged on one side of the power daughter card 3, the second golden finger 5 protrudes out of the side wall of the shell 1, and the second golden finger 5 is positioned above the first golden finger 4;

the first gold finger 4 and the second gold finger 5 can be electrically connected with a power connector 20 at the same time.

As shown in fig. 4, in this embodiment, a positive busbar 41 and a negative busbar 42 are disposed between the power daughter card 3 and the power motherboard 2 to realize electrical connection.

As shown in fig. 3 and 5, the present application further provides a power supply system, which includes the laminated conductive power supply unit 10 and the power connector 20 described above.

As shown in fig. 5, in the present embodiment, the power connector 20 is provided with a power supply inlet face 201 and a transfer outlet face 202; a first pair of connection terminals 21 and a second pair of connection terminals 22 extending from the power access face 201 to the transfer output face 202 are provided in the power connector 20; at the power supply access surface 201 side, the pins of the first pair of connection terminals 21 are abutted with the first golden finger 4, and the pins of the second pair of connection terminals 22 are abutted with the second golden finger 5.

In this embodiment, the power access surface 201 is one side surface of the power connector 20, and the transfer output surface 202 is a bottom surface or a top surface of the power connector 20; alternatively, the power access face 201 and the transfer output face 202 are two sides of the power connector 20, respectively. As shown in fig. 5, the power supply access surface 201 is preferably one side surface of the power supply connector 20, and the transfer output surface 202 is preferably a bottom surface of the power supply connector 20.

In this embodiment, the power supply system further includes a power distribution motherboard 40; the power distribution motherboard 40 is electrically connected to pins of the first pair of connection terminals 21 and the second pair of connection terminals 22 on the transfer output surface 202 of the power connector 20.

As shown in fig. 6, 7 and 8, in this embodiment, the power supply system further includes a power supply busbar 30; one end of the power supply busbar 30 is connected to the power distribution main board 40, and the other end of the power supply busbar 30 is connected to electric equipment.

As shown in fig. 6, 7 and 8, in the present embodiment, the power supply busbar 30 is provided with a copper busbar body 31 and welding pins 32 disposed at two ends of the copper busbar body 31, the copper busbar body 31 is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction, and the welding pins 32 are cylindrical.

In fig. 7, positions a and B represent the solder pins 32 of the power bus bar 30 (BUSBAR). The C position indicates a support pad 33 of the BUSBAR for supporting the fixed BUSBAR position against potential risks of contact, collision etc. with the PCB surface during transport or machine vibration. The support pad 33 is typically made of a temperature resistant insulating material.

As shown in FIG. 8, three types of abnormal BUSBAR structures are schematically shown. I.e. the power bus bar 30 (BUSBAR) comprises: L-BUSBAR, Z-BUSBAR, E-BUSBAR. The method comprises the following steps:

the L-shaped BUSBAR and the Z-shaped BUSBAR both comprise welding pins 32 at the left end and the right end, and the quantity of the welding pins 32 at the left end and the right end is equal. E-BUSBAR, a left end welding pin 32 is a power supply input end, and a middle and right end welding pins 32 are power supply output ends. Left-end bonding pins 32 number = middle bonding pins 32 number + right-end bonding pins 32 number.

Wherein: the number of bond pins 32 may be determined based on BUSBAR throughput I and individual bond pin 32 throughput I0. The number N of solder pins 32 has the following relationship: n= [ I/I0] +1.

To ensure the solder ratio of the BUSBAR solder, the solder pins 32 need to be designed to: cylindrical or oval, thereby improving the uniformity and fullness of tin on the surface of the solder pins 32 during soldering.

Referring to fig. 6, the present embodiment sequentially adopts L-type, Z-type, and E-type power supply bus bars 30 (BUSBAR) from the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, and to the GPU and hard disk array power end.

For clarity of explanation of the implementation of the present invention, the specific working procedure of the technical solution of the present invention is described below with reference to fig. 3, 6 and 8:

1) First, according to the server system configuration: total power consumption P of power distribution motherboard 40 including CPU, memory, hard disk array, system fan, GPU meter node _T The slave PSU was determined according to the 80% derating standard>Maximum current value I of power supply path of power distribution main board 40 _T 。

4) As illustrated on the right side of fig. 3, an integrally formed connector mating with PSU motherboard and PSU daughter card fingers is fabricated and mounted on the power distribution motherboard 40 end.

5) PCIE equipment (GPU) I at power distribution motherboard 40 _G Rated operating current I of hard disk array _H . The E-BUSBAR is made according to the actual layout of the power distribution motherboard 40: BUSBAR1. So that the flow of the left input part thereof satisfies 1.25 (I _G +I _H ). BUSBAR1 middle section through flow meets 1.25 x I _G . The flow through the right side segment of BUSBAR1 satisfies 1.25. Mu.I _H . As shown in fig. 5, the bus bar1 input pins are soldered beside the PSU connector of the power distribution motherboard 40, the middle pins are soldered beside the power utilization end of the GPU, and the right pins are soldered beside the power utilization end of the hard disk array.

6) Based on total rated working current I of CPU and memory at power consumption end of power distribution main board 40 _C +I _D The Z-BUSBAR is made according to the actual layout of the power distribution motherboard 40: BUSBAR2. So that the flow through it satisfies 1.25 (I _C +I _D ). As shown in fig. 6, the left pin of BUSBAR2 is soldered beside the PSU connector of the power distribution motherboard 40, through the gap between the DIMM slot and the CPU, and the other pin is soldered near the right side of the power distribution motherboard 40 near the CPU and the VR input of the memory.

7) According to the total rated working current I of the system fan power utilization end _F The L-bus bar is made according to the actual layout of the power distribution motherboard 40: BUSBAR3. So that the through flow meets 1.25 x I _F . As shown in fig. 6, the left pin of the BUSBAR3 is soldered beside the PSU connector of the power distribution motherboard 40, through the gap between the edge of the power distribution motherboard 40 and the DIMM slot, and the other pin is soldered near the right side of the power distribution motherboard 40 near the fan power end.

The present embodiment is based on the layout of the power distribution motherboard 40 and the power of the electric equipment, and the type-selection adaptation of the L-type, Z-type and E-type BUSBAR. The L-shaped, Z-shaped and E-shaped BUSBAR are adopted in sequence from the power supply input end of the power distribution main board 40 to the fan power utilization end, to the CPU and memory power utilization end and to the GPU and hard disk array power utilization end. The BUSBAR is used for replacing the PCB copper foil to conduct large current, so that the board layer of the power distribution main board 40 is reduced, the cable-free design on the power distribution main board 40 is realized, and the power supply requirement of high-power electricity utilization components of the power distribution main board 40 is met.

Example 3

As shown in fig. 6, all the technical features of embodiment 2 are included in embodiment 3, except that the power supply system in embodiment 3 further includes an electronic fuse; the electronic fuse is arranged between the power supply busbar 30 and the electrical consumer. The powered device includes at least one of a central processing unit, a memory, a pattern processor, a voltage regulator, or a fan.

As shown in fig. 6, the electronic fuses are provided in plurality and are respectively arranged at the input ends of the electric equipment. It will be appreciated that typically an electronic fuse is provided behind the power distribution motherboard 40, and the power distribution motherboard 40 is connected to the electronic fuse through the power bus bar 30 (BUSBAR), which in turn is connected to the powered device. And a power bus bar 30 (BUSBAR) may also be provided between the electrical fuses and the powered device.

a housing 1;

As shown in fig. 4, in this embodiment, a positive busbar 41 and a negative busbar 42 are disposed between the 22 power daughter card 3 and the power motherboard 2 to realize electrical connection.

Referring to fig. 6, the present embodiment sequentially adopts L-type, Z-type, and E-type power supply BUSBAR 30 (BUSBAR) from the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, to the GPU and the hard disk array power consumption device.

3) Then, a block capable of supporting 0.5 x I of through flow is designed _T A pair of prepared power supply BUSBAR BUSBAR0 is selected for PSU sub-card of (C) to make PSUThe motherboard is interconnected with the PSU daughter card.

Example 4

Referring to fig. 6, in embodiment 4, a server is provided, which includes the power supply system and the electric device described above; the powered device includes at least one of a central processing unit, a memory, a pattern processor, a voltage regulator, or a fan.

As shown in fig. 3 and 4, in the present embodiment, the power supply unit includes:

a housing 1;

5) PCIE equipment (GPU) I at power distribution motherboard 40 _G Rated operating current I of hard disk array _H . The E-BUSBAR is made according to the actual layout of the power distribution motherboard 40: BUSBAR1. To make the left side input part flow throughSatisfy 1.25 x (I _G +I _H ). BUSBAR1 middle section through flow meets 1.25 x I _G . The flow through the right side segment of BUSBAR1 satisfies 1.25. Mu.I _H . As shown in fig. 5, the bus bar1 input pins are soldered beside the PSU connector of the power distribution motherboard 40, the middle pins are soldered beside the power utilization end of the GPU, and the right pins are soldered beside the power utilization end of the hard disk array.

In one embodiment, the server is specifically a computer device, which may be a terminal, and its internal structure diagram may be shown in fig. 9. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface of the computer device is used for communicating with an external terminal through a network connection. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be keys, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.

It will be appreciated by persons skilled in the art that the architecture shown in fig. 9 is merely a block diagram of some of the architecture relevant to the present inventive arrangements and is not limiting as to the computer device to which the present inventive arrangements are applicable, and that a particular computer device may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.

According to the laminated conduction type power supply unit, the power supply system and the server, the gold finger of the power supply unit is set to be of the laminated current conduction structure, so that high-power supply from the power supply unit to the power distribution main board 40 is realized, and the power supply requirement of the power distribution main board 40 on high-power utilization components is met.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims

1. A laminated conductive power supply unit, comprising:

A housing;

2. The laminated conductive power supply unit of claim 1, wherein a positive busbar and a negative busbar are disposed between the power daughter card and the power motherboard for electrical connection.

3. A power supply system comprising the laminated conductive power supply unit according to claim 1 or 2 and a power connector.

4. The power supply system of claim 3, wherein the power connector is provided with a power access face and a transfer output face; a first pair of connection terminals and a second pair of connection terminals extending from the power access face to the transfer output face are arranged in the power connector; and at one side of the power supply access surface, the pins of the first pair of connecting terminals are in butt joint with the first golden fingers, and the pins of the second pair of connecting terminals are in butt joint with the second golden fingers.

5. The power supply system of claim 4, wherein the power access face is one side of the power connector and the transfer output face is a bottom or top face of the power connector; alternatively, the power supply access surface and the transfer output surface are two side surfaces of the power supply connector respectively.

6. The power supply system of claim 4, further comprising a power distribution motherboard; the power distribution main board is electrically connected with pins of the first pair of connecting terminals and the second pair of connecting terminals on the transfer output surface of the power connector.

7. The power supply system of claim 3, further comprising a power bus bar; one end of the power supply busbar is connected to the power distribution main board, and the other end of the power supply busbar is connected to electric equipment.

8. The power supply system according to claim 7, wherein the power supply busbar is provided with a copper bar main body and welding pins arranged at two ends of the copper bar main body, the copper bar main body is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction, and the welding pins are cylindrical.

9. The power supply system of claim 7, further comprising an electronic fuse; the electronic fuse is arranged between the power supply busbar and the electric equipment.

10. A server comprising the power supply system of any one of claims 3 to 9 and a powered device; the powered device includes at least one of a central processing unit, a memory, a pattern processor, a voltage regulator, or a fan.