CN116779350A - Power switch device for wafer detection equipment and wafer detection equipment - Google Patents

Abstract

The application belongs to the technical field of wafer detection, and particularly relates to a power switch device for wafer detection equipment and the wafer detection equipment. The wafer detection equipment comprises a shell and a moving platform, wherein a vacuum environment can be formed in the shell, the moving platform is arranged in the shell and can move in the moving platform, and the power switch device comprises a first wiring structure and a second wiring structure; the first wiring structure is arranged in the shell and at least partially positioned in the shell, and is used for accessing the lead; the second wiring structure is arranged on the mobile platform and used for leading out the lead, and the mobile platform can drive the second wiring structure to move so that the second wiring structure and the first wiring structure are switched between being connected and disconnected. The power switch device realizes power on-off by controlling the switching between the connection and disconnection of the two wiring structures, and has quicker response, so that the wafer detection equipment with the power switch device has higher efficiency. In addition, the wire layout is simple and the stability is higher.

Description

Power switch device for wafer detection equipment and wafer detection equipment

Technical Field

The application belongs to the technical field of wafer detection, and particularly relates to a power switch device for wafer detection equipment and the wafer detection equipment.

Background

Most of the semiconductor devices need to operate in a vacuum environment, however, the maintenance of the vacuum environment requires higher demands on the accessories of the semiconductor devices; when the electric element which can be used in the atmosphere is placed in a vacuum environment, the electric element can volatilize, generate heat or be influenced by an electromagnetic field, and the like, so that the vacuum environment is polluted.

At present, the connection between the vacuum environment (vacuum side) and the atmosphere side is mainly realized by a vacuum peeping method; specifically, the electric elements on the atmosphere side are connected with the electric elements in the vacuum environment through wires and electromagnetic valves, and the electromagnetic valves are controlled to realize the electric energy on-off of all the electric elements in the vacuum environment.

However, with this solution, the wires introduced into the vacuum environment need to be reasonably laid out to avoid interference with the motion mechanism of the vacuum side, and the wire layout is complex; the wires are easy to wind and further damage the equipment, and if the wires are too long to avoid winding, the wires can influence an electric field in the environment (the wires are generally high-voltage cables) so as to influence the detection precision of the equipment; secondly, the on-off of the electromagnetic valve is controlled (the on-off is required for detecting products each time), so that the equipment efficiency can be reduced.

Disclosure of Invention

The application provides a power switch device for wafer detection equipment and the wafer detection equipment, wherein the power switch device cancels an electromagnetic valve, and the wafer detection equipment using the power switch device has the advantages of quick response, high efficiency, simple wire layout and higher stability.

According to an aspect of the present application, there is provided a power switching device for a wafer inspection apparatus including a housing capable of forming a vacuum environment therein and a moving platform disposed in the housing and capable of moving in the moving platform, the power switching device including a first wiring structure and a second wiring structure; the first wiring structure is arranged in the shell and at least partially positioned in the shell, and is used for accessing the lead; the second wiring structure is arranged on the mobile platform and used for leading out the lead, and the mobile platform can drive the second wiring structure to move so that the second wiring structure and the first wiring structure are switched between being connected and disconnected.

In an alternative scheme of the application, the second wiring structure comprises a movable bracket, a second wiring piece and an abutting piece, wherein the movable bracket is arranged on the movable platform, and the second wiring piece and the abutting piece are both arranged on the movable bracket; the second wiring piece is connected to the abutting piece and leads out the lead, and the abutting piece can be abutted to the first wiring structure.

In an alternative scheme of the application, the movable bracket comprises a fixed plate, a first adapter plate, a second adapter plate and a mounting plate; the fixed plate is connected to the mobile platform, and the first adapter plate is connected to the fixed plate and comprises a first transverse plate section; the second adapter plate comprises a second transverse plate section and a second vertical plate section, the second vertical plate section is connected with the second transverse plate section, and the second transverse plate section is connected with the first transverse plate section; the mounting panel is connected in the vertical board section of second, and the second wiring spare and butt spare all set up in the mounting panel.

In an alternative aspect of the present application, the movable bracket further includes a pressing plate, and the second wire member cooperates with the pressing plate to sandwich the abutting member between the pressing plate and the mounting plate.

In an alternative aspect of the application, the number of the abutment members is plural, and the plural abutment members each extend from the top end of the mounting plate toward the vicinity of the first wiring structure and are arranged at intervals in the longitudinal direction.

In an alternative aspect of the present application, the movable bracket further includes a clamping plate connected to the fixing plate and cooperating with the fixing plate to fix the wire led out from the second wire connector.

In an alternative scheme of the application, the first wiring structure comprises a mounting seat, a first wiring piece and a contact electrode; the mounting seat is connected to the shell, and the first wiring pieces and the contact poles are arranged on the mounting seat and are all positioned in the shell; the first wire connector is connected to the contact pole and is capable of accessing the wire.

In an alternative scheme of the application, the mounting seat is provided with a plurality of first mounting grooves which are longitudinally arranged at intervals, and the number of the contact poles is the same as that of the first mounting grooves; each contact electrode is accommodated in the corresponding first mounting groove.

In an alternative scheme of the application, the device further comprises a detection sensor, wherein the detection sensor is connected to the abutting piece and used for detecting whether the abutting piece is electrified or not.

According to another aspect of the present application, there is provided a wafer inspection apparatus including the above-described power switching device.

In summary, the power switching device provided by the application can be applied to wafer detection equipment, the power switching device is not provided with the electromagnetic valve for controlling the on-off of the power, and the on-off of the power is realized by controlling the switching between the connection and disconnection of the two wiring structures, so that the response is quicker, and the efficiency of the wafer detection equipment with the power switching device is higher. And secondly, the wires at the vacuum side only comprise wires led out from the second wiring structure to the mobile platform, and the mobile platform cannot interfere with the wires in the moving operation process, in other words, the wires are not required to be arranged in the shell to transfer the wires led in from the atmosphere side, so that the interference phenomenon of the mobile platform and the transfer wires caused by unreasonable wire layout is avoided. In addition, because the lead wire positioned on the vacuum side is shorter, the electric field generated by the lead wire has less influence on the detection precision of the wafer detection equipment, and the stability is higher.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those skilled in the art that the drawings in the following description are of some embodiments of the application, and that other drawings may be obtained from these drawings without inventive effort.

FIG. 1 is a schematic diagram of a power switching device according to one embodiment of the present application;

FIG. 2 is a schematic diagram of a second power switching device according to one embodiment of the present application;

FIG. 3 is a schematic diagram of a second wiring structure of FIG. 1;

FIG. 4 is an exploded view of the second wiring structure of FIG. 3;

FIG. 5 is a schematic view of the second wiring structure of FIG. 3 at another view angle;

FIG. 6 is a schematic diagram of the first wiring structure of FIG. 1;

fig. 7 is an exploded view of the first wiring structure of fig. 6.

The reference numerals are as follows:

100. a first wiring structure; 110. a mounting base; 120. a first wire connecting piece; 130. a contact electrode;

200. a second wiring structure; 210. a movable bracket; 211. a fixing plate; 212. a first adapter plate; 2121. a first transverse plate segment; 2122. a first vertical plate section; 213. a second adapter plate; 2131. a second transverse plate segment; 2132. a second vertical plate section; 214. a mounting plate; 215. a pressing plate; 216. a clamping plate; 220. a second wire connecting piece; 230. an abutment;

101. 102, 103, 104, 201, 202, 203, 204, 205, 206, screw; 105. a plug pin;

a1, a first mounting groove; a2, a second mounting groove; h1, a first strip hole; h2, second elongated holes;

300. a housing; 400. a mobile platform; 500. and (5) conducting wires.

Detailed Description

In the description of the present application, it should be understood that, if there are descriptions of terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating orientation or positional relationship, it should be understood that the orientation or positional relationship shown based on the drawings is merely for convenience of description and simplification of the description, and does not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the application.

Furthermore, the presence of features defining "first" and "second" for descriptive purposes only, should not be interpreted as indicating or implying a relative importance or implicitly indicating the number of features indicated. Features defining "first", "second" may include at least one such defined feature, either explicitly or implicitly. If a description of "a plurality" is present, the generic meaning includes at least two, e.g., two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly stated and limited otherwise, terms such as "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; the connection may be mechanical connection, electrical connection, direct connection, indirect connection through an intermediate medium, communication between two elements or interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those skilled in the art according to the specific circumstances.

In the description of the present specification, the terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., as used herein, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Fig. 1 and 2 each show a power switching device for a wafer inspection apparatus, the power switching device shown in fig. 1 being in an on state, and the power switching device shown in fig. 2 being in an off state. Referring to fig. 1 and 2, the wafer inspection apparatus includes a housing 300 and a moving platform 400. Wherein only a partial view of the housing 300 is shown, the housing 300 can cooperate with a housing fitting (e.g., a cover plate) to form a sealed chamber, and a vacuum environment can be formed by evacuating the sealed chamber. The moving platform 400 is disposed in the housing 300 and is movable within the moving platform 400.

In a specific application, the moving platform 400 can perform planar motion in the cavity of the housing 300 under the action of a driving mechanism, for example, the driving mechanism is an X-axis linear module and a Y-axis linear module, and the X-direction and the Y-direction motion are realized by combining the X-axis linear module and the Y-axis linear module, where the X-direction may be the length direction of the housing 300, and the Y-direction may be the width direction of the housing 300. In summary, the mobile platform 400 is guaranteed to be capable of moving within the housing 300, and is not limited in particular.

In some alternative embodiments, the power switching device includes a first wiring structure 100 and a second wiring structure 200. The first wiring structure 100 is disposed in the housing 300 and at least partially located in the housing 300, and the first wiring structure 100 is used for accessing the wires 500. Referring to fig. 1 and 2, in the present embodiment, a first wiring structure 100 is installed at the top end of the wall of a housing 300, and related components of the first wiring structure 100 for introducing an atmospheric-side wire 500 are located in the housing 300.

The second wiring structure 200 is disposed on the mobile platform 400 and is used for leading out the wires 500, and the mobile platform 400 can drive the second wiring structure 200 to move, so that the second wiring structure 200 and the first wiring structure 100 can be switched between being connected and disconnected.

It should be noted that the second connection structure 200 is used for leading out the wires 500 on the vacuum side, so as to supply power to the power utilization elements in the moving platform 400 and other power utilization elements of the wafer inspection apparatus. It should be understood that the power consuming elements powered by the wire 500 do not include a drive mechanism in the mobile platform 400, i.e., the wire 500 is not used to provide the mobile platform 400 with the capability of normal mobile operation when the power switching device is in the off state.

Referring to fig. 1, the power switch device is in an on state, the first connection structure 100 is connected to the second connection structure 200, and the mobile platform 400 is at a preset position in the housing 300, where the preset position may be defined as an on position. Referring to fig. 2, the power switch device is in an off state, the first connection structure 100 is disconnected from the second connection structure 200, and the mobile platform 400 is not in an on position in the housing 300.

In this embodiment, the second connection structure 200 is connected to the first connection structure 100 by driving the moving platform 400 to the on position, so that the power switch device is in the on state; the second connection structure 200 is disconnected from the first connection structure 100 by driving the movable platform 400 to leave the open position, so that the power switching device is switched to the closed state. It can be seen that the state of the power switching device can be adjusted by changing the position of the mobile platform 400.

It should be appreciated that in the on state, the atmospheric side wire 500 led in by the first wiring structure 100 is energized with the vacuum side wire 500 led out by the second wiring structure 200; in the closed state, the atmospheric-side wire 500 led from the first wiring structure 100 is disconnected from the vacuum-side wire 500 led from the second wiring structure 200. The atmosphere side is the atmosphere outside the sealed chamber of the housing 300, and the vacuum side is the sealed chamber inside the housing 300. It should be noted that, the high voltage power is supplied to the wire 500, and the electric field formed by the wire may reduce the accuracy of the wafer inspection apparatus.

Compared with the prior art, the application omits the electromagnetic valve for controlling the on-off of the power supply, realizes the on-off of the power supply by controlling the switching between the connection and the disconnection of the two wiring structures, and has quicker response, thus the wafer detection equipment with the power supply switch device has higher efficiency. In other words, the wires are not required to be arranged in the housing 300 to transfer the wires 500 led in from the atmosphere side, so that the interference phenomenon between the mobile platform 400 and the transfer wires due to unreasonable wire layout is avoided. In addition, since the wire 500 on the vacuum side is shorter, the electric field generated by the wire has less influence on the detection accuracy of the wafer detection device, and the stability is better.

Fig. 3 to 5 show schematic diagrams related to the second connection structure 200 in fig. 1, referring to fig. 3, in some alternative embodiments, the second connection structure 200 includes a movable bracket 210, a second connection member 220, and an abutment member 230, where the movable bracket 210 is disposed on the movable platform 400, and the second connection member 220 and the abutment member 230 are disposed on the movable bracket 210.

Specifically, the movable bracket 210 can move along with the moving platform 400, so as to drive the second connection element 220 and the abutment element 230 to move. With the mobile platform 400 in the open position, the abutment 230 can abut against the first wiring structure 100, thereby switching on the lead 500 introduced from the atmosphere side, and the second wiring 220 is connected to the abutment 230 and draws out the lead 500 to power the relevant electrical components on the vacuum side.

In this embodiment, the second connection element 220 and the abutment element 230 can serve to communicate with the lead 500 introduced from the first connection structure 100, the movable bracket 210 can separate the movable platform 400 from the second connection element 220 and the abutment element 230, so as to avoid direct communication between the power source and the movable platform 400, and of course, the abutment element 230 can be fixed in a suitable position by the movable bracket 210 to ensure that the abutment element 230 can abut against the first connection structure 100.

Referring to fig. 4, in some alternative embodiments, the movable bracket 210 includes a fixed plate 211, a first adapter plate 212, a second adapter plate 213, and a mounting plate 214. Wherein the fixed plate 211 is connected to the mobile platform 400, and the first adapter plate 212 is connected to the fixed plate 211 and comprises a first transverse plate section 2121.

In a specific application, the fixing plate 211 is a rectangular plate, and four corners of the fixing plate 211 are respectively provided with screws 201 to realize fixed mounting on the mobile platform 400. The first adapter plate 212 further comprises a first vertical plate section 2122, the first vertical plate section 2122 being connected to a lateral end of the first lateral plate section 2121, the first adapter plate 212 being an L-shaped bending plate, the first vertical plate section 2122 being provided with two screws 202 for connection to the fixing plate 211.

Of course, the first adapter plate 212 may be a single plate extending in the transverse direction, so long as the transverse offset is ensured with respect to the fixing plate 211.

The second adapter plate 213 includes a second transverse plate segment 2131 and a second vertical plate segment 2132, the second vertical plate segment 2132 being connected to the second transverse plate segment 2131, the second transverse plate segment 2131 being connected to the first transverse plate segment 2121. In a specific application, the second adapter plate 213 is also an L-shaped bent plate, the first adapter plate 212 and the second adapter plate 213 are arranged facing each other, and the second transverse plate segment 2131 is connected to the first transverse plate segment 2121 by two screws 203.

The mounting plate 214 is connected to the second vertical plate segment 2132, and the second wire connector 220 and the abutment 230 are disposed on the mounting plate 214. In a specific application, the mounting plate 214 is arranged vertically, and is fixedly mounted to the second vertical plate segment 2132 by two screws 204, and the second wire connector 220 and the abutting member 230 are disposed at one vertical end of the mounting plate 214.

In this embodiment, the movable bracket 210 is formed by assembling a plurality of plates with screws, however, the number of plates and the shape of each plate are not limited to the above 4 plates, and the abutting pieces 230 can be fixed at appropriate positions by assembling the plates to achieve the connection with the first wiring structure 100. It should be noted that, under the condition of realizing assembly by the screws, each screw is also matched with a corresponding gasket so as to ensure the connection reliability of each plate.

It should be understood that the movable bracket 210 is assembled by plates, which has higher assembly flexibility, and the plates are not limited to being assembled by screws, for example, may be assembled by bolts, rivets, etc., and of course, the plates may be assembled by welding, which is not illustrated herein.

In some alternative embodiments, at least one of the first transverse plate segment 2121 and the second transverse plate segment 2131 is provided with a first elongated aperture H1 extending in a transverse direction. In the embodiment shown in fig. 4, the second transverse plate segment 2131 is provided with two first elongated holes H1, and the first elongated holes H1 are used for penetrating the screws 203 to assemble the first adapter plate 212 and the second adapter plate 213, so that the transverse relative positions of the first adapter plate 212 and the second adapter plate 213 can be adjusted during the process of assembling the movable bracket 210.

It should be appreciated that in an alternative embodiment, the first elongated hole H1 provided in the first transverse plate segment 2121 may also enable adjustment of the relative positions of the first adapter plate 212 and the second adapter plate 213 in the transverse direction. In yet another alternative embodiment, the first elongated hole H1 is provided in each of the first transverse plate segment 2121 and the second transverse plate segment 2131, and the first elongated hole H1 in the first transverse plate segment 2121 and the first elongated hole H1 in the second transverse plate segment 2131 are disposed opposite to each other, so that the relative positions of the first adapter plate 212 and the second adapter plate 213 in the transverse direction can be adjusted.

In some alternative embodiments, at least one of mounting plate 214 and second vertical plate segment 2132 is provided with a second elongated aperture H2 extending vertically. In the embodiment shown in fig. 4, the mounting plate 214 is provided with two second elongated holes H2, and the second elongated holes H2 are used for penetrating the screws 204 to assemble the second adapter plate 213 and the mounting plate 214, so that the vertical relative positions of the second adapter plate 213 and the mounting plate 214 can be adjusted during the process of assembling the movable bracket 210.

It should be appreciated that in another alternative embodiment, the provision of the second elongated hole H2 on the second vertical plate segment 2132 also enables adjustment of the vertical relative position of the second adapter plate 213 and the mounting plate 214. In yet another alternative embodiment, the second vertical plate segment 2132 and the mounting plate 214 are provided with a second elongated hole H2, and the second elongated hole H2 on the second vertical plate segment 2132 and the second elongated hole H2 on the mounting plate 214 are disposed opposite to each other, so that the vertical relative position of the second adapter plate 213 and the mounting plate 214 can be adjusted.

Therefore, the positions of the abutting pieces 230 can be finely adjusted by reasonably forming the strip holes on each plate in the movable support 210, so as to ensure that the abutting pieces 230 are fully contacted with the first wiring structure 100, and avoid poor contact.

In this embodiment, the transverse plate sections extend in the transverse direction, and the vertical plate sections extend in the vertical direction. The lateral direction is the longitudinal direction of the housing 300, the vertical direction is the height direction of the housing 300, and the longitudinal direction is the width direction of the housing 300.

It should be understood that the power introduced through the second connection member 220 and the abutment member 230 cannot directly communicate with the moving platform 400, and thus, at least one of the plates in the movable bracket 210 is a plate made of an insulating material. In particular applications, mounting plate 214 is a ceramic plate, such that movable mount 210 is prevented from being electrically charged. Of course, the mounting plate 214 is not limited to a ceramic plate, but may be an insulating plate such as a plastic plate.

In some alternative embodiments, the movable bracket 210 further includes a pressure plate 215, and the second wire member 220 cooperates with the pressure plate 215 to sandwich the abutment member 230 between the pressure plate 215 and the mounting plate 214.

In a specific application, the second connector 220 is an expansion plug connector, one end of which is provided with a threaded hole with a changeable aperture, and the other end of which is used for leading out the wire 500 on the vacuum side. The top end of the mounting plate 214 is provided with a second mounting groove A2, one ends of the pressing plate 215 and the abutting piece 230 can be accommodated in the second mounting groove A2 and are provided with through holes, and the screw 205 can penetrate through the pressing plate 215 and the through holes on the abutting piece 230 and then be connected with the threaded holes of the second wiring piece 220, so that the threaded holes of the second wiring piece 220 are enlarged, the second wiring piece 220 can be fixed, and the abutting piece 230 can be clamped between the pressing plate 215 and the mounting plate 214.

It should be understood that the pressing plate 215 is a conductive metal plate, such as a copper plate, and the pressing plate 215 ensures that the second wire connecting member 220 and the abutting member 230 have a sufficiently large contact area, so as to avoid poor contact.

It should be noted that, the second wire connecting member 220 is not limited to the expansion type plug connector, for example, it may be a threaded plug connector, and accordingly, the pressing plate 215 is provided with a threaded through hole, and the second wire connecting member 220 may pass through the mounting plate 214 to connect with the threaded hole on the pressing plate 215, so as to sandwich the abutting member 230 between the pressing plate 215 and the mounting plate 214. Of course, the second connection member 220 and the pressing plate 215 are matched in various manners by the fixing and abutting member 230, which is not illustrated in detail herein.

In some alternative embodiments, the number of abutments 230 is a plurality, with each of the plurality of abutments 230 extending from the top end of the mounting plate 214 proximate to the first wiring structure 100 and being longitudinally spaced apart.

In the embodiment shown in fig. 4, the number of the pressing plates 215, the number of the second wire connecting pieces 220, and the number of the screws 205 are equal to the number of the abutting pieces 230 and are 4, and the 4 abutting pieces 230 are arranged at intervals in the longitudinal direction, and accordingly, the 4 pressing plates 215, the 4 second wire connecting pieces 220, and the 4 screws 205 are arranged at intervals in the longitudinal direction, so that the 4 wires 500 led out from the 4 second wire connecting pieces 220 are connected in a one-to-one correspondence manner, and the wires are prevented from being shorted. It should be understood that the number of the second connection members 220 and the abutment members 230 may be determined according to design requirements, and is not limited to the illustrated embodiment.

In a specific application, the abutting piece 230 is a beryllium copper sheet and is obliquely extended towards the direction close to the first wiring structure 100, so that in the case that the second wiring structure 200 is connected with the first wiring structure 100, the abutting piece 230 can deform to provide a resilience force, so that contact is more reliable, and the risk of poor contact is reduced. Of course, the abutting member 230 is not limited to beryllium copper sheet, but may be other conductive metal sheet, such as stainless steel sheet, silver alloy sheet, etc.

Referring to fig. 5, in some alternative embodiments, the movable bracket 210 further includes a clamping plate 216, and the clamping plate 216 is connected to the fixing plate 211 and cooperates with the fixing plate 211 to fix the wires 500 led out from the second wire connector 220.

In the present embodiment, the clamping plate 216 is fixed by two screws 206, so that the wires 500 led out from the second wire connecting member 220 are fixed between the clamping plate 216 and the fixing plate 211, thus the wire layout is compact, and the moving platform 400 prevents the wires 500 from shaking during the moving operation, thereby improving the stability of the apparatus.

Fig. 6 and 7 are schematic diagrams of the first wiring structure 100 in fig. 1, referring to fig. 6 and 7, in some alternative embodiments, the first wiring structure 100 includes a mounting base 110, a first wiring member 120, and a contact 130. The mounting base 110 is connected to the housing 300, and the first wire connecting member 120 and the contact 130 are disposed on the mounting base 110 and are located in the housing 300. The first wire connector 120 is connected to the contact 130 and is capable of accessing the wire 500.

It should be understood that the installation position of the first wiring structure 100 determines the opening position of the mobile platform 400, and the installation accuracy and stability of the first wiring structure 100 are required to be high, so in this embodiment, the installation base 110 is fixedly installed by the screw 101, the screw 102 and the two bolts 105, so as to ensure the installation accuracy and stability of the installation base 110.

The first wire connector 120 is connected to the contact electrode 130, and thus the atmospheric-side wire introduced by the first wire connector 120 is connected to the contact electrode 130, and in the open state, the abutting piece 230 can abut against the contact electrode 130, thereby connecting the vacuum-side wire 500 to the atmospheric-side wire 500.

It should be noted that, in order to avoid the power-on of the housing 300, in a specific application, the mounting base 110 is made of a ceramic material, but is not limited thereto, and may be made of an insulating plastic, for example, so as to ensure that the mounting base 110 and the housing 300 are insulated from each other.

In some alternative embodiments, the mounting base 110 is provided with a plurality of first mounting grooves A1 arranged at intervals along the longitudinal direction, the number of the contact poles 130 is the same as that of the first mounting grooves A1, and each contact pole 130 is accommodated in a corresponding first mounting groove A1.

In the present embodiment, the first mounting grooves A1 are disposed at intervals in the longitudinal direction, and thus the contact poles 130 disposed in each of the first mounting grooves A1 are disposed at intervals from each other, so that the wires introduced by the first wire connector 120 are prevented from being short-circuited with each other. In addition, since the contact electrode 130 is accommodated in the first installation groove A1, the contact electrode 130 is prevented from being erroneously touched by a movable member on the vacuum side during the moving operation of the moving platform 400.

In a specific application, the contact 130 is a conductive metal block, such as a copper metal block, a silver metal block, or the like, and the contact 130 is fixed in the first mounting groove A1 by the screw 103.

In some alternative embodiments, the number of first wire members 120 is the same as the number of contact poles 130, and each first wire member 120 is connected to each contact pole 130 in a one-to-one correspondence.

In this embodiment, the first wire member 120 is connected to the contact 130 by the screw 104. In a specific application, the number of the first wire members 120, the number of the contact poles 130, the number of the screws 103 and the number of the screws 104 are all equal to 4, the first wire members 120 are expansion type plug connectors, the screws 104 can be double-headed screws, one ends of the screws are connected with the first wire members 120, and the other ends of the screws are connected with the contact poles 130, so that the first wire members 120 and the contact poles 130 are fixed on the mounting seats 110, and meanwhile, the connection of the first wire members 120 and the contact poles 130 is ensured.

It should be noted that the first wire connector 120 is not limited to the expansion type plug connector, for example, the first wire connector 120 may be a lantern type plug connector, which can be connected to the contact electrode 130 after passing through the mounting base 110. In addition, it should be appreciated that the number of abutments 230 is the same as the number of contact poles 130.

In some alternative embodiments, the power switching device further includes a detection sensor (not shown) connected to the abutment 230 for detecting whether the abutment 230 is energized.

As can be seen from the above, the contact 230 may be a conductive metal sheet, which deforms after contacting the contact 130, and the contact 230 may be irreversibly deformed due to fatigue as the working time increases, so that the contact 230 may be in poor contact with the contact 130, resulting in failure of power supply. Therefore, in the present embodiment, by adding the detection sensor, it is possible to detect whether the abutment 230 is charged or not in the on state, and to alarm in time when the abutment 230 is not charged, thereby avoiding abnormality of the wafer inspection apparatus. In particular applications, the detection sensor may employ, for example, a voltage sensor, a current sensor, or the like.

While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by those skilled in the art within the scope of the application.

Claims (10)

1. The power switch device for the wafer detection equipment comprises a shell and a moving platform, wherein the shell can form a vacuum environment inside the shell, and the moving platform is arranged in the shell and can move in the moving platform, and the power switch device is characterized by comprising a first wiring structure and a second wiring structure;

the first wiring structure is arranged in the shell and at least partially positioned in the shell, and is used for accessing a wire;

the second wiring structure is arranged on the mobile platform and used for leading out wires, and the mobile platform can drive the second wiring structure to move so that the second wiring structure and the first wiring structure are switched between being connected and disconnected.

2. The power switching device for a wafer inspection apparatus according to claim 1, wherein the second wiring structure includes a movable bracket, a second wiring member, and an abutment member, the movable bracket being disposed on the movable platform, the second wiring member and the abutment member being both disposed on the movable bracket;

the second wiring piece is connected to the abutting piece and leads out the lead, and the abutting piece can abut against the first wiring structure.

3. The power switching device for wafer inspection equipment according to claim 2, wherein the movable bracket comprises a fixed plate, a first adapter plate, a second adapter plate, and a mounting plate;

the fixed plate is connected to the mobile platform, and the first adapter plate is connected to the fixed plate and comprises a first transverse plate section;

the second adapter plate comprises a second transverse plate section and a second vertical plate section, the second vertical plate section is connected with the second transverse plate section, and the second transverse plate section is connected with the first transverse plate section;

the mounting plate is connected to the second vertical plate section, and the second wiring piece and the abutting piece are both arranged on the mounting plate.

4. The power switching device for a wafer inspection apparatus according to claim 3, wherein the movable bracket further comprises a pressing plate, the second wire member cooperating with the pressing plate to sandwich the abutting member between the pressing plate and the mounting plate.

5. A power switching device for a wafer inspection apparatus according to claim 3, wherein the number of the abutting pieces is plural, and a plurality of the abutting pieces each extend from the top end of the mounting plate toward near the first wiring structure and are arranged at intervals in the longitudinal direction.

6. The power switching device for wafer inspection equipment according to claim 3, wherein the movable bracket further comprises a clamping plate connected to the fixing plate and cooperating with the fixing plate to fix the lead wire led out from the second wire member.

7. The power switching device for a wafer inspection apparatus according to claim 1, wherein the first wiring structure comprises a mount, a first wiring member, and a contact electrode;

the mounting seat is connected to the shell, and the first wiring piece and the contact electrode are both arranged on the mounting seat and are both positioned in the shell;

the first wiring member is connected to the contact electrode and is capable of accessing a wire.

8. The power switching device for wafer inspection equipment according to claim 7, wherein the mount is provided with a plurality of first mounting grooves arranged at intervals in a longitudinal direction, the number of the contact poles being the same as the number of the first mounting grooves;

each contact electrode is accommodated in the corresponding first mounting groove.

9. The power switching device for a wafer inspection apparatus according to claim 2, further comprising a detection sensor connected to the abutment for detecting whether the abutment is energized.

10. Wafer inspection apparatus, characterized in that it comprises a power switching device for a wafer inspection apparatus according to any one of claims 1 to 9.