CN116769155A - Polyamide resin and coating composition comprising same - Google Patents
Polyamide resin and coating composition comprising same Download PDFInfo
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- CN116769155A CN116769155A CN202210231238.XA CN202210231238A CN116769155A CN 116769155 A CN116769155 A CN 116769155A CN 202210231238 A CN202210231238 A CN 202210231238A CN 116769155 A CN116769155 A CN 116769155A
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- polyamide resin
- coating composition
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- 239000008199 coating composition Substances 0.000 title claims abstract description 54
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 51
- 125000003118 aryl group Chemical group 0.000 claims abstract description 37
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 25
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 14
- 239000003960 organic solvent Substances 0.000 claims description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 238000003860 storage Methods 0.000 abstract description 6
- 125000000732 arylene group Chemical group 0.000 abstract description 3
- -1 for example Substances 0.000 description 32
- 125000000217 alkyl group Chemical group 0.000 description 24
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 20
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 20
- 125000003342 alkenyl group Chemical group 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 11
- 125000004104 aryloxy group Chemical group 0.000 description 10
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 125000000304 alkynyl group Chemical group 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 239000011231 conductive filler Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- 239000004962 Polyamide-imide Substances 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 125000006649 (C2-C20) alkynyl group Chemical group 0.000 description 3
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 3
- FXDAQKPMQIGXHZ-UHFFFAOYSA-N 4-[2-(4-carbamoylphenyl)ethenyl]benzoic acid Chemical compound C1(=CC=C(C=C1)C(=O)N)C=CC1=CC=C(C=C1)C(=O)O FXDAQKPMQIGXHZ-UHFFFAOYSA-N 0.000 description 3
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 description 3
- 125000003358 C2-C20 alkenyl group Chemical group 0.000 description 3
- IXQBIOPGDNZYNA-UHFFFAOYSA-N N=C=O.N=C=O.CC1=CC=CC=C1C1=CC=CC=C1C Chemical compound N=C=O.N=C=O.CC1=CC=CC=C1C1=CC=CC=C1C IXQBIOPGDNZYNA-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000005066 dodecenyl group Chemical group C(=CCCCCCCCCCC)* 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- XIRPMPKSZHNMST-UHFFFAOYSA-N 1-ethenyl-2-phenylbenzene Chemical group C=CC1=CC=CC=C1C1=CC=CC=C1 XIRPMPKSZHNMST-UHFFFAOYSA-N 0.000 description 1
- RZTDESRVPFKCBH-UHFFFAOYSA-N 1-methyl-4-(4-methylphenyl)benzene Chemical group C1=CC(C)=CC=C1C1=CC=C(C)C=C1 RZTDESRVPFKCBH-UHFFFAOYSA-N 0.000 description 1
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000522 cyclooctenyl group Chemical group C1(=CCCCCCC1)* 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000005070 decynyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C#C* 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000005981 pentynyl group Chemical group 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 125000001725 pyrenyl group Chemical group 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- JFLKFZNIIQFQBS-FNCQTZNRSA-N trans,trans-1,4-Diphenyl-1,3-butadiene Chemical group C=1C=CC=CC=1\C=C\C=C\C1=CC=CC=C1 JFLKFZNIIQFQBS-FNCQTZNRSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000000196 viscometry Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/28—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
- C09D177/06—Polyamides derived from polyamines and polycarboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
Abstract
The present invention provides a polyamide resin and a coating composition comprising the same, the polyamide resin comprising a plurality of units comprising a first unit represented by the following formula (I), a second unit represented by the following formula (II), or a combination thereof:x in the first unit 1 Each independently represents a substituted or unsubstituted C 6‑60 An arylene group, and X in the second unit 2 Each independently represents C 1‑60 Alkylene or substituted or unsubstituted C 6‑60 An aromatic extension group. The first unit is the same as or different from the second unit. The present invention also provides a coating composition comprising the polyamide resin, which has self-tackiness and excellent storage propertiesStability in storage, and excellent thermal conductivity.
Description
Technical Field
The present invention relates to a polyamide resin and a coating composition comprising the same, and more particularly, to a polyamide resin which is excellent in heat conductivity, is electrically insulating and has self-tackiness, and a coating composition comprising the same.
Background
An electric motor is an electric device that converts electric energy into mechanical energy. The motor includes a rotor, a stator (stator) that generates a rotational torque by interaction with the rotor, a rotary shaft that transmits rotation of the rotor to the outside, a bearing that supports the rotary shaft, a cooling device, and the like. There is an effort to develop a lightweight and small-sized motor.
The heat dissipation performance of the motor becomes more important as the size of the motor becomes smaller. Most of the heat generated by the motor is copper loss generated by the current input from the stator, and the reduction of the copper loss of the motor helps to improve the performance of the motor. In order to reduce copper loss of the motor and provide good heat conduction characteristics, a proposal is currently adopted that a circular insulating coil wound on a stator is changed into a flat insulating coil with a rectangular cross section. The flat insulation coil can improve the heat dissipation performance of the motor in addition to reducing the copper loss of the motor.
Organic/inorganic hybrid paints added with metal oxides or thermally conductive fillers, for example, zinc oxide, beryllium oxide, aluminum nitride, boron nitride, silicon oxide, aluminum powder, carbon black, powdered silica, bentonite, diamond, etc. have been previously applied to insulating coils to improve the thermal conductivity of electric machines.
However, organic/inorganic hybrid coating materials including metal oxides or thermally conductive fillers are difficult to coat on flat insulating coils due to the decrease in adhesion. In addition, the addition of a metal oxide or a thermally conductive filler to the organic/inorganic hybrid coating material may also cause a decrease in the storage stability of the organic/inorganic hybrid coating material.
Disclosure of Invention
The present invention provides some embodiments, which relate to a polyamide resin, comprising a plurality of units comprising a first unit represented by the following formula (I), a second unit represented by the following formula (II), or a combination thereof:
x in the first unit 1 Each independently represents a substituted or unsubstituted C 6-60 An arylene group, and X in the second unit 2 Each independently represents C 1-60 Alkylene or substituted or unsubstituted C 6-60 An aromatic extension group. The first unit is the same as or different from the second unit.
The present invention provides some embodiments, which relate to a coating composition comprising the polyamide resin described above.
Drawings
Fig. 1 is a schematic diagram of the chemical formula (IV) according to the present invention.
Detailed Description
The components of some embodiments of the invention are described in detail below. It is to be understood that the following description provides many different embodiments, or examples, for implementing different aspects of some embodiments of the invention. The specific components and arrangements described below are only for simplicity and clarity in describing some embodiments of the present invention. These are, of course, merely examples and are not intended to be limiting. Furthermore, repeated reference numerals or designations may be used in the various embodiments. These repetition are for the purpose of simplicity and clarity in connection with the description of some embodiments of the invention and do not in itself represent any relationship between the various embodiments and/or configurations discussed.
It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. When used in this specification, the singular form "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The terms "about", "approximately" and "approximately" herein generally mean within 20%, preferably within 10%, and more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The amounts given herein are about amounts, i.e., where "about", "approximately" are not specifically recited, the meaning of "about", "approximately" may still be implied.
The term "less than or equal to" means that a given value and a value equal to or less than the given value are included, and the term "greater than or equal to" means that a given value and a value equal to or more than the given value are included. Conversely, the term "less than" means a value including less than a given value and not including the given value, and the term "greater than" means a value including more than a given value and not including the given value. For example, "greater than or equal to a" means that values including a and above, and "greater than a" means that values exceeding a are included and a is not included. Herein, the expression "a-b" includes a, b and any value between a and b.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be appreciated that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Some embodiments of the present invention provide a polyamide resin comprising a plurality of units comprising a first unit represented by the following formula (I), a second unit represented by the following formula (II), or a combination thereof:
x in the first unit 1 Each independently represents a substituted or unsubstituted C 6-60 Aromatic extension group, andx in the second unit 2 Each independently represents C 1-60 Alkylene or substituted or unsubstituted C 6-60 An aromatic extension group. In some embodiments, the number of first cells is 50 or less and the number of second cells is 50 or less. That is, the polyamide resin comprises 0 to 50 first units and/or 0 to 50 second units. In some embodiments, the polyamide resin has a weight average molecular weight of about 100,000-200,000.
"C" in the present invention 6-60 Aryl "and" unsubstituted C 6-60 Aryl "may be used interchangeably. "C 6-60 Aryl/unsubstituted C 6-60 An aryl "refers to a monovalent group having 6 to 60 carbon atoms, including a carbocyclic aromatic system, on which none of the hydrogen atoms are substituted. "substituted C 6-60 Aryl "means C 6-60 C in which at least one hydrogen atom on the aromatic radical is substituted or unsubstituted 1-60 Alkyl, substituted or unsubstituted C 2-60 Alkenyl, substituted or unsubstituted C 6-60 Aryloxy, or substituted or unsubstituted C 6-60 Monovalent groups substituted with aromatic groups. Unsubstituted C 6-60 Non-limiting examples of aryl groups include, but are not limited to, phenyl, naphthyl, anthracenyl, phenanthrenyl, pyrenyl, indenyl, fluorenyl, and coroneyl. Substituted C 6-60 Non-limiting examples of aromatic groups include, but are not limited to, methylphenyl, m-methylphenyl, p-methylphenyl, dimethylbiphenyl, distyryl, diphenylpropenyl, and benzyloxyphenyl. "substituted or unsubstituted C as used in the present invention 6-60 An "arylene" refers to a substituted or unsubstituted C 6-60 The aromatic groups have divalent groups of the same structure.
"C" in the present invention 6-60 Aryloxy "and" unsubstituted C 6-60 Aryloxy "may be used interchangeably. "C 6-60 Aryloxy/unsubstituted C 6-60 Aryloxy "means having the structure" -O-C 6-60 An aryl "group. "substituted C 6-60 Aryloxy "means C 6-60 C in which at least one hydrogen atom on the aryloxy group is substituted or unsubstituted 1-60 Alkyl, substituted or unsubstituted C 2-60 Alkenyl, substituted or unsubstituted C 6-60 Aryloxy, or substituted or unsubstituted C 6-60 Monovalent groups substituted with aromatic groups.
"C" in the present invention 1-60 Alkyl "and" unsubstituted C 1-60 Alkyl "may be used interchangeably. "C 1-60 Alkyl/unsubstituted C 1-60 Alkyl "refers to a straight, branched, or cyclic aliphatic hydrocarbon monovalent radical having 1 to 60 carbon atoms in the main carbon chain, with no hydrogen atoms being substituted thereon. "substituted C 1-60 Alkyl "means C 1-60 C in which at least one hydrogen atom on the alkyl radical is substituted or unsubstituted 1-60 Alkyl, substituted or unsubstituted C 2-60 Alkenyl, substituted or unsubstituted C 6-60 Aryloxy, or substituted or unsubstituted C 6-60 Monovalent groups substituted with aromatic groups. Unsubstituted C 1-60 Non-limiting examples of alkyl groups include, but are not limited to, methyl, ethyl, propyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, hexyl, dodecyl, pentadecyl, eicosyl, cyclohexyl, cyclooctyl, cyclododecyl, or cycloeicosyl. Substituted C 1-60 Non-limiting examples of alkyl groups include, but are not limited to, methylphenyl, ethylphenyl, methoxyphenyl, and 2-propenyl tolyl. "substituted or unsubstituted C as used in the present invention 1-60 Alkylene "means and is substituted or unsubstituted C 1-60 Alkyl groups have divalent groups of the same structure.
"C" in the present invention 2-60 Alkenyl "and" unsubstituted C 2-60 Alkenyl "may be used interchangeably. "C 2-60 Alkenyl/unsubstituted C 2-60 Alkenyl "refers to a straight, branched, or cyclic aliphatic hydrocarbon monovalent radical having from 2 to 60 carbon atoms and at least one carbon-carbon double bond in the main carbon chain, all of which are unsubstituted on hydrogen atoms. "substituted C 2-60 Alkenyl "means C 2-60 C in which at least one hydrogen atom on the alkenyl group is substituted or unsubstituted 1-60 Alkyl, substituted or unsubstituted C 2-60 Alkenyl, warpSubstituted or unsubstituted C 6-60 Aryloxy, or substituted or unsubstituted C 6-60 Monovalent groups substituted with aromatic groups. Unsubstituted C 2-60 Non-limiting examples of alkenyl groups include, but are not limited to, ethenyl, propenyl, isobutenyl, sec-butenyl, tert-butenyl, pentenyl, isopentenyl, hexenyl, dodecenyl, pentadecenyl, eicosenyl, cyclohexenyl, cyclooctenyl, cyclopentenyl, cyclopentadienyl, cyclopentadecenyl, and cycloeicosenyl. Substituted C 2-60 Non-limiting examples of alkenyl groups include, but are not limited to, vinylphenyl, vinylbiphenyl, and allylmethoxyphenyl.
In some embodiments, X in the first unit 1 Each independently represents a substituted or unsubstituted C 6-20 An aromatic group. In some embodiments, X in the first unit 1 Each independently represents a divalent group represented by the following chemical formula: wherein R represents a hydrocarbon group and x represents a linking position. In some embodiments, X in the first unit 1 Each independently represents-> Wherein R represents a hydrocarbon group and x represents a linking position.
In some embodiments, R represents alkyl, alkenyl, alkynyl, or aryl. In some embodiments, R represents C 1-60 Alkyl, C 2-60 Alkenyl, C 2-60 Alkynyl, or C 6-60 An aromatic group. In some embodiments, R represents C 1-20 Alkyl, C 2-20 Alkenyl, C 2-20 Alkynyl, or C 6-20 An aromatic group. In some embodiments, R represents C 1-6 Alkyl, C 2-10 Alkenyl, or C 6-20 An aromatic group. In some embodiments, R represents methyl.
"C" as used in the present invention 2-60 Alkynyl "refers to a straight, branched, or cyclic aliphatic hydrocarbon monovalent radical having 2 to 60 carbon atoms and at least one carbon-carbon triple bond in the main carbon chain, and non-limiting examples thereof include, but are not limited to, ethynyl, propynyl, isobutynyl, sec-butynyl, tert-butynyl, pentynyl, isopentynyl, hexynyl, decynyl, dodecenyl, eicosynyl, pentacynyl, cyclopropynyl, cyclobutynyl, cyclopentynyl, cyclohexylyne, cycloheptynyl, cyclooctylyne, cyclopentadecynyl, and cycloeicosynyl.
In some embodiments, X in the second unit 2 Each independently represents C 1-60 Alkylene or substituted or unsubstituted C 6-20 An aromatic group. In some embodiments, X in the second unit 2 Each independently represents C 1-20 An alkylene group,Where represents the link position. In some embodiments, X in the second unit 2 Each independently represents C 1-60 Alkylene, (-)> Where represents the link position. In some embodiments, X 2 Each independently represents a linear alkylene group. In some embodiments, X 2 Each independently represents a straight chain C 2-30 Alkylene, straight chain C 2-20 Alkylene, straight chain C 2-12 Alkylene, or straight chain C 2-6 An alkylene group. In some embodiments, X 2 Each independently represents a straight chain C 20 Alkylene, straight chain C 12 Alkylene, or straight chain C 6 An alkylene group. The more carbon atoms in the main carbon chain of the linear alkylene group, the poorer the preservability of the polyamide resin. The fewer the carbon atoms on the main carbon chain of the linear alkylene group, the polyamide resinThe poorer the adhesion. When the carbon atom on the main carbon chain of the alkylene group is within the above range, the polyamide resin may have satisfactory preservability and adhesion.
The first unit and the second unit may be the same or different. In some embodiments, the first unit may be identical to the second unit, that is, X in the first unit 1 Representation ofWherein R is methyl and X in the second unit 2 Representation->
In some embodiments, the polyamide resin includes a plurality of first units. The plurality of first units may be the same as or different from each other. In some embodiments, the first unit may include at least one selected from the group consisting of groups represented by the following formulas (I-1) - (I-5):
the second units may be the same or different from each other. In some embodiments, the polyamide resin includes a plurality of second units. The plurality of second units may be the same as or different from each other. In some embodiments, the second unit may include at least one selected from the group consisting of groups represented by the following formulas (II-1) - (II-5):
in some embodiments, the first unit is present in an amount of 10mol% to 35mol% based on 100mol% of the sum of the moles of the first unit and the moles of the second unit. In some embodiments, the second unit is present in an amount of 10mol% to 50mol% based on 100mol% of the sum of the moles of the first unit and the second unit. The content of the first unit and the second unit in the polyamide resin may increase the solubility of the polyamide resin, promote the thermal conductivity and/or the adhesion of the polyamide resin, or optimize the thermal conductivity and the adhesion of the polyamide resin when it is within the above-mentioned range.
In some embodiments, the polyamide resin may further include a third unit represented by the following formula (III):
wherein X is 3 Each independently represents And is also provided with
X 4 Each independently represents C 1-60 An alkylene group,Wherein R represents a hydrocarbon group and x represents a linking position. In some embodiments, R represents alkyl, alkenyl, alkynyl, or aryl. In some embodiments, R represents C 1-60 Alkyl, C 2-60 Alkenyl, C 2-60 Alkynyl, or C 6-60 An aromatic group. In some embodiments, R represents C 1-20 Alkyl, C 2-20 Alkenyl, C 2-20 Alkynyl, or C 6-20 An aromatic group. In some embodiments, R represents C 1-6 Alkyl, C 2-10 Alkenyl, or C 6-20 An aromatic group. In some embodiments, R represents methyl.
In some embodiments, the polyamide resin includes a plurality of third units. The plurality of third units may be the same or different from each other. In some embodiments, the number of third cells is 50 or less. That is, the polyamide resin may comprise 0 to 50 first units, 0 to 50 second units, and/or 0 to 50 third units. In some embodiments, the polyamide resin may include at least one selected from the group consisting of groups represented by the following formulas (III-1) - (III-25):
in some embodiments, the first unit is present in an amount of 10mol% to 35mol% based on 100mol% total of the moles of the first unit, the second unit, and the third unit. In some embodiments, the second unit is present in an amount of 10mol% to 50mol% based on 100mol% of the sum of the moles of the first unit, the second unit, and the third unit. The content of the first unit and the second unit in the polyamide resin may increase the solubility of the polyamide resin, promote the thermal conductivity and/or the adhesion of the polyamide resin, or optimize the thermal conductivity and the adhesion of the polyamide resin when it is within the above-mentioned range.
In some embodiments, the polyamide resin of the present invention is represented by the following chemical formula (IV) (see fig. 1):
wherein X is 1 And X is 3 Each independently represents a substituted or unsubstituted C 6-60 An aromatic extension group; x is X 2 And X is 4 Each independently represents C 1-60 Alkylene or substituted or unsubstituted C 6-60 An aromatic extension group; m represents an integer of 0 to 50; n represents an integer of 0 to 50; and o represents an integer of 0 to 50, and m, n and o are not simultaneously 0.
In some embodiments, X 2 And X is 4 Each independently represents C 1-60 An alkylene group,Wherein, represents a link position, and m/m+n+o is 0.1 or more and 0.35 or less. In some embodiments, m/m+n+o is 0.2 or greater and 0.3 or less.
In some embodiments, X 1 And X is 3 Each independently represents Wherein R represents a hydrocarbon group, and o/m+n+o is 0.1 or more and 0.5 or less. In some embodiments, o/m+n+o is 0.2 or greater and 0.3 or less. In some embodiments, R represents alkyl, alkenyl, alkynyl, or aryl. In some embodiments, R represents C 1-60 Alkyl, C 2-60 Alkenyl, C 2-60 Alkynyl, or C 6-60 An aromatic group. In some embodiments, R represents C 1-20 Alkyl, C 2-20 Alkenyl, C 2-20 Alkynyl, or C 6-20 An aromatic group. In some embodiments, R represents C 1-6 Alkyl, C 2-10 Alkenyl, or C 6-20 An aromatic group. In some embodiments, R represents methyl.
The present invention further provides a coating composition comprising the polyamide resin described above. The coating composition of the present invention may further comprise an organic solvent. The coating composition of the present invention can be prepared by dissolving the polyamide resin described above in an organic solvent.
The organic solvent used in the present invention is not particularly limited as long as the above polyamide resin is soluble. Examples of the organic solvent may include, but are not limited to, N-methyl-2-pyrrolidone (NMP), dimethylformamide, dimethylacetamide, xylene, or solvent naphtha. In one embodiment, the organic solvent is N-methyl-2-pyrrolidone (NMP).
In some embodiments, the coating composition may further include various additives. Examples of additives may include, but are not limited to, cross-linking agents, lubricants, colorants, antioxidants (weathering agents), flame retardants, or reaction catalysts.
In some embodiments, the polyamide resin may be present in the coating composition in an amount of 1 to 50wt% based on 100wt% of the total coating composition. In one embodiment, 5-30wt%, or 10-25wt%. When the content of the polyamide resin in the coating composition is within the above range, the thermal conductivity and/or adhesion of the coating composition is preferable and/or the thermal conductivity and adhesion of the coating composition can be optimally balanced.
The coating composition of the present invention may be coated on a conductor. An electrically insulated wire can be obtained by applying the coating composition of the present invention to a conductor and then performing a baking process. The electrically insulated wire has excellent storage stability and/or thermal conductivity.
Specific examples and comparative examples are provided below to further illustrate the advantages of the polyamide resins of the present invention.
Example 1
0.2 mol of 4,4' -stilbene dicarboxylic acid amide (StDA), 0.1 mol of isophthalic acid (IPA), 0.7 mol of dodecanedioic acid (DDDA), 0.2 mol of diphenylmethane diisocyanate (MDI) and 0.85 mol of Toluene Diisocyanate (TDI) were used as raw materials. The above raw materials were dissolved in N-methyl-2-pyrrolidone (NMP) at a compounding concentration of 20wt% to form a mixture. The above mixture was maintained at a temperature of 150℃for 4 hours, and then the above mixture was maintained at a temperature of 170℃for 4 hours, to finally obtain a coating composition comprising a polyamide resin having a weight average molecular weight of 172,149 and a concentration of 21.2% by weight.
Example 2
A coating composition containing a polyamide resin having a weight average molecular weight of 148,563 and a concentration of 20.9wt% was produced in the same manner as in example 1 except that 0.1 mol of isophthalic acid (IPA), 0.9 mol of dodecanedioic acid (DDDA), 0.2 mol of 3,3 '-dimethyl-4, 4' -biphenyldiisocyanate (TODI), and 0.85 mol of Toluene Diisocyanate (TDI) were used as raw materials.
Example 3
A coating composition containing a polyamide resin having a weight average molecular weight of 137,751 and a concentration of 20.5wt% was produced in the same manner as in example 1 except that 0.2 mol of 4,4' -stilbene dicarboxylic acid amide (StDA), 0.1 mol of isophthalic acid (IPA), 0.7 mol of dodecanedioic acid (DDDA), 0.3 mol of 3,3' -dimethyl-4, 4' -biphenyldiisocyanate (TODI), and 0.75 mol of Toluene Diisocyanate (TDI) were used as raw materials.
Example 4
A coating composition containing a polyamide resin having a weight average molecular weight of 143,621 and a concentration of 21.0wt% was produced in the same manner as in example 1 except that 0.3 mol of 4,4' -stilbene dicarboxylic acid amide (StDA), 0.1 mol of isophthalic acid (IPA), 0.6 mol of dodecanedioic acid (DDDA), 0.2 mol of 3,3' -dimethyl-4, 4' -biphenyldiisocyanate (TODI), and 0.85 mol of Toluene Diisocyanate (TDI) were used as raw materials.
Comparative example 1
A coating composition containing a polyamide resin having a weight average molecular weight of 113,492 and a concentration of 20.6wt% was produced in the same manner as in example 1 except that 0.1 mol of isophthalic acid (IPA), 0.9 mol of dodecanedioic acid (DDDA), 0.3 mol of diphenylmethane diisocyanate (MDI), and 0.75 mol of Toluene Diisocyanate (TDI) were used as raw materials.
State observation
The coating compositions of examples 1-4 and comparative examples were visually observed (under light irradiation), and no precipitation indicated that the coating compositions were good. The results of the coating composition state are shown in table 1 below.
Viscosimetry
After placing the coating compositions of examples 1-4 and comparative examples in a constant temperature water bath at 30℃until the temperature is stable, the viscosity of the coating compositions of examples 1-4 and comparative examples, respectively, was measured using Brookfield LVT viscometry. The results of the viscosimetry are shown in table 1 below.
Measurement of thermal conductivity
The thermal conductivity was measured according to the specifications of ASTM D5470. The coating compositions of examples 1 to 4 and comparative example were applied to copper foil using a doctor blade, respectively. The copper foil was baked in an oven at 80 c for 1 hour, then at 150 c for 1 hour, then at 200 c for 1 hour, and finally at 240 c for 3 hours to obtain a copper foil film. It was confirmed that the thickness of the copper foil film was 100 μm or more and was uniform. The thermal conductivity of the copper foil film is measured by using an interface material thermal resistance and thermal conductivity coefficient measuring device Longwin LW-9389. When the thermal conductivity is 0.3W/(mK) or more, the thermal conductivity is excellent. The measurement results are shown in table 1 below.
TABLE 1
As can be seen from table 1 above, examples 1-4 have higher viscosity and thermal conductivity than the coating compositions of the comparative examples. Examples 1 to 4 all have a thermal conductivity higher than 0.3W/(mK), indicating that the coating composition of the present invention is excellent in thermal conductivity. The coating composition of the present invention has excellent thermal conductivity without the addition of metal oxides or thermal conductive fillers.
Preparation of an electrically insulated wire
Example A
Polyamide imide (model NH AI 25S from Fubao chemical) was applied on-line 9 times to copper at a line speed of 38m/min at a line speed of 0.5 mm. The polyamide-imide coated copper wire was baked in a horizontal electric furnace having an inlet furnace temperature of 480℃and an outlet furnace temperature of 520℃to prepare an insulated wire having an outer diameter of 0.529 to 0.530 mm. The resulting insulated wire has a copper core and a primer comprising polyamideimide.
The coating composition of example 1 was applied 3 times to the insulated wire at a line speed of 38 m/min. The insulated wire coated with the coating composition of example 1 was baked in a horizontal electric oven having an inlet oven temperature of 260℃and an outlet oven temperature of 300℃to prepare an electric insulated wire having an outer diameter of 0.541 to 0.543 mm. The resulting electrical insulated wire had a copper core, a primer comprising polyamideimide, and a topcoat comprising the coating composition of example 1.
Example B
Insulated wires having an outer diameter of 0.529 to 0.530mm and electrically insulated wires having an outer diameter of 0.540 to 0.542mm were produced in the same manner as in example a, except that the coating composition of example 2 was used in place of the coating composition of example 1.
Example C
Insulated wires having an outer diameter of 0.529 to 0.530mm and electrically insulated wires having an outer diameter of 0.540 to 0.542mm were produced in the same manner as in example a, except that the coating composition of example 3 was used in place of the coating composition of example 1.
Example D
Insulated wires having an outer diameter of 0.529 to 0.530mm and electrically insulated wires having an outer diameter of 0.540 to 0.542mm were produced in the same manner as in example a, except that the coating composition of example 4 was used in place of the coating composition of example 1.
Comparative example A
An insulated wire having an outer diameter of 0.529 to 0.530mm and an electrically insulated wire having an outer diameter of 0.542 to 0.543mm were produced in the same manner as in example a, except that the coating composition of comparative example 1 was used instead of the coating composition of example 1.
Determination of adhesion
(1) The coil for adhesive force measurement was prepared according to GB T4074.4 (2008) test method 18. The electric insulated wires of examples A to D and comparative example A were wound on a stainless steel rod according to the specifications, and after a predetermined load was applied, they were placed in an oven at 180℃for 10 minutes and then taken out. And (5) detaching the coil from the stainless steel rod after naturally cooling to normal temperature.
(2) The coil was stretched using a material tester (jun-6102C), and the measured stretching force was defined as adhesion, which is 1.5 or more, indicating excellent self-adhesion of the coating composition. The actual measurement results and the conditions for preparing the electric insulated wires of examples a to D and comparative example a are shown in table 2 below.
TABLE 2
As can be seen from Table 2 above, the coating compositions of examples 1-4 all had adhesion of 1.5 or more. As can be seen from the above table 1 and table 2, the coating composition of the present invention has excellent thermal conductivity while maintaining self-adhesion. In addition, since the coating composition of the present invention does not contain a metal oxide or a thermally conductive filler, the coating composition of the present invention has excellent storage stability.
In summary, the present invention provides a polyamide resin and a coating composition comprising the same. The coating composition has self-adhesion, excellent storage stability, and excellent thermal conductivity. The coating composition can be applied to a flat insulating coil, and provides a flat insulating coil which can reduce copper loss of a motor or improve heat dissipation performance of the motor, and can be stably stored.
Although embodiments of the present invention and their advantages have been disclosed, it should be understood that those skilled in the art may make alterations, substitutions and modifications without departing from the spirit and scope of the invention. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but rather to the claims, machine, manufacture, composition of matter, means, methods and steps described in the specification, unless a person skilled in the art would understand from the context of the present application that the process, machine, manufacture, composition of matter, means, methods and steps are currently or later developed in the art that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein. Accordingly, the scope of the present application includes such processes, machines, manufacture, compositions of matter, means, methods, or steps. In addition, each claim forms a separate embodiment, and the scope of the present invention also includes combinations of the claims and embodiments.
Claims (12)
1. A polyamide resin comprising a plurality of units comprising a first unit represented by the following formula (I), a second unit represented by the following formula (II), or a combination thereof:
wherein X is 1 Each independently represents a substituted or unsubstituted C 6-60 An aromatic extension group;
X 2 each independently represents C 1-60 Alkylene or substituted or unsubstituted C 6-60 An aromatic extension group.
2. The polyamide resin of claim 1 wherein X in the first unit 1 Each independently represents
Wherein R represents a hydrocarbon group and x represents a linking position.
3. The polyamide resin of claim 2 wherein X in the second unit 2 Each independently represents C 1-60 An alkylene group,Where represents the link position.
4. The polyamide resin as claimed in claim 3, wherein the content of the second unit is 10mol% to 50mol% based on 100mol% of the sum of the moles of the first unit and the second unit.
5. The polyamide resin according to claim 3, wherein the content of the first unit is 10mol% to 35mol% based on 100mol% of the sum of the moles of the first unit and the second unit.
6. The polyamide resin as claimed in claim 3, further comprising a third unit represented by the following formula (III):
wherein X is 3 Each independently represents And is also provided with
X 4 Each independently represents C 1-60 An alkylene group,
Wherein R represents a hydrocarbon group and x represents a linking position.
7. The polyamide resin as claimed in claim 6, wherein the content of the second unit is 10mol% to 50mol% based on 100mol% of the sum of the mol numbers of the first unit, the second unit, and the third unit.
8. The polyamide resin as claimed in claim 6, wherein the content of the first unit is 10mol% to 35mol% based on 100mol% of the sum of the mol numbers of the first unit, the second unit, and the third unit.
9. The polyamide resin according to claim 1, which is represented by the following chemical formula (IV):
wherein,,
X 1 and X is 3 Each independently represents a substituted or unsubstituted C 6-60 An aromatic extension group;
X 2 and X is 4 Each independently represents C 1-60 Alkylene or substituted or unsubstituted C 6-60 An aromatic extension group;
m represents an integer of 0 to 50;
n represents an integer of 0 to 50;
o represents an integer of 0 to 50; and is also provided with
m, n and o are not simultaneously 0.
10. A coating composition comprising the polyamide resin according to any one of claims 1 to 9.
11. The coating composition of claim 10, further comprising an organic solvent.
12. The coating composition of claim 11, wherein the organic solvent comprises N-methyl-2-pyrrolidone, dimethylformamide, dimethylacetamide, xylene, or solvent naphtha.
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