CN116761350B - Circuit board solder paste printing device - Google Patents
Circuit board solder paste printing device Download PDFInfo
- Publication number
- CN116761350B CN116761350B CN202311060696.2A CN202311060696A CN116761350B CN 116761350 B CN116761350 B CN 116761350B CN 202311060696 A CN202311060696 A CN 202311060696A CN 116761350 B CN116761350 B CN 116761350B
- Authority
- CN
- China
- Prior art keywords
- fixed
- rack
- solder paste
- linear guide
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 69
- 238000007639 printing Methods 0.000 title claims abstract description 41
- 238000007790 scraping Methods 0.000 claims abstract description 89
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 86
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 239000006071 cream Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses a circuit board solder paste printing device, and relates to the field of circuit board processing. The technical scheme is that the automatic tin-scraping device comprises a shell, a conveyor is assembled in the shell, a lifting plate mechanism is assembled on one side of the conveyor, a screen is arranged above the lifting plate mechanism, a tin paste coating plate and a tin scraping plate are arranged above the screen, a supporting mechanism is assembled in the shell, the supporting mechanism comprises a fixing rod, a first annular rail and a second annular rail, the first annular rail and the second annular rail are both in sliding connection with the fixing rod, a driving mechanism is assembled on the supporting mechanism, and the driving mechanism comprises a first linear guide rail, a first rack, a plurality of rows of gears, a second linear guide rail, a third rack, a fifth connecting frame and a servo motor. Through installing two tin scraping plates respectively on first link and connecting pile, two tin scraping plates scrape the solder paste from two directions simultaneously, reduce printing time.
Description
Technical Field
The application relates to the field of circuit board processing, in particular to a circuit board solder paste printing device.
Background
The motor controller is used for comprehensively and electrically controlling the movement process of the motor, and can flexibly control the working state of the motor. The motor controller circuit board comprises an insulated gate bipolar transistor control circuit module, a driving module and a protection circuit module, and the control of the motor work is completed through each module in the motor controller circuit board;
in the production process of a motor controller circuit board, namely in the manufacturing process of a PCB board, the solder paste printing of the first working procedure of production is finished by a solder paste printer, the traditional solder paste printer generally comprises a mounting table, a fixing frame fixedly connected to the mounting table, a solder paste tin scraping component, a screen and a supporting plate fixedly connected to the fixing frame and used for supporting the circuit board, wherein a worker firstly coats the screen with solder paste, scrapes the solder paste on the screen back and forth through the solder paste tin scraping component, and permeates the solder paste on the screen into the circuit board on the supporting plate, so that the coating is finished;
the existing tin paste printing device mainly comprises a tin paste coating plate, a tin scraping plate and a screen, tin paste is added on the screen through the tin paste coating plate, then the tin paste is scraped by the tin scraping plate through a screen mesh and falls onto a circuit board, the existing tin paste printing device is used for scraping the tin paste in one direction by the single tin scraping plate, the best effect can be achieved because the tin paste needs to be printed at a certain temperature, after the tin paste falls onto the screen from the coating plate, the tin paste can be led to excessively low temperature at the tail part after the tin paste passes through the screen once, printing is affected, particularly, the problem is particularly serious due to the fact that the tin paste is hard brushed on the circuit board with longer length, the passing speed of the tin scraping plate needs to be improved, the abrasion of the tin scraping plate and the screen can be accelerated due to excessively high speed, and the service life of equipment is affected.
Disclosure of Invention
Object of the application
Accordingly, the present application is directed to a circuit board solder paste printing device for realizing bi-directional printing, shortening printing time and improving printing efficiency.
(II) technical scheme
In order to achieve the technical purpose, the application provides a circuit board solder paste printing device:
the automatic tin paste coating device comprises a shell, a conveyor is assembled in the shell, a lifting plate mechanism is assembled on one side of the conveyor, a screen is arranged above the lifting plate mechanism, a tin paste coating plate and a tin scraping plate are arranged above the screen, a supporting mechanism is assembled in the shell, the supporting mechanism comprises a fixed rod, a first annular rail and a second annular rail, the first annular rail and the second annular rail are both in sliding connection with the fixed rod, a driving mechanism is assembled on the supporting mechanism, the driving mechanism comprises a first linear guide rail, a first rack, a plurality of rows of gears, a second rack, a second linear guide rail, a third rack, a fifth connecting frame and a servo motor, the first linear guide rail is in sliding connection with the first annular rail, the second linear guide rail is in sliding connection with the second annular rail, the tin scraping plate is in sliding connection with the first linear guide rail, the tin scraping plate is provided with two rows of racks, the tin scraping plate is respectively in linkage with the gears through the first linear guide rail and the second rack, the second linear guide rail is fixedly connected with the fifth rack and the fifth rack on the output end of the servo motor in a linkage mode.
Preferably, two conveyors are arranged, the two conveyors are distributed on two sides of the lifting plate mechanism, and the conveyors are fixed on the shell.
Preferably, the lifting plate mechanism is composed of a double-finger air cylinder and a supporting plate, wherein the double-finger air cylinder is fixed on the conveyor, and the supporting plate is fixedly connected with the output end of the double-finger air cylinder.
Preferably, the two sides of the second annular rail are both fixed with connecting plates, one end of the connecting plates, which is far away from the second annular rail, is in sliding connection with a fixed rod, a first cylinder and a second cylinder are fixed on the fixed rod, the output end of the first cylinder is fixedly connected with the connecting plates, and the output end of the second cylinder is fixedly connected with the first annular rail.
Preferably, the upper surface of first linear guide is fixed with first connecting block, first spout has been seted up to the lower surface of first annular rail, first connecting block and first spout sliding connection, the upper surface of second linear guide is fixed with the second connecting block, the second spout has been seted up to the lower surface of second annular rail, and second connecting block and second spout sliding connection.
Preferably, one end of the first rack is fixed with a first connecting frame, one end of the second rack is fixed with a connecting pile, two tin scraping plates are respectively fixed on the first connecting frame and the connecting pile, a second connecting frame is fixed on the first linear guide rail, one end of the second connecting frame, far away from the first linear guide rail, is fixed with a first sliding block, two second connecting frames and the first sliding block are both provided with two, two first sliding blocks are respectively connected with the second rack and the first rack in a sliding mode, and the first rack and the second rack are engaged with a plurality of rows of gears.
Preferably, a fourth connecting frame is fixed on the second linear guide rail, one end of the fourth connecting frame, which is far away from the second linear guide rail, is fixed with a third sliding block, the third rack is in sliding connection with the third sliding block, one end of the third rack, which is far away from the third sliding block, is fixed with a connecting rod, both sides of the connecting rod are fixed with the third connecting frame, one end upper surface of the third connecting frame, which is far away from the connecting rod, is fixed with the second sliding block, the second sliding block is in sliding connection with the second linear guide rail, and one end lower surface of the third connecting frame, which is far away from the connecting rod, is fixedly connected with the upper surface of the solder paste coating plate.
Preferably, the outer surfaces of the multiple rows of gears are provided with annular grooves, two annular grooves are arranged, and the two annular grooves are vertically distributed on the multiple rows of gears.
Preferably, the lower surface of the tin scraping plate is fixedly provided with a first scraping strip and a second scraping strip, both sides of the first scraping strip and both sides of the second scraping strip are arc-shaped, and the arc-shaped surfaces on the first scraping strip and the second scraping strip are distributed in a back-facing manner.
Preferably, the tin scraping plate is fixedly provided with two ball sleeves and two ball rods, the two ball sleeves and the two ball rods on the tin scraping plate are distributed in a staggered mode, and the ball sleeves are matched with the ball rods.
From the above technical scheme, the application has the following beneficial effects:
1: through adorning two tin scraping plates respectively on first link and connecting pile, first rack and second rack pass through multirow gear drive, rotate through the tin scraping plate, let first rack and second rack drive two tin scraping plates respectively and move in opposite directions, scrape the solder paste from two directions simultaneously, reduce printing time.
2: through multirow gear deflection and the tin scraping plate setting that first link links to each other, two tin scraping plates are close to mutually to the terminal back, and two tin scraping plates all are located the side of multirow gear, insert through ball cover and bulb pole and close fixedly, make first rack and second rack cooperation pin multirow gear, make first rack, second rack and tin scraping plate can drive and use multirow gear to rotate as the centre of a circle, let tin scraping plate can rotate and continue the tin cream on the screen frame, on the one hand is the space department between two tin scraping plates of replenishment, on the other hand can carry out the secondary tin scraping printing, improve the tin scraping effect.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the whole structure of a circuit board solder paste printing device provided by the application;
fig. 2 is an exploded schematic view of a circuit board solder paste printing device according to the present application;
fig. 3 is a schematic diagram of the overall structure of the driving mechanism in fig. 2 of the circuit board solder paste printing device provided by the application;
fig. 4 is a schematic diagram of a partial structure of a driving mechanism in fig. 2 of a circuit board solder paste printing device according to the present application;
fig. 5 is a schematic diagram of a partial structure of a driving mechanism in fig. 2 of a circuit board solder paste printing device according to the present application;
fig. 6 is a schematic diagram of a partial structure of a driving mechanism in fig. 2 of a circuit board solder paste printing device according to the present application;
fig. 7 is a schematic diagram of the overall structure of the tin scraping plate in fig. 2 of the tin paste printing device for circuit boards provided by the application;
fig. 8 is a schematic diagram of the whole structure of the supporting mechanism in fig. 2 of the circuit board solder paste printing device provided by the application;
fig. 9 is a schematic diagram of the overall structure of the lift mechanism in fig. 2 of a circuit board solder paste printing device provided by the application;
fig. 10 is a schematic top view of the circuit board solder paste printing device shown in fig. 4;
fig. 11 is a schematic view showing a combined state structure of the tin scraping plate in fig. 10 of the tin paste printing device for circuit boards provided by the application.
Description of the drawings: 1. a housing; 2. a conveyor; 3. a support mechanism; 31. a fixed rod; 32. a first annular rail; 33. a second annular rail; 34. a connecting plate; 35. a first cylinder; 36. a second cylinder; 4. a screen; 5. a driving mechanism; 51. a first linear guide rail; 52. a first rack; 53. a first connection frame; 54. multiple rows of gears; 55. a second rack; 56. connecting piles; 57. a second connecting frame; 58. a first slider; 59. a second linear guide rail; 510. a second slider; 511. a third connecting frame; 512. a connecting rod; 513. a third rack; 514. a fourth connecting frame; 515. a third slider; 516. a fifth connecting frame; 517. a servo motor; 518. a ball sleeve; 519. a ball head rod; 6. a lifting plate mechanism; 61. a double-finger cylinder; 62. a supporting plate; 7. coating a plate with solder paste; 8. a tin scraping plate; 81. a first scraping strip; 82. and a second scraping strip.
Description of the embodiments
The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, the same or similar reference numerals indicate the same or similar parts and features. The drawings merely schematically illustrate the concepts and principles of embodiments of the disclosure and do not necessarily illustrate the specific dimensions and proportions of the various embodiments of the disclosure. Specific details or structures may be shown in exaggerated form in particular figures to illustrate related details or structures of embodiments of the present disclosure.
Referring to fig. 1-11:
the circuit board solder paste printing device comprises a shell 1, wherein a conveyor 2 is assembled in the shell 1, one side of the conveyor 2 is provided with a lifting plate mechanism 6, two conveyors 2 are arranged on two sides of the lifting plate mechanism 6, the conveyor 2 is fixed on the shell 1, as shown in fig. 2, the conveyor 2 is used for conveying a circuit board, the lifting plate mechanism 6 is composed of a double-finger cylinder 61 and a supporting plate 62, the double-finger cylinder 61 is fixed on the conveyor 2, the supporting plate 62 is fixedly connected with the output end of the double-finger cylinder 61, and the supporting plate 62 can be driven to lift by the double-finger cylinder 61 to drive the circuit board to lift;
the screen 4 is arranged above the lifting plate mechanism 6, the mesh is formed on the surface of the screen 4, the mesh position corresponds to the processing of the circuit board, the solder paste falls onto the circuit board through the mesh, the solder paste coating plate 7 and the solder scraping plate 8 are arranged above the screen 4, the solder paste coating plate 7 is used for conveying the solder paste and coating the solder paste onto the screen 4, the solder scraping plate 8 is used for scraping the solder paste from the mesh, and the tin discharging mode of the solder paste coating plate 7 and the tin scraping mode of the solder scraping plate 8 are all known and disclosed technologies and are not described in detail herein.
The supporting mechanism 3 is assembled in the shell 1, the supporting mechanism 3 comprises a fixed rod 31, a first annular rail 32 and a second annular rail 33, the first annular rail 32 and the second annular rail 33 are in sliding connection with the fixed rod 31, connecting plates 34 are fixed on two sides of the second annular rail 33, one end, far away from the second annular rail 33, of the connecting plates 34 is in sliding connection with the fixed rod 31, a first air cylinder 35 and a second air cylinder 36 are fixed on the fixed rod 31, the output end of the first air cylinder 35 is fixedly connected with the connecting plates 34, the output end of the second air cylinder 36 is fixedly connected with the first annular rail 32, the connecting plates 34 are driven to move up and down through the first air cylinder 35, the second annular rail 33 can be driven to move up and down through the second air cylinder 36, and the first annular rail 32 can be driven to move up and down.
The supporting mechanism 3 is provided with a driving mechanism 5, the driving mechanism 5 comprises a first linear guide rail 51, a first rack 52, a plurality of rows of gears 54, a second rack 55, a second linear guide rail 59, a third rack 513, a fifth connecting frame 516 and a servo motor 517, the first linear guide rail 51 is in sliding connection with the first annular rail 32, the second linear guide rail 59 is in sliding connection with the second annular rail 33, the solder paste coating plate 7 is in sliding connection with the second linear guide rail 59, and the solder paste coating plate 7 can translate on the screen 4;
the tin scraping plates 8 are slidably connected with the first linear guide rail 51, two tin scraping plates 8 are arranged, the two tin scraping plates 8 are respectively linked with the plurality of rows of gears 54 through a first rack 52 and a second rack 55, the first rack 52 and the second rack 55 are meshed with the plurality of rows of gears 54, the plurality of rows of gears 54 rotate, the first rack 52 and the second rack 55 can drive the two tin scraping plates 8 to move oppositely, the solder paste coating plate 7 is linked with the plurality of rows of gears 54 through a third rack 513, the third rack 513 can be driven by the plurality of rows of gears 54 to translate, a fifth connecting frame 516 is fixed on the second annular rail 33, when the second annular rail 33 moves up and down, a fifth connecting frame 516 can be driven to move up and down, a servo motor 517 is fixed on the fifth connecting frame 516, and the plurality of rows of gears 54 are fixedly connected with the output ends of the servo motor 517;
the upper surface of the first linear guide rail 51 is fixedly provided with a first connecting block, the lower surface of the first annular rail 32 is provided with a first sliding groove, the first connecting block is in sliding connection with the first sliding groove, the upper surface of the second linear guide rail 59 is fixedly provided with a second connecting block, the lower surface of the second annular rail 33 is provided with a second sliding groove, the second connecting block is in sliding connection with the second sliding groove, when the first annular rail 32 moves up and down, the first linear guide rail 51 can be driven to move up and down, the first linear guide rail 51 can move along the circumference of the first annular rail 32, and similarly, the second linear guide rail 59 can also move along the circumference of the second annular rail 33;
it should be noted that, there is wedge fixture block (not shown) in the junction of first linkage piece and first spout ninety degrees and one hundred eighty degrees, wedge fixture block and first annular rail 32 telescopic connection to be equipped with spring (not shown) on the wedge fixture block and can provide elasticity for wedge fixture block, wedge fixture block blocks first linkage piece, guarantees the connection stability of first linkage piece and first spout, only is greater than the spring force when the torsion that first straight line guide rail 51 received, can push away wedge fixture block, lets first linkage piece can slide in first spout, second linkage piece and second spout junction and first spout and first linkage piece junction are handled.
Further, a first connecting frame 53 is fixed at one end of the first rack 52, a connecting pile 56 is fixed at one end of the second rack 55, two tin scraping plates 8 are respectively fixed on the first connecting frame 53 and the connecting pile 56, a second connecting frame 57 is fixed on the first linear guide rail 51, a first sliding block 58 is fixed at one end, far away from the first linear guide rail 51, of the second connecting frame 57, two first sliding blocks 58 are arranged on the second connecting frame 57 and the first sliding block 58, and the two first sliding blocks 58 are respectively in sliding connection with the second rack 55 and the first rack 52, so that stability during translation of the second rack 55 and the first rack 52 is improved;
further, a fourth connecting frame 514 is fixed on the second linear guide 59, one end of the fourth connecting frame 514 far away from the second linear guide 59 is fixed with a third sliding block 515, the third rack 513 is slidably connected with the third sliding block 515, one end of the third rack 513 far away from the third sliding block 515 is fixed with a connecting rod 512, one end lower surface of the third connecting frame 511 far away from the connecting rod 512 is fixedly connected with the upper surface of the solder paste coating plate 7, two third connecting frames 511 are connected with the solder paste coating plate 7 through the connecting rod 512, the solder paste coating plate 7 translates more stably, both sides of the connecting rod 512 are fixed with the third connecting frames 511, the third connecting frames 511 are in a U shape, as shown in fig. 5, a U-shaped cavity in the middle of the third connecting frames 511 can be used for the second connecting frames 57 to pass through, translation of the third connecting frames 511 is not affected, one end upper surface of the third connecting frames 511 far away from the connecting rod 512 is fixed with the second sliding block 510, and the second sliding blocks 510 are slidably connected with the second linear guide 59.
As shown in fig. 6, the outer surfaces of the plurality of rows of gears 54 are provided with two ring grooves, the two ring grooves are vertically distributed on the plurality of rows of gears 54, and the space between the two ring grooves is equal to the space between the first rack 52 and the third rack 513 in the initial state, so that the third rack 513 can be meshed with the plurality of rows of gears 54 when descending, the first rack 52 is left in the ring grooves and is not meshed with the plurality of rows of gears 54, and the meshing control of the plurality of rows of gears 54 with the first rack 52, the second rack 55 and the third rack 513 can be controlled.
As shown in fig. 7, the lower surface of the tin scraping plate 8 is fixed with a first scraping strip 81 and a second scraping strip 82, both sides of the first scraping strip 81 and the second scraping strip 82 are arc-shaped, and the arc surfaces on the first scraping strip 81 and the second scraping strip 82 are distributed back to back, so that double-sided tin scraping paste is realized, the arc surfaces on both sides of the first scraping strip 81 and the second scraping strip 82 can gather tin paste towards the middle part, the tin paste is prevented from overflowing outwards, and the tin scraping effect is improved.
As shown in FIG. 10, a ball sleeve 518 and a ball head rod 519 are fixed on the tin-scraping plate 8, the ball sleeve 518 and the ball head rod 519 are both provided with two, the two ball sleeves 518 and the ball head rod 519 on the two tin-scraping plates 8 are distributed in a staggered way, the ball sleeve 518 is matched with the ball head rod 519, a bayonet is formed in one surface of the ball sleeve 518, which faces away from the tin-scraping plate 8, an inner cavity of the bayonet is matched with the ball head of the ball head rod 519, the ball head rod 519 is inserted into the bayonet, the ball head rod 519 can be connected and fixed with the ball sleeve 518, the ball sleeve 518 is made of elastic plastic, after the ball head rod 519 is inserted and fixed with the ball sleeve 518, the multi-row gears 54 continue to rotate and drive the first racks 52 and the second racks 55 to rotate together, and the multi-row gears 54 rotate reversely, so that the ball head rod 519 and the ball sleeve 518 can be pulled away and separated through the first racks 52 and the second racks 55.
Working principle: when the device is used, the circuit board solder paste printing device is in an electrified state through an external power supply, a discharge port of an external solder paste box is connected with a feed port of a solder paste coating plate 7 through a guide pipe, the amount of solder paste can be controlled through an electromagnetic valve, a conveyor 2 can convey the circuit board onto a supporting plate 62, and when in printing, the supporting plate 62 is driven to ascend to be close to a screen 4 through a double-finger cylinder 61, which is a known disclosed technology and is not described in detail herein;
then the first cylinder 35 works to push the connecting plate 34 to push down, so that the second annular rail 33 drives the second linear guide rail 59 to push down, the second linear guide rail 59 drives the solder paste coating plate 7 and the third rack 513 to push down through the cooperation of the second sliding block 510, the third connecting frame 511 and the connecting rod 512, the bottom of the solder paste coating plate 7 is attached to the screen 4, the third rack 513 is meshed with the plurality of rows of gears 54, at the moment, the plurality of rows of gears 54 are not meshed with the second rack 55 and the first rack 52, the plurality of rows of gears 54 are driven to rotate clockwise through the servo motor 517, the plurality of rows of gears 54 drive the connecting rod 512 to translate through the third rack 513, so that the third connecting frame 511 drives the solder paste coating plate 7 to translate, and the solder paste is coated on the screen 4;
then the first cylinder 35 drives the second annular rail 33 to reset through the connecting plate 34, the second cylinder 36 drives the first annular rail 32 to press down, the first linear guide rail 51 drives the tin scraping plate 8 and the first rack 52 and the second rack 55 to press down, the first rack 52 and the second rack 55 are meshed with a plurality of rows of gears 54, at the moment, the tin scraping plate 8 is attached to the screen 4, the plurality of rows of gears 54 are driven by the servo motor 517 to rotate anticlockwise, the plurality of rows of gears 54 drive the first rack 52 and the second rack 55 to move oppositely, the first rack 52 and the second rack 55 drive the two tin scraping plates 8 to move oppositely, the tin paste is scraped from meshes on the screen 4 and falls onto a circuit board, the plurality of rows of gears 54 rotate anticlockwise, meanwhile, the third rack 513 can drive the tin paste coating plate 7 to return to the middle, after the two tin scraping plates 8 are abutted to the tail ends, the plurality of rows of gears 54 are locked by the first rack 52 and the second rack 55, the plurality of rows of gears 54 continue rotating to drive the two tin scraping plates 8 to rotate around the plurality of gears 54 to stop rotating one hundred degrees, the eight layers of racks are completely scraped and the tin paste is completely coated between the two tin scraping plates 8, and the gap is completely scraped by the tin paste, and the gap of the tin paste is completely coated between the eight racks 8 is completely scraped by the eight layers, and finally, and the tin paste is coated by the tin scraping plates, and the gap is completely scraped by the tin paste, and after the tin paste is coated by the tin scraping the tin paste, and the 7, and the next, and the tin scraping the tin paste is down on the down.
The exemplary implementation of the solution proposed by the present disclosure has been described in detail hereinabove with reference to the preferred embodiments, however, it will be understood by those skilled in the art that various modifications and adaptations can be made to the specific embodiments described above and that various combinations of the technical features, structures proposed by the present disclosure can be made without departing from the scope of the present disclosure, which is defined by the appended claims.
Claims (10)
1. The circuit board solder paste printing device comprises a shell (1), a conveyor (2) is assembled in the shell (1), a lifting plate mechanism (6) is assembled on one side of the conveyor (2), a screen (4) is arranged above the lifting plate mechanism (6), a solder paste coating plate (7) and a solder paste scraping plate (8) are arranged above the screen (4), the circuit board solder paste printing device is characterized in that a supporting mechanism (3) is assembled in the shell (1), the supporting mechanism (3) comprises a fixed rod (31), a first annular rail (32) and a second annular rail (33), the first annular rail (32) and the second annular rail (33) are both in sliding connection with the fixed rod (31), a driving mechanism (5) is assembled on the supporting mechanism (3), the driving mechanism (5) comprises a first linear guide rail (51), a first rack (52), a plurality of rows of gears (54), a second linear guide rail (55), a third rack (513), a fifth connecting frame (516) and a motor servo (517), the first linear guide rail (51) is connected with the second linear guide rail (59) in sliding connection with the first linear guide rail (59), tin scraping plate (8) and first linear guide rail (51) sliding connection, tin scraping plate (8) are equipped with two, two tin scraping plate (8) are linked with multirow gear (54) through first rack (52) and second rack (55) respectively, tin cream coating board (7) are linked with multirow gear (54) through third rack (513), fifth link (516) are fixed on second annular rail (33), servo motor (517) are fixed on fifth link (516), just multirow gear (54) are connected fixedly with the output of servo motor (517).
2. A circuit board solder paste printing device according to claim 1, wherein two conveyors (2) are provided, two conveyors (2) are distributed on both sides of a lifting mechanism (6), and the conveyors (2) are fixed on the housing (1).
3. The circuit board solder paste printing device according to claim 1, wherein the lifting plate mechanism (6) is composed of a double-finger cylinder (61) and a supporting plate (62), the double-finger cylinder (61) is fixed on the conveyor (2), and the supporting plate (62) is fixedly connected with the output end of the double-finger cylinder (61).
4. The circuit board solder paste printing device according to claim 1, wherein connecting plates (34) are fixed on two sides of the second annular rail (33), one end, away from the second annular rail (33), of the connecting plates (34) is slidably connected with a fixing rod (31), a first air cylinder (35) and a second air cylinder (36) are fixed on the fixing rod (31), an output end of the first air cylinder (35) is fixedly connected with the connecting plates (34), and an output end of the second air cylinder (36) is fixedly connected with the first annular rail (32).
5. The circuit board solder paste printing device according to claim 1, wherein a first connecting block is fixed on the upper surface of the first linear guide rail (51), a first sliding groove is formed in the lower surface of the first annular rail (32), the first connecting block is in sliding connection with the first sliding groove, a second connecting block is fixed on the upper surface of the second linear guide rail (59), a second sliding groove is formed in the lower surface of the second annular rail (33), and the second connecting block is in sliding connection with the second sliding groove.
6. The circuit board solder paste printing device according to claim 1, wherein one end of the first rack (52) is fixed with a first connecting frame (53), one end of the second rack (55) is fixed with a connecting pile (56), two solder scraping plates (8) are respectively fixed on the first connecting frame (53) and the connecting pile (56), a second connecting frame (57) is fixed on the first linear guide (51), one end of the second connecting frame (57) far away from the first linear guide (51) is fixed with a first sliding block (58), the second connecting frame (57) and the first sliding block (58) are both provided with two, the two first sliding blocks (58) are respectively connected with the second rack (55) and the first rack (52) in a sliding mode, and the first rack (52) and the second rack (55) are both meshed with the multi-row gears (54).
7. The circuit board solder paste printing device according to claim 1, wherein a fourth connecting frame (514) is fixed on the second linear guide rail (59), one end, away from the second linear guide rail (59), of the fourth connecting frame (514) is fixed with a third sliding block (515), the third rack (513) is in sliding connection with the third sliding block (515), one end, away from the third sliding block (515), of the third rack (513) is fixed with a connecting rod (512), two sides of the connecting rod (512) are both fixed with a third connecting frame (511), one end, away from the connecting rod (512), of the third connecting frame (511) is fixed with a second sliding block (510), and the second sliding block (510) is in sliding connection with the second linear guide rail (59), and one end lower surface, away from the connecting rod (512), of the third connecting frame (511) is fixedly connected with the upper surface of the solder paste coating plate (7).
8. The device for printing solder paste on circuit boards according to claim 1, wherein the outer surfaces of the plurality of rows of gears (54) are provided with annular grooves, two annular grooves are arranged, and the two annular grooves are vertically distributed on the plurality of rows of gears (54).
9. The circuit board solder paste printing device according to claim 1, wherein a first scraping strip (81) and a second scraping strip (82) are fixed on the lower surface of the tin scraping plate (8), two sides of the first scraping strip (81) and two sides of the second scraping strip (82) are arc-shaped, and the arc-shaped surfaces on the first scraping strip (81) and the second scraping strip (82) are distributed in a back-facing mode.
10. The circuit board solder paste printing device according to claim 1, wherein a ball sleeve (518) and a ball head rod (519) are fixed on the solder scraping plate (8), two ball sleeves (518) and ball head rods (519) are arranged, the two ball sleeves (518) and the ball head rods (519) on the two solder scraping plate (8) are distributed in a staggered mode, and the ball sleeves (518) are matched with the ball head rods (519).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311060696.2A CN116761350B (en) | 2023-08-22 | 2023-08-22 | Circuit board solder paste printing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311060696.2A CN116761350B (en) | 2023-08-22 | 2023-08-22 | Circuit board solder paste printing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116761350A CN116761350A (en) | 2023-09-15 |
| CN116761350B true CN116761350B (en) | 2023-10-27 |
Family
ID=87957669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311060696.2A Active CN116761350B (en) | 2023-08-22 | 2023-08-22 | Circuit board solder paste printing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116761350B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214928005U (en) * | 2021-03-31 | 2021-11-30 | 奥特马（无锡）电子科技有限公司 | Automatic brush tin cream mechanism |
| CN114900989A (en) * | 2022-05-10 | 2022-08-12 | 深圳市同悦鑫科技有限公司 | SMT reflow soldering tin cream coating device |
| CN115464973A (en) * | 2022-10-19 | 2022-12-13 | 深圳市金悦宏电路有限公司 | Screen printing machine |
| CN116096065A (en) * | 2023-02-13 | 2023-05-09 | 芯朋半导体科技(如东)有限公司 | Automatic solder paste printing machine of duplex position |
| CN219287841U (en) * | 2022-12-29 | 2023-06-30 | 绵存(浙江)科技有限公司 | Solder paste printing device based on SMT paster production line |
-
2023
- 2023-08-22 CN CN202311060696.2A patent/CN116761350B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214928005U (en) * | 2021-03-31 | 2021-11-30 | 奥特马（无锡）电子科技有限公司 | Automatic brush tin cream mechanism |
| CN114900989A (en) * | 2022-05-10 | 2022-08-12 | 深圳市同悦鑫科技有限公司 | SMT reflow soldering tin cream coating device |
| CN115464973A (en) * | 2022-10-19 | 2022-12-13 | 深圳市金悦宏电路有限公司 | Screen printing machine |
| CN219287841U (en) * | 2022-12-29 | 2023-06-30 | 绵存(浙江)科技有限公司 | Solder paste printing device based on SMT paster production line |
| CN116096065A (en) * | 2023-02-13 | 2023-05-09 | 芯朋半导体科技(如东)有限公司 | Automatic solder paste printing machine of duplex position |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116761350A (en) | 2023-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109533917A (en) | A kind of vertical curing oven conveying mechanism and vertical curing oven | |
| CN116761350B (en) | Circuit board solder paste printing device | |
| CN204547333U (en) | A kind of doctor blade device, stencil printer and can the system of stencil printer Automatic-feeding be given | |
| CN205034737U (en) | Plate turning device | |
| GB2172867A (en) | Pallet conveyor and drive therefor | |
| CN213187080U (en) | Circuit board loading attachment is used in SMT paster processing | |
| CN107538097B (en) | It is a kind of for processing the mold of LED light | |
| CN115027046B (en) | Full-automatic laminating machine | |
| CN105905589A (en) | Tin paste taking and pushing device and taking and pushing method thereof | |
| CN208352271U (en) | A kind of double push-material mechanism | |
| CN210285774U (en) | Reciprocating type scraper conveyor for cleaning materials | |
| CN103407761A (en) | Conveying device of lamp tube printer | |
| CN202540929U (en) | Squeegee lifting device of semi-automatic press | |
| CN109537038B (en) | Multilayer high-order PCB copper plating solution additive replenishing device | |
| CN204491023U (en) | Chip integrated circuit material strip unit | |
| KR100842356B1 (en) | Surface mounting device having exchanging feeder bases | |
| CN203687558U (en) | Automatic drying device in multi-row storage | |
| CN204491012U (en) | Chip integrated circuit material electroplating unit | |
| CN210480123U (en) | Automatic blevile of push of braid electric capacity | |
| CN204262208U (en) | The workpiece transfer device of electric tube expander | |
| CN217143028U (en) | Full-automatic flexible assembly line of accurate subassembly of backward flow formula LED | |
| CN203810297U (en) | Novel lampshade forward mechanism | |
| CN217241091U (en) | Electronic component paster device | |
| CN204652797U (en) | A kind of structure improved double end chip mounter | |
| CN205060613U (en) | Section bar unloading mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |