CN116810218A - Manufacturing method of high-weldability micro round welding strip - Google Patents
Manufacturing method of high-weldability micro round welding strip Download PDFInfo
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- CN116810218A CN116810218A CN202310854997.6A CN202310854997A CN116810218A CN 116810218 A CN116810218 A CN 116810218A CN 202310854997 A CN202310854997 A CN 202310854997A CN 116810218 A CN116810218 A CN 116810218A
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- 238000003466 welding Methods 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 126
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 230000004907 flux Effects 0.000 claims abstract description 33
- 238000005476 soldering Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 238000000137 annealing Methods 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 238000004804 winding Methods 0.000 claims description 18
- 230000007704 transition Effects 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000005491 wire drawing Methods 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000007667 floating Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
Abstract
The invention provides a manufacturing method of a high-weldability micro round solder strip, which comprises the steps of S1, forming a special-shaped copper wire by a copper wire die, S2, heating and annealing the special-shaped copper wire, S3, precoating soldering flux on the surface of the special-shaped copper wire, S4, carrying out hot dip tinning on the special-shaped copper wire coated with the soldering flux to obtain the micro round solder strip, S5, carrying out air cooling treatment on the round solder strip, and S6, timely rolling the prepared solder strip. The micro round solder strip manufactured by the method adopts the copper wire with the special-shaped structure, so that the copper wire is not easy to melt during tin plating, the tin layer of the solder strip after molding is larger than the tin coated on the outer side of the pure round copper wire, the solder strip is easier to melt during welding, the welding reliability is improved, and the yield of manufacturing the micro round solder strip is improved.
Description
Technical Field
The invention belongs to the technical field of photovoltaic power generation, and relates to a manufacturing method of a high-weldability micro round welding strip.
Background
In recent years, the photovoltaic industry has developed rapidly, and new product types are continuously emerging. The final purpose of various technical flows is to further improve the power and the power generation capacity of the assembly, so that the product efficiency can be maximally exerted. For MBB technology, the industry appears to have no clear definition of how many main gates are. It is now apparent that each of 7BB, 9BB, 12BB and 18BB is called MBB, and the solder strips are usually circular. At the same time, the diameter of the circular welding strip is reduced from 0.4mm to 0.35mm,0.30mm and 0.28mm to 0.26mm, and the diameter is also reduced.
At present, a tin layer with the diameter of about 10 mu m is plated on the outer surface of a round copper wire by adopting a hot dip plating mode, and the diameter size of the welding strip always tends to be reduced along with the change of assembly technology. With the reduction of the diameter size of the circular welding strip, copper wires are easy to burn out when hot dip plating is adopted, and the thinner tin carrying amount of the wires cannot meet the requirement, so that the manufacturing is more difficult and the energy production is not realized.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a manufacturing method of a high-weldability micro round solder strip, which comprises the following steps:
s1, forming a copper wire by a die: preparing copper wires to be formed, putting the copper wires into a special-shaped die for wiredrawing forming to form special-shaped copper wires,
s2, heating and annealing: the special-shaped copper wire is subjected to one-time online voltage type heating annealing treatment, the voltage range is 42-55V when the operating speed of the online voltage type is 300m/min,
s3, pre-coating soldering flux: the treated special-shaped copper wire is put into soldering flux, a layer of soldering flux is coated on the surface of the special-shaped copper wire,
s4, hot dip tinning: immersing the special-shaped copper wire pre-coated with the soldering flux into a tin solution, then passing through a tin mould and an annular air knife, wherein the tin mould floats on the surface of the tin solution, plating a layer of tin on the outer side of the special-shaped copper wire by adopting the annular air knife to form a circular welding strip,
s5, air cooling: the round welding strip is subjected to blowing cooling treatment by adopting an air cooler, the outlet air pressure is required to be controlled between 0.01 and 0.03MPa,
s6, winding: and (5) carrying out timely winding operation on the cooled formed circular welding strip by adopting a winding machine.
Further, the cross section diameter of the formed circular welding strip is between 0.12 and 0.24mm.
Further, the cross section of the special-shaped copper wire formed by adopting the special-shaped die is in a shape that the outer side of the special-shaped copper wire is formed into a regular polygon or an arc regular polygon by a straight line or an outer convex arc, and the angles formed by two adjacent edges are in arc transition.
Further, the cross-sectional shape of the profiled copper wire includes: regular octagons, regular hexagons, regular pentagons, regular quadrilaterals, regular trilaterals, circular-arc regular hexagons, circular-arc regular pentagons, circular-arc regular quadrilaterals, circular-arc regular trilaterals.
Further, the center lines of the tin mould and the annular air knife in the step S4 in the vertical direction are the same straight line.
Further, the hot dip tinning in step S4: and plating a layer of tin on the outer side of the special-shaped copper wire by adopting a horizontal tin plating mode to form a circular welding strip.
Further, the round welding strip is formed by a special-shaped copper wire and a tin layer, the tin layer is wrapped on the outer side of the special-shaped copper wire, the cross section structure of the tin layer is annular, the outer side is round, and the inner side is regular polygon or circular arc regular polygon with the same cross section shape as the special-shaped copper wire.
Further, when the special-shaped copper wires are subjected to heating annealing treatment, different voltages are adopted aiming at the special-shaped copper wires with different sizes.
Further, the outer side diameter of the special-shaped die used in the copper wire forming process is 20mm, and the thickness is 10mm.
The purpose of adopting the heating annealing treatment before the soldering flux precoating is to soften the special-shaped copper material subjected to cold drawing, improve the plasticity and toughness, homogenize chemical components and remove residual stress so as to obtain expected physical properties.
Compared with the prior art, the invention has the following beneficial effects:
(1) The metal matrix positioned in the center of the micro circular welding strip adopts a special-shaped structure, and each side adopts a straight line or arc form, so that the actual external circular size of the cross section of the metal matrix can be increased under the condition of meeting the welding requirement, and the metal matrix is not easy to blow and tin plating during welding;
(2) The welding strip formed by the method is circular in shape, so that the size of a coating body is easier to control, the concentricity of a metal matrix in the welding strip and the coating body is easier to ensure, the manufacturing and the processing are easier, and the mass production of the welding strip is ensured;
(3) The tin plating amount of the solder strip tin layer formed by the method is larger than that of the solder strip tin layer formed by the method, which is in a pure circular shape in the cross section of the plating layer body, and the solder strip tin layer is easier to melt during welding, so that the welding reliability is improved, and the problems of white leakage and cold joint in the welding process are greatly reduced.
(4) The micro round welding strip is small in manufacturing size, and the adopted manufacturing equipment is small in size, so that the occupied area in the manufacturing process is small, and the manufacturing cost is saved.
Drawings
FIG. 1 is a flow chart of a method of making a micro circular solder strip according to the present invention;
FIG. 2 is a schematic cross-sectional view of a micro round solder strip with a regular octagon cross-sectional shape of a special-shaped copper wire;
FIG. 3 is a schematic cross-sectional view of a micro round solder strip with a regular hexagonal cross-sectional shape of a profiled copper wire;
FIG. 4 is a schematic cross-sectional view of a micro circular welding strip with a regular hexagonal arc cross-sectional shape of a special-shaped copper wire;
FIG. 5 is a schematic cross-sectional view of a micro-round solder strip with a regular pentagon cross-sectional shape of a profiled copper wire;
FIG. 6 is a schematic cross-sectional view of a micro circular weld zone with a special-shaped copper wire having a cross-sectional shape of a circular arc regular pentagon;
FIG. 7 is a schematic cross-sectional view of a micro round solder strip with a regular quadrilateral cross-sectional shape of a profiled copper wire;
FIG. 8 is a schematic cross-sectional view of a micro circular weld zone with a regular square arc cross-sectional shape of a special-shaped copper wire;
FIG. 9 is a schematic cross-sectional view of a micro round solder strip with a regular trilateral cross-sectional shape of a profiled copper wire;
FIG. 10 is a schematic cross-sectional view of a micro circular weld zone with a cross-sectional shape of a special-shaped copper wire being a circular arc normal triangle;
FIG. 11 is a schematic cross-sectional view of a solder strip with a concave arc structure on the outer side of the cross section of a special-shaped copper wire;
FIG. 12 is a schematic view of a round mold used in the present invention;
fig. 13 is a schematic structural view of an annular air knife used in the present invention.
Wherein: 1-tin layer; 2-special-shaped copper wires.
Detailed Description
The invention is described in further detail below with reference to the attached drawing figures:
referring to the flow chart of the method for manufacturing the micro circular welding strip shown in the attached figure 1, the method for manufacturing the micro circular welding strip mainly comprises the following steps: and (3) forming a copper wire mould, heating and annealing, pre-coating soldering flux, hot dip tinning, air cooling and winding. Firstly, the micro circular welding strip manufactured by the invention has the cross section diameter dimension of 0.12-0.24mm, and is tinned by an annular air knife with the diameter of 0.14-0.26mm circular mould and a through hole with the diameter of 0.15-0.30 mm. When the diameter of the cross section of the micro circular welding strip is required to be 0.12-0.24mm, the diameter of the center circular hole of the tin plating mould is 0.14-0.26mm.
According to an embodiment of the invention, the die forming tool of the copper wire is operated as: preparing copper wires to be processed and formed, manufacturing fine round welding strips with different sizes, selecting copper wires with different diameters, and under a normal state, placing the selected copper wires with the diameter larger than the diameter of an circumscribed circle of the finally wiredrawing and forming special-shaped copper wire 2 into a special-shaped die for wiredrawing and forming to form the special-shaped copper wire 2.
According to the embodiment of the invention, the specific operation of the heating annealing is as follows: the special-shaped copper wire 2 is subjected to one-time online voltage type heating annealing treatment, the voltage range is 42-55V when the running speed of the online voltage type is 300m/min, and the voltages adopted by the special-shaped copper wires 2 with different sizes are different, so that the special-shaped copper wires 2 are not easy to be blown by excessive voltage and current in the heating process.
According to an embodiment of the invention, the specific operation of the soldering flux precoating is: the special-shaped copper wire 2 subjected to the heating annealing treatment is placed into soldering flux, a layer of soldering flux is coated on the surface of the special-shaped copper wire 2, the surface of the special-shaped copper wire 2 is guaranteed to be wrapped by the soldering flux in the process of coating the soldering flux, the thickness of the soldering flux coated on the surface of the special-shaped copper wire 2 is guaranteed to be uniform as much as possible in the process of coating the soldering flux, so that the shape of the special-shaped copper wire is guaranteed not to be changed in structure, and the outer side of the special-shaped copper wire 2 is guaranteed to be completely wrapped by the tin layer 1 in the subsequent hot dip tinning process, and the tinning thickness is uniform.
According to an embodiment of the invention, the specific operation of hot dip tinning is: immersing the special-shaped copper wire 2 pre-coated with the soldering flux into a tin solution, passing through a tin die, then discharging the tin solution, passing through an annular air knife, floating the tin die on the surface of the tin solution to control the concentricity of the tin layer, and controlling the thickness of the tin layer 1 on the outer side of the special-shaped copper wire by the annular air knife to form a circular welding strip. Before tin plating, the center line of the center circular hole of the tin mould and the center line of the center circular hole of the annular air knife are ensured to be the same straight line in the vertical direction, and the structures of the tin mould and the annular air knife can be seen in figures 12-13.
According to the embodiment of the invention, the special-shaped copper wire pre-coated with the soldering flux can be placed in a horizontal tinning device for carrying out a horizontal tinning operation.
According to an embodiment of the invention, the specific operation of wind cooling is: the prepared circular welding strip is subjected to air blowing cooling treatment by adopting an air cooler, the air pressure of an outlet is required to be controlled to be between 0.01 and 0.03Mpa, and the air pressures corresponding to the circular welding strips with different section diameters are different, because the section diameter of the circular welding strip manufactured by the invention is between 0.12 and 0.24mm, the circular welding strip belongs to a micro circular welding strip, and the rapid shaping is required, and the structure is required to be ensured not to be changed in the shaping process.
According to the embodiment of the invention, the specific operation of rolling is as follows: and (5) carrying out timely winding operation on the cooled formed circular welding strip by adopting a winding machine.
The size of the circular welding strip produced by the invention is smaller and is only 0.12-0.24mm, and the equipment used in the technical operation process is smaller in the manufacturing production process, so that the occupied space of the whole manufacturing assembly line is smaller.
In order to more specifically explain the method of producing the fine round solder strip of the present invention, the following examples will be used.
Example 1
The diameter of the cross section of the micro round solder strip to be manufactured is 0.12mm.
The manufacturing method of the micro round welding strip with the cross section diameter of 0.12mm comprises the following steps:
s1, forming a copper wire by a die: preparing copper wires to be formed, putting the copper wires into a special-shaped die for wiredrawing forming to form special-shaped copper wires 2,
s2, heating and annealing: the special-shaped copper wire 2 is subjected to one-time online voltage type heating annealing treatment, the voltage is 42V when the operating speed of the online voltage type is 300m/min,
s3, pre-coating soldering flux: the treated special-shaped copper wire 2 is put into soldering flux, a layer of soldering flux is coated on the surface of the special-shaped copper wire 2,
s4, hot dip tinning: immersing the special-shaped copper wire 2 pre-coated with the soldering flux into a tin solution, sequentially passing through a tin mould with the diameter of 0.14mm and an annular air knife, wherein the tin mould floats on the surface of the tin solution, plating a layer of tin on the outer side of the special-shaped copper wire 2 by adopting the annular air knife with the diameter of 0.15mm to form a circular welding strip with the cross section diameter of 0.12mm,
s5, air cooling: the round welding strip is subjected to blowing cooling treatment by adopting an air cooler, the outlet air pressure is required to be controlled at 0.01MPa,
s6, winding: and (5) carrying out timely winding operation on the cooled formed circular welding strip by adopting a winding machine.
Example 2
The diameter of the cross section of the micro round solder strip to be manufactured is 0.18mm.
The manufacturing method of the micro round solder strip with the cross section diameter of 0.18mm comprises the following steps:
s1, forming a copper wire by a die: preparing copper wires to be formed, putting the copper wires into a special-shaped die for wiredrawing forming to form special-shaped copper wires 2,
s2, heating and annealing: the special-shaped copper wire 2 is subjected to one-time online voltage type heating annealing treatment, the voltage is 48V when the running speed of the online voltage type is 300m/min,
s3, pre-coating soldering flux: the treated special-shaped copper wire 2 is put into soldering flux, a layer of soldering flux is coated on the surface of the special-shaped copper wire,
s4, hot dip tinning: immersing the special-shaped copper wire 2 pre-coated with the soldering flux into a tin solution, sequentially passing through a tin die with the diameter of 0.20mm and an annular air knife, floating the tin die on the surface of the tin solution, plating a layer of tin on the outer side of the special-shaped copper wire 2 by adopting the annular air knife with the through hole diameter of 0.21mm to form a circular welding strip with the cross section diameter of 0.18mm,
s5, air cooling: the round welding strip is subjected to blowing cooling treatment by adopting an air cooler, the outlet air pressure is required to be controlled at 0.02MPa,
s6, winding: and (5) carrying out timely winding operation on the cooled formed circular welding strip by adopting a winding machine.
Example 3
The diameter of the cross section of the micro round solder strip to be manufactured is 0.24mm.
The manufacturing method of the micro round welding strip with the cross section diameter of 0.24mm comprises the following steps:
s1, forming a copper wire by a die: preparing copper wires to be formed, putting the copper wires into a special-shaped die for wiredrawing forming to form special-shaped copper wires 2,
s2, heating and annealing: the special-shaped copper wire 2 is subjected to one-time online voltage type heating annealing treatment, the voltage is 55V when the operating speed of the online voltage type is 300m/min,
s3, pre-coating soldering flux: the treated special-shaped copper wire 2 is put into soldering flux, a layer of soldering flux is coated on the surface of the special-shaped copper wire 2,
s4, hot dip tinning: immersing the special-shaped copper wire 2 pre-coated with the soldering flux into a tin solution, sequentially passing through a tin die with the diameter of 0.26mm and an annular air knife, floating the tin die on the surface of the tin solution, plating a layer of tin on the outer side of the special-shaped copper wire by adopting the annular air knife with the through hole diameter of 0.30mm to form a circular welding strip with the cross section diameter of 0.24mm,
s5, air cooling: the round welding strip is subjected to blowing cooling treatment by adopting an air cooler, the outlet air pressure is required to be controlled at 0.03MPa,
s6, winding: and (5) carrying out timely winding operation on the cooled formed circular welding strip by adopting a winding machine.
According to the embodiment, for manufacturing the micro circular welding strips with different diameters, tin dies with different diameters, annular air knives with different diameters of the through holes, different voltages in the heating annealing process and different wind pressures in the air cooling process are needed. Compared with the common welding strip manufacturing process, the manufacturing speed is higher, and the mass production of the micro round welding strip manufactured by the invention can be ensured.
The micro circular solder strip structure manufactured by the above operation steps of the present invention can be referred to fig. 2-10. However, it should be emphasized that the structural shape of the micro round solder strip manufactured by the manufacturing method of the micro round solder strip according to the present invention is not limited to the structural shape provided in the drawings. The cross section of the special-shaped copper wire 2 shown in fig. 2 is regular octagon, the outer side of the cross section of the tin layer is circular, the inner side of the cross section of the tin layer is regular octagon, and the joint of two adjacent edges is in arc transition. The cross section of the special-shaped copper wire shown in the figure 3 is regular hexagon, the outer side of the cross section of the tin layer 1 is circular, the inner side of the cross section of the tin layer is regular hexagon, and the joint of two adjacent edges is in arc transition. The cross section of the special-shaped copper wire 2 shown in fig. 4 is in a circular arc regular hexagon, the outer side of the cross section of the tin layer 1 is in a circular shape, the inner side of the cross section of the tin layer is in a circular arc regular hexagon, and the joint of two adjacent edges is in circular arc transition. The cross section of the special-shaped copper wire 2 shown in fig. 5 is regular pentagon, the outer side of the cross section of the tin layer 1 is circular, the inner side of the cross section of the tin layer is regular pentagon, and the joint of two adjacent edges is in arc transition. The cross section of the special-shaped copper wire 2 shown in fig. 6 is a circular arc regular pentagon, the outer side of the cross section of the tin layer 1 is a circle, the inner side of the cross section of the special-shaped copper wire is a circular arc regular pentagon, and the joint of two adjacent edges is in circular arc transition. The cross section of the special-shaped copper wire 2 shown in fig. 7 is regular quadrangle, the outer side of the cross section of the tin layer 1 is circular, the inner side of the cross section of the tin layer is regular quadrangle, and the joint of two adjacent edges is in arc transition. The cross section of the special-shaped copper wire 2 shown in fig. 8 is in a circular arc regular quadrangle, the outer side of the cross section of the tin layer 1 is in a circular shape, the inner side of the cross section is in a circular arc regular quadrangle, and the joint of two adjacent edges is in circular arc transition. The cross section of the special-shaped copper wire 2 shown in fig. 9 is in a regular triangle, the outer side of the cross section of the tin layer 1 is in a round shape, the inner side of the cross section of the tin layer is in a regular triangle, and the joint of two adjacent sides carries out arc transition. The cross section of the special-shaped copper wire 2 shown in fig. 10 is in a circular arc regular triangle, the outer side of the cross section of the tin layer 1 is in a circular shape, the inner side of the cross section of the tin layer is in a circular arc regular triangle, and the joint of two adjacent edges carries out circular arc transition.
According to the embodiment of the invention, the arc transition is arranged on the special-shaped copper wire 2, so that the size of the circumscribed circle of the cross section of the special-shaped copper wire 2 is increased as much as possible on the premise of meeting the size of a welding strip, the special-shaped copper wire 2 is thickened, and the conditions that the special-shaped copper wire 2 is not easy to blow and is easier to tin plating operation in the tin plating welding process are met.
According to the embodiment of the invention, the schematic cross section of the welding strip with the inner concave arc structure is shown by 11, and experiments show that when the special-shaped copper wire 2 is of the inner concave arc structure, the metal copper wire 2 is easily fused at high temperature when tinning due to the fact that the special-shaped copper wire 2 is a relatively thin copper wire, so that each side of the special-shaped copper wire provided by the invention is straight or is of an outer concave arc shape, the area of the cross section of the special-shaped copper wire 2 is increased, and the risk of easy fusing when tinning is carried out on the outer side of the special-shaped copper wire 2 is reduced.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Claims (9)
1. The manufacturing method of the high-weldability fine round solder strip is characterized by comprising the following steps of:
s1, forming a copper wire by a die: preparing copper wires to be formed, putting the copper wires into a special-shaped die for wiredrawing forming to form special-shaped copper wires,
s2, heating and annealing: the special-shaped copper wire is subjected to one-time online voltage type heating annealing treatment, the voltage range is 42-55V when the operating speed of the online voltage type is 300m/min,
s3, pre-coating soldering flux: the treated special-shaped copper wire is put into soldering flux, a layer of soldering flux is coated on the surface of the special-shaped copper wire,
s4, hot dip tinning: immersing the special-shaped copper wire pre-coated with the soldering flux into a tin solution, then passing through a tin mould and an annular air knife, wherein the tin mould floats on the surface of the tin solution, plating a layer of tin on the outer side of the special-shaped copper wire by adopting the annular air knife to form a circular welding strip,
s5, air cooling: the round welding strip is subjected to blowing cooling treatment by adopting an air cooler, the outlet air pressure is required to be controlled between 0.01 and 0.03MPa,
s6, winding: and (5) carrying out timely winding operation on the cooled formed circular welding strip by adopting a winding machine.
2. The method of manufacturing a highly solderable micro circular solder strip of claim 1 wherein the cross-sectional diameter of the shaped circular solder strip is between 0.12mm and 0.24mm.
3. The method for manufacturing the high-weldability fine round solder strip according to claim 1, wherein the cross section of the special-shaped copper wire drawn by the special-shaped die is shaped as a regular polygon or an arc regular polygon formed by straight lines or convex arcs on the outer side, and the angles formed by two adjacent edges are in arc transition.
4. The method for manufacturing a high-weldability fine round solder strip of claim 3, wherein the cross-sectional shape of the profiled copper wire comprises: regular octagons, regular hexagons, regular pentagons, regular quadrilaterals, regular trilaterals, circular-arc regular hexagons, circular-arc regular pentagons, circular-arc regular quadrilaterals, circular-arc regular trilaterals.
5. The method for manufacturing a highly-solderable micro circular solder strip of claim 1 wherein the center lines of the tin mold and the annular air knife in the step S4 in the vertical direction are the same straight line.
6. The method of manufacturing a high-solderability fine round solder strip of claim 5 wherein the hot dip tinning in step S4: and plating a layer of tin on the outer side of the special-shaped copper wire by adopting a horizontal tin plating mode to form a circular welding strip.
7. The method for manufacturing the high-weldability fine round solder strip according to claim 6, wherein the round solder strip is composed of a special-shaped copper wire and a tin layer, the tin layer is wrapped on the outer side of the special-shaped copper wire, the tin layer is annular in cross section structure, the outer side is round, and the inner side is regular polygon or circular arc regular polygon with the same cross section shape as the special-shaped copper wire.
8. The method for manufacturing a high-weldability fine round solder strip according to claim 1, wherein the voltage used is different for the special-shaped copper wires with different wire diameters when the special-shaped copper wires are subjected to the heating annealing treatment.
9. The method for manufacturing a high-weldability fine round solder strip according to claim 1, wherein the outer side diameter of the special-shaped dies used in the forming of the copper wire is 20mm, and the thickness is 10mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310854997.6A CN116810218A (en) | 2023-07-13 | 2023-07-13 | Manufacturing method of high-weldability micro round welding strip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310854997.6A CN116810218A (en) | 2023-07-13 | 2023-07-13 | Manufacturing method of high-weldability micro round welding strip |
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| CN116810218A true CN116810218A (en) | 2023-09-29 |
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| CN202310854997.6A Pending CN116810218A (en) | 2023-07-13 | 2023-07-13 | Manufacturing method of high-weldability micro round welding strip |
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