CN116773348B - Load testing device for semiconductor analysis - Google Patents
Load testing device for semiconductor analysis Download PDFInfo
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- CN116773348B CN116773348B CN202311081822.2A CN202311081822A CN116773348B CN 116773348 B CN116773348 B CN 116773348B CN 202311081822 A CN202311081822 A CN 202311081822A CN 116773348 B CN116773348 B CN 116773348B
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- 238000012360 testing method Methods 0.000 title claims abstract description 184
- 239000004065 semiconductor Substances 0.000 title claims abstract description 93
- 238000004458 analytical method Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 11
- 238000002474 experimental method Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 47
- 230000005540 biological transmission Effects 0.000 claims description 45
- 238000001514 detection method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 238000009863 impact test Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- 238000007789 sealing Methods 0.000 description 1
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Abstract
The present invention provides a load testing device for semiconductor analysis, comprising: the case comprises a main case body, a base, a connecting frame and two protection side plates; the two protection side plates are respectively arranged at two sides of the main box body, and a test cavity is formed among the two protection side plates, the main box body, the base and the connecting frame; the experiment platform comprises a sliding frame, an installation table and two groups of first elastic telescopic members, and the sliding frame is slidably installed on the base; the testing mechanism comprises a telescopic device, a load testing device and a testing rod; and the sliding frame is positioned between the two connecting mechanisms. According to the scheme, in the process of downward movement of the load testing device, automatic closing of the testing environment, movement of the semiconductor integrated circuit board to the testing position and automatic locking are synchronously realized, the safety of the load testing environment is improved, the operation steps are simplified, and the use of a user is facilitated.
Description
Technical Field
The invention relates to the technical field of semiconductor testing, in particular to a load testing device for semiconductor analysis.
Background
The load test of the semiconductor means: after the production of the semiconductor integrated circuit boards is completed, random sampling is required, and bending resistance and/or impact resistance of the semiconductor integrated circuit boards in the samples are tested to evaluate physical properties of the entire batch of semiconductor integrated circuit boards. The bending resistance test method comprises the following steps: detecting bending resistance of the circuit board by gradually applying pressure to the surface of the circuit board; the impact resistance test method comprises the following steps: the impact resistance of the circuit board is detected by an impact force rapidly applied to the surface of the circuit board.
In the related art, a semiconductor load testing apparatus is disclosed, which includes a table, a platen, a detection head, a driving device, and a moving device. The semiconductor integrated circuit board to be detected is installed in the installation groove of the workbench, the pressing plate is driven by the driving device to press down, the circuit board is fixed on the installation table, the detection head is controlled to shift through the moving device, so that the detection head moves to a test position aligned with the semiconductor integrated circuit board, and then load test is carried out.
According to the load testing device, on one hand, the semiconductor integrated circuit board adopts an open testing environment, waste scraps are easy to splash in the load testing process to influence the surrounding environment, and on the other hand, the driving device and the moving device are required to be started after the semiconductor integrated circuit board is mounted, so that testing preparation work can be completed, and the operation is inconvenient.
Accordingly, there is a need to provide a load testing device for semiconductor analysis to solve the above-mentioned technical problems.
Disclosure of Invention
The invention provides a load testing device for semiconductor analysis, which solves the technical problems of how to realize the alignment of the testing position of a semiconductor integrated circuit board and the automatic sealing of the testing environment in the related technology.
In order to solve the above technical problems, the load testing device for semiconductor analysis provided by the present invention includes:
the case comprises a main case body, a base, a connecting frame and two protection side plates, wherein the connecting frame is connected with the main case body and the base; the two protection side plates are respectively arranged at two sides of the main box body, and a test cavity is formed among the two protection side plates, the main box body, the base and the connecting frame;
the test device comprises an experiment platform, a test device and a test device, wherein the experiment platform comprises a sliding frame, an installation table and two groups of first elastic telescopic members, the sliding frame is slidably installed on the base, and one end of the sliding frame extends into the test cavity; the mounting table and the first elastic telescopic parts are fixedly arranged on the sliding frame, and the mounting table is positioned between the two groups of first elastic telescopic parts;
the testing mechanism comprises a telescopic device, a load testing device and a testing rod, wherein the main box body, the telescopic device, the load testing device and the testing rod are sequentially connected, and the testing rod is suspended above the testing cavity;
the sliding frame is positioned between the two connecting mechanisms;
the connecting mechanism comprises a transmission rod, a transmission shaft and a pressing device, wherein the transmission rod is obliquely arranged, two ends of the transmission rod are respectively hinged to the load testing device and the sliding frame, the transmission rod is fixedly provided with the transmission shaft, the pressing device is provided with a transmission hole, the transmission shaft is inserted into the transmission hole, and a group of first elastic telescopic parts elastically support a corresponding pressing device;
the extension direction of the transmission hole is consistent with the sliding direction of the sliding frame, and the telescopic device drives the load testing device to move downwards, so that the connection mechanism synchronously drives the pressing device to press downwards and the sliding frame completely slides into the testing cavity.
Preferably, a T-shaped rod is fixedly arranged at the bottom end of the load testing device, and the T-shaped rod is positioned in the testing cavity and is arranged at intervals with the testing rod; the transmission rod is hinged with the load testing device through the T-shaped rod.
Preferably, the load testing device comprises a mounting box, an elastic piece, a sliding piece and an impact device, wherein the elastic piece elastically supports the sliding piece in the mounting box, one end of the impact device is connected with the sliding piece, and the other end of the impact device penetrates through the bottom end of the mounting box and then is connected with the testing rod;
the telescopic device is located in the case, the top end of the telescopic device is fixedly connected with the case, the bottom end of the telescopic device penetrates through the top end of the mounting case and then is fixedly connected with the sliding piece, and the T-shaped rod is fixedly arranged at the bottom end of the mounting case.
Preferably, the load testing device for semiconductor analysis further includes a switch board, and the other end of the carriage is connected to the switch board.
Preferably, a groove is formed in the top of the mounting table.
Preferably, the pressing device comprises a supporting plate, a connecting plate and a pressing plate, wherein the supporting plate is fixedly arranged at the top of the first elastic expansion piece, the connecting plate is fixedly arranged on the supporting plate, and the pressing plate is arranged on the connecting plate;
the support plates are distributed in an L shape with the connecting plates, the transmission holes are formed in the support plates, and the pressing plates are aligned to the installation range of the installation table.
Preferably, the pressing device further comprises a second elastic telescopic piece, one end of the second elastic telescopic piece is embedded and installed at the bottom of the connecting plate, and the other end of the second elastic telescopic piece is fixedly connected with the pressing plate.
Preferably, the top of the mounting table is provided with a telescopic hole;
the connecting mechanism further comprises two alignment devices, the two alignment devices are distributed on two sides of the mounting table, and the alignment devices are arranged in one-to-one correspondence with the supporting plates;
the alignment device comprises a third elastic expansion piece and an alignment plate, and the alignment plate is slidably arranged on the mounting table through the expansion hole; two ends of the third elastic expansion piece are hinged with the corresponding supporting plate and the corresponding alignment plate respectively.
Preferably, a connecting sliding hole is formed in the case, a T-shaped sliding block is fixedly arranged at the bottom of the sliding frame, and the T-shaped sliding block penetrates through the connecting sliding hole to be in sliding connection with the case.
Compared with the related art, the load testing device for semiconductor analysis has the following beneficial effects:
the mounting table is used for loading the semiconductor integrated circuit board to be detected. The telescopic device drives the load testing device to wholly move downwards, the load testing device pushes the sliding frame and the mounting table to move through the transmission rod, and the mounting table drives the semiconductor integrated circuit board to completely enter the testing cavity.
On the one hand, after the semiconductor integrated circuit board enters the test cavity, the semiconductor integrated circuit board is aligned with the test rod and is positioned at a test position and is also positioned in a relatively closed test environment, so that waste generated in the process of load detection is prevented from splashing everywhere.
On the other hand, the transmission rod rotates and drives the transmission shaft to move downwards, and the pressing device automatically moves downwards and locks the semiconductor integrated circuit board on the mounting table, so that the stability of the semiconductor integrated circuit board in the testing process is ensured.
Finally, in the process of downwards moving the load testing device, the automatic closing of the testing environment, the movement of the semiconductor integrated circuit board to the testing position and the automatic locking are synchronously realized, the safety of the load testing environment is improved, the operation steps are simplified, and the use of a user is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a three-dimensional view of a preferred embodiment of a load testing apparatus for semiconductor analysis according to the present invention;
FIG. 2 is a three-dimensional view of the attachment mechanism shown in FIG. 1;
FIG. 3 is a cross-sectional view A-A as shown in FIG. 2;
FIG. 4 is a system block diagram of the testing mechanism shown in FIG. 2;
FIG. 5 is a cross-sectional view B-B as shown in FIG. 2;
FIG. 6 is a side view of the mounting table shown in FIG. 5;
FIG. 7 is a schematic diagram of a load testing device for semiconductor analysis according to the present invention, wherein (a 1) is a side view of a retracted state of a mounting box, (a 2) is a side view of a telescopic device driving the mounting box to move downward, (a 3) is a side view of a telescopic device driving a test lever to move downward, (b 1) is a front view of a cross section of the mounting box in the state of (a 1), (b 2) is a front view of a cross section of the mounting box in the state of (a 2), and (b 3) is a front view of a cross section of the mounting box in the state of (a 3);
fig. 8 is a schematic diagram of the automatic centering of the semiconductor integrated circuit board shown in fig. 7, wherein (c 1) is a sectional view of the mounting table in the state of (b 1), (c 2) is a sectional view of the mounting table in the state of (b 2), and (c 3) is a sectional view of the mounting table in the state of (b 3).
Reference numerals illustrate:
10. a semiconductor integrated circuit board;
1. a chassis; 11. a main case; 12. a connecting frame; 13. a base; 14. a protective side plate;
2. a testing mechanism; 21. a telescoping device; 22. a load testing device; 23. a test rod;
22a, T-bars;
3. a connecting mechanism; 31. a transmission rod; 32. a transmission shaft; 33. a compacting device; 330. a transmission hole;
4. an experiment platform; 41. a carriage; 42. a mounting table; 43. a first elastic expansion piece;
5. a switch board;
100. a test cavity;
24. a control box; 25. a display screen;
221. a mounting box; 222. an elastic member; 223. a slider; 224. an impact device;
331. a support plate; 332. a connecting plate; 334. a pressing plate;
333. a second elastic expansion piece;
35. an alignment device; 351. a third elastic expansion piece; 352. an alignment plate;
411. a T-shaped slider; 421. a telescopic hole.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a load testing device for semiconductor analysis.
Referring to fig. 1 to 3, in one embodiment of the invention, a load testing apparatus for semiconductor analysis includes:
the case 1, the case 1 includes a main case 11, a base 13, a connecting frame 12 and two protection side plates 14, the connecting frame 12 connects the main case 11 and the base 13; the two protection side plates 14 are respectively installed at two sides of the main box body 11, and a test cavity 100 is formed among the two protection side plates 14, the main box body 11, the base 13 and the connecting frame 12;
the experiment platform 4 comprises a sliding frame 41, a mounting table 42 and two groups of first elastic telescopic members 43, wherein the sliding frame 41 is slidably mounted on the base 13, and one end of the sliding frame 41 extends into the test cavity 100; the mounting table 42 and the first elastic telescopic members 43 are both fixedly arranged on the carriage 41, and the mounting table 42 is positioned between two groups of the first elastic telescopic members 43;
the testing mechanism 2 comprises a telescopic device 21, a load testing device 22 and a testing rod 23, wherein the main box 11, the telescopic device 21, the load testing device 22 and the testing rod 23 are sequentially connected, and the testing rod 23 is suspended above the testing cavity 100;
two connection mechanisms 3, the carriage 41 being located between the two connection mechanisms 3;
the connecting mechanism 3 comprises a transmission rod 31, a transmission shaft 32 and a pressing device 33, wherein the transmission rod 31 is obliquely arranged, two ends of the transmission rod 31 are respectively hinged to the load testing device 22 and the carriage 41, the transmission shaft 32 is fixedly arranged on the transmission rod 31, a transmission hole 330 is formed in the pressing device 33, the transmission shaft 32 is inserted into the transmission hole 330, and a group of first elastic telescopic pieces 43 elastically support a corresponding pressing device 33;
the extending direction of the driving hole 330 is consistent with the sliding direction of the carriage 41, and the connection mechanism 3 synchronously drives the pressing device 33 to press down and the carriage 41 to slide into the test cavity 100 completely in the process that the telescopic device 21 drives the load testing device 22 to move down.
In this embodiment, in each set of the first elastic expansion members 43, the number of the first elastic expansion members 43 may be two.
Referring to fig. 7, a mounting table 42 is used for loading the semiconductor integrated circuit board 10 to be inspected. The telescopic device 21 drives the load testing device 22 to move downwards as a whole, the load testing device 22 pushes the carriage 41 and the mounting table 42 to move through the transmission rod 31, and the mounting table 42 drives the semiconductor integrated circuit board 10 to completely enter the test cavity 100.
On the one hand, after the semiconductor integrated circuit board 10 enters the test cavity 100, the semiconductor integrated circuit board is aligned with the test rod 23, and is in a test position and is also in a relatively closed test environment, so that waste generated in the process of load detection is prevented from splashing everywhere.
On the other hand, the driving rod 31 rotates and drives the driving shaft 32 to move downwards, and the pressing device 33 automatically moves downwards and locks the semiconductor integrated circuit board 10 on the mounting table 42, so as to ensure the stability of the semiconductor integrated circuit board 10 in the testing process.
Finally, in the process of downward moving the load testing device 22, the automatic closing of the testing environment, the movement of the semiconductor integrated circuit board 10 to the testing position and the automatic locking are synchronously realized, the safety of the load testing environment is improved, the operation steps are simplified, and the use of a user is convenient.
Referring to fig. 2 and fig. 4 in combination, in this embodiment, a control box 24 is embedded on the chassis 1, and the control box 24 is connected with an external socket through a plug to provide energy support for operation of the device.
The display screen 25 is installed on the case 1. The display screen 25 may be a touch screen, so as to meet the use requirements of the device for controlling and operating.
The control box 24 is internally provided with a processor, and the processor is in signal connection with the display screen 25 and the test rod 23.
After the semiconductor integrated circuit board 10 enters the test cavity 100, the test bar 23 may descend again to move toward the semiconductor integrated circuit board 10.
The test lever 23 is used to apply a force to the semiconductor integrated circuit board 10 and detect a pressure signal associated with the force.
The processor is used for receiving the pressure signal in real time and converting the pressure signal into pressure data.
The display screen 25 is used for receiving the pressure data and displaying the pressure data in real time.
Specifically, when the test lever 23 comes into contact with the semiconductor integrated circuit board 10, the test lever 23 starts to detect a pressure signal; the pressure signal is processed by the processor and then transmitted to the display screen 25, and the display screen 25 displays pressure data (load data) born by the semiconductor integrated circuit board 10 in real time, so as to collect data required by the bending resistance test, and facilitate recording and analysis of the data required by the test.
Referring to fig. 2 again, in the present embodiment, a T-shaped rod 22a is fixedly arranged at the bottom end of the load testing device 22, and the T-shaped rod 22a is located in the testing cavity 100 and is spaced from the testing rod 23; the transmission rod 31 is hinged with the load testing device 22 through the T-shaped rod 22 a.
In other embodiments, the drive rod 31 is directly hinged to the load testing device 22.
Referring to fig. 3 and 4 again, the load testing device 22 includes a mounting box 221, an elastic member 222, a sliding member 223, and an impact device 224, wherein the elastic member 222 elastically supports the sliding member 223 in the mounting box 221, one end of the impact device 224 is connected with the sliding member 223, and the other end of the impact device 224 penetrates through the bottom end of the mounting box 221 and then is connected with the test rod 23;
the telescopic device 21 is located in the chassis 1, the top end of the telescopic device 21 is fixedly connected with the chassis 1, the bottom end of the telescopic device 21 passes through the top end of the mounting box 221 and is fixedly connected with the sliding piece 223, and the T-shaped rod 22a is fixedly arranged at the bottom end of the mounting box 221.
The chassis 1 is provided with a chute structure, and the mounting box 221 is slidably mounted in the chute structure.
Referring to fig. 7, after the semiconductor integrated circuit board 10 enters the test cavity 100, it is aligned with the test stem 23. At this time, one end of the carriage 41 abuts against the link 12.
In this embodiment, the load testing device 22 includes two testing modes:
1. alternating stress test mode of operation: the telescopic device 21 moves down and drives the semiconductor integrated circuit board 10 into the test cavity 100. The telescopic device 21 is also used for exerting a pressing force on the semiconductor integrated circuit board 10; wherein the pressing force is gradually increased pressure;
specifically, in this working mode, after the semiconductor integrated circuit board 10 enters the test cavity 100, the telescopic device 21 drives the load testing device 22 to move down continuously, and at this time, since one end of the carriage 41 abuts against the connecting frame 12, the carriage 41 cannot move continuously; furthermore, the transmission rod 31 and the pressing device 33 remain stationary;
the telescopic device 21 can only drive the sliding member 223 to move downwards and drive the semiconductor integrated circuit board 10 into the test cavity 100. The slider 223 drives the test lever 23 downward by the impact device 224 and presses the top of the semiconductor integrated circuit board 10.
The alternating stress test mode of operation is used for bending resistance testing of the semiconductor integrated circuit board 10.
2. Impact stress test mode of operation: the telescopic device 21 moves down and drives the semiconductor integrated circuit board 10 into the test cavity 100. The impact device 224 is used for applying a force to the semiconductor integrated circuit board 10; wherein the pressing force is an impact force in a short time.
Specifically, in this operation mode, after the semiconductor integrated circuit board 10 enters the test cavity 100, the carriage 41 abuts against the connection frame 12, the impact device 224 is started, and after the impact device 224 drives the test rod 23 to move down, the transmission rod 31 and the pressing device 33 remain stationary as the telescopic device 21 remains stationary;
the telescopic device 21 is closed, the impact device 224 can only drive the test rod 23 to move downwards and press the top of the semiconductor integrated circuit board 10;
the impact stress test mode of operation is used for impact testing of the semiconductor integrated circuit board 10.
By two working modes, the telescopic device 21 can control the whole downward movement of the mounting box 221 and the independent downward movement of the test rod 23; automatic detection is realized after the semiconductor integrated circuit board 10 is conveyed to the lower part of the test bar 23.
Referring again to fig. 1, the load testing apparatus for semiconductor analysis further includes a switch board 5, and the other end of the carriage 41 is connected to the switch board 5. When the carriage 41 is slid completely into the test cavity 100, the switch plate 5 covers the test cavity 100.
The switch board 5 is provided to completely close the test cavity 100 after the carriage 41 enters the test cavity 100, so that the semiconductor integrated circuit board 10 is in a completely closed test environment.
Preferably, the switch board 5 may be a transparent structure. The transparent switch board 5 facilitates observation of the state of the semiconductor integrated circuit board 10 during inspection.
Referring again to fig. 3, as a preferred mode of the present embodiment, the top of the mounting table 42 is provided with a groove to facilitate the mounting of the semiconductor integrated circuit board 10 and to provide space for the bending or breaking of the semiconductor integrated circuit board 10 under stress during the load test.
Referring to fig. 5 and 6 in combination, the pressing device 33 includes a support plate 331, a connecting plate 332, and a pressing plate 334, wherein the support plate 331 is fixedly arranged on top of the first elastic expansion member 43, the connecting plate 332 is fixedly arranged on the support plate 331, and the pressing plate 334 is mounted on the connecting plate 332;
the support plate 331 and the connecting plate 332 are distributed in an L shape, the transmission hole 330 is formed in the support plate 331, and the pressing plate 334 is aligned to the installation range of the installation platform 42.
When the support plate 331 moves downward, the connecting plate 332 synchronously drives the pressing plate 334 to move downward and can automatically press and lock the semiconductor integrated circuit board 10 mounted above the mounting table 42.
Referring again to fig. 6, as a preferred mode of this embodiment, the width of the connecting plate 332 is one third of the width of the supporting plate 331. So that a space for mounting or dismounting the semiconductor integrated circuit board 10 is reserved between the switch board 5 and the connection board 332.
Referring to fig. 5 again, the pressing device 33 further includes a second elastic expansion member 333, one end of the second elastic expansion member 333 is embedded and mounted at the bottom of the connecting plate 332, and the other end of the second elastic expansion member 333 is fixedly connected with the pressing plate 334.
The second elastic telescopic member 333 provides buffering support for the pressing locking of the pressing plate 334, so as to avoid the damage of the semiconductor integrated circuit board 10 caused by rigid extrusion.
Referring to fig. 2 and fig. 5 in combination, a telescopic hole 421 is formed at the top of the mounting table 42;
the connecting mechanism 3 further comprises two alignment devices 35, the two alignment devices 35 are distributed on two sides of the mounting table 42, and the alignment devices 35 are arranged in one-to-one correspondence with the support plates 331;
the alignment device 35 includes a third elastic expansion member 351 and an alignment plate 352, and the alignment plate 352 is slidably mounted on the mounting table 42 through the expansion hole 421; both ends of the third elastic telescopic member 351 are hinged to the corresponding support plate 331 and the corresponding alignment plate 352.
Referring to fig. 8, in the process of downward movement adjustment of the support plate 331, the two third elastic telescopic members 351 push the corresponding alignment plates 352 to move, so that the two alignment plates 352 approach each other, and the mounted semiconductor integrated circuit board 10 is automatically centered along the moving direction perpendicular to the carriage 41.
Namely, the automatic centering of the semiconductor integrated circuit board 10 is achieved in the process that the support plate 331 drives the second elastic telescopic 333 and the pressing plate 334 to press down.
Referring to fig. 3, the chassis 1 is provided with a connection sliding hole, a T-shaped slider 411 is fixedly disposed at the bottom of the carriage 41, and the T-shaped slider 411 passes through the connection sliding hole to be slidably connected with the chassis 1.
The T-shaped slider 411 provides support and limit for the sliding adjustment of the carriage 41, maintaining the stability of the horizontal movement adjustment of the carriage 41.
The working principle of the load testing device for semiconductor analysis provided by the invention is as follows:
before the equipment is used, the semiconductor integrated circuit board 10 needing load test is mounted in a groove above the mounting table 42 and is supported above the mounting table 42;
referring to fig. 7 (a 1) and (b 1) and fig. 8 (c 1), the mounting box 221 is in a retracted state, the test lever 23 is in a retracted state, the carriage 41 is in an extended state, and the switch board 5 is in an open state when in an initial state;
as shown in fig. 7 (a 1) to (a 2), when the semiconductor integrated circuit board 10 is mounted on the top of the mounting table 42, the telescopic device 21 is started, and the telescopic device 21 drives the mounting box 221 and the test bar 23 to move downward integrally for approaching the semiconductor integrated circuit board 10;
in the process of moving down the mounting box 221, the T-bar 22a pushes the carriage 41 to move right (the direction of (a 2) shown in fig. 7) through the transmission bar 31, and the switch board 5 moves right, so that the semiconductor integrated circuit board 10 is aligned directly under the test bar 23 and the switch board 5 is closed, thereby closing the test range and reducing the interference of the test to the outside;
referring to fig. 7 (a 1) to (a 2), (b 1) to (b 2), and fig. 8 (c 1) to (c 2), the driving rod 31 rotates counterclockwise around the carriage 41, the driving rod 31 drives the driving shaft 32 to rotate and move downwards, the driving shaft 32 drives the supporting plate 331 to move downwards through the driving hole 330, and the connecting plate 332 drives the second elastic telescopic 333 and the pressing plate 334 to move downwards synchronously and press against the semiconductor integrated circuit board 10 for automatic locking during the moving process of the semiconductor integrated circuit board 10;
in the process of moving down the support plate 331, the third elastic telescopic member 351 moves down and pushes the alignment plates 352 to move towards the semiconductor integrated circuit board 10, and when the two alignment plates 352 are relatively close, the two alignment plates abut against the semiconductor integrated circuit board 10 for automatic centering adjustment before locking the semiconductor integrated circuit board 10;
wherein, the third elastic telescopic member 351 is in an extended state when the alignment plate 352 is abutted against the semiconductor integrated circuit board 10, and the pressing plate 334 is in no contact with the semiconductor integrated circuit board 10;
as shown in fig. 7 (a 2), (b 2) and fig. 8 (c 2), the mounting box 221 is in an extended state, the test lever 23 is in a retracted state, and the carriage 41 is in a retracted state;
referring to fig. 7 (a 2) to (a 3) and (b 2) to (b 3), when the telescopic device 21 continues to extend, the carriage 41 abuts against the chassis 1, the mounting box 221 is kept stationary, the sliding member 223 compresses the elastic member 222 and drives the impact device 224 to move downward, and the test bar 23 moves downward and abuts against the top of the semiconductor integrated circuit board 10, so as to provide support for the pressure test.
As shown in fig. 7 (a 3), (b 3), and fig. 8 (c 3), the mounting box 221 is in an extended state, the test lever 23 is in an extended state (with respect to the mounting box 221), and the carriage 41 is in a contracted state.
Similarly, after the testing of the semiconductor integrated circuit board 10 is completed, the telescopic device 21 is started, the telescopic device 21 drives the testing rod 23 to retract into the mounting box 221, and drives the mounting box 221 to move upwards and reset integrally, the carriage 41 moves leftwards and drives the switch board 5 to open automatically in the process of moving upwards and resetting the mounting box 221, and the pressing plate 334 contacts automatically, so that the semiconductor integrated circuit board 10 can be removed after the testing.
Principle of alternating stress test: when the test bar 23 starts to contact with the semiconductor integrated circuit board 10, the test bar 23 applies pressure to the top of the semiconductor integrated circuit board 10, and simultaneously, the test bar 23 detects the applied pressure data in real time, and when the pressure is continuously increased and reaches the maximum load of the semiconductor integrated circuit board 10, the semiconductor integrated circuit board 10 breaks, the test bar 23 instantaneously loses the pressure contact with the semiconductor integrated circuit board 10, the telescopic device 21 is closed, the pressure detected by the test bar 23 instantaneously reduces, and the pressure tested by the maximum load is the maximum pressure value displayed by the display screen 25 (with a recording function) in the detection process;
impact force testing principle: after the semiconductor integrated circuit board 10 completely enters the test cavity 100, the impact device 224 is started, and the impact test is performed on the semiconductor integrated circuit board 10 through the test rod 23 quickly (wherein, in the process of the impact test, the test rod 23 sets the impact pressure in advance, and when the pressure value reaches the preset pressure, the impact device 224 stops stretching and automatically shrinking, and the impact test can be single impact or multiple continuous impacts).
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the specification and drawings of the present invention or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (1)
1. A load testing apparatus for semiconductor analysis, comprising:
the case comprises a main case body, a base, a connecting frame and two protection side plates, wherein the connecting frame is connected with the main case body and the base; the two protection side plates are respectively arranged at two sides of the main box body, and a test cavity is formed among the two protection side plates, the main box body, the base and the connecting frame;
the test device comprises an experiment platform, a test device and a test device, wherein the experiment platform comprises a sliding frame, an installation table and two groups of first elastic telescopic members, the sliding frame is slidably installed on the base, and one end of the sliding frame extends into the test cavity; the mounting table and the first elastic telescopic parts are fixedly arranged on the sliding frame, and the mounting table is positioned between the two groups of first elastic telescopic parts;
the testing mechanism comprises a telescopic device, a load testing device and a testing rod, wherein the main box body, the telescopic device, the load testing device and the testing rod are sequentially connected, and the testing rod is suspended above the testing cavity;
the sliding frame is positioned between the two connecting mechanisms;
the connecting mechanism comprises a transmission rod, a transmission shaft and a pressing device, wherein the transmission rod is obliquely arranged, two ends of the transmission rod are respectively hinged to the load testing device and the sliding frame, the transmission rod is fixedly provided with the transmission shaft, the pressing device is provided with a transmission hole, the transmission shaft is inserted into the transmission hole, and a group of first elastic telescopic parts elastically support a corresponding pressing device;
the extension direction of the transmission hole is consistent with the sliding direction of the sliding frame, and the connecting mechanism synchronously drives the pressing device to press down and the sliding frame completely slides into the testing cavity in the process that the telescopic device drives the load testing device to move down;
the bottom end of the load testing device is fixedly provided with a T-shaped rod, and the T-shaped rod is positioned in the testing cavity and is arranged at intervals with the testing rod; the transmission rod is hinged with the load testing device through the T-shaped rod;
the load testing device comprises a mounting box, an elastic piece, a sliding piece and an impact device, wherein the elastic piece elastically supports the sliding piece in the mounting box, one end of the impact device is connected with the sliding piece, and the other end of the impact device penetrates through the bottom end of the mounting box and then is connected with the testing rod;
the telescopic device is positioned in the case, the top end of the telescopic device is fixedly connected with the case, the bottom end of the telescopic device penetrates through the top end of the mounting case and then is fixedly connected with the sliding piece, and the T-shaped rod is fixedly arranged at the bottom end of the mounting case;
the load testing device for semiconductor analysis further comprises a switch board, and the other end of the sliding frame is connected with the switch board;
the top of the mounting table is provided with a groove;
the pressing device comprises a supporting plate, a connecting plate and a pressing plate, wherein the supporting plate is fixedly arranged at the top of the first elastic expansion piece, the connecting plate is fixedly arranged on the supporting plate, and the pressing plate is arranged on the connecting plate;
the support plates and the connecting plates are distributed in an L shape, the transmission holes are formed in the support plates, and the pressing plates are aligned to the installation range of the installation table;
the pressing device further comprises a second elastic expansion piece, one end of the second elastic expansion piece is embedded and installed at the bottom of the connecting plate, and the other end of the second elastic expansion piece is fixedly connected with the pressing plate;
the top of the mounting table is provided with a telescopic hole;
the connecting mechanism further comprises two alignment devices, the two alignment devices are distributed on two sides of the mounting table, and the alignment devices are arranged in one-to-one correspondence with the supporting plates;
the alignment device comprises a third elastic expansion piece and an alignment plate, and the alignment plate is slidably arranged on the mounting table through the expansion hole; two ends of the third elastic telescopic piece are hinged with the corresponding supporting plate and the corresponding alignment plate respectively;
the machine case is provided with a connecting sliding hole, a T-shaped sliding block is fixedly arranged at the bottom of the sliding frame, and the T-shaped sliding block penetrates through the connecting sliding hole to be in sliding connection with the machine case.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311081822.2A CN116773348B (en) | 2023-08-25 | 2023-08-25 | Load testing device for semiconductor analysis |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311081822.2A CN116773348B (en) | 2023-08-25 | 2023-08-25 | Load testing device for semiconductor analysis |
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| CN116773348A CN116773348A (en) | 2023-09-19 |
| CN116773348B true CN116773348B (en) | 2023-11-07 |
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| CN116773348A (en) | 2023-09-19 |
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