CN116776608B - High-precision equivalent rapid analysis method for heat dissipation cold plate - Google Patents
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- 238000004458 analytical method Methods 0.000 title claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 57
- 230000005855 radiation Effects 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims description 47
- 239000012530 fluid Substances 0.000 claims description 28
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- 239000013529 heat transfer fluid Substances 0.000 claims description 2
- 238000005211 surface analysis Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 133
- 238000004141 dimensional analysis Methods 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract description 2
- 239000002356 single layer Substances 0.000 abstract description 2
- 238000004364 calculation method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
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- 239000005436 troposphere Substances 0.000 description 3
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Abstract
The invention discloses a high-precision equivalent rapid analysis method for a heat-dissipating cold plate, which is implemented according to the following steps: step 1: carrying out layered equivalent modeling on the liquid cooling heat dissipation cold plate; step 2: setting boundary conditions of all layers of the heat dissipation cold plate, and calculating equivalent heat exchange coefficients of all layers of the heat dissipation cold plate; step 3: and (3) carrying out overall analysis on the model, comparing temperature distribution obtained by two times of analysis of each layer, ending the analysis if the temperature distribution error is within a limited range, otherwise, repeating the steps until the temperature of each layer reaches a steady state. According to the invention, the three-dimensional conjugate heat transfer analysis problem of the heat radiation cold plate is converted into the multi-layer two-dimensional conjugate heat transfer analysis problem through structural layering and heat exchange boundary condition determination, so that the problems of huge grid number and long solving time of the three-dimensional analysis model are overcome, the accuracy problem of the single-layer two-dimensional plane model is avoided, the heat radiation analysis efficiency is obviously improved, and a reliable analysis guarantee is provided for the optimization design.
Description
Technical Field
The invention belongs to the technical field of liquid cooling cold plate heat dissipation, and particularly relates to a high-precision equivalent rapid analysis method for a heat dissipation cold plate.
Background
For high-power electronic equipment, efficient heat dissipation design is a guarantee for realizing normal operation of the high-power electronic equipment. At present, the conjugate heat transfer analysis of the liquid cooling heat dissipation cold plate of the high-power electronic equipment is basically based on a three-dimensional simulation model, and the three-dimensional simulation model has large grid quantity and long solving time. The conjugate heat transfer analysis of the liquid cooling heat dissipation cold plate relates to the iterative numerical solution of a plurality of physical fields such as a temperature field, a speed field and the like, and the number of divided grids is large, so that the problem of calculation cost caused by the large number of re-analysis times of a model is solved, and the efficiency of optimizing design is restricted to a certain extent. The existing two-dimensional plane model cannot accurately give the temperature distribution and the speed distribution of the three-dimensional model due to the characteristic of oversimplification, and the accuracy of simulation analysis is seriously affected. Therefore, the research of the high-precision two-dimensional equivalent rapid heat dissipation analysis method of the liquid cooling heat dissipation cold plate three-dimensional model is particularly important to the improvement of the solving precision and the design efficiency of the liquid cooling heat dissipation cold plate flow channel.
Disclosure of Invention
The invention aims to provide a high-precision two-dimensional equivalent rapid analysis method for a liquid cooling heat radiation cold plate, which solves the problem that the precision and efficiency of the existing two-dimensional plane heat radiation analysis model are required to be further optimized so as not to meet the conjugated heat transfer analysis requirement of the heat radiation cold plate of electronic equipment.
The technical scheme adopted by the invention is as follows;
the high-precision equivalent rapid analysis method of the heat dissipation cold plate is implemented according to the following steps:
step 1: carrying out layered equivalent modeling on the liquid cooling heat dissipation cold plate;
step 2: setting boundary conditions of all layers of the heat dissipation cold plate, and calculating equivalent heat exchange coefficients of all layers of the heat dissipation cold plate;
step 3: and (3) carrying out overall analysis on the model, comparing temperature distribution obtained by two times of analysis of each layer, ending the analysis if the temperature distribution error is within a limited range, otherwise, repeating the steps until the temperature of each layer reaches a steady state.
The invention is also characterized in that:
in step 1, the heat-dissipating cold plate is analytically divided into three layers by analyzing the difference of the fluid flow area, the main heat transfer direction and the main heat dissipation mode of the heat-dissipating cold plate in the heat-dissipating process and the layering characteristics on the structure: device-cover plate layer, conjugated heat transfer layer, supporting floor layer.
The step 1 specifically comprises the following steps:
step 1.1, a device-cover plate layer is a heat source layer, a power device is arranged on a cold plate cover plate, the device is in direct contact with the cover plate, the device and the cover plate layer are combined into a layer, the layer is high as the cover plate, heat conduction is carried out in the layer, and natural convection heat dissipation and conjugate heat transfer are carried out outside the layer;
step 1.2, the conjugated heat transfer layer is a layer where the flow channel is located, the layer is a second layer, the layer is distributed in the flow channel and comprises a solid part and a fluid part, the layer is high in the flow channel, the layer is the conjugated heat transfer layer, and the layer is the conjugated heat transfer layer;
and 1.3, supporting the floor layer as a support of the flow channel, wherein the layer is a third layer, the layer height is the thickness of the bottom plate, the layer is heat conduction, and the layer comprises natural convection heat dissipation and conjugate heat transfer.
In step 2, boundary conditions of each layer of the heat dissipation cold plate are specifically set as follows:
setting the thickness of the device-cover plate layer to H t The upper surface sets the power density boundary condition q input =q and natural convection boundary conditionsThe solid contact part of the lower surface and the conjugated heat transfer layer is set with conduction and heat dissipation boundary conditions>The lower surface and the fluid contact part of the conjugate heat transfer layer set the boundary condition of convection heat dissipation
Setting the thickness of the conjugated heat transfer layer as H m The upper surface of the conjugated heat transfer layer and the solid-solid contact surface of the device-cover plate layer set the conduction heat dissipation boundary conditionSetting convection heat radiation boundary condition on the flow-solid contact surface of device-cover plate layer>Solid-solid contact surface setting conduction powder of lower surface of conjugated heat transfer layer and floor layerThermal boundary conditionsSetting convection heat radiation boundary condition on flow-solid contact surface of floor layer>
Setting the thickness of the supporting floor layer to be H b Setting a conduction and heat dissipation boundary condition at the solid contact part of the upper surface of the supporting floor layer and the conjugate heat transfer layerTwo heat radiation boundary conditions of convection are set on the contact part of the conjugated heat transfer fluid>The lower surface is applied with natural convection boundary condition +.>
In the step 2, the equivalent heat exchange coefficient of each layer of the heat dissipation cold plate is calculated specifically as follows:
flow-solid surface equivalent heat exchange coefficient h f-s ：
By the third class of boundary condition definition formula containing the convective heat transfer coefficient, the expression of the flow-solid surface equivalent heat transfer coefficient as the following formula (1) can be obtained:
where ρ is the fluid density, μ is the hydrodynamic viscosity, k f Is the heat conductivity coefficient of the fluid, C p U is the specific heat capacity of the fluid ∞ Is the flow velocity x of the main flow area in the laminar flow state of the conjugate heat transfer layer fluid L Is the flow distance along the flow direction;
solid-solid surface equivalent heat exchange coefficient h s-s ：
And obtaining an expression of the flow-solid surface equivalent heat exchange coefficient as shown in the following formula (2) through a third class of boundary condition definition type comprising the convective heat exchange coefficient and solid-solid surface analysis thickness:
wherein delta s-s For analysis of thickness, k, of solid-solid surface s Is solid heat conductivity coefficient.
The step 3 is specifically as follows:
in the course of the analysis, the device-cap layer was first subjected to the thermal conductivity control equation:
wherein,for Hamiltonian, k s Is solid heat conductivity coefficient, T 1 For device-cover layer temperature distribution, H t For the layer height, q 12 Boundary conditions for heat dissipation of device-cap layer and conjugated heat transfer layer, comprising +.>And->q input To set the power density boundary condition, < >>Natural convection boundary conditions for this layer.
Performing heat dissipation analysis to obtain the layer temperature distribution T 1 The method comprises the steps of carrying out a first treatment on the surface of the Next, the temperature distribution T in the device-cover layer is set 1 Through boundary condition q 12 Transferring to the conjugated heat transfer layer, and then performing conjugated heat transfer analysis on the conjugated heat transfer layer, wherein an analysis control equation is as follows:
wherein ρ is the fluid density, C p Is the specific heat capacity of the fluid, u is the fluid velocity field, k f Is the heat conductivity coefficient of the fluid, T 2 For the temperature distribution of the conjugated heat transfer layer H m For the layer height, q 21 Is the heat dissipation boundary condition of the conjugated heat transfer layer and the device-cover plate layer, and comprisesAnd->q 23 Is the heat dissipation boundary condition of the conjugated heat transfer layer and the device-cover plate layer, comprising +.>And->
Obtaining the temperature distribution T of the conjugated heat transfer layer 2 Then, the analysis result of the layer is passed through the boundary condition q 21 And q 23 Transfer to the device-cover sheet layer and the support floor layer; and then carrying out heat transfer analysis on the supporting floor layer, wherein the control equation is as follows:
wherein k is s Is solid heat conductivity coefficient, T 3 To support the temperature distribution of the floor layer, H b For the layer height, q 32 To support the heat dissipation boundary conditions of the floor layer and the conjugated heat transfer layer, comprisesAnd-> Natural convection boundary conditions for this layer.
The high-precision equivalent rapid analysis method for the liquid-cooled heat-dissipating cold plate has the advantages that the calculation of the equivalent heat exchange coefficient is independent of the three-dimensional simulation analysis model, so that the prior three-dimensional model conjugate heat transfer analysis is not needed during simulation analysis. And secondly, the method adopts an equivalent heat exchange coefficient calculation method based on boundary layer theory, and supplements and considers natural convection influence factors in the two-dimensional equivalent analysis model, thereby further improving the analysis accuracy of the two-dimensional equivalent and greatly improving the analysis accuracy and calculation efficiency of the two-dimensional equivalent model.
Compared with the existing simplified two-dimensional plane model analysis method, when the method is used for heat radiation cold plate analysis, the dependence on the analysis result of the three-dimensional model can be eliminated, the accuracy of the analysis result is greatly improved, the method is closer to the three-dimensional analysis result, and the method can be used for heat radiation analysis of the heat radiation cold plate of electronic equipment.
Drawings
FIG. 1 is a schematic program flow chart of a high-precision equivalent rapid analysis method for a heat-dissipating cold plate according to the present invention;
FIG. 2 is a schematic diagram of a layered structure in an embodiment of a method for high-precision equivalent rapid analysis of a heat-dissipating cold plate according to the present invention;
FIG. 3 is a schematic diagram showing the application of boundary conditions between a device and a cover plate layer in an embodiment of the method for high-precision equivalent rapid analysis of a heat-dissipating cold plate according to the present invention;
FIG. 4 is a schematic diagram illustrating the application of boundary conditions to a troposphere in an embodiment of the method for high-precision equivalent rapid analysis of a heat sink cold plate according to the present invention;
FIG. 5 is a schematic diagram showing the application of boundary conditions to a floor layer in an embodiment of the method for high-precision equivalent rapid analysis of a heat-dissipating cold plate according to the present invention;
fig. 6 is a schematic diagram of an overall model analysis strategy in an embodiment of the high-precision equivalent rapid analysis method for a heat-dissipating cold plate according to the present invention.
Detailed Description
The high-precision equivalent rapid analysis method of the heat dissipation cold plate of the invention is described in detail below with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, the method for high-precision equivalent rapid analysis of a heat-dissipating cold plate provided by the invention mainly comprises the following steps:
example 1.
1) Layering equivalent modeling of heat dissipation cold plates:
the heat dissipation cold plate can be divided into three layers by analyzing the difference of main heat dissipation modes and structural characteristics of the heat dissipation cold plate in the heat dissipation process: device-cover sheet layer, conjugated heat transfer layer, support floor layer, as shown in fig. 2. Wherein:
1.1 Device-cap layer:
the device is mounted on the cover plate, and the device is directly contacted with the cover plate, so that the device and the cover plate are combined into one layer, and the layer is used as a first layer, and the heat conduction is carried out, and the overall size of the layer is 100mm multiplied by 132mm, the size of a single power device is 6.67mm multiplied by 6.67mm, the heat power is 5W, and the heat conduction coefficient of the material of the layer is 200W/(m multiplied by K), and the density is 2700kg/m 3 The specific heat capacity was 900J/(kg. Times.K).
1.2 Conjugated heat transfer layer):
the layer is a layer with flow channels and comprises flow channel distribution and solid distribution, the layer is internally provided with conjugate heat transfer, the overall size of the layer is 100mm multiplied by 132mm, the heat conduction coefficient of the solid part material of the layer is 200W/(m multiplied by K), and the density is 2700kg/m 3 The specific heat capacity is 900J/(kg×K), the heat conductivity coefficient of the fluid part material is 0.6W/(m×K), and the density is 1000kg/m 3 The specific heat capacity was 4180J/(kg. Times.K).
1.3 Supporting floor layer):
the layer is a supporting floor layer, is used as a support of a runner, is thermally conductive, has a layer height of the thickness of a bottom plate, has an overall dimension of 100mm multiplied by 132mm, has a thermal conductivity of 200W/(m multiplied by K) and has a density of 2700kg/m 3 The specific heat capacity was 900J/(kg. Times.K).
Example 2.
2) And (3) setting heat exchange boundary conditions:
2.1 Layer boundary condition setting:
2.1.1 A first layer is a device-cover plate layer, the upper surface is a power-applying surface, and the lower surface is a heat-exchanging surface, wherein the lower surface of the layer is in contact with not only the solid portion of the troposphere but also the fluid, so that the upper surface is subjected to a power density boundary condition q=10W/cm 2 Natural convection boundary conditionsThe lower surface is applied with conduction heat exchange boundary condition->Boundary conditions with convection heat exchange->As shown in fig. 3;
2.1.2 A second layer is a conjugated heat transfer layer, heat enters the layer in a heat conduction and heat convection mode after being conducted by the device-cover plate layer, the upper surface of the conjugated heat transfer layer is contacted with the cover plate layer, and the lower surface is contacted with the floor layer, so that the upper surface applies a conduction heat exchange boundary conditionAnd convection boundary conditions->The lower surface is applied with conduction heat exchange boundary condition->And convection boundary conditions->As shown in fig. 4;
2.1.3 The third layer is a supporting floor layer, and heat is transferred to the floor layer partially while the conjugate heat transfer layer is carried away. The contact part of the upper surface of the layer and the fluid is convection heat radiation, and the contact part of the upper surface of the layer and the solid is conduction heat radiation, so that the upper surface applies conduction heat exchange boundary conditionsBoundary conditions with convection heat exchange->The lower surface is applied with natural convection boundary condition +.>As shown in fig. 5.
2.2 Equivalent heat exchange coefficient calculation:
the heat transfer between the layers is primarily determined by heat exchange boundary conditions including heat exchange coefficients. Because the actual heat exchange between the layers has two conditions of flow-solid heat exchange and solid-solid heat exchange, the equivalent heat exchange coefficients of the flow-solid surface and the solid-solid surface are calculated respectively.
2.2.1 Flow-solid surface equivalent heat exchange coefficient h f-s ：
The expression of the equivalent heat exchange coefficient of the fluid-solid surface can be obtained by a third class of boundary condition definition expression containing the convective heat exchange coefficient:
where ρ is the fluid density, μ is the hydrodynamic viscosity, k f Is the heat conductivity coefficient of the fluid, C p U is the specific heat capacity of the fluid ∞ For the main flow area flow velocity, x L Is the flow distance in the flow direction.
2.2.2 Solid-solid surface equivalent heat exchange coefficient h s-s ：
Also, by defining a third type of boundary condition including the convective heat transfer coefficient and analyzing the thickness of the solid-solid surface, the expression of the equivalent heat transfer coefficient of the fluid-solid surface can be obtained:
wherein delta s-s For the analysis of the solid-solid surface, 1mm, k was taken s Is solid heat conductivity coefficient.
Example 3.
3) Model overall analysis strategy:
3.1 Multi-layer equivalent analysis flow:
in the course of the analysis, the device-cover layer is first analyzed to obtain the layer temperature profile T 1 The method comprises the steps of carrying out a first treatment on the surface of the Secondly, the analysis result of the device-cover plate layer is passed through the boundary condition q 12 Transfer to the conjugated heat transfer layer; then, performing a troposphere conjugated heat transfer analysis, and analyzing the result T of the layer 2 By boundary condition q 21 And q 23 Transfer to the device-cover sheet layer and the support floor layer; then analyzing the device-cover plate layer and the supporting floor layer to obtain a supporting floor layer temperature distribution T 3 . In the course of analysis, the temperature distribution T obtained by two analyses of the layers connected is compared 1 And T 1 ’、T 2 And T 2 ' and T 3 And T 3 If the temperature distribution error δt is within the defined range |δt| the analysis ends, otherwise the above steps are repeated until the layer temperatures reach steady state, as shown in fig. 6.
According to the high-precision equivalent rapid analysis method for the heat-dissipating cold plate, the three-dimensional conjugate heat transfer analysis problem of the heat-dissipating cold plate is determined and converted into the multi-layer two-dimensional conjugate heat transfer analysis problem through structural layering and heat exchange boundary conditions, so that the problems of huge grid number and long solving time of a three-dimensional analysis model are solved, the accuracy problem of a single-layer two-dimensional plane model is avoided, the heat-dissipating analysis efficiency is remarkably improved, and reliable analysis guarantee is provided for optimization design.
Claims (1)
1. The high-precision equivalent rapid analysis method for the heat dissipation cold plate is characterized by comprising the following steps of:
step 1: carrying out layered equivalent modeling on the liquid cooling heat dissipation cold plate;
in step 1, the heat-dissipating cold plate is analytically divided into three layers by analyzing the difference of the fluid flow area, the main heat transfer direction and the main heat dissipation mode of the heat-dissipating cold plate in the heat-dissipating process and the layering characteristics on the structure: a device-cover plate layer, a conjugated heat transfer layer, and a support floor layer;
the step 1 specifically comprises the following steps:
step 1.1, a device-cover plate layer is a heat source layer, a power device is arranged on a cold plate cover plate, the device is in direct contact with the cover plate, the device and the cover plate layer are combined into a layer, the layer is high as the cover plate, heat conduction is carried out in the layer, and natural convection heat dissipation and conjugate heat transfer are carried out outside the layer;
step 1.2, the conjugated heat transfer layer is a layer where the flow channel is located, the layer is a second layer, the layer is distributed in the flow channel and comprises a solid part and a fluid part, the layer is high in the flow channel, the layer is the conjugated heat transfer layer, and the layer is the conjugated heat transfer layer;
step 1.3, a supporting floor layer is used as a support of a flow channel, the layer is a third layer, the layer height is the thickness of the bottom plate, the layer is heat conduction, and the layer comprises natural convection heat dissipation and conjugate heat transfer;
step 2: setting boundary conditions of all layers of the heat dissipation cold plate, and calculating equivalent heat exchange coefficients of all layers of the heat dissipation cold plate;
in step 2, boundary conditions of each layer of the heat dissipation cold plate are specifically set as follows:
setting the thickness of the device-cover plate layer to H t The upper surface sets the power density boundary condition q input =q and natural convection boundary conditionsThe solid contact part of the lower surface and the conjugated heat transfer layer sets the conduction heat dissipation boundary conditionThe lower surface and the fluid contact part of the conjugate heat transfer layer set the boundary condition of convection heat dissipation
Setting the thickness of the conjugated heat transfer layer as H m The upper surface of the conjugated heat transfer layer and the solid-solid contact surface of the device-cover plate layer set the conduction heat dissipation boundary conditionSetting convection heat dissipation boundary condition on flow-solid contact surface of device-cover plate layerThe solid-solid contact surface between the lower surface of the conjugated heat transfer layer and the floor layer sets the conduction heat dissipation boundary conditionSetting convection heat radiation boundary condition on flow-solid contact surface of floor layer>
Setting the thickness of the supporting floor layer to be H b Setting a conduction and heat dissipation boundary condition at the solid contact part of the upper surface of the supporting floor layer and the conjugate heat transfer layerTwo heat radiation boundary conditions of convection are set on the contact part of the conjugated heat transfer fluidThe lower surface is applied with natural convection boundary condition +.>
In the step 2, the equivalent heat exchange coefficient of each layer of the heat dissipation cold plate is calculated specifically as follows:
flow-solid surface equivalent heat exchange coefficient h f-s ：
By the third class of boundary condition definition formula containing the convective heat transfer coefficient, the expression of the flow-solid surface equivalent heat transfer coefficient as the following formula (1) can be obtained:
where ρ is the fluid density, μ is the hydrodynamic viscosity, k f Is the heat conductivity coefficient of the fluid, C p U is the specific heat capacity of the fluid ∞ Is the flow velocity x of the main flow area in the laminar flow state of the conjugate heat transfer layer fluid L Is the flow distance along the flow direction;
solid-solid surface equivalent heat exchange coefficient h s-s ：
And obtaining an expression of the flow-solid surface equivalent heat exchange coefficient as shown in the following formula (2) through a third class of boundary condition definition type comprising the convective heat exchange coefficient and solid-solid surface analysis thickness:
wherein delta s-s For analysis of thickness, k, of solid-solid surface s Is solid heat conductivity coefficient;
step 3: carrying out overall analysis on the model, comparing temperature distribution obtained by two times of analysis of each layer, ending the analysis if the temperature distribution error is within a limited range, otherwise, repeating the steps until the temperature of each layer reaches a steady state;
the step 3 is specifically as follows:
in the course of the analysis, the device-cap layer was first subjected to the thermal conductivity control equation:
wherein,for Hamiltonian, k s Is solid heat conductivity coefficient, T 1 For device-cover layer temperature distribution, H t For the layer height, q 12 Boundary conditions for heat dissipation of device-cap layer and conjugated heat transfer layer, comprising +.>And->q input To set the power density boundary condition, < >>Natural convection boundary conditions for the layer;
performing heat dissipation analysis to obtain the layer temperature distribution T 1 The method comprises the steps of carrying out a first treatment on the surface of the Next, the temperature distribution T in the device-cover layer is set 1 Through boundary condition q 12 Transferring to the conjugated heat transfer layer, and then performing conjugated heat transfer analysis on the conjugated heat transfer layer, wherein an analysis control equation is as follows:
wherein ρ is the fluid density, C p Is the specific heat capacity of the fluid, u is the fluid velocity field, k f Is the heat conductivity coefficient of the fluid, T 2 For the temperature distribution of the conjugated heat transfer layer H m For the layer height, q 21 Is the heat dissipation boundary condition of the conjugated heat transfer layer and the device-cover plate layer, and comprisesAndq 23 is the heat dissipation boundary condition of the conjugated heat transfer layer and the device-cover plate layer, comprising +.>And->
Obtaining the temperature distribution T of the conjugated heat transfer layer 2 Then, the analysis result of the layer is passed through the boundary condition q 21 And q 23 Transfer to the device-cover and floor layers; and then carrying out heat transfer analysis on the supporting floor layer, wherein the control equation is as follows:
wherein k is s Is solid heat conductivity coefficient, T 3 To support the temperature distribution of the floor layer, H b For the layer height, q 32 To support the heat dissipation boundary conditions of the floor layer and the conjugated heat transfer layer, comprisesAnd->Natural convection boundary conditions for this layer.
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