CN116793299A - Dynamic stress-strain test analysis system - Google Patents
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- CN116793299A CN116793299A CN202310795935.2A CN202310795935A CN116793299A CN 116793299 A CN116793299 A CN 116793299A CN 202310795935 A CN202310795935 A CN 202310795935A CN 116793299 A CN116793299 A CN 116793299A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
- G01B21/042—Calibration or calibration artifacts
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Abstract
The invention discloses a dynamic stress strain test analysis system, which relates to the technical field of instrument measurement and calibration and comprises a core circuit board, a liquid crystal touch display screen, a battery, a key module, a heat dissipation module and a machine box, wherein the core circuit board comprises a high-precision isolation power supply module, a signal amplifying circuit, a signal filtering circuit, a temperature measuring module, an AD converter, a memory module, a microprocessor, a communication data receiving circuit, an isolation device, a Venturi bridge oscillation circuit, a digital potentiometer, a control interface and a power supply circuit. The invention generates analog dynamic strain output through microprocessor control, outputs the analog dynamic strain output to the strain gauge after filtering and amplifying treatment, acquires output signals with high precision AD in the device, and simultaneously returns measurement signals to the device by the strain gauge for data calculation, analysis and comparison to obtain a final result, the final result is displayed and stored by the liquid crystal display touch screen, and a user can derive stored data in various modes to meet the requirement of subsequent research.
Description
Technical Field
The invention relates to the technical field of instrument measurement and calibration, in particular to a dynamic stress strain test analysis system.
Background
Dynamic strain gauges have been used for seventy years since birth, can be dynamically monitored in real time due to high accuracy and sensitivity, and are now applied to various physical quantity change process measurements such as force, moment, displacement, speed, acceleration, flow and the like along with the continuous development of strain sensors.
The strain gauge itself belongs to a measuring instrument, and the measuring instrument needs a standard instrument to detect the performance of the strain gauge, so that along with the development of dynamic strain gauges, a plurality of strain gauge calibrators are also invented. Most of the existing strain calibration instruments are complex in operation, the calibration result is not visual, the cost is high, and a great improvement space is provided.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a dynamic stress-strain test analysis system. The device has the advantages that the device is controlled by the microprocessor to generate simulated dynamic strain output, the simulated dynamic strain output is output to the strain gauge after being filtered and amplified, the high-precision AD in the device collects output signals, meanwhile, the strain gauge returns measurement signals to the device for data calculation, analysis and comparison to obtain a final result, the final result is displayed and stored by the liquid crystal display touch screen, and a user can derive stored data in various modes to meet the requirement of follow-up study.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a dynamic stress strain test analysis system comprises a core circuit board, a liquid crystal touch display screen, a battery, a key module, a heat radiation module and a machine box;
the core circuit board comprises a high-precision isolation power supply module, a signal amplifying circuit, a signal filtering circuit, a temperature measuring module, an AD converter, a memory module, a microprocessor, a communication data receiving circuit, an isolation device, a Venturi bridge oscillating circuit, a digital potentiometer, a control interface and a power supply circuit;
the machine box comprises a power input interface, a storage device data interface, an analog bridge voltage output interface and a communication interface.
The invention further provides that the liquid crystal touch display screen and the key module are human-computer interaction parts of the whole system, the main function is to input commands, and a user can see part of output results, temperature display and communication states on the screen to visualize data.
The invention is further arranged that the high-precision isolation power supply module is a plurality of DC/DC isolation power supply modules, each power supply module only provides one voltage, and the high-precision LDO power supply module is selected; the high-precision DC/DC power supply module is adopted when the signal amplifying circuit, the signal filtering circuit and the AD converter are powered.
The invention is further arranged that the microprocessor is used as a core part of the whole equipment, and the microprocessor analyzes and carries out corresponding operation after receiving the instruction transmitted from the liquid crystal touch display screen or the key module.
The invention is further arranged that the digital potentiometer is controlled by the microprocessor, and a Venturi bridge oscillation circuit is built in the device by a plurality of digital potentiometers, a high-precision operational amplifier, a precision capacitor and a diode; after the frequency and amplitude of the output signal are set through the liquid crystal touch display screen or the key module, the microprocessor adjusts the oscillation frequency and the oscillation amplitude of the whole Venturi bridge oscillation circuit by adjusting the resistance values of the digital potentiometers.
The AD converter is further arranged to collect output signals inside the instrument and output the results after signal collection to the display screen for display.
The invention further provides that the communication data receiving circuit is used for receiving the measurement data of the strain gauge, the communication data receiving circuit adopts various data interfaces, the hardware is matched as much as possible, the data frame analysis setting can be carried out through the liquid crystal touch display screen or the key module, after the data frame format such as the frame head, the frame tail, the data bit number and the like are set, the frame-by-frame analysis of the measurement data of the strain gauge can be completed, and the microprocessor can complete the data comparison and calculation through the data obtained through analysis, so that key parameters such as amplitude-frequency characteristics and the like are obtained.
The invention is further configured that the memory module is used for storing the calculation result, the parameters to be set and the received data frame part, the stored calculation result can be sent to the upper computer part through the corresponding storage protocol, and the parameters set through the liquid crystal touch display screen or the key module are also stored in the memory module.
The invention is further arranged that the temperature measuring module monitors the working environment temperature of the power supply unit, a digital temperature sensor is selected and used for directly transmitting digital signals to the microprocessor, temperature comparison is carried out, and the lower limit of comparison can select 85% of the minimum working environment temperature required by the plurality of power supply modules.
A using method of a dynamic stress strain test analysis system comprises the following steps:
step one: the starting device is used for connecting the data output channel of the strain gauge with the calibrator through a corresponding data interface, setting a data communication protocol comprising a data frame head, a data frame tail, data bits and the like through the liquid crystal touch display screen or the key module, and opening the strain gauge to wait for a communication instruction after the setting is completed;
step two: setting the frequency and the amplitude of the analog dynamic strain output signal through a liquid crystal touch display screen or a key module, and observing the frequency and the amplitude of an output waveform through the display screen after the setting is finished;
step three: outputting a simulated dynamic strain output signal to a strain gauge, starting the strain gauge and sending out data, processing the data after the data is received by a calibrator, displaying a measurement result through a screen after data comparison is completed, and obtaining five values: calibration errors, linearity errors, attenuation errors, stability and amplitude-frequency characteristics, the calibrator automatically stores measurement results and calculation data in the memory module;
step four: if the original data needs to be called out for subsequent use, the data stored in the memory module can be exported through an interface on the device: the data can be stored by selecting the data backup through the screen, and the data is output to the upper computer or the external storage device through the selected format by selecting the data export format.
The beneficial effects of the invention are as follows: the dynamic stress strain test analysis system adopts a multifunctional high-integrated circuit, takes a microprocessor as a core, realizes functions on one circuit board, reduces the volume of an instrument while guaranteeing the richness of the functions, ensures lower power consumption under the conditions of guaranteeing the precision and the functions of the instrument, can realize better performances of water resistance, dust resistance, interference resistance and the like, and can also work normally in a complex environment; the power supply part designs two modes of battery power supply and direct power supply, so that the use scenes of users are enriched; the touch screen is used for controlling and simultaneously retaining physical keys, the usability of the instrument is enhanced by using the touch screen for operation, and the physical keys are reserved for preventing the problem that the touch screen is damaged and cannot be controlled in a severe environment; multiple communication interfaces are designed, different types of strain gauges can be adapted, different types of storage device interfaces are provided, more modes of data export are supported, and the use is more convenient and practical.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a dynamic stress-strain test analysis system according to the present invention;
FIG. 2 is a schematic diagram of a simulated strain generating circuit of a dynamic stress-strain test analysis system according to the present invention;
FIG. 3 is a schematic diagram of a front panel of a dynamic stress-strain test analysis system according to the present invention;
FIG. 4 is a schematic diagram of a left panel structure of a dynamic stress-strain test analysis system according to the present invention;
fig. 5 is a schematic view of a rear panel structure of a device of a dynamic stress-strain test analysis system according to the present invention.
In the figure: 1. a microprocessor; 2. a digital potentiometer; 3. a venturi bridge oscillating circuit; 4. a signal amplifying circuit; 5. a signal filtering circuit; 6. an AD converter; 7. a communication data receiving circuit; 8. a memory module; 9. a temperature measurement module; 10. high-precision isolation power supply module; 11. a liquid crystal touch display screen; 12. and a key module.
Detailed Description
The technical scheme of the patent is further described in detail below with reference to the specific embodiments.
Embodiments of the present patent are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the patent and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and are therefore not to be construed as limiting the patent.
In the description of this patent, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be fixedly connected, disposed, detachably connected, disposed, or integrally connected, disposed, for example. The specific meaning of the terms in this patent will be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1 and fig. 3 to 5, a dynamic stress strain test analysis system includes a core circuit board, a liquid crystal touch display 11, a battery, a key module 12, a heat dissipation module and a case;
the core circuit board comprises a high-precision isolation power supply module 10, a signal amplifying circuit 4, a signal filtering circuit 5, a temperature measuring module 9, an AD converter 6, a memory module 8, a microprocessor 1, a communication data receiving circuit 7, an isolation device, a Venturi bridge oscillating circuit 3, a digital potentiometer 2, a control interface and a power supply circuit;
the machine box comprises a power input interface, a storage device data interface, an analog bridge voltage output interface and a communication interface.
In this embodiment, the microprocessor 1 is used as a core part of the whole device, and is responsible for processing and analyzing functions such as transmitting instructions, receiving data, calculating and outputting data in the device. After the microprocessor 1 receives the instruction transmitted from the liquid crystal touch display 11 or the key module 12, it analyzes and performs corresponding operation.
The digital potentiometer 2 is controlled by the microprocessor 1, and a venturi bridge oscillating circuit 3 is built in the device by a plurality of digital potentiometers 2, high-precision operational amplifiers, precision capacitors and diodes. After the frequency and amplitude of the output signal are set through the liquid crystal touch display screen 11 or the key module 12, the microprocessor 1 adjusts the oscillation frequency and the oscillation amplitude of the whole venturi bridge oscillation circuit 3 by adjusting the resistance values of the plurality of digital potentiometers 2, so that the effect of generating sine wave signals with different frequencies and amplitudes is achieved, wherein in order to ensure the accuracy of the generated signals, all the used electronic components are high-precision devices.
After the signal is generated, in order to make the output signal more suitable for the strain gauge acquisition, a signal amplifying circuit 4 and a signal filtering circuit 5 are added, the output sine wave signal can be amplified properly through the amplifying circuit, the function is realized by controlling the digital potentiometer 2 to control the amplification factor, the specific amplification factor setting is input through the liquid crystal touch display screen 11 or the key module 12, and the setting is completed after the microprocessor 1 processes the instruction and selects an input channel through controlling the analog switch.
The high-precision AD converter 6 is used for collecting output signals inside the instrument and outputting the result after signal collection to a display screen for display. In order to realize the calibration function, the high-precision AD converter 6 is used for acquiring the output signal to obtain standard data, and then the standard data is compared with the received strain gauge measurement data to convert, and meanwhile, the data comparison result is sent to the liquid crystal touch display screen 11 for display.
The communication data receiving circuit 7 is used for receiving measurement data of the strain gauge, in order to adapt to the strain gauges with more models, the communication data receiving circuit 7 adopts various data interfaces, matching is performed on hardware as much as possible, data frame analysis setting can be performed through the liquid crystal touch display screen 11 or the key module 12, after a data frame format such as a frame head and a frame tail, a data bit number and the like is set, frame-by-frame analysis of the measurement data of the strain gauge can be completed, and the microprocessor 1 can complete data comparison and calculation through data obtained through analysis, so that key parameters such as amplitude-frequency characteristics and the like are obtained.
The memory module 8 is used for storing calculation results, parameters to be set, received data frame parts and the like, the stored calculation results can be sent to the upper computer part through corresponding storage protocols, the parameters set through the liquid crystal touch display screen 11 or the key module 12 are also stored in the memory module 8, the multi-time use is convenient, and meanwhile, the received output data of the strain gauge can be temporarily stored in the memory for subsequent calling.
The temperature measuring module 9 monitors the working environment temperature of the power supply unit, and a digital temperature sensor is selected, so that a digital signal can be directly transmitted to the microprocessor 1 for temperature comparison, and the lower limit of comparison can be about 85% of the minimum working environment temperature required by the plurality of power supply modules.
The high-precision isolation power supply module 10 is a plurality of DC/DC isolation power supply modules, each power supply module generally provides only one voltage, and in order to ensure the stability and the precision of sinusoidal signals generated by the venturi bridge oscillating circuit 3, a high-precision LDO power supply module is generally selected; the high-precision DC/DC power supply module is used for supplying power to the devices such as the signal amplifying circuit 4, the signal filtering circuit 5, the high-precision AD converter 6, and the like.
The liquid crystal touch display 11 and the key module 12 are used as man-machine interaction parts of the whole device, the main function is to input commands, and a user can see part of output results, temperature display, communication states and the like on the screen to visualize data.
A using method of a dynamic stress strain test analysis system comprises the following steps:
step one: the starting device is used for connecting a data output channel of the strain gauge with the calibrator through a corresponding data interface, setting a data communication protocol comprising a data frame head, a data frame tail, data bit numbers and the like through the liquid crystal touch display screen 11 or the key module 12, and opening the strain gauge to wait for a communication instruction after the setting is completed;
step two: setting the frequency and the amplitude of the analog dynamic strain output signal through the liquid crystal touch display screen 11 or the key module 12, and observing the frequency and the amplitude of the output waveform through the display screen after the setting is finished;
step three: outputting a simulated dynamic strain output signal to a strain gauge, starting the strain gauge and sending out data, processing the data after the data is received by a calibrator, displaying a measurement result through a screen after data comparison is completed, and obtaining five values: calibration errors, linearity errors, attenuation errors, stability and amplitude-frequency characteristics, the calibrator automatically stores the measurement results and calculation data in the memory module 8;
step four: if the original data needs to be called out for subsequent use, the data stored in the memory module 8 can be exported through an interface on the device: the data can be stored by selecting the data backup through the screen, and the data is output to the upper computer or the external storage device through the selected format by selecting the data export format.
Referring to fig. 2, a typical diode stable venturi bridge oscillator is adopted in an analog strain quantity generating circuit of a dynamic stress strain test analysis system, a device 1 refers to a high-precision operational amplifier, R1, R2, R3 and R4 are all programmable digital potentiometers, R5 is a constant value resistor, and D1 and D2 are diodes. The oscillator has two bridges, one consisting of a bandpass filter and the other consisting of a voltage divider, wherein the paths of R1, R2, C1 and C2 form positive feedback and R3, R4 and two diodes connected in parallel form negative feedback. To achieve a sustained stable oscillation, the phase shift in the loop gain needs to be eliminated, and the oscillation frequency formula is as follows:
wherein R represents a programmable resistance value:
d represents the decimal equivalent of a programmable digital code, R Total (S) Indicating the total resistance of the potentiometer. In order to maintain oscillation, the venturi bridge oscillator should be relatively balanced, that is, the positive feedback gain and the negative feedback gain must be coordinated. If the positive feedback gain is too large, the oscillation amplitude or V OUTPUT Will increase until the amplifier is saturated. If negative feedback dominates, the oscillation amplitude will correspondingly decay. In the circuit in the figure, the ratio of the positive feedback loop resistance to the negative feedback loop resistance is about 2 or more, so that the signal starts to oscillate, and meanwhile, the gain is temporarily smaller than 2 due to the fact that diodes in the negative feedback loop are alternately turned on, so that the oscillation is stabilized, and the oscillation frequency can be set by adjusting the ratio. After confirming the required oscillation frequency, by settingThe resistance value of the resistor R4 of the negative feedback loop is set, the oscillation amplitude is tuned on the premise of not influencing the oscillation frequency, and the calculation formula is as follows:
wherein variable I D And V D Representing the diode forward current and diode forward voltage through D1 and D2, respectively.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. The dynamic stress strain test analysis system is characterized by comprising a core circuit board, a liquid crystal touch display screen (11), a battery, a key module (12), a heat radiation module and a machine box;
the core circuit board comprises a high-precision isolation power supply module (10), a signal amplifying circuit (4), a signal filtering circuit (5), a temperature measuring module (9), an AD converter (6), a memory module (8), a microprocessor (1), a communication data receiving circuit (7), an isolation device, a Venturi bridge oscillating circuit (3), a digital potentiometer (2), a control interface and a power supply circuit;
the machine box comprises a power input interface, a storage device data interface, an analog bridge voltage output interface and a communication interface.
2. The dynamic stress-strain test analysis system according to claim 1, wherein the liquid crystal touch display screen (11) and the key module (12) are human-computer interaction parts of the whole system, and are mainly used for inputting commands, and a user can see part of output results, temperature display and communication states on the screen to visualize data.
3. The dynamic stress-strain test analysis system of claim 1, wherein the high-precision isolation power supply module (10) is a plurality of DC/DC isolation power supply modules, each providing only one voltage, and selecting a high-precision LDO power supply module; the high-precision DC/DC power supply module is adopted when the signal amplifying circuit (4), the signal filtering circuit (5) and the AD converter (6) are powered.
4. The system according to claim 1, wherein the microprocessor (1) is used as a core part of the whole device, and the microprocessor (1) analyzes and operates the command transmitted from the liquid crystal touch display (11) or the key module (12) after receiving the command.
5. The dynamic stress-strain test analysis system according to claim 4, wherein the digital potentiometer (2) is controlled by the microprocessor (1), and a venturi bridge oscillating circuit (3) is built in the device by a plurality of digital potentiometers (2), high-precision operational amplifiers, precision capacitors and diodes; after the frequency and the amplitude of the output signal are set through the liquid crystal touch display screen (11) or the key module (12), the microprocessor (1) adjusts the oscillation frequency and the oscillation amplitude of the whole Venturi bridge oscillation circuit (3) by adjusting the resistance values of the digital potentiometers (2).
6. A dynamic stress-strain test analysis system according to claim 1, characterized in that the AD converter (6) is operative to collect the output signal from the inside of the instrument and to output the result of the signal collection to a display screen for display.
7. The dynamic stress-strain test analysis system according to claim 6, wherein the communication data receiving circuit (7) is used for receiving measurement data of the strain gauge, the communication data receiving circuit (7) adopts various data interfaces to match with each other in hardware as much as possible, and can perform data frame analysis setting through the liquid crystal touch display screen (11) or the key module (12), after setting a data frame format such as a frame head and a frame tail, a data bit number and the like, frame-by-frame analysis of the measurement data of the strain gauge can be completed, and the microprocessor (1) can complete data comparison and calculation through the data obtained by analysis, so as to obtain key parameters such as amplitude-frequency characteristics and the like.
8. The system according to claim 1, wherein the memory module (8) is configured to store the calculation result, the parameters to be set and the received data frame portion, and the stored calculation result may be sent to the upper computer portion through a corresponding storage protocol, and the parameters set through the liquid crystal touch display (11) or the key module (12) are also stored in the memory module (8).
9. The system according to claim 1, wherein the temperature measuring module (9) monitors the temperature of the working environment of the power pack, and a digital temperature sensor is selected for directly transmitting digital signals to the microprocessor (1) for temperature comparison, and the lower limit of the comparison can be 85% of the minimum required temperature of the working environment in the power modules.
10. A method of using the dynamic stress-strain test analysis system of claim 1, comprising the steps of:
step one: the starting device is used for connecting the data output channel of the strain gauge with the calibrator through a corresponding data interface, setting a data communication protocol comprising a data frame head, a data frame tail, data bit numbers and the like through a liquid crystal touch display screen (11) or a key module (12), and opening the strain gauge to wait for a communication instruction after the setting is completed;
step two: setting the frequency and the amplitude of the analog dynamic strain output signal through a liquid crystal touch display screen (11) or a key module (12), and observing the frequency and the amplitude of an output waveform through the display screen after the setting is finished;
step three: outputting a simulated dynamic strain output signal to a strain gauge, starting the strain gauge and sending out data, processing the data after the data is received by a calibrator, displaying a measurement result through a screen after data comparison is completed, and obtaining five values: calibration errors, linearity errors, attenuation errors, stability and amplitude-frequency characteristics, the calibrator automatically stores measurement results and calculation data in a memory module (8);
step four: if the original data needs to be called out for subsequent use, the data stored in the memory module (8) can be exported through an interface on the device: the data can be stored by selecting the data backup through the screen, and the data is output to the upper computer or the external storage device through the selected format by selecting the data export format.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117268251A (en) * | 2023-11-23 | 2023-12-22 | 中国电建集团西北勘测设计研究院有限公司 | Strain measurement system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117268251A (en) * | 2023-11-23 | 2023-12-22 | 中国电建集团西北勘测设计研究院有限公司 | Strain measurement system |
| CN117268251B (en) * | 2023-11-23 | 2024-03-19 | 中国电建集团西北勘测设计研究院有限公司 | Strain measurement system |
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