CN116786998A - Cutting equipment and method for forming small-size circuit board - Google Patents
Cutting equipment and method for forming small-size circuit board Download PDFInfo
- Publication number
- CN116786998A CN116786998A CN202310872121.4A CN202310872121A CN116786998A CN 116786998 A CN116786998 A CN 116786998A CN 202310872121 A CN202310872121 A CN 202310872121A CN 116786998 A CN116786998 A CN 116786998A
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- fixedly connected
- circuit board
- outer side
- cutting
- stand
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- 238000005520 cutting process Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000003698 laser cutting Methods 0.000 claims description 20
- 239000000428 dust Substances 0.000 claims description 17
- 230000000087 stabilizing effect Effects 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 230000005484 gravity Effects 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses cutting equipment for forming a small-size circuit board and a method thereof, and relates to the technical field of circuit board cutting. According to the cutting equipment for forming the small-size circuit board and the method thereof, the clamp head is positioned at the lower half part of the rotating shaft and is extruded inwards, so that the upper half part of the clamp head can rotate anticlockwise, and the upper half part of the clamp head can extrude and clamp the part with the hole on the surface of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board cutting, in particular to cutting equipment and a method for forming a small-size circuit board.
Background
The circuit board, namely the circuit board, can lead the circuit to be miniaturized and visualized, plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, and can be called a printed circuit board or a printed circuit board.
The circuit board needs to be cut and cut according to the actual use purpose in the production process, but scraps can be generated in the cutting process of the circuit board, namely mechanical cutting and laser cutting; in addition, the circuit board is required to be clamped and fixed when being cut.
Disclosure of Invention
In order to achieve the above purpose, the invention is realized by the following technical scheme: the cutting equipment for forming the small-size circuit board comprises a stand, a cutter, a clamp holder and a dust remover, wherein the cutter is arranged above the stand, the bottom of the cutter is fixedly connected with the clamp holder, the dust remover is fixedly arranged in the clamp holder, and the cutter is fixedly arranged in the stand;
the cutter comprises a transverse groove, the transverse groove is formed in the top of the stand, a sliding frame is slidably arranged in the transverse groove, a screw rod is connected to the sliding frame in a threaded mode, one end of the screw rod is connected with a driving machine through a coupling, the outer side of the driving machine is fixedly connected with the sliding frame, a movable table is connected to the surface of the screw rod in a threaded mode, and a laser cutter is fixedly connected to the bottom of the movable table;
the clamp holder comprises a fixed frame, the fixed frame is fixedly arranged in the stand, a clamping assembly is rotatably arranged in the stand, a regulator is fixedly connected to the outer side of the clamping assembly, and the inner part of the clamping assembly is fixedly connected with the dust remover;
the dust remover comprises an opening sleeve, a suction plug is arranged in the opening sleeve in a sliding manner, an external suction pipe and a drainage pipe are sleeved on the outer side of the opening sleeve respectively, the drainage pipe is arranged below the external suction pipe, a lower pull rod is fixedly connected to the bottom of the suction plug, a fixed sleeve is arranged on the outer side of the lower pull rod in a sliding manner, the outer side of the fixed sleeve is fixedly connected with a clamping assembly, the lower pull rod is inserted into the bottom of the stand, and the drainage pipe is sleeved on the bottom of the stand. And finally, when the suction plug reaches the lower part of the connection part of the drainage tube and the open-pore sleeve, the suction force is not enough to generate, so that the scraps can slide downwards from the drainage tube due to gravity.
Preferably, the both sides of laser cutting machine are provided with steady backplate and No. two steady backplate respectively, the bottom of steady backplate and No. two steady backplate all centre gripping has the circuit board, the outside fixedly connected with ejector pad of steady backplate. The second stable guard board is fixed on the upper surface of the circuit board by the screw, wherein the lower part of the circuit board is limited by the baffle, so that the upper, lower, left and right positions of the circuit board are limited. The first stable guard board and the second stable guard board are enclosed on two sides of the laser cutting machine, so that the laser cutting machine also plays a role in preventing damage to the rest board caused by heat generated by laser. The position movement of the other stabilizing guard plate can adjust the cutting range required by different circuit boards.
Preferably, the outside sliding of ejector pad is installed the kink pole, kink pole slidable mounting is in the inside of frame, and the surface threaded connection of No. two steady backplate has the screw rod, the bottom and the frame threaded connection of screw rod.
Preferably, the clamping assembly comprises a flat groove, the flat groove is formed in the inner side of the fixed frame, a sliding rod is slidably mounted in the flat groove, an inserting rod is connected to the outer side of the sliding rod through a bearing, and the inserting rod is in threaded connection with the surface of the fixed frame.
Preferably, the bottom side fixedly connected with connecting plate of slide bar, the outside cover of connecting plate is equipped with the fixed axle, the central part fixedly connected with clamping head of fixed axle, the pivot is installed in the surface rotation of clamping head, the pivot sets up the top at the fixed axle, the both ends and the fixed frame fixed connection of pivot. The lower half part of the clamping head, which is positioned on the rotating shaft, is extruded inwards, so that the upper half part of the clamping head can rotate anticlockwise, the part of the clamping head, which is provided with the hole on the surface of the circuit board, is extruded and clamped, and the part, which is contacted with the circuit board, of the clamping head is provided with a soft cushion for protection.
Preferably, the outer side of the regulator is fixedly connected with an inner clamping seat, the bottom of the inner clamping seat is fixedly connected with the stand, and the inner side of the inner clamping seat is fixedly connected with the fixing sleeve.
Preferably, the adjuster comprises a universal seat, the outer side of the universal seat is fixedly connected with the screw cap, the rotating part of the universal seat is fixedly connected with an inserting strip, and the outer side of the inserting strip is slidably provided with a sleeve strip.
Preferably, the outside fixedly connected with center plectane of cover strip, the outside and the fixed column fixed connection of center plectane, the outside and the interior cassette fixed connection of fixed column.
Preferably, the side fixedly connected with spring of center plectane, the one end fixedly connected with limit plate of spring, the inboard and the cutting fixed connection of limit plate, the one end fixedly connected with limit plate No. two of spring keeping away from limit plate, the inboard and the cover strip fixed connection of limit plate No. two. When the cutting stretches into the sleeve strip, the two ends of the spring are compressed simultaneously, so that the sleeve strip moves in the opposite direction to the cutting, and at the moment, the other clamping head rotates reversely to the previous clamping head, so that the clamping and fixing effects on the circuit board are achieved simultaneously.
The cutting method for forming the small-size circuit board comprises the following steps:
step one, stable clamping, namely, extruding the lower half part of the clamping head, which is positioned on the rotating shaft, inwards to enable the upper half part of the clamping head to rotate anticlockwise, so that the upper half part of the clamping head can extrude and clamp the part with the hole on the surface of the circuit board;
step two, laser cutting, namely starting a driving machine to enable a screw rod connected with an output end of the driving machine to rotate, wherein a movable table is connected to the outer side of the screw rod in a threaded manner, so that the movable table can drive the laser cutting machine fixed at the bottom of the movable table to move, and laser cutting is carried out on a circuit board;
step three, dust removal treatment, when the suction plug is downward and reaches the lower part of the external suction pipe, the external suction pipe can generate a suction force so as to play a role in enlarging the adsorption range of chips, and finally when the suction plug reaches the lower part of the connection part of the drainage tube and the open-pore sleeve, the suction force is not generated enough because the length of the drainage tube is long, so that the chips can slide downwards from the drainage tube due to gravity.
The invention provides cutting equipment for forming a small-size circuit board and a method thereof. The beneficial effects are as follows:
1. according to the cutting equipment for forming the small-size circuit board and the method thereof, the second stable guard plate is fixed on the upper surface of the circuit board by the screw, wherein the lower part of the circuit board is limited by the baffle, so that the upper, lower, left and right positions of the circuit board are limited.
2. According to the cutting equipment for forming the small-size circuit board and the method thereof, the first stable protection plate and the second stable protection plate are enclosed on two sides of the laser cutting machine, so that the effect of preventing damage to the rest board surfaces caused by heat generated by laser is also achieved. The position movement of the other stabilizing guard plate can adjust the cutting range required by different circuit boards.
3. According to the cutting equipment for forming the small-size circuit board and the method thereof, the lower half part of the clamp head, which is positioned on the rotating shaft, is extruded inwards, so that the upper half part of the clamp head can rotate anticlockwise, the part of the clamp head, which is provided with the hole on the surface of the circuit board, is extruded and clamped, and the part, which is contacted with the circuit board, of the clamp head is provided with the soft cushion for protection.
4. According to the cutting equipment for forming the small-size circuit board and the method thereof, when the suction plug is continuously downward and reaches the lower part of the external suction pipe, the external suction pipe can generate a suction force so as to play a role in enlarging the adsorption range of chips, and finally when the suction plug reaches the lower part of the connection part of the drainage tube and the open-pore sleeve, the suction force is not generated enough because the length of the drainage tube is very long, so that the chips can slide out of the drainage tube downward due to gravity.
Drawings
FIG. 1 is a flow chart of a cutting method for forming a small-sized circuit board according to the present invention;
FIG. 2 is a schematic view showing the external structure of a cutting device for molding a small-sized circuit board according to the present invention;
FIG. 3 is a schematic overall sectional view of the present invention;
FIG. 4 is a schematic view of a cutter according to the present invention;
FIG. 5 is a schematic cross-sectional view of a cutter according to the present invention;
FIG. 6 is a schematic view of the structure of the clamper of the present invention;
FIG. 7 is a schematic view of a clamping assembly according to the present invention;
FIG. 8 is a schematic cross-sectional view of a regulator of the present invention;
FIG. 9 is a schematic cross-sectional view of a dust collector of the present invention.
In the figure: 1. a stand; 2. a cutter; 3. a holder; 4. a dust remover; 21. a transverse groove; 22. a carriage; 23. a mobile station; 24. a driving machine; 25. a laser cutting machine; 26. a first stable guard board; 27. a second stable guard board; 28. bending the rod; 29. a screw; 20. a screw rod; 201. a pushing block; 202. a circuit board; 31. a fixed frame; 32. a clamping assembly; 33. a regulator; 321. a flat groove; 322. a slide bar; 323. a rod; 324. a connecting plate; 325. a fixed shaft; 326. a screw cap; 327. a rotating shaft; 328. an inner clamping seat; 329. a clamping head; 331. a universal seat; 332. cutting; 333. sleeving strips; 334. a center circular plate; 335. a spring; 336. a first limit disc; 337. a second limit disc; 338. fixing the column; 41. a hole sleeve is arranged; 42. a suction plug; 43. externally connected with a suction pipe; 44. a pull-down rod; 45. a fixed sleeve; 46. a drainage tube.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
In a first embodiment, as shown in fig. 1 to 5, the present invention provides a technical solution: the utility model provides a cutting equipment and method for small-size circuit board shaping, includes frame 1, cutterbar 2, holder 3 and dust remover 4, cutterbar 2 sets up in the top of frame 1, the bottom and the holder 3 fixed connection of cutterbar 2, dust remover 4 fixed mounting is in the inside of holder 3, cutterbar 2 fixed mounting is in the inside of frame 1.
The cutter 2 comprises a transverse groove 21, the transverse groove 21 is formed in the top of the stand 1, a sliding frame 22 is slidably mounted in the transverse groove 21, a screw rod 20 is connected to the sliding frame 22 through internal threads, one end of the screw rod 20 is connected with a driving machine 24 through a coupling, the outer side of the driving machine 24 is fixedly connected with the sliding frame 22, a movable table 23 is in threaded connection with the surface of the screw rod 20, the bottom of the movable table 23 is fixedly connected with a laser cutter 25, a first stable guard plate 26 and a second stable guard plate 27 are respectively arranged on two sides of the laser cutter 25, a circuit board 202 is respectively clamped at the bottoms of the first stable guard plate 26 and the second stable guard plate 27, a push block 201 is fixedly connected to the outer side of the first stable guard plate 26, a bending rod 28 is slidably mounted on the outer side of the push block 201, a screw rod 29 is in threaded connection with the surface of the second stable guard plate 27, and the bottom of the screw rod 29 is in threaded connection with the stand 1. By moving the bending bar 28 outwards along the inside of the stand 1, wherein the push block 201 is slidably mounted inside the bending bar 28, the first stabilizing guard plate 26 connected with the push block 201 moves outwards, then the circuit board 202 is laid on the bending part of the bending bar 28, then the bending bar 28 is pushed inwards again to clamp the side surface of the circuit board 202, and meanwhile the push block 201 is pushed inwards again, so that the bottom of the first stabilizing guard plate 26 connected with the pushing block is attached to the upper surface of the circuit board 202 to move inwards, and finally the second stabilizing guard plate 27 is fixed on the upper surface of the circuit board 202 by using the screw 29, wherein the lower part of the circuit board 202 is limited by the baffle plate, and therefore the upper, lower, left and right positions of the circuit board 202 are limited.
The baffle is fixedly connected to the bending rod 28, and then the driver 24 is started to rotate the screw rod 20 connected to the output end of the driver, and the movable table 23 is connected to the outer side of the screw rod 20 in a threaded manner, so that the movable table 23 drives the laser cutter 25 fixed at the bottom of the movable table to move so as to cut the surface of the circuit board 202. The first stabilizing guard plate 26 and the second stabilizing guard plate 27 are enclosed on two sides of the laser cutting machine 25, so that the laser cutting machine also plays a role in preventing damage to the rest plate surfaces caused by heat generated by laser. The positional movement of the additional stabilizing shield 26 can be used to adjust the range of cuts required for different circuit boards 202.
In a second embodiment, as shown in fig. 6-9, the holder 3 includes a fixing frame 31, the fixing frame 31 is fixedly installed inside the stand 1, a clamping assembly 32 is rotatably installed inside the stand 1, an adjustor 33 is fixedly connected to the outer side of the clamping assembly 32, and the inside of the clamping assembly 32 is fixedly connected with the dust remover 4.
The clamping assembly 32 comprises a flat groove 321, the flat groove 321 is formed in the inner side of the fixed frame 31, a sliding rod 322 is slidably mounted in the flat groove 321, an inserting rod 323 is connected to the outer side of the sliding rod 322 through a bearing, the inserting rod 323 is in threaded connection with the surface of the fixed frame 31, a connecting plate 324 is fixedly connected to the bottom side of the sliding rod 322, a fixing shaft 325 is sleeved on the outer side of the connecting plate 324, a clamping head 329 is fixedly connected to the center of the fixing shaft 325, a rotating shaft 327 is rotatably mounted on the surface of the clamping head 329, the rotating shaft 327 is arranged above the fixing shaft 325, two ends of the rotating shaft 327 are fixedly connected with the fixed frame 31, an inner clamping seat 328 is fixedly connected to the outer side of the adjuster 33, the bottom of the inner clamping seat 328 is fixedly connected with the stand 1, and the inner side of the inner clamping seat 328 is fixedly connected with a fixing sleeve 45. The sliding rod 322 connected with the inner end through the bearing moves inwards by rotating the inserting rod 323, wherein the sliding rod 322 is arranged in the sliding mounting flat groove 321, the connecting plate 324 is fixedly connected with the bottom of the sliding rod 322, the connecting plate 324 also moves inwards and drives the fixing shaft 325 sleeved in the fixing shaft 325, the center part of the fixing shaft 325 is sleeved in the clamping head 329, the clamping head 329 rotates through the rotating shaft 327, the rotating shaft 327 is arranged above the fixing shaft 325, and the upper half part of the clamping head 329 can press inwards because the lower half part of the clamping head 329 is pressed inwards, so that the upper half part of the clamping head 329 can press and clamp the part of the circuit board 202 with the surface open hole, and in addition, the part of the clamping head 329 contacted with the circuit board 202 is provided with a soft cushion for protection.
The regulator 33 includes universal seat 331, universal seat 331's outside and nut 326 fixed connection, universal seat 331's rotation part fixedly connected with cutting 332, cutting 332's outside sliding mounting has cover strip 333, the outside fixedly connected with center plectane 334 of cover strip 333, the outside and the fixed column 338 fixed connection of center plectane 334, the outside and interior cassette 328 fixed connection of fixed column 338, the side fixedly connected with spring 335 of center plectane 334, the one end fixedly connected with limit dish 336 of spring 335, the inboard and the cutting 332 fixed connection of limit dish 336 of No. one, the one end fixedly connected with No. two limit dish 337 of limit dish 336 is kept away from to spring 335, the inboard and the cover strip 333 fixed connection of No. two limit dish 337. When the fixing shaft 325 moves inwards, the nut 326 fixed on the outer side of the fixing shaft moves, the universal seat 331 is fixedly connected to the outer side of the nut 326, and the rotating part inside the universal seat 331 is connected with the cutting 332, so that the cutting 332 stretches into the cutting 333, the first limit plate 336 and the second limit plate 337 are fixedly connected to the surfaces of the cutting 332 and the cutting 333 respectively, the first limit plate 336 and the second limit plate 337 are connected through the spring 335, in addition, the middle part of the spring 335 is fixed by the central circular plate 334, and therefore, when the cutting 332 stretches into the cutting 333, the two ends of the spring 335 are simultaneously compressed, so that the cutting 333 moves in the opposite direction with the cutting 332, and at the moment, the other clamping head 329 reversely rotates with the previous clamping head 329 to simultaneously clamp and fix the circuit board 202.
The dust remover 4 comprises an opening sleeve 41, a suction plug 42 is slidably arranged in the opening sleeve 41, an external suction pipe 43 and a drainage pipe 46 are sleeved outside the opening sleeve 41 respectively, the drainage pipe 46 is arranged below the external suction pipe 43, a lower pull rod 44 is fixedly connected to the bottom of the suction plug 42, a fixing sleeve 45 is slidably arranged outside the lower pull rod 44, the outer side of the fixing sleeve 45 is fixedly connected with a clamping assembly 32, the lower pull rod 44 is inserted into the bottom of the stand 1, and the drainage pipe 46 is sleeved at the bottom of the stand 1. The lower pull rod 44 is pulled downwards, so that the suction plug 42 fixedly connected with the top of the lower pull rod moves downwards along the inner side of the perforated sleeve 41, the top of the suction plug 42 is clung to the inner side of the perforated sleeve 41 at first, because the cross section area of the suction plug 42 is far larger than the area of a hole formed in the top of the perforated sleeve 41, the suction plug 42 generates suction force in the perforated sleeve 41 to suck the chips generated by laser cutting, the external suction pipe 43 also generates a suction force to increase the adsorption range of the chips as the suction plug 42 continues downwards and reaches the lower part of the external suction pipe 43, and finally, when the suction plug 42 reaches the lower part of the connection part of the drainage tube 46 and the perforated sleeve 41, the chips slide downwards from the inside of the drainage tube 46 due to gravity because the length of the drainage tube 46 is long enough for generating the suction force.
As shown in fig. 1 to 9, a cutting method for molding a small-sized circuit board includes the steps of:
step one, stable clamping, namely, the lower half part of the clamping head 329, which is positioned on the rotating shaft 327, is extruded inwards, so that the upper half part of the clamping head 329 can rotate anticlockwise, and therefore, the upper half part of the clamping head 329 can extrude and clamp the part with the surface hole of the circuit board 202;
step two, laser cutting, namely starting a driver 24 to enable a screw rod 20 connected with an output end of the driver to rotate, wherein a movable table 23 is connected to the outer side of the screw rod 20 in a threaded manner, so that the movable table 23 drives a laser cutting machine 25 fixed at the bottom of the screw rod to move and cut a circuit board by laser;
step three, the dust removal process, when the suction plug 42 continues to be downward and reaches the lower part of the external suction pipe 43, the external suction pipe 43 also generates a suction force to increase the adsorption range of the chips, and finally when the suction plug 42 reaches the lower part of the connection part of the drainage tube 46 and the open hole sleeve 41, the suction force is not generated enough because the length of the drainage tube 46 is long, so that the chips can slide downward from the drainage tube 46 due to gravity.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (10)
1. Cutting equipment for small-size circuit board shaping, including stand (1), cutterbar (2), holder (3) and dust remover (4), its characterized in that: the cutter (2) is arranged above the stand (1), the bottom of the cutter (2) is fixedly connected with the clamp holder (3), the dust remover (4) is fixedly arranged in the clamp holder (3), and the cutter (2) is fixedly arranged in the stand (1);
the cutter (2) comprises a transverse groove (21), the transverse groove (21) is formed in the top of the stand (1), a sliding frame (22) is slidably arranged in the transverse groove (21), a screw rod (20) is connected with the sliding frame (22) in a threaded mode, one end of the screw rod (20) is connected with a driving machine (24) through a coupler, the outer side of the driving machine (24) is fixedly connected with the sliding frame (22), a movable table (23) is connected with the surface of the screw rod (20) in a threaded mode, and a laser cutting machine (25) is fixedly connected to the bottom of the movable table (23);
the clamp holder (3) comprises a fixed frame (31), the fixed frame (31) is fixedly arranged in the stand (1), a clamping assembly (32) is rotatably arranged in the stand (1), an adjustor (33) is fixedly connected to the outer side of the clamping assembly (32), and the inner part of the clamping assembly (32) is fixedly connected with the dust remover (4);
the dust remover (4) comprises an opening sleeve (41), a suction plug (42) is arranged in the opening sleeve (41) in a sliding manner, an external suction pipe (43) and a drainage pipe (46) are sleeved on the outer side of the opening sleeve (41) respectively, the drainage pipe (46) is arranged below the external suction pipe (43), a lower pull rod (44) is fixedly connected to the bottom of the suction plug (42), a fixing sleeve (45) is arranged on the outer side of the lower pull rod (44) in a sliding manner, the outer side of the fixing sleeve (45) is fixedly connected with a clamping assembly (32), the lower pull rod (44) is spliced at the bottom of the stand (1), and the drainage pipe (46) is sleeved at the bottom of the stand (1).
2. The cutting apparatus for molding a small-sized wiring board according to claim 1, wherein: the laser cutting machine is characterized in that a first stabilizing guard plate (26) and a second stabilizing guard plate (27) are respectively arranged on two sides of the laser cutting machine (25), a circuit board (202) is clamped at the bottoms of the first stabilizing guard plate (26) and the second stabilizing guard plate (27), and a pushing block (201) is fixedly connected to the outer side of the first stabilizing guard plate (26).
3. The cutting apparatus for molding a small-sized wiring board according to claim 2, wherein: the outside sliding of ejector pad (201) is installed bending rod (28), bending rod (28) slidable mounting is in the inside of frame (1), and the surface threaded connection of No. two steady backplate (27) has screw rod (29), the bottom and the frame (1) threaded connection of screw rod (29).
4. The cutting apparatus for molding a small-sized wiring board according to claim 1, wherein: the clamping assembly (32) comprises a flat groove (321), the flat groove (321) is formed in the inner side of the fixed frame (31), a sliding rod (322) is slidably mounted in the flat groove (321), an inserting rod (323) is connected to the outer side of the sliding rod (322) through a bearing, and the inserting rod (323) is in threaded connection with the surface of the fixed frame (31).
5. The cutting apparatus for molding a small-sized wiring board according to claim 4, wherein: the bottom side fixedly connected with connecting plate (324) of slide bar (322), the outside cover of connecting plate (324) is equipped with fixed axle (325), the central part fixedly connected with clamping head (329) of fixed axle (325), pivot (327) are installed in the surface rotation of clamping head (329), pivot (327) set up in the top of fixed axle (325), the both ends and the fixed frame (31) fixed connection of pivot (327).
6. The cutting device for molding a small-sized wiring board according to claim 5, wherein: the outside of fixed axle (325) fixedly connected with nut (326), fixed axle (325) set up in the position between chuck (329) and nut (326), the outside of nut (326) is fixedly connected with regulator (33).
7. The cutting apparatus for molding a small-sized wiring board according to claim 6, wherein: the outer side of the regulator (33) is fixedly connected with an inner clamping seat (328), the bottom of the inner clamping seat (328) is fixedly connected with the stand (1), and the inner side of the inner clamping seat (328) is fixedly connected with a fixing sleeve (45).
8. The cutting apparatus for molding a small-sized wiring board according to claim 1, wherein: the adjuster (33) comprises a universal seat (331), the outer side of the universal seat (331) is fixedly connected with a screw cap (326), a cutting (332) is fixedly connected to a rotating part of the universal seat (331), and a sleeve strip (333) is arranged on the outer side of the cutting (332) in a sliding mode.
9. The cutting apparatus for molding a small-sized wiring board according to claim 8, wherein: the outside fixedly connected with center plectane (334) of cover strip (333), the outside and the fixed column (338) fixed connection of center plectane (334), the outside and the interior cassette (328) fixed connection of fixed column (338).
10. A cutting method for forming a small-size circuit board is characterized by comprising the following steps of: the method comprises the following steps:
step one, stable clamping, namely, the lower half part of the clamping head (329) positioned on the rotating shaft (327) is extruded inwards, so that the upper half part of the clamping head can rotate anticlockwise, and the upper half part of the clamping head (329) can extrude and clamp the part with the surface open hole of the circuit board (202);
step two, laser cutting, namely starting a driving machine (24) to enable a screw rod (20) connected with an output end of the driving machine to rotate, wherein a movable table (23) is connected to the outer side of the screw rod (20) in a threaded manner, so that the movable table (23) drives a laser cutting machine (25) fixed at the bottom of the movable table to move, and laser cutting is carried out on a circuit board;
step three, dust removal treatment, when the suction plug (42) continues downwards and reaches the lower part of the external suction pipe (43), the external suction pipe (43) also generates a suction force to play a role in enlarging the adsorption range of chips, and finally when the suction plug (42) reaches the lower part of the connection part of the drainage tube (46) and the perforated sleeve (41), the chips finally slide downwards from the drainage tube (46) due to gravity because the length of the drainage tube (46) is long and insufficient for generating suction force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310872121.4A CN116786998A (en) | 2023-07-17 | 2023-07-17 | Cutting equipment and method for forming small-size circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310872121.4A CN116786998A (en) | 2023-07-17 | 2023-07-17 | Cutting equipment and method for forming small-size circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117283158A (en) * | 2023-10-25 | 2023-12-26 | 河北泽义钢结构有限公司 | Material fixing device for laser cutting |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117283158A (en) * | 2023-10-25 | 2023-12-26 | 河北泽义钢结构有限公司 | Material fixing device for laser cutting |
| CN117283158B (en) * | 2023-10-25 | 2024-04-30 | 河北泽义钢结构有限公司 | Material fixing device for laser cutting |
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