CN116806244A

CN116806244A - encapsulated adhesive

Info

Publication number: CN116806244A
Application number: CN202180087135.4A
Authority: CN
Inventors: 史蒂文·S·拜克
Original assignee: Shi DiwenSBaike
Current assignee: Shi DiwenSBaike
Priority date: 2020-12-23
Filing date: 2021-12-21
Publication date: 2023-09-26
Also published as: EP4267689A1; WO2022140407A1

Abstract

An adhesive for a package inserted into a cavity having a first volume and a method of manufacturing the adhesive for the package are presented. The encapsulated adhesive includes a second volume of adhesive material and a non-adhesive encapsulant substantially surrounding the adhesive material. The encapsulant is strong enough to withstand handling and storage, but breaks in response to pressure, exposing the adhesive material. Also proposed is a method of bonding two parts by forming a first cavity in a first part, inserting an encapsulated adhesive into the first cavity, and inserting a member into the first cavity to break the encapsulation.

Description

Encapsulated adhesive

Cross Reference to Related Applications

The present application is a continuation-in-part application from U.S. patent application Ser. No.17/133,191, filed 12/23/2020, claiming the benefit of U.S. provisional application Ser. No.63/083,660, filed 9/25/2020, both of which are incorporated herein by reference.

Background

The present disclosure relates generally to adhesives, and in particular to methods and apparatus for applying adhesives.

Adhesives or glues are widely used in a variety of applications to bond or attach two or more objects together. Although adhesives are very useful, handling of the adhesives is cumbersome because they may adhere to objects in a one-touch fashion and cause spillage. Thus, the adhesive is typically packaged in a container or tube having a built-in closable opening through which the adhesive can be dispensed in a controlled manner. The packaging facilitates easy transportation, storage and use of the adhesive.

However, even in the case of packaging, the adhesive is still difficult to apply. One example of such a situation, in which the use of adhesive is often omitted despite its advantages, is in assembling flat packaged furniture or accessories using mortice and tenon (mortise-and-tenons) or dowel-and-hole constructions. The mortise and tenon type joints connect two components together by pushing the tenon/mortise into the mortise/hole of the component. The attachment is as secure as the mating tightness. Although the attachment may be significantly enhanced by the use of an adhesive between the tenon/mortise and mortise/holes, the use of an adhesive is generally avoided due to the lack of ability for a typical user to properly apply the adhesive. Thus, the assembled furniture or accessories may suffer from a loss of structural integrity over time due to loosening of the joints.

While flat pack furniture is typically packaged with small tools such as screwdrivers, screws, allen wrenches, or wrenches, adhesives are typically not included. The adhesive is generally not included because it can cause potential confusion if it leaks during storage or shipping, and because its method of application can make use challenging for typical consumers. If the user is not careful or skillful enough, the adhesive may even damage the furniture components.

What is desired are methods and apparatus for the controlled application of adhesives.

Disclosure of Invention

In one aspect, the present inventive concept relates to an adhesive for a package inserted into a cavity having a first volume. A cavity is formed in the member. The encapsulated adhesive includes a second volume of adhesive material and a non-adhesive encapsulant surrounding and surrounding the adhesive material. The second volume of the adhesive material is less than the first volume of the cavity.

In another aspect, the present inventive concept relates to a method of preparing an encapsulated adhesive. The method entails mixing an adhesive material with a first reactant to form an adhesive mixture and placing the adhesive mixture in contact with a second reactant to form a spherically shaped encapsulant around the adhesive mixture. Each of the first reactant and the second reactant is one of sodium alginate and calcium chloride.

Inclusion of the adhesive within the package makes the adhesive easier to store, transport, and use.

Drawings

Fig. 1 depicts an encapsulated adhesive according to one embodiment of the inventive concept.

Fig. 2 depicts a method of preparing an encapsulated adhesive according to one embodiment of the inventive concept.

Fig. 3 depicts another example method of preparing an encapsulated adhesive.

Fig. 4A depicts a method of preparing an encapsulated adhesive according to another embodiment of the inventive concept.

Fig. 4B depicts another method of preparing an encapsulated adhesive according to another embodiment of the inventive concept.

Fig. 5 depicts an exemplary use of the encapsulated adhesive.

Fig. 6A, 6B and 6C depict another exemplary use of the encapsulated adhesive.

Fig. 7A depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept.

Fig. 7B depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept.

Fig. 8 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept.

Fig. 9 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept.

Fig. 10A, 10B and 10C depict an encapsulated adhesive 10 according to one embodiment of the inventive concept.

Fig. 11A, 11B, 11C, 11D, 11E, 11F, and 11G depict different shapes of the packaged adhesive.

Fig. 12A and 12B depict packaged adhesives according to various embodiments of the inventive concept.

Fig. 13 depicts an encapsulated adhesive according to one embodiment of the inventive concept.

Fig. 14 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept.

Fig. 15A, 15B, 15C, 15D, and 15E depict embodiments of dowels that may be used with the adhesive of the package.

Fig. 16A and 16B illustrate an encapsulated adhesive according to one embodiment of the inventive concept.

Detailed Description

The present inventive concept relates to a method of preparing an adhesive that is easy to handle and an adhesive prepared in this way. There are many types of adhesive materials. One embodiment of the present application uses non-water-based adhesive materials such as epoxy, polyurethane, cyanoacrylate (crazy glue), non-aqueous polyvinyl acetate (e.g., white glue), non-aqueous aliphatic glue (e.g., wood glue), and animal glue/skin glue, it being understood that the inventive concepts disclosed herein are applicable for use with other types of adhesive materials. In one aspect of the application, the non-aqueous based adhesive may be paired with any suitable encapsulant. In another embodiment, a water-based adhesive may be used, and the water-based adhesive is preferably paired with a water-impermeable encapsulant, such as plastic or polymer or glass. More generally, the application may be implemented with any adhesive contained in a suitable package. The encapsulant may comprise gelatin, calcium alginate, plastic, polymer, glass, ceramic, metal, composite, glass fiber, carbon fiber, or any combination thereof. The encapsulant may be formed in one or more layers of different materials.

In a particular aspect of the present disclosure, the encapsulated adhesive is used to assemble wood or cellulose-based structures, such as furniture. Additional aspects of the inventive concept include methods of making encapsulated adhesives using encapsulation machines, pouch machines, two-piece capsules, and other methods set forth. In one particular aspect of the manufacturing method, this technique is applied to materials and parameters (e.g., dimensions and volumes) to produce an adhesive suitable for encapsulation of wood or cellulose based structures such as furniture.

Fig. 1 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept. As shown, the encapsulated adhesive 10 includes an adhesive mixture 20 contained in an encapsulant 30. The adhesive mixture 20 includes adhesive material and any additives (e.g., to achieve a desired consistency, pH, color). The encapsulant 30 is not tacky or adhesive and can withstand low levels of pressure or impact. The encapsulant 30 may be a flexible polymeric material, such as calcium alginate, gelatin, or a brittle material, such as glass or plastic. This encapsulation makes handling of the adhesive mixture 20 easier.

Fig. 2 depicts a method of preparing an encapsulated adhesive 10 according to one embodiment of the inventive concept. In this embodiment, a specialized apparatus, such as the apparatus used to manufacture paintballs (paint balls), which is typically the same manufacturing technique used to manufacture gelatin capsules, is used to prepare the encapsulated adhesive 10. In the example shown in fig. 2, two strips of encapsulant material (e.g., softened plastic or gelatin) are loaded onto a feed roll. The adhesive mixture 20 is placed in a filling tank so that a precisely measured amount of the adhesive mixture 20 can be injected into the area between the two counter-rotating drums 12. The drum 12 is lined with pockets or wells (wells) that form the encapsulants 30. When the gelatin strip is pushed into the pit, the pit automatically receives a measured amount of adhesive mixture 20 and the machine seals the two strips together to surround the adhesive material.

The balls of encapsulated adhesive 10 may be flexible as they exit the chute (channel). They are cooled, hardened and dried in a tumbling machine (trumbling machine). The tumbling mill may also uniformly round or cylindrical the balls. Further drying time may be required.

Fig. 3 depicts a method of preparing an encapsulated adhesive 10 according to one embodiment of the inventive concept. An off-the-shelf glue (off-the-shelf glue) or adhesive material 22 is mixed with the first reactant 40 and any other additives to prepare the adhesive mixture 20. In the example shown in fig. 2, the first reactant 40 is calcium chloride (CaCl) ₂ ) Which is typically a solid at ambient conditions. When calcium chloride is mixed with the adhesive material 22, which is typically in liquid form, the resulting adhesive mixture 20 is liquid. The adhesive mixture is dripped into a pool of second reactant 42 (which may be mixed with water) using a tool such as a dropper-type dispenser 48. In the example of fig. 2, the second reactant may be sodium alginate (NaC ₆ H ₇ O ₆ ). In some embodiments, the first reactant 40 may be sodium alginate and the second reactant may be calcium chloride, with the surrounding chemicals also being interchanged.

In the embodiment of fig. 3, first reactant 40 and second reactant 42 are switched relative to the examples described above. Thus, sodium alginate in powder form (first reactant 40 in this example) is mixed with adhesive material 22 to prepare adhesive mixture 20. The adhesive mixture 20 is then placed in contact with a second reactant 42, which in this example is calcium chloride. This contact may be achieved by adding droplets of the cement mixture 20 to a pool of water-miscible calcium chloride using a dropper 48.

After contact, sodium alginate (NaC) ₆ H ₇ O ₆ ) And calcium chloride are reacted as shown below to prepare calcium alginate:

2NaC ₆ H ₇ O ₆ +CaCl ₂ →2NaCl+CaC ₁₂ H ₁₄ O ₁₂

calcium alginate is a gel-like substance that is not itself sticky. When the chemical reaction occurs, the droplets falling into the pool of the second reactant become discrete gel-like "balls" through a spheroidization process, thereby forming balls of encapsulated adhesive 10. The encapsulant 30 is formed around the adhesive mixture such that there is no empty space between the encapsulant 30 and the adhesive mixture 20. The encapsulated adhesive 10 is easy to handle because the adhesive is contained within a non-tacky encapsulant 30. When pressure is applied to the encapsulated adhesive 10, the gel-like encapsulation breaks, releasing the adhesive material.

Depending on the exact pH of the adhesive material used, the spheroidization process can be challenging. To fine tune the pH level of the adhesive, certain additives, either alkaline or acidic (e.g., sodium citrate, lemon juice, baking soda) may be added to the adhesive mixture 20 prior to placement in contact with the second reactant. In order to obtain the desired consistency, polyethylene glycol (PEG) or water may be added to the adhesive mixture, depending on the type of adhesive material used. Crayon wax (crayon wax) may be added as a thickener. Mineral oil and coloring agent may also be added.

The encapsulated adhesives 10 are difficult to form due to their gelatinous, semi-liquid nature. For example, if a stick-shaped adhesive is desired, it is difficult to produce a packaged adhesive 10 of a desired shape. Optionally, the encapsulated adhesive spheres 10 may be cooled to semi-set so that they may be shaped in a desired manner. After shaping or molding is completed, the encapsulated adhesive 10 may be frozen to maintain shape.

Whether or not the cooling and freezing process is performed, the encapsulated adhesive 10 may be immersed in a harder shell material to prevent it from breaking under too little pressure. Coating with paint, acrylic or epoxy may be performed followed by curing to form a shell around the encapsulated adhesive 10.

Fig. 4A depicts a method 50 of preparing an encapsulated adhesive 10 according to another embodiment of the inventive concept. In this embodiment, a hollow housing (52) made of rubber, plastic or glass is obtained, and the adhesive material 22 is injected into the hollow housing (54) and sealed (56). The sealing may be accomplished by: the injection site is coated with a material that hardens after drying or with an acrylic or epoxy resin and then cured.

Fig. 4B depicts another method of preparing an encapsulated adhesive 10 according to another embodiment of the inventive concept. In this embodiment, the encapsulant 30 is a capsule (or sphere, or any other suitable shape) that is separable into two parts 30a, 30 b. The adhesive material 22 is placed in one or both of the capsule portions 30a, 30b, and the two capsule portions 30a, 30b combine to form an enclosed space holding the adhesive material 22. The adhesive material 22 used may be tacky to avoid or minimize spillage during assembly. In one such embodiment, the capsule portions 30a and 30b may comprise conventional gelatin capsule portions and are used with non-water-based adhesive material 22 (due to the solubility of gelatin in water). Alternatively, the gelatin-containing capsule portions 30a and 30b may be coated with a water-resistant material, such as a non-water-based epoxy, urethane, plastic, or other suitable material. As previously mentioned, the capsule portion may also comprise a water insoluble material (such as plastic) to allow for the use of any suitable adhesive material 22.

Fig. 5 depicts an exemplary use of the encapsulated adhesive 10. In this example, the packaged adhesive 10 is placed at a desired location on a planar surface and an object is pushed down onto the packaged adhesive 10. The encapsulant 30 breaks due to pressure, the adhesive material 22 is exposed, and the object adheres to the flat surface.

Fig. 6A, 6B and 6C depict another exemplary use of the packaged adhesive 10. Fig. 6A depicts a dowel 80 designed to fit into a dowel hole 82. This type of mortise-tenon or mortise-hole arrangement is a common way of attaching two components together, such as during assembly of flat packaged furniture. To securely attach the dowel 80 into the dowel hole 82, the packaged adhesive 10 is placed in the dowel hole 82 prior to insertion of the dowel 80. When the dowel 80 is pushed into the dowel hole 82, the pressure of the dowel breaks the encapsulation, allowing the adhesive material 22 to fill the space between the dowel 80 and the inner wall of the dowel hole 82. When the adhesive material 22 dries and hardens, the dowel 80 is securely attached to the dowel hole 82.

The dowels are available in a variety of sizes, typically categorized by their diameters. In one aspect of the inventive concept, the holes and dowels are used in wood-based or cellulose-based structures, such as furniture. Typical standard wooden dowel sizes include 1/4, 5/16, and 3/8 inch diameter sizes, which generally correspond to typical metric dowel sizes of 6mm, 8mm, and 10mm, respectively. The length of a wooden dowel may be of various dimensions, but the common length of a typical dowel is as follows (and approximate volume) (although the present discussion relates to a particular application utilizing a wooden dowel, the inventive concepts are applicable to other types of dowels, and are not limited to wooden dowels):

table 1: exemplary dimensions of the dowels

Diameter of

1/4in.

5/16in.

3/8in.

6mm

8mm

10mm

Length of

1 1/8in.

11/2in.

30mm

40mm

Volume of

0.90ml

1.88ml

2.70ml

0.85ml

2.01ml

3.14ml

1/2 volume

0.45ml

0.94ml

1.35ml

0.85ml

2.01ml

3.14ml

Similarly, two-part capsules, such as those depicted in fig. 4B, are available in common sizes 000, 00, 0, 1, 2, 3, and 4. Capsules generally have the following characteristics:

table 2: capsule size

In an exemplary embodiment, the combination of the dowel and the capsule size provides beneficial results. For example, when a 3/8 inch dowel having a length of 11/2 inch for a size 1 (gelatin) capsule is used in a hole having a diameter slightly greater than 3/8 inch to provide a tight fit (i.e., allow insertion and removal of the dowel by hand, but not loose) and a depth slightly greater than 3/4 inch (about 0.8 inch), the amount of adhesive material contained in the size 1 capsule is suitable to provide good coverage between the surface of the dowel and the wall of the hole. While in some cases some adhesive does squeeze out of the joint between the dowel and the hole in this combination, the amount of spillage is minimal. In the same dowel and hole arrangement, but using size 0 capsules filled with adhesive, similar good results were obtained in terms of coverage between the dowel and the hole wall. However, the overflow volume is higher, but not excessive. By providing a cover between the surfaces of the two parts that are joined together by the dowel, the amount of flash from this example can be beneficial. For one application involving wood or cellulose based structures, spillage may be advantageous to provide a direct bond between the adjoining sides (the judging sides) of the two members to be connected. However, for other applications, spillage may be less desirable.

Similarly, the combination of a 5/16 inch dowel 11/2 inch length and a size 1 (gelatin) capsule filled adhesive (again, slightly wider and deeper holes) provides good coverage with minimal spillage. The use of size 0 capsules increases spillage, which may be beneficial depending on the application, more than in a 3/8 inch dowel combination.

The combination of a 1 1/8 inch length 1/4 inch dowel and size 4 (gelatin) capsule filled adhesive (again, slightly wider and deeper holes) also provided good coverage with minimal spillage. As previously mentioned, larger size capsules, such as size 3 capsules, may be used as desired for the application.

The above should not be construed as limiting the scope of the application and combinations of dowel sizes and capsule sizes may be varied to achieve the desired results. In particular, since the dowel length may vary, it may be desirable to increase or decrease the amount of adhesive. The use of smaller size capsules reduces the amount of adhesive. Similarly, the amount of adhesive may be increased by increasing the capsule size or using multiple encapsulated adhesive capsules. Table 3 shows examples of capsules that can be used in holes of a specific size.

Table 3: capsule size dependent capsule specification

Table 3 (continuation): capsule size dependent capsule specification

Diameter of hole	0.27 inch	0.33 inch	0.39 inch
				Depth of hole	0.58 inch	0.64 inch	0.64 inch
Pore volume	0.544ml	0.90ml	1.24ml
				Capsule size/volume	2/0.37ml	0/0.68ml	0/0.68ml
Cap volume/pore volume	0.68	0.75	0.55

The upper graph provides an approximate hole diameter and depth for the example embodiment discussed. It can be seen that good coverage is achieved when the volume of the adhesive is approximately in the range of 40% to 75% of the volume of the hole (it is understood that this ratio may vary if the mortise size is significantly different from the tenon size). However, any suitable ratio of adhesive to pore volume may be used. This range should be considered exemplary and may vary depending on additional factors such as the spacing between the hole wall and the dowel. For example, in some applications, it may be desirable to increase the spacing, or the application may have difficulty achieving a minimum spacing. It may also be desirable to allow excess adhesive to overflow to allow adhesion between the ends of the two components to be joined. In this case, the volume of adhesive can be increased to compensate for the extra volume in the hole to be filled with adhesive (after the dowel is inserted). Alternatively, a drier or tighter fit may be desired, requiring less adhesive. Furthermore, as discussed, certain types of aggregates can be used as part of the adhesive of the package to properly fill the space between the dowel and the hole wall.

Similarly, there may be circumstances where the volume of adhesive may be reduced, such as where it is desirable to avoid any spillage or to achieve a drier fit between the dowel and the hole wall. Furthermore, aggregates or other materials may be introduced into the holes (i.e., applied separately from the encapsulated adhesive) in addition to the dowels. In this case, the volume of adhesive can be reduced to compensate for the smaller volume to be filled between the hole and the dowel. Thus, any suitable range of adhesive to pore volume ratio, such as 25% to 85%, may be suitable.

The amount of adhesive contained within the encapsulated adhesive may also vary as compared to the volume of the hole depending on the difference between the depth of the hole and the length of the dowel inserted into the hole (e.g., it may be desirable to insert more than (or less than) half the length of the dowel into the hole). Similarly, the thickness (and volume) of the encapsulating material may vary, requiring a variation in the amount of adhesive contained in the encapsulated adhesive.

Furthermore, the geometry of the dowel may require more or less adhesive than the volume of the hole. For example, the dowels may be shaped like an elongated star with long fins (fin) leaving more empty space between the hole wall and the dowels. This shape will provide more dowel surface area to bond with the hole wall, but will require more adhesive to fill the void space.

In another embodiment, the packaged adhesive 10 may be applied to a tongue and groove (tongue and groove ) assembly. In such applications, the encapsulated adhesive may be formed in an elongated tube that is inserted into the recess. The encapsulated adhesive 10 is released from the encapsulation upon engagement of the tongue into the groove, and upon curing adheres the tongue and groove. Similarly, instead of a single long tube of encapsulated adhesive, several smaller encapsulated adhesives 10 may be applied within the groove.

Recently, joinery systems (joinery systems) have been developed that use dovetail tenons (wedge dowels). The dovetail is typically ribbed (annular around the circumference of the dovetail) rather than relatively smooth. The ribbed dowel is inserted into a hole or cavity having a wider end into which the ribbed dowel can be inserted. The ribbed dowel may then be moved into the narrower portion of the hole or cavity where a corresponding mating wedge is formed in the inner wall of the hole or cavity. The ribs form an interlocking engagement as the ribbed dowel is pushed into a tighter area with mating ribs. In one embodiment of the application, the encapsulated adhesive 10 may be inserted into the narrower (or ribbed) end of a hole or cavity. When the ribbed dowel is pushed into the narrower end, the encapsulated adhesive may rupture, releasing the adhesive material 22 therein. In one aspect of the application, the encapsulated adhesive may be formed to fracture in a manner that provides greater coverage of the adhesive material between the ribbed dowel and the inner wall of the hole or cavity. The wedge or ribbed dowel may be of many shapes, such as a ribbed wedge or ribbed dowel, having a mating shaped hole or cavity with an insertion end without ribs and a narrower or ribbed end with ribs. The encapsulated adhesive 10 may be inserted into a narrower or ribbed end. Thus, the encapsulated adhesive 10 may also be ribbed for easy insertion into the narrower or ribbed end of the hole or cavity. The encapsulated adhesive 10 may also be shaped to match the geometry of the ribbed dowel and cavity, such as a wedge or cylinder. In addition, the encapsulated adhesive 10 may be designed in a manner that provides flow of adhesive material between the ribbed dowel and the hole/cavity. The design may include the shape of the encapsulated adhesive, the use of scores or perforations, or the positioning of the encapsulated adhesive in holes or cavities. The terms "aperture" and "cavity" are used interchangeably throughout this disclosure.

Fig. 7A and 7B illustrate an embodiment of the packaged adhesive 10 having an outer layer. Fig. 7A depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept. The embodiment of fig. 7A has fibers 90 attached to the surface of the encapsulant 30. The fibers 90 may be glass fibers or carbon fibers and form an outer layer of the encapsulated adhesive 10. The fibers 90 make the encapsulated adhesives 10 easier to handle and also help the encapsulated adhesives 10 remain in place where they are placed. For example, referring to FIG. 6A, the "fluffy" texture of the fibers 90 makes the encapsulated adhesive 10 less likely to roll out of the dowel holes 82. The fibers 90 may be applied to the encapsulant in any number of ways. For example, after forming the encapsulated adhesive 10, the adhesive may be applied to the encapsulated adhesive, and the fibers 90 may be applied and cured to form the outer layer. In another embodiment using a packaging machine (such as one similar to those used in manufacturing paintballs), the fibers 90 may be applied to the outwardly facing surface of the packaging layer, which is then fed into the machine.

Fig. 7B depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept. As shown, this embodiment has a spike (spike) 93 on the surface of the package 30 as an outer layer. Similar to the fibers 90 in fig. 7A, the spikes 93 serve to help hold the encapsulated adhesive 10 in place. The spike 93 may be made of any suitable material to help provide a stronger bond, such as fiberglass, cellulose (e.g., wood or paper fibers), carbon fibers, cured epoxy, plastic, ceramic, metal, and the like. The spike 93 may be applied to the encapsulated adhesive in a manner similar to the application of fibers, as described above.

Fig. 8 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept. In this embodiment, the fibers 90 are added to the adhesive mixture 20 held inside the encapsulant 30. The fibers 90 may be carbon or glass fibers or other suitable materials. The fibers 90 are mixed with the adhesive material 22 to form the adhesive mixture 20. The fibers 90 help to form a stronger bond between the two components being joined. In this embodiment, the fibers 90 are included in the mixture 20. However, any suitable type of aggregate that facilitates the formation of a bond between two components may be used.

Fig. 9 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept. The embodiment of fig. 9 has an elongated shape or a cylindrical shape instead of a spherical shape. As described above, this shape can be achieved by cooling, shaping and curing the encapsulated adhesive 10. To maintain shape at higher temperatures, the encapsulated adhesive 10 may be coated with a hard shell as it is frozen. In another embodiment, when using a packaging machine to form the packaged adhesive, the two layers of the package may be formed into half cylinders, which are then bonded together and filled.

Fig. 10A depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept. This embodiment has pins 95 inside the encapsulant material 30. The pin 95 is shaped such that when compressed, it expands in one or more directions and breaks the encapsulation 30. Thus, in the dowel-hole application shown in fig. 10B and 10C, pushing the dowel into the dowel hole 82 with the encapsulated adhesive 10 within the hole 82 will cause the pin 95 to expand and damage the encapsulation material 30, allowing the adhesive material 22 to contact the dowel 80 and the inner wall of the dowel hole 82. In embodiments of adhesives that utilize spheroidization to form packages, the pins may be dispensed with the adhesive in a second reaction mixture. In another embodiment using an encapsulation machine, pins may be inserted as the adhesive fills into the bonding halves of the package. The pin may also be configured in a suitable configuration, such as square (two-dimensional) or cube/cuboid (three-dimensional) (or any suitable shape) to increase the likelihood of the pin being compressed when the dowel/member 80 is inserted into the dowel hole/cavity 82.

As shown in fig. 10B and 10C, the packaged adhesive 10 is placed in the cavity 82 and the dowel/member 80 is inserted into the cavity. When the dowel/member 80 reaches and presses against the encapsulated adhesive 10, the pin 95 is compressed and breaks the encapsulation 30. Alternatively or additionally, the pin 95 may be added to the cavity 82 separately from the encapsulated adhesive 10 such that the encapsulation 30 will rupture when the member 80 is pressed down on the pin 95 and the encapsulated adhesive 10.

Fig. 11A, 11B, 11C, 11D, 11E, 11F, and 11G depict different shapes of the packaged adhesive 10. As described above, the shaping can be performed by controlling the temperature and coating with a hard shell. The shapes shown in fig. 11A, 11B, and 11C may be used for dowel and hole applications. For example, the adhesive size of the packages of fig. 11A, 11B, and 11C may be slightly smaller than the size of the dowel hole and placed within the dowel hole so as to be "stand-up". The bottom can be shaped to mate with the bottom of the dowel hole (e.g., circular, flat, etc.), and the top surface can be shaped to receive the dowel and to fracture easily. Fig. 11D, 11E, 11F, and 11G depict polygonal or prismatic shapes of the packaged adhesive 10, which may be advantageous in various applications. The different shapes shown are not meant to be exhaustive; rather, they are provided to demonstrate that there is no limitation on the shape of the adhesive 10 that may be used for encapsulation.

Fig. 12A and 12B depict packaged adhesive 10 according to various embodiments of the inventive concept. These embodiments have scores/perforations 100 on the surface of the encapsulant 30 to make breakage of the encapsulant 30 predictable. For example, scoring may ensure that the encapsulant 30 will break into small pieces. Scoring 100 may be accomplished by laser or mechanically on the prepared encapsulated adhesive 10. The indentations or holes of score 100 should not be large enough to allow any adhesive material 22 to leak out. Scoring may be performed in any pattern, whether decorative or functional. Functionally, the scores may be applied to the encapsulant in any pattern such that the adhesive is sufficiently released around the collapsed encapsulant such that the adhesive is applied uniformly to the surfaces of the two components (e.g., mortise and tenon, mortise and hole, or tongue and groove). For example, in embodiments using a cylindrical encapsulated adhesive, the scoring may be applied in a spiral pattern such that the encapsulant is released around the entire surface of the cylinder, thereby coating the surfaces of the two components to be bonded, and the remaining encapsulant acts as an aggregate material.

Fig. 13 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept, wherein each encapsulated adhesive 10 comprises one chemical component of a multi-component epoxy resin (e.g., a two-component epoxy resin). Two-component epoxy resins contain two substances, neither of which is adhesive per se, but which, when mixed, give rise to adhesive properties. In the embodiment of fig. 13, one of the encapsulated adhesive spheres 10 comprises one of the two-part epoxy components. Thus, if the package 30 is accidentally broken during storage or transportation and the contents leak, no viscous mess occurs. However, in use, two pieces of the packaged adhesive 10 must be used such that when both pieces of the package 30 are ruptured, the first adhesive material 22a and the second adhesive material 22b are released to mix and create adhesive properties. In the case of fig. 13, the first adhesive material 22a and the second adhesive material 22b may be resins and activators, as is well known in the art. When the dowel 80 is inserted into the cavity 82, the first adhesive material 22a and the second adhesive material 22b will mix in the cavity and secure the dowel 80 in place.

Fig. 14 depicts an encapsulated adhesive 10 according to one embodiment of the inventive concept. This embodiment provides a two-part epoxy resin encapsulated in two compartments of a single encapsulated adhesive 10. The separation layer 32 keeps the two types of epoxy resins contained in the package 30 from contacting each other. When the encapsulated adhesive 10 breaks, the release layer 32 may also break, but may not be necessary. When the encapsulant 30 and/or the separation layer 32 breaks, the first adhesive material 22a and the second adhesive material 22b mix and begin to cure. The embodiment of fig. 14 may be prepared by: using the capsule structure shown in fig. 4B, a separation layer 32 is then added to one or both of the half-capsule pieces prior to combining the two half-capsule pieces.

The two-component epoxy structure of fig. 13 and 14 allows the first adhesive material 22a and the second adhesive material 22b to be present in a preselected ratio. For the embodiment of fig. 13 in which the first and second adhesive materials 22a, 22b are in separate packages 30, the ratio of the two components can be controlled by the relative dimensions of the spheres. The size of the spheres can be controlled by the size of the droplets falling into the second reactant, see the process described in fig. 3. Alternatively, the size of the spheres may be exactly the same and the proportions of the components may be controlled by the number of spheres of each adhesive material used. The use of many smaller adhesive spheres may result in better mixing of the two components than two large spheres, as the spheres may be unevenly placed. In addition, the encapsulated adhesive may be color coded, one color for the activator and another color for the resin. Color coding will further aid in the application of the proper ratio of activator and resin. For the capsule embodiment of fig. 14, the relative dimensions of the two components can be adjusted to achieve a suitable adhesive ratio. The dowel or tenon is preferably removed and reinserted into the hole to ensure adequate mixing of the two-part epoxy.

Embodiments of the present application using a two-part epoxy adhesive material in a separately packaged adhesive may be suitable for bonding dissimilar materials. In one application, the metal rod is typically secured to the concrete structure by inserting the metal rod into a hole (e.g., an anchor bolt) drilled into the concrete. The rods are typically bonded to the concrete using a two-part epoxy adhesive. However, the epoxy resin must be used for a fixed time after mixing. Alternatively, the two-part epoxy may be dispensed by a caulking gun using a caulking cartridge. Large applications require mixing several batches of epoxy or multiple caulks (caulking cartridge). The use of encapsulated adhesives will avoid mixing batches or replacement of the caulk cartridge.

Fig. 15A, 15B, 15C, 15D, and 15E (collectively "fig. 15") depict embodiments of dowels that may be used with the packaged adhesive 10. Fig. 15A shows a dowel 80 having one or more spikes 84 that help to break the encapsulant 30. Fig. 15B shows a dowel 80 with serrated edges designed to crack and spread the packaged adhesive 10. Fig. 15C shows a dowel 80 made of or including fibers, such as fibers (e.g., cellulose acetate fibers) used to make cigarette filters. The fibers naturally have "cracks" or spaces through which the adhesive can penetrate, allowing the dowels 80 to absorb the adhesive and expand, providing a safer attachment. Fig. 15D shows a dowel 80 with the microencapsulated adhesive 10 attached to its surface. Fig. 15E shows a fiber attached to the surface of the dowel similar to fiber 90 attached to encapsulant 30 in fig. 7A. The fibers help to form the bond.

Fig. 16A and 16B illustrate an embodiment of the packaged adhesive 10 that includes a package 30 in the form of a pouch (sachets). Adhesive material 22 is dispensed in the pouch and sealed. The spike (fringe) 38 can be formed during pouch formation, such as at the sealed edges of the pouch material. The bead 38 may be formed substantially around the perimeter of the packaged adhesive 10 as shown in fig. 16A, or at the end as shown in fig. 16B. The bead 38 may be formed such that the bead 38 helps to retain the encapsulated adhesive 10 in any hole or cavity that may be placed. For example, in a dowel and hole application, the width of the bead 38 may be slightly longer than the diameter of the hole into which the packaged adhesive 10 is inserted. The ears 38 prevent the encapsulated adhesive 10 from falling off if the holes in the component are facing downward.

This embodiment may be implemented using a plastic film as the encapsulant 30. Pouch or pouch filling and sealing machines are well known and may be used to fill and seal packaged adhesive 10 according to one embodiment of the present application. The size, shape and dimensions of the packaged adhesive 10 will preferably correspond to the desired application. For example, for dowel and hole applications, the packaged adhesive 10 in the form of a pouch will be substantially cylindrical. For mortise and tenon applications, according to another example, the encapsulated adhesive 10 may be a pocket that conforms to the rough dimensions of the mortise. A plastic film thickness of about 1 mil (1 mil = thousandth of an inch, or 0.0254 millimeter) has been found to be sufficient for dowel and hole applications, but any suitable thickness can be used for this application so that the encapsulated adhesive can be easily broken in the desired application, but does not break during manual handling.

As previously described, the encapsulated adhesive 10 may be scored or partially perforated. The scoring will control the manner in which the package 10 breaks during application. For dowel and hole applications, the encapsulant 10 will preferably fracture radially or upward (i.e., upward from the hole) to preferably coat the inner wall of the hole and the mating surface of the dowel. Thus, a score or perforation may be applied to one end of the packaged adhesive 10 (so that the perforation is inserted upwardly from the hole) or along the circumference of the packaged adhesive 10 toward the inner wall of the hole. Thus, the pattern and location of the scores or perforations may be adjusted accordingly to suit the desired application. Furthermore, the use of thicker packages 30 would benefit from scoring or perforating to allow for breakage during application while still allowing for manual handling without breakage. Also, thinner packages 30 may not require scoring or perforation while achieving the same purpose.

The various features of the different embodiments presented in this disclosure may be combined. For example, the elongated encapsulated adhesive 10 of fig. 9 may also have fibers 90 (or any suitable aggregate) as shown in fig. 7 and 8. The encapsulated adhesive 10 may have pins 95 (as shown in fig. 10) inside the encapsulation 30 and also have fibers 90 on the surface (as shown in fig. 7) or inside the encapsulation 30 (as shown in fig. 8). Many other combinations are possible.

As discussed, any adhesive may be used with the appropriate encapsulant. Any size or shape of the encapsulated adhesive may be formed to suit the application. The application is also applicable to bonding any suitable piece including, but not limited to, wood, paper, metal, plastic, ceramic or alloy for similar or different parts. It should be understood that the inventive concept may be practiced with modification and alteration within the spirit and scope of the present disclosure. It is not intended to be exhaustive or to limit the inventive concepts to the precise form disclosed.

Claims

1. An encapsulated adhesive for insertion into a cavity having a first volume, wherein the cavity is formed in a member, the encapsulated adhesive comprising:

an adhesive material having a second volume;

a non-adhesive encapsulant surrounding and substantially surrounding the adhesive material;

wherein the second volume of the adhesive material is less than the first volume of the cavity.

2. The packaged adhesive of claim 1, wherein the ratio of the second volume of adhesive material to the first volume of the cavity is between about 40% and 75%, inclusive.

3. The packaged adhesive of claim 1, wherein the ratio of the second volume of adhesive material to the first volume of the cavity is between about 25% and 85%, inclusive.

4. The packaged adhesive of claim 1, wherein the package is a layer of: the layer conforms to the adhesive material and is capable of breaking such that the adhesive material is exposed.

5. The encapsulated adhesive of claim 1 wherein the first component of the encapsulant is selected from the group consisting of polymers, calcium alginate, glass, gelatin, ceramics, plastics, polymers, resins, and lacquers.

6. The packaged adhesive of claim 1 having a shape selected from spheres, cylinders, spherical cylinders, ellipsoids, polyhedrons, prisms, and pyramids.

7. The encapsulated adhesive of claim 1 further comprising an outer layer, wherein the outer layer is selected from the group consisting of fiberglass, carbon fiber, cellulose, plastic, gelatin, ceramic, and metal.

8. The encapsulated adhesive of claim 1 further comprising an aggregate mixed with the adhesive material and contained within the encapsulation, the aggregate selected from the group consisting of fiberglass, carbon fiber, cellulose, plastic, ceramic, and metal.

9. The packaged adhesive of claim 1 wherein the member comprises one of wood, cellulose, plastic, ceramic, and metal.

10. A method of bonding, the method comprising:

forming a first cavity in a first component having a first volume;

inserting a first encapsulated adhesive into a first cavity of the first component, the first encapsulated adhesive comprising an adhesive material within an encapsulation, the encapsulated adhesive having a volume, wherein a ratio of the volume of the encapsulated adhesive to the first volume is between about 25% and 85%; and

a member is inserted into the first cavity such that the member breaks the encapsulation and exposes the adhesive material of the adhesive of the first encapsulation to the surfaces of the cavity and the member.

11. The method of claim 10, wherein the member is a protrusion of a second component, wherein a bond is formed between the first and second components.

12. The method of claim 10, further comprising:

forming a second cavity in the second component;

inserting a second encapsulated adhesive into a second cavity of the second component, the second encapsulated adhesive;

inserting the member into the second cavity such that the member breaks the encapsulation and exposes the adhesive material of the second encapsulated adhesive to the surfaces of the second cavity and the member.

13. A method of preparing an encapsulated adhesive comprising:

forming an encapsulant; and

an adhesive is disposed within the encapsulant.

14. The method of claim 13, wherein forming the encapsulant comprises:

forming a first portion of an encapsulant layer;

forming a second portion of the encapsulant layer; and

the first portion of the encapsulant layer is bonded to the second portion of the encapsulant layer such that the encapsulant layer encloses a volume.

15. The method of claim 14, wherein the step of disposing the adhesive is performed during the step of joining the first and second portions of the encapsulant layer such that the adhesive is disposed within the volume.

16. The method of claim 14, wherein the disposing of the adhesive occurs after formation of a first portion of the encapsulant layer and before formation of a second portion of the encapsulant layer.

17. The method of claim 13, wherein the forming of the encapsulant and the disposing of the adhesive within the encapsulant occur simultaneously, comprising:

mixing an adhesive material with a first reactant to form an adhesive; and

placing the adhesive in contact with a second reactant to form an encapsulant around the adhesive;

wherein each of the first reactant and the second reactant is one of sodium alginate and calcium chloride, whereby the encapsulate substantially comprises calcium alginate and encapsulates the adhesive.

18. The method of claim 17, further comprising coating the encapsulated adhesive with one of an uncured acrylic material and an epoxy material to form a shell around the adhesive bead.

19. The method of claim 13, further comprising scoring the encapsulant.

20. The method of claim 13, wherein the first component comprises one of wood, cellulose, plastic, ceramic, and metal, and wherein the second component comprises one of wood, cellulose, plastic, ceramic, and metal.