CN116818774A

CN116818774A - Defect detection method, defect detection device, electronic equipment and storage medium

Info

Publication number: CN116818774A
Application number: CN202310790062.6A
Authority: CN
Inventors: 张鹏黎
Original assignee: Shanghai Yuwei Semiconductor Technology Co ltd
Current assignee: Shanghai Yuwei Semiconductor Technology Co ltd
Priority date: 2023-06-29
Filing date: 2023-06-29
Publication date: 2023-09-29

Abstract

The embodiment of the invention discloses a defect detection method, a detection device, electronic equipment and a storage medium, wherein the defect detection method comprises the steps of determining a maximum imaging view field in an objective view field according to the size of a periodic pattern in a surface to be detected; the pattern of the maximum imaging view field can be spliced by the pattern of at least one periodic pattern, or the pattern of the periodic pattern can be spliced by the pattern of at least one maximum imaging view field; scanning the surface to be detected with the maximum imaging view field sequentially in a step-and-scan mode to obtain an image of the surface to be detected; and comparing the image of the surface to be detected with the standard image, and identifying and positioning the defect of the surface to be detected. The defect detection method realizes the dynamic matching of the size of the imaging view field and the size of the periodic pattern in the surface to be detected, improves the utilization rate of the imaging view field, improves the integrity and accuracy of the acquisition of the periodic pattern, and reduces the defect detection time.

Description

Defect detection method, defect detection device, electronic equipment and storage medium

Technical Field

The embodiment of the invention relates to the technical field of automatic optical detection, in particular to a defect detection method, a defect detection device, electronic equipment and a storage medium.

Background

With the deep and popular industrial automation and intellectualization, the use of automatic optical detection equipment to replace traditional manual visual inspection has become a trend in technology development. Automatic optical detection equipment is widely used in the fields of automobiles, medicines, traffic, semiconductors and the like by virtue of the rapid and accurate defect identification positioning capability.

Currently, existing automated optical inspection equipment typically includes optical imaging systems, stages, material transport systems, and the like. Wherein the optical imaging system comprises an illumination unit, an imaging objective lens, a detector and the like. The illumination unit is used for providing required radiation light, the imaging objective is used for collecting optical signals of the surface to be detected, the detector is used for converting the optical signals into digital image signals, and defect identification and positioning are carried out through an image processing algorithm.

In the existing automatic optical detection equipment adopting an area array camera, in order to realize detection of a surface to be detected, an imaging field scanning or stepping mode is required to be used for photographing and covering the whole object to be detected. However, for periodic pattern inspection (e.g., patterned wafers), since the imaging field of view is fixed and may not match the size of the periodic pattern, the image of the surface under inspection acquired by the imaging field of view contains an incomplete periodic pattern, which affects the integrity and accuracy of defect inspection of the surface under inspection.

Disclosure of Invention

The embodiment of the invention provides a defect detection method, a defect detection device, electronic equipment and a storage medium, which are used for realizing dynamic matching of the size of an imaging view field and the size of a periodic pattern in a surface to be detected and improving the utilization rate of the imaging view field.

In a first aspect, an embodiment of the present invention provides a defect detection method, including:

determining a maximum imaging field of view within the field of view of the objective according to the size of the periodic pattern in the surface to be measured; the patterns of the maximum imaging view field can be spliced by the patterns of at least one periodic pattern, or the patterns of the periodic pattern can be spliced by the patterns of at least one maximum imaging view field;

scanning the surface to be detected sequentially in a step-and-scan mode with the maximum imaging view field to obtain an image of the surface to be detected;

and comparing the image of the surface to be detected with the standard image, and identifying and positioning the defects of the surface to be detected.

In a second aspect, an embodiment of the present invention further provides a defect detection apparatus, including:

the maximum imaging view field determining module is used for determining a maximum imaging view field in the field of view of the objective lens according to the size of the periodic pattern in the surface to be detected; the patterns of the maximum imaging view field can be spliced by the patterns of at least one periodic pattern, or the patterns of the periodic pattern can be spliced by the patterns of at least one maximum imaging view field;

The image acquisition module is used for sequentially scanning the surface to be detected with the maximum imaging view field in a step-and-scan mode to acquire an image of the surface to be detected;

and the defect detection module is used for comparing the image of the surface to be detected with the standard image and identifying and positioning the defects of the surface to be detected.

In a third aspect, an embodiment of the present invention further provides an electronic device, including:

one or more processors;

a storage means for storing one or more programs;

the one or more programs, when executed by the one or more processors, cause the one or more processors to implement the defect detection method of any of the first aspects.

In a fourth aspect, an embodiment of the present invention further provides a computer readable storage medium, on which a computer program is stored, which when executed by a processor implements the defect detection method according to any one of the first aspects.

The embodiment of the invention provides a defect detection method, a detection device, electronic equipment and a storage medium, wherein the defect detection method comprises the steps of determining a maximum imaging view field in an objective view field according to the size of a periodic pattern in a surface to be detected; the pattern of the maximum imaging view field can be spliced by the pattern of at least one periodic pattern, or the pattern of the periodic pattern can be spliced by the pattern of at least one maximum imaging view field; scanning the surface to be detected with the maximum imaging view field sequentially in a step-and-scan mode to obtain an image of the surface to be detected; and comparing the image of the surface to be detected with the standard image, and identifying and positioning the defect of the surface to be detected. According to the technical scheme provided by the embodiment of the invention, the size of the imaging view field is adjusted according to the size of the periodic pattern in the surface to be detected, so that the dynamic matching of the size of the imaging view field and the size of the periodic pattern in the surface to be detected is realized, the imaging view field can accommodate at least one complete periodic pattern, or one complete periodic pattern can be acquired by at least one imaging view field, the utilization rate of the imaging view field is improved, the integrity and accuracy of the acquisition of the periodic pattern are improved, and the defect detection time is reduced.

Drawings

FIG. 1 is a schematic flow chart of a defect detection method according to an embodiment of the present invention;

FIG. 2 is a flow chart of another defect detection method according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of dynamic matching of an imaging field of view to a periodic pattern according to an embodiment of the present invention;

FIG. 4 is a flowchart of another defect detection method according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of another imaging field of view dynamically matching a periodic pattern provided by an embodiment of the present invention;

FIG. 6 is a flowchart of another defect detection method according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of still another imaging field of view dynamically matching a periodic pattern provided by an embodiment of the present invention;

FIG. 8 is a schematic diagram of a defect detecting device according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Detailed Description

The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.

Fig. 1 is a schematic flow chart of a defect detection method provided in an embodiment of the present invention, where the defect detection method may be implemented by a defect detection device, and the defect detection device may be implemented in hardware and/or software, and the defect detection device may be configured in a control board. As shown in fig. 1, the defect detection method includes:

s110, determining a maximum imaging view field in the view field of the objective lens according to the size of the periodic pattern in the surface to be measured; the pattern of the maximum imaging field of view can be spliced by the pattern of at least one periodic pattern, or the pattern of the periodic pattern can be spliced by the pattern of at least one maximum imaging field of view.

Specifically, for a surface to be measured including a plurality of periodic patterns, the sizes of the periodic patterns in different surfaces to be measured (for example, the sizes of the periodic patterns may include the shape and the size of the periodic patterns) are also different, if a fixed field of view of an objective is used to collect the images of the periodic patterns in each surface to be measured (for example, the field of view of the objective may be a rectangular field of view, which has a large limitation, and for a rectangle of a non-rectangular shape or a different size, the utilization rate of the rectangular field of view is low), the images of the periodic patterns in each surface to be measured collected in adjacent two times may each include an incomplete periodic pattern, and even if the images of the periodic patterns in each surface to be measured collected in adjacent two times are spliced, a situation of splice coverage or defect loss or the like may occur, which results in detection accuracy and precision of defects in the images of the periodic patterns in each surface to be measured in adjacent two times. According to the size of the periodic pattern in the surface to be measured, the size of the maximum imaging view field in the view field of the objective lens is reasonably adjusted, and the dynamic matching of the size of the maximum imaging view field in the view field of the objective lens and the size of the periodic pattern in the surface to be measured is realized, wherein the pattern of the maximum imaging view field can be formed by splicing the pattern of at least one periodic pattern, namely, at least one complete periodic pattern can be acquired in the maximum imaging view field, or the pattern of the periodic pattern can be formed by splicing the pattern of at least one maximum imaging view field, namely, one complete periodic pattern can be acquired by at least one maximum imaging view field.

S120, scanning the surface to be detected with the maximum imaging view field sequentially in a step-and-scan mode, and obtaining an image of the surface to be detected.

Specifically, for the known size of the periodic pattern in the surface to be measured, the size of the maximum imaging field of view within the field of view of the objective is reasonably adjusted to achieve a dynamic match of the size of the maximum imaging field of view within the field of view of the objective with the size of the periodic pattern in the surface to be measured. The method comprises the steps of adopting a step scanning mode, scanning the surface to be detected with the size of the largest imaging view field in the view field of the objective lens which is matched, determining the step scanning mode according to the actual size of the surface to be detected, scanning any position on the surface to be detected or all areas of the surface to be detected according to the step scanning mode, and acquiring images of the surface to be detected, wherein the images of the surface to be detected can be images of all areas of the surface to be detected obtained after splicing, and the images of the surface to be detected can be images of all areas of the scattered surface to be detected without splicing.

S130, comparing the image of the surface to be detected with the standard image, and identifying and positioning the defect of the surface to be detected.

Specifically, after the image of the surface to be measured is obtained, the image of the surface to be measured may be compared with a standard image, and the standard image may be, for example, a known image of the surface to be measured containing the same periodic pattern and having no defects, and the image of the surface to be measured is the same size as the standard image. If the image of the surface to be measured may be an image of all areas of the surface to be measured obtained after stitching, the standard image may be an image of all areas of the surface to be measured that contain the same periodic pattern and are free of defects, and if the image of the surface to be measured may be an image of each area of the scattered surface to be measured that does not require stitching, the standard image may be an image of the periodic pattern of the scattered single surface to be measured. And the image of the surface to be detected is compared with the standard image, and the defects of the surface to be detected are identified and positioned by adopting an image processing algorithm, so that the integrity and the accuracy of the defect detection of the surface to be detected are effectively ensured.

According to the technical scheme, the maximum imaging view field is determined in the objective view field according to the size of the periodic pattern in the surface to be detected; the pattern of the maximum imaging view field can be spliced by the pattern of at least one periodic pattern, or the pattern of the periodic pattern can be spliced by the pattern of at least one maximum imaging view field; then scanning the surface to be detected in sequence by using a step-and-scan mode and using the maximum imaging view field to acquire an image of the surface to be detected; and finally, comparing the image of the surface to be detected with the standard image, and identifying and positioning the defect of the surface to be detected. According to the defect detection method, the size of the imaging view field is adjusted according to the size of the periodic pattern in the surface to be detected, so that the dynamic matching of the size of the imaging view field and the size of the periodic pattern in the surface to be detected is realized, the imaging view field can accommodate at least one complete periodic pattern, or the complete periodic pattern can be acquired by the at least one imaging view field, the utilization rate of the imaging view field is improved, the acquisition integrity and accuracy of the periodic pattern are improved, and the defect detection time is reduced.

Fig. 2 is a flow chart of another defect detection method according to an embodiment of the present invention, which is optimized based on the above embodiment. Optionally, the periodic patterns in the surface to be measured are sequentially and periodically arranged in a first direction and/or a second direction, wherein the first direction and the second direction are two directions parallel to the intersection of the surface to be measured;

Determining a maximum imaging field of view within the field of view of the objective lens based on the size of the periodic pattern in the surface to be measured, comprising:

when at least one periodic pattern can be accommodated in the field of view of the objective lens, determining the arrangement mode of the periodic patterns which can be simultaneously accommodated in the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction according to the sizes of the field of view of the objective lens and the periodic patterns;

and according to the arrangement mode of the periodic patterns which can be simultaneously accommodated in the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction, splicing the periodic patterns of the number according to the arrangement mode, and obtaining the maximum imaging field of view.

For details not yet described in this embodiment, refer to the above embodiment, as shown in fig. 2, the defect detection method includes:

s210, when at least one periodic pattern can be accommodated in the field of view of the objective lens, determining an arrangement mode of the periodic patterns which can be simultaneously accommodated in the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction according to the sizes of the field of view of the objective lens and the periodic patterns.

Optionally, the length of the periodic pattern in the first direction is Px, and the length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D; when at least one periodic pattern can be accommodated in the field of view of the objective lens, determining an arrangement mode of the periodic patterns which can be simultaneously accommodated in the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction according to the sizes of the field of view of the objective lens and the periodic patterns, wherein the method comprises the following steps: when Px and Py are both less than D, the following conditions are used:

D>sqrt(m1*Px*m1*Px+n1*Py*n1*Py)，

D<sqrt((m1+1)*Px*(m1+1)*Px+n1*Py*n1*Py)，

D<sqrt(m1*Px*m1*Px+(n1+1)*Py*(n1+1)*Py)，

Determining the number m1 of periodic patterns which can be accommodated in the first direction and the number n1 of periodic patterns which can be accommodated in the second direction at the same time of the field of view of the objective lens; wherein m1 and n1 are both positive integers.

Specifically, fig. 3 is a schematic diagram of dynamic matching of an imaging field of view and a periodic pattern, as shown in fig. 3, for a surface to be measured including a plurality of periodic patterns, the periodic patterns in the surface to be measured may be sequentially and periodically arranged in a first direction X and/or a second direction Y, where the first direction X and the second direction Y are two directions parallel to an intersection of the surface to be measured, a length of the periodic pattern in the first direction X is Px, and a length of the periodic pattern in the second direction Y is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D. For example, for a surface to be measured including a plurality of rectangular periodic patterns, the first direction X and the second direction Y are two directions parallel to the intersection of the surface to be measured, and the first direction X and the second direction Y may be two directions parallel to two sides of the rectangular periodic pattern, that is, the first direction X and the second direction Y are two directions orthogonal, a length of the rectangular periodic pattern in the first direction X is Px, that is, a length of the first side of the rectangular periodic pattern is Px, and a length of the rectangular periodic pattern in the second direction Y is Py, that is, a length of the second side of the rectangular periodic pattern is Py.

When at least one periodic pattern can be accommodated in the field of view of the objective lens, that is, when at least one complete periodic pattern image can be acquired in the field of view of the objective lens, in order to fully utilize the field of view of the objective lens and reduce the incomplete periodic pattern image acquired in the field of view of the objective lens, the imaging field of view in the field of view of the objective lens with a circular shape can be dynamically adjusted to a size matched with the periodic pattern according to the field of view of the objective lens and the size of the periodic pattern, and for an object surface to be measured comprising a plurality of rectangular periodic patterns, the imaging field of view in the field of view of the objective lens can be adjusted to be rectangular. Illustratively, when both Px and Py are less than D, the following conditions apply: d > sqrt (m1×px+n1×py+n1×py), i.e. the field of view of the objective can accommodate a first side of m1 periodic patterns in the first direction X and a second side of n1 periodic patterns in the second direction Y, and m1×n1 periodic patterns can be accommodated simultaneously in the field of view of the objective; and D < sqrt ((m1+1) ×px (m1+1) ×px+n1×py×n1×py), i.e. the field of view of the objective may not accommodate a first side of m1+1 periodic patterns in the first direction X and/or may not accommodate a second side of n1 periodic patterns in the second direction Y, and may not accommodate (m1+1) ×n1 periodic patterns simultaneously within the field of view of the objective; and D < sqrt (m1×pxm1+ (n1+1) ×py), i.e. the field of view of the objective cannot accommodate a first side of the m1 periodic patterns in the first direction X and/or cannot accommodate a second side of the n1+1 periodic patterns in the second direction Y, and cannot accommodate the m1 (n1+1) periodic patterns simultaneously within the field of view of the objective.

According to the calculation process of the above condition, the arrangement mode of the periodic patterns which can be simultaneously contained in the field of view of the objective lens can be determined, the arrangement mode of the periodic patterns is related to the diameter D of the field of view of the objective lens and the arrangement mode of the periodic patterns in the surface to be measured, and the number m1 of the periodic patterns which can be simultaneously contained in the field of view of the objective lens in the first direction X and the number n1 of the periodic patterns which can be simultaneously contained in the second direction Y can be determined, so that the number m 1X n1 of the periodic patterns which can be simultaneously contained in the field of view of the objective lens in the first direction X and the second direction Y is m 1X n1 of complete periodic patterns, namely, the field of view of the objective lens can be simultaneously contained in m 1X n1 of complete periodic patterns, wherein m1 and n1 are positive integers.

S220, according to the arrangement mode of the periodic patterns which can be simultaneously accommodated in the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction, splicing the periodic patterns with the number in the arrangement mode, and obtaining the maximum imaging field of view.

Specifically, with continued reference to fig. 3, according to the arrangement of the periodic patterns that can be simultaneously accommodated in the field of view of the objective lens, and the number m1 of periodic patterns that can be simultaneously accommodated in the first direction X and the number n1 of periodic patterns that can be simultaneously accommodated in the second direction Y, that is, the field of view of the objective lens can simultaneously accommodate m1×n1 complete periodic patterns, the m1×n1 complete periodic patterns are spliced in the arrangement, so as to obtain the maximum imaging field of view. For example, the imaging field of view in the objective field of view may be rectangular, and then the maximum imaging field of view is rectangular, the length of the maximum imaging field of view in the first direction X is m 1X Px, and the length of the maximum imaging field of view in the second direction Y is n 1X Py.

Illustratively, for a surface to be measured comprising a plurality of rectangular periodic patterns, the maximum imaging field of view is rectangular, the length Px of the rectangular periodic pattern in the first direction X is 6.5mm, and the length Py of the rectangular periodic pattern in the second direction Y is 3.5mm; the field of view of the objective is circular, the diameter D of the field of view of the objective is 10mm, and if the length of the fixed imaging field of view in the first direction X is 8mm and the length in the second direction Y is 6mm, the fixed imaging field of view can only acquire one complete periodic pattern. And when both Px and Py are smaller than D, the following conditions are satisfied: d > sqrt (m1×m1×px+n1×py+n1×py), D < sqrt ((m1+1) ×px (m1+1) ×py+n1×py), D < sqrt (m1×px+m1×py+px+n1) ×py+px+p1+p1+py), the number of periodic patterns m1 that can be accommodated in the first direction X and the number of periodic patterns n1 that can be accommodated in the second direction Y are 2, the length of the fixed imaging field of view in the first direction X can be dynamically adjusted to 6.5×1=6.5 mm, the length of the second direction Y is adjusted to 3.5×3×5×6.5mm, the imaging field of view can be obtained by calculating the number of periodic patterns m1 that can be accommodated in the first direction X and the number of periodic patterns n1 that can be accommodated in the second direction Y is 2, and the imaging field of view can be dynamically adjusted to have a maximum imaging efficiency of the field of view that is improved by using the fixed field of view in the first direction y=7 mm.

S230, scanning is sequentially carried out on the surface to be detected in a step-and-scan mode through the maximum imaging view field, and an image of the surface to be detected is obtained.

S240, comparing the image of the surface to be detected with the standard image, and identifying and positioning the defect of the surface to be detected.

According to the technical scheme, the method and the device for determining the periodic patterns in the field of view of the objective lens have the advantages that the size of the periodic patterns in the surface to be detected is specified, when at least one periodic pattern can be accommodated in the field of view of the objective lens, the arrangement mode of the periodic patterns which can be accommodated in the field of view of the objective lens at the same time and the number of the periodic patterns which can be accommodated in the first direction and the second direction are determined according to the size of the periodic patterns in the field of view of the objective lens, the content of the maximum imaging field of view is determined in the field of view of the objective lens, the size of the field of view of the objective lens is dynamically adjusted when Px and Py are smaller than D, and at least one complete periodic pattern can be accommodated in the field of view of the objective lens at the same time.

Fig. 4 is a flow chart of another defect detection method according to an embodiment of the present invention, which is optimized based on the above embodiment. Optionally, the periodic patterns in the surface to be measured are sequentially and periodically arranged in a first direction and/or a second direction, wherein the first direction and the second direction are two directions parallel to the intersection of the surface to be measured;

when at least one equally divided pattern formed by equally dividing the periodic pattern in the first direction and the second direction can be accommodated in the field of view of the objective lens, determining the largest equally divided pattern of the periodic pattern which can be accommodated in the field of view of the objective lens according to the sizes of the field of view of the objective lens and the periodic pattern, wherein the equally divided patterns are patterns formed by equally dividing the periodic pattern in the first direction and the second direction respectively, and the equally divided patterns are equally divided in the first direction and the second direction respectively;

the largest one of the aliquots of the periodic pattern is taken as the largest imaging field of view.

For details not yet described in this embodiment, refer to the above embodiment, as shown in fig. 4, the defect detection method includes:

and S310, when at least one equally divided pattern formed by equally dividing the periodic pattern in the first direction and the second direction can be accommodated in the field of view of the objective lens, determining the largest equally divided pattern of the periodic pattern which can be accommodated in the field of view of the objective lens according to the sizes of the field of view of the objective lens and the periodic pattern, wherein the equally divided pattern is a pattern formed by equally dividing the periodic pattern in the first direction and the second direction respectively, and the equally divided patterns are equally divided or different in the first direction and the second direction respectively.

Optionally, the length of the periodic pattern in the first direction is Px, and the length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D; when at least one equally divided pattern formed by equally dividing the periodic pattern in the first direction and the second direction can be accommodated in the field of view of the objective lens, determining the largest equally divided pattern of the periodic pattern accommodated in the field of view of the objective lens according to the sizes of the field of view of the objective lens and the periodic pattern, wherein the equally divided pattern is a pattern formed by equally dividing the periodic pattern in the first direction and the second direction respectively, and the equally divided patterns are equally divided or different in the first direction and the second direction respectively, and comprise the following steps: when Px and Py are both greater than D, the following conditions are used:

D>sqrt(Px/m2*Px/m2+Py/n2*Py/n2)，

D<sqrt(Px/(m2-1)*Px(m2-1)+Py/n2*Py/n2)，

D<sqrt(Px/m2*Px/m2+Py/(n2-1)*Py/(n2-1))，

determining the number m2 of the largest division pattern of the periodic pattern which can be divided equally into the periodic pattern in the first direction and the number n2 of the largest division pattern of the periodic pattern which can be divided equally into the periodic pattern in the second direction; wherein m2 and n2 are positive integers greater than or equal to 2.

Specifically, fig. 5 is a schematic diagram of dynamic matching of an imaging field of view and a periodic pattern, where as shown in fig. 5, for a surface to be measured including a plurality of periodic patterns, the periodic patterns in the surface to be measured may be sequentially and periodically arranged in a first direction X and/or a second direction Y, where the first direction X and the second direction Y are two directions parallel to an intersection of the surface to be measured, a length of the periodic pattern in the first direction X is Px, and a length of the periodic pattern in the second direction Y is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D. For example, for a surface to be measured including a plurality of rectangular periodic patterns, the first direction X and the second direction Y are two directions parallel to the intersection of the surface to be measured, and the first direction X and the second direction Y may be two directions parallel to two sides of the rectangular periodic pattern, that is, the first direction X and the second direction Y are two directions orthogonal, a length of the rectangular periodic pattern in the first direction X is Px, that is, a length of the first side of the rectangular periodic pattern is Px, and a length of the rectangular periodic pattern in the second direction Y is Py, that is, a length of the second side of the rectangular periodic pattern is Py.

When an aliquoting pattern formed by respectively aliquoting at least one periodic pattern in the first direction X and the second direction Y can be contained in the field of view of the objective lens, the aliquoting pattern is a pattern formed by respectively aliquoting the periodic pattern in the first direction X and the second direction Y, the aliquoting numbers of the aliquoting patterns respectively in the first direction X and the second direction Y can be the same or different, namely, when at least one complete periodic pattern image can not be acquired in the field of view of the objective lens, the imaging field of view in the circular field of view of the objective lens can be dynamically adjusted to be matched with the aliquoting pattern formed by respectively aliquoting the periodic pattern in the first direction X and the second direction Y according to the sizes of the field of view of the objective lens and the periodic pattern, and for example, the imaging field of view in the field of view of the objective lens can be adjusted to be rectangular for the surface to be measured comprising a plurality of rectangular periodic patterns. Illustratively, when both Px and Py are greater than D, the following conditions are used: d > sqrt (Px/m2+py/n 2) that is, the field of view of the objective may accommodate a first side of the m 2-halved pattern of the periodic pattern in the first direction X, a second side of the n 2-halved pattern of the periodic pattern in the second direction Y, and an aliquot pattern formed by the m 2-halving pattern of the periodic pattern in the first direction X and the n 2-halving pattern in the second direction Y; and D < sqrt (Px/(m 2-1) ×px (m 2-1) +py/n2×py/n 2), i.e. the field of view of the objective lens cannot accommodate a first side of the bisected pattern of the m2-1 bisected periodic pattern in the first direction X and/or cannot accommodate a second side of the bisected pattern of the n2 bisected periodic pattern in the second direction Y, and cannot accommodate a bisected pattern of the m2-1 bisected periodic pattern in the first direction X and the n2 bisected pattern in the second direction Y within the field of view of the objective lens; and D < sqrt (Px/m2+py/(n 2-1)), i.e., the objective field of view cannot accommodate a first side of the m 2-halved halving pattern of the periodic pattern in the first direction X and/or cannot accommodate a second side of the n 2-1-halving pattern of the periodic pattern in the second direction Y, and cannot accommodate an halving pattern formed by the m 2-halving pattern of the periodic pattern in the first direction X and the n 2-1-halving pattern of the periodic pattern in the second direction Y.

According to the calculation process of the above condition, the biggest one aliquoting pattern of the periodic pattern which can be accommodated in the field of view of the objective lens can be determined, and the number m2 of aliquoting patterns of the periodic pattern which can be equally divided into the biggest periodic pattern in the first direction X and the number n2 of aliquoting patterns of the periodic pattern which can be equally divided into the biggest periodic pattern in the second direction Y can be determined, namely, the complete image of the periodic pattern can be acquired and spliced by m 2X n2 pieces of the field of view of the objective lens, wherein m2 and n2 are positive integers which are more than or equal to 2. If m2 and/or n2 is 1, then both Px and Py are smaller than D, which is not applicable here.

S320, taking the largest one of the divided patterns of the periodic pattern as the largest imaging view field.

Specifically, with continued reference to fig. 5, according to the number m2 of the aliquoting patterns of the periodic pattern that can be equally divided into the largest periodic pattern in the first direction X and the number n2 of the aliquoting patterns that can be equally divided into the largest periodic pattern in the second direction Y, that is, the complete image of the periodic pattern may be acquired and spliced by m 2X n2 of the field of view of the objective lens, the aliquoting pattern of the largest one periodic pattern is taken as the largest imaging field of view, and the largest imaging field of view may acquire the image of the aliquoting pattern of the periodic pattern. For example, the imaging field of view in the objective field of view may be rectangular, and the maximum imaging field of view may be rectangular, and the length of the maximum imaging field of view in the first direction X may be Px/m2, and the length of the maximum imaging field of view in the second direction Y may be Py/n2.

Illustratively, for a surface to be measured comprising a plurality of rectangular periodic patterns, the maximum imaging field of view is rectangular, the length Px of the rectangular periodic patterns in the first direction X is 10mm, and the length Py of the rectangular periodic patterns in the second direction Y is 14mm; the field of view of the objective is circular, the diameter D of the field of view of the objective is 10mm, and if the length of the fixed imaging field of view in the first direction X is 8mm and the length in the second direction Y is 6mm, 6 of the fixed imaging fields of view are required to acquire a complete periodic pattern. And when the conditions that Px and Py are both larger than D are satisfied, the following conditions are adopted: d > sqrt (m1×m1×px+n1×py+n1×py), D < sqrt ((m1+1) ×px (m1+1) ×py+n1×py), D < sqrt (m1×m1×px+1×py+n 1+1) ×py), the number m2 of the bisecting pattern of the largest periodic pattern in the first direction X and the number n2 of the bisecting pattern of the largest periodic pattern in the second direction Y are 2, the complete image of the periodic pattern can be acquired by the 4 objective lens, the dynamic length of the fixed imaging field of view in the first direction X is adjusted to be 10 mm/2 mm/the dynamic length of the field of view in the first direction x=5 mm/the dynamic field of view in the second direction x=5 mm, the imaging field of view is obtained by calculating the objective lens field of view and the number m2 of the bisecting pattern of the largest periodic pattern in the first direction X and the number n2 of the bisecting pattern in the second direction Y is 2, the complete image of the periodic pattern can be acquired by the 4 objective lens field of view, the dynamic field of view is adjusted to be 10 mm/10 mm in the first direction X/2 mm, the dynamic field of the imaging field of view is adjusted to be the maximum in the dynamic field of view is increased by the maximum field of the imaging field of view, and the imaging field of the imaging field is obtained by the imaging field of the imaging field is obtained by the imaging field in the imaging field.

S330, scanning the surface to be detected with the maximum imaging view field sequentially in a step-and-scan mode, and obtaining an image of the surface to be detected.

S340, comparing the image of the surface to be detected with the standard image, and identifying and positioning the defect of the surface to be detected.

According to the technical scheme, the technical scheme is that when at least one aliquoting pattern formed by aliquoting the periodic pattern in the first direction and the second direction respectively can be contained in the field of view of the objective lens according to the size of the periodic pattern in the surface to be measured, the aliquoting pattern of the largest periodic pattern which can be contained in the field of view of the objective lens is determined according to the sizes of the field of view of the objective lens and the periodic pattern, the content of the largest imaging field of view is determined in the field of view of the objective lens, the size of the field of view of the objective lens is dynamically regulated when Px and Py are both larger than D, the complete image of the periodic pattern can be acquired and spliced by at least one field of view of the objective lens, and compared with the fixed imaging field of view, the utilization rate of the field of the objective lens is effectively improved.

Fig. 6 is a flow chart of another defect detection method according to an embodiment of the present invention, which is optimized based on the above embodiment. Optionally, the periodic patterns in the surface to be measured are sequentially and periodically arranged in a first direction and/or a second direction, wherein the first direction and the second direction are two directions parallel to the intersection of the surface to be measured;

when at least one equally divided pattern of the periodic pattern in the first direction can be contained in the field of view of the objective lens, determining the largest equally divided pattern of the periodic pattern which can be contained in the field of view of the objective lens according to the field of view of the objective lens and the size of the periodic pattern, wherein the equally divided pattern is formed by equally dividing the periodic pattern in the first direction;

For details not yet described in this embodiment, refer to the above embodiment, as shown in fig. 6, the defect detection method includes:

s410, when at least one equally divided pattern of the periodic pattern in the first direction can be accommodated in the field of view of the objective lens, determining the largest equally divided pattern of the periodic pattern which can be accommodated in the field of view of the objective lens according to the field of view of the objective lens and the size of the periodic pattern, wherein the equally divided pattern is formed by equally dividing the periodic pattern in the first direction.

Optionally, the length of the periodic pattern in the first direction is Px, and the length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D; when at least one equally divided pattern of the periodic pattern in the first direction can be accommodated in the field of view of the objective lens, determining the largest equally divided pattern of the periodic pattern which can be accommodated in the field of view of the objective lens according to the field of view of the objective lens and the size of the periodic pattern, wherein the equally divided pattern is formed by equally dividing the periodic pattern in the first direction, and comprises the following steps: when Px is greater than D and Py is less than D, the following conditions are used:

D>sqrt(Px/m3*Px/m3+Py/n3*Py/n3)，

D<sqrt(Px/(m3-1)*Px(m3-1)+Py/n3*Py/n3)，

Determining the number n3 of periodic patterns that the field of view of the objective lens can accommodate in the second direction; wherein n3 is a positive integer greater than or equal to 1; determining a number m3 of maximum division patterns in which the periodic pattern can be divided equally into the periodic pattern in the first direction; wherein m3 is a positive integer greater than or equal to 2.

Specifically, fig. 7 is a schematic diagram of dynamic matching of an imaging field of view and a periodic pattern, as shown in fig. 7, for a surface to be measured including a plurality of periodic patterns, the periodic patterns in the surface to be measured may be sequentially and periodically arranged in a first direction X and/or a second direction Y, where the first direction X and the second direction Y are two directions parallel to an intersection of the surface to be measured, a length of the periodic pattern in the first direction X is Px, and a length of the periodic pattern in the second direction Y is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D. For example, for a surface to be measured including a plurality of rectangular periodic patterns, the first direction X and the second direction Y are two directions parallel to the intersection of the surface to be measured, and the first direction X and the second direction Y may be two directions parallel to two sides of the rectangular periodic pattern, that is, the first direction X and the second direction Y are two directions orthogonal, a length of the rectangular periodic pattern in the first direction X is Px, that is, a length of the first side of the rectangular periodic pattern is Px, and a length of the rectangular periodic pattern in the second direction Y is Py, that is, a length of the second side of the rectangular periodic pattern is Py.

When an aliquoting pattern of at least one periodic pattern in the first direction X can be accommodated in the field of view of the objective lens, the aliquoting pattern is a pattern formed by aliquoting the periodic pattern in the first direction X, that is, when an image of at least one complete periodic pattern cannot be acquired in the field of view of the objective lens, in order to fully utilize the field of view of the objective lens to acquire the image of the complete periodic pattern, the imaging field of view in the field of view of the circular objective lens can be dynamically adjusted to be in a size matched with the aliquoting pattern of the periodic pattern in the first direction X according to the sizes of the field of view of the objective lens and the periodic pattern, and for a surface to be measured comprising a plurality of rectangular periodic patterns, the imaging field of view in the field of view of the objective lens can be adjusted to be rectangular. Illustratively, when Px is greater than D and Py is less than D, the following conditions apply: d > sqrt (Px/m3+py/n 3) firstly, the number n3 of periodic patterns that can be accommodated in the second direction Y of the field of view of the objective lens can be determined according to the multiple relationship between Py and D, where n3 is a positive integer equal to or greater than 1, and illustratively, n3 can be set to 1, on the basis of n3 determination, that is, the field of view of the objective lens can accommodate a first side of an m 3-halved pattern of the periodic pattern in the first direction X, and a second side of the periodic pattern in the second direction Y, and the field of view of the objective lens can accommodate an m 3-halved pattern of the periodic pattern in the first direction X and an equally-halved pattern formed in the second direction Y; and D < sqrt (Px/(m 3-1) ×px (m 3-1) +py/n3×py/n 3), i.e. the field of view of the objective lens cannot accommodate a first side of the bisecting pattern of the periodic pattern m3-1 in the first direction X and/or a second side of the periodic pattern in the second direction Y, and cannot accommodate a bisecting pattern of the periodic pattern m3-1 in the first direction X and a bisecting pattern of the periodic pattern in the second direction Y.

According to the calculation process of the above condition, the biggest one aliquoting pattern of the periodic pattern which can be accommodated in the field of view of the objective lens can be determined, and the number m3 of the aliquoting patterns which can be equally divided into the biggest periodic pattern in the first direction X can also be determined, namely, the complete image of the periodic pattern can be acquired and spliced by m 3X 1 pieces of field of view of the objective lens, wherein m3 is a positive integer greater than or equal to 2. If m3 is 1 and n3 is 1, then both Px and Py are smaller than D, which is not applicable here.

Also, when Px is smaller than D and Py is larger than D, the length of the rectangular periodic pattern in the first direction X is Py, that is, the length of the first side of the rectangular periodic pattern is Py, and the length of the rectangular periodic pattern in the second direction Y is Px, that is, the length of the second side of the rectangular periodic pattern is Px. The calculation may also be performed using the above condition to determine the number m3 of division patterns in which the periodic pattern is equally divided into the largest periodic pattern in the first direction X.

S420, taking the largest one of the divided patterns of the periodic pattern as the largest imaging view field.

Specifically, with continued reference to fig. 7, according to the number m3 of the aliquoting patterns of the periodic pattern that can be equally divided into the largest periodic pattern in the first direction X, that is, the complete image of the periodic pattern may be acquired and spliced by m3×1 of the field of view of the objective lens, the aliquoting pattern of the largest one of the periodic patterns is taken as the largest imaging field of view, and the largest imaging field of view may acquire the image of the aliquoting pattern of the periodic pattern. For example, the imaging field of view in the objective field of view may be rectangular, and then the maximum imaging field of view is rectangular, the length of the maximum imaging field of view in the first direction X is Px/m3, the length of the maximum imaging field of view in the second direction Y is Py, and the length of the maximum imaging field of view in the second direction Y may also be py×n3.

Illustratively, for a surface to be measured comprising a plurality of rectangular periodic patterns, the maximum imaging field of view is rectangular, the length Px of the rectangular periodic patterns in the first direction X is 14mm, and the length Py of the rectangular periodic patterns in the second direction Y is 9mm; the field of view of the objective is circular, the diameter D of the field of view of the objective is 10mm, and if the length of the fixed imaging field of view in the first direction X is 6mm and the length in the second direction Y is 8mm, 6 of the fixed imaging fields of view are required to acquire a complete periodic pattern. And when Px is larger than D and Py is smaller than D, the following conditions are satisfied: d > sqrt (Px/m 3+py/n 3) and D < sqrt (Px/(m 3-1) ×px (m 3-1) +py/n 3) are set to 1, the number n3 of periodic patterns that can be accommodated in the second direction Y of the field of view of the objective lens is set to 1, the number m3 of division patterns that can be equally divided into the largest periodic patterns in the first direction X is calculated to be 3, the complete image of the periodic patterns can be acquired and spliced by 3 field of view of the objective lens, the length of the fixed field of view of the imaging can be dynamically adjusted to 14/3=4.7 mm in the first direction X, the length of the fixed field of view of imaging can be dynamically adjusted to 9/1=9 mm in the second direction Y, the maximum field of view of imaging can be obtained, and compared with the fixed field of view of imaging, the utilization of the field of view of the objective lens can be effectively improved.

S430, scanning the surface to be detected with the maximum imaging view field sequentially in a step-and-scan mode, and obtaining an image of the surface to be detected.

S440, comparing the image of the surface to be detected with the standard image, and identifying and positioning the defect of the surface to be detected.

According to the technical scheme, when the size of the periodic pattern in the surface to be measured can be contained in the objective view field in the first direction, the largest halving pattern of the periodic pattern which can be contained in the objective view field is determined according to the sizes of the objective view field and the periodic pattern, the content of the largest imaging view field is determined in the objective view field, the size of the objective view field is dynamically adjusted when Px is larger than D and Py is smaller than D, the complete image of the periodic pattern can be acquired and spliced by at least one objective view field, and compared with the fixed imaging view field, the utilization rate of the objective view field is effectively improved.

Fig. 8 is a schematic structural diagram of a defect detecting device according to an embodiment of the present invention, where the defect detecting device is applicable to a case of detecting defects in a periodic pattern by an automatic optical detecting system, and the defect detecting device may be implemented in a form of software and/or hardware and is generally configured in a control board. As shown in fig. 8, the defect detecting apparatus includes:

A maximum imaging field determination module 51 for determining a maximum imaging field within the field of view of the objective lens according to the size of the periodic pattern in the surface to be measured; the pattern of the maximum imaging view field can be spliced by the pattern of at least one periodic pattern, or the pattern of the periodic pattern can be spliced by the pattern of at least one maximum imaging view field; the image acquisition module 52 is configured to sequentially scan the surface to be measured with a maximum imaging field of view by adopting a step-and-scan manner, so as to acquire an image of the surface to be measured; the defect detection module 53 is configured to compare the image of the surface to be detected with the standard image, and identify and locate a defect of the surface to be detected.

Optionally, the periodic patterns in the surface to be measured are sequentially and periodically arranged in a first direction and/or a second direction, wherein the first direction and the second direction are two directions parallel to the intersection of the surface to be measured; the maximum imaging field determining module 51 may specifically include a first objective field determining unit and a first maximum imaging field determining unit, where the first objective field determining unit is configured to determine, when at least one periodic pattern can be accommodated in the objective field, an arrangement manner of periodic patterns that can be simultaneously accommodated in the objective field and the number of periodic patterns that can be simultaneously accommodated in the first direction and the second direction according to sizes of the objective field and the periodic patterns; the first maximum imaging view field determining unit is used for splicing the number of periodic patterns in the arrangement mode according to the arrangement mode of the periodic patterns which can be simultaneously accommodated in the view field of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction, so as to obtain the maximum imaging view field.

Optionally, the length of the periodic pattern in the first direction is Px, and the length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D; the first objective field-of-view determining unit may specifically include a first objective field-of-view determining subunit configured to, when Px and Py are both smaller than D, according to the following condition:

D>sqrt(m1*Px*m1*Px+n1*Py*n1*Py)，

D<sqrt((m1+1)*Px*(m1+1)*Px+n1*Py*n1*Py)，

D<sqrt(m1*Px*m1*Px+(n1+1)*Py*(n1+1)*Py)，

Optionally, the periodic patterns in the surface to be measured are sequentially and periodically arranged in a first direction and/or a second direction, wherein the first direction and the second direction are two directions parallel to the intersection of the surface to be measured; the maximum imaging field determining module 51 may specifically include a second objective field determining unit and a second maximum imaging field determining unit, where the second objective field determining unit is configured to determine, according to the sizes of the objective field and the periodic pattern, a maximum one of the divided patterns of the periodic pattern that the objective field can accommodate when the divided patterns of at least one of the periodic pattern that is equally formed in the first direction and the second direction are accommodated in the objective field, the divided patterns being a pattern in which the periodic pattern is equally formed in the first direction and the second direction, respectively, and the divided patterns being equally divided in the first direction and the second direction, respectively, by the same or different amounts; the second maximum imaging field determining unit is configured to set a maximum one of the divided patterns of the periodic pattern as a maximum imaging field.

Optionally, the length of the periodic pattern in the first direction is Px, and the length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D; the second objective view field determining unit may specifically include a second objective view field determining unit configured to, when Px and Py are both greater than D, according to the following condition:

D>sqrt(Px/m2*Px/m2+Py/n2*Py/n2)，

D<sqrt(Px/(m2-1)*Px(m2-1)+Py/n2*Py/n2)，

D<sqrt(Px/m2*Px/m2+Py/(n2-1)*Py/(n2-1))，

Optionally, the periodic patterns in the surface to be measured are sequentially and periodically arranged in a first direction and/or a second direction, wherein the first direction and the second direction are two directions parallel to the intersection of the surface to be measured; the maximum imaging field determining module 51 may specifically include determining, according to the size of the field of view of the objective lens and the size of the periodic pattern, a maximum one of the equally divided patterns of the periodic pattern that can be accommodated in the field of view of the objective lens when the equally divided patterns of the at least one periodic pattern in the first direction can be accommodated in the field of view of the objective lens, the equally divided patterns being patterns formed by equally dividing the periodic pattern in the first direction; the third maximum imaging field determining unit is configured to set a maximum one of the divided patterns of the periodic pattern as a maximum imaging field.

Optionally, the length of the periodic pattern in the first direction is Px, and the length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D; the third objective view field determining unit may specifically include a third objective view field determining subunit, where the third objective view field determining subunit is configured to, when Px is greater than D and Py is less than D, according to the following condition:

D>sqrt(Px/m3*Px/m3+Py/n3*Py/n3)，

D<sqrt(Px/(m3-1)*Px(m3-1)+Py/n3*Py/n3)，

The defect detection device provided by the embodiment of the invention can execute the defect detection method provided by any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the execution method.

Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. Terminal devices are intended to represent various forms of digital computers, such as laptops, desktops, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. Terminal devices may also represent various forms of mobile devices such as personal digital assistants, cellular telephones, smart phones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed herein.

As shown in fig. 9, the terminal device 10 includes one or more processors 11, and a storage means, such as a Read Only Memory (ROM) 12, a Random Access Memory (RAM) 13, etc., communicatively connected to the processor 11, wherein the storage means stores computer programs executable by the one or more processors, and the processor 11 can perform various appropriate actions and processes according to the computer programs stored in the Read Only Memory (ROM) 12 or the computer programs loaded from the storage unit 18 into the Random Access Memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the terminal device 10 can also be stored. The processor 11, the ROM 12 and the RAM 13 are connected to each other via a bus 14. An input/output (I/O) interface 15 is also connected to bus 14.

A plurality of components in the terminal device 10 are connected to the I/O interface 15, including: an input unit 16 such as a keyboard, a mouse, etc.; an output unit 17 such as various types of displays, speakers, and the like; a storage unit 18 such as a magnetic disk, an optical disk, or the like; and a communication unit 19 such as a network card, modem, wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information/data with other devices via a computer network, such as the internet, and/or various telecommunication networks.

The processor 11 may be a variety of general and/or special purpose processing components having processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various specialized Artificial Intelligence (AI) computing chips, various processors running machine learning model algorithms, digital Signal Processors (DSPs), and any suitable processor, controller, microcontroller, etc. The processor 11 performs the various methods and processes described above, such as defect detection methods.

In some embodiments, the defect detection method may be implemented as a computer program tangibly embodied on a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and/or installed onto the terminal device 10 via the ROM 12 and/or the communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the defect detection method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to perform the defect detection method by any other suitable means (e.g. by means of firmware).

Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuit systems, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), systems On Chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs, the one or more computer programs may be executed and/or interpreted on a programmable system including at least one programmable processor, which may be a special purpose or general-purpose programmable processor, that may receive data and instructions from, and transmit data and instructions to, a storage system, at least one input device, and at least one output device.

A computer program for carrying out methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the computer programs, when executed by the processor, cause the functions/acts specified in the flowchart and/or block diagram block or blocks to be implemented. The computer program may execute entirely on the machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.

In the context of the present invention, a computer-readable storage medium may be a tangible medium that can contain, or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, the computer readable storage medium may be a machine readable signal medium. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

To provide for interaction with a user, the systems and techniques described here can be implemented on a terminal device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which a user can provide input to the terminal device. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic input, speech input, or tactile input.

The systems and techniques described here can be implemented in a computing system that includes a background component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front-end component (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such background, middleware, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local Area Networks (LANs), wide Area Networks (WANs), blockchain networks, and the internet.

The computing system may include clients and servers. The client and server are typically remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server can be a cloud server, also called a cloud computing server or a cloud host, and is a host product in a cloud computing service system, so that the defects of high management difficulty and weak service expansibility in the traditional physical hosts and VPS service are overcome.

It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present invention may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present invention are achieved, and the present invention is not limited herein.

Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims

1. A defect detection method, comprising:

2. The defect detection method according to claim 1, wherein the periodic patterns in the surface to be detected are sequentially periodically arranged in a first direction and/or a second direction, the first direction and the second direction being two directions parallel to an intersection of the surface to be detected;

when at least one periodic pattern can be accommodated in the field of view of the objective lens, determining an arrangement mode of the periodic patterns which can be simultaneously accommodated in the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction according to the sizes of the field of view of the objective lens and the periodic patterns;

and according to the arrangement mode of the periodic patterns which can be simultaneously accommodated by the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction, splicing the number of the periodic patterns in the arrangement mode to obtain the maximum imaging field of view.

3. The defect detection method according to claim 2, wherein a length of the periodic pattern in the first direction is Px, and a length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D;

when at least one periodic pattern can be accommodated in the field of view of the objective lens, determining an arrangement mode of the periodic patterns which can be simultaneously accommodated in the field of view of the objective lens and the number of the periodic patterns which can be simultaneously accommodated in the first direction and the second direction according to the sizes of the field of view of the objective lens and the periodic patterns, wherein the method comprises the following steps:

when Px and Py are both less than D, the following conditions are used:

D>sqrt(m1*Px*m1*Px+n1*Py*n1*Py)，

D<sqrt((m1+1)*Px*(m1+1)*Px+n1*Py*n1*Py)，

D<sqrt(m1*Px*m1*Px+(n1+1)*Py*(n1+1)*Py)，

determining the number m1 of the periodic patterns that the field of view of the objective lens can accommodate in the first direction and the number n1 of the periodic patterns that the field of view of the objective lens can accommodate in the second direction at the same time; wherein m1 and n1 are both positive integers.

4. The defect detection method according to claim 1, wherein the periodic patterns in the surface to be detected are sequentially periodically arranged in a first direction and/or a second direction, the first direction and the second direction being two directions parallel to an intersection of the surface to be detected;

when at least one aliquoting pattern formed by aliquoting the periodic pattern in the first direction and the second direction can be contained in the field of view of the objective lens, determining the largest aliquoting pattern of the periodic pattern which can be contained in the field of view of the objective lens according to the sizes of the field of view of the objective lens and the periodic pattern, wherein the aliquoting pattern is a pattern formed by aliquoting the periodic pattern in the first direction and the second direction, and the aliquoting patterns are respectively equal or different in aliquoting quantity in the first direction and the second direction;

and taking the largest one of the divided patterns of the periodic pattern as the largest imaging view field.

5. The defect detection method according to claim 4, wherein a length of the periodic pattern in the first direction is Px, and a length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D;

when at least one aliquoting pattern formed by aliquoting the periodic pattern in the first direction and the second direction can be contained in the field of view of the objective lens, determining the largest aliquoting pattern of the periodic pattern which can be contained in the field of view of the objective lens according to the sizes of the field of view of the objective lens and the periodic pattern, wherein the aliquoting pattern is a pattern formed by aliquoting the periodic pattern in the first direction and the second direction respectively, and the aliquoting patterns are respectively equal to or different in the aliquoting number in the first direction and the second direction respectively, and the method comprises the following steps:

When Px and Py are both greater than D, the following conditions are used:

D>sqrt(Px/m2*Px/m2+Py/n2*Py/n2)，

D<sqrt(Px/(m2-1)*Px(m2-1)+Py/n2*Py/n2)，

D<sqrt(Px/m2*Px/m2+Py/(n2-1)*Py/(n2-1))，

determining the periodic pattern while a number m2 of the largest division pattern equally divisible into the periodic pattern in the first direction and a number n2 of the largest division pattern equally divisible into the periodic pattern in the second direction; wherein m2 and n2 are positive integers greater than or equal to 2.

6. The defect detection method according to claim 1, wherein the periodic patterns in the surface to be detected are sequentially periodically arranged in a first direction and/or a second direction, the first direction and the second direction being two directions parallel to an intersection of the surface to be detected;

when at least one halving pattern of the periodic pattern in the first direction can be contained in the field of view of the objective lens, determining the largest halving pattern of the periodic pattern which can be contained in the field of view of the objective lens according to the field of view of the objective lens and the size of the periodic pattern, wherein the halving pattern is formed by halving the periodic pattern in the first direction;

7. The defect detection method according to claim 6, wherein a length of the periodic pattern in the first direction is Px, and a length of the periodic pattern in the second direction is Py; the field of view of the objective lens is circular, and the diameter of the field of view of the objective lens is D;

when at least one aliquoting pattern of the periodic pattern in the first direction can be contained in the field of view of the objective lens, determining the largest aliquoting pattern of the periodic pattern which can be contained in the field of view of the objective lens according to the field of view of the objective lens and the size of the periodic pattern, wherein the aliquoting pattern is formed by aliquoting the periodic pattern in the first direction, and comprises the following steps:

when Px is greater than D and Py is less than D, the following conditions are used:

D>sqrt(Px/m3*Px/m3+Py/n3*Py/n3)，

D<sqrt(Px/(m3-1)*Px(m3-1)+Py/n3*Py/n3)，

determining a number n3 of the periodic patterns that the field of view of the objective lens can accommodate in the second direction; wherein n3 is a positive integer greater than or equal to 1; determining a number m3 of maximum division patterns in which the periodic pattern can be divided equally into the periodic pattern in the first direction; wherein m3 is a positive integer greater than or equal to 2.

8. A defect detection apparatus, comprising:

9. An electronic device, comprising:

one or more processors;

a storage means for storing one or more programs;

the one or more programs, when executed by the one or more processors, cause the one or more processors to implement the defect detection method of any of claims 1-7.

10. A computer-readable storage medium, on which a computer program is stored, characterized in that the program, when being executed by a processor, implements the defect detection method as claimed in any one of claims 1-7.