CN116773203A - Filling and sealing method for small telemetry transmitter - Google Patents

Filling and sealing method for small telemetry transmitter Download PDF

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Publication number
CN116773203A
CN116773203A CN202310675483.4A CN202310675483A CN116773203A CN 116773203 A CN116773203 A CN 116773203A CN 202310675483 A CN202310675483 A CN 202310675483A CN 116773203 A CN116773203 A CN 116773203A
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China
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transmitter
potting
glue
encapsulating
shell
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CN202310675483.4A
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Chinese (zh)
Inventor
李仙丽
陆云辉
郁兆年
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Sichuan Tianli Technology Co ltd
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Sichuan Tianli Technology Co ltd
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Priority to CN202310675483.4A priority Critical patent/CN116773203A/en
Publication of CN116773203A publication Critical patent/CN116773203A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a potting method of a small telemetry transmitter, which comprises the following steps: the encapsulating device is installed, a small-sized telemetering transmitter encapsulating device is built, and telemetering transmitter components are installed in the encapsulating device; air tightness checking, namely performing tightness checking through a joint; vacuum filling and sealing, namely, using a vacuum pump to pump air in a telemetering transmitter assembly through a gas path nozzle to form negative pressure, simultaneously injecting insulating heat dissipation pouring sealant through a glue injector at a certain speed, stopping glue injection and vacuum pumping after full filling, taking down a glue injection pipeline, and using a plug to plug the glue injection nozzle; after the potting, the insulating heat dissipation pouring sealant is solidified according to the characteristics of the insulating heat dissipation pouring sealant after vacuum potting; and (3) dismantling the encapsulating device, taking and dismantling the encapsulating device of the telemetering transmitter, so that the device is separated and the encapsulated transmitter assembly is taken out. The invention solves the problems of stability and insulation heat dissipation of the telemetering transmitter in a narrow space in an engine.

Description

Filling and sealing method for small telemetry transmitter
Technical Field
The invention belongs to the technical field of telemetry transmitters, and particularly relates to a small telemetry transmitter encapsulating method.
Background
The measurement of engine rotor parameters is a key technology and bottleneck of engine test, and extends through the whole process of engine structural strength test and performance test. Structural strength assessment, service life assessment, performance test and safety monitoring in the engine test all need to reliably measure dynamic strain parameters of the rotating member. The remote measuring system is used as a rotary member parameter acquisition and transmission device and has the advantages of flexible installation, long service life, small volume, multiple channels, light weight and the like.
The telemetering transmitter is an important component of a telemetering system, is arranged on an engine optional component, needs to adapt to a narrow installation space, and needs to bear severe working conditions of the engine such as high rotating speed, high centrifugal force, vibration and the like. The core of the transmitter is a circuit board and electronic components, and the transmitter has the advantages of miniaturization, weight saving, narrow gap between components and reliable insulation and heat dissipation. However, there is currently no reliable means to solve this problem.
Disclosure of Invention
In order to solve the problems, the invention provides a small-sized telemetering transmitter encapsulating method which can realize the encapsulating in a narrow space and solve the problems of stability and insulation heat dissipation of the telemetering transmitter in the narrow space of an engine.
In order to achieve the above purpose, the invention adopts the following technical scheme: a method for potting a small telemetry transmitter, comprising the steps of:
s10, mounting a potting device, constructing a small telemetry transmitter potting device, and mounting telemetry transmitter components therein; a miniature telemetry transmitter potting apparatus comprising: the encapsulating shell is of a hollow cavity structure and is used for accommodating the telemetering transmitter assembly, and two ends of the encapsulating shell are open; the potting top plate is arranged at the top of the potting shell; the encapsulating bottom plate is arranged at the bottom of the encapsulating shell; the glue injection nozzle is arranged on the potting top plate and is connected with the glue injector through a pipeline and used for injecting glue; the air passage nozzle is arranged on the potting top plate and is connected with a vacuum pressurizing pump through a pipeline for vacuumizing and exhausting or pressurizing inwards; the telemetering transmitter assembly comprises a transmitter shell and a telemetering transmitter arranged on the transmitter shell, wherein the top of the transmitter shell is provided with a small hole corresponding to the injection joint and the air path joint, the bottom opening of the transmitter shell is provided with an interface board, and the transmitter shell is pressed in the potting shell by a potting bottom plate under the transmitter shell and the interface board;
s20, checking air tightness, and checking tightness through a joint;
s30, vacuum filling and sealing, namely, using a vacuum pump to pump air in a telemetering transmitter assembly through a gas path nozzle to form negative pressure, simultaneously injecting insulating heat dissipation pouring sealant through a glue injector at a certain speed, stopping glue injection and vacuum pumping after full filling, taking down a glue injection pipeline, and using a plug to plug the glue injection nozzle;
s40, after-potting treatment, solidifying the insulating heat-dissipation pouring sealant according to the characteristics of the insulating heat-dissipation pouring sealant after vacuum potting;
s50, the encapsulating device is removed, the telemetering transmitter encapsulating device is taken and disassembled, and the device is separated, and the encapsulated transmitter assembly is taken out.
Further, when the filling and sealing device is installed, the filling and sealing top plate and the filling and sealing shell are fixedly connected through connecting screws; the surface of the telemetering transmitter module with the filling and sealing reserved small hole is upwards filled into the filling and sealing shell, and then the filling and sealing bottom plate compresses the telemetering transmitter in the cavity through the compression screw.
Further, when the air tightness is checked, one nozzle is selected, the injection glue nozzle or the gas path nozzle is connected, the vacuum pump is connected for vacuumizing check, and the other nozzle is blocked by a plug;
when the vacuumizing energy is maintained at-85 kpa +/-5%, the sealing performance is considered to be good, and the next potting work can be performed;
if the negative pressure cannot be pumped or the negative pressure cannot be maintained, checking whether a gasket or an O-shaped sealing ring of the joint is placed at a correct position, screwing threads, vacuumizing again after checking, and performing next filling and sealing work after checking is qualified.
Further, when vacuum filling and sealing is carried out, a vacuum mode of a pump is started, air in the telemetering transmitter assembly is pumped to form negative pressure, and when the pressure reaches-85 kpa, the glue injector is started.
Further, a transparent glue collector is arranged on a pipeline from the gas path nozzle to the glue injector;
injecting insulating heat dissipation pouring sealant into the transparent glue collector by the glue injector at a certain speed when vacuum pouring is carried out, fully filling, and stopping injecting the glue and stopping vacuumizing when the insulating heat dissipation pouring sealant overflows into the transparent glue collector from the gas path nozzle and reaches a certain height;
and then a pipeline at the upper end of the transparent glue collecting container is switched with a pressurizing pump, pressure is applied to the direction of the transparent glue collecting container, and the insulating heat dissipation pouring sealant in the transparent glue collecting container can partially flow back into the shell of the transmitter under the action of the pressure to fill the shrinkage gap, so that the shrinkage gap formed in the insulating heat dissipation pouring sealant gelation and solidification process is avoided, and the filling is compact.
Further, the pump was set to a pressurized mode, and the pressure was set to 150kPa to maintain the pressure.
Further, when the post-pouring treatment is performed, the pouring device is required to be stood for a plurality of hours according to the characteristics of the selected insulating heat dissipation pouring sealant after vacuum pouring, and the corresponding drying temperature is selected for drying, so that the completely dried pouring device is ensured.
The beneficial effect of adopting this technical scheme is:
according to the small-sized telemetering transmitter encapsulating device, the high-performance insulating heat-dissipating material is injected into the telemetering transmitter shell through the encapsulating device, after the telemetering transmitter shell is solidified, the telemetering transmitter shell can be effectively insulated, and meanwhile, the electronic components are supported and fixed, so that the device has higher integrity, and the vibration resistance and impact resistance are improved.
Meanwhile, the weight of the cured encapsulating material is far smaller than that of the metal radiator, so that the weight of an electronic instrument is effectively reduced, and the cured encapsulating material also has the functions of water resistance and moisture resistance.
Drawings
FIG. 1 is a schematic flow chart of a method for encapsulating a small telemetry transmitter according to the present invention;
fig. 2 is a schematic structural diagram of a small-sized telemetry transmitter encapsulating device according to an embodiment of the invention.
FIG. 3 is a longitudinal cross-sectional view of a potting apparatus and a transmitter assembly according to an embodiment of the invention;
FIG. 4 is a transverse cross-sectional view of a potting apparatus and a transmitter assembly according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a transmitter assembly according to an embodiment of the present invention;
wherein 1 is the embedment casing, 2 is the embedment roof, 3 is the embedment bottom plate, 4 is the injection joint mouth, 5 is the gas circuit mouth, 6 is the vacuum force pump, 7 is the injecting glue ware, 8 is the transmitter casing, 9 is the aperture, 10 is transparent album of glue ware, 11 is connecting screw, 12 is the hold-down screw, 13 is the circuit board, 14 is the embedment glue.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent.
In a specific embodiment, the present invention takes a certain type of wireless telemetry transmitter assembly as an example, as shown in fig. 5, and its external dimensions are as follows: 44mm x 23mm x 48.6mm, in actual use, install the polylith on the rotor spare of high-speed rotation after according to data acquisition group number behind the polylith, be used for rotor spare strain, the collection of measurement parameters such as temperature, pressure and the like and pass through wireless form with information transmission to the receiving terminal of installing in stator spare, because the transmitter unit is integrated with on the rotor, the quality of a plurality of modules that use in groups, the focus all has strict requirements, the encapsulation quality requirement is extremely high, if the encapsulation has internal defect, the encapsulation is incomplete, bubble, space etc. exist, can cause each quality inconsistent, theoretical gyration center takes place the skew when using in groups, dynamic unbalance exceeds standard, the circumstances such as rotor spare abnormal vibration take place, in addition the encapsulation is insufficient will cause the inside components of transmitter to receive centrifugal force influence and take place deformation or drop when rotating at high speed, cause inside damage or contact failure, finally lead to data transmission packet loss rate exceeds standard. As shown in fig. 4, the telemetry transmitter includes a plurality of layers of longitudinally disposed circuit boards 13, with the circuit boards 13 wired to sockets provided on an interface board disposed at the bottom of the transmitter housing 8.
According to the maximum external dimension of the telemetering transmitter assembly, the potting shell 1 and the transmitter shell 8 are matched by adopting small clearance tolerance of H8/f9 in the transverse direction, so that the transmitter shell 8 is ensured not to shake in the potting shell 1, and the consistency of the vacuumizing speed and the glue injection speed is better matched because the internal clearance of the inner mould of the transmitter is smaller and the glue amount to be injected is not large. The threaded connector in the connector assembly adopts a standard 1.6mm pipe diameter as a vacuumizing port and a glue injection port, one of the connectors is used as the glue injection port when the connector is used, a standard 1.6mm nylon hose is used as a pipeline, one end of the pipeline is connected with the glue injector 7, and the other end of the pipeline is connected with the glue injection port; the other nozzle is connected with the transparent glue collector 10 through a nylon hose with the diameter of 1.6mm and then connected with a pressurizing/vacuum pump.
In this embodiment, referring to fig. 1, the invention provides a method for encapsulating a small telemetry transmitter, which includes the steps of:
s10, mounting a potting device, constructing a small telemetry transmitter potting device, and mounting telemetry transmitter components therein; as shown in fig. 2 and 3, a small telemetry transmitter potting apparatus comprising: the encapsulation shell 1 is of a hollow cavity structure and is used for accommodating a telemetry transmitter assembly, and two ends of the encapsulation shell are open; a potting top plate 2 arranged at the top of the potting shell 1; the potting bottom plate 3 is arranged at the bottom of the potting shell 1; the glue injection nozzle 4 is arranged on the potting top plate 2 and is connected with the glue injector 7 through a pipeline for injecting glue; the air passage nozzle 5 is arranged on the potting top plate 2 and is connected with the vacuum pressurizing pump 6 through a pipeline for vacuumizing and exhausting or pressurizing inwards; the telemetering transmitter assembly comprises a transmitter shell 8 and a telemetering transmitter arranged on the transmitter shell 8, wherein the top of the transmitter shell 8 is provided with a small hole 9 corresponding to the injection joint mouth 4 and the gas joint mouth 5, an interface board is arranged at the opening of the bottom of the transmitter shell 8, and the transmitter shell 8 is pressed in the potting shell 1 by using the potting bottom plate 3 under the bottom of the transmitter shell 8 and the interface board;
s20, checking air tightness, and checking tightness through a joint;
s30, vacuum filling and sealing, namely, using a vacuum pump to pump air in a telemetering transmitter assembly through the air channel connector 5 to form negative pressure, simultaneously injecting insulating heat dissipation pouring sealant 14 through the glue injector 7 at a certain speed, stopping glue injection and vacuum pumping after full filling, taking down a glue injection pipeline, and using a plug to plug the glue injection connector 4;
s40, after-potting treatment, solidifying the insulating heat dissipation pouring sealant 14 according to the characteristics of the insulating heat dissipation pouring sealant after vacuum potting;
s50, the encapsulating device is removed, the telemetering transmitter encapsulating device is taken and disassembled, and the device is separated, and the encapsulated transmitter assembly is taken out.
As an optimization scheme of the embodiment, when the potting device is installed, the potting top plate 2 and the potting shell 1 are fixedly connected through the connecting screw 11; the surface of the telemetering transmitter module with the filling and sealing reserved small hole 9 is upwards filled into the filling and sealing shell 1, and then the filling and sealing bottom plate 3 compresses the telemetering transmitter in the cavity through the compression screw 12. The aperture 9 may be designed to be phi 1.8mm.
As an optimization scheme of the embodiment, when the air tightness is checked, one nozzle is selected, the injection glue nozzle 4 or the air passage nozzle 5 is connected with a vacuum pump for vacuumizing check, and the other nozzle is blocked by a plug;
when the vacuumizing energy is maintained at-85 kpa +/-5%, the sealing performance is considered to be good, and the next potting work can be performed;
if the negative pressure cannot be pumped or the negative pressure cannot be maintained, checking whether a gasket or an O-shaped sealing ring of the joint is placed at a correct position, screwing threads, vacuumizing again after checking, and performing next filling and sealing work after checking is qualified.
As an optimization scheme of the embodiment, when vacuum filling and sealing is carried out, a vacuum mode of a pump is started, air in a telemetering transmitter assembly is extracted to form negative pressure, and when the pressure reaches-85 kpa, the glue injector 7 is started.
A transparent glue collector 10 is arranged on a pipeline from the air passage nozzle 5 to the glue injector 7;
when vacuum filling and sealing are carried out, the insulating heat dissipation pouring sealant 14 is injected into the glue injector 7 at a certain speed, so that the insulating heat dissipation pouring sealant 14 is fully filled, and when the insulating heat dissipation pouring sealant 14 overflows into the transparent glue collector 10 from the air passage nozzle 5 and reaches a certain height, glue injection and vacuum pumping are stopped;
and switching a pressurizing pump on a pipeline at the upper end of the transparent glue collecting container, regulating the pump to a pressurizing mode, and setting the pressure to 150kPa to maintain the pressure. And pressure is applied to the direction of the transparent adhesive collecting container, and the insulating heat dissipation pouring sealant 14 in the transparent adhesive collecting container can partially flow back into the transmitter shell 8 under the action of the pressure to fill the shrinkage gap, so that the shrinkage gap formed in the solidification process of the insulating heat dissipation pouring sealant 14 is avoided, and the filling is compact.
As an optimization scheme of the above embodiment, when the post-potting treatment is performed, the potting device needs to be kept stand for several hours according to the characteristics of the insulating heat dissipation potting adhesive 14 after vacuum potting, and the corresponding drying temperature is selected for drying, so that the completely dried potting device is ensured.
After the transparent glue collector 10 is completely solidified, the plugs are removed, the compression screw 12 and the connection screw 11 are disassembled, the encapsulated transmitter assembly is separated and taken out, after the encapsulation operation, a plurality of groups of encapsulated transmitter modules are weighed, the actual mass is identical with the theoretical mass, so that no glue sealing defect exists in the inside, the density is consistent, no interlayer, bubbles and the like are generated, the transparent glue collector 10 is uniformly arranged in a high-speed rotor for use, the dynamic balance test is carried out, the unbalance amount caused by encapsulated equipment is very small, the requirement of the unbalance amount can be met without the operation of matching the encapsulated transmitter modules with weights and the like, and the encapsulation is thoroughly and uniformly improved, the anti-vibration and anti-shrinkage defect is avoided, the possibility of water vapor entering is reduced, and the moisture resistance and the insulation performance of the equipment are greatly improved.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. A method for potting a small telemetry transmitter, comprising the steps of:
s10, mounting a potting device, constructing a small telemetry transmitter potting device, and mounting telemetry transmitter components therein; a miniature telemetry transmitter potting apparatus comprising: the encapsulating shell (1) is of a hollow cavity structure and is used for accommodating a telemetry transmitter assembly, and two ends of the telemetry transmitter assembly are open; the potting top plate (2) is arranged at the top of the potting shell (1); the encapsulating bottom plate (3) is arranged at the bottom of the encapsulating shell (1); the glue injection nozzle (4) is arranged on the potting top plate (2) and is connected with the glue injector (7) through a pipeline for injecting glue; the air passage nozzle (5) is arranged on the potting top plate (2) and is connected with the vacuum pressurizing pump (6) through a pipeline for vacuumizing and exhausting or pressurizing inwards; the telemetering transmitter assembly comprises a transmitter shell (8) and a telemetering transmitter arranged on the transmitter shell (8), wherein a small hole (9) corresponding to the glue injection joint mouth (4) and the gas path joint mouth (5) is arranged at the top of the transmitter shell (8), an interface board is arranged at the opening at the bottom of the transmitter shell (8), and the transmitter shell (8) is pressed in the potting shell (1) by utilizing a potting bottom plate (3) under the bottom of the transmitter shell (8) and the interface board;
s20, checking air tightness, and checking tightness through a joint;
s30, vacuum filling and sealing, namely, pumping air in a telemetering transmitter assembly by a gas path joint nozzle (5) by using a vacuum pump to form negative pressure, and simultaneously injecting insulating heat dissipation pouring sealant (14) by a glue injector (7) at a certain speed, stopping glue injection after full filling, stopping vacuumizing, taking down a glue injection pipeline and blocking the glue injection joint nozzle (4) by using a plug;
s40, after-potting treatment, solidifying the insulating heat dissipation pouring sealant (14) according to the characteristics of the insulating heat dissipation pouring sealant after vacuum potting;
s50, the encapsulating device is removed, the telemetering transmitter encapsulating device is taken and disassembled, and the device is separated, and the encapsulated transmitter assembly is taken out.
2. The method for encapsulating a small telemetry transmitter according to claim 1, characterized in that when the encapsulating device is installed, the encapsulating top plate (2) and the encapsulating shell (1) are fixedly connected through a connecting screw (11); the surface of the telemetering transmitter module, which is provided with a filling and sealing reserved small hole (9), is upwards filled into the filling and sealing shell (1), and then the filling and sealing bottom plate (3) compresses the telemetering transmitter in the cavity through the compression screw (12).
3. The method for encapsulating a small-sized telemetering transmitter according to claim 1, wherein when the air tightness is checked, a nozzle is selected, an injection nozzle (4) or an air passage nozzle (5) is connected, a vacuum pump is connected for vacuumizing check, and the other nozzle is blocked by a plug;
when the vacuumizing energy is maintained at-85 kpa +/-5%, the sealing performance is considered to be good, and the next potting work can be performed;
if the negative pressure cannot be pumped or the negative pressure cannot be maintained, checking whether a gasket or an O-shaped sealing ring of the joint is placed at a correct position, screwing threads, vacuumizing again after checking, and performing next filling and sealing work after checking is qualified.
4. A method of potting a small telemetry transmitter according to claim 1, characterised in that the vacuum mode of the pump is switched on during vacuum potting, air in the telemetry transmitter assembly is drawn to a negative pressure, and when the pressure reaches-85 kpa, the glue injector (7) is activated.
5. The method for encapsulating a small telemetry transmitter according to claim 1 or 4, characterized in that a transparent glue collector (10) is arranged on a pipeline from the air channel connector (5) to the glue injector (7);
when vacuum filling and sealing are carried out, insulating heat dissipation pouring sealant (14) is injected into the glue injector (7) at a certain speed, so that the glue injector is fully filled, and when the insulating heat dissipation pouring sealant (14) overflows into the transparent glue collector (10) from the air passage joint (5) and reaches a certain height, glue injection and vacuum pumping are stopped;
and then a pipeline at the upper end of the transparent glue collecting container is switched with a pressurizing pump, pressure is applied to the direction of the transparent glue collecting container, the insulating heat dissipation pouring sealant (14) in the transparent glue collecting container can partially flow back into the transmitter shell (8) under the action of the pressure to fill the shrinkage gap, so that the shrinkage gap formed in the solidification process of the insulating heat dissipation pouring sealant (14) is avoided, and the filling is compact.
6. The method of claim 5, wherein the pump is set to a pressurized mode and the pressure is set to 150kPa to maintain the pressure.
7. The method for encapsulating a small telemetry transmitter according to claim 1, wherein when the post-encapsulating treatment is performed, the encapsulating device is allowed to stand for a plurality of hours according to the characteristics of the selected insulating heat dissipation pouring sealant (14) after vacuum encapsulation, and the corresponding drying temperature is selected to dry, so that the encapsulated device is completely dried.
CN202310675483.4A 2023-06-08 2023-06-08 Filling and sealing method for small telemetry transmitter Pending CN116773203A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310675483.4A CN116773203A (en) 2023-06-08 2023-06-08 Filling and sealing method for small telemetry transmitter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310675483.4A CN116773203A (en) 2023-06-08 2023-06-08 Filling and sealing method for small telemetry transmitter

Publications (1)

Publication Number Publication Date
CN116773203A true CN116773203A (en) 2023-09-19

Family

ID=88007402

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310675483.4A Pending CN116773203A (en) 2023-06-08 2023-06-08 Filling and sealing method for small telemetry transmitter

Country Status (1)

Country Link
CN (1) CN116773203A (en)

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